JP2002084110A - Power combiner / distributor - Google Patents

Abstract

(57) [Problem] To provide a small and inexpensive power combiner / distributor capable of arbitrarily changing the amplitude and phase of an output signal while having low loss. SOLUTION: A mother substrate 201 is a lowermost metal plate 20.
2. A dielectric substrate 203 having a hole in an intermediate layer and a dielectric substrate 204 having an uppermost circuit wiring formed thereon are bonded together. A variable impedance element 210 is mounted on one end of the strip conductor 206b. The hole of the intermediate layer has a metal pattern formed on the inner wall,
2. A cavity 208 whose upper surface is closed by the ground pattern of the dielectric substrate 204. By changing the impedance variable element 210 to an appropriate impedance, the phase and amplitude of the output signal can be arbitrarily controlled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to a configuration of a power combiner / divider using a cavity resonator.

[0002]

2. Description of the Related Art In recent years, there has been an urgent need for wireless devices to use a millimeter-wave band, which is a new frequency resource, with the rapid increase in users. In addition, application of the millimeter wave band to distance measuring devices such as anti-collision radars for automobiles is being studied by utilizing the short wavelength. For the practical use of millimeter-wave band devices, cost reduction and miniaturization have become issues.

[0003] In the conventional power combiner / distributor according to the present invention, for example, as a combiner / distributor circuit with a fixed distribution ratio, Wilk described in "Microwave Integrated Circuit" by Yoshihiro Konishi and the like is described.
A device using a planar circuit such as an inson-type hybrid or a branch-type hybrid is generally used in terms of mass productivity and miniaturization. Although one using a waveguide has been developed,
Due to the high construction cost and the difficulty in integrating other circuits such as amplifiers and converters, large-scale practical use has not been achieved. Further, as a circuit configuration of a variable distribution ratio including a changeover switch, there is a circuit configuration in which a diode and a strip line are disclosed in JP-A-07-074672.

FIG. 10 shows a conventional power distribution combiner (switch) having a variable distribution ratio. This switch is the input terminal 1001
From the first output terminal 1002 or the second output terminal
Of the output terminal 1003. The operation will be briefly described.
In order to set the 02 side as a pass terminal and the output terminal 1003 side as an isolation terminal, a negative voltage is applied to the control terminal 1004 to turn off the diode 1005 and pass a signal through the transmission line 1008 to the output terminal 1002. The transmission line 1009 is connected to the control terminal 100
By applying a positive voltage to 6, the diode 1007 is turned on and brought into the same state as grounded, thereby forming a short-circuited line at the tip, so that the signal does not propagate. Although the phase is not particularly described, the output signal is output with a delay corresponding to the phase corresponding to the length of the transmission lines 1008 and 1009 with respect to the input signal.

[0005]

In a conventional power distribution / combiner, a configuration using a planar circuit has a loss in a transmission line, and a configuration using a waveguide is not suitable for small size and low cost. Had.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a small and low-cost power combining / distributing device capable of arbitrarily changing the amplitude and phase of an output signal with low loss. I do.

[0007]

To solve this problem, the present invention provides a metal plate, a dielectric substrate having a through hole,
By bonding a dielectric substrate on which circuit wiring is formed and closing the top and bottom of the through hole with a metal to form a cavity resonator, and connecting a variable element to at least one of its input / output lines, the amplitude and phase of the output signal Is a power combining / distributing device that can arbitrarily change the power.

Accordingly, a power combiner / distributor which can change the amplitude and phase of the input / output signal arbitrarily while having a low loss can be configured to be small and inexpensive.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention has a resonator and at least two coupling terminals coupled to the resonator, wherein each of the coupling terminals serves as a signal input / output terminal. A variable element whose impedance changes according to a control signal is connected to at least one of the coupling terminals, and an amplitude and a phase of a signal output from the coupling terminal serving as the output terminal are arbitrarily controlled by a change in impedance of the variable element. A power combining / distributing device capable of changing a resonance state of the resonator by changing at least one impedance of an input / output terminal of the resonator, and a signal output from one or more output terminals. By changing the phase and amplitude of a single variable element,
The power combiner / distributor capable of arbitrarily changing the amplitude and phase of the input / output signal while having a low loss has an effect of being able to be configured at a small size and at low cost.

According to a second aspect of the present invention, there is provided the power combining / distributing device according to the first aspect, wherein a cavity resonator is used as the resonator. This has the effect of reducing the size of the device, that is, the circuit.

[0011] The invention according to claim 3 is a metal substrate of the lowermost layer, a first dielectric substrate having a through hole in which the inner wall of the intermediate layer is covered with metal, a circuit wiring on the upper surface of the uppermost layer, and a first wiring on the rear surface. A mother substrate is formed by bonding a second dielectric substrate on which a ground pattern having a second slot is formed, and a through hole formed in the first dielectric substrate of the intermediate layer in the mother substrate. A space surrounding the hole by the lowermost metal plate and the ground pattern on the back surface of the second dielectric substrate in the uppermost layer is defined as a cavity resonator, and the circuit wiring and the cavity are formed through the first and second slots. The circuit wiring coupled to the first slot by electromagnetically coupling the resonator is used as a signal input terminal, and at least one circuit wiring coupled to the second slot is used as an output terminal, and the first or second circuit wiring is connected. Tied to slot 2 A variable element whose impedance changes according to a control signal is connected to at least one of the circuit wirings, and the amplitude and phase of a signal output from the output terminal can be arbitrarily controlled by a change in the impedance of the variable element. A power combining / distributing device characterized by a simple power combining / distributing device.By incorporating a resonator in a dielectric substrate, the amplitude and phase of input / output signals can be arbitrarily reduced while maintaining low loss. This has the effect that the power combiner / distributor that can be changed and that can be easily integrated with the signal and power supply wiring can be configured in a small size and at low cost.

According to a fourth aspect of the present invention, there is provided the power combiner / distributor according to the third aspect, wherein the lowermost layer is a third dielectric substrate having a ground pattern on an upper surface. By forming the resonator in the converted dielectric substrate, there is an effect that the power combining / distributing device can be configured to be small, light, and inexpensive.

According to a fifth aspect of the present invention, there is provided the power combiner / distributor according to the fourth aspect, wherein the ground pattern of the lowermost third dielectric substrate has at least one window. By forming a window in the ground pattern, it is possible to prevent resonance in an unnecessary frequency band other than the desired mode, that is, a harmonic component, and to configure a power combiner / distributor excellent in band selectivity at a small size and at a low price. It has the action of:

According to a sixth aspect of the present invention, a metal plate having a depression in a lower layer, a circuit wiring on an upper surface in an upper layer, and a ground pattern having at least two slots on a rear surface are formed.
4. The power combining / distributing device according to claim 3, wherein the mother substrate is constituted by the dielectric substrate of (1), and when integrated with other active elements, strength and heat dissipation are achieved by using a metal plate. This has the effect that a power combining / distributing device having excellent performance can be configured in a small size and at low cost.

According to a seventh aspect of the present invention, a silicon substrate having a depression in a lower layer and an inner wall covered with a metal film, a ground pattern having circuit wiring on an upper surface and at least two slots on a rear surface are formed on an upper layer. 4. The power combining / distributing device according to claim 3, wherein the mother substrate is constituted by the fourth dielectric substrate. By using a silicon substrate as the substrate, the hole can be formed with high precision by silicon processing. In addition to the ability to form a resonator, an active element for IF or signal processing is formed on a substrate, so that a high-performance power combining / distributing device can be configured to be small and inexpensive.

The invention according to claim 8 is the power combiner / distributor according to claim 7, characterized in that the recess formed in the silicon substrate has at least one window in the metal film covering the inner wall. By forming a window in the ground pattern, resonance in unnecessary frequency bands other than the desired mode, that is, harmonic components, is prevented, and a power combining / distributing device excellent in band selectivity is reduced in size and cost. It has the effect that it can be configured.

According to a ninth aspect of the present invention, a dielectric substrate having at least two open-ended coplanar lines serving as signal input and output terminals on an upper surface is used as a mother substrate, and one surface of the dielectric substrate is provided on the mother substrate. A chip having a pattern is bump-mounted so that the metal pattern surface faces the motherboard, and a variable element whose impedance is changed by a control signal is connected to at least one of the coplanar lines, and the impedance of the variable element is The power combining and distributing device is characterized in that the power combining and distributing device is capable of arbitrarily controlling the amplitude and phase of the signal output from the output terminal by changing the output terminal. By realizing the resonator by bump mounting without special processing such as opening, the price can be reduced and the resonator can be mounted later. To do so, has the effect of change or replacement of the shapes can be configured for easy power combiner divider.

According to a tenth aspect of the present invention, there is provided the power combiner / distributor according to the ninth aspect, wherein the interval between the bumps when mounting the chip on the dielectric substrate is set to 1/8 wavelength or less. Realizing the resonator by bump mounting without special processing such as drilling holes on the board side can reduce the price, and since the resonator is mounted later, the shape change and This has the effect that an easily replaceable power combiner / distributor can be configured.

According to an eleventh aspect of the present invention, there is provided the power combiner / distributor according to the ninth aspect, wherein at least one window is provided in a ground pattern of at least one of the chip and the dielectric substrate. By forming a window in the ground pattern, resonance in unnecessary frequency bands other than the desired mode, that is, harmonic components, is prevented, and a power combining / distributing device excellent in band selectivity is reduced in size and cost. It has the effect that it can be configured.

According to a twelfth aspect of the present invention, there is provided the power combiner / distributor according to the ninth aspect, wherein a window is formed in a ground pattern of the chip, and the slot is used as a slot antenna. By using the antenna as an antenna, by controlling its output phase and amplitude, the power combiner / distributor integrated with an antenna having variable characteristics including directivity and gain can be configured to be small and inexpensive.

According to a thirteenth aspect of the present invention, a metal pattern is formed on the upper surface of the chip, and the metal pattern is used as a patch antenna by electromagnetically coupling with a window of the ground pattern. It is a power combiner / distributor as described, and is used as an antenna by coupling a patch to the slot of the output terminal, and is integrated with an antenna with variable directivity and gain by controlling its output phase and amplitude The power combining and distributing device thus constructed can be made small and inexpensive.

According to a fourteenth aspect of the present invention, there is provided the power combining / distributing device according to the ninth aspect, wherein the chip is formed in a lens shape, and the window of the ground pattern is used as a lens antenna having a feed terminal. It is used as an antenna by coupling the slot of the output terminal with a chip formed in a lens shape, and by controlling its output phase and amplitude, power integrated with an antenna with variable characteristics including directivity and gain This has the effect that the combiner / distributor can be made small and inexpensive.

[0023] The invention according to claim 15 is the invention according to claims 1-1.
4. A wireless system characterized by using the power combiner / distributor according to any one of (1) to (4) above. This has the effect of realizing a wireless system.

Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG.

(Embodiment 1) FIG. 1 is a functional block diagram of a power combiner / distributor according to the present invention. In FIG. 1, a cavity resonator 101 has an input terminal 102 and two output terminals 10.
A total of three input / output terminals are connected. An impedance variable device 105 is connected to the first output terminal 103, and its impedance can be arbitrarily changed by a control signal from a control terminal 106.

The operation of the power combiner / distributor of the present invention when used as a power distributor will be described. Input terminal 1
The high-frequency signal input from 02 propagates into the cavity resonator 101, the shape of the cavity resonator 101, the output terminals 103,
The signal is output from the output terminals 103 and 104 at the phase and amplitude determined by the mounting position and the impedance of the terminal 04. Therefore, the impedance variable device 105 is connected to the output terminal.
Is added, and by changing the impedance to an appropriate impedance, the phase and amplitude of the output signal can be arbitrarily controlled. At this time, by coupling the two output terminals 103 and 104 with the same resonance mode in the cavity resonator 101, not only the output terminal 103 to which the impedance variable device 105 is added but also the phase and the phase of the other output terminal 104 The amplitude can also be controlled at the same time.

In the above description, an example in which the number of output terminals is two has been described. However, the present invention can be similarly implemented by controlling the phases and amplitudes of three or more output terminals.

In the above description, an example has been described in which a signal is output from all output terminals while changing the phase and amplitude. It is feasible.

(Embodiment 2) FIG. 2 shows a perspective view and a sectional view of a power combiner / distributor of the present invention. In FIG. 2, the mother substrate 201 is formed by bonding a lowermost metal plate 202, an intermediate dielectric substrate 203 with holes, and a dielectric substrate 204 on which the uppermost circuit wiring is formed. Both surfaces of the intermediate dielectric substrate 203 are ground patterns, and the upper and lower ground patterns are connected by via holes 205. The uppermost dielectric substrate 204 includes a strip conductor 20 on the upper surface serving as a wiring.
6a to 6c, and a microstrip line structure in which a ground pattern having slots 207a to 207b is formed on the lower surface. A variable impedance element 210 is mounted on one end of the strip conductor 206b. Hole 2 in the middle layer
Reference numeral 09 denotes a metal pattern formed on the inner wall. The lower surface is a metal plate 202, and the upper surface is a cavity 208 closed by a ground pattern of the dielectric substrate 204.

The operation of the power combiner / distributor of the present invention when used as a power distributor will be described. The strip conductor 206a is an input terminal, and the strip conductors 206b, c
Are output terminals, the high-frequency signal input from the input terminal propagates through the strip conductor 206a. The slot 207a is formed at a position suitable for the open end of the strip conductor 206a.
The signal propagates into the cavity 208 by the electromagnetic field coupling between the slot a and the slot 207a. Similarly, slot 2
07b and the strip conductors 206b and 206c are electromagnetically coupled to each other so that the two strip conductors 2
The signal propagates to 06b and c.

The distance between the slot 207 and the strip conductor 206 may be, for example, about λg / 4 inside from the open end. Note that λg is the wavelength of the microstrip line on the dielectric 203. The amplitude and phase of the signal propagating to the two output terminals can be arbitrarily changed depending on which part of the cavity 208 the slot is arranged and the positional relationship between the slot and the strip conductor. The thickness of the dielectric substrate 203 of the intermediate layer and the width and length of the cavity 208 may be arbitrary values. However, when the cavity 208 is a cavity resonator that resonates in a signal frequency band, a power distributor with a small passage loss can be realized.

For example, when the signal frequency is 25 GHz and the cavity 208 is resonated using the TE101 mode as a cavity resonator, the cavity has a width of 6.7 mm and a length of 13.4.
mm. The thickness of the dielectric substrate 203 = the height of the cavity resonator is a parameter related to the Q of the resonator. The lower the lower, the higher the power divider having a wider frequency characteristic, but the greater the insertion loss. As the shape of the slot, for example, the width λα /
20, length λα / 2. λα is the wavelength of the slot and depends on the dielectric constant of the upper dielectric substrate 203. Also,
If the strip conductors 207b and 207c are arranged at symmetrical positions at the same distance from the slot ends, the signals propagated to the two output ends have the same amplitude and the same phase.

Next, control of the phase and amplitude of the output signal will be described. Since the phase and amplitude of the output signal can be changed by changing the impedance of the output terminal, it is possible to arbitrarily control the phase and amplitude of the output signal by adding an impedance variable element 210 and changing the impedance to an appropriate impedance. Becomes possible. As the variable impedance element, for example, a varactor diode may be used.One end of the varactor diode is connected to the strip line of the output terminal, and the other end is connected to the ground pattern, and the strip line impedance is changed by changing the termination condition of the strip line. Can be changed.

In the above description, an example in which the dielectric substrate 203 is used for the intermediate layer has been described. However, the present invention can be similarly applied to a metal plate having a hole.

In the above description, the metal plate 2
Although the example using 02 has been described, the present invention can be similarly applied to a dielectric substrate having a ground pattern formed on the upper surface.

The dielectric substrate described above includes ceramic, Teflon (registered trademark), glass epoxy,
The present invention can also be implemented using a substrate made of silicon, gallium arsenide, or the like.

In the above description, an example in which a rectangular cavity is used as the cavity resonator has been described.
The present invention can be similarly applied to other three-dimensional shapes such as a sphere, a cylinder, and a coasting cylinder.

Further, the two output lines are configured so that isolation between the output terminals can be increased by connecting arbitrary locations of the two output lines with appropriate resistors, and is used for adjusting the control sensitivity of each terminal. Is also good.

(Embodiment 3) FIG. 3 is a perspective view of a power combiner / distributor according to the present invention. The same components as those in FIG. 2 are denoted by the same reference numerals, and description thereof is omitted. FIG. 3 differs from the above-described embodiment in that the lowermost dielectric substrate 301
Windows 312 are formed at appropriate intervals in the ground pattern 310 of FIG.

The basic operation is the same as that of the above-described embodiment, except that the ground pattern 310 of the lowermost dielectric substrate 301 is formed.
By forming the windows 312 at appropriate intervals, it is possible to suppress occurrence of resonance other than the desired mode in the cavity resonator and to prevent signals from passing through the power combiner / distributor at frequencies other than the desired frequency. It becomes possible.

With the above configuration, it is possible to solve the problem of passing a signal other than the desired frequency, which has been a problem in the conventional power combiner / distributor, and to realize a power combiner / distributor having good characteristics. It is.

(Embodiment 4) FIG. 4 shows a perspective view and a sectional view of a power combiner / distributor according to the present invention. 4 differs from the above-described embodiment in that a cavity resonator is formed using a metal plate 401 having a recess 402 and a wiring substrate 403. The wiring substrate 403 has a microstrip line structure having a microstrip line 407 serving as a wiring on the upper surface and a slot 404 on the lower surface. A varactor diode 405 as an impedance variable element is mounted at one end of the microstrip line 407.

The basic operation is the same as that of the above-described embodiment, except that a recess 402 is formed in a metal plate 401, and a wiring board 403 is pasted thereon so that a slot 404 is arranged in the recess 402. The cavity is formed by the wiring substrate 403 and the depression.

With the above configuration, a cavity resonator can be formed by a simple method, and a power combining / distributing device having good characteristics can be realized.

In the above description, an example in which a depression is formed in a metal plate has been described. However, in addition, a depression is formed in a silicon substrate by an etching technique, and a metal pattern is applied to an inner wall of the depression to make the depression shape more precise. Even if it is well processed, it can be similarly implemented.

The same effect as in the third embodiment can be obtained even if the same window as in the third embodiment is formed in the metal pattern on the inner wall of the depression formed in the silicon substrate.

(Embodiment 5) FIG. 5 is a perspective view of a power combiner / distributor according to the present invention. In FIG. 5, circuit wiring having coplanar lines 504a to 504c is formed on the upper surface of a circuit substrate 501, and a chip substrate 502 having a ground pattern on one surface is mounted thereon with bumps 503. A varactor diode 505 is connected to the coplanar line 504c, and a control signal is applied from a control signal input terminal 506.

The difference from the above-described embodiment is that the cavities are formed by the circuit board 501, the chip board 502, and the chip board 50.
2 is realized in a space surrounded by bumps 503 used for mounting the semiconductor device.

The circuit board described above can be implemented by using a ceramic substrate, a ceramic multilayer substrate, a substrate made of Teflon, glass epoxy, silicon, gallium arsenide, or the like.

In the above description, the circuit board has been described as an example in which only wiring is formed. However, a depression is formed in the circuit board below the power combiner chip, and the inner surface is metallized to thereby reduce the volume of the cavity resonator. Can be similarly implemented by increasing the Q as a resonator by forming so as to increase.

FIG. 5 shows an example in which a coplanar line with an open end is used. However, the present invention can be similarly implemented using a coplanar line with a short end.

The interval between bumps at the time of mounting is, for example, 1
/ 8 wavelength or less.

Further, the same effects as in the third embodiment can be obtained by forming windows similar to those in the above-described third embodiment in both or one of the ground patterns of the dielectric substrate and the chip substrate.

(Embodiment 6) FIG. 6 is a top perspective view and a sectional view when a power combiner / distributor of the present invention is used as a feeder circuit of a transmitting antenna. In FIG. 6, a circuit board 60 is shown.
9, a power amplifier MMIC 602, a varactor diode 604, and an antenna chip 606 are mounted by bump mounting. The transmission signal input from the input terminal 601 is amplified by the power amplifier MMIC 602 and then input to the antenna. The circuit board 609 at the antenna portion is a coplanar line with GND open at the tip. The lower side of the antenna chip 606 has a ground pattern having a plurality of slots.

The space surrounded by the ground pattern 613 of the circuit board 609, the ground pattern of the antenna chip 606, and the bump 610 used to mount the antenna chip 606 is used as a cavity resonator, and a signal propagated therein. Is radiated above the slot 607 on the antenna chip 606 side. The amplitude and phase of the radio wave radiated from each slot 607 can be arbitrarily determined according to the position and shape of the slot 607, and can be operated as an array antenna having a plurality of slot antennas by arranging it appropriately. It is possible.

Further, the signal supplied to each slot 607 can be arbitrarily changed by changing the impedance of the varactor diode 604, whereby the gain and directivity of the array antenna can be arbitrarily controlled. .

In the above description, an example was described in which a slot antenna radiating from a slot formed in the antenna chip was used, but the antenna chip 7 shown in FIG.
Similarly, the present invention can be implemented by using a patch antenna in which a patch 710 is provided above 06 and a secondary radiator is used. 707 is an antenna slot, and 711 is an antenna board.

Further, the present invention can be similarly implemented by using a dielectric lens antenna having a dielectric lens formed as shown in FIG. FIG. 8 has functions of antenna characteristic control and a transmission / reception switch. As in the above-described embodiment, the circuit board 801 is attached to a metal plate 813 having a depression.

The transmission signal input from the input line 802 is radiated from the slot 806 with an arbitrary amplitude and phase by using the transmission control IC 804, and transmitted as the secondary radiator using the lens antenna chip 807 mounted with the bump 809. You.

At the time of receiving operation, the received signal is
2 and the input line 8 using the reception control IC 810.
By controlling the signal not to be output to the slot on the 02 side, the received signal is output only to the output line 803.

(Embodiment 7) FIG. 9 is a schematic system diagram showing an example of a wireless system using the power combiner / distributor of the present invention. In FIG. 9, three wireless devices 901, 90
2, 903 are mutually performing wireless communication. Each of the wireless devices 901, 902, and 903 has a baseband control unit 906 and a wireless circuit unit 905. First
In the wireless device 901, the power combining / distributing device of the above-described embodiment is mounted as an antenna feed circuit 904. The antenna feed circuit 904 has a plurality of antenna terminals,
Each is connected to a feed terminal of the antenna to form an array antenna 907.

The basic operation will be described. The first wireless device 901 controls the antenna pointing by changing the phase and amplitude of the antenna feed circuit 904 so that the antenna is directed to the second wireless device 902 or the third wireless device 903 that performs communication. For example, a nearby second wireless device 9
When communication is performed with the second wireless device 02, the reception gain dynamic range of the second wireless device 902 can be reduced by reducing the antenna gain, and the receiving circuit can be simplified. Further, a third wireless device 903 located far away
Erroneous operation of other wireless systems including the above can be prevented.
Conversely, when communicating with the distant third wireless device 903, the reception power of the third wireless device 903 is increased by sharply narrowing the antenna directivity and increasing the antenna gain, thereby improving the communication conditions. can do. Further, in the communication in the TDD system, the line design and the circuit configuration are optimized by changing the antenna gain and the directivity at the time of transmission and at the time of reception.

[0063]

As described above, according to the present invention, there is an advantageous effect that a power combiner / distributor capable of arbitrarily changing the amplitude and phase of an input / output signal with a small loss can be realized at a small size and at a low price. Is obtained.

[Brief description of the drawings]

FIG. 1 is a functional block diagram showing a power combiner / distributor according to a first embodiment of the present invention.

FIG. 2 is a perspective view and a sectional view showing a power combiner / distributor according to a second embodiment of the present invention.

FIG. 3 is a perspective view showing a power combiner / distributor according to a third embodiment of the present invention.

FIG. 4 is a perspective view and a sectional view showing a power combiner / distributor according to a fourth embodiment of the present invention.

FIG. 5 is a perspective view showing a power combiner / distributor according to a fifth embodiment of the present invention.

FIG. 6 is a top perspective view and a sectional view showing a power combiner / distributor according to a sixth embodiment of the present invention.

FIG. 7 is a top perspective view and a sectional view showing another example of the power combiner / distributor according to the sixth embodiment of the present invention.

FIG. 8 is a top perspective view and a sectional view showing still another example of the power combiner / distributor according to the sixth embodiment of the present invention.

FIG. 9 is a schematic system diagram showing an example of a wireless system using the power combiner / distributor of the present invention.

FIG. 10 is a circuit diagram showing a conventional power combiner / distributor.

[Explanation of symbols]

 Reference Signs List 101 cavity resonator 102 input terminal 103 first output terminal 104 second output terminal 105 impedance variable device 106 control terminal 201 mother substrate 202 metal plate 203, 204 dielectric substrate 205 via hole 206 strip conductor 207 slot 208 cavity 209 hole 210 Impedance variable element 211 Control signal input terminal 302 Dielectric substrate 310 Installation pattern 312 Window 401 Metal plate 402 Depression 403 Wiring board 404 Slot 405 Varactor diode 406 Control signal input terminal 407 Microstrip line 501 Circuit board 502 Chip board 503 Bump 504 Coplanar Line 505 Varactor diode 506 Control signal input terminal 601 Input terminal 602 Power amplifier MMIC 603 Bicycle for power amplifier MMIC Terminal 604 varactor diode 605 control voltage terminal 606 antenna chip 607 antenna chip slot 608 substrate-side ground pattern 609 circuit board 610 bump 611 microstrip line 612 coplanar line with GND 613 ground pattern 706 antenna chip 707 antenna chip slot 710 antenna chip patch 711 Antenna chip substrate 801 Circuit board 802 Input line 803 Output line 804 Transmission control IC 805 Control signal input terminal 806 Slot 807 Lens antenna chip 808 Pad 809 Bump 810 Reception control IC 811 Control signal input terminal 812 Control IC 813 Metal with recess Plate 901 First wireless device 902 Second wireless device 903 Third wireless device 904 Antenna feed Circuit 905 Radio circuit unit 906 Baseband / control unit 907 Array antenna

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01P 5/16 H01P 5/16 C H01Q 3/26 H01Q 3/26 Z 19/06 19/06 23/00 23/00

Claims (15)

[Claims] 1. A resonator comprising: a resonator; and at least two coupling terminals coupled to the resonator, wherein each of the coupling terminals serves as a signal input / output terminal, and at least one of the coupling terminals has an impedance change by a control signal. A power combining / distributing device which is capable of arbitrarily controlling the amplitude and phase of a signal output from a coupling terminal serving as the output terminal according to a change in impedance of the variable element. 2. The power combiner / distributor according to claim 1, wherein a cavity resonator is used as the resonator. 3. A lowermost metal plate, a first dielectric substrate having a through hole in which an inner wall of an intermediate layer is covered with metal, a circuit wiring on an upper surface of the uppermost layer, and first and second slots on a back surface. A mother substrate is formed by bonding a second dielectric substrate on which a ground pattern is formed, and a through-hole formed in the first dielectric substrate of the intermediate layer in the mother substrate is connected to the lowermost metal layer. A space surrounded by a plate and a ground pattern on the back surface of the second dielectric substrate in the uppermost layer is a cavity resonator,
And a circuit wiring coupled to the first slot by electromagnetically coupling the circuit wiring and the cavity resonator through a second slot, a signal input terminal, and at least one coupled to the second slot. A circuit wiring is used as an output terminal, and a variable element whose impedance is changed by a control signal is connected to at least one of the circuit wirings coupled to the first or second slot, and the impedance of the variable element is changed by the change of the impedance. A power combiner / divider characterized by being a power combiner / divider capable of arbitrarily controlling the amplitude and phase of a signal output from an output terminal. 4. The power combiner / distributor according to claim 3, wherein the lowermost layer is a third dielectric substrate having a ground pattern on an upper surface. 5. The power combiner / distributor according to claim 4, wherein the ground pattern of the lowermost third dielectric substrate has at least one window. 6. A mother substrate is constituted by a metal plate having a depression in a lower layer, a fourth dielectric substrate formed with a circuit pattern on an upper surface in an upper layer, and a ground pattern having at least two slots on a rear surface. The power combiner / distributor according to claim 3, wherein 7. A silicon substrate having a depression in a lower layer and an inner wall covered with a metal film, a fourth dielectric substrate in which a ground pattern having circuit wiring on an upper surface and at least two slots on a rear surface is formed on an upper layer. The power combiner / distributor according to claim 3, wherein the power combiner / distributor comprises a mother board. 8. The power combiner / distributor according to claim 7, wherein the metal film covering the inner wall of the depression formed in the silicon substrate has at least one window. 9. A dielectric substrate having at least two open-ended coplanar lines serving as signal input and output terminals on an upper surface as a mother substrate, and a chip having a metal pattern on one surface on the mother substrate is provided. A bump is mounted so that a metal pattern surface faces the motherboard, and a variable element whose impedance is changed by a control signal is connected to at least one of the coplanar lines. A power combiner / distributor characterized in that the power combiner / divider can arbitrarily control the amplitude and phase of an output signal. 10. The power combiner / distributor according to claim 9, wherein the interval between the bumps when mounting the chip on the dielectric substrate is set to 1/8 wavelength or less. 11. The power combiner / distributor according to claim 9, wherein at least one window is provided in a ground pattern of at least one of the chip and the dielectric substrate. 12. A window is formed in the ground pattern of the chip,
The power combining / distributing device according to claim 9, wherein the power combining / distributing device is used as a slot antenna. 13. The power combiner / distributor according to claim 9, wherein a metal pattern is formed on an upper surface of the chip, and the metal pattern is used as a patch antenna by electromagnetically coupling with a window of the ground pattern. 14. The power combiner / distributor according to claim 9, wherein the chip is formed in a lens shape and used as a lens antenna having a window of the ground pattern as a power supply terminal. 15. A wireless system using the power combiner / distributor according to claim 1. Description: