JP2002146320A - Adhesive composition, adhesive member using the same, substrate for mounting semiconductor, and semiconductor device - Google Patents

Abstract

(57) Abstract: An adhesive member having heat resistance and moisture resistance required for mounting a semiconductor element having a large difference in thermal expansion coefficient on a semiconductor mounting substrate and capable of suppressing volatile components during use. To provide a semiconductor mounting substrate and a semiconductor device which can be formed and are excellent in workability. (A) The content of an epoxy resin and a low molecular weight component having a molecular weight of 500 or less is 20% by mass or less, and a content of a low molecular weight component having a molecular weight of 1000 or less is 30% by mass.
100 parts by mass of the following phenol resin, and (b) a high molecular weight component 1 having a weight average molecular weight containing a functional group of 100,000 or more
An adhesive composition comprising 0 to 400 parts by mass, an adhesive member obtained by forming the adhesive composition into a film, a semiconductor mounting substrate provided with the adhesive member, and a semiconductor having a semiconductor chip adhered thereon apparatus.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an adhesive composition, an adhesive member using the same, a wiring board for mounting a semiconductor, and a semiconductor device.

[0002]

2. Description of the Related Art In recent years, the mounting density of electronic components has increased with the development of electronic equipment, and the size of a semiconductor chip, which is called a chip scale package or a chip size package (hereinafter abbreviated as CSP), is substantially the same as that of a semiconductor chip. A new type of mounting method, such as a semiconductor package or a bare chip mounting of a semiconductor, has begun to be adopted.

One of the most important characteristics of a mounting board on which various electronic components such as semiconductor elements are mounted is reliability. Among them, the connection reliability against thermal fatigue is a very important item because it is directly related to the reliability of the device using the mounting board.

[0004] As a cause of lowering the connection reliability,
Thermal stress caused by using various materials having different thermal expansion coefficients can be given. This is because the thermal expansion coefficient of a semiconductor element is as small as about 4 ppm / ° C., whereas the thermal expansion coefficient of a wiring board on which electronic components are mounted is as large as 15 ppm / ° C. or more, so that thermal strain is generated due to thermal shock. The thermal strain causes thermal stress.

[0005] In a conventional substrate on which a semiconductor package having a lead frame such as a QFP or SOP is mounted, reliability is maintained by absorbing thermal stress in the lead frame portion.

However, bare chip mounting employs a method of connecting electrodes of a semiconductor element to a wiring board pad of a wiring board using solder balls or a method of forming small projections called bumps and connecting them with a conductive paste. Thermal stress was concentrated on this connection part, thereby reducing connection reliability. It has been found that it is effective to inject a resin called an underfill between the semiconductor element and the wiring board in order to disperse the thermal stress, but this has increased the number of mounting steps and increased the cost. In addition, there is a method of connecting the electrodes of the semiconductor element and the wiring pads of the wiring board using conventional wire bonding. However, the number of mounting steps is increased unless a sealing resin is coated to protect the wires.

Since the CSP can be mounted together with other electronic components, the surface mounting technology published by Nikkan Kogyo Shimbun, 1997-
March issue article "CSP (fine pitch B)
Various types of structures as shown in Table 1 on page 5 in "GA)" have been proposed. Among them, a system using a tape or a carrier substrate for a wiring substrate called an interposer has been put into practical use. This includes the methods developed by Tessera and TI in the table above. Since these pass through a wiring board called an interposer, IEICE Technical Report CPM 96-121, ICD 96-
160 (1996-12) "Tape BGA size CSP
Development ”and Sharp Technical Report No. 66 (1996-12)
"Chip Size Package (Chip Size Pa
Cage) development ”, it shows excellent connection reliability.

[0008] It is preferable to use an adhesive member between these semiconductor elements of the CSP and a wiring board called an interposer so as to reduce thermal stress caused by a difference in thermal expansion. In addition, moisture resistance and high-temperature durability are required. Further, a film-type adhesive member is required for easy management of the manufacturing process.

[0009] Film-type adhesives are used for flexible printed wiring boards and the like, and systems containing acrylonitrile-butadiene rubber as a main component are often used.

As a printed wiring board material having improved moisture resistance, there is an adhesive containing an acrylic resin, an epoxy resin, a polyisocyanate and an inorganic filler disclosed in JP-A-60-243180. Japanese Patent Application Laid-Open No. 61-138680 discloses an acrylic resin, an epoxy resin, and an adhesive containing a primary amine compound having a urethane bond in a molecule and a primary amine compound and an inorganic filler.

[0011]

As a film-type adhesive, a system containing acrylonitrile-butadiene rubber as a main component is often used, but the adhesive strength after a long-time treatment at a high temperature has a large decrease. Also, there were drawbacks such as poor corrosion resistance. In particular, when a moisture resistance test was performed under severe conditions such as a PCT (pressure cooker test) process used in reliability evaluation of semiconductor-related components, deterioration was large.

Japanese Patent Application Laid-Open Nos. 60-243180 and 61-138680 disclose PCT
When a moisture resistance test was performed under severe conditions such as treatment, deterioration was large.

When a semiconductor chip is mounted on a wiring board using an adhesive as a material related to the printed wiring board, a difference in thermal expansion coefficient between the semiconductor element and a wiring board called an interposer is large, and cracks occur during reflow. Could not be used for. Further, when a humidity resistance test under severe conditions such as a temperature cycle test or a PCT treatment was performed, the deterioration was large and the device could not be used.

The present inventors have disclosed in Japanese Patent Application Laid-Open No. 2000-15436.
As disclosed in Japanese Patent Application Publication No. 1 (1993) -197, by lowering the elastic modulus of the adhesive member near room temperature, the thermal stress generated during heating and cooling due to the difference in thermal expansion between the semiconductor element and the wiring board can be reduced.
Therefore, no cracks are observed during reflow,
Further, it was found that no destruction was observed even after the temperature cycle test, and the heat resistance was excellent.

However, in the future, when the demand for heat resistance and reflow crack resistance becomes severe, it is necessary to reduce the volatile content from the adhesive to a lower level. If the amount of volatile matter exceeds a certain level, there is a possibility that peripheral devices will be contaminated in the work process.

According to the present invention, there is provided an adhesive member having heat resistance and moisture resistance required for mounting a semiconductor element having a large difference in thermal expansion coefficient on a semiconductor mounting substrate and capable of suppressing volatile components during use. An object of the present invention is to provide an adhesive composition that can be formed, an adhesive member using the adhesive composition, a semiconductor mounting substrate excellent in workability, and a semiconductor device.

[0017]

The present invention is characterized by the following. (1) (a) When the content of the epoxy resin and the low molecular weight component having a molecular weight of 500 or less is 20% by mass or less and the molecular weight is 100
100 parts by mass of a phenol resin having a content of a low molecular weight component of not more than 0 and not more than 30% by mass, and (b) a high molecular weight component having a weight average molecular weight including a functional group of not less than 100,000 and not more than 10-4.
An adhesive composition consisting of 00 parts by mass. (2) The adhesive composition according to (1), wherein the high molecular weight component containing a functional group and having a weight average molecular weight of 100,000 or more is incompatible with the epoxy resin. (3) An epoxy group-containing acrylic copolymer having a weight average molecular weight of 100,000 or more containing 0.5 to 6% by mass of glycidyl acrylate or glycidyl methacrylate as a high molecular weight component having a weight average molecular weight of 100,000 or more containing a functional group. The adhesive composition according to (1) or (2), which is united. (4) The storage modulus of the cured product of the adhesive composition is in the range of 10 to 2000 MPa at 25 ° C. and 3 at 260 ° C.
The adhesive composition according to any one of (1) to (3), which is in a range of from 1 to 50 MPa. (5) The adhesive composition according to any one of (1) to (4), wherein a weight loss rate when the adhesive composition is heated to 270 ° C. is 2% by mass or less. (6) (a) When the content of the epoxy resin and the low molecular weight component having a molecular weight of 500 or less is 20% by mass or less and the molecular weight is 100
100 parts by mass of a phenol resin having a content of a low molecular weight component of not more than 0 and not more than 30% by mass, and (b) a high molecular weight component having a weight average molecular weight including a functional group of not less than 100,000 and not more than 10-4.
An adhesive member obtained by forming an adhesive composition comprising 00 parts by mass into a film. (7) The resin composition has a weight average molecular weight containing a functional group of 1
(6) The adhesive member according to (6), wherein the high-molecular-weight component having a molecular weight of at least 10,000 is incompatible with the epoxy resin. (8) The resin composition has a weight average molecular weight containing a functional group of 1
Use is made of an adhesive composition in which the high molecular weight component of at least 100,000 is an epoxy group-containing acrylic copolymer containing 0.5 to 6% by mass of glycidyl acrylate or glycidyl methacrylate and having a weight average molecular weight of at least 100,000. Or the adhesive member according to (7). (9) The storage modulus of the cured product of the adhesive composition is in the range of 10 to 2000 MPa at 25 ° C and 3 at 260 ° C.
The adhesive member according to any one of (6) to (8), which has a range of from 50 MPa to 50 MPa. (10) The adhesive member according to any one of (6) to (9), wherein a weight loss rate when the adhesive composition is heated to 270 ° C is 2% by mass or less. (11) On the semiconductor element mounting surface of the support member, (a) the content of the epoxy resin and the low molecular weight component having a molecular weight of 500 or less is 20% by mass or less and the content of the low molecular weight component having a molecular weight of 1000 or less is 30% by mass. The following phenolic resin 10
0 parts by mass and (b) a weight average molecular weight containing a functional group of 10
A semiconductor mounting substrate provided with an adhesive member obtained by forming an adhesive composition comprising 10 to 400 parts by mass of a high molecular weight component of not less than 10,000 in a film shape. (12) On the semiconductor element mounting surface of the support member, the content of (a) the content of the epoxy resin and the low molecular weight component having a molecular weight of 500 or less is 20% by mass or less and the content of the low molecular weight component having a molecular weight of 1000 or less is 30% by mass. The following phenolic resin 10
0 parts by mass and (b) a weight average molecular weight containing a functional group of 10
A semiconductor device comprising an adhesive member obtained by forming an adhesive composition comprising 10 to 400 parts by mass of a high molecular weight component which is not less than 10,000 in a film shape, and a semiconductor chip adhered thereon.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The epoxy resin used in the present invention may be any epoxy resin having an epoxy group in the molecule, such as a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a bisphenol S epoxy resin. Resin, alicyclic epoxy resin, aliphatic chain epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, bisphenol A novolak type epoxy resin, diglycidyl etherified biphenol, diglycidyl etherified naphthalene diol , Diglycidyl etherified products of phenols, diglycidyl etherified products of alcohols, and alkyl-substituted, halogenated, and hydrogenated products thereof.
These may be used in combination, and components other than the epoxy resin may be contained as impurities. In the present invention, an epoxy resin to be obtained by reacting a halogenated bisphenol compound such as tetrabromobisphenol A such as a halogenated bisphenol A epoxy resin, a halogenated bisphenol F epoxy resin, a halogenated bisphenol S epoxy resin, and epichlorohydrin. When an epoxy resin in which the ortho position is substituted with a halogen atom such as chlorine or bromine with respect to the ether group of the benzene ring to which the ether group is bonded is used, the epoxy resin cured by the treatment liquid of the present invention. The efficiency of decomposition and / or dissolution of the substance is particularly good. The curing agent for an epoxy resin used in the present invention can be used without limitation as long as it cures an epoxy resin.For example, polyfunctional phenols, amines, imidazole compounds, acid anhydrides, organic phosphorus compounds and There are these halides and the like. Examples of polyfunctional phenols include hydroquinone, resorcinol, catechol, and monocyclic bifunctional phenols, bisphenol A, bisphenol F, naphthalene diols, biphenols, and their halides and alkyl group substitution. There is a body. Further, there are novolaks and resols which are polycondensates of these phenols and aldehydes. Examples of amines include aliphatic or aromatic primary amines, secondary amines, tertiary amines, quaternary ammonium salts and aliphatic cyclic amines, guanidines, urea derivatives and the like. Examples of these compounds include N, N-benzyldimethylamine, 2- (dimethylaminomethyl) phenol, 2,
4,6-tris (dimethylaminomethyl) phenol,
Tetramethylguanidine, triethanolamine, N,
N'-dimethylpiperazine, 1,4-diazabicyclo [2,2,2] octane, 1,8-diazabicyclo [5,4,0] -7-undecene, 1,5-diazabicyclo [4,4,0]- 5-nonene, hexamethylenetetramine, pyridine, picoline, piperidine, pyrrolidine, dimethylcyclohexylamine, dimethylhexylamine, cyclohexylamine, diisobutylamine,
Di-n-butylamine, diphenylamine, N-methylaniline, tri-n-propylamine, tri-n-octylamine, tri-n-butylamine, triphenylamine, tetramethylammonium chloride, tetramethylammonium bromide, tetramethylammonium Examples include iodide, triethylenetetramine, diaminodiphenylmethane, diaminodiphenylether, dicyandiamide, tolylbiguanide, guanylurea, and dimethylurea. Examples of the imidazole compound include imidazole, 2-ethylimidazole, 2-ethyl-4
-Methylimidazole, 2-methylimidazole, 2-
Phenylimidazole, 2-undecylimidazole,
1-benzyl-2-methylimidazole, 2-heptadecylimidazole, 4,5-diphenylimidazole,
2-methylimidazoline, 2-phenylimidazoline,
2-undecylimidazoline, 2-heptadecylimidazoline, 2-isopropylimidazole, 2,4-dimethylimidazole, 2-phenyl-4-methylimidazole, 2-ethylimidazoline, 2-phenyl-4-methylimidazoline, benzimidazole, 1-cyanoethylimidazole and the like. Examples of acid anhydrides include:
Examples include phthalic anhydride, hexahydrophthalic anhydride, pyromellitic dianhydride, and benzophenonetetracarboxylic dianhydride. The organic phosphorus compound can be used without particular limitation as long as it is a phosphorus compound having an organic group. For example, hexamethylphosphoric triamide, tri (dichloropropyl) phosphate, tri (chloropropyl) phosphate, phosphorous acid Examples include triphenyl, trimethyl phosphate, phenylphosphonic acid, triphenylphosphine, tri-n-butylphosphine, and diphenylphosphine.
These curing agents can be used alone or in combination. The amount of these epoxy resin curing agents can be used without any particular limitation as long as the curing reaction of the epoxy group can proceed, but preferably,
It is used in the range of 0.01 to 5.0 equivalents, particularly preferably in the range of 0.8 to 1.2 equivalents, per 1 mol of the epoxy group. Further, the thermosetting epoxy resin composition of the present invention may optionally contain a curing accelerator. Representative curing accelerators include tertiary amines, imidazoles,
Examples include, but are not limited to, quaternary ammonium salts. The epoxy resin cured product that is the object of the present invention is obtained by curing the above thermosetting epoxy resin composition, and the curing reaction is performed at any temperature as long as the reaction proceeds. However, it is generally preferable to cure at room temperature to 250 ° C.
This curing reaction can be performed under pressure, under atmospheric pressure, or under reduced pressure. Commercially available products include, for example, Epicoat 807 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.), Epicoat 815 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.), and Epicoat 825 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.) ), Epicoat 827 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.), Epicoat 828 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.), Epicoat 834 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.), Epicoat 1
001 (product name, manufactured by Yuka Shell Epoxy Co., Ltd.), Epicoat 1004 (product name, manufactured by Yuka Shell Epoxy Co., Ltd.), Epicoat 1007 (product name, manufactured by Yuka Shell Epoxy Co., Ltd.), Epicoat 1009 (product name, Yuka Shell DER-330 (manufactured by Dow Chemical Company, trade name), DER-301 (manufactured by Dow Chemical Company, trade name), DER-361 (manufactured by Dow Chemical Company,
YD8125 (trade name, manufactured by Toto Kasei Co., Ltd.), YDF8170 (trade name, manufactured by Toto Kasei Co., Ltd.)
Bisphenol A epoxy resin, Epicoat 15
2 (manufactured by Yuka Shell Epoxy), Epicoat 154 (manufactured by Yuka Shell Epoxy), EPPN-201 (manufactured by Nippon Kayaku Co., Ltd.), DEN-438 (Dow Chemical) Phenol novolak type epoxy resin such as EOCN-1
02S (product name, manufactured by Nippon Kayaku Co., Ltd.), EOCN-1
03S (manufactured by Nippon Kayaku Co., Ltd., trade name), EOCN-1
04S (trade name, manufactured by Nippon Kayaku Co., Ltd.), EOCN-1
012 (manufactured by Nippon Kayaku Co., Ltd., trade name), EOCN-1
025 (product name, manufactured by Nippon Kayaku Co., Ltd.), EOCN-1
027 (product name, manufactured by Nippon Kayaku Co., Ltd.), YDCN70
1 (trade name, manufactured by Toto Kasei Co., Ltd.), YDCN702
O-cresol novolac epoxy resin such as YDCN703 (trade name, manufactured by Toto Kasei Co., Ltd.) and YDCN704 (trade name, manufactured by Toto Kasei Co., Ltd.), Epon 1031S (oiled shell) Epoxy Co., Ltd., trade name), Araldite 0163
(Trade name, manufactured by Ciba Specialty Chemicals), Denacol EX-611 (trade name, manufactured by Nagase Kasei Co., Ltd.), Denacol EX-614 (trade name, manufactured by Nagase Kasei Co., Ltd.), Denacol EX-614B (trade name of Nagase Kasei Co., Ltd.) Company name, Denacol EX-622 (manufactured by Nagase Kasei Co., Ltd., brand name), Denacol EX-512
(Trade name, manufactured by Nagase Kasei Co., Ltd.), Denacor EX-
521 (manufactured by Nagase Kasei Co., Ltd., trade name), Denacol EX-421 (manufactured by Nagase Kasei Co., Ltd.), Denacol EX-411 (manufactured by Nagase Kasei Co., Ltd., trade name), Denacol EX-321 (Nagase Kasei Stock Multifunctional epoxy resin such as manufactured by the company, trade name), Epicoat 60
4 (manufactured by Yuka Shell Epoxy Co., Ltd.), YH-
434 (Toto Kasei Co., Ltd., trade name), TETRAD
-X (Mitsubishi Gas Chemical Co., Ltd., trade name), TETRA
DC (Mitsubishi Gas Chemical Co., Ltd., trade name), ELM-
Amine type epoxy resin such as 120 (manufactured by Sumitomo Chemical Co., Ltd.), heterocyclic ring-containing epoxy resin such as Araldite PT810 (manufactured by Ciba Specialty Chemicals), ERL4234 (manufactured by UCC, trade name), ER
L4299 (manufactured by UCC, trade name), ERL4221
An alicyclic epoxy resin such as (trade name, manufactured by UCC) or ERL4206 (trade name, manufactured by UCC) can be used, and one or more of these can be used in combination.

A phenol resin having a low molecular weight component having a molecular weight of 500 or less and a low molecular weight component having a molecular weight of 1000 or less and having a content of 30 mass% or less is used as a curing agent for an epoxy resin. Although there is no particular limitation, it is preferable to use a phenol novolak resin, a bisphenol A novolak resin, a cresol novolak resin, or the like, which has excellent resistance to electric corrosion during moisture absorption.

The weight average molecular weight of the phenol resin used in the present invention is preferably 4000 or more in terms of standard polystyrene, as measured by gel permeation chromatography (hereinafter abbreviated as GPC).

The phenolic resin used in the present invention has a low molecular weight component having a molecular weight of 500 or less by GPC measurement of 20% by mass or less and a low molecular weight component of 1000 or less in molecular weight having a content of 30% by mass or less. % Or less, but the content of the low molecular weight component having a molecular weight of 500 or less is 1
It is more preferable that the content of the low molecular weight component having a molecular weight of 1000 or less and 5 mass% or less is 20 mass% or less.

The method for reducing the low molecular weight component is not particularly limited, and may be carried out under synthesis conditions or the like, or may be removed from the resin after synthesis. The method for removing the low molecular weight component from the synthesized resin is not particularly limited, and a known method such as a fractionation method, an extraction method, and a distillation method can be used.

The mixing amounts of the epoxy resin and the phenol resin are each equivalent to an equivalent ratio of epoxy equivalent to hydroxyl equivalent of 0.1.
70 / 0.30-0.30 / 0.70, preferably 0.65 / 0.35-0.35 / 0.65, more preferably 0.60 / 0.30-0. .30 / 0.
60, more preferably 0.55 / 0.45
It is particularly preferably 0.45 / 0.55. If the compounding ratio exceeds the above range, the curability of the adhesive may be poor.

As the high molecular weight component having a weight average molecular weight of 100,000 or more including a functional group, a weight average molecular weight containing 0.5 to 6% by mass of glycidyl acrylate or glycidyl methacrylate incompatible with the epoxy resin is 100,000. The epoxy group-containing acrylic copolymer described above is preferable.

The epoxy group-containing acrylic copolymer containing 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate and having a weight-average molecular weight of 100,000 or more is not particularly limited, and may be HTR manufactured by Teikoku Chemical Industry Co., Ltd.
-860P-3 or the like can be used. When the functional group monomer uses carboxylic acid type acrylic acid or hydroxyl group type hydroxymethyl (meth) acrylate,
Bridging reaction proceeds easily, gelling in varnish state, B
It is not preferable because there is a problem such as a decrease in adhesion due to an increase in the degree of curing in the stage state. The amount of glycidyl (meth) acrylate used as the functional group monomer is 2
６6% by mass of the copolymer. If it is less than 2% by mass, the adhesive strength may decrease, and if it is more than 6% by mass, it may gel. The remainder can be ethyl (meth) acrylate or butyl (meth) acrylate or a mixture of both, but the mixing ratio is determined in consideration of the glass transition temperature (hereinafter abbreviated as Tg) of the copolymer. -1
The temperature is preferably 0 ° C. or higher. If the Tg is lower than -10 ° C, the tackiness of the adhesive layer in the B-stage state is increased, and the handleability may be deteriorated. The polymerization method is not particularly limited, and pearl polymerization, solution polymerization and the like can be used.

The weight average molecular weight of the epoxy group-containing acrylic copolymer is preferably from 300,000 to 3,000,000,
More preferably, it is 500,000 to 2,000,000. If the weight-average molecular weight is less than 300,000, the strength and flexibility of the sheet or film may be reduced and the tackiness may increase. May decrease.

The amount of the epoxy group-containing acrylic copolymer is from 10 to 400 parts by mass. If the amount is less than 10 parts by mass, the effect of reducing the elastic modulus and suppressing the flow property during molding tends to be small, and if it exceeds 400 parts by mass, the handleability at high temperatures tends to decrease.

Further, a curing accelerator can be added to the adhesive composition of the present invention. There is no particular limitation on the curing accelerator, and various imidazoles can be used.
As imidazoles, 2-methylimidazole, 2
-Ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-
Phenyl imidazolium trimellitate and the like,
These may be used alone or in combination of two or more.

The amount of the curing accelerator to be added may be an epoxy resin or a phenol resin having a low molecular weight component having a molecular weight of 500 or less and a low molecular weight component having a molecular weight of 1000 or less being 30 mass% or less. Total amount of 100
0.1 to 5 parts by mass, preferably 0.2 to 5 parts by mass,
3 parts by mass is more preferred. If the amount is less than 0.1 part by mass, the curability tends to be poor, and if it is more than 5 parts by mass, the storage stability tends to decrease.

The storage modulus of the cured adhesive obtained by curing the adhesive composition of the present invention is 10 to 2000 MPa at 25 ° C., and preferably 3 to 50 MPa at 260 ° C. The measurement of the storage elastic modulus is performed using a dynamic viscoelasticity measuring device D.
Using VE-V4 (trade name, manufactured by Rheology Co., Ltd.), apply a tensile load to the cured adhesive, and measure the temperature from -50 ° C to 300 ° C at a frequency of 10 Hz and a heating rate of 5 to 10 ° C / min. The test was performed in the sex measurement mode. Storage modulus is 25
If the temperature exceeds 2000 MPa at 200 ° C. and 50 MPa at 260 ° C., the effect of relieving the thermal stress generated by the difference in the thermal expansion coefficient between the semiconductor chip and the interposer as the wiring board becomes small, and there is a possibility that peeling or cracking may occur. . When the storage modulus is less than 10 MPa at 25 ° C.,
The handleability of the adhesive and the thickness accuracy of the adhesive layer may be deteriorated, and if it is less than 3 MPa at 260 ° C., reflow cracks may easily occur.

The rate of weight loss when the adhesive composition of the present invention is heated at 270 ° C. is 2% by mass or less, preferably 1.5% by mass, and more preferably 1% by mass. If the rate of weight loss during heating is greater than this, peripheral equipment tends to be contaminated during use.

In order to improve the flexibility and the reflow crack resistance of the adhesive composition of the present invention, a high molecular weight resin compatible with the epoxy resin can be added. The high molecular weight resin compatible with the epoxy resin is not particularly limited, and for example, phenoxy resin, high molecular weight epoxy resin, ultrahigh molecular weight epoxy resin, and the like can be used.

The amount of the high molecular weight resin compatible with the epoxy resin is preferably 40% by mass or less based on the epoxy resin. If it exceeds 40% by mass, the Tg of the epoxy resin layer may be reduced.

The adhesive composition of the present invention may also contain an inorganic filler for improving the handleability, improving the thermal conductivity, adjusting the melt viscosity, imparting thixotropic properties, and the like. There is no particular limitation on the inorganic filler, for example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, nitrided Boron, crystalline silica, amorphous silica, and the like can be used, and these can be used alone or in combination of two or more. For improving the thermal conductivity, aluminum oxide, aluminum nitride, boron nitride, crystalline silica, amorphous silica and the like are preferable. For the purpose of adjusting the melt viscosity and imparting thixotropic properties, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, crystalline silica, Amorphous silica and the like are preferred. The amount of the inorganic filler to be used is preferably 1 to 20 parts by volume with respect to 100 parts by volume of the adhesive composition. If the amount is less than 1 part by volume, the effect of addition is not sufficient. If the amount exceeds 20 parts by volume, problems such as an increase in the storage elastic modulus of the adhesive layer, a decrease in adhesiveness, and a decrease in electrical properties due to remaining voids may occur. is there.

Further, various kinds of coupling agents can be added to the adhesive composition of the present invention in order to improve interfacial bonding between different kinds of materials. Examples of the coupling agent include a silane-based, titanium-based, and aluminum-based coupling agent, and a silane-based coupling agent is most preferable.

The silane coupling agent is not particularly limited, and examples thereof include vinyltrichlorosilane, vinyltris (β-methoxyethoxy) silane, vinyltriethoxysilane, vinyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ
-Glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N
-Β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane,
N-phenyl-γ-aminopropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-
Mercaptopropyltriethoxysilane, 3-aminopropylmethyldiethoxysilane, 3-ureidopropyltriethoxysilane, 3-ureidopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3
-Aminopropyl-tris (2-methoxy-ethoxy-
Ethoxy) silane, N-methyl-3-aminopropyltrimethoxysilane, triaminopropyl-trimethoxysilane, 3-4,5-dihydroimidazol-1-yl-propyltrimethoxysilane, 3-methacryloxypropyl-trimethoxy Silane, 3-mercaptopropyl-methyldimethoxysilane, 3-chloropropyl-methyldimethoxysilane, 3-chloropropyl-dimethoxysilane, 3-cyanopropyl-triethoxysilane, hexamethyldisilazane, N, O-bis (trimethylsilyl) Acetamide, methyltrimethoxysilane, methyltriethoxysilane, ethyltrichlorosilane, n-propyltrimethoxysilane, isobutyltrimethoxysilane, amyltrichlorosilane, octyltriethoxysilane, phenyltrisilane Tokishishiran, phenyltriethoxysilane, methyl tri (methacryloyloxy Oki ethoxy) silane, methyltri (glycidyloxy) silane,
N-β (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane, octadecyldimethyl [3- (trimethoxysilyl) propyl] ammonium chloride, γ-chloropropylmethyldichlorosilane, γ-chloropropylmethyldimethoxysilane , Γ-
Chloropropylmethyldiethoxysilane, trimethylsilyl isocyanate, dimethylsilyl isocyanate,
Methylsilyl triisocyanate, vinylsilyl triisocyanate, phenylsilyl triisocyanate, tetraisocyanate silane, ethoxy silane isocyanate and the like can be used, and one or more of these can be used in combination.

The titanium-based coupling agent is not particularly limited. For example, isopropyl trioctanoyl titanate, isopropyl dimethacryl isostearyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl isostearyl diacryl titanate, isopropyl tri (dioctyl phosphate) ) Titanate, isopropyl tricumyl phenyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tris (n-aminoethyl) titanate, tetraisopropyl bis (dioctyl phosphite) titanate, tetraoctyl bis (ditridecyl phosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) bis (ditridecyl) phosph Itotitanate, dicumylphenyloxyacetate titanate, bis (dioctylpyrophosphate) oxyacetate titanate, tetraisopropyl titanate, tetranormal butyl titanate, butyl titanate dimer, tetra (2-ethylhexyl) titanate, titanium acetylacetonate, polytitanium aethyl Acetonate, titanium octylene glycolate, titanium lactate ammonium salt, titanium lactate, titanium lactate ethyl ester, titanium thiethanol aminate, polyhydroxytitanium stearate, tetramethyl orthotitanate, tetraethyl orthotitanate, tetarapropyl orthotitanate, tetraisobutyl Ortho titanate, stearyl titanate, cresyl titanate monomer Cresyl titanate polymer, diisopropoxy - bis (2,4
Pentadionate) titanium (IV), diisopropyl-bis-triethanolaminotitanate, octylene glycol titanate, tetra-n-butoxytitanium polymer, tri-n-butoxytitanium monostearate polymer, tri-n-butoxytitanium monostearate A rate or the like can be used, and one or more of these can be used in combination.

As the aluminum-based coupling agent,
There is no particular limitation, for example, ethyl acetoacetate aluminum diisopropylate, aluminum toys (ethyl acetoacetate), alkyl acetoacetate aluminum diisopropylate, aluminum monoacetyl acetate bis (ethyl acetoacetate), aluminum tris (acetyl acetonate), Aluminum = monoisopropoxymonooleoxyethyl acetoacetate, aluminum-di-n-butoxide-mono-
Aluminum chelates such as ethyl acetoacetate, aluminum-di-iso-propoxide-mono-ethyl acetoacetate, aluminum isopropylate, aluminum such as mono-sec-butoxyaluminum diisopropylate, aluminum-sec-butylate, aluminum ethylate Alcoholates and the like can be used, and one or more of these can be used in combination.

The amount of the coupling agent to be added is preferably 0.1 to 10 parts by mass with respect to the total 100 parts by mass of the resin in view of the effect, heat resistance and cost.

Further, an ion scavenger may be added to the adhesive composition in order to adsorb ionic impurities and improve insulation reliability during moisture absorption. The ion scavenger is not particularly limited, and a compound known as a copper harm inhibitor for preventing copper from being ionized and dissolved, for example, a triazine thiol compound, a bisphenol-based reducing agent, and the like can be used. An inorganic ion adsorbent such as a zirconium-based or antimony-bismuth-based magnesium aluminum compound can also be used. The addition amount of the ion scavenger is preferably 1 to 10 parts by mass from the viewpoint of the effect of the addition, heat resistance, cost and the like.

The adhesive member of the present invention can be obtained by dissolving or dispersing the adhesive composition of the present invention in a solvent to form a varnish, coating it on a support film, heating and removing the solvent.

As the support film, plastic films such as polytetrafluoroethylene film, polyethylene terephthalate film, polyethylene film, polypropylene film, polymethylpentene film and polyimide film can be used. Can be used after release treatment. The support film can be peeled off at the time of use to use only the adhesive layer, or used together with the support film and removed later.

The varnishing solvent is not particularly limited, but may be methyl ethyl ketone, acetone, methyl isobutyl ketone,
It is preferable to use a solvent having a relatively low boiling point such as ethoxyethanol, toluene, xylene, butyl cellosolve, methanol, ethanol, and 2-methoxyethanol.
In addition, a solvent having a relatively high boiling point, such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and cyclohexanone, can be added for the purpose of improving coating properties.

In the production of a varnish when an inorganic filler is added to the adhesive composition of the present invention, a crusher, a three-roll mill, a ball mill, a bead mill and the like are used in consideration of the dispersibility of the inorganic filler. Are preferred, and these can be used in combination. In addition, it is also possible to shorten the mixing time by mixing the inorganic filler and the low molecular weight material in advance and then blending the high molecular weight material. After the varnish is formed, bubbles in the varnish can be removed by vacuum degassing or the like. As a method of applying the varnish to the support film, a known method can be used, and examples thereof include a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, a curtain coating method, and the like. .

The thickness of each of the adhesive layers is 25 to 250 μm.
However, preferred is not limited thereto. 25μ
When the thickness is smaller than m, the stress relaxation effect tends to be poor.
If it is thicker than 50 μm, it is not economical.

The adhesive layer of the adhesive member of the present invention may be two or more in order to obtain a desired thickness. In this case, bonding conditions are required so that peeling of the adhesive layers occurs.

The adhesive layer of the adhesive member of the present invention can be used by bonding it to both sides of the core material. The thickness of the core material is preferably in the range of 5 to 200 μm, but is not limited.

The film used for the core material is not particularly limited, but is preferably a heat-resistant thermoplastic film, and more preferably a heat-resistant thermoplastic film having a softening point temperature of 260 ° C. or higher. When a heat-resistant thermoplastic film having a softening point temperature of less than 260 ° C. is used as the core material, the adhesive film may be peeled at a high temperature such as solder reflow. Furthermore, a heat-resistant thermoplastic film using a liquid crystal polymer, polyamide imide, polyimide, polyether imide, polyether sulfone, wholly aromatic polyester,
Polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroeletylene-perfluoroalkyl vinyl ether copolymer and the like are preferably used. As the heat-resistant thermoplastic film, a porous film can be used to reduce the elastic modulus of the adhesive layer.

The adhesive layers formed on both surfaces of the core material can be made into a varnish by dissolving or dispersing the adhesive composition in a solvent. The adhesive film can be formed on the heat-resistant thermoplastic film by applying the varnish onto a heat-resistant thermoplastic film serving as a core material and heating to remove the solvent. As the coating method, the above-described method or the like can be used. By performing this step on both surfaces of the heat-resistant thermoplastic film, an adhesive member having an adhesive layer formed on both surfaces of the core material can be produced. In this case, it is preferable to protect the surface with a cover film so that the adhesive layers on both sides do not block each other. However, when blocking does not occur, it is preferable not to use a cover film for economic reasons, and there is no limitation.

A varnish obtained by dissolving or dispersing the adhesive composition in a solvent is coated on the above-mentioned support film, heated and the solvent is removed to form an adhesive layer on the support film. Then, by bonding this adhesive layer to both surfaces of the core material, an adhesive member having adhesive layers formed on both surfaces of the core material can be produced. In this case, a support film can be used as a cover film.

The semiconductor mounting substrate of the present invention can be used irrespective of the material of the substrate such as a lead frame having a die pad, a ceramic substrate, and an organic substrate. As the ceramic substrate, an alumina substrate, an aluminum nitride substrate, or the like can be used. As an organic substrate, FR-4 made of glass cloth impregnated with epoxy resin
Substrate, B impregnated with bismaleimide-triazine resin
A T substrate, or a polyimide film substrate using a polyimide film as a substrate can be used.

The shape of the wiring may be any of single-sided wiring, double-sided wiring, and multi-layered wiring. If necessary, electrically connected through holes and non-through holes may be provided. Further, when the wiring appears on the outer surface of the semiconductor device, it is preferable to provide a protective resin layer.

As a method of attaching the adhesive member to the wiring board, a method of cutting the adhesive member into a predetermined shape and thermocompression bonding the cut adhesive member to a desired position on the wiring board is general. This is not a limitation.

The structure of the semiconductor device of the present invention includes a structure in which the electrode of the semiconductor element and the wiring board are connected by wire bonding, and a structure in which the electrode of the semiconductor element and the wiring board are inner leads of tape automated bonding (TAB). There are structures and the like connected by bonding, but the present invention is not limited to these structures, and any of the cases is effective.

As semiconductor elements, IC, LSI, VL
General semiconductor elements such as SI can be used.

The thermal stress generated between the semiconductor chip and the support member is remarkable when the area difference between the semiconductor chip and the support member is small. However, the semiconductor device of the present invention uses a low elastic modulus adhesive member to reduce the heat stress. Relieve stress to ensure reliability. These effects are very effective when the area of the semiconductor chip is 70% or more of the area of the wiring board. In a semiconductor device having a small area difference between the semiconductor element and the support member, the external connection terminals are often provided in an area.

Further, as a characteristic of the adhesive member of the present invention, in a heating step such as a step of thermocompression bonding the adhesive member to a desired position on a support member or a step of connecting the adhesive member by wire bonding, the adhesive member is formed from the adhesive layer. Volatile components can be suppressed.

[0058]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to embodiments. (Production Example 1) 159.81 g (0.70 mol) of bisphenol A and 21.0 g (0.56 mol) of 80% paraformaldehyde were placed in a 500 ml four-necked flask equipped with a stirrer, a condenser with an oil-water separator, and a nitrogen inlet. Mol) and 119 g of toluene. When the temperature reaches 75 ° C., 1.05 g of oxalic acid is added and the mixture is homogenized at 70 to 75 ° C. When the reaction solution becomes uniform, the temperature is increased to 90 to 9 ° C.
After raising the temperature to 5 ° C. and reacting for about 2 hours, the temperature was raised to 110 ° C. and the condensation reaction was carried out until the theoretical amount of condensed water was distilled. Thereafter, the mixture was cooled, and triethanolamine 0.084 g at 55 ° C.
, And the mixture was neutralized for about 1 hour, and toluene as a solvent was removed by distillation under reduced pressure to obtain a bisphenol A novolak resin (V-1). The reaction was performed while blowing nitrogen.

(Production Example 2) The bisphenol A novolak resin (V-1) 15 obtained in Production Example 1 was placed in a 500 ml four-necked flask equipped with a stirrer, a cooling pipe, and a nitrogen introduction pipe.
After 0 g and 150 g of toluene were added and refluxed for 1 hour, the mixture was allowed to stand for about 1 minute, and only the supernatant was removed. From the remaining varnish, toluene as a solvent was removed by distillation under reduced pressure to obtain a bisphenol A novolak resin (V-2). This operation was performed while blowing nitrogen.

(Production Example 3) In Production Example 2, the operation of refluxing for 1 hour, leaving the mixture to stand for about 1 minute, and repeating the operation of removing only the supernatant twice was repeated, and then removing toluene as a solvent from the remaining varnish. Excluded by vacuum distillation, bisphenol A
Novolak resin (V-3) was obtained. Table 1 shows the results of GPC analysis of the bisphenol A novolak resins (V-1) to (V-2) obtained by blowing nitrogen while blowing this operation. The weight average molecular weight was converted into standard polystyrene, and the content was determined from the area% of GPC. In addition,
Since the obtained resin is bisphenol A novolak, the molecular weight of mononuclear and dinuclear is 500 or less, and the molecular weight of mononuclear to tetranuclear is 1000 or less.

[0061]

[Table 1]

Example 1 45 parts by mass of Epicoat 828 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd., bisphenol A type epoxy resin, epoxy equivalent: 190), ESCN1
95 (trade name of Sumitomo Chemical Co., Ltd., cresol novolak type epoxy resin, epoxy equivalent: 195) 15 parts by mass,
40 parts by mass of bisphenol A novolak resin (V-2) obtained in Production Example 2, and phenotote YP-50 (trade name of Toto Kasei Co., Ltd., phenoxy resin, molecular weight: 50,000) 15
Parts by mass, HTR-860P-3 (trade name of Teikoku Chemical Industry Co., Ltd., epoxy group-containing acrylic rubber, molecular weight 1,000,000,
Tg-7 ° C) 150 parts by mass, Cureazole 2PZ-CN
(Shikoku Chemical Industry Co., Ltd. product name, 1-cyanoethyl-2
-Phenylimidazole) 0.5 parts by mass, NUC A-
To a composition consisting of 0.7 parts by mass of 187 (trade name, manufactured by Nippon Unicar Co., Ltd., γ-glycidoxypropyltrimethoxysilane), methyl ethyl ketone was added, mixed with stirring, and degassed under vacuum. This adhesive varnish is applied on a release-treated polyethylene terephthalate film having a thickness of 75 μm and dried by heating at 140 ° C. for 5 minutes to obtain a B-stage adhesive film (F-1) having a thickness of 75 μm. Was. When this adhesive film was stored in an atmosphere of 25 ° C. and 50% RH (relative humidity), the flow amount was 380 μm after one day, the adhesive strength was 600 N / m, and the flow amount was 170 μm after 30 days.
Adhesive strength 500 N / m, flow amount 25 μm after 90 days,
The adhesive strength was 250 N / m. Flow volume is 75 μm
Punching a thick film adhesive with a φ10mm punch,
Sandwiched at the center of two polyethylene terephthalate films cut to 25 mm x 25 mm, at 100 ° C, 3MP
a, The size of the sample after pressing under the conditions of 5 minutes was measured, and the difference in radius before and after pressing was measured. The adhesive strength of the film adhesive was measured using a hot roll laminator at a temperature of 100 μm on both sides of a film adhesive using a 50 μm polyimide film Upilex S (trade name, manufactured by Ube Industries, Ltd.).
C., pressure 0.3 MPa, speed 0.3 m / min, then cured at 170.degree. C. for 1 hour and cut into 10 mm width polyimide films on both sides of the sample Upilex (Ube Industries, Ltd.) , 50 m in the direction of 180 degrees in a room temperature atmosphere
The T-peel strength was measured at a speed of m / min. Furthermore, the storage elastic modulus of the cured adhesive obtained by curing the adhesive film at 170 ° C. for 1 hour was measured using a dynamic viscoelasticity measuring device DVE-V4.
(Sample size: length 20 mm, width 4 mm, film thickness 80 μm, heating rate 5 ° C./min, tensile mode, 10 Hz, automatic static load)
As a result, 370 MPa at 25 ° C. and 6 MPa at 260 ° C.
Met.

Example 2 The procedure of Example 1 was repeated except that the bisphenol A novolak resin (V-2) was changed to (V-3) obtained in Production Example 3 to obtain a film having a thickness of 75 μm. B-staged adhesive film (F-
2) was obtained. The properties of the adhesive film were evaluated under the same conditions as in Example 1. After one day, the flow amount was 370 μm.
m, adhesive strength 600 N / m, flow amount 165 after 30 days
μm, adhesive strength 500 N / m, flow rate 20 after 90 days
μm and an adhesive strength of 250 N / m. Further, the storage elastic modulus of the cured product of the adhesive was 390 MPa at 25 ° C., 260
It was 9 MPa at ° C.

Comparative Example 1 The procedure of Example 1 was repeated except that the bisphenol A novolak resin (V-2) was changed to (V-1) obtained in Production Example 1 to obtain a film having a thickness of 75 μm. B-staged adhesive film (F-
3) was obtained. The properties of the adhesive film were evaluated under the same conditions as in Example 1. After one day, the flow amount was 380 μm.
m, adhesive strength 600 N / m, flow amount 180 after 30 days
μm, adhesive strength 500 N / m, flow rate 30 days after 90 days
μm and an adhesive strength of 250 N / m. The storage elastic modulus of the cured product of the adhesive was 360 MPa at 25 ° C. and 260 MPa.
It was 4 MPa at ℃.

(Example 3) 15 parts by mass of YD8125 (trade name, manufactured by Toto Kasei Co., Ltd., bisphenol A type epoxy resin, epoxy equivalent: 175), YDCN703 (trade name, manufactured by Toto Kasei Co., Ltd., cresol novolac type epoxy resin, epoxy) Equivalent 210) 45 parts by mass, 40 parts by mass of bisphenol A novolak resin (V-2) obtained in Production Example 2, 15 parts by mass of phenotote YP-50 (trade name of Toto Kasei Co., Ltd., phenoxy resin, molecular weight 50,000) Department, HTR
-860P-3 (trade name of Teikoku Chemical Industry Co., Ltd., epoxy group-containing acrylic rubber, molecular weight 1,000,000, Tg-7 ° C) 1
50 parts by mass, Curesol 2PZ-CN (trade name, manufactured by Shikoku Chemicals Co., Ltd., 1-cyanoethyl-2-phenylimidazole) 0.5 part by mass, NUC A-187 (trade name, manufactured by Nippon Unicar Co., Ltd., γ-) To a composition consisting of 0.7 parts by mass of (glycidoxypropyltrimethoxysilane), methyl ethyl ketone was added, mixed with stirring, and degassed under vacuum. This adhesive varnish is applied on a 75 μm-thick release-treated polyethylene terephthalate film, and dried by heating at 140 ° C. for 5 minutes to obtain a 75 μm-thick B-stage adhesive film (F-4). Was. When the characteristics of this adhesive film were evaluated under the same conditions as in Example 1, the flow amount was 480 μm and the adhesive strength was 750 N / m after 1 day, and the flow amount was 240 μm and the adhesive strength was 600 N / m after 30 days.
After the day, the flow amount was 40 μm, and the adhesive strength was 460 N / m. The storage elastic modulus of the cured product of the adhesive was 3 at 25 ° C.
It was 4 MPa at 60 MPa and 260 ° C.

Example 4 The same operation as in Example 3 was carried out except that the bisphenol A novolak resin (V-2) was changed to (V-3) obtained in Production Example 3, and the film thickness was 75 μm. B-staged adhesive film (F-
5) was obtained. The properties of this adhesive film were evaluated under the same conditions as in Example 1. After one day, the flow amount was 480 μm.
m, adhesive strength 760 N / m, flow amount 230 after 30 days
μm, adhesive strength 600 N / m, flow rate 50 after 90 days
μm and an adhesive strength of 460 N / m. The storage elastic modulus of the cured product of the adhesive is 380 MPa at 25 ° C., 260
It was 6 MPa at ℃.

Comparative Example 2 The procedure of Example 3 was repeated except that the bisphenol A novolak resin (V-2) was changed to (V-1) obtained in Production Example 1 to obtain a film having a thickness of 75 μm. B-staged adhesive film (F-
6) was obtained. When the characteristics of this adhesive film were evaluated under the same conditions as in Example 1, the flow amount was 500 μm after one day.
m, adhesive strength 750 N / m, flow amount 250 after 30 days
μm, adhesive strength 600 N / m, flow rate 40 after 90 days
μm and an adhesive strength of 450 N / m. Further, the storage elastic modulus of this cured adhesive is 350 MPa at 25 ° C., 260
It was 4 MPa at ℃.

The B-staged adhesive films (F-1) to (F-) obtained in Examples 1-4 and Comparative Examples 1-2.
6) was left on a hot plate heated to a predetermined temperature for 2 minutes, and the amount of volatiles was calculated from the change in mass before and after heating by the formula. Table 2 shows the results.

[0069]

(Equation 1)

[0070]

[Table 2]

From Table 2, it can be seen that the adhesive composition of the present invention uses a phenol resin having a reduced low molecular weight component.
Volatile components from the adhesive film could be suppressed.

[0072]

As described above, the present invention has the heat resistance and moisture resistance necessary for mounting a semiconductor element having a large difference in thermal expansion coefficient on a semiconductor mounting substrate, It is possible to provide an adhesive composition capable of forming an adhesive member capable of suppressing the content, an adhesive member using the adhesive composition, a semiconductor mounting substrate excellent in workability, and a semiconductor device.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C09J 133/04 C09J 133/04 161/06 161/06 201/00 201/00 H01L 21/52 H01L 21 / 52 EF term (reference) 4J004 AA02 AA12 AA13 AB05 CA04 CA05 CA06 CC02 CC03 DB02 EA05 FA05 GA01 4J036 AA02 AA05 AK10 DA01 FB07 JA06 JA08 4J040 DF041 EB052 EB062 EC031 EC041 EC061 EC071 EC08 LA07 EC071 MA01 MA02 MA04 MA10 NA20 5F047 AA17 BA23 BA34 BA35 BA51 BB03 BB11 BB13 BB16

Claims (12)

[Claims] (1) The content of the epoxy resin and the low molecular weight component having a molecular weight of 500 or less is 20% by mass or less and the content of the low molecular weight component having a molecular weight of 1000 or less is 30% by mass.
100 parts by mass of the following phenol resin, and (b) a high molecular weight component 1 having a weight average molecular weight containing a functional group of 100,000 or more
An adhesive composition comprising 0 to 400 parts by mass. 2. The adhesive composition according to claim 1, wherein the high molecular weight component containing a functional group and having a weight average molecular weight of 100,000 or more is incompatible with the epoxy resin. 3. An epoxy group-containing acryl having a weight average molecular weight of at least 100,000 containing 0.5 to 6% by mass of glycidyl acrylate or glycidyl methacrylate as a high molecular weight component having a weight average molecular weight of at least 100,000 including a functional group. 3. The adhesive composition according to claim 1, which is a copolymer. 4. The cured product of the adhesive composition has a storage elastic modulus of 2
Range from 10 to 2000 MPa at 5 ° C. and 260
The adhesive composition according to any one of claims 1 to 3, wherein the adhesive composition has a temperature in the range of 3 to 50 MPa at ℃. 5. The adhesive composition according to claim 1, wherein a weight loss rate of the adhesive composition when heated to 270 ° C. is 2% by mass or less. (1) The content of the epoxy resin and the low-molecular-weight component having a molecular weight of 500 or less is 20% by mass or less and the content of the low-molecular-weight component having a molecular weight of 1000 or less is 30% by mass.
100 parts by mass of the following phenolic resin, and (2) a high molecular weight component 1 having a functional group-containing weight average molecular weight of 100,000 or more
An adhesive member obtained by forming an adhesive composition comprising 0 to 400 parts by mass into a film. 7. The adhesive member according to claim 6, wherein the resin composition comprises an adhesive composition in which a high molecular weight component having a functional group and a weight average molecular weight of 100,000 or more is incompatible with the epoxy resin. . 8. A resin composition comprising a high molecular weight component having a functional group and a weight average molecular weight of 100,000 or more and a glycidyl acrylate or glycidyl methacrylate of 0.5 to 6% by weight and a weight average molecular weight of 100,000 or more. The adhesive member according to claim 6, wherein an adhesive composition that is an epoxy group-containing acrylic copolymer is used. 9. The cured product of the adhesive composition having a storage elastic modulus of 2
Range from 10 to 2000 MPa at 5 ° C. and 260
The adhesive member according to any one of claims 6 to 8, wherein the temperature is in a range of 3 to 50 MPa at a temperature of 0C. 10. The adhesive member according to claim 6, wherein a weight reduction rate when the adhesive composition is heated to 270 ° C. is 2% by mass or less. 11. A semiconductor device mounting surface of a supporting member, wherein (1)
100 parts by mass of an epoxy resin and 100 parts by mass of a phenol resin having a content of a low molecular weight component having a molecular weight of 500 or less of 20% by mass or less and a content of a low molecular weight component having a molecular weight of 1000 or less of 30% by mass or less; A semiconductor mounting substrate provided with an adhesive member obtained by forming an adhesive composition comprising 10 to 400 parts by mass of a high molecular weight component having a weight average molecular weight of 100,000 or more, into a film. 12. A semiconductor device mounting surface of a supporting member, comprising:
100 parts by mass of an epoxy resin and 100 parts by mass of a phenol resin having a content of a low molecular weight component having a molecular weight of 500 or less and 20% by mass or less and a low molecular weight component having a molecular weight of 1000 or less and 30% by mass or less; A semiconductor device comprising an adhesive member obtained by forming an adhesive composition comprising 10 to 400 parts by mass of a high molecular weight component having a weight average molecular weight of 100,000 or more into a film, and a semiconductor chip adhered thereon.