JP2002037638A - Cutting device of glass substrate and its method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an invention to cut a glass substrate by giving precise impacts on incisions of a laminated glass substrate. SOLUTION: A pair of impacting convex columns 22, 24 are attached to an edge of a break bar 22. The glass substrate is cut by striking an incision 18 of the laminated glass substrate 12, 14 with these impacting convex columns 22, 24.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for cutting a glass substrate such as a liquid crystal display.

[0002]

2. Description of the Related Art In a manufacturing process of a liquid crystal display device, after an array substrate and a counter substrate are laminated by a sealing member,
There is a step of cutting unnecessary portions of these glass substrates.

[0003] This cutting method will be described with reference to FIG.

[0004] Linear cuts are made on the front and back surfaces of the two laminated glass substrates along a cutting position by a glass cutting wheel.

[0005] The two glass substrates 102 and 104 thus cut are placed on a stage 106.

[0006] Then, a break bar having a flat lower end is impacted toward the linear scratch 108 with a constant impact force.

[0007] Then, as shown by a dotted line in FIG. 3, a crack is vertically spread between the cuts 108 on the glass substrate 104, and of the two laminated glass substrates 102, 104, first, the glass substrate 104 is cut. Is done.

Next, the glass substrate 102 is cut from the cuts 109 by the same operation as above with the upper and lower glass substrates turned upside down and the glass substrate 104 as the upper surface.

[0009]

However, according to the above-described cutting method, the tip of the break bar 110 has a planar shape and is in surface contact with the glass substrate 102.

Therefore, when the break bar 110 gives an impact to a position deviated from a regular position, the cut bar 10
8 has a problem that it does not proceed perpendicularly to the glass substrates 102 and 104 but proceeds in an oblique direction.

This is because the maximum load is applied to the central portion of the tip of the break bar 110, and the cuts 108 progress in the direction of the maximum load.

Therefore, the laminated glass substrates 102,
The reference numeral 104 deviates from the regular size and causes a defect in the subsequent manufacturing process.

Further, when an impact is applied at a position where the tip of the break bar 110 deviates from a proper position, there is also a problem that the cut 108 does not progress and the cutting is not performed.

In view of the above problems, the present invention provides a glass substrate cutting apparatus and method for cutting a glass substrate by reliably applying an impact to a cut provided on a laminated glass substrate. Is provided.

[0015]

According to the present invention, there is provided an apparatus for cutting two laminated glass substrates, comprising a linear cutting device provided along cutting positions on both surfaces of the laminated glass substrates. An apparatus for cutting a glass substrate, comprising: a break bar for applying an impact toward a scratch; and a pair of cylindrical impact projections provided along a tip of the break bar.

According to a second aspect of the present invention, there is provided a method for cutting two laminated glass substrates, wherein the glass cutting wheel cuts linear cuts along the cutting positions on both sides of the laminated glass substrates. Providing a step of cutting the glass substrate by applying an impact toward the cut with a pair of columnar impact projections provided at the tip of the break bar, and cutting the glass substrate. is there.

The present invention will be described.

A straight cut is made by a glass cutting wheel along the cutting positions on both sides of the two laminated glass substrates.

Next, an impact is applied to the cut by a pair of columnar impact projections provided at the tip of the break bar, and the cut is advanced in the vertical direction to cut the glass substrate. .

With this break bar, the load can be dispersed at a point contact with the glass substrate, so that the cut can be advanced vertically.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIG. 2 shows a liquid crystal cell 10 before liquid crystal is injected.
FIG. 3 is a plan view of FIG. 1, in which an array substrate 12 and a counter substrate 14 are bonded together with a seal member 16. Then, outer portions of the stacked array substrate 12 and the counter substrate 14,
That is, the U-shaped portion is unnecessary for the liquid crystal cell 10 and must be cut. Hereinafter, the cutting method will be described.

In the above-mentioned liquid crystal cell 10, linear cuts 18 and 19 are formed along the cutting position by a glass cutting wheel. In this case, the array substrate 12
And cuts 18 and 19 on the respective surfaces of the counter substrate 14.
Are provided at the same position.

The liquid crystal cell 10 provided with the cuts 18 and 19 as described above is mounted on the stage 20 and fixed.

Next, a break bar 22 as shown in FIG. 1 is brought into contact with the linear cut 19 by a constant impact force to advance the cut 18. In this case, at the lower end, which is the surface of the break bar 22 to which the impact is applied, cylindrical impact projections 24 are provided in parallel so as to face each other. When the break bar 22 moves downward, the pair of impact projections 24, 24
As shown in FIG.
Is to shock. This impact is given by point contact as shown in FIG. 1 because the impact projection 24 has a circular cross section, and an impact load is applied only at these two points.
The cut 18 can be advanced vertically.

Next, the upper and lower surfaces of the liquid crystal cell 10 are turned upside down, and the opposing substrate 14 is turned up. And, as above,
The break bar 22 is brought into contact with a constant impact force to cause the cut 19 to proceed vertically.

As described above, three cuts 1
8 and 19 are cut by a break bar 22, and unnecessary portions of the liquid crystal cell 10 are cut.

As described above, in the cutting method of the present embodiment, by providing a pair of impact projections 24, 24 at the lower end of the break bar 22, the load is evenly dispersed,
Advances perpendicularly to the two laminated glass substrates 12 and 14 and can be stably cut.

[0029]

As described above, according to the present invention, by cutting two laminated glass substrates with a break bar having a pair of columnar impact projections, the cuts progress in the vertical direction and are stable. Can be cut into

[Brief description of the drawings]

FIG. 1 is a diagram showing a state in which two laminated glass substrates are about to be cut, showing one embodiment of the present invention.

FIG. 2 is a plan view of the same.

FIG. 3 is a diagram showing a state in which two conventional laminated glass substrates are used for cutting.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Liquid crystal cell 12 Array substrate 14 Counter substrate 16 Seal member 18 Cutout 20 Stage 22 Break bar 24 Impact convex part

Claims (2)

[Claims] 1. A cutting device for cutting two laminated glass substrates, said break bar applying an impact toward a linear cut provided along a cutting position on both sides of said laminated glass substrate. A glass substrate cutting apparatus, comprising: a pair of columnar impact projections provided along the tip of the break bar. 2. A method for cutting two laminated glass substrates, the method comprising: providing a linear cut with a glass cutting wheel along cutting positions on both surfaces of the laminated glass substrates; Cutting the glass substrate by applying an impact toward the cut with a pair of cylindrical impact projections provided at the tip of the bar.