JP2002015663A - Method for manufacturing plasma display panel - Google Patents

Abstract

(57) [Problem] To provide a method of manufacturing a plasma display panel effective for overcoming the problem of the withstand voltage of a dielectric glass layer. SOLUTION: A glass substrate 56 (a surface of a front glass substrate having a discharge electrode formed thereon) coated with a dielectric glass paste 55 is placed on a mounting table 53 of a vacuum leveling device 50, and then a vacuum pump 52 is provided. By operating
The internal space 54 of the container 51 is reduced to a constant pressure. As a result, bubbles 5 existing in the coating layer before leaving
7 can be reliably degassed toward the interior space 54 of the container 51 as shown by the arrow 58 in the figure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a plasma display panel used for a display device or the like, and more particularly to a method for manufacturing a plasma display panel for improving a dielectric glass layer.

[0002]

2. Description of the Related Art In recent years, expectations for high-definition and large-screen televisions including high-definition televisions have been increasing. Conventionally, CRTs, liquid crystals, and plasma display panels have been used as display devices for such televisions. Among them, the CRT is superior to a plasma display panel and a liquid crystal in terms of resolution and image quality, but is not suitable for a large screen of 40 inches or more in terms of depth and mass. Liquid crystals, on the other hand, have excellent performances such as low power consumption and low driving voltage, but have limitations in screen size and viewing angle. On the other hand, a plasma display panel is capable of realizing a large screen, and a 40-inch class product has already been developed (for example, “functional material” 19).
Vol. 16, No. 27 pages).

FIG. 11 is a perspective view of a main part of a conventional alternating current (AC) type plasma display panel. In FIG. 11, reference numeral 111 denotes a front glass substrate made of a sodium borosilicate glass by a float method. Discharge electrodes 1 are provided on the surface of front glass substrate 111.
12 is formed, and a dielectric glass layer 113 is formed so as to cover the dielectric glass layer 12.
The surface of magnesium oxide (MgO) dielectric protective layer 1
14 is covered.

Reference numeral 115 denotes a rear glass substrate, on which an address electrode 116 is formed, and a dielectric glass layer 117 is formed so as to cover the address electrode 116.
Are provided, and the partition wall 118 and the phosphor layer 11 are further provided on the surface thereof.
9 are provided. The space between the partition walls 118 is a discharge space 120 in which a discharge gas is sealed. The dielectric glass layers 113 and 117 are generally coated with a paste containing glass powder having an average particle diameter of 2 μm to 15 μm using a printing method such as a screen printing method or a die coating method. Is formed by drying and firing
It functions as a capacitor. Therefore, excellent withstand voltage is required.

[0005]

However, in the dielectric glass layers 113 and 117 formed by the printing method as described above, air bubbles often remain, and a dense film having excellent withstand voltage is stable. Not produced. The factors include, for example, entrainment of air into the paste when the paste is stirred by a stirrer or the like, and entrainment of air when the paste is applied to the substrate.

Usually, after applying and printing a paste containing the material of the dielectric glass layer, the coating layer is left for a certain period of time in order to flatten the surface of the coating layer (this process is generally called leveling). It is thought that some of the air bubbles existing on the surface of the coating layer during this standing period will escape, but this is not sufficient. In addition, by applying and printing a dielectric glass paste under vacuum in which gas such as air does not exist, it is considered that the entrapment of air bubbles at the time of the above-described printing can be prevented, but such a printing technique is used for a plasma display panel. It has not been developed as a manufacturing method.

Accordingly, the present invention has been made in view of the above problems, and has as its object to provide a method of manufacturing a plasma display panel which is effective in overcoming the problem of withstand voltage of a dielectric glass layer. Aim.

[0008]

In order to achieve the above object, the present invention provides a first substrate for forming a first substrate having a first dielectric glass layer formed on a surface of a first substrate body. A substrate manufacturing step, comprising a second substrate manufacturing step of manufacturing a second substrate formed by forming a second dielectric layer and a phosphor layer on the surface of the second substrate body, the first substrate The substrate manufacturing step and / or the second substrate manufacturing step includes a first step of applying a paste containing a material for forming a dielectric glass layer to the substrate body to form a coating layer, and after the first step, A second step of leaving the coating layer under a reduced-pressure atmosphere, and after the second step, a third step of drying the coating layer that has been left, and drying after the third step. And a fourth step of firing the coating layer.

Thus, after passing through the second step of leaving the coating layer in a reduced-pressure atmosphere, and then passing through the third step and the fourth step, in the second step, the Since the air bubbles entrained at the time of applying the paste are defoamed and then dried and fired, the number of air bubbles remaining in the finally formed dielectric glass layer can be surely reduced.

In order to achieve the above object, the present invention provides a first substrate manufacturing step for manufacturing a first substrate having a first dielectric glass layer formed on a surface of a first substrate body. And a second substrate producing step of producing a second substrate formed by forming a second dielectric layer and a phosphor layer on the surface of the second substrate body, the first substrate producing step and And / or the second substrate manufacturing step includes a fifth step of applying a paste containing a material for forming a dielectric glass layer to the substrate body to form a coating layer, and after the fifth step, under a reduced pressure atmosphere. The method includes a sixth step of leaving the coating layer and drying it by heating, and a seventh step of baking the dried coating layer after the sixth step.

According to this, after passing through the fifth step of leaving the coating layer in a reduced-pressure atmosphere, and then passing through the sixth step and the seventh step, in the sixth step, the Since the air bubbles entrained at the time of applying the paste are defoamed and then dried and fired, the number of air bubbles remaining in the finally formed dielectric glass layer can be surely reduced. Furthermore, in the fifth step, defoaming can be performed, and drying of the coating layer can be performed almost simultaneously, so that the number of steps can be reduced accordingly.

Here, the drying in the sixth step may be performed by utilizing heat conduction from the back side of the substrate body where the coating layer is not printed. Here, a hot plate can be used as a heat source for the heat conduction. Here, the drying in the sixth step may be performed by radiant heat.

Here, IR can be used as the heat source of the radiant heat.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A configuration of a plasma display panel (hereinafter referred to as "PDP") according to an embodiment of the present invention and a method of manufacturing the same will be described with reference to the drawings. First, the configuration of the PDP will be described. Figure 1
Is an AC surface discharge type PDP common to the embodiments described below.
2 is a vertical sectional view including a line XX of FIG. 1, and FIG. 3 is a vertical sectional view including a YY line of FIG. 1. In these figures, only three cells are shown for convenience, but actually, red (R), green (G), and blue (B)
A large number of cells emitting the respective colors are arranged to form a PDP.

In the PDP, a pulse-like voltage is applied to each electrode to generate a discharge inside the panel, and visible light of each color generated on the rear panel PA1 side due to the discharge is emitted from the main surface of the front panel PA2. AC surface discharge type P to be transmitted
DP. The front panel PA1 has a dielectric glass layer 13 formed on a front glass substrate 11 on which the discharge electrodes 12 are arranged in a stripe shape so as to cover the discharge electrodes 12. Further, the dielectric glass layer 13 The protective layer 14 is formed so as to cover it. The discharge electrode 12 includes a transparent electrode 12a formed on the surface of the glass substrate 11, and a metal electrode 12b formed on the transparent electrode 12a.

On the other hand, the rear panel PA2 protects the address electrodes on the rear glass substrate 21 on which the address electrodes 22 are arranged in stripes so as to cover the address electrodes 22, and reflects visible light toward the front panel. A dielectric glass layer 23 having an effect is formed, and extends in the same direction as the address electrode 22 on the dielectric glass layer 23, and a partition wall 24 is erected so as to sandwich the address electrode 22. The phosphor layer 25 is provided between the partition walls 24.

Next, an outline of a method of manufacturing the PDP having the above configuration will be described. Fabrication of Front Panel PA1: The front panel PA1 forms discharge electrodes 12 in a stripe shape on the surface of a front glass substrate 11 by a known photolithography method, and then applies glass powder so as to cover the discharge electrodes 12. To form a dielectric glass layer 13 and further form a protective layer 14 made of magnesium oxide (MgO) on the surface of the dielectric glass layer 13 by an electron beam evaporation method.

Fabrication of Back Panel PA2: First, address electrodes 22 are formed on the surface of the back glass substrate 21 by the same photolithographic method as the formation of the discharge electrodes 12 described above. This address electrode is composed of only a metal electrode. Then, the dielectric glass layer 23 is formed in a manner similar to that of the front panel PA1 so as to cover the address electrodes 22.
To form

Next, on the dielectric glass layer 23, partition walls 24 made of glass are provided at a predetermined pitch. Then, a phosphor layer 25 is formed by disposing a red (R) phosphor, a green (G) phosphor, and a blue (B) phosphor in each space sandwiched by the partition walls 24. As the phosphors of the respective colors R, G, and B, phosphors generally used in PDPs can be used. Here, the following phosphors are used.

Red phosphor: (Y _x Gd _1-x ) BO ₃ : Eu ³⁺ Green phosphor: Zn ₂ SiO ₄ : Mn Completion of PDP by panel bonding: Next, front panel PA1 and rear panel PA2 are positioned such that discharge electrode 12 and address electrode 22 are orthogonal to each other, and both panels are bonded. Thereafter, discharge gas (for example, He-Xe-based, Ne-X
The PDP is completed by filling e-type inert gas) at a predetermined pressure.

The composition of the discharge gas to be filled is a conventionally used He-Xe type, Ne-Xe type or the like. In order to improve the light emission luminance of the cell, the content of Xe is reduced to 5% by volume. As described above, the sealing pressure is 0.67 × 10 ^{5 to} 1.01 ×
Set to 10 ⁵ Pa. The PDP having the above configuration is driven using the drive circuit shown in FIG. Address electrode driver 3
1 is connected to the address electrode 22, the scan electrode drive unit 32 is connected to the scan electrode of the discharge electrode 12, and the sustain electrode drive unit 33 is connected to the sustain electrode of the discharge electrode 12. . Then, wall charges are uniformly accumulated in all cells in the PDP so that discharge is easily generated in the setup period by such a driving circuit. Next, write discharge is performed on cells to be turned on in the address period. Further, the cells written in the address period are turned on in the sustain period to maintain the lighting, and the cell charges are stopped by erasing the wall charges in the erase period. These multiple operations are repeatedly performed to display an image of one TV field.

<Embodiment 1> * Details of formation of dielectric glass layer FIG. 4 is a process chart showing a process of forming a dielectric glass layer in the present embodiment. First, the dielectric glass layer 13
The outline of the forming process is as follows: using a glass powder having a predetermined particle size distribution, a front glass substrate 11 on which a discharge electrode 12 is formed by a screen printing method, a die coating method, a spin coating method, a spray coating method, or a blade coating method.
Is formed by applying and printing on the surface of the substrate (Step 1), leaving it in a reduced-pressure atmosphere for a certain period of time (Step 2), drying it (Step 3), and then baking the applied layer (Step 4). .

Steps 1 to 4 are determined in consideration of the final thickness of the dielectric glass layer. For example, when the final thickness of the dielectric glass layer is to be 40 μm, 2
Steps 1 to 4 are desirably repeated about once. * Step 1 First, the glass powder used in the step 1 is finally converted into a glass coarse material having a predetermined composition by using a pulverizing apparatus such as a ball mill or a jet mill (for example, HJP300-02 manufactured by Sugino Machine Co., Ltd.). It is crushed to near the particle diameter of the glass powder used for forming the body glass layer.

The above-mentioned glass coarse material is, for example, a component G1,
When using glass consisting of G2, G3, ..., GN
, The components G1, G2, G3, ..., GN correspond to the component ratio
And weighed in a furnace at 1300 ° C, for example.
Heat-melted and then poured into water
is there. Specifically, as a glass coarse material, PbO-B
_TwoO_Three-SiO_Two-CaO-based glass, PbO-B_TwoO_Three-S
iO_Two-MgO-based glass, PbO-B_TwoO_Three-SiO_Two-B
aO-based glass, PbO-B_TwoO_Three-SiO_Two-MgO-A
l_TwoO_ThreeGlass, PbO-B_TwoO_Three-SiO_Two-BaO-
Al_TwoO_ThreeGlass, PbO-B_TwoO_Three-SiO_Two-CaO
-Al_TwoO_ThreeGlass, Bi_TwoO_Three-ZnO-B_TwoO_Three-Si
O_Two-CaO-based glass, ZnO-B_TwoO_Three-SiO_Two-Al_Two
O_Three-CaO-based glass, P_TwoO_Five-ZnO-Al_TwoO_Three-C
aO-based glass, Nb_TwoO_Five-ZnO-B_TwoO_Three-SiO_Two−
It is possible to use CaO-based glass alone or a mixture thereof
it can. In addition, it is generally used for PDP dielectrics.
The glass to be used can be used in the same manner.

Such a glass powder is well kneaded with a binder and a solvent for dissolving the binder by a ball mill, a disper mill or a jet mill to prepare a mixed glass paste. As the binder used here, an acrylic resin, ethyl cellulose, ethylene oxide alone or a mixture thereof can be used. As the binder dissolving solvent, terpineol, butyl carbitol acetate, pentanediol alone, or a mixture thereof can be used. By adjusting the amount of the binder-dissolving solvent to be contained in the mixed paste, the viscosity of the mixed paste is set to a value suitable for a film forming method employing the mixed paste.

It is desirable to add a plasticizer or a surfactant (dispersant) to the mixed glass paste as needed. This is because if a plasticizer is added, the glass film after applying and drying the glass paste becomes flexible, and it is possible to prevent the film from cracking during sintering.
Further, when a surfactant is added, the surfactant is adsorbed around the glass particles, the dispersibility of the glass is improved, and uniform glass application can be performed. The addition of a surfactant is particularly effective in the case of a die coating method, a spray coating method, a spin coating method, and a blade coating method in which a film is formed using a glass paste having a low viscosity.

The composition of this mixed paste is as follows.
5% by mass to 70% by mass, binder 5% by mass to 15% by mass
Is preferably 30% by mass to 65% by mass. The amount of the added plasticizer or surfactant (dispersant) is preferably 0.1% by mass to 3.0% by mass with respect to the binder component. As the surfactant (dispersant), an anionic surfactant can be used. Examples thereof include polycarboxylic acid, sodium salt of alkyl diphenyl ether sulfonate, alkyl phosphate, phosphate of higher alcohol, and polyoxyethylene. Ethylene diglycerin borate carboxylate, polyoxyethylene alkyl sulfate, naphthalenesulfonic acid formalin condensate, glycerol monooleate, sorbitan sesquiolate, or homogenol can be used. In addition, as a plasticizer, dibutyl phthalate,
Dioctyl phthalate or glycerin can be used. These may be used alone or in combination of two or more.

Next, using the mixed glass paste, the mixed paste is applied by screen printing, die coating, spin coating, spray coating, or blade coating to the front glass substrate 11 on which the discharge electrodes 12 are formed.
Apply on top. * Step 2 In step 2, the coated layer of the printed dielectric glass paste is left for a certain period of time to adjust the surface of the coated layer to a flat surface.

Further, by performing this in a reduced-pressure atmosphere, bubbles trapped in the dielectric glass paste during printing or the like are removed. In the step 2, a glass substrate on which a dielectric glass paste is applied and printed is placed in a reduced-pressure leveling device 50 as shown in FIG.
The decompression leveling device 50 includes a container 51, a vacuum pump 52, and a mounting table 53 provided in the container. The inner space 54 of the container 51 is
Is activated to reduce the pressure.

After a glass substrate 56 (having a front glass substrate with a discharge electrode formed thereon) coated with a dielectric glass paste 55 is placed on a mounting table 53 of such a reduced-pressure leveling device 50, the pressure is reduced. By operating the pump 52, the internal space 54 of the container 51 is reduced to a constant pressure. Thereby, it is possible to reliably remove bubbles 57 existing in the coating layer toward the interior space 54 of the container 51 as shown by the arrow 58 in the drawing before leaving.

In order to more effectively exert the defoaming effect, it is important to determine the degree of pressure reduction and the time for which the dielectric glass paste is left under reduced pressure in consideration of the viscosity of the applied dielectric glass paste and the applied thickness. Becomes In other words, when the viscosity of the dielectric glass paste is relatively high, the moving speed of the bubbles existing in the coating layer is considered to be generally slow. Therefore, the degree of pressure reduction is relatively high, or the pressure is left for a long time. It is desirable to do.

In the case where the coating thickness is relatively large, it is considered that the distance required for bubbles existing in the coating layer to reach the internal space is generally large. Alternatively, it is desirable to leave the apparatus under reduced pressure for a long time. Therefore, in the one-time application printing process (the above-described process 1), it is possible to perform defoaming in a shorter time by using a dielectric glass paste having a viscosity as low as possible, even under the same reduced pressure condition. It can be said that it is more desirable.

Usually, it is sufficient to reduce the pressure to about 1.33 × 10 ² Pa. * Step 3 Next, in step 3, the coating layer of the dielectric glass paste which has been left is dried to remove the solvent in the paste from the coating layer. * Step 4 Next, in step 4, the glass powder in the dielectric glass paste is sintered at a predetermined temperature (550 ° C. to 590 ° C.). Note that this sintering process is preferably performed near the softening point of the dielectric glass as much as possible. This is because, when sintering is performed at a temperature much higher than the softening point, the flowability of the molten glass increases, which causes a reaction with the discharge electrode to generate bubbles.

By repeating the above steps 1 to 4 a plurality of times, the dielectric glass layer 13 is formed to a desired thickness. Next, formation of the dielectric glass layer 23 will be described. Dielectric glass layer 23 on the address electrodes, using a powder obtained by adding TiO ₂ 5 to 30 wt% in the dielectric glass paste, is formed by the same method as the dielectric glass layer 13 . By adding TiO ₂ in this manner, the dielectric glass layer on the rear glass substrate plays a role of reflecting light emitted from the phosphor toward the front panel. It should be noted that the greater the amount of TiO ₂ added, the higher the reflectivity. This is preferable in that respect. However, if the amount of TiO ₂ is too large, the withstand voltage is reduced.
0% by mass seems to be the limit.

After the dielectric glass paste is applied to the glass substrate as described above, the dielectric glass paste is left for a certain period of time in a reduced-pressure atmosphere to remove bubbles, and then dried and fired to form the dielectric glass layer 13. Nos. 23 are excellent in the withstand voltage with a small number of bubbles remaining when the dielectric glass paste is applied or the like. The dielectric glass layer provided on both the front panel and the back panel is not formed by defoaming by being left in a reduced-pressure atmosphere as described above, but one of them may be formed as such. it can.

<Second Embodiment> In the second embodiment, the dielectric glass layers 13 and 23 are basically formed by the same method as that of the first embodiment. The difference is that the step of leaving under the atmosphere) and the step 3 (the step of drying the coating layer) are performed almost simultaneously, and the number of steps is reduced by one.

FIG. 6 is a process diagram showing a process of forming dielectric glass layers 13 and 23 in the present embodiment. As shown in this figure, the surface of the front glass substrate 11 (rear glass substrate) is screen-printed, die-coated, spin-coated, spray-coated, or blade-coated using glass powder having a predetermined particle size distribution. After coating and printing (Step 5), the coated layer is left under a reduced pressure atmosphere for a certain period of time and dried by heating (Step 6), and then the applied layer is baked (Step 7).

Steps 5 to 7 are determined in consideration of the final thickness of the dielectric glass layer. For example, when the final thickness of the dielectric glass layer is to be 40 μm, 2
Steps 5 to 7 are desirably repeated about once. In step 6, a glass substrate on which a dielectric glass paste is applied and printed is placed in a reduced-pressure leveling / drying device 70 as shown in FIG.

The basic structure of the reduced-pressure leveling and drying apparatus 70 is the same as that of the reduced-pressure leveling apparatus 50, except that a container 51, a vacuum pump 52, and a mounting table 53 provided in the container are provided. The point that a hot plate 72 for heating and drying the coating layer by transmitting heat from the surface 71 opposite to the surface on which the glass substrate 56 coated with the dielectric glass paste is coated is disposed on the mounting table 53. Is different.

Then, the glass substrate 56 coated with the dielectric glass paste is placed on the hot plate 72 of such a reduced pressure leveling and drying apparatus 70, and the glass substrate is heated from the back side and the reduced pressure pump 52 is operated. Thus, the internal space 54 of the container 51 is reduced to a constant pressure. Thereby, it is possible to reliably remove bubbles 57 existing in the coating layer toward the interior space 54 of the container 51 as shown by the arrow 58 in the drawing before leaving. Further, in addition to this, the coating layer can be dried almost simultaneously.

Since the coated layer of the dielectric glass paste is placed under reduced pressure while heating as described above, it is not desirable that the coated layer is dried before the defoaming is sufficiently performed. . Therefore, it is desirable to perform heating so that drying is performed gradually enough to maintain the viscosity of the dielectric glass paste applied and printed so as to be able to remove bubbles.

As a means for heating and drying the coating layer, a hot plate is used in the above description, but it is also possible to use radiant heat using IR or the like as a heat source. The dielectric glass layer provided on both the front panel and the back panel is not formed by defoaming by being left in a reduced-pressure atmosphere as described above, but one of them may be formed as such. it can.

<Example> Based on the first embodiment, P
Only the front panel that was a part of the DP was manufactured, and the characteristics of the dielectric glass layer were examined. 100mm x 7 for glass substrate
A soda glass plate having a size of 4 mm was used. Then, in step 1, an area of 80 mm × 50 mm and a thickness of 40 mm
A dielectric glass paste was printed on the μm by a die coating method.

In printing, PbO—Al ₂ O ₃ —SiO ₂ was used as the dielectric glass material, and the binder was:
Ethyl cellulose and α-terpineol were used as the solvent. Next, in step 2, the substrate obtained in step 1 was placed in a desiccator and taken to 9.31 × 10 ² over 5 minutes.
The pressure was reduced to Pa, and then the mixture was allowed to stand at 9.31 × 10 ² Pa for 10 minutes. Here, when we observed inside the desiccator,
Air bubbles are observed to come out of the dielectric, and 9.31 ×
About 7 minutes after starting to stand at 10 ² Pa, generation of air bubbles was not recognized.

Next, in step 3, the substrate was taken out by leaking in the desiccator, and then the substrate was dried. Drying was carried out by placing it in a hot air drying oven under a temperature environment of 120 ° C. for 25 minutes. Finally, in step 4, 5
It was baked at 90 ° C. for 10 minutes. In contrast to the above example, a comparative example was prepared in which the substrate was produced by simply leveling in step 2 without leaving the substrate under reduced pressure.

Here, an Ag electrode having a width of 2 mm and a length of 50 mm was printed and formed on the surface of the dielectric glass layer for each of the plurality of substrates (Examples and Comparative Examples).
Dielectric strength (withstand voltage) was measured by applying various values of DC voltage between the electrodes. The result is shown in FIG. In this figure, the vertical axis indicates the applied voltage when the dielectric glass layer is broken. Therefore, the more the plot “○” is distributed at high voltage values, the higher the withstand voltage is.

As shown in this figure, in the embodiment,
It can be seen that the withstand voltage is higher than that of the comparative example. Next, FIG. 9 is an electron micrograph showing the film state of the dielectric glass layer, FIG. 9A shows the film state of the dielectric glass layer of the example, and FIG. The film state of the body glass layer is shown.

As can be seen from this figure, it can be said that the example according to the example left in a reduced-pressure atmosphere has a smaller number of bubbles than the example according to the comparative example that does not. In this figure, it is observed that a large number of fine air bubbles exist in the dielectric glass layer according to the example, but the number of air bubbles having a slightly larger diameter is evident. Reduced compared to the layer.

The decrease in dielectric strength is more greatly affected by the presence of bubbles having a large diameter than the presence of minute bubbles. Therefore, as shown in FIG. 9A, it can be said that even if a large number of fine bubbles are present in the embodiment, the withstand voltage is not significantly affected. This is clear from the results of the dielectric strength shown in FIG.

[0050]

As described above, according to the method of manufacturing a plasma display panel of the present invention, a first substrate is formed by forming a first dielectric glass layer on the surface of a first substrate main body. A first substrate producing step, and a second substrate producing step of producing a second substrate in which a second dielectric layer and a phosphor layer are formed on the surface of the second substrate body, The one substrate production step and / or the second substrate production step
A first step of applying a paste containing a material for forming a dielectric glass layer to a substrate body to form a coating layer, and after the first step, a second step of leaving the coating layer under a reduced-pressure atmosphere And, after the second step, a third step of drying the coating layer that has been left, and including a fourth step of firing the dried coating layer after the third step. Features.

Thus, after passing through the second step of leaving the coating layer under a reduced-pressure atmosphere, and then passing through the third step and the fourth step, in the second step, the Since the air bubbles entrained at the time of applying the paste are defoamed and then dried and fired, the number of air bubbles remaining in the finally formed dielectric glass layer can be surely reduced.

Further, the present invention provides a first substrate manufacturing step for manufacturing a first substrate having a first dielectric glass layer formed on a surface of a first substrate main body, A second substrate manufacturing step of manufacturing a second substrate having a second dielectric layer and a phosphor layer formed on a surface thereof, wherein the first substrate manufacturing step and / or the second substrate manufacturing step are performed. A fifth step of applying a paste containing a material for forming a dielectric glass layer to the substrate body to form a coating layer, and after the fifth step, leaving the coating layer in a reduced-pressure atmosphere and heating It is characterized by including a sixth step of drying, and a seventh step of baking the dried coating layer after the sixth step.

Thus, after passing through the fifth step of leaving the coating layer under a reduced-pressure atmosphere, and then passing through the sixth step and the seventh step, in the sixth step, the Since the air bubbles entrained at the time of applying the paste are defoamed and then dried and fired, the number of air bubbles remaining in the finally formed dielectric glass layer can be surely reduced. Furthermore, in the sixth step, defoaming is performed and drying of the coating layer can be performed almost simultaneously, so that the number of steps can be reduced accordingly.

[Brief description of the drawings]

FIG. 1 is an AC surface discharge type PD common to an embodiment of the present invention.
It is a principal part perspective view of P.

FIG. 2 is a vertical sectional view including the line XX of FIG. 1;

FIG. 3 is a vertical sectional view including a line YY of FIG. 1;

FIG. 4 shows a dielectric glass layer 13 according to the first embodiment.
It is a schematic diagram which shows the formation process of (23).

FIG. 5 is a diagram showing a configuration of a reduced-pressure leveling device used in step 2.

FIG. 6 shows a dielectric glass layer 13 according to the second embodiment.
It is a schematic diagram which shows the formation process of (23).

FIG. 7 is a diagram showing a configuration of a reduced-pressure leveling drying apparatus used in step 6.

FIG. 8 is a diagram showing the results of measuring the dielectric breakdown strength (withstand voltage) of the dielectric glass layers of the example and the comparative example.

FIG. 9 is an electron micrograph showing a film state of a dielectric glass layer. FIG. 9A shows a film state of a dielectric glass layer of an example, and FIG. 9B shows a dielectric glass layer of a comparative example. Shows the state of the film.

FIG. 10 is a block diagram showing a driving circuit of the PDP.

FIG. 11 is a perspective view of a main part of an AC surface discharge type PDP according to a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Front glass substrate 12 Discharge electrode 12a Transparent electrode 12b Metal electrode 13 Dielectric glass layer 14 Protective layer 21 Back glass substrate 22 Address electrode 23 Dielectric glass layer 24 Partition wall 25 Phosphor layer 30 Discharge space 31 Address electrode drive part 32 Scan electrode Driving unit 33 Sustained electrode driving unit 50 Decompression leveling device 51 Container 52 Vacuum pump 53 Mounting table 54 Internal space 55 Dielectric glass paste 56 Glass substrate 57 Bubbles 58 Arrow (showing how bubbles move) 70 Decompression leveling drying device 71 Substrate One side (rear) 72 Hot plate PA1 Front panel PA2 Rear panel

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuya Hasegawa 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 5C027 AA05 5C040 FA01 GB03 GB14 GD09 JA28 MA23

Claims (6)

[Claims] 1. A first substrate manufacturing step for manufacturing a first substrate having a first dielectric glass layer formed on a surface of a first substrate main body; A second substrate manufacturing step of manufacturing a second substrate on which a dielectric layer and a phosphor layer are formed, wherein the first substrate manufacturing step and / or the second substrate manufacturing step includes a substrate main body. A first step of applying a paste containing a material for forming a dielectric glass layer to form a coating layer, and after the first step, a second step of leaving the coating layer under a reduced pressure atmosphere, After the second step, a third step of drying the coated layer left, and a fourth step of firing the dried coating layer after the third step, Of manufacturing a plasma display panel. 2. A first substrate manufacturing step for manufacturing a first substrate having a first dielectric glass layer formed on a surface of a first substrate main body, and a second substrate manufacturing step for forming a second substrate on a surface of the second substrate main body. A second substrate manufacturing step of manufacturing a second substrate on which a dielectric layer and a phosphor layer are formed, wherein the first substrate manufacturing step and / or the second substrate manufacturing step includes a substrate main body. A fifth step of applying a paste containing a material for forming a dielectric glass layer to form a coating layer, and after the fifth step, leaving the coating layer in a reduced-pressure atmosphere and heating and drying the coating layer. And a seventh step of baking the coating layer dried after the sixth step. 3. The plasma display panel according to claim 2, wherein the drying in the sixth step is performed by utilizing heat conduction from the back side of the substrate body where the coating layer is not printed. Manufacturing method. 4. The method according to claim 3, wherein a hot plate is used as the heat source for heat conduction. 5. The method according to claim 2, wherein the drying in the sixth step is performed by radiant heat. 6. The method according to claim 5, wherein IR is used as the heat source of the radiant heat.