JP2002170781A - Heat-treating device - Google Patents
Heat-treating deviceInfo
- Publication number
- JP2002170781A JP2002170781A JP2000364959A JP2000364959A JP2002170781A JP 2002170781 A JP2002170781 A JP 2002170781A JP 2000364959 A JP2000364959 A JP 2000364959A JP 2000364959 A JP2000364959 A JP 2000364959A JP 2002170781 A JP2002170781 A JP 2002170781A
- Authority
- JP
- Japan
- Prior art keywords
- box
- gas
- space
- main body
- maintenance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012423 maintenance Methods 0.000 claims abstract description 59
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 40
- 235000012431 wafers Nutrition 0.000 description 13
- 238000000034 method Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 9
- 238000009792 diffusion process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 101100454435 Biomphalaria glabrata BG05 gene Proteins 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Landscapes
- Ventilation (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体ウエハなど
の被処理体に成膜処理などの熱処理を施す熱処理装置に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment apparatus for performing a heat treatment such as a film forming process on an object to be processed such as a semiconductor wafer.
【０００２】[0002]
【従来の技術】一般に、半導体集積回路を形成するに
は、半導体ウエハ等の被処理体に対して、成膜処理、酸
化拡散処理、アニール処理、エッチング処理等の各種の
処理を繰り返し行なうが、このような熱処理を行なう熱
処理装置の内、一度に多数枚の半導体ウエハに対して処
理を行なうことができる、いわゆるバッチ式の縦型の熱
処理装置が多く用いられている。図８は真空排気系を有
しない従来のバッチ式の縦型熱処理装置の一例を示す概
略斜視図、図９は図８に示す装置の平面図、図１０は真
空排気系を有する従来のバッチ式の縦型熱処理装置の一
例を示す概略斜視図、図１１は図１０に示す装置の平面
図である。2. Description of the Related Art Generally, in order to form a semiconductor integrated circuit, various processes such as a film forming process, an oxidation diffusion process, an annealing process, and an etching process are repeatedly performed on an object to be processed such as a semiconductor wafer. Among the heat treatment apparatuses that perform such heat treatment, a so-called batch type vertical heat treatment apparatus that can perform processing on a large number of semiconductor wafers at a time is often used. 8 is a schematic perspective view showing an example of a conventional batch type vertical heat treatment apparatus without a vacuum exhaust system, FIG. 9 is a plan view of the apparatus shown in FIG. 8, and FIG. 10 is a conventional batch type heat treatment apparatus having a vacuum exhaust system. FIG. 11 is a schematic perspective view showing an example of the vertical heat treatment apparatus, and FIG. 11 is a plan view of the apparatus shown in FIG.
【０００３】この熱処理装置２は、装置本体４と、ガス
ボックス６と、電気系ボックス８とにより主に構成され
る。上記装置本体４は全体が筐体１２に囲まれており、
この中には周囲に加熱ヒータを配置して、内部で一度に
多数枚の半導体ウエハに対して所定の熱処理を施す縦型
の処理容器１４が設けられると共に、その前面側には、
半導体ウエハを収容したキャリア（図示せず）を搬入・
搬出させる搬出入ポート１６が形成されている。この搬
出入ポート１６側が操作面側となり、その反対側が裏面
側となる。更に、図示されていないが、この筐体１２内
には、カセットを載置するカセットストッカや、ウエハ
搬送機、ボートエレベータ等の種々の機構及び部材が設
けられている。[0003] The heat treatment apparatus 2 is mainly composed of an apparatus main body 4, a gas box 6 and an electric system box 8. The device main body 4 is entirely surrounded by a housing 12,
In this, a heater is disposed around and a vertical processing container 14 for internally performing a predetermined heat treatment on a large number of semiconductor wafers at a time is provided.
Loading a carrier (not shown) containing semiconductor wafers
A carry-in / out port 16 for carrying out is formed. The loading / unloading port 16 side is the operation surface side, and the opposite side is the back surface side. Further, although not shown, various mechanisms and members such as a cassette stocker for mounting a cassette, a wafer transfer machine, and a boat elevator are provided in the housing 12.
【０００４】上記ガスボックス６と上記電気系ボックス
８とは、ガスボックス６を上段にして上下に積み重ねら
れている。そして、このガスボックス６と電気系ボック
ス８は、装置本体４の裏面側にメンテナンス空間１８を
隔てて設けられており、上記ガスボックス６の内部には
拡散処理等の熱処理に必要な処理ガスを清浄化するフィ
ルタや開閉弁やマスフローコントローラのような流量制
御器等を内蔵するガス制御ユニット２０が収容されてい
る。このガスボックス６の全体はガスボックス筐体２２
により覆われて、その前面にはガス操作表示パネル２２
Ａが設けられる。上記ガスボックス６には、複数、図示
例では３本のガス供給ライン２４Ａ、２４Ｂ、２４Ｃが
接続されており、これらの各ガス供給ライン２４Ａ〜２
４Ｃは下方へ引き回されて、必要なガスを床下に配設さ
れている集中ガス源より導入するようになっている。ま
た、このガスボックス６からはボックス排気ライン２６
が下方に向けて延びており、床下に設けた排気設備によ
りガスボックス６内を吸引排気するようになっている。
また、上記電気系ボックス８は、必要な電気系部品を収
容したものである。尚、電源トランス等は、これが設置
されるクリーンルームの床下などに設置される。[0004] The gas box 6 and the electric system box 8 are vertically stacked with the gas box 6 as an upper stage. The gas box 6 and the electric system box 8 are provided on the back side of the apparatus main body 4 with a maintenance space 18 interposed therebetween. Inside the gas box 6, processing gas required for heat treatment such as diffusion processing is provided. A gas control unit 20 containing a filter for cleaning, an on-off valve, a flow controller such as a mass flow controller, and the like is housed. The entirety of the gas box 6 is a gas box housing 22.
And a gas operation display panel 22 on its front surface.
A is provided. A plurality of gas supply lines 24A, 24B, and 24C in the illustrated example are connected to the gas box 6, and these gas supply lines 24A to 24C are connected to each other.
4C is routed downward to introduce the required gas from a centralized gas source located below the floor. In addition, from the gas box 6, a box exhaust line 26
Extend downward, and the inside of the gas box 6 is sucked and evacuated by an exhaust system provided under the floor.
The electric box 8 accommodates necessary electric parts. The power transformer and the like are installed under the floor of a clean room where the power transformer is installed.
【０００５】そして、装置本体４とガスボックス６との
間は、配線用ダクト２８で連結されており、この下部に
種々のガス配管３０を通して、上記ガスボックス６から
処理容器１４内側へ各種の処理ガスを供給し得るように
なっている。このダクト２８内には、必要な配線ケーブ
ルが収容される。そして、装置本体４側のガス取り込み
部には上記ガス配管３０に接続されるバルブボックス３
２が設けられており、このバルブボックス３２内に最終
段の開閉弁やフィルタを内蔵させて、配管の引き回しに
起因する流量制御の精度劣化等を防止している。上記熱
処理装置２は、大気圧で、或いは大気圧近傍で拡散処理
やアニール処理を行う装置であるが、ＣＶＤ成膜処理等
を行うには大がかりな真空排気系が必要であり、この場
合には、図１０及び図１１に示すように、上記ガスボッ
クス６と電気系ボックス８の一体化物に背中合わせとな
るように排気ボックス３４を併設している。尚、この場
合、ガスボックス６と電気系ボックス８は図８及び図９
に示す場合とは反対側に向けて、操作を行うようになっ
ている。この排気ボックス３４内には、排気管３８に介
設して開閉弁、圧力制御弁、トラップ機構等（図示せ
ず）が設けられるが、この排気ボックス３４の排気管３
８と上記装置本体４の処理容器１４との間は大口径の真
空排気管３６により接続され、この排気管３８を床下に
設けた真空ポンプ（図示せず）に接続して処理容器１４
内を真空引きするようになっている。[0005] The apparatus body 4 and the gas box 6 are connected by a wiring duct 28, and various gas pipes 30 pass through the lower part of the apparatus main body 4 and various processing pipes from the gas box 6 to the inside of the processing vessel 14. A gas can be supplied. In the duct 28, necessary wiring cables are accommodated. A valve box 3 connected to the gas pipe 30 is provided in a gas intake section of the apparatus body 4.
The valve box 32 is provided with a built-in last-stage on-off valve and a filter to prevent a deterioration in accuracy of flow control due to the routing of piping. The heat treatment apparatus 2 is an apparatus that performs a diffusion process or an annealing process at or near the atmospheric pressure. However, a large-scale vacuum exhaust system is required to perform a CVD film forming process or the like. As shown in FIG. 10 and FIG. 11, an exhaust box 34 is provided so as to be back-to-back with the integrated product of the gas box 6 and the electric system box 8. In this case, the gas box 6 and the electric system box 8 are connected to each other as shown in FIGS.
The operation is performed in the direction opposite to the case shown in FIG. An open / close valve, a pressure control valve, a trap mechanism, etc. (not shown) are provided in the exhaust box 34 through an exhaust pipe 38.
8 and the processing vessel 14 of the apparatus main body 4 are connected by a large-diameter vacuum exhaust pipe 36, and this exhaust pipe 38 is connected to a vacuum pump (not shown) provided under the floor to process the processing vessel 14.
The inside is evacuated.
【０００６】[0006]
【発明が解決しようとする課題】ところで、この種の熱
処理装置が設置されるクリーンルームは、単位面積当た
りの維持コストが非常に高いことから、装置自体の占有
スペースを減少させることは勿論必要であるが、更に、
この熱処理装置全体をメンテナンスするために確保すべ
きスペースを極力減少させることが求められている。し
かしながら、クリーンルームの多くは、装置の階下にガ
ス供給ラインや排気ラインを設けているため、上記した
従来の熱処理装置２にあっては、ガスボックス６と電気
系ボックス８との一体化物と装置本体４との間にメンテ
ナンス空間１８を設ける必要があるばかりか、その一体
化物の裏面側には、ガス供給ライン２４Ａ〜２４Ｃやボ
ックス排気ライン２６を配設するための配管スペース４
０も必要となり、全体としての必要スペースが非常に大
きくなってしまうという問題があった。また、図１０及
び図１１に示す従来装置例の場合には、一体化物のガス
操作パネル２２Ａ側に、上記配管スペース４０よりも面
積の大きな、メンテナンス空間４２を設けなければなら
ない、という問題があった。In a clean room in which this type of heat treatment apparatus is installed, the maintenance cost per unit area is very high. Therefore, it is of course necessary to reduce the space occupied by the apparatus itself. But also
It is required to reduce the space to be secured for maintenance of the entire heat treatment apparatus as much as possible. However, most of the clean rooms are provided with a gas supply line and an exhaust line downstairs of the apparatus. Therefore, in the above-described conventional heat treatment apparatus 2, the integrated body of the gas box 6 and the electric box 8 and the apparatus body In addition to the necessity of providing a maintenance space 18 between the gas supply lines 4 and 4, a piping space 4 for arranging gas supply lines 24A to 24C and a box exhaust line 26 is provided on the back side of the integrated material.
0 is also required, and there is a problem that the required space as a whole becomes very large. Further, in the case of the conventional apparatus shown in FIGS. 10 and 11, there is a problem that a maintenance space 42 having a larger area than the piping space 40 must be provided on the integrated gas operation panel 22A side. Was.
【０００７】特に、ウエハサイズが２０ｃｍ（８イン
チ）から３０ｃｍ（１２インチ）へ大きくなるに従っ
て、装置自体も格段に大きくなり、上記した問題点の早
期解決が望まれている。本発明は、以上のような問題点
に着目し、これを有効に解決すべく創案されたものであ
る。本発明の目的は、装置の占有スペースのみならず、
このメンテナンス空間も含めた必要なスペースを大幅に
削減することが可能な熱処理装置を提供することにあ
る。[0007] In particular, as the wafer size increases from 20 cm (8 inches) to 30 cm (12 inches), the size of the apparatus itself increases remarkably, and an early solution of the above-mentioned problems is desired. The present invention has been devised in view of the above problems and effectively solving them. The purpose of the present invention is not only the occupied space of the device,
An object of the present invention is to provide a heat treatment apparatus capable of greatly reducing a required space including the maintenance space.
【０００８】[0008]
【課題を解決するための手段】請求項１に係る発明は、
複数の被処理体に対して処理ガスにより所定の処理を施
すための処理容器を収容する装置本体と、前記処理ガス
の供給を制御するガス制御ユニットを収容するガスボッ
クスと、電気部品を収容する電気系ボックスとを有する
熱処理装置において、前記ガスボックスと前記電気系ボ
ックスとを、前記ガスボックスを下方にした状態でフレ
ーム筐体で上下に接合して一体化物とすると共に、この
一体化物の側面を前記装置本体の裏面に、この裏面に設
けたメンテナンスドアを避けて連結するように構成した
ものである。これにより、ガスボックスを電気系ボック
スの下段に位置させ、しかも上記両ボックスの一体化物
を装置本体の裏面側へ接合するようにしたので、従来必
要とされた配管スペースが不要となり、また、一体化物
も装置本体のメンテナンス空間の一部に配置されること
になるので、装置占有スペースと装置のメンテナンス空
間とを含む全体としての必要スペースを大幅に削減する
ことが可能となる。The invention according to claim 1 is
An apparatus main body that houses a processing container for performing a predetermined process with a processing gas on a plurality of processing objects, a gas box that houses a gas control unit that controls the supply of the processing gas, and an electrical component that houses In a heat treatment apparatus having an electric system box, the gas box and the electric system box are vertically joined by a frame housing with the gas box down, and a side surface of the integrated body is formed. Is connected to the back surface of the apparatus main body, avoiding the maintenance door provided on the back surface. As a result, the gas box is located at the lower level of the electric system box, and the integrated body of the two boxes is joined to the back side of the device main body, so that the piping space conventionally required becomes unnecessary, and Since the compound is also disposed in a part of the maintenance space of the apparatus main body, it is possible to greatly reduce the required space as a whole including the space occupied by the apparatus and the maintenance space of the apparatus.
【０００９】この場合、例えば請求項２に規定するよう
に、前記ガスボックスのガス操作パネルと、前記電気系
ボックスの電気操作パネルとは、前記メンテナンスドア
の後方に位置するメンテナンス空間に臨ませて配置され
る。また、例えば請求項３に規定するように、前記処理
容器内の真空引きを制御するための排気ユニットを収容
する排気ボックスを、前記メンテナンス空間を挟んで前
記一体化物に対向させて前記装置本体の裏面に接合す
る。これによれば、処理容器内の真空引きを行う排気ボ
ックスも装置本体の裏面に直接接合しているので、全体
としての必要スペースを一層削減することが可能とな
る。In this case, for example, as defined in claim 2, the gas operation panel of the gas box and the electric operation panel of the electric system box face a maintenance space located behind the maintenance door. Be placed. Further, for example, as defined in claim 3, an exhaust box containing an exhaust unit for controlling the evacuation of the inside of the processing container is opposed to the integrated body with the maintenance space interposed therebetween, so that Join on the back. According to this, since the exhaust box for evacuating the inside of the processing container is also directly joined to the back surface of the apparatus main body, it is possible to further reduce the required space as a whole.
【００１０】この場合、例えば請求項４に規定するよう
に、前記一体化物のメンテナンスを行う一体化物メンテ
ナンス空間と、前記排気ボックスのメンテナンスを行う
排気メンテナンス空間と、前記装置本体のメンテナンス
空間とを共用する。In this case, for example, an integrated article maintenance space for performing maintenance of the integrated article, an exhaust maintenance space for performing maintenance of the exhaust box, and a maintenance space for the apparatus main body are shared. I do.
【００１１】[0011]
【発明の実施の形態】以下に、本発明に係る熱処理装置
の一実施例を添付図面に基づいて詳述する。図１は本発
明の熱処理装置の第１実施例の裏面側を示す斜視図、図
２は図１に示す装置の平面図、図３は図１に示す装置の
側面図、図４は本発明装置の第１実施例の必要スペース
の削減効果を説明するための説明図である。尚、ここで
は先に説明した従来装置と同一構成部分については同一
符号を付して説明する。この熱処理装置５０は、大気
圧、或いは大気圧近傍で拡散処理等の熱処理を行う装置
であり、後述するようにここでは真空排気系を設けてい
ない。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a heat treatment apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. 1 is a perspective view showing the back side of a first embodiment of the heat treatment apparatus of the present invention, FIG. 2 is a plan view of the apparatus shown in FIG. 1, FIG. 3 is a side view of the apparatus shown in FIG. 1, and FIG. FIG. 6 is an explanatory diagram for explaining an effect of reducing a required space of the first embodiment of the device. Here, the same components as those of the above-described conventional device are denoted by the same reference numerals and described. The heat treatment apparatus 50 is an apparatus for performing a heat treatment such as a diffusion process at or near atmospheric pressure, and does not include a vacuum exhaust system as described later.
【００１２】まず、この熱処理装置５０は、装置本体４
と、ガスボックス６と、電気系ボックス８とにより主に
構成される。上記装置本体４は全体が筐体１２に囲まれ
ており、この中には周囲に加熱ヒータを配置して、内部
で一度に多数枚の半導体ウエハに対して熱拡散等の所定
の熱処理を施す縦型の処理容器１４が設けられると共
に、その前面側には、半導体ウエハを収容したキャリア
（図示せず）を搬入・搬出させる搬出入ポート１６及び
本体操作パネル１７（図２参照）が形成されている。こ
の搬出入ポート１６側が操作面側となり、その反対側が
裏面側となる。更に、図示されていないが、この筐体１
２内には、カセットを載置するカセットストッカや、ウ
エハ搬送機、ボートエレベータ等の種々の機構及び部材
が設けられている。また、上記筐体１２の裏面側には上
記処理容器１４を搬出入したり、この装置本体４内をメ
ンテナンスする際に、開閉されるメンテナンスドア５２
が開閉可能に設けられる。First, the heat treatment apparatus 50 includes an apparatus main body 4
, A gas box 6 and an electric box 8. The apparatus main body 4 is entirely surrounded by a housing 12, in which a heater is arranged, and a predetermined heat treatment such as thermal diffusion is performed on a large number of semiconductor wafers at once inside. A vertical processing container 14 is provided, and a loading / unloading port 16 for loading / unloading a carrier (not shown) containing a semiconductor wafer and a main body operation panel 17 (see FIG. 2) are formed on the front side thereof. ing. The loading / unloading port 16 side is the operation surface side, and the opposite side is the back surface side. Further, although not shown, this housing 1
Various mechanisms and members, such as a cassette stocker for mounting a cassette, a wafer transfer device, and a boat elevator, are provided in 2. A maintenance door 52 that is opened and closed when loading and unloading the processing container 14 and performing maintenance on the inside of the apparatus main body 4 on the back side of the housing 12.
Is provided so as to be openable and closable.
【００１３】上記ガスボックス６と上記電気系ボックス
８とは、ガスボックス６を下段にして上下に積み重ねら
れている。そして、このガスボックス６と電気系ボック
ス８は、フレームを用いて縦長の直方体状に組み立てら
れたフレーム筐体５４により上下に接合されており、一
体化物５６として構成されている。そして、この一体化
物５６の幅の狭い側面を、上記装置本体４の裏面の一側
に連結するように接合させている。この場合、勿論のこ
ととして、上記メンテナンスドア５２を避けるように上
記一体化物５６を接合している。The gas box 6 and the electric box 8 are vertically stacked with the gas box 6 at the bottom. The gas box 6 and the electric system box 8 are vertically joined by a frame casing 54 assembled in a vertically long rectangular parallelepiped shape using a frame, and are configured as an integrated body 56. Then, the narrow side surface of the integrated body 56 is joined so as to be connected to one side of the back surface of the apparatus main body 4. In this case, needless to say, the integrated member 56 is joined so as to avoid the maintenance door 52.
【００１４】上記ガスボックス６の内部には拡散処理等
の熱処理に必要な処理ガスを清浄化するフィルタや開閉
弁やマスフローコントローラのような流量制御器等を内
蔵するガス制御ユニット（図示せず）が収容されてい
る。このガスボックス６の全体はプレート５８により覆
われて、その前面の一部にはガス操作表示パネル２２Ａ
が設けられ、また、前面のパネル５８も開閉可能になさ
れている。そして、このガスボックス６の上部には複
数、図示例では３つのガス出口６０Ａ、６０Ｂ、６０Ｃ
が設けられる。また、上記電気ボックス８は、必要な電
気部品やガス検出器等が収容されており、この前面には
ガス指示計や表示ランプや操作ボタン等の電気系操作表
示パネル８Ａが設けられる。そして、これらの各パネル
８Ａ、２２Ａは、装置本体４の裏面側である装置本体４
のメンテナンス空間６２に臨ませて設けられている。Inside the gas box 6, a gas control unit (not shown) incorporating a filter for purifying a processing gas necessary for heat treatment such as diffusion processing, a flow controller such as an on-off valve and a mass flow controller, etc. Is housed. The entire gas box 6 is covered with a plate 58, and a part of the front surface thereof is provided with a gas operation display panel 22A.
Is provided, and a front panel 58 is also opened and closed. In the upper part of the gas box 6, a plurality of gas outlets 60A, 60B, and 60C in the illustrated example are provided.
Is provided. The electric box 8 houses necessary electric parts, gas detectors, and the like, and an electric operation display panel 8A such as a gas indicator, a display lamp, and operation buttons is provided on a front surface of the electric box 8. Each of these panels 8A and 22A is connected to the device body 4 on the back side of the device body 4.
Is provided so as to face the maintenance space 62.
【００１５】そして、図３に示すように、この熱処理装
置５０を設置するクリーンルームの床は、上床６４と下
床６６とよりなる２重構造になされており、この上床６
４と下床６６との間に形成されたユティリティ空間６８
内に、必要ガスを供給するガス通路７０Ａ、７０Ｂ、７
０Ｃ、略常圧での排気を行う常圧排気管７２、必要な装
置毎に真空ポンプ７４を設けた真空排気管７６、各種の
配線コード７８等が設けられている。尚、本実施例では
常圧処理を行うことから、真空ポンプ７４や真空排気管
７６は用いられない。更に、このユティリティ空間６８
内には、電源トランス等も設置される。そして、上記各
ガス通路７０Ａ〜７０Ｃは、上記ガスボックス６よりそ
の下方へ直接的に延びる各ガス供給管２４Ａ、２４Ｂ、
２４Ｃへ接続され、このガスボックス６の上部に設けた
各ガス出口６０Ａ、６０Ｂ、６０Ｃと上記処理容器１４
とを連絡するようにガス管８０Ａ、８０Ｂ、８０Ｃを接
続し、必要なガスを流量制御しつつ処理容器１４内へ供
給し得るようになっている。As shown in FIG. 3, the floor of the clean room in which the heat treatment apparatus 50 is installed has a double structure consisting of an upper floor 64 and a lower floor 66.
Utility space 68 formed between 4 and lower floor 66
Gas passages 70A, 70B, 7 for supplying necessary gas
At 0C, a normal pressure exhaust pipe 72 for exhausting at substantially normal pressure, a vacuum exhaust pipe 76 provided with a vacuum pump 74 for each necessary device, various wiring cords 78 and the like are provided. In this embodiment, the vacuum pump 74 and the vacuum exhaust pipe 76 are not used because the atmospheric pressure processing is performed. Furthermore, this utility space 68
Inside, a power transformer and the like are also installed. Each of the gas passages 70A to 70C has a gas supply pipe 24A, 24B, which extends directly below the gas box 6 below.
24C, each of the gas outlets 60A, 60B, 60C provided at the upper part of the gas box 6 and the processing vessel 14
The gas pipes 80A, 80B, and 80C are connected to communicate with each other so that necessary gas can be supplied into the processing container 14 while controlling the flow rate.
【００１６】また、ガスボックス６の下端部には、この
ガスボックス６内の雰囲気を吸引排気するための複数
（図示例では３つ）のボックス排気口８０Ａ、８０Ｂ、
８０Ｃが設けられており、各ボックス排気口８０Ａ〜８
０Ｃを選択的に使用し得るようになっている。図３に示
す場合には、中央に位置するボックス排気口８０Ｂを用
いており、これに常圧排気管７２を接続している。この
ように複数のボックス排気口８０Ａ〜８０Ｃを設けて選
択的に利用できるようにした理由は、上記ユティリティ
空間６８内に設けた床梁（図示せず）等の障害物によっ
て特定のボックス排気口が利用できなくなる場合を考慮
したものである。また、このガスボックス６の一側を上
下方向に貫通させるようにして、上記電気系ボックス８
に連絡する配線コード７８を配設している。At the lower end of the gas box 6, a plurality of (three in the illustrated example) box exhaust ports 80A, 80B for sucking and exhausting the atmosphere in the gas box 6 are provided.
80C, and each box exhaust port 80A-8
0C can be selectively used. In the case shown in FIG. 3, a box exhaust port 80B located at the center is used, and a normal pressure exhaust pipe 72 is connected to this. The reason why the plurality of box exhaust ports 80A to 80C are provided to be selectively used as described above is that a specific box exhaust port is provided by an obstacle such as a floor beam (not shown) provided in the utility space 68. Is considered when the service becomes unavailable. Also, one side of the gas box 6 is vertically penetrated so that the electric box 8
Is provided.
【００１７】このようになされた本発明装置は、一般的
には、複数台が隣同士を接して並設されることになる。
この本発明装置によれば、ガスボックス６を電気系ボッ
クス８の下段に位置させた状態で両ボックスを接合して
一体化物５６とし、この一体化物５６を装置本体４の裏
面側にメンテナンスドア５２を避けるようにして取り付
けるようにしているので、ガスボックス６からのガス供
給管２４Ａ〜２４Ｃは、この一体化物５６の外側を引き
回すことなく下方に直接延ばして床下のユティリティ空
間６８に配設されている各ガス通路７０Ａ〜７０Ｃに直
接連結でき、従来装置で必要とされた配管引き回し用の
スペース（図９参照）をなくすことが可能となる。ま
た、上記したようにガスボックス６と電気系ボックス８
との一体化物５６を、装置本体４の裏面側のメンテナン
ス空間６２の一部に配置させるようになっており、そし
て、この装置本体４のメンテナンス空間６２と上記一体
化物５６をメンテナンスするための一体化物メンテナン
ス空間とを共用させるようにしている。従って、以上の
理由より、装置の占有スペースと装置のメンテナンス空
間とを含む全体としての必要スペースを大幅に削減する
ことができる。In the apparatus of the present invention thus constructed, generally, a plurality of apparatuses are juxtaposed adjacently to each other.
According to the device of the present invention, the two boxes are joined to form an integrated product 56 with the gas box 6 positioned at the lower level of the electric system box 8, and the integrated product 56 is attached to the back side of the device body 4 by the maintenance door 52. Therefore, the gas supply pipes 24A to 24C from the gas box 6 extend directly downward without routing around the outside of the integrated body 56 and are disposed in the utility space 68 below the floor. Can be directly connected to each of the gas passages 70A to 70C, and a space for pipe routing (see FIG. 9) required in the conventional apparatus can be eliminated. Also, as described above, the gas box 6 and the electric box 8
And the integrated space 56 for maintaining the integrated space 56 with the maintenance space 62 of the apparatus main body 4. The building is shared with the monster maintenance space. Therefore, for the above reasons, the required space as a whole including the space occupied by the device and the maintenance space for the device can be significantly reduced.
【００１８】このように、本発明装置の第１実施例の省
スペース化の効率について、図４を参照して従来装置の
場合と比較して説明する。図４（Ａ）は従来装置の配置
の場合（図９に対応）を示し、図４（Ｂ）は本発明装置
の配置の場合を示し、図中、斜線部分はメンテナンス空
間（配管スペースを含む）を示す。図４（Ａ）に従来装
置の場合には、装置本体４とガス電気系ボックス６、８
の両裏面側にそれぞれメンテナンス空間１８と配管スペ
ース４０を必要としている。この場合、ウエハサイズに
もよるが、装置本体４の長さＨ１は１９００ｍｍ程度、
メンテナンス空間１８の長さＨ２は１２００ｍｍ程度、
ガスボックス６と電気系ボックス８の長さＨ３は６００
ｍｍ程度、配管スペース４０の長さＨ４は６００ｍｍ程
度である。尚、このメンテナンス空間１８は、処理容器
ヒータを搬出入するヒータ通路も兼ねている。The efficiency of space saving in the first embodiment of the present invention will be described in comparison with the conventional apparatus with reference to FIG. FIG. 4A shows the case of the arrangement of the conventional apparatus (corresponding to FIG. 9), and FIG. 4B shows the case of the arrangement of the apparatus of the present invention. ). FIG. 4A shows the case of the conventional apparatus, in which the apparatus main body 4 and the gas electric system boxes 6, 8
Requires a maintenance space 18 and a piping space 40 on both back sides. In this case, depending on the wafer size, the length H1 of the apparatus main body 4 is about 1900 mm,
The length H2 of the maintenance space 18 is about 1200 mm,
The length H3 of the gas box 6 and the electric system box 8 is 600
mm and the length H4 of the piping space 40 is about 600 mm. The maintenance space 18 also serves as a heater passage for carrying in and out the processing container heater.
【００１９】これに対して、図４（Ｂ）に示す本発明装
置の第１実施例の場合には、装置本体４の長さＨ１が同
じく１９００ｍｍ程度、一体化物５６の置かれているメ
ンテナンス空間６２の長さＨ５は１０００ｍｍ程度、更
にその背面側に必要とされるヒータ通路８０の長さＨ６
は８５０ｍｍ程度であり、本発明装置の方が遥かに省ス
ペース化に寄与させることができる。また、本発明装置
の場合には、ガスボックス６から処理容器１４に至るガ
ス管８０Ａ〜８０Ｃ（図３参照）の長さが非常に短いの
で、従来装置で必要とされたバルブボックス３２（図９
参照）を省略することができる。On the other hand, in the case of the first embodiment of the apparatus of the present invention shown in FIG. 4B, the length H1 of the apparatus main body 4 is also about 1900 mm, and the maintenance space in which the integrated member 56 is placed. The length H5 of the heater passage 80 is about 1000 mm, and the length H6
Is about 850 mm, and the device of the present invention can contribute to much space saving. Further, in the case of the apparatus of the present invention, since the length of the gas pipes 80A to 80C (see FIG. 3) from the gas box 6 to the processing container 14 is very short, the valve box 32 (see FIG. 9
) Can be omitted.
【００２０】上記実施例の熱処理装置５０は、大気圧
で、或いは大気圧近傍で拡散処理やアニール処理を行う
熱処理装置を例にとって説明したが、真空雰囲気下にて
ＣＶＤ成膜等を行う熱処理装置についても本発明を適用
することができる。この真空雰囲気下にてＣＶＤ成膜処
理等を行うには大がかりな真空排気系が必要であり、こ
の場合には、図５及び図６に示すように、上記ガスボッ
クス６と電気系ボックス８の一体化物５６に対向するよ
うにメンテナンス空間６２を挟んで排気ボックス３４を
装置本体４の裏面に接合させている。この排気ボックス
３４は、全体がパネル８２により覆われており、メンテ
ナンス空間６２側は開閉可能になっている（図５中にお
いては一部のパネルを取った状態を示す）。この排気ボ
ックス３４内には開閉弁８４、トラップ機構８６、圧力
制御弁８８等が設けられるが、この排気ボックス３４の
排気管３８の上端は直接的に処理容器１４へ接続され、
この排気管３８の下端は床下に設けた真空ポンプ７４
（図３参照）に接続して処理容器１４内を真空引きする
ようになっている。Although the heat treatment apparatus 50 of the above embodiment has been described as an example of a heat treatment apparatus for performing diffusion processing or annealing treatment at or near atmospheric pressure, a heat treatment apparatus for performing CVD film formation or the like in a vacuum atmosphere. The present invention can also be applied to In order to perform a CVD film forming process or the like in this vacuum atmosphere, a large-scale vacuum exhaust system is required. In this case, as shown in FIGS. The exhaust box 34 is joined to the back surface of the apparatus main body 4 with the maintenance space 62 interposed therebetween so as to face the integrated body 56. The exhaust box 34 is entirely covered by a panel 82, and the maintenance space 62 is openable and closable (FIG. 5 shows a state in which some panels are removed). An open / close valve 84, a trap mechanism 86, a pressure control valve 88, and the like are provided in the exhaust box 34. The upper end of an exhaust pipe 38 of the exhaust box 34 is directly connected to the processing container 14,
The lower end of the exhaust pipe 38 is connected to a vacuum pump 74 provided under the floor.
(See FIG. 3) to evacuate the processing chamber 14.
【００２１】この実施例の場合には、先に説明した実施
例の作用効果に加えて、装置本体４のメンテナンス空間
６２と、一体化物５６をメンテナンスする一体化物メン
テナンス空間と、排気ボックス３４をメンテナンスする
排気メンテナンス空間とを共用させるようにしているの
で、全体として必要スペースを更に少なくして省スペー
ス化に寄与することが可能となる。尚、この場合、排気
ボックス３４を設置した領域だけメンテナンス空間６２
が狭くなるが、上記各部材をメンテナンスするには十分
な広さである。In the case of this embodiment, in addition to the functions and effects of the above-described embodiment, the maintenance space 62 of the apparatus main body 4, the integrated material maintenance space for maintaining the integrated material 56, and the exhaust box 34 are maintained. Since the exhaust maintenance space to be used is shared, it is possible to further reduce the required space as a whole and to contribute to space saving. In this case, only the area where the exhaust box 34 is installed has the maintenance space 62.
Is small, but is large enough for maintenance of the above members.
【００２２】このように、本発明装置の第２実施例の省
スペース化の効率について、図７を参照して従来装置の
場合と比較して説明する。図７（Ａ）は従来装置の配置
の場合（図１１に対応）を示し、図７（Ｂ）は本発明装
置の配置の場合を示し、図中斜線部分はメンテナンス空
間（配管スペースを含む）を示す。図７（Ａ）に従来装
置の場合には、装置本体４とガス電気系ボックス６、８
の両裏面側にそれぞれメンテナンス空間１８と配管スペ
ース４０を必要としている。また、排気ボックス３４の
メンテナンス空間は、装置本体４のメンテナンス空間を
共用している。この場合、ウエハサイズにもよるが、装
置本体４の長さＨ１は１９００ｍｍ程度、メンテナンス
空間１８の長さＨ２は１２００ｍｍ程度、排気ボックス
３４の長さＨ８は６００ｍｍ程度、ガスボックス６と電
気系ボックス８の長さＨ３は６００ｍｍ程度、配管スペ
ース４０の長さＨ４は６００ｍｍ程度である。尚、この
メンテナンス空間１８は、処理容器ヒータを搬出入する
ヒータ通路も兼ねている。The efficiency of space saving in the second embodiment of the present invention will be described in comparison with the conventional apparatus with reference to FIG. FIG. 7A shows the case of the arrangement of the conventional apparatus (corresponding to FIG. 11), and FIG. 7B shows the case of the arrangement of the apparatus of the present invention. In the figure, the hatched portion indicates the maintenance space (including the piping space). Is shown. In the case of the conventional apparatus shown in FIG. 7A, the apparatus main body 4 and the gas electric system boxes 6, 8
Requires a maintenance space 18 and a piping space 40 on both back sides. The maintenance space of the exhaust box 34 shares the maintenance space of the apparatus main body 4. In this case, although depending on the wafer size, the length H1 of the apparatus main body 4 is about 1900 mm, the length H2 of the maintenance space 18 is about 1200 mm, the length H8 of the exhaust box 34 is about 600 mm, and the gas box 6 and the electric box 8, the length H3 is about 600 mm, and the length H4 of the piping space 40 is about 600 mm. The maintenance space 18 also serves as a heater passage for carrying in and out the processing container heater.
【００２３】これに対して、図７（Ｂ）に示す本発明装
置の第２実施例の場合には、装置本体４の長さＨ１が同
じく１９００ｍｍ程度、一体化物５６及び排気ボックス
３４の置かれているメンテナンス空間６２の長さＨ５は
１０００ｍｍ程度、更にその背面側に必要とされるヒー
タ通路８０の長さＨ６は８５０ｍｍ程度であり、本発明
装置の方が遥かに省スペース化に寄与させることができ
る。尚、以上の各数値例は、比較のために単に一例を示
したに過ぎず、これらに限定されないのは勿論である。
また、ここでは被処理体として半導体ウエハに対して熱
処理する場合を例にとって説明したが、これに限定され
ず、ＬＣＤ基板、ガラス基板等に熱処理する場合にも、
本発明を適用できるのは勿論である。On the other hand, in the case of the second embodiment of the apparatus of the present invention shown in FIG. 7B, the length H1 of the apparatus main body 4 is also about 1900 mm, and the integrated member 56 and the exhaust box 34 are placed. The length H5 of the maintenance space 62 is about 1000 mm, and the length H6 of the heater passage 80 required on the back side is about 850 mm. The apparatus of the present invention contributes to much space saving. Can be. It should be noted that each of the above numerical examples is merely an example for comparison, and it is a matter of course that the present invention is not limited to these.
In addition, here, the case where heat treatment is performed on a semiconductor wafer as an object to be processed has been described as an example, but the present invention is not limited thereto.
Of course, the present invention can be applied.
【００２４】[0024]
【発明の効果】以上説明したように、本発明の熱処理装
置によれば、次のように優れた作用効果を発揮すること
ができる。請求項１、２に係る発明によれば、ガスボッ
クスを電気系ボックスの下段に位置させ、しかも上記両
ボックスの一体化物を装置本体の裏面側へ接合するよう
にしたので、従来必要とされた配管スペースが不要とな
り、また、一体化物も装置本体のメンテナンス空間の一
部に配置されることになるので、装置占有スペースと装
置のメンテナンス空間とを含む全体としての必要スペー
スを大幅に削減することができる。請求項３、４に係る
発明によれば、処理容器内の真空引きを行う排気ボック
スも装置本体の裏面に直接接合しているので、全体とし
ての必要スペースを一層削減することができる。As described above, according to the heat treatment apparatus of the present invention, the following excellent functions and effects can be exhibited. According to the first and second aspects of the present invention, the gas box is located at the lower stage of the electric system box, and the integrated body of the two boxes is joined to the back side of the apparatus main body. Piping space is not required, and the integrated product will be placed in a part of the maintenance space of the device main body. Therefore, the required space as a whole including the space occupied by the device and the maintenance space for the device will be significantly reduced. Can be. According to the third and fourth aspects of the present invention, since the exhaust box for evacuating the inside of the processing container is also directly joined to the back surface of the apparatus main body, the required space as a whole can be further reduced.
【図１】本発明の熱処理装置の第１実施例の裏面側を示
す斜視図である。FIG. 1 is a perspective view showing a back side of a first embodiment of a heat treatment apparatus of the present invention.
【図２】図１に示す装置の平面図である。FIG. 2 is a plan view of the device shown in FIG.
【図３】図１に示す装置の側面図である。FIG. 3 is a side view of the device shown in FIG. 1;
【図４】本発明装置の第１実施例の必要スペースの削減
効果を説明するための説明図である。FIG. 4 is an explanatory diagram for explaining the effect of reducing the required space in the first embodiment of the device of the present invention.
【図５】本発明の熱処理装置の第２実施例の裏面側を示
す斜視図である。FIG. 5 is a perspective view showing a back side of a second embodiment of the heat treatment apparatus of the present invention.
【図６】図５に示す装置の平面図である。6 is a plan view of the device shown in FIG.
【図７】本発明装置の第２実施例の必要スペースの削減
効果を説明するための説明図である。FIG. 7 is an explanatory diagram for explaining the effect of reducing the required space in the second embodiment of the device of the present invention.
【図８】真空排気系を有しない従来のバッチ式の縦型熱
処理装置の一例を示す概略斜視図である。FIG. 8 is a schematic perspective view showing an example of a conventional batch type vertical heat treatment apparatus having no evacuation system.
【図９】図８に示す装置の平面図である。9 is a plan view of the device shown in FIG.
【図１０】真空排気系を有する従来のバッチ式の縦型熱
処理装置の一例を示す概略斜視図である。FIG. 10 is a schematic perspective view showing an example of a conventional batch type vertical heat treatment apparatus having a vacuum evacuation system.
【図１１】図１０に示す装置の平面図である。11 is a plan view of the device shown in FIG.
４ 装置本体 ６ ガスボックス ８ 電気系ボックス １４ 処理容器 ３４ 排気ボックス ５０ 熱処理装置 ５２ メンテナンスドア ５４ フレーム筐体 ５６ 一体化物 ６０Ａ〜６０Ｃ ガス出口 ６２ メンテナンス空間 ７０Ａ〜７０Ｃ ガス通路 ７２ 常圧排気管 ７４ 真空ポンプ ７６ 真空排気管 Reference Signs List 4 apparatus main body 6 gas box 8 electric box 14 processing container 34 exhaust box 50 heat treatment apparatus 52 maintenance door 54 frame housing 56 integrated body 60A to 60C gas outlet 62 maintenance space 70A to 70C gas passage 72 normal pressure exhaust pipe 74 vacuum pump 76 Vacuum exhaust pipe
フロントページの続き (72)発明者 佐藤 健一 神奈川県津久井郡城山町町屋１丁目２番41 号 東京エレクトロン東北株式会社相模事 業所内 Ｆターム(参考） 3L058 BD00 BE02 BF09 BG05 4K030 DA09 EA01 KA08 KA28 5F045 BB08 BB10 EB05 EC07 EE01Continuation of the front page (72) Inventor Kenichi Sato 1-2-41 Machiya, Shiroyamacho, Tsukui-gun, Kanagawa Prefecture F-term (reference) in the Tokyo Electron Tohoku Sagami Office 3L058 BD00 BE02 BF09 BG05 4K030 DA09 EA01 KA08 KA28 5F045 BB08 BB10 EB05 EC07 EE01
Claims (4)
所定の処理を施すための処理容器を収容する装置本体
と、前記処理ガスの供給を制御するガス制御ユニットを
収容するガスボックスと、電気部品を収容する電気系ボ
ックスとを有する熱処理装置において、前記ガスボック
スと前記電気系ボックスとを、前記ガスボックスを下方
にした状態でフレーム筐体で上下に接合して一体化物と
すると共に、この一体化物の側面を前記装置本体の裏面
に、この裏面に設けたメンテナンスドアを避けて連結す
るように構成したことを特徴とする熱処理装置。An apparatus main body accommodating a processing container for performing a predetermined processing on a plurality of objects by a processing gas with a processing gas; a gas box accommodating a gas control unit for controlling supply of the processing gas; In a heat treatment apparatus having an electric system box for housing electric components, the gas box and the electric system box are joined together up and down by a frame housing with the gas box down, to form an integrated product, A heat treatment apparatus, wherein a side surface of the integrated material is connected to a back surface of the apparatus main body while avoiding a maintenance door provided on the back surface.
前記電気系ボックスの電気操作パネルとは、前記メンテ
ナンスドアの後方に位置するメンテナンス空間に臨ませ
て配置されることを特徴とする請求項１記載の熱処理装
置。2. A gas operation panel of the gas box,
2. The heat treatment apparatus according to claim 1, wherein the electric operation panel of the electric box is arranged to face a maintenance space located behind the maintenance door. 3.
めの排気ユニットを収容する排気ボックスを、前記メン
テナンス空間を挟んで前記一体化物に対向させて前記装
置本体の裏面に接合するようにしたことを特徴とする請
求項２記載の熱処理装置。3. An exhaust box for accommodating an exhaust unit for controlling the evacuation of the inside of the processing container is joined to the back surface of the apparatus main body so as to face the integrated body with the maintenance space interposed therebetween. The heat treatment apparatus according to claim 2, wherein:
化物メンテナンス空間と、前記排気ボックスのメンテナ
ンスを行う排気メンテナンス空間と、前記装置本体のメ
ンテナンス空間とを共用するようにしたことを特徴とす
る請求項３記載の熱処理装置。4. The apparatus according to claim 1, wherein an integrated article maintenance space for performing maintenance of the integrated article, an exhaust maintenance space for performing maintenance of the exhaust box, and a maintenance space for the apparatus main body are shared. 3. The heat treatment apparatus according to 3.
Priority Applications (1)
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|---|---|---|---|
| JP2000364959A JP3610900B2 (en) | 2000-11-30 | 2000-11-30 | Heat treatment equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000364959A JP3610900B2 (en) | 2000-11-30 | 2000-11-30 | Heat treatment equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002170781A true JP2002170781A (en) | 2002-06-14 |
| JP3610900B2 JP3610900B2 (en) | 2005-01-19 |
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|---|---|---|---|
| JP2000364959A Expired - Fee Related JP3610900B2 (en) | 2000-11-30 | 2000-11-30 | Heat treatment equipment |
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