JP2002001567A - Laser processing equipment - Google Patents

Abstract

(57) [Abstract] (with correction) [PROBLEMS] To process a workpiece having a processing area larger than the operation range of the galvano scanner, the time of laser beam scanning by the galvanometer scanner and the processing of the workpiece by the XY table. Reduce the processing time and improve the accuracy by moving time. SOLUTION: A processing planning means 8 for rearranging a designation order of a laser beam irradiation position by a laser beam irradiation position command so as to conform to a moving order of a conveying means (XY table) 4,
A transport speed control unit 11 for generating a transport speed command for controlling a moving speed of the transport unit based on a positional relationship between a target position of the transport unit and a current position of the transport unit, and a transport speed command and a transport generated by the processing plan unit. A transfer position control unit 10 for controlling the movement of the transfer unit based on the position command is provided, and the transfer unit (XY table) 4 and the laser beam scanning unit (galvano scanner) 2 are simultaneously driven.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for performing drilling, cutting, marking, and the like, and in particular, by simultaneously driving a workpiece conveying means and a laser beam scanning means, thereby achieving high speed and high precision. The present invention relates to a laser processing apparatus capable of processing into a laser beam.

[0002]

2. Description of the Related Art A laser beam machine has been used for processing such as drilling and cutting a thin plate such as a printed wiring board with high precision as a workpiece. Such a laser processing machine needs to scan and process a laser beam with high speed and high accuracy in order to improve productivity. A galvanometer beam scanner (hereinafter, referred to as a galvanometer scanner) is generally used as a means for scanning a laser beam with high speed and high accuracy. Conventionally, a laser beam scanning means such as a galvano scanner and a transport means X for moving a work table are set.
2. Description of the Related Art A laser processing apparatus using two position control means including a Y table in combination is widely used.

FIG. 12 is a perspective view showing the above-described conventional laser processing apparatus disclosed in Japanese Patent Application Laid-Open No. 58-123702, in which an electronic circuit formed on an insulating substrate as a workpiece is trimmed. I do. For example, laser trimming for adjusting a resistance value by cutting a part of a resistor in an electronic circuit is performed. In the figure, reference numeral 100 denotes an insulating substrate, which is a workpiece, on which an electronic circuit to be trimmed is formed. 11
0, 120, 130, and 140 are examples of blocks that are multi-divided within the movement range of the beam positioner, 150 is an XY table, 160 is a probe card, and 170 is block 11.
The resistors to be trimmed within 0, 180, 180 'are probes, 190 is a laser light source, 200 is an expander, 2
10 is an X axis galvano scanner, 220 is a Y axis galvano scanner, 230 is an objective lens, 240 is a 90 degree reflecting mirror,
250 is the X-axis drive source of the XY table 150, 260 is X
The Y-axis drive source of the Y table 150. The expander 200, the X-axis galvano scanner 210, and the Y-axis galvano scanner 220 constitute a beam positioner that positions a laser beam.

Next, the operation will be described. The insulating substrate 100 on which the electronic circuit to be trimmed is formed is moved to the blocks 110, 120, and 13 within the movement range of the beam positioner.
It is divided into multiple parts like 0 and 140 and fixed together with the probe card 160 on the XY table 150. In the illustrated example, the insulating substrate 100 partitioned into blocks 110
The upper resistor 170 is connected to the measuring instrument by probes 180, 180 'fixed on the probe card 160,
The resistance value is measured.

The trimming operation by the laser light will be described. The laser light emitted from the laser light source 190 is moved at a high speed by the expander 200, the X-axis galvano scanner 210, and the Y-axis galvano scanner 220, and the objective lens 230 is moved. And the light reflected by the 90-degree reflecting mirror 240 on the resistor 170. When the laser beam is scanned by the X-axis galvano scanner 210 and the Y-axis galvano scanner 220 and trimming of the resistor 170 is completed, the laser beam is scanned to another electronic circuit to be trimmed in the block 110 to perform a trimming operation. When the trimming of the electronic circuit to be trimmed in the block 110 is completed, the X-axis drive source 250 of the XY table 150,
The Y-axis drive source 260 is operated to move the block 120 under the beam positioner. After that, trimming is performed on the electronic circuit to be trimmed in the block 120 in the same manner as described above, and when this is completed, the blocks 130 and 140 are similarly trimmed.

As described above, in the conventional laser processing apparatus,
The operation of the beam positioner, which is a laser beam scanning unit, including the expander 200, the X-axis galvano scanner 210, and the Y-axis galvano scanner 220, and the operation of the beam positioner including the XY table 150, the X-axis drive source 250, and the Y-axis drive source 260 The workpiece conveying means are separately driven to process the workpiece. More specifically, the galvano scanners 210 and 220 can scan at high speed by moving a light mirror to scan laser light, but have a small operating range. On the other hand, the XY table 150 has a large operating range, but is difficult to move at high speed because it conveys a large-mass object. Thus, in the related art, machining is performed by separately driving the two so that the operation ranges and the moving speeds of the two are matched. In the example of the laser processing apparatus disclosed in Japanese Patent Application Laid-Open No. 58-123702, a laser beam is scanned in the operation range of the galvano scanners 210 and 220 with the XY table 150 stopped, and the galvano scanners 210 and 2 are scanned.
With the substrate 20 stopped, the insulating substrate 10 as the workpiece is
0, the unprocessed portions are galvanometer scanners 210 and 22
The insulating substrate 100 is moved by the XY table 150 so as to come within the operation range of 0.

[0007]

Since the conventional laser processing apparatus is configured as described above, in order to process a workpiece having a processing area larger than the operation range of the galvano scanners 210 and 220, Galvano scanner 21
In addition to the laser light scanning time of 0 and 220, a moving time of the workpiece by the XY table 150 is required, and there is a problem that the processing time becomes long.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. By simultaneously driving a workpiece conveying means and a laser beam scanning means, high-speed and high-precision processing can be performed. An object is to obtain a laser processing device.

[0009]

A laser processing apparatus according to the present invention comprises a laser light generating means for generating laser light for processing, and a laser light generated by changing a trajectory of the laser light generated by the laser light generating means. Laser light scanning means for moving the irradiation position of the laser beam, conveying means for changing the relative position between the laser light scanning means and the work, and a laser light irradiation position command for designating the laser light irradiation position on the work And a transfer position command for specifying a target position of the transfer means corresponding to the laser light irradiation position command, and the laser by the laser light irradiation position command is adapted to conform to the moving order of the transfer means moving according to the transfer position command. Processing planning means for rearranging the designation order of the light irradiation position; and transfer means for the transfer means based on the positional relationship between the target position of the transfer means specified by the transfer position command and the current position of the transfer means. Transport speed control means for generating a transport speed command for controlling the dynamic speed, and transport for controlling the movement of the transport means based on the transport speed command generated by the transport speed control means and the transport position command generated by the processing plan means The laser beam is irradiated to the laser beam irradiation position on the workpiece specified by the laser beam irradiation position command based on the position control unit and the laser beam irradiation position command generated by the processing plan unit and the current position of the transfer unit. The laser beam scanning control means for controlling the laser beam scanning means as described above, and performs the processing while simultaneously driving the transporting means and the laser beam scanning means.

A laser processing apparatus according to the present invention comprises: a laser light generating means for generating a processing laser light; and a laser light generating means for changing a trajectory of the laser light generated by the laser light generating means to move an irradiation position of the laser light. A plurality of laser light scanning means, each of which is driven at a constant interval, a conveying means for changing a relative position between each of the plurality of laser light scanning means and the workpiece, and a plurality of laser light scanning means For each of the laser light irradiation position command that specifies the laser light irradiation position on the workpiece, and a transfer position command that specifies the target position of the transfer means corresponding to the laser light irradiation position command, Processing plan means for rearranging the designation order of the laser light irradiation position by the laser light irradiation position command so as to conform to the moving order of the transfer means moving in accordance with the transfer position command; The step extracts, from among the target positions of the transporting means specified by the transporting position command generated for each of the plurality of laser beam scanning means, the one that minimizes the interval between the current position of the transporting means and this Conveying speed control means for generating a conveying speed command for controlling the moving speed of the conveying means based on the positional relationship with the current position of the conveying means, a conveying speed command generated by the conveying speed control means, and a conveying position generated by the machining planning means. A transfer position control means for controlling the movement of the transfer means based on the command, and a workpiece specified by the laser light irradiation position command based on the laser light irradiation position command generated by the processing planning means and the current position of the transfer means. Laser light scanning control means for controlling a plurality of laser light scanning means so that the laser light is irradiated to the laser light irradiation position on the upper part, a conveying means and a plurality of laser light scanning means, And performs processing while simultaneously driven.

In the laser processing apparatus according to the present invention, the processing planning means generates a transfer position command such that the transfer position command is at a position added by a fixed distance from a target position of the transfer means corresponding to the laser light irradiation position command, and the transfer speed is adjusted. The control means generates a transfer speed command for controlling the moving speed of the transfer means based on the positional relationship between the position of the transfer means specified by the transfer position command generated by the processing planning means and the current position of the transfer means. .

In the laser processing apparatus according to the present invention, the laser beam scanning control means smoothly interpolates the laser beam irradiation position designated by the previous laser beam irradiation position command to the current laser beam irradiation position command. A command value is generated, and a laser beam scanning position command comprising a difference between the acceleration / deceleration pattern command value and a predicted position of the transport unit after a predetermined time estimated from the current position of the transport unit and the current speed of the transport unit is generated. A delay compensating means for controlling the laser beam scanning means based on the laser beam scanning position command calculated by the delay compensating means.

A laser processing apparatus according to the present invention simulates a processing operation using parameters such as an operating range of a laser beam scanning unit, a distance to be added to a target position of a transporting unit, and a moving speed of the transporting unit before performing the processing. It is provided with an operation condition determining means for determining a parameter for maximizing the processing performance.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below. Embodiment 1 FIG. FIG. 1 is a perspective view showing a laser processing apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a block diagram showing a configuration of a control system of the laser processing apparatus according to Embodiment 1. In the figure, reference numeral 1 denotes a laser oscillator (laser light generating means) for generating a processing laser light, which may be used in a conventional laser processing apparatus such as an Nd: YAG laser. 2 is a galvano scanner (laser beam scanning means) for scanning the laser beam, 3 is an fθ lens for condensing the laser beam at a desired position on the workpiece 7, and 4 is for transporting the workpiece 7 XY table (transporting means), X axis and Y
The illustration of the drive source for the shaft is omitted. Reference numeral 5 denotes a linear scale for detecting the position of the work 7, and detects the position of the work 7 from the operation of the XY table 4. 6 is a laser oscillator 1
The laser beam 7 emitted from is a workpiece, and in the illustrated example, a thin plate such as a printed wiring board is shown. Numeral 8 denotes a machining planning means, which is a workpiece 7 preset by a user.
An XY table that generates a laser beam irradiation position command specifying the laser beam irradiation position above and a transfer position command specifying the target position of the XY table 4 corresponding to the laser light irradiation position command, and moves in accordance with the transfer position command The order in which the laser light irradiation positions are specified by the laser light irradiation position command is rearranged so as to conform to the movement order of Step 4.

Numeral 9 denotes a laser beam scanning control means, which is a laser beam irradiation position command generated by the machining planning means 8 and an XY table 4.
The galvano scanners 2 and 2 are controlled so that the laser beam is irradiated to the laser beam irradiation position on the workpiece 7 specified by the laser beam irradiation position command based on the current position of the laser beam.
10 is X based on the transfer speed command generated by the transfer speed control means 11 and the transfer position command generated by the machining planning means 8.
This is a transfer position control means for controlling the movement of the Y table 4, and is composed of a commercially available numerical controller or the like. Numeral 11 denotes a conveying speed control means for generating a conveying speed command for controlling the moving speed of the XY table 4 based on the positional relationship between the target position of the XY table 4 specified by the conveying position command and the current position of the XY table 4. . Reference numeral 12 denotes a laser beam irradiation position command pattern generation unit (laser beam scanning unit), which constitutes a laser beam scanning control unit 9 and which uses the laser beam irradiation position command generated by the machining planning unit 8 last time to irradiate the current laser beam. A laser beam irradiation position command pattern (acceleration / deceleration pattern command value) for smoothly interpolating the laser beam irradiation position specified by the position command is generated. Reference numeral 13 denotes a laser beam scanning servo unit (laser beam scanning unit) that operates the galvano scanners 2 and 2 based on the laser beam scanning position command input from the subtracting unit 19.
Reference numeral 19 denotes a difference between the current position of the XY table 4 from the linear scales 5 and 5 and the laser light irradiation position command pattern from the laser light irradiation position command pattern generating means 12 to obtain a laser light scanning position command (value). This is a subtraction unit input to the scanning servo unit 13.

Next, the operation will be described. First, before starting machining, a user sets a laser beam irradiation position command for designating a laser beam irradiation position on the workpiece 7 in advance in the machining planning means 8, and the entire laser beam irradiation position command on the workpiece 7 is correspondingly set. A transfer position command for specifying a target position of the XY table 4 is generated based on the processing range. Specifically, the laser beam irradiation positions specified by the laser beam irradiation position command are ordered so as to conform to the moving order of the XY table 4 that moves according to the transfer position command, and the target position of the XY table 4 is set to the laser beam irradiation position. Make it correspond to the command. The transfer position commands are all output to the transfer position control means 10 before the start of processing.

After the processing is started, the processing planning means 8 outputs the laser light irradiation position commands one by one to the laser light irradiation position command pattern generating means 12 one by one according to the progress of the processing, and simultaneously the XY table corresponding to the laser light irradiation position command. The target position No. 4 is output to the transport speed control means 11. Transport speed control means 1
1 compares the target position of the XY table 4 input from the processing plan means 8 with the current position of the XY table 4 input from the linear scale 5 and generates a transfer speed command for controlling the moving speed of the XY table 4. Transfer position control means 1
Output to 0.

The transfer position control means 10 includes a processing plan means 8
The XY table 4 is moved and accelerated / decelerated in accordance with a transfer position command and a transfer speed command input from the control unit 11 and the transfer speed control unit 11, respectively. In addition, the laser beam irradiation position command pattern generation unit 12 receives the 1
A laser beam irradiation position command pattern that smoothly interpolates from the previous laser beam irradiation position command to the current laser beam irradiation position command is generated and output to the subtraction unit 19. Subtraction unit 19
Outputs the laser beam irradiation position command to the laser beam scanning servo means 13 as a laser beam irradiation position command, which is obtained by subtracting the current position of the XY table 4 measured by the linear scale 5 from the laser beam irradiation position command pattern. Laser beam scanning servo means 13
Controls the galvano scanners 2 and 2 based on the laser beam scanning position input from the subtracting unit 19.

In this way, by associating the laser beam irradiation position command for controlling the scanning of the laser beam with the transfer position command and the transfer speed command for controlling the operation of the XY table 4, the XY table 4 and the The galvano scanner 2 is driven at the same time. When the laser beam reaches the laser beam irradiation position on the workpiece 7 designated by the laser beam irradiation position command, the laser beam 6 is irradiated from the laser oscillator 1 to perform the processing. At this time, during the operation of the galvano scanner 2 as the laser beam scanning means, the XY table 4 as the transport means moves toward the target position specified by the transport position command corresponding to the laser beam irradiation position command. By
The distance from the center of the operation range of the galvano scanner 2 to the laser beam irradiation position specified by the laser beam irradiation position command on the workpiece 7 is reduced.

Thus, when the moving speed of the XY table 4 is sufficiently high, the laser beam irradiation position command on the workpiece 7 is designated from the center of the operation range of the galvanometer scanners 2 and 2. The distance to the position is always kept within the operation range of the galvano scanner 2. Also, even when the moving speed of the XY table 4 is not high, the galvano scanners 2
The waiting time for moving is reduced. As described above, the entire processing time can be reduced.

The above-described operation will be specifically described. First,
Conventionally, to process the entire processing range of the workpiece 7, (1) the laser beam is scanned by the galvano scanner 2 to process the workpiece 7 within the operation range. (2) The next processing area on the workpiece 7 is moved to the operation range of the galvano scanner 2 by the XY table 4. (3) The laser beam is scanned by the galvano scanner 2 to process the next processing area of the workpiece 7. The above (1),
It is necessary to repeat the operations (2) and (3), and the total processing time is the time required for (1) + the time required for (2) + (3)
It is the time required. In the present invention, since the operations (1) and (2) can be performed simultaneously, when the XY table 4 is sufficiently fast, the total processing time is approximated to the time (1). Further, even when the XY table 4 is not at a high speed, the workpiece 7 in (2) can be operated during the operation time in (1).
Moves, and the time of (2) is shortened.

Here, the operation of rearranging the laser beam irradiation position specified by the laser beam irradiation position command generated by the processing planning means 8 will be described. FIG. 3 is a diagram for explaining the rearrangement of laser beam irradiation positions of the laser processing apparatus according to the first embodiment. When the workpiece 7 is viewed from above, the processing range of the workpiece 7 is changed to the operating range of the galvano scanner 2. Are divided into smaller blocks. In the figure, symbols A, B, C,..., X are assigned to each block in order from bottom to top, and numbers 1, 2, 3,. For example, the lower left is block A1, the lower right is block An
Becomes Here, n is the number of blocks in the horizontal direction, and only the lower left block A1 and the lower right block An are displayed. Further, the block A1 is divided into four vertically long rectangular blocks a11, a12, a13, and a14,
Is divided into two vertically long rectangular blocks an1 and an2 and four horizontally long rectangular blocks ana, anb, anc and and.

Next, the operation will be described. FIG. 4 is a flowchart showing a reordering operation of the laser beam irradiation position designated by the laser beam irradiation position command by the machining planning means of the laser machining apparatus according to the first embodiment, and the description will be made along this. First, in step ST1, the block from the block A1 to the left half of the block An is divided into vertically long rectangular blocks each having a width of 1/4 of the block. Next, step ST2
In, the machining planning means 8 searches for a laser beam irradiation position designated by a preset laser beam irradiation position command from the vertically long rectangular block a11. In step ST3, the laser beam irradiation position specified by the laser beam irradiation position command is searched from the bottom of the vertically-long rectangular block a11 to the top, and the processing planning means 8 orders the appearance in the order of appearance, and searches for the vertically-long rectangular block a12 on the right. Move the target.

In step ST4, the laser beam irradiation position specified by the laser beam irradiation position command is searched from the top to the bottom of the vertically-long rectangular block a12, and the processing planning means 8 arranges them in the order of appearance. a13
Move the search target to. In step ST5, it is determined whether or not the search for the laser beam irradiation position specified by the laser beam irradiation position command has been completed up to the left half surface of the block An. If the search has not been completed, the process returns to step ST3, and the search in the vertically long rectangular block is continued. If the search has been completed up to the left half of the block An, the process proceeds to step ST6.

In step ST6, the right half surface of the block An is divided into a horizontally long rectangular block at a height of 1/4 of the block, and a laser beam irradiation position designated by the laser beam irradiation position command is designated from the lower horizontal rectangle block ana. Start the search. In step ST7, the laser beam irradiation positions designated by the laser beam irradiation position command are searched from left to right of the horizontally long rectangular block ana, ordered in the order of appearance, and the search target is moved to the next horizontally elongated rectangular anb block. . In step ST8, the laser beam irradiation position designated by the laser beam irradiation position command is searched from the right to the left of the horizontally long rectangular block anb, and the positions are arranged in the order of appearance.
The search target is moved to the next higher rectangular block anc.

In step ST9, the search for the laser beam irradiation position designated by the laser beam irradiation position command is performed in block A.
It is checked whether the process has been completed up to the horizontal rectangular block and at the upper end of n. If it has not been completed, the process returns to step ST7 to continue the search in the horizontally long rectangular block, and if it has been completed to the horizontally long rectangular block and, the process proceeds to step ST10. Thereafter, until the search for the laser beam irradiation position specified by all the laser beam irradiation position commands is completed, the machining planning means 8
Repeats the division of the block into a horizontally long rectangle and a vertically long rectangle, and the search and ordering of the laser beam irradiation position designated by the laser beam irradiation position command in the rectangular block (step ST10).

Next, the relationship between the laser beam irradiation position command, the target position of the XY table, and the transfer position command will be described. FIG. 5 is a diagram for explaining the relationship between the target position of the XY table and the transfer position command with respect to the laser light irradiation position specified by the laser light irradiation position command, and is a diagram when the workpiece 7 is viewed from above. In FIG. 5, similarly to FIG. 3, the processing range of the workpiece 7 is divided into small blocks within the operation range of the galvano scanner 2, and only the lower left block A1 and the lower right block An are displayed. Here, for the laser beam irradiation position existing in the left half of the block A1, the center of the block A1 is set as the target position of the XY table 4 as the transport means. Also, the block An starts from the right half of block A1
In the area up to the left half of the XY table 4, the middle point on the right side of each vertically long rectangle (a12,..., An2) including the laser beam irradiation position is set as the target position.

The irradiation position of the laser beam is 1 at the lower right of the block An.
If it exists in the area of / 4, the center of the block An is set as the target position of the XY table 4. Block Bn (not shown) in the upper right 1/4 of the block An and the second right of the block An
, The upper left vertex of each horizontally long rectangle (anc, and,...) Including the laser beam irradiation position is set as the target position of the XY table 4. The center of the block Bn is set as the target position of the XY table 4 for the laser beam irradiation position existing in the upper right quarter of the block Bn. Thereafter, similarly, the target position of the XY table 4 is determined.

In the illustrated example, each of the transfer target positions of the XY table 4 exists on a line connecting the center points of the blocks located at the left and right ends of the workpiece 7 and is transferred to the left end point of the line. The movement start point of the XY table 4 is determined by designating the position command. The transfer position control means 10 moves the XY table 4 in the order of the target position specified by the transfer position command.
Further, as described above, the conveying speed control unit 11 compares the target position of the XY table 4 associated with the laser beam irradiation position command with the current position of the XY table 4 by the processing planning unit 8. At this time, the transport speed control means 11
When the target position of the Y table 4 is ahead of the current position,
The speed of the XY table 4 is increased according to the distance, and X
When the target position of the Y table 4 is located before the current position, a conveyance speed command is generated so as to decelerate or stop the XY table 4, and the conveyance position control means 10 is controlled based on the command to thereby control the laser beam. The position of the XY table 4 is controlled so that the position of the XY table 4 is appropriate for the irradiation position command.

As described above, according to the first embodiment, the laser oscillator 1 that generates the processing laser light 6,
The trajectory of the laser beam 6 generated by the laser oscillator 1 is changed to change the irradiation position of the laser beam 6, and the relative position between the galvano scanners 2, 2 and the workpiece 7 is changed. XY table 4 to be processed, a laser light irradiation position command for designating a laser light irradiation position on the workpiece 7, and an X corresponding to the laser light irradiation position command.
A transfer position command that specifies the target position of the Y table 4 is generated, and the order of specifying the laser light irradiation position by the laser light irradiation position command is rearranged so as to match the moving order of the XY table 4 that moves according to the transfer position command. A transfer speed control for generating a transfer speed command for controlling the moving speed of the XY table 4 based on the positional relationship between the target position of the XY table 4 specified by the transfer position command and the current position of the XY table 4. Means 11, a transfer position control means 10 for controlling the movement of the XY table 4 based on a transfer speed command generated by the transfer speed control means 11 and a transfer position command generated by the processing plan means 8, and a processing plan means 8 The laser beam irradiation position command specified by the laser beam irradiation position command and the current position of the XY table 4 on the workpiece 7 specified by the laser beam irradiation position command. Since laser beam scanning control means 9 for controlling the galvanometer scanners 2 and 2 so that the laser beam is irradiated to the light irradiation position is provided, and the XY table 4 and the galvanometer scanners 2 and 2 are simultaneously driven, the processing is performed. X
The Y table 4 and the galvanometer scanners 2 and 2 can be controlled synchronously. Even when the operation range of the galvanometer scanners 2 and 2 is limited, the XY scanner is stopped by stopping the galvanometer scanners 2 and 2 as in the related art. There is no need to wait for the table 4 to move, and the processing time can be reduced.

The transfer position control means 10 is provided with a transfer speed command generated by the transfer speed control means 11 and a processing plan means 8.
It is only necessary to input the generated transfer position command and adjust the power to be supplied to the drive source of the XY table 4 using these commands, so that a commercially available numerical controller can be used. This makes it possible to obtain a laser processing device constituting a cooperative synchronization system at low cost.

Embodiment 2 FIG. In the second embodiment, a plurality of laser beam scanning means are provided, and the laser beam scanning means and the transport means are simultaneously driven to perform processing.

FIG. 6 is a perspective view showing a laser processing apparatus according to Embodiment 2 of the present invention, and has two sets of laser beam scanning means including a galvano scanner 2 and an fθ lens 3. In the figure, reference numeral 14 denotes a laser beam splitting means for splitting a laser beam 6 in two directions, and uses a beam splitter or an acousto-optic element. Reference numeral 15 denotes a bend mirror that changes the direction of the laser light 6. The same components as those in FIG. 1 are denoted by the same reference numerals, and duplicate description will be omitted.

FIG. 7 is an explanatory view for explaining the processing operation of the laser processing apparatus according to the second embodiment, in which the workpiece 7 is viewed from above. In the figure, the hatched portion inside the circle indicating the fθ lens 3 indicates the operating range of the galvano scanners 2,..., 2 at the current position of the XY table 4. f
The laser light scanning means including the θ lens 3a scans the laser light 6 on the upper end face of the workpiece 7, and the laser light scanning means including the fθ lens 3b scans the laser light 6 on the lower end face of the workpiece 7. The distance between the plurality of fθ lenses 3a and 3b is manually or automatically adjusted according to the operation range of the galvano scanners 2,.

Next, the operation will be described. As shown by the arrow in FIG. 7, the processing first proceeds from the lower left to the lower right along the X axis, then proceeds upwards along the Y axis, and then proceeds from right to left along the X axis. And then proceed in a similar procedure.
The processing planning means 8 includes a plurality of galvanometer scanners 2,.
A laser beam irradiation position command and a conveyance position command are generated for the two sets in the same manner as in the first embodiment. When the processing is started, the transport speed control unit 11 determines the difference between the target position specified by the transport position command and the current position of the XY table 4 for each of the plurality of galvanometer scanners 2,. Is calculated, the one with the smallest interval from the current position is extracted, and a transport speed command for controlling the moving speed of the XY table 4 is generated based on the positional relationship between this and the current position of the XY table 4. The laser processing apparatus according to the second embodiment operates in the same manner as the first embodiment except that each of the plurality of laser beam scanning units is driven at a constant interval.

As described above, according to the second embodiment, the laser oscillator 1 that generates the processing laser light 6,
The irradiation position of the laser beam 6 is moved by changing the trajectory of the laser beam 6 generated by the laser oscillator 1, and a plurality of galvano scanners 2, each of which is driven at a constant interval,
, 2 and a plurality of galvano scanners 2, ..., 2
And an XY table 4 for changing a relative position between each of the workpieces 7 and a plurality of galvanometer scanners 2,.
, 2 for each of a laser beam irradiation position command specifying the laser beam irradiation position on the workpiece 7 and a transport position command specifying the target position of the XY table 4 corresponding to the laser beam irradiation position command. And a processing planning means 8 for rearranging the designation order of the laser light irradiation position by the laser light irradiation position command so as to conform to the moving order of the XY table 4 moving according to the transfer position command. Of the target positions of the XY table 4 specified by the transfer position command generated for each of the galvano scanners 2,..., Those having the minimum interval with the current position of the XY table 4 are extracted. Transport speed control means 11 for generating a transport speed command for controlling the moving speed of the XY table 4 based on the positional relationship between the transport position and the current position of the XY table 4; A transport position control means 10 for controlling the movement of the XY table 4 based on a transport speed command generated by the speed control means 11 and a transport position command generated by the processing planning means 8, and a laser beam irradiation generated by the processing planning means 8 Based on the position command and the current position of the XY table 4, a plurality of galvanometer scanners 2,... Are provided so that the laser beam is irradiated to the laser beam irradiation position on the workpiece 7 designated by the laser beam irradiation position command. , 2 for controlling the scanning while simultaneously driving the XY table 4 and the plurality of galvanometer scanners 2,..., 2, the plurality of galvanometer scanners 2,. , 2 and a single XY table 4 can be controlled synchronously,
Even when the operation range of the plurality of galvanometer scanners 2,... 2 is limited, it is necessary to stop the plurality of galvanometer scanners 2,. And the processing time can be greatly reduced.

The transfer position control means 10 controls the transfer speed command generated by the transfer speed control means 11 and the machining planning means 8.
It is only necessary to input the generated transfer position command and adjust the power to be supplied to the drive source of the XY table 4 using these commands, so that a commercially available numerical controller can be used. This makes it possible to obtain a laser processing device constituting a cooperative synchronization system at low cost.

Embodiment 3 In the third embodiment, the processing plan means generates a transfer position command so that the transfer position command is located at a position added by a certain distance from the target position of the transfer means corresponding to the laser beam irradiation position command, and the transfer speed control means A transport speed command for controlling the moving speed of the transport unit is generated based on a positional relationship between the position of the transport unit designated by the transport position command generated by the unit and the current position of the transport unit.

The processing planning means 8 according to the third embodiment gives a position preceding the target position of the XY table 4 calculated from the laser beam irradiation position command by a certain distance as a transfer system position command. Hereinafter, the preceding distance is referred to as a preceding distance. FIG. 8 is an explanatory view for explaining the processing operation of the laser processing apparatus according to Embodiment 3 of the present invention.
The workpiece 7 is viewed from above. Only the lower right block An is displayed among the small blocks within the operation range of the galvano scanner 2 in which the processing range of the workpiece 7 is divided. The left half surface of the block An is divided into two vertically elongated rectangular blocks an1 and an2 having a width of 1/4 of the block An.
The right half surface of the block An is four blocks ana, anb, an which are horizontally long rectangles at a height of 1/4 of the block An.
It is divided into c and and. The laser beam irradiation position specified by the laser beam irradiation position command existing in the vertically rectangular block from the lower left block A1 to the left half surface of the lower right block An precedes rightward from the middle point on the right side of the vertically rectangular block. The target position of the transfer position command corresponding to the position obtained by adding the distance corresponds to each position. However, the processing planning means 8 adjusts the value of the preceding distance so that the transfer position command after adding the preceding distance is not to the right of the center of the block An. Further, the preceding distance is not added to the transport system position command corresponding to the laser beam irradiation position command existing in the lower right quarter of the block An. Upper right 1 of block An
In the transfer position command corresponding to the laser light irradiation position specified by the laser light irradiation position command existing in the area 4, the position obtained by adding the preceding distance upward from the upper left vertex of the horizontally long rectangular blocks anc and and is the transfer position. This is the target position of the XY table 4 specified by the command. Hereinafter, the preceding distance is similarly added to the transfer position command.

Next, the outline will be described. Although the laser processing apparatus according to the present invention drives the galvano scanner 2 and the XY table 4 simultaneously, the moving speed of the galvano scanner 2 is higher than the moving speed of the XY table 4.
Therefore, when the delay of the XY table 4 is large, the laser beam irradiation position command pattern generating means 12
The laser beam irradiation position command obtained by taking the difference between the laser beam irradiation position command pattern positioned above and the current position of the XY table 4 falls outside the operation range of the galvano scanner 2, and the galvano scanner 2 moves the laser beam scanning position. It stops at the maximum value within the operation range closest to the command, and waits for the movement of the XY table 4. Therefore, the third embodiment
By adding the preceding distance to the transfer position command as in the laser processing apparatus of FIG.
Even when the speed of the galvano scanner 2 is higher than the speed of the Y table 4, the waiting time of the galvano scanner 2 for the movement of the XY table 4 can be reduced, and the overall processing time can be reduced.

As described above, according to the third embodiment, the transfer position command is set so as to be at a position added by a fixed distance from the target position of the XY table 4 corresponding to the laser beam irradiation position command. Is generated, and the transfer speed control unit 11 determines the moving speed of the XY table 4 based on the positional relationship between the position of the XY table 4 specified by the transfer position command generated by the processing planning unit 8 and the current position of the XY table 4. Since the conveyance speed command to be controlled is generated, even when the speed of the galvano scanner 2 is higher than the speed of the XY table 4, the delay of the XY table 4 is reduced by adding the preceding distance to the conveyance position command, and the XY table The time that the galvano scanner 2 waits for the movement of the scanner 4 is reduced, and the overall processing time can be reduced.

Embodiment 4 In the fourth embodiment, a laser beam scanning control unit generates an acceleration / deceleration pattern command value for smoothly interpolating a laser beam irradiation position designated by a previous laser beam irradiation position command to a current laser beam irradiation position command. A delay compensating means for generating a laser beam scanning position command comprising a difference between the acceleration / deceleration pattern command value and a predicted position of the conveying means after a certain time estimated from the current position of the conveying means and the current speed of the conveying means. And controls the laser light scanning means based on the laser light scanning position command calculated by the delay compensation means.

FIG. 9 is a block diagram showing a configuration of a laser processing apparatus according to Embodiment 4 of the present invention. In the figure, reference numeral 16 denotes a delay compensation circuit (delay compensation means) for calculating a predicted position of the XY table 4 after a predetermined time, and 19a denotes an XY table based on the laser beam irradiation position command pattern generated by the laser beam irradiation position command pattern generation unit 12. When generating the laser beam scanning position command (value) by subtracting the current position of No. 4
Instead of the current position of the XY table 4, the delay compensation circuit 1
Reference numeral 6 denotes a subtraction unit (delay compensation unit) that calculates a laser beam scanning position command (value) using the calculated predicted position of the XY table 4 after a predetermined time. Further, the delay compensation circuit 16 calculates the predicted position of the XY table 4 by the following equation. P ＾ = P + V · Tb (1) where P ＾ is the predicted position of the XY table 4 after delay compensation, P is the current position of the XY table 4, V is the current speed of the XY table 4, and Tb is the laser. This is a time constant equivalent to the control sampling time of the galvano scanner 2 as the optical scanning means. The same components as those in FIG. 2 are denoted by the same reference numerals, and redundant description will be omitted.

FIG. 10 is an explanatory diagram for explaining delay compensation of the transport means of the laser processing apparatus according to the fourth embodiment.
(A) shows the laser beam irradiation position on the workpiece 7 at the time T, and (b) shows the laser beam irradiation position on the workpiece 7 at the time T + ΔT. In the figure, at time T, the position of the laser beam scanning system with respect to the laser beam irradiation position a on the workpiece 7 is point A. It is also assumed that the galvano scanner 2 reaches the point A at time T + ΔT after ΔT time which is the control sampling time of the galvano scanner 2. In addition,
The same components as those in FIG. 1 are denoted by the same reference numerals, and redundant description will be omitted.

Next, the outline will be described. During the period from time T to time T + ΔT, the XY table 4 displays the speed V
As shown in FIG. 10B, the laser beam irradiation position command a on the workpiece 7 moves rightward by the moved distance V · ΔT of the XY table 4 as shown in FIG. I have. Therefore, in the laser processing apparatus according to the fourth embodiment, at the time T, the predicted position in consideration of the moving distance V · ΔT for the ΔT time of the XY table 4 is determined by the delay compensation circuit 16.
The subtraction unit 19a generates a laser beam scanning system position command from the difference between the predicted position calculated by the delay compensation circuit 16 and the laser beam irradiation position command pattern instead of the current position of the XY table 4. Thus, by controlling the galvano scanner 2 in accordance with the laser beam scanning position command, the point A
From this point B becomes the laser beam scanning system position, and the laser beam irradiation position at time T + ΔT can be moved to point a.

As described above, according to the fourth embodiment, the laser beam scanning control means 9 smoothly adjusts the laser beam irradiation position designated by the previous laser beam irradiation position command to the current laser beam irradiation position command. A laser beam irradiation position command pattern to be interpolated is generated, and a laser consisting of a difference between the laser beam irradiation position command pattern and the predicted position of the XY table 4 after a certain period of time estimated from the current position and current speed of the XY table 4. Delay compensation circuit 16 for generating optical scanning position command
And a delay compensator comprising a subtractor 19a, which controls the galvano scanner 2 based on the laser beam scanning position command calculated by the delay compensator, so that the galvano scanner 2 recognizes the current position of the XY table 4 In this case, a delay corresponding to the control sampling time of the galvano scanner 2 can be considered, and the accuracy of the laser beam irradiation position can be improved. Thereby, high-precision laser processing can be realized.

Embodiment 5 In the fifth embodiment, the processing operation is simulated by using the operating range of the laser beam scanning means, the distance to be added to the target position of the transport means, and the moving speed of the transport means as parameters before the processing is performed, and the processing performance is most improved. An operating condition determining means for determining a parameter to be performed is provided.

FIG. 11 is a block diagram showing a configuration of a laser processing apparatus according to Embodiment 5 of the present invention. In the figure, reference numeral 17 denotes a laser beam irradiation position command pattern generation unit 12.
Irradiating position command pattern (operating range of the galvano scanner 2) generated by the processing planning means 8
A simulation unit (operating condition determining means) that simulates a processing operation using the distance to be added to the target position of the table 4 and the moving speed of the XY table 4 as parameters, and determines parameters that improve processing performance the most. The same components as those in FIG. 2 are denoted by the same reference numerals, and redundant description will be omitted.

Next, the outline will be described. When the delay of the XY table 4 is large, a laser beam scanning system position command obtained by subtracting the current position of the XY table 4 from the laser beam irradiation position command pattern on the workpiece 7 is out of the operation range of the galvano scanner 2, and When the scanner 2 stops at the maximum value within the operation range closest to the laser beam scanning system position command, X
It is necessary to wait for the Y table 4 to move. For this reason, the entire machining time becomes longer by this time. Therefore, in the fifth embodiment, the preceding distance and the maximum speed of the XY table 4 to be added to the transport position command, which is the target position of the XY table 4,
The function to adjust by simulation before the processing is added.

The simulation section 17 includes a laser beam irradiation position command pattern (operating range of the galvano scanner 2),
The preceding distance to be added to the target position of the XY table 4 and X
The simulation for simultaneously driving the XY table 4 and the galvano scanner 2 is performed by changing the maximum speed of the Y table 4 in several ways. The processing time obtained from such trial and error is the shortest, and / or the laser beam 6
The laser beam irradiation position command pattern (operating range of the galvano scanner 2) that minimizes the error of the scanning position or minimizes the error within a certain period of processing time is added to the target position of the XY table 4. And the maximum speed of the XY table 4 are determined. By performing actual machining using these parameters, it is possible to reduce machining time and improve accuracy.

As described above, according to the fifth embodiment, the operation range of the galvano scanner 2, the distance to be added to the target position of the XY table 4, and the XY table 4
Since the simulation unit 17 that simulates the machining operation using the moving speed of the parameter as a parameter and determines the parameter that most improves the machining performance is provided, the machining time can be reduced and the accuracy can be improved.

[0052]

As described above, according to the present invention, a laser beam generating means for generating a laser beam for processing, and the trajectory of the laser beam generated by the laser beam generating means are changed to irradiate the laser beam. Laser light scanning means for moving the position, conveying means for changing the relative position between the laser light scanning means and the work, and a laser light irradiation position command for specifying a laser light irradiation position on the work, And generating a transfer position command that specifies a target position of the transfer means corresponding to the laser light irradiation position command, and irradiating the laser light by the laser light irradiation position command so as to conform to the moving order of the transfer means that moves according to the transfer position command. Processing plan means for rearranging the position designation order, and control of the moving speed of the transfer means based on the positional relationship between the target position of the transfer means specified by the transfer position command and the current position of the transfer means Transfer speed control means for generating a transfer speed command, and transfer position control means for controlling the movement of the transfer means based on the transfer speed command generated by the transfer speed control means and the transfer position command generated by the processing planning means. The laser beam is irradiated such that the laser beam is radiated to the laser beam irradiation position on the workpiece specified by the laser beam irradiation position command based on the laser beam irradiation position command generated by the processing planning unit and the current position of the transfer unit. Laser beam scanning control means for controlling the scanning means, and the processing is performed while simultaneously driving the transport means and the laser light scanning means, so that the transport means and the laser light scanning means can be synchronously controlled, and the laser Even when the operation range of the light scanning means is limited, there is no need to stop the laser light scanning means and wait for the movement of the conveying means as in the related art, thereby shortening the processing time. There is an effect that theft can be.

The transfer position control means inputs the transfer speed command generated by the transfer speed control means and the transfer position command generated by the machining planning means, and adjusts the power supplied to the drive source of the transfer means with these. Therefore, a commercially available numerical controller can be used. Thereby, there is an effect that a laser processing apparatus constituting a cooperative synchronization system can be obtained at low cost.

According to the present invention, the laser light generating means for generating the processing laser light and the trajectory of the laser light generated by the laser light generating means are changed to move the irradiation position of the laser light. A plurality of laser light scanning means driven at a constant interval, a conveying means for changing a relative position between each of the plurality of laser light scanning means and the workpiece, and a plurality of laser light scanning means, respectively. On the other hand, a laser beam irradiation position command for designating a laser beam irradiation position on the workpiece and a conveyance position command for designating a target position of the conveyance means corresponding to the laser beam irradiation position command are generated. Processing planning means for rearranging the designation order of the laser beam irradiation position by the laser beam irradiation position command so as to conform to the moving order of the conveying means moving according to Among the target positions of the transporting means specified by the transporting position command generated for each of the optical scanning means, the one having the smallest interval with the current position of the transporting means is extracted, and A transfer speed control unit for generating a transfer speed command for controlling the moving speed of the transfer unit based on the positional relationship of the transfer unit, and a transfer speed command generated by the transfer speed control unit and a transfer position command generated by the processing plan unit. Transfer position control means for controlling the movement of the transfer means, and laser light on the workpiece specified by the laser light irradiation position command based on the laser light irradiation position command generated by the processing planning means and the current position of the transfer means. Laser light scanning control means for controlling the plurality of laser light scanning means so that the irradiation position is irradiated with the laser light, wherein the transport means and the plurality of laser light scanning means are simultaneously driven. While performing the processing, the same effect as in the above paragraph 0053 can be obtained, and a plurality of laser light scanning means and a single conveying means can be controlled synchronously, thereby limiting the operation range of the plurality of laser light scanning means. Even in the case where there is, there is no need to stop a plurality of laser beam scanning means and wait for the movement of the transporting means as in the related art, and there is an effect that the processing time can be greatly reduced.

According to the present invention, the processing plan means generates the transfer position command so as to be at a position added by a fixed distance from the target position of the transfer means corresponding to the laser beam irradiation position command, and the transfer speed control means A transfer speed command for controlling the moving speed of the transfer means based on the positional relationship between the position of the transfer means specified by the transfer position command generated by the processing planning means and the current position of the transfer means. Even when the speed of the laser beam scanning means is higher than that of the above, the delay of the carrying means is reduced by adding the preceding distance to the carrying position command, and the time for which the laser beam scanning means waits for the movement of the carrying means is shortened. This has the effect that the overall processing time can be reduced.

According to the present invention, the laser beam scanning control means sets the acceleration / deceleration pattern command value for smoothly interpolating the laser beam irradiation position designated by the previous laser beam irradiation position command to the current laser beam irradiation position command. Delay compensation for generating a laser beam scanning position command comprising a difference between the acceleration / deceleration pattern command value and a predicted position of the conveyance means after a predetermined time estimated from the current position of the conveyance means and the current speed of the conveyance means. Means for controlling the laser beam scanning means based on the laser beam scanning position command calculated by the delay compensating means, so that when the laser beam scanning means recognizes the current position of the conveying means, the laser beam scanning The delay of the control sampling time of the means can be considered, and the accuracy of the laser beam irradiation position can be improved. Thereby, there is an effect that high-precision laser processing can be realized.

According to the present invention, the processing operation is simulated using the operating range of the laser beam scanning means, the distance to be added to the target position of the conveying means, and the moving speed of the conveying means as parameters before executing the processing. Is provided with an operation condition determining means for determining a parameter for improving the processing time, so that the processing time can be shortened and the accuracy can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a laser processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a block diagram illustrating a configuration of a control system of the laser processing apparatus according to the first embodiment.

FIG. 3 is a diagram for explaining rearrangement of laser beam irradiation positions of the laser processing apparatus according to the first embodiment.

FIG. 4 is a flowchart showing a reordering operation of a laser beam irradiation position designated by a laser beam irradiation position command by a machining planning unit of the laser machining apparatus according to the first embodiment.

FIG. 5 is a diagram illustrating a relationship between a target position of an XY table and a transfer position command with respect to a laser light irradiation position designated by a laser light irradiation position command.

FIG. 6 is a perspective view showing a laser processing apparatus according to a second embodiment of the present invention.

FIG. 7 is an explanatory diagram illustrating a processing operation of the laser processing apparatus according to the second embodiment.

FIG. 8 is an explanatory diagram illustrating a processing operation of a laser processing apparatus according to a third embodiment of the present invention.

FIG. 9 is a block diagram showing a configuration of a laser processing apparatus according to Embodiment 4 of the present invention.

FIG. 10 is an explanatory diagram for explaining delay compensation of a transport unit of a laser processing apparatus according to a fourth embodiment.

FIG. 11 is a block diagram showing a configuration of a laser processing apparatus according to Embodiment 5 of the present invention.

FIG. 12 is a perspective view showing a conventional laser processing apparatus.

[Explanation of symbols]

1 laser oscillator (laser light generating means), 2 galvano scanner (laser light scanning means), 3 fθ lens, 4
XY table (transportation means), 5 linear scale, 6
Laser light, 7 workpiece, 8 processing planning means, 9 laser light scanning control means, 10 transfer position control means, 11 transfer speed control means, 12 laser light irradiation position command pattern generation means (laser light scanning means), 13 laser Optical scanning servo means (laser light scanning means), 14 laser beam splitting means, 15 bend mirror, 16 delay compensation circuit (delay compensation means), 17 simulation section (operating condition determination means), 19 subtraction section, 19a subtraction section (delay) Compensation means).

Claims (5)

[Claims] 1. A laser light generating means for generating a processing laser light, a laser light scanning means for changing a trajectory of the laser light generated by the laser light generating means and moving an irradiation position of the laser light, A conveying means for changing a relative position between the laser light scanning means and the workpiece, a laser light irradiation position command for designating a laser light irradiation position on the workpiece, and a laser light irradiation position command corresponding to the laser light irradiation position command. A transfer position command for specifying the target position of the transfer means is generated, and the designation order of the laser light irradiation position by the laser light irradiation position command is changed so as to conform to the movement order of the transfer means moving according to the transfer position command. Processing planning means for rearranging, and a moving speed of the transport means based on a positional relationship between a target position of the transport means specified by the transport position command and a current position of the transport means. Transfer speed control means for generating a transfer speed command for controlling the degree, and controlling the movement of the transfer means based on the transfer speed command generated by the transfer speed control means and the transfer position command generated by the machining planning means. Transfer position control means, and a laser light irradiation position on the workpiece specified by the laser light irradiation position command based on the laser light irradiation position command generated by the processing planning means and a current position of the transfer means. And a laser beam scanning control unit for controlling the laser beam scanning unit so that the laser beam is irradiated on the laser beam scanning unit, and performing a process while simultaneously driving the transporting unit and the laser beam scanning unit. 2. A laser light generating means for generating a processing laser light, and a laser beam irradiation position is moved by changing a trajectory of the laser light generated by the laser light generating means. A plurality of laser light scanning means to be driven while being held; a conveying means for changing a relative position between each of the plurality of laser light scanning means and the workpiece; and a plurality of laser light scanning means. Generating a laser light irradiation position command specifying a laser light irradiation position on the workpiece and a transfer position command specifying a target position of the transfer means corresponding to the laser light irradiation position command; Processing planning means for rearranging the designation order of the laser light irradiation position by the laser light irradiation position command so as to conform to the movement order of the transfer means moving in accordance with the command; The target position of the transport unit designated by the transport position command generated by the image unit for each of the plurality of laser beam scanning units is extracted from the target position of the transport unit having the minimum interval with the current position of the transport unit. A transport speed control unit for generating a transport speed command for controlling a moving speed of the transport unit based on a positional relationship between the transport speed and the current position of the transport unit; and a transport speed command generated by the transport speed control unit. A transfer position control unit that controls the movement of the transfer unit based on the transfer position command generated by the processing plan unit, and a laser beam irradiation position command generated by the processing plan unit and a current position of the transfer unit. Controlling the plurality of laser beam scanning means so that the laser beam is irradiated to the laser beam irradiation position on the workpiece specified by the laser beam irradiation position command based on the laser beam irradiation position command And a laser light scanning control means, the laser machining apparatus for machining while simultaneously driven and the conveying means and the plurality of laser beam scanning means. 3. The processing plan means generates a transfer position command so as to be at a position added by a fixed distance from a target position of the transfer means corresponding to the laser beam irradiation position command. A transfer speed command for controlling a moving speed of the transfer means based on a positional relationship between the position of the transfer means specified by the transfer position command generated by the means and a current position of the transfer means. The laser processing apparatus according to claim 1 or 2. 4. The laser beam scanning control means generates an acceleration / deceleration pattern command value for smoothly interpolating a laser beam irradiation position designated by a previous laser beam irradiation position command to a current laser beam irradiation position command. A delay compensating means for generating a laser beam scanning position command comprising a difference between an acceleration / deceleration pattern command value and a current position of the conveying means and a predicted position of the conveying means after a predetermined time estimated from a current speed of the conveying means. 3. The laser processing apparatus according to claim 1, wherein the laser beam scanning unit is controlled based on the laser beam scanning position command calculated by the delay compensating unit. 5. A processing operation is simulated using the operating range of the laser beam scanning means, the distance to be added to the target position of the transporting means, and the moving speed of the transporting means as parameters before performing the processing, thereby improving processing performance most. 4. The laser processing apparatus according to claim 3, further comprising an operation condition determining means for determining the parameter.