JP2002033051A - Gas discharge panel manufacturing method and gas discharge panel - Google Patents

Abstract

(57) Abstract: A gas discharge panel capable of obtaining a high-quality gas discharge panel by, for example, avoiding a problem caused by local heating of a panel in a chip tube sealing and cutting process. It is an object of the present invention to provide a method for producing the same. SOLUTION: In a chip tube sealing and cutting step, a cylindrical heat insulating material 9 is provided between a heating unit 8 and a back substrate 2 as a heat amount reducing unit, and much of radiant heat transmitted from the heating unit 8 to the back substrate 2 is provided. By the heat insulating material 9, the amount of heat transmitted to the back substrate 2 is greatly reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a gas discharge panel, and more particularly to a method for sealing a pipe member in a gas discharge space.

[0002]

2. Description of the Related Art Conventionally, an AC type plasma display panel (hereinafter, referred to as "PD") has been used as one of the gas discharge panels.
P "," panel ". )It has been known.

FIG. 6 is a cross-sectional perspective view schematically showing the structure of a conventional PDP, and the front is a perspective view showing the cross-sectional structure. As shown in FIG. 1, the envelope 3 mainly includes a front substrate (display-side substrate) 1 and a back substrate 2 (back-side substrate). Front board 1 and back board 2
Are opposed to each other, and are sealed between the two substrates 1 and 2 by a sealing member 4 provided at the outer peripheral edge of the four corners between the two substrates 1 and 2 so that the front substrates 1 and 2 are sealed. A space for gas discharge is formed between the back substrates 2.
A rare gas (mixed gas of neon and xenon) of 300 Torr to 500 Torr is sealed in the gas discharge space.

The front substrate 1 includes a front panel glass (not shown), display electrodes (not shown) patterned on the front panel glass, and a dielectric film (see FIG. 1) formed so as to cover the front panel glass. ) And an MgO protective film (not shown) formed thereon.

On the other hand, the back substrate 2 includes a back panel glass (not shown), address electrodes (data electrodes, not shown) patterned on the surface of the back panel glass, and covers the back electrode. It is composed of a film-formed dielectric (not shown), a partition 5 composed of a plurality of ribs, and an RGB phosphor (not shown) applied between the ribs.

Next, a conventional method of manufacturing a PDP having such a structure will be described.

[0007] A sealing member 4 such as low melting point glass is applied to the outer peripheral edges of the four corners between the front substrate 1 and the back substrate 2 and then fired to seal between the front substrate 1 and the back substrate 2. . As a result, the space for gas discharge sealed from the outside by the sealing member 4 is divided into the front substrate 1 and the back substrate 2.
Formed between them.

Then, after evacuating (evacuating) the chip tube 6 provided on a part of the back substrate 2 and having a ventilation hole therein to fill a rare gas, the ventilation hole in the chip tube 6 is closed. The PDP can be completed by closing (chip-off).

FIG. 7 is a sectional view showing a sectional structure of the tip tube 6 and the envelope 3. Hereinafter, the sealing of the rare gas using the tip tube 6 and the tip-off will be described in more detail with reference to FIG. As shown in FIG.
Numeral 6 communicates with a gas discharge space 17 through a through hole 2 a provided in the back substrate 2.

First, the PDP which is the envelope 3 after gas filling is used.
When manufacturing the substrate, the through holes 2 provided in the back substrate 2
A chip tube 6 having a vent 16 communicating with a gas discharge space in the envelope 3 through a is attached to a predetermined position on the back substrate 2.

Next, after the gas discharge space is evacuated and the discharge gas is sealed through the chip tube 6, the vent hole 16 of the chip tube 6 is sealed to form the envelope 3. The gas discharge space 17 is sealed from the outside.

At the time of sealing the vent 16 of the tip tube 6,
The panel-side remaining portion, which is closed and cut off by closing the ventilation port 16 of the chip tube 6 used at the time of the exhaust process and the process of filling the discharge gas into the gas discharge space, remains on the back substrate 2.
FIG. 8 is an explanatory view showing the remaining portion on the panel side, and shows a cross-sectional structure of only the remaining portion on the panel side.

As shown in FIG. 1, the panel-side remaining portion 11 is made of a sealing material 7 containing a material equivalent or similar to that of the sealing member 4.
And remains adhered on the back substrate 2 while maintaining the airtightness.

As a heat source for cutting and sealing the tip tube, a heating unit such as a gas burner, an electric heater, or a high-frequency heater is used. When a (hollow) cylindrical electric sealing jig is used as the heating unit, the electric sealing jig is arranged on the back substrate 2 so that the chip tube passes through the center of the electric sealing jig.

FIG. 9 is an explanatory view showing a partial cross-sectional structure in the axial direction of the tip tube 6 in which the cylindrical heating section 8 is arranged on the tip tube 6 as described above.

Usually, the pressure of the gas filled in the PDP is 300 to
Since the pressure is 500 Torr, the atmospheric pressure is higher than the internal pressure of the envelope 3. By heating the sealing cut portion 6a of the chip tube 6 and its periphery from the heat source of the heating section 8, the chip tube 6
When the temperature rises to near the softening point, the inner wall portion of the tip tube 6 shrinks at the sealing portion 6a of the tip tube 6 in which the material shrinks in such a manner as to be pressed by the atmospheric pressure, and the vent hole is completely closed. Is done.

As a result of the melting of the sealing portion 6a of the tip tube 6, as shown in FIG. 10, a molten portion 6b in which the vent 16 is completely closed is formed. In a state where the melting portion 6b of the chip tube 6 is molten, a tensile stress is applied to the chip tube 6 in a direction opposite to the back substrate 2 to seal off the chip tube 6 or to completely melt the chip tube 6 By cutting the middle part of the PDP 6b, the panel-side remaining part 11 as shown in FIG. 8 is completed.
Can be made independent from the exhaust system and the gas filling system via the chip tube 6.

When the pressure inside the panel of the sealed gas (the pressure in the gas discharge space) is higher than the pressure of the atmosphere around the sealing cut portion 6a of the chip tube 6, Japanese Patent Application Laid-Open No. 11-204040 is disclosed.
As described in Japanese Patent Application Laid-Open No. 9-344636, a panel is pressurized in a high-pressure chamber around the tip tube portion so that the pressure of the atmosphere near the tip tube is higher than the gas filling pressure in the panel. Perform sealing.

[0019]

The melting portion 6 of the tip tube 6
When b is located near the plasma display panel surface (the back substrate 2 in the example of FIG. 10), heat for melting the sealing cut portion 6a of the chip tube 6 is transmitted to the panel surface as a result. The panel portion relatively close to the fusion zone 6b of the chip tube 6 is locally heated, which causes panel cracking.

If the distance between the fused portion 6b of the chip tube 6 and the panel surface is sufficiently long, the amount of heat transmitted to the panel surface is reduced.
The panel-side remaining portion 11 that is the length of the chip tube that has been cut off by that amount
The formation length becomes long.

The panel-side remaining portion 11 needs to be handled with great care, and is present as a projection that stands upright in the vertical direction with respect to the panel. In processes such as aging, board mounting, panel module assembling process, and inspection process, there are many regulations on the handling of the panel-side remaining portion 11, which hinders the efficiency of subsequent processes.

Particularly when the material of the tip tube is glass,
When the temperature of the tip tube reaches the annealing point of the glass, expansion of the tip tube starts, and when the temperature further rises, the tip tube softens and melts. The larger the temperature gradient near the interface between the melted portion and the non-melted portion (hereinafter sometimes abbreviated as “melted portion interface”) during the melting of the tip tube, the greater the percentage of the region reaching the annealing point near the melted portion interface Is reduced, stress concentrates in the region reaching the annealing point, and as a result, large stress remains near the interface of the fusion zone.

If there is a portion where a large stress remains in the tip tube, the probability of cracking of the tip tube at the time of sealing and cutting increases from that portion. If the chip tube breaks, the outside air enters the gas discharge space in the plasma display panel, and P
DP stops emitting light normally. In particular, even if the chip tube is not broken in the chip tube sealing and cutting step, the chip tube is likely to be broken if a certain amount of stress is applied in a subsequent step, so that care must be taken when handling the chip tube.

Normally, the tip tube sealing cut of the plasma display panel is in a form in which the softened tip tube is crushed by the differential pressure between the atmospheric pressure and the pressure inside the panel and the inner wall of the tube is closed, so that the pressure inside the panel is reduced by the chip pressure. This has a significant effect on the tube sealing and cutting process.

For example, if the pressure difference between the atmospheric pressure and the pressure in the panel is large, the tip tube is crushed by a large force during melting,
Large stress tends to remain in the fusion zone.

Conversely, if the pressure difference between the atmospheric pressure and the pressure in the panel is small, it is difficult to squeeze the chip tube sufficiently during melting, and the chip tube may not be completely closed, which may cause a leak.

If the gas pressure in the panel at the time of sealing is higher than the atmospheric pressure, the inner diameter of the chip tube does not close even if the chip tube is melted and sealed, because the chip tube is pressurized by the gas inside. On the contrary, it expands and cannot be sealed.

The present invention has been made in order to solve the above-mentioned problems. In a chip tube sealing and cutting step, a part of heat supplied from a heat source for melting a chip tube is transmitted to a panel. It is an object of the present invention to provide a method of manufacturing a PDP capable of avoiding a problem caused by local heating of a panel.

Alternatively, it is another object of the present invention to provide a method of manufacturing a PDP in which a stress remaining in the vicinity of the interface of a fused portion of a chip tube is reduced in a chip tube sealing and cutting step.

Alternatively, it is another object of the present invention to provide a method of manufacturing a PDP in which a pressure inside a panel and a pressure difference between outside air are controlled to a state most suitable for sealing in a chip tube sealing and cutting step.

[0031]

Means for Solving the Problems Claim 1 according to the present invention.
The method for manufacturing a gas discharge panel according to the above aspect is a method for manufacturing a gas discharge panel in which a gas discharge space is formed between one substrate and the other substrate, wherein (a) a pipe member provided on the one substrate (B) melting the heated area of the pipe member by a heating operation using a heating unit, and performing the ventilation of the pipe member through a vent operation of exhausting the gas discharge space and venting the gas through the vent hole. Closing the mouth, and the step (b) is performed while arranging a calorie reducing unit for reducing the calorie received by the one substrate from the heating unit.

According to a second aspect of the present invention, in the method for manufacturing a gas discharge panel according to the first aspect, the heat reducing portion includes a heat insulating material provided between the heating portion and the one substrate. Including.

According to a third aspect of the present invention, there is provided a method of manufacturing a gas discharge panel according to the first or second aspect,
The heat quantity reducing unit includes a cooling unit provided between the heating unit and the one substrate and adjacent to the piping member, and having a cooling function.

According to a fourth aspect of the present invention, in the method for manufacturing a gas discharge panel according to the third aspect, the cooling unit is provided near a joint of the pipe member with the one substrate.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a gas discharge panel, wherein a space for gas discharge is formed between one substrate and the other substrate. On the other hand, performing a gas discharge space exhaust and gas filling operation through a vent in a pipe member provided on the substrate, and (b) a heating area of the pipe member by a heating operation using a heating unit. Melting, and closing the ventilation port of the pipe member, the pipe member includes a pipe member erected on the one substrate, the heating unit, in the erection direction of the pipe member Along with this, the heating operation is performed by changing the amount of heat transmitted to the heating region of the pipe member.

According to a sixth aspect of the present invention, in the method for manufacturing a gas discharge panel according to the fifth aspect, the heating area is formed by a closed area in which the vent is closed and the heating operation of the heating unit. The pipe member includes a fusion portion interface that is a boundary between a region where the pipe member is in a fusion state and a region where a non-molten state is maintained, and the heating portion approaches the fusion portion interface from the closed region along the upright direction. Accordingly, the heating operation is performed by changing the amount of heat transmitted to the heating region so as to decrease at least partially without increasing.

According to a seventh aspect of the present invention, in the method for manufacturing a gas discharge panel according to the sixth aspect, the heating area is
Including a plurality of partial heating areas classified in the standing direction,
The heating unit is provided corresponding to the plurality of partial heating regions, includes a plurality of partial heating units each performing a partial heating operation for the corresponding partial heating region, the plurality of partial heating units, The partial heating operation is performed such that the amount of heat transmitted to the plurality of partial heating regions decreases at least partially without increasing as the distance from the closed region to the interface of the fusion zone is approached along the upright direction.

According to an eighth aspect of the present invention, in the method for manufacturing a gas discharge panel according to the seventh aspect, the distance required for heat radiation between the plurality of partial heating sections and the plurality of partial heating areas is the same. Is set to, the plurality of partial heating units,
As the plurality of partial heating regions approach the fusion zone interface from the closed region, the partial heating operation is performed so that the amount of generated heat decreases at least partially without increasing.

According to a ninth aspect of the present invention, in the method for manufacturing a gas discharge panel according to the seventh aspect, the generated heat amounts of the plurality of partial heating units are set to be the same, and the plurality of partial heating units are The distance required for heat radiation between the plurality of partial heating sections and the plurality of partial heating areas is increased at least in part without being shortened as the distance from the closed area to the interface of the fusion zone increases. , Disposed with respect to the piping member.

According to a tenth aspect of the present invention, there is provided the method for manufacturing a gas discharge panel according to any one of the seventh to ninth aspects, wherein the plurality of partial heating sections are provided in the melting section. The partial heating operation is performed such that the temperature of the interface and the vicinity thereof reaches the annealing point of the pipe member.

A method for manufacturing a gas discharge panel according to claim 11, which is a method for manufacturing a gas discharge panel in which a gas discharge space is formed between one substrate and the other substrate, wherein: On the other hand, performing a gas discharge space exhaust and gas filling operation through a vent in a pipe member provided on the substrate, and (b) a heating area of the pipe member by a heating operation using a heating unit. Melting and closing the vent of the pipe member, and the step (b) is performed while heating or cooling the entire gas discharge panel.

A gas discharge panel according to a twelfth aspect is manufactured by the method for manufacturing a gas discharge panel according to any one of the first to eleventh aspects.

[0043]

DESCRIPTION OF THE PREFERRED EMBODIMENTS <Embodiment 1> FIG. 1 is an explanatory view showing a chip tube sealing and cutting step of a method of manufacturing a PDP according to Embodiment 1 of the present invention. 3 shows an axial cross-sectional structure.

In the chip tube sealing cutting step, the chip tube sealing cut portion and its surroundings are heated by a heating portion such as an electric sealing jig to raise the temperature of the heating region of the chip tube to near the softening point. By making the heated area into a molten state, material shrinkage occurs in the tip tube in a way that it is pushed to the atmospheric pressure, and as a result, the sealing cut part of the tip tube shrinks completely and the inner wall of the vent hole is completely closed Is done.

As shown in FIG. 1, in the first embodiment, a (hollow) cylindrical heat insulating material 9 is provided between the heating unit 8 and the back substrate 2 to reduce the amount of heat during the chip tube sealing and cutting step. It is provided as a part. The heat insulating material 9 is arranged so that the chip tube 6 penetrates the center thereof, similarly to the heating unit 8.

Therefore, in the chip tube sealing and cutting step, most of the radiant heat transmitted from the heating section 8 as the heat source to the back substrate 2 is blocked by the heat insulating material 9, so that the amount of heat transmitted to the back substrate 2 is greatly reduced. be able to.

Therefore, the method of the first embodiment is different from the conventional method in which the heat insulating material 9 is not provided between the heating unit 8 and the back substrate 2, in that the back substrate due to the radiant heat from the heating unit, which causes panel cracking, is used. 2 can effectively suppress a local temperature rise, and a PDP of good quality can be obtained.

<Embodiment 2> FIG. 2 is an explanatory view showing a chip tube sealing and cutting step of a method of manufacturing a PDP according to Embodiment 2 of the present invention. Shows the structure.

As shown in the figure, in the chip tube sealing and cutting step, a cooling function such as a water-cooled pipe is provided near the joint between the back substrate 2 and the chip tube 6 (near the region where the sealing material 7 is formed). In addition, the ring-shaped cooling section 10 is arranged as a heat quantity reducing section. The cooling unit 10 has a chip tube 6 at its center.
Are arranged so as to penetrate and be adjacent to the tip tube 6.

As shown in the figure, in the second embodiment, the cooling unit 1
By arranging 0, the amount of heat transmitted from the melting portion of the chip tube to the back substrate 2 via the chip tube 6 can be reduced.

Further, by cooling the region near the joint between the back substrate 2 and the chip tube 6 by the cooling unit 10, the back substrate 2 is melted from the chip tube melting portion via the chip tube 6.
Can be reduced most effectively.

Therefore, the method of the second embodiment is different from the conventional method in which the chip tube sealing and cutting step is performed without providing the cooling unit 10, in that the back substrate from the chip tube fusion part which causes a panel crack is generated. 2, it is possible to suppress a local rise in temperature of the panel due to heat conduction to the panel 2, and to manufacture a high-quality PDP.

If the chip tube sealing and cutting step is performed by combining the heat insulating material 9 of the first embodiment and the cooling unit 10 of the second embodiment, the amount of heat transmitted from the heating unit to the back substrate 2 can be increased. Of course, it can be effectively reduced.

<Embodiment 3> (Principle) After executing the chip tube sealing and cutting step, as shown in FIG.
The inner wall portion of the ventilation port 16 at a is contracted and completely closed. Only air exists between the heating unit 8 and the tip tube 6, and the cylindrical heating unit 8 is moved from the tip tube 6 (the tip tube 6).
When the heat capacity per unit area (heat generation amount) of the heating unit 8 is equal, the tip tube axis from the heating unit 8 to the tip tube 6 The thermal resistance in the vertical direction is almost equal.

As shown in FIG. 10, in the tip tube sealing and cutting step, the vicinity of the tip tube portion 6c where heat is most easily transmitted from the lower end of the heating unit 8 is the interface 6d of the melting part of the tip tube 6d.
Becomes The high temperature side near the fusion interface 6d is a temperature at which the glass is sufficiently softened and melted, and the low temperature side near the fusion interface 6d is not heated at all but cooled by the outside air.

That is, since the interface 6d of the fusion zone is the boundary between the region where the molten state is formed in the chip tube sealing and cutting step and the region where the non-molten state is maintained, the temperature gradient near the interface 6d of the fusion zone becomes very large. . When the molten portion 6b is cooled by the outside air in this state, a very large stress remains in the vicinity of the molten portion interface 6d, which causes a chip tube crack.

On the other hand, if the thermal resistance in the direction perpendicular to the chip tube axis from the heating section 8 to the chip tube 6 is increased in order to reduce the temperature gradient in the vicinity of the interface 6d of the molten portion, the glass chip tube 6 May not be melted sufficiently, and the inner wall of the cut-off portion may not be completely closed, which may cause leakage from the gas discharge space.

Therefore, the tip tube sealing and cutting step is performed so as to transmit the amount of heat enough to melt the glass to the vicinity of the chip tube sealing and cutting portion, and to transmit an appropriate amount of heat smaller than the above-mentioned amount of heat to the vicinity of the chip tube melting portion interface. Is desirable in solving the above problem. That is, it is necessary to appropriately control the amount of heat received by the chip tube 6 from the heating unit 8 along the axial direction of the chip tube 6 (the direction in which the chip tube 6 stands).

Further, the temperature in the vicinity of the sealing cut portion of the chip tube 6 reaches the maximum temperature, from which the panel (back substrate 2)
If a control is performed to obtain a temperature gradient such that the temperature gradually decreases in the axial direction of the tip tube 6 toward the tip tube, the temperature difference between the melted portion and the non-melted portion during melting of the tip tube is reduced, and Stress near the interface 6d can be reduced.

(Structure) FIG. 3 is an explanatory view showing a chip tube sealing and cutting step in a method of manufacturing a PDP according to a third embodiment of the present invention. Is shown.

As shown in the figure, the heating section 18 is provided in a cylindrical shape such that the tip tube 6 penetrates the center thereof. The heating unit 18 has a plurality of electrically independent resistance lines 18f to 18j, each of which is electrically independent.
By energizing 18j, the tip tube portions 6f to 6j, which are the partial heating regions of the tip tube 6 corresponding to the electric resistance lines 18f to 18j, are heated. The tip tube sections 6f to 6h are closed areas, and a fusion interface exists in the tip tube sections 6h to 6i.

As described above, the electric resistance wires 18f to 18j function as ring heaters of the same shape that are electrically independent from each other, and are required for heat radiation between the electric resistance wires 18f to 18j and the tip tube portions 6f to 6j. The distance will be the same.

Therefore, the electric resistance lines 18f, 18g and 1
The same voltage is applied to 8h as to obtain a heat flow necessary for melting the tip tube sufficiently, and a smaller heat flow to the electric resistance wire 18i than the heat flow obtained from the electric resistance lines 18f to 18h is obtained. If a voltage is applied and the electric resistance lines 18f to 18j are controlled so as to apply a voltage at which a smaller heat flow is obtained to the electric resistance line 18j than the electric resistance line 18i, heating is performed by the electric resistance line 18i. The temperature of the tip tube portion 6i is higher than the tip tube portion 6j, and the temperature can be controlled to be lower than the temperature of the tip tube portion 6h.

That is, along the axial direction of the tip tube 6,
As approaching the fusion zone interface (existing at 6h to 6i) from the closed region (6f to 6h), the amount of heat transmitted to the tip tube portions 6f to 6i decreases stepwise at the tip tube portions 6i and 6j without increasing. As described above, the electric resistance wires 18f to 18h perform the partial heating operation.

As described above, the temperature gradient near the melted portion interface of the tip tube 6 existing between the tip tube portions 6h to 6i can be controlled by the electric resistance lines 18h to 18i.

The temperature gradient in the vicinity of the tip tube fusion zone interface caused by the temperature control of the third embodiment is such that even if the tip tube portions 6i and 6j are in a molten state, the electric resistance lines 18i and 18j are not connected to the electric resistance lines 18i and 18j. When the same voltage as that of 18f to 18h is applied and the same heat flow rate is applied, the temperature gradient is clearly smaller than the temperature gradient generated near the interface of the tip tube melting portion, and as a result, the temperature gradient remains near the interface of the tip tube melting portion. The stress is reduced.

In particular, the electric resistance lines 18i, 18j are so set that the temperature of the tip tube portion 6i is higher by about 10 ° C. to 30 ° C. than the annealing point of the tip tube material, and the temperature of the tip tube portion 6j is about the aforementioned annealing point. By controlling the temperature, the area where the temperature has reached the annealing point can be made relatively large in the vicinity of the interface of the melting point of the tip tube, so that the stress concentration can be alleviated in the area where the annealing point has reached the melting point, The stress remaining in the vicinity can be made very small.

When the heat of the tip tube sections 6f to 6h is transmitted to the tip tube sections 6i and 6j and the temperature of the tip tube sections 6ij increases with time, the tip tube sections 6i and 6j are increased in accordance with the temperature rise. It is sufficient to control the heat flow generated by the electric resistance wires 18i, 18j so that 6i, 6j is maintained at the target temperature.

The electric resistance lines 18f to 18j do not necessarily have to be configured to be independently controllable. For example, by connecting electric resistance lines having different resistance values in series, a desired heat flow rate can be obtained in each electric resistance line. As described above, the same voltage may be applied by controlling the resistance value.

In the above example, the temperature control in the vicinity of the melting portion interface of the chip tube 6 existing on the back substrate 2 side in the axial direction of the chip tube 6 with the chip tube melting portion as the center has been described. In order to alleviate the residual stress in the vicinity of the interface of the melted portion of the tip tube 6 on the opposite side to the electric resistance line 18f,
The same control as that for the electric resistance lines 18i · j may be applied to 18g.

The heat source for heating the chip tube does not necessarily need to be an electric heater using the above-described electric resistance wire, and there is no problem with a gas burner or the like as long as the above-described temperature control is possible.

Further, for example, a heating section composed of different heat sources may be used, in which a heat source for melting the chip tube is a gas burner, and a heat source for heating the vicinity of the interface of the chip melting portion is an electric heater.

<Embodiment 4> As a method for controlling the thermal resistance in the direction perpendicular to the chip tube axis from the heating unit to the chip tube in the axial direction of the chip tube, a method of controlling the thermal resistance in the direction perpendicular to the chip tube axis of the chip tube and the heating unit Is changed in the axial direction of the tip tube.

FIG. 4 shows a PD according to a fourth embodiment of the present invention.
It is explanatory drawing which shows the chip-tube sealing cutting process of the manufacturing method of P, and has shown the axial cross-sectional structure of a chip tube and its peripheral part.

As shown in the figure, the heating unit 19 is provided in a cylindrical shape such that the tip tube 6 penetrates the center thereof. The upper region 19a of the heating unit 19 has a distance d1 from the tip tube 6 (in the direction perpendicular to the chip tube axis), and the lower region 19c of the heating unit 19 has a distance d1 from the tip tube 6. The distance is set to d2 by extension, and the center area 19b of the heating unit 19 has a distance from the tip tube 6 of d1 to d2.
It is set so as to be gradually extended toward.

Assuming that only the stagnated air exists between the chip tube 6 and the heating unit 19, the heating value per unit area in the direction perpendicular to the chip tube axis of the heating unit 19 is equal, the chip tube is directed toward the panel. In the axial direction, the thermal resistance from the heating portion 18 to the tip tube portions 6k to 6l (the portion corresponding to the region 19a) is equal, and the thermal resistance gradually increases from the heating portion 18 to the tip tube portions 6l to 6m (the portion corresponding to the region 19b). The temperature from the tip tube portion 6k to 6l is highest in the tip tube axial direction toward the panel, and gradually decreases from the tip tube portion 6l to 6m. That is, in the fourth embodiment, the thermal resistance in the direction perpendicular to the axis of the tip tube 6 from the heating unit 8 to the tip tube is variably set along the axial direction of the tip tube 6.

That is, as the distance from the blockage area (6 k to 6 l) to the fusion zone interface (existing at 6 l to 6 m) is reduced, the distance from the heating section 19 to the tip pipe portion 6 l to 6 m is not shortened. The heating unit 19 is arranged so as to be gradually extended to the portions 6l to 6m.

At this time, the tip tube 6 is connected to the tip tube portion 6k.
If the tip tube 6 from the tip tube portion 6l to the tip tube portion 6n is in a molten state, the temperature gradient in the vicinity of the tip tube melting portion interface is as follows. In the vicinity of the interface of the melting portion of the chip tube formed when the distance from the chip tube to the heat source in the vertical direction to the chip tube axis is equal to d1 and the distance from the chip tube to the heat source in the vertical direction is equal to the heat generation per unit area in the tube axis. The stress becomes clearly smaller than the temperature gradient, and the stress remaining in the vicinity of the interface of the tip tube fusion zone becomes smaller.

In particular, the tip tube portions 6k to 6l are sufficiently melted, the temperature in the vicinity of the tip tube portion 6m is higher than the annealing point of the tip tube material by about 10 ° C. to 30 ° C., and the temperature in the vicinity of the tip tube portion 6n is If the distances d1 and d2 and the formation lengths of the regions 19a to 19c in the axial direction of the tip tube are set so as to be about the annealing point of the tip tube material, the interface of the tip tube melting portion existing between the tip tube portions 6l to 6m is set. Since the region reaching the annealing point in the vicinity of the annealing point in the vicinity can be provided relatively widely, stress concentration can be reduced in the region reaching the annealing point,
The stress remaining near the interface of the tip tube melting portion can be made very small.

<Embodiment 5> As described in the section of the prior art, in the chip tube sealing and cutting step, a heating region to be a chip tube sealing and cutting portion is heated by a heating unit, and the temperature of the heating region is reduced to a chip. When the temperature rises to above the softening point of the pipe, the sealing cut off part of the chip pipe, in which the material shrinks in the form of being pushed by the pressure difference between the atmospheric pressure and the panel internal pressure, is completely shrunk by the shrinkage of the inner wall of the pipe (vent). Closed.

FIG. 5 shows a PD according to a fifth embodiment of the present invention.
It is explanatory drawing which shows the chip tube sealing cutting process of the manufacturing method of P. As shown in the figure, in the chip tube sealing and cutting step, a panel (envelope 3) is housed in a housing portion provided on a surface plate 20 that can be heated and cooled. The platen 20 accommodates the envelope 3 so that the temperature of the gas discharge space in the envelope 3 can be set by heat conduction from the platen 20. The heat source for controlling the temperature of the envelope 3 may be the platen 20 itself or another heating device using the platen 20 as a heat conducting means.

The molten shape of the tip tube which affects the tip tube leak is governed by the viscosity of the softened or molten glass and the differential pressure between the atmospheric pressure and the internal pressure of the tip tube (the pressure in the gas discharge space). By controlling the internal pressure of the panel using the surface plate 20 in the chip tube sealing and cutting process by setting the temperature of the envelope 3 by heating / cooling control of the surface plate 20, an optimum melt shape of the chip tube is obtained. be able to.

For example, the internal pressure of the panel most suitable for the molten shape of the glass at the time of sealing due to the viscosity of a certain glass is 500.
Let it be Torr.

When sealing a panel having an internal pressure of 400 Torr at room temperature during the chip tube sealing and cutting step, the platen 20 is heated to raise the temperature of the outer package 3 (panel before sealing) to 100 ° C.
When the panel is sealed by holding it at about
It can be changed to Torr, and it is possible to manufacture a high-quality panel with almost no chip tube leak.

Similarly, when sealing a panel having a panel internal pressure of 600 Torr at room temperature during the chip tube sealing and cutting step, the platen 20 is cooled to maintain the temperature of the panel at about −30 ° C. If sealed, the internal pressure can be changed to about 500 Torr, and a high-quality panel with little chip tube leakage can be manufactured.

[0086]

As described above, the method for manufacturing a gas discharge panel according to the first aspect of the present invention is to reduce the amount of heat received by one of the substrates by the heat reducing portion while closing the ventilation port of the pipe member. On the other hand, a gas discharge panel of good quality can be obtained by suppressing the trouble caused by heating the one substrate.

In the method for manufacturing a gas discharge panel according to the second aspect, by heating a portion of the radiant heat from the heating section by the heat insulating material, the heating of the one substrate by the heating section can be effectively suppressed.

In the method for manufacturing a gas discharge panel according to the third aspect, the amount of heat transmitted from the heating unit to the one substrate via the pipe member can be effectively reduced by the cooling function of the cooling unit.

In the method for manufacturing a gas discharge panel according to a fourth aspect of the present invention, the cooling unit is provided in the vicinity of the joint between the piping member and the one substrate, so that the amount of heat transmitted to the one substrate via the piping member can be most effectively reduced. Can be suppressed.

According to a fifth aspect of the present invention, in the method for manufacturing a gas discharge panel, the heating operation is performed by changing the amount of heat transmitted to the heating region of the pipe member along the direction in which the pipe member is erected. A heating operation that does not adversely affect the heating area and its surroundings becomes possible, and a high-quality gas discharge panel can be obtained.

According to a sixth aspect of the present invention, in the method for manufacturing a gas discharge panel, the amount of heat transferred to the heating area is reduced by the heating section at least in part as the heating section approaches the fusion zone interface from the closed area without increasing. Then, a heating operation is performed.

Therefore, by suppressing the amount of heat transmitted to the interface of the fusion zone to be smaller than the amount of heat transmitted to the closed region, the temperature gradient of the pipe member near the interface of the fusion zone can be reduced, and adverse effects on the piping member can be suppressed.

In the method of manufacturing a gas discharge panel according to the seventh aspect, the amount of heat transmitted to the interface of the fusion zone can be suppressed to be smaller than the amount of heat transmitted to the closed region by the partial heating operation of each of the plurality of partial heating units.

In the method of manufacturing a gas discharge panel according to claim 8, the amount of heat transmitted to the interface of the fusion zone is suppressed to be smaller than the amount of heat transmitted to the closed region by changing the amount of heat generated in the partial heating operation of the plurality of partial heating units. be able to.

In the method for manufacturing a gas discharge panel according to the ninth aspect, by changing the distance required for heat radiation between the plurality of partial heating sections and the plurality of partial heating areas, the amount of heat transmitted to the fusion zone interface is transmitted to the closed area. It can be kept smaller than the calorific value.

In the method for manufacturing a gas discharge panel according to the tenth aspect, the plurality of partial heating portions are partially heated so that the temperature at the interface of the melting portion and the vicinity thereof reaches near the annealing point of the pipe member and reaches the annealing point. In order to perform the operation, it is possible to provide a region that has reached the annealing point in the vicinity of the fusion zone interface,
Stress remaining at the interface of the fusion zone and its vicinity can be suppressed to a small value.

In the gas discharge panel manufacturing method according to the present invention, the pressure of the gas discharge space is optimized by heating or cooling the entire gas discharge panel so that the molten state of the pipe member is optimized. , And as a result, a high quality gas discharge panel can be obtained.

The gas discharge panel according to the twelfth aspect of the present invention is manufactured by the method for manufacturing a gas discharge panel according to the first to the eleventh aspects, and has an effect that the quality is good.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a chip tube sealing and cutting step of a PDP manufacturing method according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a chip tube sealing and cutting step of a method of manufacturing a PDP according to a second embodiment of the present invention.

FIG. 3 is an explanatory view showing a chip tube sealing and cutting step of a method of manufacturing a PDP according to a third embodiment of the present invention.

FIG. 4 is an explanatory view showing a chip tube sealing and cutting step of a method of manufacturing a PDP according to a fourth embodiment of the present invention.

FIG. 5 is an explanatory view showing a chip tube sealing and cutting step of a method of manufacturing a PDP according to a fifth embodiment of the present invention.

FIG. 6 is a sectional perspective view schematically showing the structure of a conventional PDP.

FIG. 7 is an explanatory diagram showing details of a chip tube.

FIG. 8 is an explanatory view showing a panel-side remaining portion.

FIG. 9 is an explanatory view showing a state in which a cylindrical heating unit is set on the tip tube.

FIG. 10 is an explanatory diagram showing a state of a chip tube after a chip tube sealing and cutting step.

[Explanation of symbols]

9 Insulation material, 10 Cooling unit, 18, 19 Heating unit, 20
Surface plate.

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Shunichi Inumita 2-3-2 Marunouchi, Chiyoda-ku, Tokyo F-term (reference) in Mitsubishi Electric Corporation 5C012 AA09 PP05 PP08 5C040 HA05

Claims (12)

[Claims] 1. A method for manufacturing a gas discharge panel in which a gas discharge space is formed between one substrate and another substrate, comprising: (a) a gas discharge panel provided on the one substrate through a vent in a pipe member; Performing a gas discharge space gas exhaust and gas filling operation; and (b) melting a heating region of the pipe member by a heating operation using a heating unit, and closing the ventilation port of the pipe member. Wherein the step (b) is performed while arranging a calorie reducing unit for reducing the amount of heat received by the one substrate from the heating unit. 2. The method of manufacturing a gas discharge panel according to claim 1, wherein the calorie reducing unit includes a heat insulating material provided between the heating unit and the one substrate. Method. 3. The method of manufacturing a gas discharge panel according to claim 1, wherein the calorie reducing unit is provided between the heating unit and the one substrate and adjacent to the piping member. A method for manufacturing a gas discharge panel, including a cooling unit having a cooling function. 4. The method of manufacturing a gas discharge panel according to claim 3, wherein the cooling unit is provided near a joint of the pipe member with the one substrate. 5. A method for manufacturing a gas discharge panel in which a gas discharge space is formed between one substrate and the other substrate, wherein: (a) a gas discharge panel is provided through a vent in a pipe member provided on the one substrate; Performing a gas discharge space gas exhaust and gas filling operation; and (b) melting a heating region of the pipe member by a heating operation using a heating unit, and closing the ventilation port of the pipe member. The piping member includes a piping member erected on the one substrate, the heating unit changes the amount of heat transmitted to the heating area of the piping member along the erection direction of the piping member. Performing the heating operation in a gas discharge panel. 6. The method for manufacturing a gas discharge panel according to claim 5, wherein the heating area is a closed area where the vent is closed, and the pipe member is in a molten state by the heating operation of the heating unit. A melting portion interface that is a boundary between a region to be formed and a region that maintains a non-molten state, wherein the heating portion is closer to the melting portion interface from the closed region along the upright direction, A method for manufacturing a gas discharge panel, wherein the heating operation is performed by changing the amount of heat transmitted so as to decrease at least partially without increasing. 7. The method for manufacturing a gas discharge panel according to claim 6, wherein the heating region includes a plurality of partial heating regions classified in the standing direction, and the heating unit includes the plurality of portions. A plurality of partial heating units are provided corresponding to the heating regions and each perform a partial heating operation on the corresponding partial heating region, wherein the plurality of partial heating units are closed along the upright direction. A method for manufacturing a gas discharge panel, wherein the partial heating operation is performed such that the amount of heat transmitted to the plurality of partial heating regions decreases at least partially without increasing as the region approaches the fusion zone interface. 8. The method for manufacturing a gas discharge panel according to claim 7, wherein a distance required for heat radiation between the plurality of partial heating units and the plurality of partial heating regions is set to be equal to each other, and The partial heating unit performs the partial heating operation so that the plurality of partial heating regions approach the melting unit interface from the closed region and the amount of generated heat decreases at least partially without increasing. A method for manufacturing a discharge panel. 9. The method of manufacturing a gas discharge panel according to claim 7, wherein a generated heat amount of each of the plurality of partial heating units is set to be the same, and wherein the plurality of partial heating units are the plurality of partial heating units. With respect to the piping member, the distance required for heat radiation between the and the plurality of partial heating regions is extended at least partially without being shortened as the distance from the closed region approaches the interface of the fusion zone. A method for manufacturing a gas discharge panel to be arranged. 10. The method of manufacturing a gas discharge panel according to claim 7, wherein the plurality of partial heating units have a temperature at an interface between the melting unit and the vicinity thereof. A method for manufacturing a gas discharge panel, wherein the partial heating operation is performed to reach a slow cooling point of the pipe member. 11. A method of manufacturing a gas discharge panel in which a gas discharge space is formed between one substrate and the other substrate, wherein: (a) a gas discharge panel is provided through a vent in a pipe member provided on the one substrate; Performing a gas discharge space gas exhaust and gas filling operation; and (b) melting a heating region of the pipe member by a heating operation using a heating unit, and closing the ventilation port of the pipe member. Wherein the step (b) is performed while heating or cooling the entire gas discharge panel. 12. A gas discharge panel manufactured by the method for manufacturing a gas discharge panel according to claim 1. Description: