JP2002009232A - Adhesive coating device and method of manufacturing semiconductor device using the same - Google Patents

Abstract

(57) Abstract: In an adhesive application device having a plurality of adhesive discharge tubes, it is easy to control a distance from a tip of the adhesive discharge tube to an adhesive application surface. An adhesive having an adhesive injection port for injecting an adhesive, and a plurality of cylindrical adhesive discharge pipes for discharging the adhesive injected from the adhesive injection port and applying the adhesive to a predetermined area. In the coating apparatus, a tip is provided at a height different from a plane formed by the tip of the adhesive discharge pipe in the vicinity of the adhesive discharge pipe, and a distance from the tip of the adhesive discharge pipe to a coating surface. This is an adhesive coating device provided with a support member that supports a constant.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for applying an adhesive and a method for manufacturing a semiconductor device using the same, and more particularly to an apparatus for applying an adhesive on a lead frame or a semiconductor chip which is easily deformed. And effective technology.

[0002]

2. Description of the Related Art Conventionally, in a method of manufacturing a semiconductor device,
When a semiconductor chip is fixed on a die pad of a lead frame, a resin-based adhesive is often used.
An adhesive application device 1 'as shown in FIG. In the adhesive application device 1 ′, an adhesive discharge pipe 3 that discharges a plurality of resin-based adhesives is arranged in a predetermined shape,
As shown in FIG. 12B, a resin adhesive 11 is applied to the resin application surface on the die pad 7 little by little from each of the adhesive discharge pipes 3, and on the applied resin adhesive 11, as shown in FIG. The semiconductor chip 12 is transported and mounted by a collet or the like, and heated to cure the resin-based adhesive 11.
As shown in FIG.
To adhere.

[0003] In the resin coating method using the adhesive coating device 1 ', first, the adhesive discharge nozzle 3 of the adhesive coating device 1' is set so as to come to the resin coating surface (die pad 7) of the lead frame. Align in the XY directions, then
The adhesive dispensing apparatus 1 'is moved in the Z-axis direction, and the adhesive discharge pipe 3 is brought close to the resin application surface of the lead frame to discharge the resin-based adhesive 11 from the adhesive discharge pipe 3. Coated.

In recent years, semiconductor devices have become more sophisticated,
Higher densification is progressing, and semiconductor devices and the like in which a plurality of semiconductor chips are stacked in one package are manufactured. When stacking the plurality of semiconductor chips,
After bonding a semiconductor chip on a lead frame or a wiring board according to the above procedure, a film-like adhesive tape is attached on the bonded semiconductor chip to bond the semiconductor chips to each other.

[0005]

However, in the prior art, the tips 3A of the adhesive discharge pipes 3 provided in the adhesive coating device 1 'are on the same plane. Therefore, as shown in FIG.
When the adhesive application device 1 ′ approaches the lead frame, for example, when the resin application surface or the like on which the resin is to be applied is distorted, the tip 3 of the adhesive discharge pipe 3
The distance from A to the resin application surface varies. For this reason, the amount of the resin-based adhesive 11 applied by a tube whose distance to the resin application surface is short and the amount of the resin-based adhesive 11 applied by a tube whose distance to the resin application surface is large vary, As shown in FIG. 13B, the thickness of the resin adhesive 11 applied to the resin application surface becomes uneven. If the thickness of the applied resin-based adhesive 11 becomes uneven, the adhesiveness between the resin-applied surface (lead frame) and the semiconductor chip 12 deteriorates, or as shown in FIG. There is a problem that the empty package 27 is formed inside the agent 11 and the inside of the semiconductor device is heated during the manufacturing process or during use, causing an air explosion and cracking at the bonded portion.

In addition to the distortion of the lead frame and the wiring board, as shown in FIG. 14 (a), each of the adhesive discharge pipes 3 from the resin application surface is inclined by the inclination of the adhesive application device 1 'or the like. The distance to the tip 3A may vary. In such a case, as shown in FIG. 14B, the thickness of the resin-based adhesive 11 becomes uneven, and the bonded semiconductor chip 12 is inclined as shown in FIG. 14C. As a result, the subsequent wire bonding process becomes difficult. In the resin coating method using the conventional adhesive coating apparatus 1 ', each adhesive discharge pipe 3
Of the resin-based adhesive 11
In order to apply the resin adhesive uniformly, it is necessary to adjust the position of the distal end 3A of the tube using another device, and there is a problem that it is difficult to control the application of the resin adhesive 11 uniformly.

In a semiconductor device in which a plurality of semiconductor chips are stacked, as shown in FIG. 14D, a resin-based adhesive 11 is applied to the surface of the semiconductor chip 12 by using the adhesive application device 1 '. When another semiconductor chip is to be stacked, the tip 3A of the adhesive discharge tube 3 comes into contact with the surface of the semiconductor chip 12, and the surface of the semiconductor chip is likely to be scratched and become defective. Therefore, when laminating semiconductor chips, the semiconductor chips are bonded to each other using a film-shaped adhesive tape. However, it is difficult to process the film-shaped adhesive tape to make the thickness uniform, and the cost is high. Therefore, there is a problem that the cost of the semiconductor device in which the semiconductor chips are stacked increases. In addition, when the adhesive tape is attached to the semiconductor chip, air bubbles are likely to enter inside and the air bubbles remain, thereby deteriorating the adhesiveness and expanding the air when heated, which tends to cause peeling. Was.

An object of the present invention is to make it easy to control the distance from the tip of the adhesive discharge pipe to the adhesive application surface in an adhesive coating apparatus having a plurality of adhesive discharge pipes. To provide technology.

Another object of the present invention is to provide a method for manufacturing a semiconductor device using an adhesive applying apparatus having an adhesive discharge pipe, wherein the adhesive is easily applied on the adhesive applied surface with a uniform thickness. It is to provide a technology that can do it.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0011]

The summary of the invention disclosed in the present application is as follows. (1) An adhesive application having an adhesive injection port for injecting an adhesive, and a plurality of cylindrical adhesive discharge pipes for discharging the adhesive injected from the adhesive injection port and applying the adhesive to a predetermined area. In the device, in the vicinity of the adhesive discharge pipe, the adhesive discharge pipe has a tip at a height different from a plane formed by the tip of the adhesive discharge pipe, and a distance from the tip of the adhesive discharge pipe to a coating surface is set. This is an adhesive application device provided with a support member for supporting the same. (2) A method of manufacturing a semiconductor device, comprising: a step of applying an adhesive to a region on a lead frame on which a semiconductor chip is to be mounted; and a step of mounting and bonding the semiconductor chip on the applied adhesive. The step of applying the agent
An adhesive application device provided with an adhesive discharge pipe composed of a plurality of pipes for applying the adhesive and a support member having a tip at a height different from a plane formed by the tip of the adhesive discharge pipe. Positioning the adhesive discharge pipe in a region where the semiconductor chip is mounted, and performing horizontal alignment so that the support member is positioned on a lead of the lead frame; and Move in the direction of the lead frame, contact the tip of the support member with the lead, press the lead, and keep the distance from the tip of the adhesive discharge pipe to the resin coating surface of the lead frame constant. A supporting step and a step of discharging and applying the adhesive from the adhesive discharge pipe. (3) A method for manufacturing a semiconductor device, comprising: a step of applying an adhesive to a surface of a first semiconductor chip adhered to a wiring board; and a step of mounting and adhering a second semiconductor chip on the applied adhesive. The step of applying the adhesive,
An adhesive discharge pipe composed of a plurality of pipes for applying an adhesive on the first semiconductor chip, and a support member having a distal end whose height is different from a plane formed by the distal end of the adhesive discharge pipe are provided. Positioning the provided adhesive coating device in the horizontal direction so that the adhesive discharge pipe is located on the first semiconductor chip; and moving the adhesive coating device in the direction of the wiring board. Contacting the supporting member with a wiring board to support a constant distance between a tip end of the adhesive discharge pipe and an adhesive application surface on the first semiconductor chip; Discharging and applying the adhesive.

According to the above (1), a support member having a height different from that of the adhesive discharge pipe is provided in the vicinity of the adhesive discharge pipe provided in the adhesive application device, and the support member is connected to a lead. By supporting the adhesive application device in contact with a frame or a wiring board, the distance from each adhesive discharge pipe to the adhesive application surface can be made constant. Therefore, the adhesive can be uniformly applied to the adhesive applied surface.

Further, by supporting the adhesive application device with the support member, the adhesive discharge pipe can be prevented from coming into contact with the adhesive application surface, and the adhesive application surface can be prevented from being damaged. .

In the step (1) of applying an adhesive on a lead frame using the adhesive applying apparatus, the step (2)
After the positioning of the adhesive coating device in the planar direction, the adhesive coating device is moved in the direction of the lead frame to bring the support member of the adhesive coating device into contact with the lead frame. . At this time, by pressing the adhesive applying surface (tab) of the lead frame with the support member so as to be flat, the distance between each of the adhesive discharge pipes and the adhesive applying surface can be made constant, and the bonding can be performed. An agent can be applied to the adhesive applied surface in a uniform thickness.

In the case where the second semiconductor chip is bonded by applying an adhesive to the surface of the first semiconductor chip bonded on the lead frame or the wiring board, the above-mentioned (3)
As described in the means, the distance between the plane formed by the tip of the support member and the tip of the adhesive discharge pipe is slightly longer than the length of the first semiconductor chip. With this configuration, when the tip of the support member comes into contact with the lead frame or the wiring board, the tip of the adhesive discharge pipe does not come into contact with the surface of the semiconductor chip, so that a predetermined distance can be maintained. The adhesive can be applied uniformly without damaging the surface of the semiconductor chip.

The distance between the plane formed by the tip of the adhesive discharge pipe and the tip of the support member is determined by the adhesive discharge pipe when the support member is brought into contact with a lead frame or a wiring board. The processing is performed so that the distance from the surface to the adhesive applied surface is about 10 μm to 100 μm.

Hereinafter, the present invention will be described in detail together with embodiments (examples) with reference to the drawings. In all the drawings for explaining the embodiments, parts having the same function are denoted by the same reference numerals, and their repeated description will be omitted.

[0018]

(Embodiment 1) FIG. 1 is a schematic diagram showing a schematic configuration of an adhesive applying apparatus according to Embodiment 1 of the present invention. FIG. 1 (a) is a front view, and FIG. 1) is a bottom view of FIG. In FIG. 1, reference numeral 1 denotes an adhesive application device;
Is an adhesive inlet, 3 is an adhesive discharge pipe, 3A is a tip of the adhesive discharge pipe, 4 is a support member, 4A is a tip of the support member,
Reference numeral 5 denotes a substrate, 5A denotes an adhesive applied surface, and Δh denotes a distance from the adhesive applied surface to the tip of the adhesive discharge pipe.

FIG. 1 shows an adhesive applying apparatus 1 according to the first embodiment.
As shown in FIG. 1A and FIG. 1B, an adhesive injection port 2 for injecting an adhesive, a plurality of cylindrical adhesive discharge tubes 3 for discharging the injected adhesive, It is constituted by a support member 4 provided near the agent discharge pipe 3.

As shown in FIG. 1A, when the adhesive coating device 1 is placed on an arbitrary substrate 5, the tip 4A of the support member 4 comes into contact with the substrate 5, and Is supported so that the distance from the adhesive application surface 5A to the tip 3A of the adhesive discharge pipe 3 becomes Δh. The distance from the adhesive application surface 5A to the tip 3A of the adhesive discharge pipe 3 is set to about 10 μm to 100 μm.

FIGS. 2 to 4 are schematic views for explaining a method of manufacturing a semiconductor device using the adhesive application device of the first embodiment. In the first embodiment, a method will be described in which an adhesive is applied to a tab (die pad) of a lead frame using the adhesive applying apparatus 1 to bond a semiconductor chip.

2 to 4, 6 is a lead frame, 7 is a tab (die pad), 7A is an adhesive application area,
8 is a lead, 9 is a tab suspension lead, and 10 is an outer frame. In FIG. 4, reference numeral 11 denotes a resin adhesive, and 12 denotes a semiconductor chip. Hereinafter, a method of manufacturing a semiconductor device using the adhesive application device of the first embodiment will be described with reference to FIGS.

As an example of the lead frame 6 to which the adhesive is applied by using the adhesive applying apparatus of the first embodiment, as shown in FIG. 2, a tab (die pad) 7 for attaching a semiconductor chip, A lead 8 connected to an external electrode of the semiconductor chip is provided, and the tab 7 is integrated with an outer frame 10 of the lead frame 6 by a tab suspension lead 9. The semiconductor chip is bonded by applying an adhesive to the adhesive application area 7A of the tab 7 by the adhesive application device.

First, as shown in FIGS. 3 (a) and 3 (b), the adhesive discharge pipe 3 provided in the adhesive coating device 1 Positioning in the xy directions is performed so as to be on the application area 7A.
This positioning is performed by a conventional positioning and shaking method. Observing with a camera in advance, the center of the adhesive discharge pipe 3 arranged in the resin coating device 1 and the adhesive coating area of the tab 7 It is assumed that numerical control is performed so that the center of 7A matches. 3A, the support member 4 of the adhesive discharging device 1 is provided so as to come on the tab suspension lead 9. As shown in FIG. At this time, the tab 7 and the tab suspension lead 9 of the lead frame 6 are
As shown in (b), it is assumed that the tab 7 is curved so as to move away from the adhesive application device 1.

Next, from the state shown in FIG. 3B, the adhesive coating device 1 is moved in the z-axis direction to bring the adhesive coating device 1 and the lead frame 6 close to each other.
As shown in (c), the support member 4 and the tab suspension lead 9 come into contact with each other.

Thereafter, the resin coating device 1 is further moved, and as shown in FIG. 4D, the tab suspending lead 9 is pressed by the support member 4 so that the curved tabs 7 and After the tab suspension leads 9 are flattened, an adhesive, for example, a thermosetting resin-based adhesive 11 such as a resin is discharged from the adhesive discharge pipe 3 and applied to the tab 7. At this time, the distance from the adhesive application surface of the tab 7 to the tip 3A of the adhesive discharge pipe 3 becomes constant as shown in FIG. The adhesive 11 has a uniform thickness, as shown in FIG.

Next, as shown in FIG. 4 (e), the semiconductor chip 12 is conveyed by a collet or the like onto the resin-based adhesive 11 applied to a uniform thickness. Put on.

Next, the resin adhesive 11 is cured by heating to a predetermined temperature, and the semiconductor chip 1 is placed on the tub 7.
2 is adhered.

As described above, according to the first embodiment, the support member is provided in the adhesive coating apparatus provided with a plurality of adhesive discharge pipes, and the adhesive discharge pipe is provided from the adhesive application surface. The adhesive is applied with a uniform thickness on the lead frame or the wiring board by supporting the adhesive with a constant distance to the tip of the lead frame.

Further, the distance between the adhesive application surface and the adhesive discharge pipe is maintained constant by contacting a support member provided in the adhesive application device with a lead frame or a wiring board. Therefore, the adhesive can be applied with a uniform thickness on the adhesive applied surface without controlling the adhesive applying device using a special device.

(Embodiment 2) FIG. 5 is a schematic plan view showing a schematic configuration of an adhesive coating apparatus according to Embodiment 2 of the present invention. In FIG. 5, 13 is the wiring board, Δh1 is the height from the wiring board to the surface of the semiconductor chip, and Δh2 is the height from the surface of the semiconductor chip to the tip of the adhesive discharge pipe.

The basic configuration of the adhesive application device of the second embodiment is the same as that of the adhesive application device described in the first embodiment, and a description thereof will be omitted.

The adhesive applying apparatus according to the second embodiment shows an example in which an adhesive is applied on a semiconductor chip.
As shown in FIG. 5, when the adhesive discharge pipe 3 is positioned on the first semiconductor chip 12 bonded to the wiring board 13 with the resin-based adhesive 11, the support member 4 And supports the adhesive application device 1 in contact with the wiring board 13. At this time, the distance Δh from the tip of the support member 4 to the tip of the adhesive discharge pipe 3 is determined by the surface of the first semiconductor chip 12 adhered on the wiring board 13 from the surface of the wiring board 13 (adhesion). The height .DELTA.h1 is set to a value obtained by adding a height .DELTA.h2 to the height .DELTA.h1 of the adhesive discharge pipe 3 so that the surface of the first semiconductor chip 12 does not come into contact with the height .DELTA.h1 of the adhesive discharge pipe 3. The height Δh2 is, for example, about 10 μm to 100
It is set to μm.

FIGS. 6 to 8 are views for explaining a method of manufacturing a semiconductor device using the adhesive application device of the second embodiment. Hereinafter, a method of applying an adhesive on a semiconductor chip using the adhesive applying apparatus of the second embodiment will be described with reference to FIGS.

First, as shown in FIGS. 6 (a) and 6 (b), the external electrodes 12A are formed on the wiring substrate 13 on which the terminal electrodes 13A and the metal wirings are formed by using a resin adhesive 11 in advance. The first semiconductor chip 12 provided with the adhesive is bonded, and the position of the adhesive application device 1 in the xy direction is adjusted. Place it on 12B. This positioning is performed in the same manner as the positioning of the adhesive coating device on the lead frame, which is conventionally performed, and therefore, detailed description thereof is omitted. At this time, as shown in FIG. 6A and FIG.
Outside the first semiconductor chip 12, the wiring substrate 13
13A and the metal wiring are not provided.

Next, the adhesive application device 1 is moved in the z-axis direction.
That is, it is moved in the direction of the wiring board 13 and FIG.
As shown in (c), the support member 4 is connected to the wiring board 1.
3 to support the first semiconductor chip 12 at a constant distance from the surface (adhesive application surface) of the first semiconductor chip 12 to the tip of each adhesive discharge pipe, and a thermosetting resin-based adhesive such as resin. 11 is applied. At this time, the first semiconductor chip 1
7 and the tip 3A of the adhesive discharge pipe 3 are supported at a fixed distance, so that the resin adhesive 11 can be applied to a uniform thickness as shown in FIG. 7D. . Further, since the surface of the first semiconductor chip 12 and the tip 3A of the adhesive discharge pipe 3 do not come into contact with each other and are supported at a fixed distance, the surface of the first semiconductor chip 12 may be damaged. Lower. Next, as shown in FIG. 7D, the second semiconductor chip 14 is transported and placed on the applied resin-based adhesive 11.

Thereafter, the surface of the wiring board 13 is heated,
The resin-based adhesive 11 is cured to bond the second semiconductor chip 14 on the first semiconductor chip 12, and the external electrodes 12A of the first semiconductor chip 12, the terminal electrodes 13A of the wiring board 13, and the The external electrodes 14A of the two semiconductor chips and the terminal electrodes 13B of the wiring board are respectively wiped and bonded to form the first semiconductor chip 12, the second semiconductor chip 14, and the bonding wires 15 as shown in FIG. Resin sealing.

When the adhesive applying device 1 is moved in the z-axis direction to bring the support member 4 into contact with the wiring board 13, the amount of movement of the adhesive applying device 1 is large, and When the member 4 presses the wiring board 13, the wiring board 13 is deformed and the adhesive discharge pipe 3 is deformed.
May come into contact with the first semiconductor chip 12. Therefore, as shown in FIG.
A method is provided in which a pressure sensor 17 is provided at a position where the support member 4 of the wiring board 13 contacts, and the movement of the adhesive coating device 1 is stopped when a predetermined pressure is applied to the pressure sensor 17; As shown in (b), the optical transmitter 18A
Using the optical receiver 18B, the light 19 is allowed to pass through the position where the support member 4 is located, and the adhesive coating device 1 is moved in the z-axis direction so that the support member 4 approaches the wiring board 13 and FIG. As shown in (1), there is a method in which the movement is stopped when the light 19 is blocked by the support member 4 and is no longer received by the optical receiver 18B.

As described above, according to the second embodiment, the distance between the tip of the support member provided in the adhesive application device and the tip of the adhesive discharge pipe is determined by the first adhesive bonded to the wiring board. By setting to a value obtained by adding a margin to the height of the semiconductor chip, for example, a height of about 10 μm to 100 μm,
The position of the adhesive application device can be easily controlled, and the adhesive can be applied with a uniform thickness without damaging the surface of the first semiconductor chip. As a result, the semiconductor chips can be bonded to each other using an apparatus similar to the adhesive coating apparatus used for bonding the lead frame and the semiconductor chips, so that the manufacturing cost is lower than when an adhesive tape that is expensive and difficult to process is used. Can be reduced.

In addition, since the thickness of the adhesive applied to the surface of the first semiconductor chip can be made uniform, the flatness of the second semiconductor chip adhered on the first semiconductor chip can be improved. It also prevents poor wire connection.

FIGS. 9 and 10 are schematic views showing a modified example of the adhesive coating apparatus according to the present invention. In the above embodiment,
The column-shaped support members 4 are provided at the four corners of the adhesive application device 1, but the present invention is not limited to this.
As shown in FIG. 9A, a plate-shaped support member 20 may be provided along two sides of the adhesive coating device 1, or as shown in FIG. A support member 21 surrounding the periphery of the discharge pipe 3 may be provided. In the case where the adhesive application area is annular and the substrate near the center may be damaged, a support member 22 is provided at the center of the adhesive application apparatus 1 as shown in FIG. You may.

The tip 4A of the support member 4 is
As shown in FIG.
As shown in (b), when the support member 4 comes into contact with the material by coating (protecting) it with a material softer than the material (metal) of the adhesive coating device 1, for example, a protective cap 23 made of a fluororesin. In addition, the lead frame, the wiring board and the like are hardly damaged.

As described above, the present invention has been specifically described based on the above-described embodiment. However, the present invention is not limited to the above-described embodiment, and may be variously modified without departing from the gist thereof. Of course.

FIG. 11 is a schematic view showing an application example of a method of manufacturing a semiconductor device using the adhesive applying apparatus according to the present invention.

In the first embodiment, an example in which the support member 4 is brought into contact with the tab suspension lead 9 of the lead frame 6 and the resin adhesive 1 is applied on the tab 7 will be described. Although the example in which the resin-based adhesive 11 is applied on the semiconductor chip bonded on the wiring board has been described, the present invention is not limited to this.
As shown in FIG. 1A, the support member 4 may be brought into contact with the inner leads 24A of the lead frame, and the resin adhesive 11 may be applied on the semiconductor chip 12 bonded on the tab 24B. As shown in (b), LOC (Lead On Chip) in which the leads 25 are connected on the semiconductor chip 12
In a semiconductor device having a structure, a resin adhesive 11 is applied on the semiconductor chip 12 to adhere the semiconductor chip,
It can also be used when the lead 25 is sandwiched between two semiconductor chips. Further, in the adhesive application device 1, the support member 4 was used longer than the adhesive discharge pipe 3, but the support member 4 was shortened and deformed as shown in FIG. It is also possible to bring the supporting member 4 into contact with the lead 26 and apply the tip 3A of the adhesive discharge pipe 3 close to the semiconductor chip 12.

[0046]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1) In an adhesive coating apparatus having a plurality of adhesive discharge pipes, it is possible to easily control the distance from the tip of the adhesive discharge pipe to the adhesive application surface. (2) In the method of manufacturing a semiconductor device using the adhesive application device having the adhesive discharge pipe, the adhesive can be easily applied with a uniform thickness on the adhesive application surface.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating a schematic configuration of an adhesive application device according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram for explaining a method of manufacturing a semiconductor device using the adhesive application device of the first embodiment.

FIG. 3 is a schematic diagram for explaining a method of manufacturing a semiconductor device using the adhesive application device of the first embodiment.

FIG. 4 is a schematic diagram for explaining a method of manufacturing a semiconductor device using the adhesive application device of the first embodiment.

FIG. 5 is a schematic diagram illustrating a schematic configuration of an adhesive application device according to a second embodiment of the present invention.

FIG. 6 is a schematic diagram for explaining a method of manufacturing a semiconductor device using the adhesive application device according to the second embodiment.

FIG. 7 is a schematic diagram for explaining a method of manufacturing a semiconductor device using the adhesive application device according to the second embodiment.

FIG. 8 is a schematic diagram for explaining a method of manufacturing a semiconductor device using the adhesive application device of the second embodiment.

FIG. 9 is a schematic view showing a modified example of the adhesive application device according to the present invention.

FIG. 10 is a schematic view showing a modified example of the adhesive application device according to the present invention.

FIG. 11 is a schematic diagram for explaining an application example of a method of manufacturing a semiconductor device using the adhesive application device according to the present invention.

FIG. 12 is a schematic diagram for explaining a method of manufacturing a semiconductor device using a conventional adhesive application device.

FIG. 13 is a schematic diagram for explaining a problem of the related art.

FIG. 14 is a schematic diagram for explaining a problem of the related art.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Adhesive application apparatus, 2 ... Adhesive injection port, 3 ... Adhesive discharge pipe, 3A ... Tip of adhesive discharge pipe, 4, 20, 2
1, 22: Support member, 4A: Tip of support member, 5: Substrate, 5A: Adhesive applied surface, 6: Lead frame, 7: Tab (die pad), 7A, 12B: Adhesive applied area, 8
... Lead, 9 ... Tab suspension lead, 10 ... Outer frame, 11 ... Resin adhesive, 12 ... Semiconductor chip (first semiconductor chip),
12A: external electrode, 13: wiring board, 13A, 13B ...
Terminal electrode, 14: second semiconductor chip, 14A: external electrode, 15: bonding wire, 16: sealing resin, 17
... pressure sensor, 18A ... optical transmitter, 18B ... optical receiver,
19: light, 23: protective cap, 24A: inner lead, 24B: tab, 25: lead, 26: deformed lead,
27 ... empty package.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B05D 7/00 H01L 25/08 B 7/24 301 H01L 21/52 (72) Inventor Kazunari Suzuki Tokyo 5-22-1, Kamizuhoncho, Kodaira-shi F-term (reference) 4D075 AC07 AC88 AC93 CA47 DA06 DB14 DC22 EA35 4F041 AA06 AB01 BA05 BA22 BA56 4F042 AA07 BA08 CB03 5F047 AA11 BA21 BB11 FA22

Claims (3)

[Claims] 1. An adhesive having an adhesive injection port for injecting an adhesive, and a plurality of cylindrical adhesive discharge pipes for discharging the adhesive injected from the adhesive injection port and applying the adhesive to a predetermined area. In the adhesive dispensing device, in the vicinity of the adhesive discharge pipe, the tip has a height different from a plane formed by the tip of the adhesive discharge pipe, and extends from the tip of the adhesive discharge pipe to a coating surface. An adhesive applying device, comprising a support member for supporting a distance uniformly. 2. A method of manufacturing a semiconductor device, comprising: a step of applying an adhesive to a region on a lead frame on which a semiconductor chip is to be mounted; and a step of mounting and bonding the semiconductor chip on the applied adhesive. The step of applying the adhesive includes an adhesive discharge pipe including a plurality of pipes for applying the adhesive, and a support member having a tip at a height different from a plane formed by a tip of the adhesive discharge pipe. Is aligned in the horizontal direction so that the adhesive discharge pipe is located in a region where the semiconductor chip is mounted, and the support member is located on the lead of the lead frame. Moving the adhesive application device in the direction of the lead frame, bringing the tip of the support member into contact with the lead and pressing the lead, and moving the adhesive applying device forward from the tip of the adhesive discharge pipe. A method for manufacturing a semiconductor device, comprising: a step of maintaining a constant distance to a resin application surface of a lead frame; and a step of discharging and applying an adhesive from the adhesive discharge pipe. 3. A method of manufacturing a semiconductor device, comprising: a step of applying an adhesive to a surface of a first semiconductor chip bonded to a wiring board; and a step of mounting and bonding a second semiconductor chip on the applied adhesive. In the method, the step of applying the adhesive may include forming an adhesive discharge pipe including a plurality of pipes for applying the adhesive on the first semiconductor chip, and forming a distal end of the adhesive discharge pipe. A step of horizontally positioning an adhesive coating device provided with a support member having a tip at a height different from a plane so that the adhesive discharge pipe is positioned on the first semiconductor chip; Moving the dispensing device in the direction of the wiring board, bringing the support member into contact with the wiring board, and contacting the tip of the adhesive discharge pipe with the first
A method for manufacturing a semiconductor device, comprising: a step of maintaining a constant distance to an adhesive application surface on a semiconductor chip; and a step of discharging and applying an adhesive from the adhesive discharge pipe.