JP2002016386A - Electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device which is free from the breakage of a water circulating pipe and can efficiently cool a semiconductor element. SOLUTION: The heat generated from the semiconductor element 9 is transmitted to a heat conducting member 17, the wiring layer of a wiring board, and the external wall 8 of equipment, and thermally joined to an inserting section 6 which supplies electricity to the equipment. The electric cable 13 of an AC adaptor used for supplying DC power to the inserting section 6 is used as a water circulating cable 5, and a pump which is used for circulating cooling water into the AC adaptor is provided. The pump is driven with the AC power of the adaptor.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a device for cooling a semiconductor element in a housing.

[0002]

BACKGROUND OF THE INVENTION In recent years. 2. Description of the Related Art As portable electronic devices and personal computers (hereinafter, referred to as personal computers) have become faster and smaller, the temperature generated by semiconductor elements inside a housing has been increasing.

[0003] As a cooling means for such personal computers, an enclosure made of a material having good thermal conductivity and radiating heat from the enclosure has been increasing.

However, in recent years, with the spread of mobile personal computers, the use of personal computers in trains and the like and on the road has increased. In particular, in a car where there is no back space, the case of operating the PC on the knee is increasing. Therefore, when the heat of the semiconductor element is transferred to the housing side, the bottom surface of the housing may become hot and may not even be placed on the lap.

As a cooling means for such a personal computer, for example, as described in Japanese Patent Application Laid-Open No. Hei 7-142886,
2. Description of the Related Art There is an electronic device that absorbs heat of a semiconductor element housed in a personal computer whose entire surface is a heat dissipation surface by a cooling medium circulating in a pipe, and transfers the absorbed heat to a display via the pipe.

Further, as described in Japanese Patent Application Laid-Open No. 8-228423, a cooling pipe is divided into a part where cooling is not necessary and a part where cooling is necessary, and a double pipe is provided in a part where the cooling is unnecessary.
A necessary part is a single tube that cools the power cable.

[0007]

Generally, a portable personal computer has a sharp mounted object such as a pin inside a portable personal computer, and a display serving as a lid of the personal computer main body is opened and closed. Therefore, the above-mentioned Japanese Patent Application Laid-Open No.
When a circulation pipe for a cooling medium is provided as in Japanese Patent Publication No. 886, the pipe is bent by repeated opening and closing operations of the display, and comes into contact with a sharp part, thereby damaging or twisting the pipe. Leakage of the cooling medium resulting from the defect may occur.

Further, as disclosed in Japanese Patent Application Laid-Open No. 8-228423, no consideration is given to leakage of the cooling medium to the joint of the double pipe portions of the pipes, the branch portion of the single pipe, the junction, and the like.

An object of the present invention is to provide an electronic device capable of efficiently cooling a semiconductor element without damaging a water circulation pipe.

[0010]

An object of the present invention is to provide an electronic device comprising a substrate mounted in a case, a semiconductor element mounted on the substrate, and a keyboard mounted on the case. This is achieved by connecting a heat conducting member connected to the case and a heat radiating means to the heat conducting member, and making the heat radiating means detachable from the outside of the case.

Also, in an electronic device including a substrate mounted in a case, a semiconductor element mounted on the substrate, and a keyboard mounted on the case, a heat conductive member connected to the semiconductor element may be provided. This is achieved by connecting a heat radiating means to the heat conducting member, making the heat radiating means detachable from the outside of the case, and using the water radiating means as a water circulation pipe.

Further, the present invention is achieved by providing the water circulation pipe integrally with the wiring connected to the AC / DC power converter.

Further, the present invention is achieved by providing a pump for circulating water in the water circulation pipe in the DC / AC converter.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a perspective view of a personal computer provided with the present invention.

In FIG. 1, a personal computer 1 has a keyboard 2 for inputting characters and the like and a liquid crystal display 3 for displaying data and the like. Furthermore, an AC adapter 4 for supplying electricity to the personal computer 1
(AC / DC power supply converter), and a water circulation cable 5 (radiation means) is attached between the AC adapter 4 and the personal computer 1. The water circulation cable 5 is inserted into the insertion section 6 of the personal computer 1. Also, A
An AC cable 23 having an AC outlet 7 is attached to the C adapter 4. This AC outlet 7 is inserted into an AC 100 V supply port of a home or the like, and the personal computer 1
To supply electricity.

It is necessary for a personal computer to satisfy both portability and high functionality.

The portability means that a storage battery such as a battery is mounted in the main body of the personal computer, and the personal computer is operated using the storage battery. When a storage battery is used, the calculation processing speed of the personal computer is reduced to reduce the power consumption of the personal computer, especially the CPU (semiconductor element).

The high functionality means that a personal computer executes various processes such as image output and numerical calculation. In this case, the calculation processing speed of the personal computer is high, the power consumption of the personal computer, especially the CPU, is maximum, and the heat generation temperature is high.

In a personal computer, the above-mentioned boundary between portability and high functionality is largely determined by the presence or absence of the AC adapter 4 in FIG. That is, when the AC adapter is not attached to the personal computer, power is supplied from a storage battery such as a battery. Therefore, considering the power consumption of the storage battery, it is not possible to perform the operation that consumes high power.

On the other hand, when the AC adapter is mounted on the main body of the personal computer and operated, the power supply is always performed, so that the operation with high power consumption can be performed. Increase.

By the way, in the case of a personal computer, the need for low noise is high regardless of the operating state of the personal computer in consideration of the user's use environment. The noise at this time is mainly generated by a cooling fan for cooling the personal computer.

Therefore, of the heat generated when performing a work with high power consumption, the amount of heat dissipated from the personal computer to the outside air is made the same as that when performing a work with low power consumption, and much of the remaining heat is supplied by the water circulation cable. , And are carried to an AC adapter, and the AC adapter emits the air to the outside.

FIG. 2 is a sectional view showing the vicinity of the insertion portion 6 of the personal computer shown in FIG.

In FIG. 2, the personal computer 1 includes a keyboard 2 and a personal computer outer wall 8. PC 1
An electronic substrate 19 on which the semiconductor element 9 is mounted is mounted inside. A wiring connector 10 is provided at one end of the electronic board 19.
Is electrically connected to the insertion section 6 provided in the communication section 11 through a distribution cable 11. When the water circulation cable 5 is inserted into the insertion portion 6, the high-voltage side 12 and the low-voltage side 13 of the power supply cable in the water circulation cable 5 are electrically connected to the insertion portion 6. The heat conducting member 17 attached to the semiconductor element 9 is thermally connected to the insertion section 6.

As for the direction 16 of the cooling water, there are a cooling water forward path 14 and a cooling water return path 15 in the same cable as shown by arrows. In consideration of the outer dimensions of the water circulation cable 5, it is necessary to reduce the curvature of the boundary between the cooling water outward path 14 and the cooling water return path 15. Further, it is necessary to reduce the circulation flow rate of the cooling water as much as possible to eliminate useless cooling water that does not contribute to cooling. Therefore, the pipe diameter of the cooling water outward path 14 and the cooling water return path 15 is set to 1 to
It is about 2 mm. Semiconductor element 9 transmitted to insertion portion 6
Is connected to the cooling water at the boundary area between the cooling water outward path 14 and the cooling water return path 15 via the electric wiring cable high voltage side 12 and the electric wiring cable low voltage side 13.

The cooling water is circulated by a pump in an AC adapter, which will be described later, and the heat is radiated to the atmosphere at a position distant from the personal computer body by the surface of the AC adapter or a heat exchanger. As a result, it can be understood that since the cooling is performed by the water circulation pipe instead of the cooling fan that has been conventionally attached for heat radiation, the noise generated from the personal computer main body is almost eliminated.

FIG. 3 shows an embodiment in which the wiring layer 18 in the electronic substrate 19 is used other than the heat conducting member of FIG. Only different points from the case of FIG. 2 will be described.

In FIG. 3, the semiconductor element 9 is the wiring pin 2
By 0, it is electrically and thermally connected to the wiring layer 18 of the electronic substrate 19. The heat generated from the semiconductor element 9 spreads to the electronic substrate 19 via the wiring pins 20. further,
The electric power is transmitted to the power cable 11 through an electric wire inside the wiring connector 10 provided at one end of the electronic board 19. The subsequent heat path is the same as in FIG.

Thus, it can be seen that the noise generated from the personal computer main body is almost eliminated when cooling the semiconductor element having high heat generation.

FIG. 4 shows an embodiment in which the outer wall of the personal computer is used as a heat radiation path. Only different points from FIG. 2 and FIG. 3 will be described.

In FIG. 4, the semiconductor element 9 and the electronic substrate 1
A heat conductive member 21 is provided on the opposite side through the heat exchanger 9, and the heat conductive member 21 is attached to the outer wall 8 of the personal computer so as to be thermally excellent. The heat generated from the semiconductor element 9 is transmitted to the outer wall 8 of the personal computer, and is conducted to the insertion portion 6 provided on the outer wall 8 of the personal computer. The subsequent heat path is the same as in FIGS. As a result, it can be seen that the noise generated from the main body of the personal computer hardly disappears when cooling the semiconductor element having high heat generation.

FIG. 5 shows a mounting diagram near the AC adapter 4 in FIG.

In FIG. 5, in the AC adapter 4,
An AC pump 22, which is a driving source of the cooling water, is mounted. The supply of electricity to the pump 22 is the same as the supply of electricity to the personal computer. It is also possible to drive a pump such as a piezoelectric element type using an AC type voltage. By providing the drive pump 22 in the AC adapter 4, no new power cable or the like is required. In the AC adapter 4, there is an original DC / AC converter in addition to the cooling water drive pump. The DC-converted electricity passes through the electric wiring cable high voltage side 12 and the electric wiring cable low voltage side 13.
Via the AC adapter 4. The direction of the cooling water 16 by the pump 22 passes through the cooling water outward path 14, becomes the cooling water return path 15 at the insertion portion of the personal computer described in FIGS. 2 to 4, and returns to the pump 22.

Next, FIGS. 6 to 8 show an embodiment of the cross-sectional shape of the water circulation cable 5. FIG.

6 and 8, the high voltage side 12 of the electric wiring cable and the low voltage side 13 of the electric wiring cable are located outside,
This is a case where the cooling water outward path 14 and the cooling water return path 15 are provided near the center. This can prevent the cooling path from being damaged due to external factors.

FIG. 7 shows a high voltage side 12 of an electric wiring cable.
This is an example in which four pipes of an electric wiring cable low voltage side 13, a cooling water outward path 14, and a cooling water return path 15 are bundled into one pipe. As a result, the existing technology can be used in terms of cost such as workability and works effectively.

As described above, according to the present invention, the heat generated from the semiconductor element is transmitted to the heat conducting member, the wiring layer of the wiring board, and the outer wall of the device, so that the locally generated heat can be spread. The temperature of the device can be reduced.

When a personal computer is used with an AC power supply, the heat generated by the heat conductive member, the wiring board wiring layer, and the outer wall of the device can be easily joined to the insertion portion for supplying electricity to the personal computer main body. Can be released outside.

Further, by using a water circulation cable as the electric cable of the AC adapter for supplying DC power to the insertion portion, the heat collected in the insertion portion can be transmitted to the cooling water, and the circulating water can be used. Heat can be released to the outside.

Further, by providing a pump for circulating the cooling water inside the AC adapter, a closed circuit of the cooling water can be easily realized, and it is not necessary to provide an air-cooling fan for local heat radiation, thereby reducing the noise of the equipment. Can be achieved.

Further, by driving the pump with the AC power of the AC adapter, it is possible to reduce the cost and improve the space efficiency without requiring a new power supply for the pump.

[0043]

According to the present invention, there can be provided an electronic device capable of efficiently cooling a semiconductor element without damaging a water circulation pipe.

[Brief description of the drawings]

FIG. 1 is a perspective view of a personal computer provided with the present invention.

FIG. 2 is a cross-sectional view of a water circulation cable connected to a personal computer of the present invention and around an insertion portion.

FIG. 3 is a cross-sectional view around a water circulation cable and an insertion portion for explaining another embodiment of the present invention.

FIG. 4 is a cross-sectional view around a water circulating cable and an insertion portion for explaining another embodiment of the present invention.

FIG. 5 is a sectional view around an AC adapter having a pump for driving a cooling water of a water circulation cable connected to the personal computer of the present invention.

FIG. 6 is a cross-sectional view of an electric supply cable and a water circulation cable having a cooling water passage separated from a single pipe.

FIG. 7 is a cross-sectional view of a water circulation cable individually having a power supply cable and a cooling water channel.

FIG. 8 is a sectional view of a water circulation cable having an electric supply cable and a cooling water channel composed of individual tubes.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Personal computer, 2 ... Keyboard, 3 ... Liquid crystal display, 4 ... AC adapter, 5 ... Water circulation cable, 6 ... Insertion part, 7 ... AC outlet, 8 ... Personal computer outer wall, 9 ... Semiconductor element, 10 ... Wiring connector, 11 ... Wiring cable,
12: High voltage side of the power supply cable, 13: Low voltage side of the power supply cable, 14: Cooling water outward path, 15: Cooling water return path, 16: Direction of cooling water, 17: Heat conducting member 1, 18 ...
Wiring layer, 19: Wiring board, 20: Wiring pin, 21: Thermal conductive member 2, 22: Pump, 23: AC cable, 24:
AC / DC.

Continued on the front page (72) Inventor Masaaki Nagashima 810 Shimoimaizumi, Ebina-shi, Kanagawa F-term in PC Division, Hitachi, Ltd. F-term (reference)

Claims (4)

[Claims] An electronic device comprising a substrate mounted in a case, a semiconductor element mounted on the substrate, and a keyboard mounted on the case, a heat conductive member connected to the semiconductor element. An electronic device, wherein a heat radiating means is connected to the heat conducting member, and the heat radiating means is detachable from the outside of the case. 2. An electronic device comprising a substrate mounted in a case, a semiconductor element mounted on the substrate, and a keyboard mounted on the case, wherein a heat conductive member connected to the semiconductor element is provided. An electronic device, wherein a heat radiating means is connected to the heat conducting member, the heat radiating means is detachable from the outside of the case, and the heat radiating means is a water circulation pipe. 3. The electronic device according to claim 2, wherein said water circulation pipe is provided integrally with a wiring connected to an AC / DC power converter. 4. The electronic device according to claim 3, wherein a pump for circulating water in the water circulation pipe is provided in the DC / AC converter.