JP2002090684A - Optical scanner and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical scanner which has superior handling properties and resistance to a shock and can stably obtain desired driving characteristics in a temperature range used. SOLUTION: This optical scanner has a support 11, having a couple of erected pieces, a couple of holding frames 12 provided on a pair of erected pieces of the support 11, a movable plate 13 which has a mirror surface 17 for reflecting light, a pair of elastic members 18 which connect the opposite sides of the movable plate 13 and the couple of holding frames 12 in a both-end supporting beam state, and a driving means which drives and displaces the movable plate 13, and further has the holding frames 12, movable plate 13, and elastic members 18 formed into a single body on one substrate; and the elastic members 18 are made of a materials, having fillers in high polymer resin and are characterized by that a modulus of tensile elasticity at 25 deg.C being 10 to 20 GPa and a modules of tensile elasticity within the use ambient temperature range being <=2 GPa.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an optical scanning device for reflecting light from a light source and scanning the reflected light.

[0002]

2. Description of the Related Art Generally, in an electrophotographic copying machine, a laser printer, a bar code reader, or the like, when forming or reading an image, an optical scanning device is used to transmit an image signal obtained by optical scanning. However, such an optical scanning device has been required to have high-speed scanning, high stability, high durability, high image quality, and the like.

Japanese Patent Application Laid-Open No. 7-175005 discloses a movable plate 504 provided with a total reflection mirror 508 at a central portion on a silicon substrate 502 and a movable plate 504 provided on the movable plate 504 as shown in FIGS. Drive coil 505 and torsion bar 50 connecting silicon substrate 502 and movable plate 504
3 are integrally formed, glass substrates 506 and 506 ′ are bonded to the upper and lower surfaces of the silicon substrate 502 by an anodic bonding method, and permanent magnets 507 are attached to the upper and lower glass substrates 506 and 506 ′, respectively. Galvano mirror 50
The invention of a galvanomirror configured to form 0 is disclosed. 8 and 9, reference numeral 509 denotes an electrode terminal.

[0004]

However, in the case of the galvanomirror 500 disclosed in the above-mentioned conventional Japanese Patent Application Laid-Open No. 7-175005, the torsion bar 503 formed on the silicon substrate 502 has a surface treated on the silicon substrate 502. And the driving characteristics of the movable plate 504 in the high-frequency range are as follows:
The width and thickness of the torsion bar 503 must be extremely thin and thin, and as a result, the torsion bar 503 which is very brittle
Therefore, it becomes weak against shocks during manufacturing and use, which reduces the yield and shortens the product life.

In order to avoid this, it has been attempted to form the torsion bar 503 with a polymer resin such as polyimide. However, on the contrary, it is difficult to obtain good driving characteristics in a high frequency range because of its softness. Had.

Further, the silicon substrate 502 is replaced with a glass substrate 5
06, 506 ', the wall surface of the silicon substrate 502 is located near the drive coil 505, so that the permanent magnet 507 has to be arranged on the sandwiched glass substrate 506. As a result, the drive coil Since the distance between the permanent magnet 505 and the permanent magnet 507 is long, the drive coil 5
06, the magnetic field acting on the movable plate 504 is weakened, and there is also a problem that it is difficult to secure the driving force.

In order to avoid such a problem, it is possible to increase the dimension between the wall surface of the silicon substrate 502 and the drive coil 505 from the beginning, and to position the permanent magnet 507 between them. In this case, the size of the entire galvanomirror 500 increases, and the manufacturing cost increases.

The present invention has been made in view of the above circumstances, and provides an optical scanning device which is excellent in handleability, withstands impact, and can stably obtain desired driving characteristics in a use temperature range. It is an object of the present invention to provide a manufacturing method capable of obtaining an optical scanning device capable of exhibiting more stable and efficient driving characteristics.

[0009]

According to a first aspect of the present invention, there is provided a support having a pair of upright pieces, a pair of holding frames provided on the pair of upright pieces of the support, and at least one surface. A movable plate having a mirror surface for reflecting light, a pair of elastic members for connecting between the opposing sides of the movable plate and the pair of holding frames in a doubly supported manner, and displacing the movable plate; An optical scanning device having the holding frame, the movable plate, and the elastic member integrally formed on a single substrate, wherein the elastic member contains a filler in a polymer resin, Tensile elastic modulus at 25 ° C is 10 GPa or more and 20 G
Pa or less, and a change in tensile elasticity within a use environment temperature range is within 2 GPa.

According to the first aspect of the present invention, a pair of elastic members are formed in a doubly supported beam shape, a holding frame for supporting each elastic member is formed using a pair of standing pieces, and the elastic member is formed of a polymer resin. The filler is contained therein, the tensile elasticity at 25 ° C. is 10 GPa or more and 20 GPa or less, and the fluctuation of the tensile elasticity within a use environment temperature range is 2 GPa or less. Even with the elastic member of the base, the synergistic effect with the mixed filler increases rigidity enough to support the movable plate in a displaceable manner, enhances the handleability of the optical scanning device itself, and is excellent in impact resistance. In addition, it is possible to provide an optical scanning device capable of stably realizing desired driving characteristics in a use temperature range.

According to a second aspect of the present invention, there is provided a method of manufacturing an optical scanning device, wherein a pair of parallel holding frames and a mirror surface for reflecting light are formed on at least one of the surfaces, and the driving means constitutes a planar shape. A movable plate having a rectangular shape formed with a coil, a pair of elastic members respectively connecting the center of opposing sides of the movable plate and the pair of holding frames in a doubly supported manner, A step of integrally forming a unit composed of a pair of unnecessary frames that respectively connect between both ends of the pair of holding frames at a position occupying the outside by a semiconductor manufacturing process, and a pair of holding frames of the unit are provided on a support. A step of disposing the unit on a support, each unit being fixed on a pair of standing pieces, a step of removing a pair of unnecessary frames of the unit, and a region outside the movable plate from which the pair of unnecessary frames has been removed. Each constitute a driving means Gunetto is what, characterized in that it comprises a step of attaching a pair of yokes for supporting the respective magnets in a state in which faces in proximity to said movable plate to said support ends.

In the invention according to claim 2, a pair of holding frames of the unit formed by a semiconductor manufacturing process are fixed on a pair of standing pieces provided on the support, respectively, and the unit is arranged on the support. The pair of unnecessary frames of the unit are removed, and the magnets constituting the driving means are respectively arranged in the outer regions of the movable plate from which the pair of unnecessary frames have been removed, in the state where the magnets face each other in the vicinity of the movable plate. A pair of yokes that support the movable plate are attached to both ends of the support, so that the movable plate and the magnet can be brought close to each other, and the driving characteristics of the movable plate by electromagnetic force can be enhanced to realize high-speed scanning. Can be manufactured.

According to a third aspect of the present invention, in the method of manufacturing an optical scanning device according to the second aspect, the elastic member is made of a polymer resin containing a filler by a semiconductor manufacturing process. Has a tensile modulus of 10G
It is not less than Pa and not more than 20 GPa, and a variation in tensile elasticity within a use environment temperature range is formed within 2 GPa.

According to the third aspect of the present invention, the elastic member can enhance the rigidity enough to displaceably support the movable plate by a synergistic effect with the mixed filler even if the polymer resin base is used. Therefore, it is possible to manufacture an optical scanning device capable of improving the handleability of the optical scanning device itself, having excellent impact resistance, and stably realizing desired driving characteristics in a use temperature range.

[0015]

Embodiments of the present invention will be described below in detail.

(Embodiment 1) Hereinafter, an optical scanning device according to Embodiment 1 of the present invention and a method for manufacturing the same will be described with reference to FIGS. 1, 2, 3, 4A to 4I. I will explain.

FIG. 1 is a perspective view showing a schematic configuration of the optical scanning device according to the first embodiment. FIG. 2 is a sectional view taken along line AA which is a central axis of the optical scanning device shown in FIG. FIG. 3 is a sectional view taken along the line BB ′ of FIG.

FIGS. 4A to 4I are diagrams showing the manufacturing steps of the optical scanning device according to the first embodiment, respectively.
FIG. 5 is a perspective view showing a mounting process of the optical scanning device according to the first embodiment.

As shown in FIG. 1, the optical scanning device according to the first embodiment has an inverted U-shaped cross section and a pair of standing pieces 11a, 1a.
Said supporting pieces 11a in the support 11 having
11b, a rectangular movable plate 1 formed in a rectangular shape and capable of vibrating as a free end of a pair of elastic members 18 is provided at a substantially central portion of the movable member 1b.
3 and a pair of permanent magnets 15 made of permanent magnets disposed close to and opposed to both ends of the movable plate 13 that are orthogonal to the pair of elastic members 18.

The movable plate 13 and a pair of holding frames 12 integrally provided on both the standing pieces 11a and 11b of the support 11 and functioning as fixed ends are formed in a cantilevered and leaf-spring shape. They are connected by a pair of elastic members 18.

On the surface of the movable plate 13, a mirror surface 17 as a total reflection mirror is formed. A coil 16 composed of two inner and outer coils 16a and 16b is provided on the movable plate 13 so as to go around the periphery of the movable plate 13.

From the inner coil 16a, coil ends are drawn out so as to straddle the outer coil 16b, and each end of the flexible (flexible) substrate 20 is routed through wiring provided on the one elastic member 18. It is connected to the connection pad 19 provided on the part.

On the other hand, both ends of the outer coil 16b are connected to connection pads 19 provided on the end of the flexible board 20 by wires provided on the elastic member 18 as they are.

In the manufacturing process of the optical scanning device, the wirings on the elastic member 18 are formed at the same time, so that the wirings and the connecting portions at both ends of the coils 16a and 16b have stepped portions in the wirings. Are formed.

Here, the magnets 15 have a magnetization direction substantially perpendicular to the vibration direction of the movable plate 13,
The magnetized surface is arranged so that the approximate center thereof faces a position facing the plane of the coils 16a and 16b.

Outside the pair of magnets 15, yokes 14 each having a rectangular plate shape are joined.
Are fixed to both ends of the support 11, and the yokes 14 support the magnets 15 on both ends of the support 11 and in the vicinity of both ends of the movable plate 13, respectively.

Next, a sectional structure of the optical scanning device shown in FIG. 1 along the line AA 'and the line BB' will be described with reference to FIGS.

As shown in FIG. 2, the optical scanning device of FIG.
When viewed in a cross section along the line −A ′, one holding frame 12 is
It is formed by laminating a silicon substrate 200, a silicon nitride film 210, a first polyimide layer 220, a second polyimide layer 230, and a third polyimide layer 240. The other holding frame 12 is formed by stacking a silicon nitride film 210, a silicon substrate 200, a silicon nitride film 210, a first polyimide layer 220, and a second polyimide layer 230.

Further, on the second polyimide layer 230 on the other holding frame 12, a wiring 142 over the coil 16 and a connection pad 19 thicker than the wiring 142 are provided. A through-hole is formed in a portion corresponding to the connection pad 19 in the third polyimide layer 240 laminated thereon, and the wiring 143 of the flexible substrate 20 is formed by the anisotropic conductive adhesive 300 filled in the through-hole. And the connection pad 19 are connected.

The movable plate 13 has a structure in which the coils 16 a and 16 b are formed on the first polyimide layer 220 in addition to the same laminated structure as the one holding frame 12.

The elastic member 18 is formed by laminating a first polyimide layer 220, a second polyimide layer 230, and a third polyimide layer 240, and the elastic member 18 on the connection pad 19 side has a second polyimide layer. Wiring 1 on 230
42 are arranged.

As the silicon substrate 200, a silicon single crystal substrate having a (1,0,0) plane orientation is used.
Polyimide is an organic insulating material having elasticity, and its elastic modulus is considerably smaller than that of a silicon single crystal substrate, so that the first polyimide layer 220 and the second polyimide layer 23
The zero and third polyimide layers 240 are elastically deformable elastic thin films.

Here, the thickness of the third polyimide layer 240 is determined by the first polyimide layer 220 and the second polyimide layer 23.
It is formed substantially equal to the sum of the film thicknesses of 0.

Therefore, in the elastic member 18, the thicknesses of the coils 16 a and 16 b provided on the second polyimide layer 230 are arranged at substantially equal positions in the thickness direction of the elastic member 18.

Further, in one holding frame 12, in order to connect with a drive circuit, a wiring 143 on a flexible substrate 20 provided with a coverlay film 30 for insulating protection, and a connection pad 19 on the holding frame 12 are formed. Are connected via the anisotropic conductive adhesive 300 as described above.

As shown in FIG. 3, the optical scanning device of FIG.
When viewed in a cross section along line -B ', the movable plate 13 shown in FIG.
The pair of magnets 15 fixed to the wall surfaces of the pair of yokes 14 are arranged with the same clearance symmetrically in the left-right direction with respect to the laminated structure forming.

The pair of magnets 15 and the coil 16 constitute a driving means (actuator) for driving the movable plate 13 by applying an electromagnetic force to the movable plate 13.

Next, the operation of the optical scanning device having such a configuration will be described. An alternating current is supplied to the coils 16a and 16b from a power source (not shown) via the connection pad 19.

The alternating current flowing through the coils 16a and 16b is applied to both magnets 1 located near both ends of the movable plate 13.
5 interact with the magnetic lift produced by coils 5a,
, A particularly large electromagnetic force acts near both ends of the movable plate 13. That is, both magnets 15 and coils 16a, 1
The movable plate 13 is vibrated by a part of 6b.

Since the current flowing through the coils 16a and 16b is an alternating current, the direction of the force applied to the planar coils 16a and 16b changes periodically.

Here, among the first polyimide layer 220, the second polyimide layer 230, and the third polyimide layer 240,
Portions that are not bonded to the silicon substrate 200 have relatively low rigidity, and these portions are made of leaf spring-like elastic members 18.
The movable plate 13 vibrates in its thickness direction.

The resonance frequency of the movable plate 13 is uniquely determined by the shapes and materials of the movable plate 13 and the elastic member 18. By supplying an alternating current having a frequency equal to the resonance frequency to the coils a and 16b, The movable plate 13 vibrates with the maximum amplitude determined by the current value.

The light reflected by the mirror surface 17 on the movable plate 13 is reciprocally scanned within a range of a deflection angle determined by the vibration amplitude of the movable plate 13. Obtain an image signal.

Next, a method of manufacturing the optical scanning device according to the first embodiment will be described with reference to FIGS. 4 (A) to 4 (I).

As shown in FIG. 4A, the plane orientation is (1, 1).
A rectangular silicon substrate 200 having a (0,0) plane is prepared, and after cleaning, a silicon nitride film 210 is formed on the surface using a low-pressure CVD apparatus. The silicon nitride film 210 on the lower surface side of the silicon substrate 200 is partially removed by dry etching and patterned, and the patterned silicon nitride film 210 is used for forming the holding frame 12 and the movable plate 13 from the silicon substrate 200. Functions as a mask.

The silicon nitride film 210 on the upper surface side is
When the holding frame 12 and the movable plate 13 are formed from the silicon substrate 200, the structure has a role of protecting a structure formed above the silicon nitride film 210 on the upper surface from the etching process of the silicon substrate 200.

Next, as shown in FIG. 4B, a first polyimide layer 220 is formed on the silicon nitride film 210 on the upper surface side.
Is formed. The first polyimide layer 220 is formed by uniformly applying a liquid polyimide solution on the silicon nitride film 210 formed on the silicon substrate 200 by a printing method or a spin coating method, and drying and curing the film.

Next, as shown in FIG. 4C, the coils 16a and 16b are formed on the first polyimide layer 220. The coils 16a and 16b are formed by forming an aluminum film by sputtering and patterning the film by etching.

Next, as shown in FIG. 4D, a second polyimide layer 230 covering the coils 16a and 16b is formed on the first polyimide layer 220. As in the case of the first polyimide layer 220, the second polyimide layer 230 is formed by uniformly applying a liquid polyimide solution on the first polyimide layer 220, drying and curing.

Next, as shown in FIG. 4E, a wiring 142 is formed on the second polyimide layer 230. The wiring 142 is formed by patterning the sputtered aluminum film by etching.

In this step, the wiring 14 is formed so as to straddle the planar coil 16b manufactured in the step of FIG.
In order to form the second polyimide layer 230, first, the upper polyimide at the inner peripheral end of the coil 16b is removed by etching, an aluminum film is formed on the removed portion, and interlayer connection is established by patterning. An aluminum film is formed thereon and patterned.

Next, as shown in FIG. 4F, a third polyimide layer 240 is formed on the wiring 142 and the second polyimide layer 230. Similarly to the first and second polyimide layers 220 and 230, the third polyimide layer 240 is formed by uniformly applying a liquid polyimide solution on the second polyimide layer 230, and baking and curing it.

The third polyimide layer 240 is formed so that the elastic member 18 has predetermined characteristics, and at the same time, the wiring 142 manufactured in the step shown in FIG.
It plays a role in preventing exposure to the air and causing a change with time, and a role of insulating protection.

Further, the thickness of the third polyimide layer 240 is
A film is formed substantially equal to the sum of the thicknesses of the first polyimide layer 220 and the second polyimide layer 230.
Of the elastic member 18 are arranged at approximately two equally-spaced positions in the thickness direction of the elastic member 18.

Further, the mirror surface 17 of the third polyimide layer 240
The mirror surface 17 is formed by depositing a chromium film and then an aluminum film by an electron shower method on a portion corresponding to.

As shown in FIG. 4G, the portion of the third polyimide layer 240 located on the end of the connection pad 19 is removed by dry etching.

The polyimide used for each of the first polyimide layer 220, the second polyimide layer 230, and the third polyimide layer 240 has high rigidity itself.
For example, a spherical silica fine powder having an average particle size of 0.5 μm, for example, “Admafin SO-C2” (manufactured by Admatechs) is coated on the surface of “U Imide Type A” (manufactured by Unitika). After processing, a predetermined amount is added and mixed, applied by screen printing, dried and cured to form.

Next, the pair of holding frames 12, the driving plate 13, and the pair of unnecessary frames 40 for connecting both ends of the pair of holding frames 12, respectively.
4H, a region other than the region where the pair of elastic members 18 is formed is removed, and as shown in FIG. 4H, an alkaline solution is applied using the patterned silicon nitride film 210 on the lower surface of the silicon substrate 200 as a mask. A part of the silicon substrate 200, that is, the pair of elastic members 1
8 is removed from the lower surface by anisotropic etching.

At this time, the silicon nitride film 210 under the first polyimide layer 220 functions as a mask layer for protecting the first polyimide layer 220 when the silicon substrate 200 is etched and penetrated.

Next, as shown in FIG. 4I, the silicon nitride film 21 serving as a mask layer of the first polyimide layer 220 is formed.
After the etching of the silicon substrate 200, a part of 0 is removed by dry etching.

The unit constituting the optical scanning device manufactured as described above is connected to a flexible substrate (flexible substrate) 20. That is, the wiring 143 to the drive circuit is formed using the anisotropic conductive adhesive 300, and the flexible substrate 20 whose surface is insulated and protected by the cover lay film 30.
After connecting the unit and the flexible board 20 by thermocompression bonding to one of the holding frames 12 of the unit, as shown in FIG.
a and 11b are fixed on the support 11 in such a manner as to be joined to each other.

Thereafter, the portions of the pair of unnecessary frames 40 connecting the both ends of the pair of holding frames 12 are mechanically broken and removed, and furthermore, the region where the pair of unnecessary frames 40 is removed is removed. With the pair of magnets 15 facing each other, the pair of yokes 14 supporting the magnets 15 are attached to the support 1.
The optical scanning device according to the first embodiment as shown in FIG.

In order to make the unnecessary frame 40 easily breakable,
It is preferable that a scribe line or the like is previously formed on the silicon substrate 200 by etching or the like.

According to the optical scanning device according to the first embodiment described in detail above, the light beam diameter can be increased by the electromagnetic driving method, and the movable plate 13 can be reduced in weight by patterning the coil 16. , High-speed scanning can be stably realized, and the use of the double-supported beam method and the torsion method enables stable driving with less positional fluctuation.
Since the positions of the a and 16b and the magnet 15 can be made closer to each other, a high-efficiency, low-power-consumption type, excellent impact resistance, and excellent drive characteristics with a mirror surface 17 having a large displacement width are provided. A simple optical scanning device can be provided.

Further, by manufacturing using a micromachining technique by micromachining, the holding frame 12 and the elastic member 1 are formed.
Since the movable plate 8 and the movable plate 13 can be integrally formed in a series of steps, a subsequent assembling step is not required, and a very small optical scanning device can be mass-produced in large quantities at low cost.

Further, since the semiconductor manufacturing technology is applied, an optical scanning device having high dimensional accuracy and very little variation in characteristics can be manufactured.

The elastic member 18 is made of polyimide as an organic insulating material as a base, and spherical silica fine powder is mixed therein as an inorganic filler. The tensile elasticity at 25 ° C. is 10 GPa or more and 20 GPa or less. By using a material in which the variation in the tensile elasticity within the temperature range is suppressed to within 2 GPa, brittle fracture is less likely to occur than an elastic member using a silicon substrate.
It is excellent in impact resistance and therefore excellent in handling properties, and can obtain a large deflection angle, and can realize stable driving characteristics within a use environment temperature range.

In addition, since the coil 16 and the wiring 142 are not exposed on the surface of the polyimide layer but are formed inside, the change in characteristics due to moisture and oxidation can be suppressed.

The tensile modulus at 25 ° C. is 10 GP.
If it is less than a, the inherent properties of a flexible resin are exhibited, and the rigidity is insufficient, so that it cannot be applied to an optical scanning device requiring high-speed scanning.

The tensile modulus at 25 ° C. is 20 G
When it exceeds Pa, the rigidity tends to be good, but the adhesive strength between the resin and the filler is insufficient and the resin becomes brittle, the impact resistance is weakened, and a defect similar to the case of the silicon substrate appears. I will.

Further, if the change in the tensile modulus within the temperature range of the use environment is larger than 2 GPa, for example, -30
When applied to equipment used at temperatures between
The driving characteristics vary within a temperature range of ° C., which necessitates the addition of a temperature compensation circuit.

Further, the mirror surface 17 and the coils 16a, 16
b, the unnecessary frame 40 is removed, and the yoke 14 to which the magnet 15 is attached is attached to the support 11, so that handling properties can be maintained and drive characteristics can be maintained. And the magnets 1 of the coils 16a, 16b
5 can also be made more efficient by approaching the position.

In the first embodiment, in the elastic member 18, the wiring 142 is arranged at a position approximately equal to the thickness in the thickness direction. Usually, during operation of the optical scanning device, the elastic member 18 is greatly deformed, and as a result, stress is generated.

If the wiring 142 is formed on the outermost layer of the elastic member 18, the stress repeatedly breaks due to the stress. However, according to the structure of the first embodiment, long-term reliability can be obtained.

Incidentally, the respective structures of the first embodiment are not limited to those described above, and various modifications and changes are possible.
For example, the planar coils 16a and 16b can be formed by plating instead of sputtering and etching. In this case, since the thickness of the wirings can be easily increased, the resistance of the coils 16a and 16b is reduced while the number of turns is increased, and the electromagnetic force is increased. Can be obtained.

Each layer of the polyimide is a material that can exhibit various characteristics depending on physical properties such as rigidity and linear expansion coefficient, or a method of applying each layer such as a solvent-soluble type, a photoreaction type, an addition type, and a thermoplastic type. Therefore, it is not necessary to use the same material, and a combination is also possible.

The resin system is not limited to a polyimide resin system, but may be an epoxy resin system, an acrylic resin system,
Other types of resins, such as polyester resin, can also be applied.

Further, the filler to be mixed can be properly used not only in a spherical shape but also in a whisker shape, a flake shape, a fibrous shape or the like according to desired characteristics. In addition, as the filler, not only silica, but also alumina, aluminum nitride, boron nitride, etc., insulating ceramic fine powder, resin powder, etc.
They can be used alone or in combination.

For the patterning of each layer of the polyimide, a technique using laser ablation can be applied.

Further, in the first embodiment, the same kind of polyimide resin is used for each layer of polyimide. However, depending on the configuration, a method of applying various combinations of various polyimides and fillers to each layer can be used. .

In the first embodiment, the mirror surface 17 is formed on the third polyimide layer 240. However, the polyimide layer and the silicon nitride film in the central portion are all removed by etching to remove the surface of the silicon substrate 200. After being exposed, aluminum may be sputtered here to form a film.

In the first embodiment, the movable plate 1
Although the mirror surface 17 is formed on the upper portion of the movable plate 13, when a reflected light detection circuit or the like is formed on the support 11 between the movable plate 13 and the support 11, The mirror surface 17 may be formed by forming a metal thin film made of gold or the like.

The connection between the wiring 143 of the flexible substrate 20 and the connection pad 19 on the holding frame 12 may be made by a method of resin bonding by wire bonding.

Further, the method of driving the movable plate 13 is not limited to the reciprocating motion using an alternating current equal to the resonance frequency. For example, it is possible to perform static positioning by driving using a variable frequency or driving using a direct current. It is.

(Embodiment 2) Next, Embodiment 2 of the present invention will be described with reference to FIG. When the movable plate 13 is manufactured in the same manner as in the first embodiment, in the second embodiment, a pair of through holes as shown in FIG. 400 are provided. Otherwise, the optical scanning device was manufactured in the same manner as in the first embodiment.

The through-hole 400 is formed by etching, laser ablation, or the like after completion of lamination of all layers.

As described above, by providing the through hole 400 for the movable plate 13, the weight of the movable plate 13 itself can be reduced, and the air resistance received by the movable plate 13 during vibration can be reduced as much as possible. The movable plate 13 and the elastic member 1
8 can be reduced, and a more stable and long-life optical scanning device can be provided.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIG. In the above-described first embodiment, the shape of the movable plate 13 is a rectangular shape that is axially symmetric with respect to the vibration axis of the movable plate 13, but in the third embodiment, as illustrated in FIG. Elastic member 1 in 12
The movable plate 13 is formed so as to have a substantially hexagonal shape having a symmetrical ridge line with respect to the vibration axis of the movable plate 13 from the intersection line portion where the branch 8 branches toward the ends of both ends (both free ends) of the movable plate 13. The holding frame 1 is used as the pair of elastic members 18.
The size of the crossing line portion where the elastic member 18 branches from 2 (the size of the portion connecting the holding frame 12 and the elastic member 18) is set to, for example, the entire length of the movable plate 13 (for example, An optical scanning device was manufactured in the same manner as in the first embodiment described above, except that the length was extremely short, that is, 1/10 or less of the dimension between the connecting portions.

In order to support the entire amount of the movable plate 13, the elastic member 18 may be slightly thicker than the thickness applied in the first embodiment or a member having high rigidity may be used.

As described above, in the third embodiment, since the size of the elastic member 18 is made as short as possible, when the size of the movable plate 13 is relatively large, the elastic member 18 is bent by the weight of the movable plate 13. Inconvenience that the free end position of the movable plate 13 becomes unstable can be avoided.

(Fourth Embodiment) Next, a fourth embodiment will be described. In the first embodiment described above, the first to third polyimide layers 210 and 22 are formed by screen-printing a polyimide resin mixed with an inorganic filler and curing the same.
However, in Embodiment 4, a photosensitive insulating paste that becomes ceramic when fired, for example,
“NTP paste” (manufactured by NEC Corporation) is applied to each of the polyimide layers by screen printing, dried at 100 ° C. for one hour, and
5 minutes at 5 ° C. and 7 minutes at 920 ° C., half-baked at 250 ° C. for 1 hour to degas and leave only a relatively stable resin and pattern by photolithography Thus, each polyimide layer including the elastic member was formed. Except for this, the optical scanning device was manufactured in the same manner as in the first embodiment.

According to the fourth embodiment, there is an advantage that the patterning step is simplified and the tensile elastic modulus of the elastic member can be easily controlled by controlling the semi-sintering conditions.

According to the present invention described above, the following configuration can be added.

(Appendix 1) A support having a pair of standing pieces, a pair of holding frames provided on the pair of standing pieces of the support, and a mirror surface for reflecting light on at least one surface are formed. A movable plate on which a planar coil forming driving means is formed, and a pair of elastic members connecting the opposing sides of the movable plate and the pair of holding frames in a doubly-supported beam shape respectively; An optical scanning device having a magnet constituting driving means for driving a movable plate by applying a magnetic force to a coil formed on the plate, wherein the holding frame, the movable plate and the elastic member are integrally formed as a unit on one substrate Wherein the elastic member is made of a polymer resin containing a filler, and has a tensile elastic modulus at 25 ° C. of 10 GPa or more and 20 GPa or more.
An optical scanning device having a GPa or less and a change in tensile elasticity within a use environment temperature range of 2 GPa or less. According to this configuration, it is possible to provide an optical scanning device that is excellent in handling properties of the optical scanning device itself, withstands impact, and can stably obtain desired driving characteristics in a use temperature range.

(Supplementary note 2) The optical scanning device according to supplementary note 1, wherein a through hole is formed in the movable plate. According to this configuration, the weight of the movable plate can be reduced, the air resistance applied to the movable plate during vibration can be reduced as much as possible, the load on the movable plate and the elastic member can be reduced, and a more stable long-life light A scanning device can be provided.

(Supplementary Note 3) The movable plate is formed in a substantially hexagonal shape, and a pair of elastic members for connecting the opposing sides of the movable plate and the pair of holding frames in a doubly-supported beam shape are formed of a movable plate. 2. The optical scanning device according to claim 1, wherein the optical scanning device is formed to have a short dimension of about 1/10 of a dimension between opposing sides. According to this configuration, when the size of the movable plate is relatively large, it is possible to avoid such a disadvantage that the elastic member is bent by the weight of the movable plate and the free end position of the movable plate becomes unstable.

[0097]

According to the first aspect of the present invention, there is provided an optical scanning device which is excellent in handleability of the optical scanning device itself, withstands impact, and can stably obtain desired driving characteristics in a use temperature range. Can be provided.

According to the second aspect of the present invention, it is possible to manufacture an optical scanning device capable of realizing stable and highly efficient driving characteristics.

According to the third aspect of the present invention, it is possible to manufacture an optical scanning device capable of improving handling properties, having excellent impact resistance, and stably realizing desired driving characteristics in a use temperature range. it can.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a schematic configuration of an optical scanning device according to a first embodiment of the present invention.

FIG. 2 is a central axis AA of the optical scanning device shown in FIG. 1;
It is sectional drawing along the line.

FIG. 3 is a sectional view taken along line B-B 'of FIG.

FIG. 4 is a diagram showing a manufacturing process of the optical scanning device according to the first embodiment.

FIG. 5 is an explanatory diagram of a mounting process of the optical scanning device according to the first embodiment.

FIG. 6 is a perspective view showing a modification of the optical scanning device according to the second embodiment.

FIG. 7 is a perspective view showing a modification of the optical scanning device according to the third embodiment.

FIG. 8 is a plan view of a conventional galvanometer mirror.

FIG. 9 is a sectional view taken along the line CC of FIG. 8;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Support body 12 Holding frame 13 Movable plate 13 Movable part 14 Yoke 15 Magnet 16 Coil 16a Coil 16b Coil 17 Mirror surface 18 Elastic member 19 Connection pad 20 Flexible board 30 Coverlay film 40 Unnecessary frame 142 Wiring 143 Wiring 200 Silicon substrate 210 Silicon nitride Film 220 first polyimide layer 230 second polyimide layer 240 third polyimide layer 300 anisotropic conductive adhesive 400 through hole

Claims (3)

[Claims] 1. A support having a pair of standing pieces, a pair of holding frames provided on the pair of standing pieces of the support, and a mirror surface for reflecting light on at least one surface. A movable plate, a pair of elastic members for connecting the opposite side of the movable plate and the pair of holding frames to each other in a doubly-supported beam shape, and driving means for driving the movable plate to be displaced; An optical scanning device in which a movable plate and an elastic member are integrally formed on a single substrate, wherein the elastic member is made of a polymer resin containing a filler, and has a tensile elastic modulus at 25 ° C. of 10 GPa or more and 20 GPa. An optical scanning device according to claim 1, wherein a variation in tensile elasticity within a use environment temperature range is within 2 GPa. 2. A rectangular movable plate having a pair of parallel holding frames, a mirror surface for reflecting light formed on at least one surface thereof, and a planar coil forming driving means formed thereon, A pair of elastic members that respectively connect the center of opposing sides of the movable plate and the pair of holding frames in a doubly supported manner, and a position between the ends of the pair of holding frames at a position occupying the outside of the movable plate. Integrally forming a unit consisting of a pair of unnecessary frames for connecting the respective units by a semiconductor manufacturing process; and fixing a pair of holding frames of the unit on a pair of standing pieces provided on a support, respectively, to thereby form the unit. A step of disposing a pair of unnecessary frames of the unit; a step of removing a pair of unnecessary frames of the unit; Close-up view Attaching a pair of yokes supporting each of the magnets to both ends of the support in a state. 3. The elastic member is made of a polymer resin containing a filler by a semiconductor manufacturing process, and has a tensile modulus at 25 ° C. of 10 GPa or more and 20 GPa or more.
3. The method of manufacturing an optical scanning device according to claim 2, wherein the variation in tensile elasticity within the operating environment temperature range is within 2 GPa.