JP2002157558A - IC chip mounted body and manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC chip mounting body having a reinforcing member which is more inexpensive and more reliable compared with an IC chip mounting body having a conventional reinforcing member, and a manufacturing method. SOLUTION: Resin for fixing does not have to be provided between the reinforcing member and the chip, and as a result, its volume does not increase. Furthermore, there is no problem of making the reinforcing member shift to disturb an operation even when the IC chip mounting body where the reinforcing member is mounted on the IC chip is moved before the resin cures.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION An IC chip mounted body of the present invention is a so-called contact IC card used for a bank card, a point card, etc., a ticket, a telephone card,
The present invention relates to a so-called non-contact type IC card used for a luggage tag or the like and exchanging data and the like by external radio waves, and a so-called combination type IC card having both functions of a contact type and a non-contact type.

[0002] These IC packages are also called data carriers, commonly called IC cards.
Not only a card-shaped carrier but also a carrier in various forms, such as a sheet-shaped product attached to an object, a tag enclosed in a container, and a wristwatch-shaped carrier. Also in this specification, the IC package is used as including an IC card or a form other than a card.

[0003]

2. Description of the Related Art In recent years, small electronic devices in which an IC chip is mounted as a new information recording medium on a commuter pass or the like used for personal security management, physical distribution management, commuting to school, and the like are becoming widespread. In particular, a card-type large-capacity variable information recording medium called a convenient IC card for portable use has begun to spread widely. IC cards are roughly classified into two types: contact type and non-contact type. In the contact type, a terminal for data exchange is provided on the card surface, and data exchange with an external reader is performed through the terminal. Currently, the disposable type is widely distributed as a telephone card in Europe and the like. In addition, experiments using a rewritable type of information as a money card have been conducted in various countries, and are attracting attention as cards used in financial relations.

[0004] On the other hand, non-contact IC cards are attracting attention as recording media, such as conventional tickets and commuter passes, which are replaced with tickets having a magnetic recording layer provided on one side, for exchanging data by radio waves. In particular, it is expected that the convenience will be greatly improved because the data can be exchanged even from a regular baggage, a bag or the like without taking out the ticket one by one at the time of passing the ticket gate. In the physical distribution field as well, management using an RFID tag, which replaces barcodes and magnetic recording with a mobile object by radio waves, is becoming mainstream. As a method of mounting an IC chip on such a small electronic device, a wire bonding method has been widely used conventionally. In the wire bonding method, electrical conduction is performed by connecting a pad of an IC chip and a metal lead with a gold wire having a thickness of several μm. However, due to the characteristics of the connection structure, the gold wire forms a large arc on the chip pad, and it is sealed with epoxy or other resin to protect this gold wire, and further packaged with a ceramic medium Is usually done. Therefore, it has a very bulky structure, and is not suitable as a method for mounting an IC chip in a small electronic device.

On the other hand, in the face-down method using an IC chip in which pads such as gold or solder are provided on the pads, since the bumps are directly connected to the circuit board, it is not necessary to use gold wires for wiring, and the mounting volume is reduced. Because of its ability, it has attracted much attention as an IC chip mounting method for small portable electronic devices. Further, in order to improve durability, a reinforcing member is provided on an IC chip. After connecting and fixing the IC chip to the circuit board by face-down method, it is common practice to apply a resin such as epoxy on the IC chip, mount a reinforcing member on it, and cure and fix the epoxy resin with ultraviolet rays etc. ing.

[0006]

However, in such a method, it is necessary to interpose a fixing resin between the reinforcing member and the chip, resulting in a problem that the volume is increased. Further, when a device having a reinforcing member mounted on an IC chip is moved before curing of the resin, there is a problem that the reinforcing member is displaced, which hinders the operation. SUMMARY OF THE INVENTION An object of the present invention is to provide an IC chip package having a reinforcing member that is more inexpensive and more reliable than a conventional IC chip package having a reinforcing member, and a method of manufacturing the same.

[0007]

According to the first aspect of the present invention, there is provided:
The C-chip mounting body is composed of a circuit board, an IC chip and an IC connected and fixed to the circuit board via a single curable resin layer.
A reinforcing member that covers at least a part of a surface of the chip opposite to a surface connected by the curable resin layer. In this mounting body, the IC chip and the reinforcing member are connected and fixed by a single curable resin layer provided between the IC chip and the circuit board without providing a fixing resin between the IC chip and the reinforcing member. Therefore, the volume does not increase unnecessarily despite having the reinforcing member. Furthermore, since no fixing resin is required between the IC chip and the reinforcing member, an IC chip mounted body with low manufacturing cost can be provided. Claim 2
The IC chip package according to the invention is characterized in that the curable resin layer is a thermosetting resin layer. The thermosetting resin layer is more preferable as the curable resin layer of the present invention because the curing time is short and handling at normal temperature is easy. An IC chip mounted body according to a third aspect of the invention is characterized in that the reinforcing member and the IC chip are at least covered with another resin layer. The reinforcing member and the I
By covering at least the C chip with another resin layer, the reinforcing member and the IC chip can be more stably fixed on the circuit board. An IC chip package according to a fourth aspect of the present invention is characterized in that the reinforcing member covers at least the IC chip. When the reinforcing member covers the IC chip, the bonding area with the curable resin layer increases, so that the reinforcing member and the IC chip can be more stably fixed on the circuit board.

The IC chip mounted body of the present invention is suitable for mounting an IC chip of a small electronic device because the mounting area and volume of the IC chip can be reduced as much as possible. Particularly, the IC chip is mounted in a thin card. Very suitable for contactless IC cards. In the method for manufacturing an IC chip mounted body according to the invention of claim 5, pressure is applied by a pressing jig from a side of the reinforcing member where the IC chip is not provided, so that the reinforcing member and the IC are mounted.
The C chip is integrally fixed on the circuit board by a curable resin layer between the IC chip and the circuit board. According to this method, the reinforcing member and the IC chip can be fixed on the circuit board by one press-fixing operation. Therefore, work efficiency can be improved.
Further, since no separate adhesive is required between the IC chip and the reinforcing member, an inexpensive IC chip mounting body can be provided. According to a sixth aspect of the present invention, in the method of manufacturing an IC chip mounted body, the reinforcing member covers at least a crimped portion of the pressing jig. Since the reinforcing member covers the pressing jig, the curable resin layer provided between the IC chip and the circuit board during the pressure mounting is less likely to adhere to the pressing jig. Therefore, the trouble of cleaning the pressing jig is omitted, and the work can be performed more efficiently.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings, taking a non-contact IC card as an example. In addition,
FIG. 1 is a plan view of an inlet before mounting a reinforcing member of an IC chip mounted body of the present invention. FIG. 2 is an AA sectional view of one embodiment in which a reinforcing member is attached to the inlet of FIG. FIG. 3 is a cross-sectional view of a more preferable form of the inlet, which is another embodiment of the IC chip mounted body of the present invention.
Note that an IC chip mounted body provided with an IC chip and a communication antenna on a circuit board is called an inlet. The inlet itself is not suitable for use by the final general user as it is, and thus is unlikely to be a final product. However, there is a case where the IC card is mounted on the IC chip mounted body according to the present invention, since the inlet may be distributed between manufacturers and the reinforcing member is attached.

As the support 1 for forming the circuits 5a and 5b and the antenna 6, polyethylene, polypropylene, polybutene, polystyrene, polymethylpentene, ethylene-propylene copolymer, ethylene-butylene copolymer, propylene-butene Polyolefin resin polymers such as copolymers, fluorine resin polymers such as polyvinylidene fluoride and polytetrafluoroethylene, polyurethane, phenolic polyether, cellulose acetate, acrylonitrile polymer, amide resin, polyester resin, glass epoxy A simple substance or a mixture of resin, polycarbonate, acrylonitrile butadiene styrene, polyethylene naphthalate, polyphenyl sulfide, paper and the like can be exemplified. Further, a mixture of the above substances and an inorganic substance may be used. A circuit 5a for electrically connecting to the bumps 4a, 4b of the IC chip 3,
Examples of a method for providing the circuit board 8 by providing the antenna 5 and the antenna 6 on the support 1 include a winding method, an etching method, and a paste screen printing method. In particular, an etching method using copper or aluminum and a screen printing method using a paste containing silver particles are more suitable for mass production in terms of the manufacturing method, and thus are more preferable as the method for forming the circuits 5a and 5b and the antenna 6 of the present invention.

The IC chip 3 is provided below the IC chip 3.
Examples of the curable resin layer 7 for connecting and fixing the reinforcing member 2 on the IC chip 3 to the circuit board 8 include a thermosetting resin, an ultraviolet-curable resin, and a humidity-curable resin. The thermosetting resin is particularly preferable as the curable resin layer 7 of the present invention because it can be cured in a short time and can be easily handled at room temperature. Furthermore, it is also possible to use a resin film in which a curable resin is made into a film state. By making the curable resin into a film, handling becomes easier, which is preferable as the curable resin layer 7 of the present invention. In addition, anisotropic conductive resin containing curable resin containing metal particles such as gold, silver, copper, aluminum and nickel, or resin particles obtained by coating metal particles such as nickel and gold on plastic particles such as styrene and acrylic. May be used as the curable resin layer 7 of the present invention. The amount of the curable resin layer may be an amount capable of sufficiently connecting and fixing the IC chip 3 and the reinforcing member 2 on the IC chip 3 to the circuit board 8. The IC chip 3 needs to have bumps 4a and 4b for electrically connecting the circuits 5a and 5b.
The bumps 4a and 4b used for the IC chip 3 are preferably made of a metal such as gold or solder or a conductive paste. Gold bumps include a method using a wire bonder technique, a plating method, and a sputtering method. The shape of the gold bump is characterized by the manufacturing method. In the plating and sputtering methods, the shape is round or cylindrical, and the shape of the bump manufactured by the wire bonder has a unique shape because the wire is cut in the middle. The resin bumps made of the conductive paste are formed on the pad portions of the IC chip by screen printing, dispenser, or the like.

The reinforcing member of the present invention only needs to have a mechanical strength capable of protecting the IC chip, and examples thereof include a metal material such as stainless steel, a plastic material such as epoxy resin, a ceramic material, and a composite material thereof. . Examples of the shape of the reinforcing member include a triangle, a square, and a round shape. Further FIG.
It is more preferable that the reinforcing member 2b covers at least the IC chip 3 as shown in FIG. Since the reinforcing member 2b covers the IC chip 3, the bonding area with the curable resin layer 7 increases, so that the reinforcing member 2b and the IC chip 3 can be more stably fixed on the circuit board 8. Become.

Next, a method of fixing the IC chip 3 and the reinforcing member 2 to the circuit board 8 will be described with reference to FIGS. FIG. 4 is a sectional view showing an assembling process of connecting and fixing the reinforcing member of the inlet and the IC chip shown in FIG. 2 to a circuit board. FIG. 5 is a cross-sectional view showing the pressurized state during the assembly process for connecting and fixing the inlet reinforcing member and the IC chip shown in FIG. 2 to the circuit board. FIG. 6 is a sectional view showing a state after pressurization during the assembly process for connecting and fixing the inlet reinforcing member and the IC chip shown in FIG. 2 to the circuit board.
As shown in FIG. 4, the curable resin layer 7, the IC chip 3, and the reinforcing member 2 are temporarily placed on the circuit of the circuit board 8 sequentially. As shown in FIG. 5, by applying pressure from the side of the reinforcing member 2 where the IC chip is not provided using the pressing jig 13,
The curable resinous layer under the IC chip is extruded laterally,
It becomes possible to rise along the side surface of the IC chip and adhere to the reinforcing member 2. By curing the curable resin layer 7 with heat, ultraviolet rays, or the like in the state of FIG. 5, the IC chip 3 and the reinforcing member 2 can be fixed on the circuit board 8 at the same time. Examples of the heating method when the curable resin is thermosetting include a method of transmitting heat from the pressing jig 13 and a method of directly applying hot air to the resin. As shown in FIG.
After the curing of the curable resin layer 7 is completed, the pressing jig 13
Is separated from the reinforcing member 2. Through this series of operations, the IC chip 3 and the reinforcing member 2 can be integrally fixed on the circuit board 8 with the curable resin layer 7.

The pressurizing source in the pressurizing method of the present invention can be exemplified by an air cylinder, a hydraulic pressure, a motor, and the like. The pressing force in the pressurizing method of the present invention depends on the IC used.
An appropriate pressing force may be set depending on the size and thickness of the chip, and 0.1 kgf to 2 kgf is more preferably used. Furthermore, as shown in FIG. 7, it is more preferable that the reinforcing member 2c covers at least the pressing jig 13. FIG. 7 is a sectional view showing an example of a more preferable manufacturing method for connecting and fixing the reinforcing member and the IC chip to the circuit board. When the reinforcing member 2c covers the pressing jig 13, the amount of the curable resin layer 7 attached to the IC chip reinforcing member 2c when the IC chip 3 and the reinforcing member 2c are fixed to the circuit board 8 by pressing is large. In this case, since the adhesion to the pressing jig 13 is suppressed, the labor for cleaning the pressing jig 1 can be omitted, and the work can be performed more efficiently. The pressing jig 13 only needs to have strength at the time of pressing and fixing, and examples of the material include metals such as iron and stainless steel, and ceramics.

As shown in FIG. 8, the reinforcing member 2b and the IC chip 3 fixed on the circuit board 8 by the curable resin layer 7 are further covered with another curable resin layer 9 to form a reinforcing member. This is more preferable because the 2b and the IC chip 3 can be more stably fixed on the circuit board 8. FIG. 8 is a cross-sectional view of a more preferable form of an inlet which is another embodiment of the IC chip mounted body of the present invention. As the curable resin layer 9, an epoxy resin, a silicone resin, or the like has electrical characteristics,
It is excellent in moisture resistance, mechanical strength, adhesiveness and the like, and is preferable as the main sealing resin.

Next, referring to FIG. 9 and FIG.
The method of molding the C card will be described. FIG. 9 is a cross-sectional view for explaining manufacturing and assembling of a non-contact type IC card as an embodiment of the IC chip mounted body of the present invention. FIG. 10 is a cross-sectional view for explaining another example of manufacturing and assembling a non-contact type IC card which is an embodiment of the IC chip mounted body of the present invention. As shown in FIG. 9, non-contact type ICs are formed by attaching insulating substrates 12a and 12b to the front and back of the inlet 10 obtained by the above operation using adhesive layers 11a and 11b, and then punching out a card type. You can get a card. Also, as shown in FIG.
The non-contact IC card can also be obtained by sticking the insulating base material 12c to only the surface having the IC chip by using the adhesive 11c and then punching it into a card type. As the adhesive layers 11a, 11b and 11c, generally used dry laminating adhesives such as polyester, ABS, acrylic, and polyurethane, hot-melt resins and thermosetting resins, moisture-absorbing curing resins, and line curing Resins and the like can be exemplified. Insulating base materials 12a, 12b and 1
2c includes polyethylene terephthalate resin, acrylonitrile butadiene styrene resin, polybutylene resin, polyvinyl chloride resin, polycarbonate resin,
Paper and synthetic paper can be exemplified.

[0017]

EXAMPLES The present invention will be described more specifically with reference to the following examples, but it should be understood that the present invention is not limited by these examples.

Embodiment 1 Embodiment 1 will be described with reference to FIG. 3 and FIG. In FIG. 3, a support 1 (P
ET, Lumirror: Toray) 4 turns loop antenna 6 with 18μ copper foil and electrical connection terminals 5a, 5b
And a circuit board 8 was prepared. A film-shaped curable resin layer 7 (CP7151: 50 μm in thickness, thermosetting resin containing gold-plated resin particles, manufactured by Sony Chemical Co., Ltd.) is temporarily attached onto the electrical connection terminals 5 a and 5 b on the circuit board 8, An IC chip 3 (Mif) on which gold bumps 4a and 4b are provided by a face-down method and a wire bonder method.
areLight: SLE44R31, thickness 180μ,
Siemens) and a reinforcing member 2b (SU
S304: thickness 100 μ, size 2.7 mm × 2.7 m
m) was temporarily placed in order. Pressure is applied from the side of the reinforcing member 2b where the IC chip is not provided by using a pressing jig 13 having a pressing area of 2.5 mm × 2.5 mm with a load of 0.5 kgf to heat and harden the curable resin layer 7. The IC chip 3 and the reinforcing member 2b were connected and fixed on the circuit board 8 to form an inlet shown in FIG. Further, as shown in FIG. 9, hot melt adhesive layers 11a and 11b (manufactured by Toagosei Co., Ltd.) having a thickness of 100 .mu.
The insulating substrates 12a and 12b (PET, Lumirror, manufactured by Toray Industries, Inc.) were provided, and after lamination, punched into a card type to obtain a non-contact type IC card.

Example 2 The film-like curable resin layer 7 (CP71) of Example 1 was used.
51: Change the thickness of 50 μm, thermosetting resin containing gold-plated resin particles, manufactured by Sony Chemical Co., Ltd. to liquid moisture-curable resin (Aron Alpha: cyanoacrylate, manufactured by Toagosei) and leave at room temperature under pressure Example 1 except for curing
The same operation as described above was performed to obtain a non-contact type IC card. Third Embodiment A third embodiment will be described with reference to FIGS. FIG.
, A support 1 having a thickness of 350 μm by an etching method
(PET, Lumirror: manufactured by Toray Co., Ltd.), a 4-turn loop antenna 6 with 18 μm copper foil and an electric connection terminal 5a,
5b was provided, and a circuit board 8 was formed. A paste-like curable resin layer 7 (XAP0101C: thermosetting resin containing gold-plated resin particles, manufactured by Toshiba Chemical Co., Ltd.) is applied to the electrical connection terminals 5a and 5b on the circuit board 8, and a face-down method is applied thereon. Chip 3 (MifareLig) provided with gold bumps 4a and 4b by wire bonder method
ht: SLE44R31, thickness 180 μm, manufactured by Siemens), and a reinforcing member 2b (SUS304:
A thickness of 100 μ and a size of 2.7 mm × 2.7 mm) were temporarily placed in that order. The curable resin layer 7 is cured by heating under a pressure of 0.5 kgf from the side of the reinforcing member 2b where the IC chip is not provided, using a pressing jig 13 having a pressing area of 2.5 mm × 2.5 mm. IC chip 3 and reinforcing member 2
b was fixedly connected to the circuit board 8. Further, the reinforcing member 2b and the IC chip 3 are covered with a curable resin layer 9 (XT5900: epoxy resin, manufactured by Toshiba Chemical), and FIG.
Of the IC chip mounted body shown in FIG. Further, as shown in FIG. 10, the inlet 10 obtained by the above operation has a thickness of 100 μm on the surface where the IC chip exists.
Hot melt adhesive layer 11c (Toagosei) and 350μ
Were provided, and after lamination, punched into a card type to obtain a non-contact type IC card.

[0020]

As described above, according to the present invention, since the IC chip and the reinforcing member are integrally joined and fixed by the curable resin layer interposed between the circuit board and the IC chip, work efficiency is improved. It is possible. Further, since no other adhesive layer is required between the surface where the IC chip and the reinforcing member are in direct contact, the manufacturing cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view of an inlet of a non-contact IC card according to the present invention before a reinforcing member is attached.

FIG. 2 is a cross-sectional view of an inlet as one embodiment of the IC chip mounted body of the present invention.

FIG. 3 is a cross-sectional view of a more preferable form of an inlet which is another embodiment of the IC chip mounted body of the present invention.

FIG. 4 is a sectional view showing an assembling process for connecting and fixing the reinforcing member of the inlet and the IC chip shown in FIG. 2 to a circuit board;

FIG. 5 is a cross-sectional view showing a pressurized state during the assembly process of connecting and fixing the reinforcing member of the inlet and the IC chip shown in FIG. 2 to a circuit board.

FIG. 6 is a cross-sectional view showing a state after pressurization during the assembly process for connecting and fixing the reinforcing member of the inlet and the IC chip shown in FIG. 2 to a circuit board;

FIG. 7 is a cross-sectional view showing a more preferable manufacturing method for connecting and fixing the reinforcing member and the IC chip of the present invention to a circuit board.

FIG. 8 is a cross-sectional view of a more preferable inlet, which is another embodiment of the IC chip mounted body of the present invention.

FIG. 9 is a cross-sectional view for explaining manufacturing and assembling of a non-contact type IC card as an embodiment of the IC chip mounted body of the present invention.

FIG. 10 is a cross-sectional view for explaining manufacturing and assembling of another example of the non-contact type IC card which is one embodiment of the IC chip mounted body of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Support body 2 Reinforcement member 5a, 5b circuit 3 IC chip 7 Curable resin layer 8 Circuit board

Claims (6)

[Claims] 1. An IC chip mounted body having an IC chip mounted on a circuit board provided with a circuit on a support, wherein the IC chip is connected and fixed to the circuit board via a single curable resin layer. And a reinforcing member that covers at least a part of a surface of the IC chip opposite to a surface connected by the curable resin layer of the IC chip. 2. The IC chip package according to claim 1, wherein said curable resin layer is a thermosetting resin layer. 3. The IC chip package according to claim 1, wherein the reinforcing member and the IC chip are at least covered with another resin layer. 4. The IC chip package according to claim 1, wherein the reinforcing member covers at least the IC chip. 5. A pressure jig is applied to the reinforcing member from a side where no IC chip is provided, and the reinforcing member and the IC chip are separated by a hardening resin layer between the IC chip and the circuit board. The method of manufacturing an IC chip package according to any one of claims 1 to 4, wherein the IC chip is integrally fixed thereon. 6. The IC according to claim 5, wherein said reinforcing member covers at least a crimping portion of said pressing jig.
Manufacturing method of chip mounted body.