JP2002016054A - Wafer-solvent pre-wet system - Google Patents

Abstract

(57) [Summary] To reduce polyimide consumption per semiconductor wafer as much as possible. A system for improving manufacturing, comprising:
It is characterized by including a polyimide solvent distribution nozzle near the polyimide distribution nozzle. In one embodiment, the polyimide solvent dispensing nozzle near the polyimide dispensing nozzle further comprises a polyimide solvent dispensing nozzle fitted with a three-dimensional adjustable bracket assembly. In one embodiment, the polyimide solvent dispensing nozzle with a three-dimensional adjustable bracket assembly further includes a bracket adjustable in x, y and z directions. In one embodiment, the polyimide solvent dispensing nozzle proximate the polyimide dispensing nozzle further comprises a polyimide solvent dispensing nozzle mounted on an arm holding the polyimide dispensing nozzle.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to quality control in the field of semiconductor wafers for producing integrated circuits.

[0002]

2. Description of the Related Art A high level of quality control is required for manufacturing and testing integrated circuits. Integrated circuits (ICs) contain hundreds to tens of millions of different electronic circuit elements (eg, transistors, resistors,
Microelectronic circuit composed of a capacitor or an inductor). A series of oxidations, embeddings, controlled deposition of materials, and selective removal of materials produce or form multiple ICs on a semiconductor wafer (also referred to as an integrated circuit wafer). The manufacture of integrated circuit wafers typically involves 200
More than ~ 400 different manufacturing steps are required. One particular manufacturing step is the controlled deposition of polyimide. Polyimide is a plastic coating typically used as a "stress buffer." Generally, polyimide is the last (or near last) coating applied to each semiconductor wafer. Upon completion of the fabrication process (eg, polyimide deposition), the wafer upon which the polyimide is deposited is divided into individual dies (ie, chips). Each functional die is then typically sold as an individual IC.

[0003] Polyimide is often described as a thermal stress buffer because it protects the dies produced from the wafer from thermal expansion. In addition, the polyimide acts as a cushion between the chip and the wrap (typically a black epoxy surrounding the chip). For example, a chip typically heats up and cools down during use (due to dissipation of electrical energy as heat), which causes the chip to expand and contract. Polyimide has the function of allowing polyimide-coated chips to undergo thermal expansion and contraction without undue damage. The polyimide also has the function of preventing the chip coated with the polyimide from being damaged by rubbing against the chip packaging material during the thermal expansion and thermal contraction of the chip as described above. Therefore, polyimide constitutes a very important part in most integrated circuits.

[0004]

Polyimides are relatively expensive materials. For example, between 1999 and 2000, the cost of polyimide averaged about $ 500 / kg.
In the related art, as long as each standard wafer requires about 3.0 g of polyimide per 6 inch wafer and each factory typically processes wafers that require about 20,000 polyimides per month, polyimide It is clear that the costs associated with are relatively high.

[0005]

SUMMARY OF THE INVENTION The present inventors have invented a system capable of reducing polyimide consumption per semiconductor wafer. In one embodiment, the system includes, but is not limited to, a polyimide solvent distribution nozzle near the polyimide distribution nozzle. In one embodiment, the polyimide solvent dispensing nozzle near the polyimide dispensing nozzle further includes, but is not limited to, a polyimide solvent dispensing nozzle fitted with a three-dimensional adjustable bracket assembly. In one embodiment, a polyimide solvent dispensing nozzle with a three-dimensional adjustable bracket assembly further includes, but is not limited to, an x-axis, y-axis, and z-axis adjustable bracket assembly. Not something. In one embodiment, the polyimide solvent dispensing nozzle near the polyimide dispensing nozzle further includes, but is not limited to, a polyimide solvent dispensing nozzle mounted on an arm holding the polyimide dispensing nozzle. In one embodiment, the polyimide solvent dispensing nozzle mounted on an arm holding the polyimide dispensing nozzle further comprises a polyimide solvent dispensed with an adjustable bracket assembly such that said polyimide solvent dispensing nozzle can be centered on a wafer holder. There is a dispensing nozzle and the like, but is not limited thereto. In one embodiment, a polyimide solvent storage container supplies liquid to the polyimide solvent distribution nozzle. In one embodiment, one or more dispensing / suction valves are inserted between the polyimide solvent dispensing nozzle and the polyimide solvent reservoir. In one embodiment, one or more pneumatic valves are inserted and operably connected between the polyimide solvent dispensing nozzle and the polyimide solvent reservoir.

[0006] The above description is a summary, and therefore, there is a simplified description, general description and deletion of the detailed contents as necessary. Thus, it will be apparent to one skilled in the art that the summary is illustrative only and is not intended to limit the invention in any manner. Other aspects, inventive features, and advantages of the present invention are defined solely by the claims, and will be apparent from the detailed description provided below. However, the present invention is not limited by the description.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be better understood, and its many objects, features and advantages will become apparent to those skilled in the art by referencing the accompanying drawings.

The use of the same reference symbols in different drawings indicates similar or identical items.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION

[0010]

The following is a detailed description of at least the best mode contemplated for carrying out the independent invention described herein. This description is for the purpose of explanation and should not be construed as limiting the invention.

I. Apparatus Referring to FIG. 1, the indices of FIGS. The index shown in FIG. 1 describes the parts of FIGS. 2-11 in the context of the Dainippon Screen 623 coater.
Dainippon Screen 623 Coater is a Japanese Raksai (RA
Dainippon Screen Mfg. With an office in KUSAI)
on Screen MFG. CO., LTD).

Although those skilled in the art have illustrated and described herein the equipment and processes in the context of the Dainippon Screen 623 coater, the use of the Dainippon Screen 623 coater is not intended for use in connection with a coater machine. It will be apparent that these are merely examples of such devices and processes performed.

Referring now to FIG. 2, the solvent distribution nozzle bracket 200 and the solvent distribution nozzle block 2
02 (these may be collectively referred to as “bracket assemblies”) as well as a solvent distribution line 204. In the upper part of FIG. 2, the polyimide distribution lines 206, 208 are shown. The particular system shown in FIG. 2 has two different types of polyimide (eg,
(Photosensitive and non-photosensitive). However, in the illustrated system, only one type of polyimide (non-photosensitive) is used, and such polyimide is dispensed from the polyimide dispensing line 206. It is shown in distribution line 206 with a yellow chemical.

Without an embodiment of the present invention, the Dainippon Screen 623 coater (again, merely as an example of a coating apparatus) would have a solvent distribution nozzle 300 (FIG. 2).
Is not visible to the naked eye because of the viewing angle; see Fig. 3)
The solvent distribution nozzle bracket 200 also includes a solvent distribution nozzle block 202 (as shown in FIG. 8 below,
Neither can be collectively referred to as a “bracket assembly”) nor does the solvent distribution line 204. Therefore, in order for the inventor to provide the solvent distribution capability to the Dainippon Screen 623 coater, the solvent distribution line bracket 204 and the solvent distribution nozzle bracket 200 capable of holding and accurately positioning the solvent distribution line 204 and the solvent distribution nozzle 300 (see FIG. 3). It was necessary to design a bracket assembly consisting of the dispensing nozzle block 202 so that the solvent dispensing nozzle 300 (see FIG. 3) could be centered in three dimensions. As discussed below, the solvent dispensing nozzle bracket 200 allows the solvent dispensing nozzle to move in two dimensions x and y (roughly equivalent (not exactly equivalent since FIG. 2 is a perspective view). No), but equally in the horizontal and vertical dimensions of FIG. 2, respectively.
That is, when the Dainippon Screen Coater 623 is fixed to the factory floor, the solvent distribution nozzle bracket 200 is considered to be able to move in the xy plane that is horizontal to the factory floor.) Can move in the third dimension z (almost the same in the front-back dimension of the drawing of FIG. 2, ie, when the Dainippon Screen Coater 623 is fixed to the factory floor, the solvent distribution nozzle block 204 Can move in the z-direction perpendicular to the factory floor). In operation of the system shown in FIG. 2, it is contemplated that there will typically be a semiconductor wafer (not shown) on the wafer holder 210 inside the cup 212 and the arm 214 will have a solvent distribution nozzle 300 (FIG. 3).
(See FIG. 1) is located at a position substantially at the center of the semiconductor wafer. The configuration is shown in FIG.

Referring to FIG. 3, the solvent dispensing nozzle 300 is mounted on the wafer holder 2 inside the cup 212.
The arm 214 is shown to be positioned substantially centered on the semiconductor wafer 302 on 10. Because the semiconductor wafer 302 looks "mirror-like" due to its highly polished nature, it also better illustrates what the lower surfaces of the solvent distribution nozzle block 202 and the solvent distribution nozzle 300 look like.

A polyimide dispensing nozzle 304 attached to arm 214 is shown. In one embodiment, the Dainippon Screen 623 coater has a number of preset positions (eg, four locations) where the arms 214 can be located. A solvent dispensing nozzle block 202 and a solvent dispensing nozzle bracket 204 are mounted on the arm 214 and at one or more of such pre-adjusted positions, the solvent nozzle 3
00 can be adjusted in three dimensions, and a polyimide solvent (eg, N
It is shown that the solvent nozzle 300 can be arranged so as to be able to dispense (MP) (1).
In embodiments, distributing the polyimide solvent near the center of the semiconductor wafer allows the solvent to cover the wafer relatively well.) One skilled in the art will appreciate that some devices have multiple arms similar to arm 214, which can be located somewhere on the semiconductor wafer to some extent. In embodiments having such a continuously adjustable arm, the nozzle assembly is designed such that it can be centered on the wafer when in position on the continuously adjustable arm.

Referring further to FIGS. 2 and 3,
In one embodiment, there is a means that allows a movement range of 1/2 to 1 inch, but in another embodiment, it is thought that some movement is possible, and the factory floor where the Dainippon Screen is placed is considered. The solvent distribution nozzle bracket 200 is designed to move in the x direction in a horizontal plane parallel to. In one embodiment, the solvent distribution nozzle block 202 is comprised of two main parts held together by bolts (see FIG. 9), the two main parts being the solvent dispersion lines 204 (1) between them. In an embodiment, it is a Teflon (registered trademark) line). In one embodiment, movement of the solvent dispensing nozzle 300 in a direction z perpendicular to a given xy horizontal plane horizontal to the factory floor loosens the bolt and moves the solvent dispensing nozzle 300 in the direction of the wafer holder 210 or the wafer. This is achieved by moving in a direction away from the holder 210.

Still referring to FIG. 3, a solvent drain 306 is shown. In one embodiment, the solvent drain 306 is used to connect the arm 214 to the solvent drain 306.
When moving to the upper non-operation position, that is, the home position,
The solvent that accidentally spills from the solvent distribution nozzle 300 is captured.

Referring to FIG. 4, one of the solvent chemical supply systems executed by the Dainippon Screen 623 coater will be described.
FIG. 3 shows a perspective view of an embodiment. In one embodiment, the unused chemical backside cleaning subsystem of the Dainippon Screen 623 coater was used as a solvent chemical supply system to reduce costs. However, those skilled in the art will:
It will be appreciated that other embodiments can be achieved by purchasing and installing the parts needed to basically replicate the functionality of the chemical backside cleaning subsystem described herein (one skilled in the art). Then, it can be understood that “backside cleaning” is an operation of spraying a chemical on the backside of the semiconductor wafer to prevent the coating from surrounding the backside of the wafer or riding on the backside.) Thus, the unused backside cleaning subsystem has all of the components normally used in dispensing chemicals (chemical reservoirs, pressurizers and associated controls), thus eliminating the need for solvent distribution systems. Effective when used as a part.

Illustrated is an NMP pressure canister 400 (in one embodiment, the solvent dispensed is the polyimide solvent N-methylpyrrolidone, which is referred to herein as "NMP"). . In one embodiment,
NMP pressure canister 400 is an 18 liter pressure canister. The figure shows the NMP pressure canister 40
0 indicates that the NMP trap tank 402 is pressurized or filled. The function of the NMP trap tank 402 (in one embodiment, the existing trap tank associated with the existing backside cleaning subsystem) is a function of the NMP trap tank 402.
Senses the empty state of the chemical (and thus is used in one embodiment to alert the NMP pressure canister 400 is empty).

In the figure, the NMP trap tank 402
It is shown feeding into an existing filter housing with a filter 404. The NMP is typically for semiconductors, but in one or more embodiments, when making a connection to the NMP pressure canister 400 (by adding a new canister, the NMP trap tank 402 is empty). (E.g., when additional NMP is introduced into the system when this is indicated), the NMP is further filtered as impurities may be introduced into the chemical stream. And again, in one embodiment, the cost is reduced by using the existing unused back surface cleaning system of the Dainippon Screen 623 coater, but in another embodiment, as shown in FIG. It is thought that a system similar to the above can be obtained.

Referring to FIG. 5, there is shown a perspective view of the underside of a portion of the Dainippon Screen 623 below the part of the arm 214 of FIGS. 2 and 3 in which the solvent distribution line 204 passes inward to the Dainippon Screen 623 coater. It is shown. In the figure, an NMP supply line 500 and an NMP distribution / suction valve 502 are shown. In one embodiment, N
The MP supply line 500 is a Teflon line connected to the NMP filter 404 of FIG. 4, as can be seen from the piping diagram of FIG. 6 described below.

In one embodiment, the NMP supply line 500
Is pressurized by NMP. To control the dispensing of pressurized NMP, in one embodiment, the dispensing / suction valve 5
02 is opened and closed so that the chemical flows out through the solvent dispensing nozzle 300. In one embodiment, the dispensing / suction valve 502 is actually a pneumatic Teflon diaphragm valve manufactured by CKD (the exact part number of the valve used is shown in FIG. 7 below with a parts list). It is in). Those skilled in the art will appreciate that the valves listed in the parts list are widely used in the semiconductor industry, are very reliable valves, and are often used for distribution.

In one embodiment, a bracket holds the dispensing / suction valve 502. The bracket is generally below the cup 212 shown in FIGS.
It should be noted that in one embodiment, it is desirable to have dispensing / suction valve 502 as close as practical to the dispensing location to increase the probability of acceptable suction. One of ordinary skill in the art will understand that the term "suction" refers to the process of "suctioning" any chemical as it is dispensed onto the wafer so that undesired chemicals do not drip onto the wafer after dispensing. It will be understood that this is used to explain To prevent such accidental drip, valves such as the dispensing / suction valve 502 are designed with suction capability. That is, when such a valve has finished dispersing, the valve draws back the liquid dispersed by the valve from the line. It should be noted that in one embodiment, the appropriate suction valve parameters were determined by trial and error so that the suction behavior was very reproducible and robust. In one embodiment, it was observed that without gentle aspiration, the system was likely to drip. It should be noted that the suction parameters depend to a large extent on the properties of the liquid, the temperature and the frequency of operation of the system. Therefore, the industry standard practice for determining appropriate aspiration parameters is:
This is due to the empirical process described above.

Referring to FIG. 5, in one embodiment, the suction parameter is the NMP dispersion / suction valve 5
02 was adjusted by a speed controller, such as the speed controller 506 associated with the H.02. A speed control device such as the speed control device 506 controls the opening / closing speed of the NMP dispersion / suction valve.

FIG. 5 further shows a pneumatic system 504 and a dispersion / suction valve 502 for controlling the opening and closing of the NMP dispersion / suction valve 502 by applying air pressure to the pneumatic system 504.
Shows an associated speed controller 508 for.
Controlling the air pressure in the pneumatic system 504 is an existing logic on the Dainippon Screen 623 associated with an unused backwash system. In one embodiment, the logic is:
The use of a signal to control the supply of air to a solenoid valve that opens an AOV (pneumatic valve),
The AOV is used in a backflow system and has been converted to function as a polyimide solvent dispersion system to provide pressurization in the pneumatic system 504.
Is used to control the dispersion / suction valve 502. Thus, in the breakdown of the backflow in column C2 in the flow chart (the programming used to control the Dainippon Screen 623 coater), the AOV is opened by signal drive, which activates the dispense / aspirate valve 502.
The procedure table is described below with reference to FIGS. That is, in the procedure described below, when a command is given to dispense the backflow, the Dainippon Screen 623 coater machine considers its backflow distribution.
Opening 02 controls the start and stop of the distribution associated with the dispersion / suction valve 502.

Referring to FIG. 6, there is shown a plumbing diagram 600 of the embodiment described above with respect to FIGS. If applicable, use the reference numbers to refer to the parts in the piping diagram in FIG.
5 correspond to the corresponding parts. Other numbers in FIG. 6 correspond to the parts list shown in FIG. Components not labeled in FIG. 6 or appearing in FIG. 7 are existing components on the Dainippon Screen 623 coater (eg, NMP trap tank 402). Piping diagram 600
2 shows a pneumatic (air) pipe and a control method of an air pipe system, and shows a liquid pipe system and a control method of the liquid pipe system. It should be noted that in the very far lower right corner of FIG. 6, the arrow labeled “Distribution” represents the solvent dispersion nozzle 300.

In FIG. 6, different colors and different pattern lines are used to illustrate the presence of different substances in pneumatic and liquid piping. For example, in the description below in FIG. 6, a short blue dashed line in the piping diagram indicates a piping through which N ₂ (nitrogen) flows,
A long green dashed line indicates a pipe for flowing exhaust gas, a red two-dot chain line indicates a pipe for flowing CDA (clean dry air), and a solid black line indicates a pipe for flowing a polyimide solvent (NMP). It should be noted that some parts separated in the piping diagram are drawn with solid black lines for practical reasons, but which lines indicate the piping and which lines are simply Whether it is used to draw or describe a part (eg, NMP pressure canister 400 is drawn in solid black) will be apparent from context.

FIG. 6 has a note indicating the inner and outer diameters of the piping. For example, the exhaust line 602 near the center of FIG. 6 is marked as having a size of φ8 / φ6. This note, ie φ Outer Diameter / φ Inner Diameter, indicates that the depicted pipe has an outer diameter of 8 mm and an inner diameter of 6 mm. Other notes used in FIG. 6 should be interpreted similarly. For those skilled in the art, φ “outer diameter” / φ
It will be apparent that "inner diameter" is heavily used in the art.
With respect to the symbols used in FIG. 6, those skilled in the art will recognize that such symbols are of the type commonly used in the art to represent components such as filters, speed controllers, valves and the like. It will be obvious.

Referring to FIG. 7, there is shown a parts list related to the numbered arrangement in FIG. The manufacturer of each listed part, the amount paid for each part, and the part number of the manufacturer associated with each part are shown.

Referring to FIG. 8, the solvent distribution nozzle block 202 and the solvent distribution nozzle bracket 200
Various views of a solvent dispensing nozzle bracket assembly 800 are shown. At the right end of FIG. 8, a first isometric view (perspective view) of the solvent dispensing nozzle bracket assembly 800 is shown. 8, a second isometric view of the solvent dispensing nozzle bracket assembly 800 (first
(Plan view of FIG. 2). At the bottom center of FIG. 8, a third isometric view (second plan view) of the solvent distribution nozzle bracket assembly 800 is shown. 8 shows an isometric view (plan view) of the front and back portions of the solvent distribution nozzle block 202. Further, FIG.
The isometric view of the Dainippon Screen 62 in one embodiment
Shown is how to position the solvent distribution nozzle bracket assembly 800 on the third arm 214 (the arm 214 is shown in FIGS. 2 and 3).

Referring to FIG. 9, the solvent distribution nozzle bracket 200 and the solvent distribution nozzle block 202
1 shows a manufacturing drawing for one embodiment of FIG. In the upper left quadrant of FIG. 9, a manufacturing drawing of the components of the solvent distribution nozzle block 202 is shown. Solvent distribution nozzle block 202
2 and 3 correspond to moving the solvent distribution nozzle 300 in FIG. 3 in the front-rear direction with respect to the semiconductor wafer 302 shown in FIG. In the discussion of the z-axis. The solvent distribution nozzle block 202 shown in FIG. 9 is adjusted to provide a solvent distribution line 204 (in one embodiment, a Teflon line).
Of the solvent distribution nozzle block 20
Adjustment of the two illustrated two bolts allows the solvent distribution line 204 to slide up and down relative to the nozzle block assembly 800, and thus the solvent distribution nozzle 300.

Referring again to FIG. 9, the upper right quadrant of FIG. 9 includes a solvent dispensing nozzle bracket 20 that allows movement in the X-axis direction as described with respect to FIGS.
There is a production drawing of the part of 0. The upper right quadrant of FIG. 9 shows a grooved orifice 900 formed by a portion 902 of the solvent distribution nozzle bracket 200 that is flat in the x-z plane, which is extended by bolts (not shown). The solvent distribution nozzle bracket is adjustable in what is described as the X axis in FIG.

Referring again to FIG. 9, in the lower right quadrant of FIG. 9 is a manufacturing drawing of a portion of the solvent distribution nozzle bracket 200 that allows movement in the Y-axis direction as described with respect to FIG. The lower right quadrant of FIG. 9 includes a portion 90 of the solvent distribution nozzle bracket 200 that is flat in the y-z-axis plane.
Shown is a grooved orifice 904 formed at 6, which is extended by bolts (not shown) to allow the solvent distribution nozzle bracket to be adjusted in what is described as the Y axis in FIG.

Here, the point to be repeated again is as follows.
The axes described above relate to the above figures (eg, FIGS. 2 and 3), and when looking at the machine of FIG. 2 sitting on a factory floor, x-
The y-axis direction indicates a direction parallel to the factory floor, and the z-axis direction indicates a direction perpendicular to the factory floor.

Referring to FIG. 10, there is shown a manufacturing drawing of a bracket to which an NMP pre-wet valve is attached. This bracket is shown in FIG. 5 and is a bracket that holds two illustrated dispense / suction valves (eg, dispense / suction valve 502) on a Dainippon Screen 623 coater machine (one of ordinary skill in the art Japan Screen 623
It will be appreciated that the coater machine has two substantially identical "fluids", each fluid path being constructed to allow for dispensing of the polyimide. Thus, in one embodiment of the systems and processes described herein, there is also a dual polyimide solvent distribution system for dual channels. However, for clarity, only one fluid path is discussed herein. That is, on the Dainippon Screen 623 coater machine just to the left of what is shown and described in connection with what is shown in FIGS. 2-4, which is a reproduction of the system described herein in its most substantial aspect. There are two dispensing / suction valves in FIG. 5 since there is an identical assembly in FIG. ).

Referring to the bracket positioning shown in FIG. 10, for the Dainippon Screen 623 coater machine, the location selected for positioning is substantially below the cup associated with each dispensing / suction valve shown in FIG. (Note that there are two cups supporting two fluid channels, but only one is shown in the figure for clarity).

Referring now to FIG. 11, there is shown a manufacturing drawing for the solvent drain 306 shown and described with respect to FIG. The function of the solvent drain 306 is to function if a contingency occurs when the solvent dispensing nozzle 300 is unused (e.g., when the valve breaks or the nozzle is in the "home" position (i.e., on the solvent drain 306)). Or if someone activates a dispensing valve), the task is to trap the solvent from the solvent dispensing nozzle 300. As shown in FIG. 3, the solvent drain 306 captures solvent that was accidentally released from the solvent dispensing nozzle 300 and such a leaked liquid would be considered to occur in the absence of the solvent drain 306. The solvent drain 306 is arranged to allow such accidental spills to re-flow to the drain of the Dainippon Screen 623 coater machine, rather than causing it to run down the machine. The existing Dainippon Screen 623 coater machine drain has two existing polyimide nozzles 206, 2 on the machine.
The solvent drain 306 is necessary because only the protection of 08 is performed.

The above embodiments herein have been described with reference to a Dainippon Screen 623 coater machine for clarity. In the art, the Dainippon Screen 623 coater machine is merely illustrative and many of the different systems in which the embodiments described herein may be useful (e.g., other polyimide dispensing systems). Configuration and model). Further, although only the polyimide process is described herein, the embodiments described herein are useful for other coating systems with minor modifications within the purview of those skilled in the art. It is possible that this will become apparent.

II. Steps Referring to FIG. 12, (1) Unmodified Dainippon 623
A procedure table 1200 containing a procedure used to control the dispensing of 1.3 g of polyimide from the coater, and (2) in one embodiment, used with the modified Dainippon Screen 623 system described above with respect to FIGS. Shown is a screen print taken from a Dainippon Screen 623 coater of Procedure 1250, which includes a procedure for controlling both the dispensing of polyimide solvent (NMP) and the subsequent dispensing of 1.3 g of polyimide.

It should be understood that unless the polyimide solvent is distributed, an acceptable semiconductor wafer will generally not be obtained in the procedure shown in Procedure 1200 because the amount of polyimide distributed will not sufficiently cover the wafer. Will be done. However, when the polyimide solvent pre-wet process shown in the procedure table 1250 is performed, when the polyimide solvent pre-wet is performed, the semiconductor wafer is sufficiently covered with the amount of the polyimide to be distributed. Is obtained. Procedure tables 1200 and 1250 are shown side by side to highlight the advantages associated with the polyimide solvent (eg, NMP) pre-wet procedure.

Referring to FIG. 13, a procedure table 120 will be described.
FIG. 147 is a diagram showing main items 1204 explaining which of the various entries at 0 and 1250 are related.
Further, the main item 1204 is the procedure table 130 shown in FIG.
0 and 1350 can also be used and describe which of the various entries in the procedure table are relevant.

The arrangement of procedure tables 1200 and 1250 is as follows:
Each of the columns in each of the first columns is intended to represent a separate step in the procedure table (other than the first column indicating what the column entries are for; e.g., "Step N") (Column 1
N is 1, 2, 3,... 8), the rotational speed in row 2 and the times T1 and T2 in rows 3 and 4). "SP" in procedure tables 1200 and 1250 respectively
The arrangement of the individual second columns labeled "IN N" is such that each column has such a procedure table (eg, procedure tables 1200 and 125).
0) the rotational speed in revolutions per minute (RPM) of the semiconductor wafer for each corresponding procedure table stage N in the first individual column of 0). Dainippon Screen 62
It will be apparent that, due to the uniqueness of the three coater user interface, the indicated value must be multiplied by 10 in order to get the true RPM from the indicated value. For example, in the procedure table 1200, the RPM of the stage 4 is 1
75 × 10 = 1750 RPM, and the RPM of stage 7 of procedure 1200 is 500 × 10 = 500
It is considered to indicate 0 RPM. The arrangement of the individual third columns of the procedure tables 1200 and 1250, each labeled "T1", such that each column represents the number of seconds in which the transition from the previous stage to the current stage rotational speed (RPM) occurs. (For example, in stage 3 of the procedure table 1200, the rotation speed is 0 (the rotation speed in the stage 2 of the procedure table 1200) to 500 RPM (the rotation speed in the stage 3 of the procedure table 1200) for 0.5 seconds. Should rise). Procedure table 1
The arrangement of each fourth column, labeled "T2" at 200 and 1250, respectively, is such that each column indicates the total time in seconds with respect to the predetermined number of revolutions in stage N (e.g., the procedure). Step 3 of Table 1200 lasts a total of 15.5 seconds, followed by a rotation speed of 500 RPM of 15.0 seconds and a 0. 0 RPM required for the system to rise from 0 RPM to 500 RPM.
Five seconds must be obtained. Similarly, step 3 of the procedure table 1250 should last for a total of 1.0 second, and then at a rotational speed of 200 RPM for 1.0 second with a rise time of 0.0 second. ). That is, the total time involved in each stage N is T1 + T2.

Each of the seventh to fourteenth columns “C1 to C8” in the procedure tables 1200 and 1250 is described in the Dainippon Screen 62.
"Chemicals" on three coaters (again, if you are a person skilled in the art,
"Chemical" generally refers to something used in some process, and thus may refer to actual chemicals such as NMP or polyimide, may refer to vacuum,
(It may be understood that it may mean "reverse blow" etc.)), which represents a dispensing system, many of which have a reservoir in which chemicals can be placed and dispensed. Columns "C1" of procedure tables 1200 and 1250-
For "C8", the presence or absence of a number in such a column indicates that the chemical is dispensed from such a system. For example, to describe the procedure table 1250, in the column 8 of the table described as “C2” and the column described as “Stage 5”, there is a number “1”. Main matters 1204
, The numeral “1” represents the chemical “polyimide”. Thus, the presence of a "1" in the column labeled "Step 5" in the column labeled "C2" indicates that the chemical polyimide is dispersed over the period of Step 5 (eg, 7.5 seconds). (E.g., from the polyimide dispersing nozzle 304). By way of further example, referring further to procedure table 1250, it should be noted that steps 6 and 7 in the column labeled "C2" have the number "8", which indicates the operation of "Exhaust Damper Close". (A person of ordinary skill in the art would also understand that it also usually refers to operations such as those described above as "chemicals.")
Is equivalent to In that case, such "chemicals" would be "dispensed" over the period of steps 6 and 7 of procedure table 1250.
Is done.

"M1" in procedure tables 1200 and 1250
The individual fifteenth row, labeled as, is the arm 2 associated with the groove.
14 illustrates the positioning of a polyimide dispensing nozzle 304 mounted on 14 (or another subsystem capable of operating and processing on a semiconductor wafer). For example, Dainippon Screen 623 coater has two grooves, each track having an arm, a polyimide dispensing nozzle, a series of chemical dispensing systems, and the like. Therefore, in order to accurately describe the procedure table, the Dainippon Screen 623 coater is told which groove (and therefore which combination of nozzles) to use for the operation described in the column of the procedure table (corresponding to the process step). It is necessary. Thus, it should be understood that substantially all of the process steps described herein will be re-performed in the second groove of the Dainippon Screen. For ease of understanding, all of the procedure tables in this specification are for the groove 1. However, it should be understood that such a procedure is applicable to the groove 2 as well.

Each of the sixteenth and seventeenth columns labeled “P1x” and “Ply” is the Dainippon Screen 6
The xy position of the polyimide dispensing nozzle 304 mounted on the arm 214 in a predetermined coordinate system of 23 machines (the xy position of which is approximately equal to the x and y position described above with respect to FIGS. 1-11). (Thus, the position of the solvent dispersion nozzle 300 since the polyimide distribution nozzle 304 and the solvent distribution nozzle 300 are arranged on the arm 214 in the form shown in FIG. 3 and other figures in this specification) It is. In one embodiment (eg,
As shown in FIG. 3 above, the solvent distribution nozzle 300 and the polyimide distribution nozzle 304 are located at substantially the same y-axis position, but are separated by approximately 36 mm in the x-axis direction (xy positions are shown in FIGS. 11 is substantially equal to the position in the x-axis direction and the y-axis direction described above with reference to FIG. However, it should be understood that while the relative position varies from machine to machine, the intention of relative positioning is to separate the solvent distribution nozzle 300 and the polyimide distribution nozzle 304, as follows. At an appropriate stage in the described flow chart, the aim is to allow the solvent dispensing nozzle 300 to be substantially centered on the wafer.

The meaning of the remaining columns not specifically described herein is shown in the main item 1204.

Referring again to FIG. 12, with respect to Procedure Table 1250, steps 1-4 are polyimide solvents (eg,
(NMP) distribution pre-wet procedure. In stage 1, the positions [P1x = 2, P1y =
0], the polyimide dispensing nozzle 304 of the arm 214 at
The acceleration of a semiconductor wafer associated with a solvent distribution nozzle (eg, solvent distribution nozzle 300) associated with (M1 = 1) is described. That is, the rotation speed changes from 0 RPM to 2000 RPM in 0.5 second (T1), and thereafter, the rotation speed is reduced to 2.0
2,000 RPM for a total of 2.5 seconds (T2). Stage 2
In position [P1 over 2 seconds (in one embodiment, this corresponds to a 2 mL distribution of the polyimide solvent NMP)
x = 2, P1y = 0] (in one embodiment, approximately corresponding to the center of the semiconductor wafer) polyimide solvent NMP (C2) with solvent distribution nozzle associated with polyimide distribution nozzle 304 (M1 = 1) of arm 214 Is described. Meanwhile, the rotation speed is kept constant at 2000 RPM. Stage 3 involves 200 semiconductor wafers.
While continuing the rotation at 0 RPM for 1.0 second, the position [P1
x = 3, P1y = 0] is described as moving the nozzle associated with the polyimide dispensing nozzle 304 of the arm 214 (M1 = 1). Step 4 includes an additional 4.5
Continuous rotation of the semiconductor wafer at 2000 RPM over a second is described. It should be noted that semiconductors
There is a 0.5 second "rise" time, even though it continues to spin at a constant speed of 000 RPM. Such a rise time is due to the peculiarity of the Dainippon Screen 623, and if the rise time of 0.5 seconds is not inserted, when going from Step 4 to Step 5, the Dainippon Screen May introduce error conditions (although this is not always the case). Such a rise time, as shown herein, where the rotational speed is shown to be constant, exists to correct for the described specificity.

Still referring to the procedure table 1250, step 5 is very similar to step 1 of the procedure table 1200, where the polyimide (chemical "1" in the main item 1204) is the polyimide dispensing nozzle 304 of the arm 213.
(M1 = 1) and distributed on a fixedly held semiconductor wafer (rotation speed 0 RPM in column SPIN N)
(Shown as "1" in column C2 indicating that the main item 1204 is associated with the polyimide distribution)
Indicated by the presence of). Thereafter, the remaining steps of the procedure table 1250 show operations necessary for rotating the semiconductor wafer so that the polyimide is diffused and covers the semiconductor wafer by the specific operations listed in each step.

Step 5 of procedure table 1250 and procedure table 1200
It is evident from a comparison of step 1 of the above that such steps are substantially the same, and as described initially, both procedure listings describe the distribution of 1.3 g of polyimide. However, by comparing the remaining groups of steps 6-11 of the procedure table 1250 with the similarly functional groups of steps 2-8 of the procedure table 1200, the subsequent groups used to diffuse the polyimide onto the semiconductor wafer The energy of
In comparison with what is necessary in the procedure table 1200, the procedure table 125
It can be seen that 0 is lower.

The above discussion mainly focuses on polyimide 1.3.
Procedure Tables 1200 and 12 Selected for Description of g Distribution
The focus was on 50. For the 1.3 g version of the polyimide solvent pre-wet / polyimide distribution, steps 1 to
By dispensing and diffusing 2 mL of NMP with 4, the required amount of polyimide dispensed in step 5 is 3.0 g (this is the acceptable performance from semiconductor wafers without polyimide solvent (eg NMP) prewetting) / Required for obtaining the yield), and it is possible to obtain a performance / yield of the semiconductor wafer which is equal to or more than that of using 3.0 g of polyimide in the absence of the polyimide solvent. it can. The dispense time (T2 = 7.5 seconds) shown in step 5 of the pre-wet procedure table 1250 for 1.3 g of polyimide relates to the dispense as close as practical to polyimide 1.3. . Such time depends on the viscosity of the polyimide used. In one embodiment, the viscosity of the polyimide used is about 3500 cps at 25 ° C., and such a polyimide is commercially available from Toray, which has offices in Japan. However, those skilled in the art will appreciate that polyimide viscosity ranges in the art are about 1000-8000.
You will recognize that it is cps. In addition to it,
As previously described, the procedure tables 1200 and 1250 shown are for the Dainippon Screen 623 coater machine. Dainippon Screen Mfg. Has an office in RAKUSAI, Japan.

Referring to FIG. 14, (1)
Polyimide 1.1 from Unmodified Dainippon 623 Coater Machine
A procedure table 1300 containing the procedure table used to control the dispensing of 5 g and (2) a polyimide solvent (1) used in conjunction with the modified Dainippon 623 coater machine system described above in connection with FIGS. Nippon Screen 6 of Procedure 1350, which includes a procedure to control both the dispensing of NMP) and the subsequent 1.15 g of polyimide.
3 shows a screen print taken from a 23 coater.

Comparing Procedure Table 1300 and Procedure Table 1200 individually and comparing Procedure Table 1350 and Procedure Table 1250 individually, the polyimide distribution step (Procedure Tables 1200 and 1)
The 1.3g protocol (procedures 1200 and 1250) is substantially the same as the 1.15g protocol (1300 and 1350) except for the fact that step 1 at 300 and step 5) at procedure 1250 and 1350 change. It turns out that it is the same. Specifically, the distribution time in the procedure tables 1300 and 1350 in FIG. 14 described as the column “T2” is 5.5 seconds, and in the procedure tables in FIG. 12 and FIG. It is described as "T2" and is 7.5 seconds.

In addition, as long as the 1.15 g polyimide procedure (1300 and 1350) and the 1.3 g polyimide procedure (1200 and 1250) have common entries, the discussion of the 1.3 g polyimide procedure is: The same applies to the 1.15 polyimide procedure. For example, in a 1.15 g version of the polyimide pre-wet / polyimide dispensing process (ie, Procedure Table 1350), dispensing 2 mL of a polyimide solvent (eg, NMP) can reduce the amount of dispensed polyimide to 1.15 g; Moreover, performance / yield equivalent to or higher than the case of using 3.0 g of polyimide usually used in the absence of a polyimide solvent can be obtained with a semiconductor wafer. With respect to the distribution time (T2 = 5.5 seconds) shown in FIG. 1350 relating to the distribution of 1.15 g of polyimide, such time was determined empirically by trial and error. It should be understood that the dispensing time shown in step 5 of the prewetting procedure table for 1.15 g of polyimide (eg, T2 =
5.5 seconds) relates to a distribution as close as practical to polyimide 1.15. Such a time
It depends on the viscosity of the polyimide used. In one embodiment, the viscosity of the polyimide used is about 350 at 25 ° C.
0 cps, and such polyimides are commercially available, especially from Toray, which has offices in Japan. However,
One skilled in the art will recognize that the polyimide viscosity range in the art is about 1000-8000 cps. In addition, as previously described, the procedure shown is for the Dainippon Screen 623 coater machine. Dainippon Screen Mfg. Has an office in Laksai, Japan.

Those skilled in the art will appreciate that the exact time required to reach the above amounts of polyimide solvent (eg, 2 mL) and polyimide (eg, 1.3 and 1.15 g) depends on
It will be appreciated that it will vary with viscosity, temperature and other factors.

In addition, those skilled in the art will appreciate that the polyimide solvent (eg, NMP) to be dispensed and / or the dispensing time and / or amount for the polyimide may be determined by the semiconductor wafer in the spirit of the description herein. It will be appreciated that the permissible performance / yield can be varied to obtain acceptable performance / yield. Those skilled in the art will recognize that what constitutes acceptable performance / yield is design choice that varies between manufacturers and products. Further, in some cases, a visual inspection can indicate when a plate with the above steps does not work. For example, a polyimide solvent (eg, NMP) pre-wet (Procedure Table 12)
If the polyimide 1.3 is dispensed without performing (e.g., 00), a visual inspection can often indicate that the polyimide has not completely covered the semiconductor wafer portion.

Acceptable performance / yield is a design choice that varies between manufacturers and products. For test data related to the equipment and processes described herein,
That description herein has referred to the acceptable performance and behavior of the semiconductor wafer. Those skilled in the art will recognize that what constitutes acceptable performance / yield is design choice that varies between manufacturers and products. One set of test data having what appears to be acceptable performance is shown in FIG.

Referring to FIG. 15, there is shown one set of test data showing what appears to be acceptable performance in one embodiment. With respect to the test data obtained from limited lot production in 1a, certain major memory products are often used for testing, and the memory products are considered disposable because of their low cost. Regarding the test data, “EFT” represents a simple function test. "Die per wafer" represents the actual number of final dies per wafer, and "TBT" is a type of "burn in" test that involves failure under thermal cycling.
n) "represents the test. "ET1" is a test similar to TBT, but only ET1 is a relatively long-term (time-wise) test.

Referring to FIG. 16, the above-mentioned 1.3 g pre-wet procedure table in comparison with the case of 3.0 g required to obtain an acceptable semiconductor performance / yield when the polyimide solvent pre-wet is not performed. Calculations showing some aspects and advantages related to are provided. One of ordinary skill in the art will recognize that similar calculations can be similarly obtained for a 1.15 g pre-wet procedure using mathematical operations within the skill of the art (eg, calculations). 1.3 g is replaced by 1.15 g).

Those skilled in the art will understand that Dainippon Screen 623
It will be appreciated that the coater will have many built-in and / or associated computing equipment, and such computing devices will typically include one or more processing units (eg, a main processing unit, a graphics processing unit, a sound processing unit). Devices, such as, but not limited to, one or more memories (RAM, DRAM, ROM) and one or more communication devices (eg, network cards or modems (optical or electronic)). .

In the above detailed description, various embodiments of the present invention have been described using block diagrams, flowcharts, and examples. Each of the block diagram components, flowchart steps and operations and / or operations described using the embodiments.
Or, it will be understood by those skilled in the art that the components may be implemented individually and / or collectively by a wide variety of hardware, software, firmware, or any combination thereof.
In one embodiment, the invention can be practiced using a Dainippon Screen 623 coater machine as described above. However, one of ordinary skill in the art will appreciate that the embodiments disclosed herein may be wholly or partially implemented in application specific integrated circuits (AS).
IC), on a standard integrated circuit, as a computer program running on a computer, as firmware, or substantially any combination thereof, and the circuit design and / or software or It will be appreciated that writing firmware code is considered to be within the skill of those in the art in light of the present disclosure. Further, those skilled in the art will recognize that the features of the present invention can be distributed as program products in various forms, and that the illustrated embodiment of the present invention will have the signals used to actually make that distribution. It will be understood that they are equally applicable independent of the particular type of medium. Examples of a medium having a signal include a floppy disk, a hard disk drive, and a CD-RO.
M, recordable media such as digital tape, and TD
This includes, but is not limited to, transmission-type media such as digital and analog communication links using communication links based on M or IP (eg, packet links).

The above embodiment shows various components included in or related to other various components. It should be understood that such configurations shown here are merely examples, and many other configurations are possible that actually achieve the same function. For the most part, but not explicitly, the arrangement of components to achieve the same function is effectively "associated" to achieve the desired function. Thus, any two components that are combined herein to achieve a particular function are "related" to each other so that the desired function is achieved without regard to configuration or intermediate components. It can be seen that it has been obtained. Similarly, two such related components are “operably linked” or “operably linked” to one another to achieve a desired function. You can also.

[0063] Other embodiments are within the following claims.

As described above, the specific embodiments of the present invention have been explicitly shown and described, but changes and modifications can be made based on the description of the present invention without departing from the present invention and its relatively wide aspects. It is therefore intended that the following appended claims include all such changes and modifications as fall within the true spirit and scope of the invention, and that
It will be clear to those skilled in the art. Furthermore, it is to be understood that the invention is limited only by the appended claims. It should be understood by those skilled in the art that if a specific number of claimed elements is intended, such an intention is clearly indicated in the claim and such description Without it, there is no such intention. For simplicity, for example, in the appended claims, the introductory expressions "at least one" and "one or more" may be used to introduce claim elements. However, the use of such expressions
Even if the same claim contains indefinite articles such as the introductory phrase "one or more" or "at least one" and "one" or "a", the indefinite article "one" or "a" The introduction of a claim element shall not be construed as suggesting that a particular claim, including such an introductory claim element, is limited to the invention containing only one such element. It is also the case for the use of definite articles used to introduce claim elements. Furthermore, even if the specific number of an introductory claim element is explicitly stated, one of ordinary skill in the art will recognize that such description is usually construed to mean at least the stated number. (Eg, if there are no other modifiers and the term "two elements" is used, it usually means at least two elements or two or more operations).

[Brief description of the drawings]

FIG. 1 is an index of FIGS.

FIG. 2 shows a solvent distribution nozzle bracket 200 and a solvent distribution nozzle block 202 (these are collectively referred to as
FIG. 3 illustrates the “bracket assembly”) as well as the solvent distribution line 204.

FIG. 3 shows a state in which the solvent dispensing nozzle 300
FIG. 4 is a view showing that an arm 214 is arranged so as to be substantially at the center on a semiconductor wafer 302 on a wafer holder 210 inside the wafer holder 2.

FIG. 4 is a perspective view of one embodiment of a solvent chemistry supply system implemented in a Dainippon Screen 623 coater.

FIG. 5 is a perspective view showing the underside of a portion of the Dainippon Screen 623 below a part of the arm 214 of FIGS. It passes inside the coater.

FIG. 6 shows a plumbing diagram 600 of the above-described embodiment relating to FIGS.

FIG. 7 shows a parts list related to the number assigned in FIG. 6;

FIG. 8 shows various views of a solvent distribution nozzle bracket assembly 800 comprising a solvent distribution nozzle block 202 and a solvent distribution nozzle bracket 200.

FIG. 9 shows a manufacturing drawing for one embodiment of a solvent distribution nozzle bracket 200 and a solvent distribution nozzle block 202.

FIG. 10 is a manufacturing view of a bracket to which an NMP pre-wet valve is attached.

FIG. 11 shows a fabrication drawing for the solvent drain 306 shown and described in connection with FIG.

FIG. 12 is a flow chart 1200 including (1) a flow chart used to control the distribution of 1.3 g of polyimide from an unmodified Dainippon 623 coater, and (2) 1
In an embodiment, the Dainippon Screen 623 coater of the procedure chart 1250, which includes a procedure chart for use with the modified Dainippon 623 coater equipment system to control both the dispensing of the polyimide solvent (NMP) and the subsequent 1.3g of polyimide. FIG. 4 is a view showing a screen print taken from the above.

FIG. 13 is a diagram showing main items 1204 for explaining what various entries in the procedure tables 1200 and 1250 are related to.

FIG. 14 is a procedure chart 1300 including (1) a procedure chart used to control the distribution of 1.15 g of polyimide from an unmodified Dainippon 623 coater, and (2)
In one embodiment, Dainippon Screen 623 of Flow Chart 1350, which includes a flow chart for use with a modified Dainippon 623 coater system to control both the dispensing of polyimide solvent (NMP) and subsequent 1.15 g of polyimide. FIG. 4 shows a screen print taken from the coater.

FIG. 15 shows one set of test data showing what appears to be acceptable performance in one embodiment.

FIG. 16 relates to the above 1.3 g pre-wet procedure compared to 3.0 g needed to obtain acceptable semiconductor performance / yield without polyimide solvent pre-wet. FIG. 4 illustrates a calculation illustrating some aspects and advantages.

Claims (10)

[Claims] 1. A system for improving manufacturing, comprising: a polyimide solvent dispensing nozzle proximate a polyimide dispensing nozzle. 2. The system of claim 1, wherein the polyimide solvent dispensing nozzle proximate the polyimide dispensing nozzle further comprises a polyimide solvent dispensing nozzle fitted with a three-dimensional adjustable bracket assembly. 3. The system of claim 2, wherein said polyimide solvent dispensing nozzle with a three-dimensional adjustable bracket assembly further comprises an x-axis adjustable bracket. 4. The system of claim 2, wherein the polyimide solvent dispensing nozzle fitted with a three-dimensional adjustable bracket assembly further comprises a y-axis adjustable bracket. 5. The system of claim 2, wherein the polyimide solvent dispensing nozzle with a three-dimensional adjustable bracket assembly further comprises a z-axis adjustable bracket. 6. The system of claim 1, wherein the polyimide solvent dispensing nozzle proximate the polyimide dispensing nozzle further comprises a polyimide solvent dispensing nozzle mounted on an arm holding the polyimide dispensing nozzle. 7. A polyimide solvent dispensing nozzle mounted on an arm holding the polyimide dispensing nozzle, and a polyimide solvent dispensing nozzle mounted with an adjustable bracket assembly such that the polyimide solvent dispensing nozzle can be centered on the wafer holder. 7. The system according to claim 6, comprising: 8. The system according to claim 1, wherein the polyimide solvent dispensing nozzle supplies a polyimide solvent storage container. 9. The system of claim 8, wherein one or more dispensing / suction valves are inserted between the polyimide solvent dispensing nozzle and the polyimide solvent reservoir. 10. The system of claim 8, wherein one or more pneumatic valves are operably connected to the polyimide solvent dispensing nozzle and the polyimide solvent reservoir.