JP2002083734A - Member for transferring metal film, method of manufacturing the same, method of transferring the metal film and method of manufacturing laminated ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a member for transferring a metal film, with which a pattern of a metal film having an extremely thin and uniform thickness can be transferred to a surface of an easy-to-break target member, such as a green sheet or the like extremely easily and reliability at a high speed and at a low cost. SOLUTION: This member 30 for transferring a metal film has a translucent substrate 20, on which a thin film 21 having a photocatalytic function is formed, a first adhesion layer 24 in a predetermined pattern which contains a thermoplastic organic polymer and is formed on the surface of the thin film having a photocatalytic function and a metal film 22 formed on the surface of the first adhesion layer. Titanium oxide contained in the thin film 21 is activated and decomposes the thermoplastic organic polymer contained in the first adhesion layer 24, by having the translucent substrate 20 side irradiated with ultraviolet rays, resulting in weaker adhesion of the first adhesion layer 24. As a result, the metal film 22 formed on the surface of the first adhesion layer can be transferred onto a surface of an easy-to-break target member such as a ceramic green sheet or the like extremely easily and reliably at high speed and low cost.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a member for transferring a metal film, a method for manufacturing a member for transferring a metal film, a method for transferring a metal film, and a method for manufacturing a multilayer ceramic electronic component.

[0002]

2. Description of the Related Art In recent years, from the viewpoint of miniaturization of electronic equipment and resource saving, miniaturization of multilayer ceramic electronic components, particularly, in multilayer ceramic capacitors, rapid increase in capacity by multilayering and multilayering has been rapidly progressing. There is also a need for a thinner, uniform and less defective electrode.

As a method of forming internal electrodes of a multilayer ceramic electronic component, a method of printing a metal paste comprising a metal powder and an organic binder on a ceramic green sheet by screen printing is generally used.

[0004] However, there is a limit to thinning due to the particle size of the raw metal particles or the thickness of the screen, and the electrodes are formed by sintering of the particles. There is a problem that it is easy.

Therefore, a method of manufacturing a multilayer ceramic electronic component in which a metal film formed on a carrier film by various thin film forming methods is directly transferred to a ceramic green sheet has been proposed (Japanese Patent Publication No. 7-54780, JP-A-4-314876, JP-A-8-115847
JP, JP-A-5-74651, JP-A-6-23
1999, JP-A-10-125556 and JP-A-10-208980).

According to the methods described in these publications, a thinner layer can be expected as compared with a method of screen printing a metal paste on a ceramic green sheet.

[0007]

However, in order to transfer a pure metal film having almost no adhesiveness onto a fragile ceramic green sheet having a small content of an organic binder without defects, a temperature of approximately 50 ° C. or higher is generally required. Heating and 2M
Pressurization of Pa or more is required, which imposes restrictions on transfer conditions.
In order to heat to a predetermined temperature and pressurize to a predetermined pressure,
Since a certain time is required, there is a problem that productivity is low, a press machine having a heating means for generating high pressure is required, and equipment cost is increased.

Further, the conventional method for manufacturing a multilayer ceramic electronic component employs a direct transfer method in which a carrier film having a metal film formed thereon is directly pressed onto a fragile ceramic green sheet to transfer the metal film. Therefore, there is a problem that a portion corresponding to the periphery of the metal film pattern on the ceramic green sheet is easily broken. This is considered to be because the pressure applied during transfer cannot be absorbed if the thickness of the ceramic green sheet as the member to be transferred is extremely thin, for example, 5 μm or less, and the cushion effect is reduced.

Therefore, the inventor of the present application has sought to transfer a metal film formed on a carrier film by various thin film forming methods to an intermediate medium such as a non-woven fabric through an adhesive layer which can be dissolved in a predetermined liquid material, and then transfer the liquid film. A method of manufacturing a multilayer ceramic electronic component in which a metal film is indirectly transferred to a ceramic green sheet by supplying a substance to an adhesive layer to weaken the adhesive force has been proposed (Japanese Patent Application No. 11-169192). According to this method, an extremely thin and uniform metal film pattern can be very easily and reliably transferred to the surface of a fragile green sheet, and in particular, it has become possible to realize automatic transfer lines. However, it takes time to penetrate the liquid material into the medium while supplying the liquid material to the intermediate layer while allowing the liquid material to penetrate into the intermediate medium. It was necessary and did not provide sufficient productivity. In addition, the use of liquid substances requires anticorrosion measures or explosion-proof measures for the apparatus, which tends to increase equipment costs.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a metal capable of transferring an extremely thin and uniform metal film pattern onto a surface of a fragile transfer member such as a green sheet, very easily, reliably, at high speed and at low cost. An object of the present invention is to provide a member for film transfer and a method for manufacturing the same. Another object of the present invention is to transfer a very thin and uniform metal film pattern onto the surface of a fragile transfer-receiving member such as a green sheet, very easily and reliably, at a high speed and at a low cost. An object of the present invention is to provide a method of transferring a metal film which is more suitable for high-speed automation of a line. Further, it is an object of the present invention to provide a multilayer ceramic electronic component having a thin and uniform internal electrode with few defects which can be manufactured extremely easily and at low cost, and which is particularly suitable for high-speed automation of a production line. It is to provide a manufacturing method.

[0011]

To achieve a metal film transfer member above object, according to the Invention The metal film transfer member according to the first aspect, the light-transmitting substrate photocatalytic functional thin film is is formed, the A first adhesive layer having a predetermined pattern containing a thermoplastic organic polymer formed on the surface of the photocatalytic thin film;
And a metal film formed on the surface of the adhesive layer.

According to a second aspect of the present invention, there is provided a metal film transfer member comprising: a light-transmitting substrate; and a first adhesive layer having a predetermined pattern containing a photocatalyst and a thermoplastic organic polymer formed on the surface of the light-transmitting substrate. And a metal film formed on the surface of the first adhesive layer.

[0013] A second adhesive layer containing a thermoplastic organic polymer formed on the surface of the metal film may be further provided.

In a first aspect, between the photocatalytic functional thin film and the adhesive layer, and in a second aspect, between the light-transmissive substrate and the adhesive layer, ultraviolet light is irradiated to decompose quickly. An easily degradable adhesive layer (third adhesive layer) made of cellulose or the like may be interposed.

The member for transferring a metal film according to the present invention may be formed by sequentially laminating a first adhesive layer and a metal film on a light-transmitting substrate. A photocatalyst of a light-transmissive substrate having a photocatalytic thin film formed on the first adhesive layer side of a transfer member in which a film is formed and a first adhesive layer containing a thermoplastic organic polymer is formed on the surface of the metal film. A manufacturing method comprising: contacting the functional thin film side; and separating the base from the light-transmitting substrate, and transferring the first adhesive layer and the metal film having a predetermined pattern onto the surface of the photocatalytic thin film of the light-transmitting substrate. It can also be manufactured by a method. A first adhesive layer side of a transfer member in which a metal film of a predetermined pattern is formed on the surface of the substrate and a first adhesive layer containing a photocatalyst and a thermoplastic organic polymer is formed on the surface of the metal film, A step of bringing the substrate into contact with the surface of the transparent substrate, separating the substrate from the transparent substrate, and transferring the first adhesive layer and the metal film in a predetermined pattern onto the surface of the transparent substrate. Can be manufactured.

At this time, a second adhesive layer containing a thermoplastic organic polymer may be formed on the surface of the metal film after the transfer step.

Method for transferring a metal film In order to achieve the above object, a method for transferring a metal film according to a first aspect is a method for transferring a metal film onto a surface of a photocatalytic functional thin film formed on a surface of a light-transmitting substrate. Contacting a metal film side of a metal film transfer member, on which a first adhesive layer having a predetermined pattern including a metal film is formed on a surface of the first adhesive layer, with a member to be transferred, the metal film A step of irradiating the photocatalytic function thin film with ultraviolet rays from the translucent substrate side of the transfer member to weaken the adhesive force of the first adhesive layer (decomposing at least a part of the first adhesive layer); Separating the light-transmitting substrate from the substrate, and transferring a metal film having a predetermined pattern onto the surface of the member to be transferred.

In a method for transferring a metal film according to a second aspect, a first adhesive layer having a predetermined pattern including a photocatalyst and a thermoplastic organic polymer is formed on a surface of a light-transmitting substrate, and the surface of the first adhesive layer is formed. Contacting the metal film side of the metal film transfer member with the metal film formed thereon with the member to be transferred; and applying ultraviolet light to the first adhesive layer containing the photocatalyst from the transparent substrate side of the metal film transfer member. Irradiating the first adhesive layer to reduce the adhesive force of the first adhesive layer, and separating the substrate from the transfer-receiving member and transferring a metal film having a predetermined pattern onto the surface of the transfer-receiving member.

A second adhesive layer containing a thermoplastic organic polymer may be formed on the surface of the metal film of the metal film transfer member.

Method of Manufacturing Multilayer Ceramic Electronic Component In order to achieve the above object, a method of manufacturing a multilayer ceramic electronic component according to a first aspect provides a method of manufacturing a multilayer ceramic electronic component by applying heat to a surface of a photocatalytic thin film formed on a surface of a light-transmitting substrate. A first adhesive layer having a predetermined pattern including a plastic organic polymer is formed, and a metal film side of a metal film transfer member having a metal film formed on a surface of the first adhesive layer is brought into contact with a green sheet; Irradiating the photocatalytic function thin film with ultraviolet light from the translucent substrate side of the metal film transfer member to weaken the adhesive force of the first adhesive layer (decomposing at least a part of the first adhesive layer); Separating the substrate from the green sheet and transferring a predetermined pattern of metal film onto the surface of the green sheet; and transferring the green sheet onto which the predetermined pattern of metal film has been transferred to another green sheet. It has a laminating step of laminating together, and a firing step of firing the stacked green sheets.

According to a second aspect of the method of manufacturing a multilayer ceramic electronic component, a first adhesive layer having a predetermined pattern containing a photocatalyst and a thermoplastic organic polymer is formed on a surface of a light-transmitting substrate. Contacting the metal film side of the metal film transfer member having a metal film formed on the surface thereof with a green sheet; and contacting the first adhesive layer containing the photocatalyst from the transparent substrate side of the metal film transfer member. Irradiating ultraviolet light to the first
A step of weakening the adhesive force of the adhesive layer, a step of separating the substrate from the green sheet, and a step of transferring a metal film of a predetermined pattern on the surface of the green sheet, and a step of transferring the metal film of the predetermined pattern to the green sheet, There is a laminating step of laminating with the other green sheets, and a firing step of firing the laminated green sheets.

It is preferable that a cutting step for cutting the stacked green sheets is provided before the firing step.

Common Items The order of the contacting step and the step of reducing the adhesive strength of the first adhesive layer by the action of a photocatalyst are not particularly limited. That is, after the metal film side of the metal film transfer member is brought into contact with the surface of the member to be transferred such as a green sheet, ultraviolet light is irradiated from the light transmitting substrate side of the metal film transfer member, and the photocatalytic functional thin film The function may be used to reduce the adhesive strength of the first adhesive layer. Further, after irradiating ultraviolet rays from the transparent substrate side of the metal film transfer member to weaken the adhesive force of the first adhesive layer by the action of the photocatalytic thin film, the metal film side of the metal film transfer member is green. It may be brought into contact with the surface of a member to be transferred such as a sheet. In the latter case, it is necessary to weaken the adhesion of the first adhesive layer to such an extent that the metal film does not move from the surface of the metal film transfer member.

It is preferable that the photocatalytic function thin film contains titanium oxide. Preferably, the photocatalyst is titanium oxide. The thickness of the photocatalytic functional thin film is not particularly limited as long as it can exhibit a photocatalytic reaction, and is preferably 100 to 1000 nm.

The thickness of the first adhesive layer is preferably as thin as possible within a range in which the first adhesive layer can be adhered to the translucent substrate, and is not particularly limited, but is more preferably 1 μm or less.
Although the thickness of the metal film is not particularly limited, it is 0.1 to 1.5 μm.
m is preferable.

The method for forming the first adhesive layer is not particularly limited, and examples thereof include electrodeposition coating, spray coating, and printing. However, from the viewpoint that a thin film can be formed, it is preferable to form the film by an electrodeposition coating method.

Preferably, the metal film is a metal film formed by an electrolytic plating method.

The specific shape of the light-transmitting substrate is not particularly limited, but is preferably sheet-like. The surface of the substrate is preferably smooth.

[0029]

The titanium oxide (Ti) is an example of a photocatalyst.
O ₂ ) has a stronger oxidizing power than ozone and chlorine when irradiated with ultraviolet light, and in recent years, attempts have been made to use it for decomposing NOx and sterilizing bacteria.
In general, the rate at which titanium oxide decomposes organic substances is not high, but the present inventor focused on the organic substance decomposability of titanium oxide as a type of photocatalyst, and thought that this could be used for the transfer of a metal film. As a result, the present invention has been reached.

In the metal film transfer member according to the present invention, a first adhesive layer having a predetermined pattern containing a thermoplastic organic polymer is formed on the thin film surface side of the light transmitting substrate on which the photocatalytic function thin film is formed. And a metal film is formed on the surface of the adhesive layer. For this reason, by irradiating ultraviolet rays from the translucent substrate side, the photocatalyst contained in the thin film is activated, and the first catalyst is activated.
The thermoplastic organic polymer (organic substance) contained in the adhesive layer is decomposed, whereby the adhesive strength of the first adhesive layer can be reduced.

In the ordinary method of using the photocatalyst, the photocatalyst is activated by utilizing only the incident light of ultraviolet rays. However, in the present invention, not only the incident ultraviolet rays but also the photocatalyst thin film and the first adhesive layer are used. And the reflected ultraviolet light reflected by the surface of the metal film on the first adhesive layer side can also contribute to the decomposition of the organic matter contained in the first adhesive layer, and more efficiently reduce the adhesive force of the first adhesive layer. Can be weakened.

As a result, it is possible to transfer the metal film formed on the surface of the first adhesive layer onto the surface of a fragile transfer member such as a ceramic green sheet very easily, reliably, at high speed and at low cost. Becomes possible.

In particular, when the first adhesive layer is formed by an electrodeposition coating method, the thickness can be formed as extremely thin as 1 μm or less.
By using the first adhesive layer having such a thickness, the metal film is easily peeled off at the time of transfer, and higher-speed transfer can be performed.

According to the method for transferring a metal film using the member for transferring a metal film according to the present invention, since the liquid material such as water or an organic solvent is not used in transferring the metal film, the apparatus can be simplified, and When the object to be transferred contains an organic binder such as a ceramic green sheet, there is no need to consider its water resistance and solvent resistance, so that the applicable range is wide. Further, by using a strong ultraviolet light source, it is possible to perform transfer in a short time of several seconds to several tens of seconds. As a result, an extremely thin and uniform metal film pattern can be transferred onto the surface of a fragile transfer member such as a green sheet very easily and reliably, at a high speed and at a low cost. It can be more suitable for

According to the method for manufacturing a laminated ceramic electronic component using the metal film transfer member according to the present invention, a liquid material such as water or an organic solvent is not used when transferring the metal film to the ceramic green sheet. The apparatus can be simplified, and there is no need to consider the water resistance and solvent resistance of the ceramic green sheet containing the organic binder. further,
By using a strong ultraviolet light source, transfer in a short time of several seconds to several tens of seconds is possible. As a result, a multilayer ceramic electronic component having a thin and uniform internal electrode with few defects can be manufactured extremely easily and at low cost, and can be more particularly suitable for high-speed automation of a manufacturing line.

The member for transferring a metal film according to the present invention can be used mainly for forming internal electrodes of a multilayer ceramic electronic component, but is not particularly limited thereto.
Other applications including a step of transferring a metal film having a predetermined pattern, for example, forming external electrodes of a multilayer ceramic electronic component, forming an antenna pattern for a non-contact IC card,
It may be used for manufacturing a magnetic core having a laminated soft magnetic metal film.

The multilayer ceramic electronic component is not particularly limited, but may be a multilayer ceramic capacitor, a piezoelectric element,
Examples include chip inductors, chip varistors, chip thermistors, chip resistors, and other surface mount (SMD) chip-type electronic components.

[0038]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings.

FIG. 1 is a partially cutaway cross-sectional view of a multilayer ceramic capacitor according to one embodiment of the present invention, FIG. 2 is a plan view of the multilayer ceramic capacitor, and FIG. 3 is used in the process of manufacturing the capacitors shown in FIGS. FIG. 4 is a perspective view showing an example of a metal film transfer member according to the first embodiment of the present invention, FIG. 5 is a cross-sectional view taken along the line VV shown in FIG. 4, and FIG. 4 and 5 are process diagrams for explaining an example of a method for manufacturing the metal film transfer member shown in FIG. 5, FIG. 7 is a perspective view showing an example of the metal film transfer member according to the second embodiment of the present invention, and FIG. Is a cross-sectional view along the line VIII-VIII shown in FIG.
FIG. 9 is a process chart for explaining an example of a method of manufacturing the metal film transfer member shown in FIGS. 7 and 8.

In the present embodiment, a multilayer ceramic capacitor 2 shown in FIGS. 1 and 2 will be exemplified as a multilayer ceramic electronic component, and its structure and manufacturing method will be described.

First Embodiment Multilayer Ceramic Capacitor First, the structure of a multilayer ceramic capacitor will be described.

As shown in FIGS. 1 and 2, the multilayer ceramic capacitor 2 according to the present embodiment has a capacitor body 4, a first terminal electrode 6, and a second terminal electrode 8.
The capacitor element body 4 has a dielectric layer 10, a first internal electrode layer 12, and a second internal electrode layer 14, and the first internal electrode layer 12 and the second internal electrode It has a multilayer structure in which the layers 14 are alternately stacked. Each first internal electrode layer 1
One end of 2 is electrically connected to the inside of the first terminal electrode 6 formed outside the first end 4a of the capacitor body 4. One end of each second internal electrode layer 14 is electrically connected to the inside of the second terminal electrode 8 formed outside the second end 4 b of the capacitor body 4.

In this embodiment, the internal electrode layers 12 and 1
4 is formed by transferring a metal film 22 described later (see FIG. 4) to a dielectric green sheet, and is formed of the same material as the metal film 22. It is thicker than the film 22.

The material of the dielectric layer 10 is not particularly limited.
For example, it is composed of a dielectric material such as calcium titanate, strontium titanate and / or barium titanate. The thickness of each dielectric layer 10 is not particularly limited, but is generally several μm to several hundred μm.

Although the material of the terminal electrodes 6 and 8 is not particularly limited, copper, a copper alloy, nickel or a nickel alloy is usually used, but silver or an alloy of silver and palladium can also be used. The thickness of the terminal electrodes 6 and 8 is not particularly limited, but is usually about 10 to 50 μm.

Such a multilayer ceramic capacitor 2
The shape and size of may be determined appropriately according to the purpose and use. When the multilayer ceramic capacitor 2 has a rectangular parallelepiped shape, it is usually 0.6 to 3.2 mm × 0.3 to 1.6 mm ×
It is about 0.1 to 1.2 mm.

The metal film transfer member will be described metal film transfer member used in the manufacture of multilayer ceramic capacitors.

As shown in FIGS. 4 and 5, the metal film transfer member 30 according to the present embodiment comprises a sheet-shaped light-transmitting substrate 2.
On the surface of No. 0, a thin film 21 containing titanium oxide is formed. On the surface of the thin film 21, a first adhesive layer 24 is formed in a predetermined pattern. The metal film 22 is formed on the surface of the first adhesive layer 24. The thin film 21 containing titanium oxide
An easily decomposable adhesive layer (not shown) made of nitrocellulose or the like, which is quickly decomposed by irradiating ultraviolet rays, may be interposed between the first adhesive layer 24 and the first adhesive layer 24.

In this embodiment, the light-transmitting substrate 20 is made of a glass plate, a PET sheet or the like having a total light transmittance of preferably 5%.
It is made of a material of 0% or more, more preferably 90% or more. It is desirable that the surface roughness of the base 20 be sufficiently smaller than the thickness of the metal film to be formed. The thickness of the base 20 is not particularly limited.
It may be about 0 μm.

The titanium oxide contained in the thin film 21 may be a mixture of anatase type and rutile type, but is preferably anatase type. The specific surface area is not particularly limited, but is preferably from ^{20 to} 100 m ² / g. The particle size is not particularly limited, but is preferably from 10 to 50 nm.

The thin film 2 containing titanium oxide on the surface of the substrate 20
The method for forming 1 is not particularly limited. For example, in the case of a substrate having sufficient heat resistance, alkoxide or chelate which is a precursor of titanium oxide is applied to the substrate 20 at a high temperature (about 200 to 500 ° C.). This can be done by baking. When the heat resistance of the substrate 20 is insufficient, the substrate 20 may be formed by applying a titanium oxide sol mixed with a low-temperature curable inorganic binder such as peroxotitanic acid and curing the mixture at a low temperature (60 to 150 ° C.). it can.

The thickness D3 of the thin film 21 is preferably 100
１０００1000 nm. If the thickness of the thin film 21 is too small, the function of decomposing the adhesive layer 24 described later may not be sufficiently exhibited. If the thickness is too large, ultraviolet rays are absorbed inside the thin film 21, so that the amount of light reaching the vicinity of an interface with an adhesive layer 24, which should exhibit an organic substance decomposing function, is attenuated, and the decomposing function can be sufficiently exhibited. It may disappear.

When glass is used as the substrate 20, the sodium component in the glass is reduced by the thin film 2 during the high-temperature treatment.
In order to reduce the activity by diffusing into 1 (titanium oxide layer), it is preferable to interpose a barrier layer (not shown) made of SiO ₂ between the substrate 20 and the thin film 21. Thereby, diffusion of the sodium component is effectively prevented.

The first adhesive layer 24 having a predetermined pattern and the metal film 2
As a method for forming the second adhesive layer 25 and the second adhesive layer 25 on the surface of the thin film 21 containing titanium oxide of the base 20, for example, FIG.
As shown in (A) and (B), a plating resist layer 32 having an opening 20c having a desired pattern shape is previously formed by SU.
After being formed on the surface of the base 20a made of S or the like, a metal film 22 is formed by an electrolytic plating method.

In the present embodiment, the plating resist layer 32 is formed by using a printing method such as a screen printing method. Alternatively, a photosensitive dry film may be attached to the surface of the base 20a, and the plating resist layer 32 may be formed through a metal mask. The film may be formed using a photolithographic method of developing after exposure to light, and the forming method is not particularly limited.

The material of the plating resist layer 32 is a metal film 2
2 may be selected as appropriate according to the type of plating solution used to form No. 2. The thickness of the plating resist layer 32 is 1
It may be about 30 μm.

The thickness D1 (see FIG. 5) of the metal film 22 formed by the electrolytic plating method can be appropriately set according to the application. For example, the thickness D1 for the internal electrode of the ceramic multilayer capacitor required to be thinner is required. As 0.1 to 1.5
It may be about μm.

The composition of the metal film 22 is not limited.
g, Cu, Pd, Ni or other alloys or alloys thereof. P, B, S, C, etc. derived from various additives added for the purpose of adjusting surface properties / crystallinity / internal stress, etc. May be included.

The metal film 22 may be composed of a single layer, or may be composed of two or more metal films having different compositions.

As the electrolytic plating bath for forming the metal film 22, for example, when a nickel metal film is formed, a so-called Watt bath containing nickel sulfate, nickel chloride and boric acid as main components, nickel sulfamate, bromide Nickel, a sulfamic acid bath mainly composed of boric acid,
When a copper metal film is formed, a widely used plating bath such as a so-called pyro copper bath containing copper pyrophosphate and potassium pyrophosphate as main components can be used. Further, in addition to the above main components, additives such as a stress adjusting agent, a surfactant, and a leveling agent may be included.

Next, as shown in FIG. 6C, the first adhesive layer 2 containing a thermoplastic organic polymer is formed on the surface of the metal film 22.
4 is formed.

In order to form the first adhesive layer 24 containing a thermoplastic organic polymer on the surface of the metal film 22, the first adhesive layer 24 is immersed in an organic polymer emulsion or solution, and electrolytically treated using the metal film 22 as a cathode or an anode ( (Anionic or cationic electrodeposition coating method).

As the organic polymer emulsion or solution, epoxy type, acrylic type, vinyl acetate type, acrylic copolymer type and the like can be used. However, considering the thermal decomposability when firing the ceramic laminate, acrylic type is used. It is preferable to select a resin that can be deposited by cathodic electrolysis or anodic electrolysis from among the system resins or the acrylic copolymer resins.

The thickness D2 of the first adhesive layer 24 (see FIG. 5)
Is preferably as thin as possible within a range that can be adhered to the surface of the thin film 21 containing titanium oxide of the light-transmitting substrate 20.
μm or less, more preferably 500 nm or less. The thickness D2 can be controlled by setting the electrodeposition voltage to a predetermined value. This is because in the electrodeposition coating, the growth of the insulating film is stopped when the insulating film having a thickness corresponding to the applied voltage is formed on the surface of the metal.

Incidentally, an organic / inorganic pigment or the like can be added to the organic polymer emulsion or solution, if necessary, similarly to the usual electrodeposition coating method.
Or the dielectric layer 10 and the internal electrode layers 12 and 14 (= the metal film 2) in the multilayer ceramic capacitor 2 as the multilayer ceramic electronic component shown in FIGS.
It is also possible to provide effects such as improvement of adhesion with 2) and prevention of oxidation of the internal electrode layers 12 and 14 (= metal film 22).

Next, the plating resist layer 32 is stripped with a stripping solution such as an organic solvent, an acid, or an alkali selected so as not to dissolve the first adhesive layer 24. As a result, FIG.
As shown in (1), a transfer member 31 in which a metal film 22 having a predetermined pattern is formed on the surface of the base 20a and the first adhesive layer 24 is formed on the surface of the metal film 22 is obtained.

Next, as shown in FIGS. 6E and 6F, the obtained transfer member 31 is attached to the first adhesive layer 2.
4 are laminated so as to be in contact with the thin film 21 of the translucent substrate 20 on which the thin film 21 containing titanium oxide is formed, and the two are preferably heated at a temperature of 15 to 30 ° C. and preferably 1 to 5 MPa. Pressurize with pressure. As a result, the metal film 22 having a predetermined pattern is formed by the action of the first adhesive layer 24.
Good adhesion to the transparent substrate 20 side.

Next, the metal film 22 is transferred to the surface of the thin film 21 containing titanium oxide of the translucent substrate 20 via the first adhesive layer 24 by peeling the substrate 20a from the substrate 20 side. (G) and the metal film transfer member 30 shown in FIG. 5 can be obtained.

After that, a second adhesive layer containing a thermoplastic organic polymer for transfer may be formed on the surface of the metal film 22. The second adhesive layer makes the transfer more reliable when transferring the metal film 22 to another member.

[0070] Method of Production of Multilayer Ceramic Capacitor Next, a method for manufacturing a multilayer ceramic capacitor 2.

The multilayer ceramic capacitor 2 can be manufactured as follows using, for example, the above-described metal film transfer member 30 and the like.

First, a dielectric layer paste is prepared. The dielectric layer paste is composed of an organic solvent-based paste obtained by kneading a dielectric material and an organic vehicle, or a water-soluble solvent-based paste. The dielectric material is appropriately selected from various compounds to be complex oxides and oxides, such as carbonates, nitrates, hydroxides, and organometallic compounds.
They can be used in combination.

The organic vehicle is obtained by dissolving a binder in an organic solvent. The binder used for the organic vehicle is not particularly limited, and various ordinary binders such as ethyl cellulose, polyvinyl butyral, and acrylic resin are used. . Further, the organic solvent is not particularly limited, terpineol, butyl carbitol, acetone,
An organic solvent such as toluene is used.

As the water-soluble solvent used in the water-soluble solvent-based paste, a solvent obtained by dissolving a water-soluble binder, a dispersant, and the like in water is used. The water-soluble binder is not particularly limited, and polyvinyl alcohol, methyl cellulose, hydroxyethyl cellulose, water-soluble acrylic resin, emulsion, and the like are used.

The content of the organic vehicle in each of the above-mentioned pastes is not particularly limited, and may be a usual content, for example, about 1 to 5% by weight of a binder and about 10 to 50% by weight of a solvent. Each paste may contain additives selected from various dispersants, plasticizers, glass frits, insulators, and the like, if necessary.

Next, using this dielectric layer paste,
The green sheet 10a shown in FIG. 3 is formed by a doctor blade method or the like. Next, a metal film pattern 12a to be the internal electrode 12 shown in FIG. 1 is formed on the surface of the green sheet 10a by a transfer method. On the surface of another green sheet 10a, a metal film pattern 14a to be the internal electrode 14 shown in FIG. 1 is formed by a transfer method.

The patterns 12a and 14a of the metal film are
It can be formed on the surface of the green sheet 10a by a similar transfer method. In the following description, green sheet 1
A method of forming the electrode pattern 12a on the surface of the substrate 0a by a transfer method will be described.

The green sheet 10a immediately after being formed by a doctor blade method or the like is usually releasably laminated on a base sheet. The metal film transfer member 30 shown in FIGS. 4 and 5 is laminated on the surface of the green sheet 10a such that the metal film 22 contacts the surface of the green sheet 10a as shown in FIG. . Prior to lamination, a second adhesive layer (not shown) for facilitating transfer may be formed at a position corresponding to the metal film 22 on the green sheet 10a. Then, after lamination, both are pressed at room temperature, preferably at a pressure of 0.2 to 1.0 MPa.

Next, by irradiating the transparent substrate 20 with ultraviolet rays, the titanium oxide contained in the thin film 21 is activated, and a part of the thermoplastic organic polymer contained in the first adhesive layer 24 is decomposed. Thereby, the adhesive force of the first adhesive layer 24 is weakened. When the second adhesive layer is interposed between the metal film 22 and the green sheet 10a, the metal film 22 blocks ultraviolet rays, and the second adhesive layer includes a thin film 21.
Is not bonded, so that the bonding strength is not weakened.

The irradiation energy of the ultraviolet light is preferably 2
It is a 00~2000J / ^{m 2.} The irradiation time is not particularly limited, but is preferably about 5 seconds to 1 minute.

Examples of the ultraviolet lamp to be used include a chemical lamp, a metal halide lamp, a high-pressure mercury lamp and the like. The irradiation atmosphere of the active energy ray is not particularly limited, and may be in the air or in an inert gas such as nitrogen or argon.

Next, as shown in FIG.
By peeling 0 from the green sheet 10a side, the metal film 22 having a predetermined pattern is transferred, and the metal film pattern 12a shown in FIG. 3 is obtained. Other metal film pattern 1
4a can be similarly formed by the transfer method.

By such a transfer method, a plurality of green sheets 10a each having the metal film 22 formed with the patterns 12a and 14a shown in FIG. 3 are laminated together with the green sheet 10a having no pattern formed thereon as necessary. Then, a green chip before firing is obtained by cutting along the cutting line 16.

Next, binder removal processing and baking processing are performed on the green chip. The binder removal treatment is performed before firing, and may be performed under normal conditions. In particular, when a base metal such as nickel or a nickel alloy is used as the conductive material of the internal electrode layer, the heating rate is set to 5 in an air atmosphere.
To 300 ° C / hour, more preferably 10 to 100 ° C / hour, and holding temperature of 180 to 400 ° C, more preferably 20 to
The temperature is maintained at 0 to 300 ° C. and the temperature is maintained for 0.5 to 24 hours, more preferably 5 to 20 hours.

The firing atmosphere of the green chip may be appropriately determined according to the type of the metal film. When a base metal such as nickel or a nickel alloy is used as the conductive material, the oxygen partial pressure of the firing atmosphere is ^reduced to 10 ^−12. The pressure is preferably set to 10 to ⁸ atm. If the oxygen partial pressure is too low, the conductive material of the internal electrode will undergo abnormal sintering and break, and if the oxygen partial pressure is too high, the internal electrode tends to be oxidized. The holding temperature during firing is 1100 to 1400 ° C, more preferably 1200 to 1380 ° C. If the holding temperature is too low, densification becomes insufficient, and if the holding temperature is too high, the capacitance-temperature characteristics tend to deteriorate due to breakage of the electrodes due to abnormal sintering of the internal electrodes or diffusion of the internal electrode material.

Other firing conditions include a heating rate of 50 to 500 ° C./hour, more preferably 200 to 300 ° C.
° C / hour, the temperature holding time is 0.5-8 hours, more preferably 1-3 hours, the cooling rate is 50-500 ° C / hour, more preferably 200-300 ° C / hour, and the firing atmosphere is a reducing atmosphere. It is desirable to use a mixed gas of, for example, nitrogen gas and hydrogen gas as the atmosphere gas after humidification.

When firing in a reducing atmosphere, it is desirable to anneal the sintered body of the capacitor chip. In the above-described binder removal processing, firing and annealing steps, for example, a wetter or the like can be used to humidify the nitrogen gas or the mixed gas. The water temperature in this case is desirably 5 to 75 ° C.

As described above, the capacitor body 4 shown in FIGS. 1 and 2 is obtained. By forming terminal electrodes 6 and 8 at both ends of the obtained capacitor body 4,
The multilayer ceramic capacitor 2 is obtained.

According to the method for manufacturing a multilayer ceramic capacitor of the present embodiment, the metal film transfer member 30 is used, and the ultraviolet light is irradiated from the light-transmitting substrate 10 side, whereby the oxidation contained in the thin film 21 is reduced. The titanium is activated to decompose the thermoplastic organic polymer contained in the first adhesive layer 24,
Thereby, the adhesive strength of the first adhesive layer 24 can be reduced. In the present embodiment, not only the incident ultraviolet light incident from the light transmitting substrate 20 side but also the thin film 2 containing titanium oxide is used.
The reflected ultraviolet light that has passed through the first and first adhesive layers 24 and has been reflected on the surface of the metal film 22 on the first adhesive layer 24 side can also contribute to the decomposition of organic substances contained in the first adhesive layer 24,
The adhesive strength of the first adhesive layer 24 can be reduced more efficiently. As a result, the metal film 22 formed on the surface of the first adhesive layer 24 can be very easily and reliably transferred onto the surface of the ceramic green sheet 10a at high speed and at low cost.

In particular, in the present embodiment, since the first adhesive layer 24 is formed by the electrodeposition coating method, the thickness D2 can be formed as extremely small as 1 μm or less, and the first adhesive layer 2 having such a thickness can be formed.
By using No. 4, higher-speed transfer becomes possible.

Second Embodiment Metal Film Transfer Member As shown in FIGS. 7 and 8, a metal film transfer member 30a according to the present embodiment has A first adhesive layer 24a containing a plastic organic polymer is formed in a predetermined pattern. The metal film 22 is formed on the surface of the first adhesive layer 24a. In addition,
Even when an easily decomposable adhesive layer (not shown) made of nitrocellulose or the like, which decomposes promptly by irradiating ultraviolet rays, is interposed between the translucent substrate 20 and the first adhesive layer 24a. Good.

As a method of forming the first adhesive layer 24a and the metal film 22 in a predetermined pattern on the surface of the base 20, for example, as shown in FIGS. Plating resist layer 32 having portion 20c
Is formed on the surface of the base 20a made of SUS or the like, and then the metal film 22 is formed by an electrolytic plating method.

The method, material, and thickness of the plating resist layer 32 may be the same as in the first embodiment. The thickness (corresponding to D1 in FIG. 5), composition, and electrolytic plating bath for forming the metal film 22 formed by the electrolytic plating method may be the same as those in the first embodiment.

Next, as shown in FIG. 9C, a first adhesive layer 24a containing titanium oxide and a thermoplastic organic polymer is formed on the surface of the metal film 22.

In order to form the first adhesive layer 24a containing titanium oxide and a thermoplastic organic polymer on the surface of the metal film 22, for example, the first adhesive layer 24a is immersed in an organic polymer emulsion or solution containing titanium oxide, It can be performed by performing an electrolytic treatment (anion or cation electrodeposition coating method) using the metal film 22 as a cathode or an anode. The titanium oxide used in this case is not particularly limited, but it is preferable to use a neutral type titanium oxide sol from the viewpoint that aggregation and precipitation due to reaction with the organic polymer in the electrodeposition treatment liquid are not easily caused. .

As the organic polymer emulsion or solution, epoxy-based, acrylic-based, vinyl acetate-based, acrylic copolymer-based and the like can be used. However, considering the thermal decomposition property when firing the ceramic laminate, acrylic It is preferable to select a resin that can be deposited by cathodic electrolysis or anodic electrolysis from among the system resins or the acrylic copolymer resins.

The amount of titanium oxide added may be such that the concentration in the emulsion or solution is preferably about 0.5 to 5% by mass, more preferably about 1 to 2% by mass.

The thickness of the first adhesive layer 24a (corresponding to D2 in FIG. 5) is preferably as thin as possible within a range in which the first adhesive layer 24a can be adhered to the surface of the translucent substrate 20 (see FIG. 8). ,
More preferably, it is 500 nm or less. First adhesive layer 24
As in the first embodiment, the thickness of a can be controlled by setting the electrodeposition voltage to a predetermined value.

An organic / inorganic pigment or the like can be added to the organic polymer emulsion or solution to which titanium oxide has been added, if necessary. Dielectric layer 10 and internal electrode layers 12 and 14 (= metal film 22) in multilayer ceramic capacitor 2 as a multilayer ceramic electronic component shown in FIG.
To the internal electrode layers 12, 14 (= metal film 2)
It is also possible to provide the effect of 2) such as oxidation prevention.

Next, the plating resist layer 32 is made of an organic solvent, an acid, or a solvent selected so as not to dissolve the first adhesive layer 24a.
Peel off with a stripper such as alkali. As a result, FIG.
As shown in (D), a transfer member 3 in which a metal film 22 having a predetermined pattern is formed on the surface of a substrate 20a and a first adhesive layer 24a containing titanium oxide is formed on the surface of the metal film 22 is formed.
1a is obtained.

Next, as shown in FIGS. 9E and 9F, the obtained transfer member 31a is laminated so that the first adhesive layer 24a is in contact with the translucent substrate 20,
Both are pressurized preferably at a temperature of 15 to 30 ° C. and preferably at a pressure of 1 to 5 MPa. as a result,
By the action of the first adhesive layer 24a, the metal film 22 having the predetermined pattern is satisfactorily adhered to the transparent substrate 20 side.

Next, by peeling the base 20a from the base 20 side, the metal film 22 is transferred to the surface of the light-transmitting base 20 via the first adhesive layer 24a, and the metal film 22 shown in FIGS. The film transfer member 30a can be obtained.

Even when the multilayer ceramic capacitor 2 (see FIG. 1) is manufactured using such a metal film transfer member 30a, the same operation and effect as those of the first embodiment can be obtained.

Other Embodiments The embodiments of the present invention have been described above, but the present invention is not limited to these embodiments.
Of course, the present invention can be implemented in various modes without departing from the gist of the present invention.

For example, in the present invention, a metal film transfer member is manufactured using a long substrate, and the member is overlapped with a ceramic green sheet similarly manufactured in a long length, and is subjected to continuous processing such as nipping with a pressure roll in a conveying process. The application of the law is also possible. In this case, the productivity of the multilayer ceramic electronic component can be further improved.

The main use of the metal film transfer member of the present invention is for forming metal internal electrodes of a multilayer ceramic electronic component such as a multilayer ceramic capacitor. A patterned metal film formed by a thin film forming method is used. It can be applied to other uses including a step of transferring. For example, formation of external electrodes of multilayer ceramic electronic components, non-contact IC
The metal film transfer member according to the present invention can also be used for forming an antenna pattern for a card.

[0107]

EXAMPLES Hereinafter, the present invention will be described based on more detailed examples, but the present invention is not limited to these examples.

Example 1 A glass plate was prepared as a light-transmitting substrate. An SiO ₂ sol is applied and baked on one surface of the translucent substrate to provide a SiO ₂ barrier layer, and then a titanium-acetylacetone chelate solution adjusted to a concentration of 5% by mass is applied and baked at 500 ° C. to form titanium oxide. A thin film containing (TiO ₂ ) was formed (Sample A).

On the other hand, a SUS sheet was prepared as a base. After mirror polishing one side of this SUS sheet, after printing a plating resist leaving openings of a predetermined pattern,
It was immersed in a nickel sulfamate plating bath to form a nickel plating film having a thickness of 0.5 μm in the opening of the resist. The SUS on which the nickel film of the predetermined pattern is formed
Emulsion concentration of 3% by mass on nickel film of sheet
The adhesion amount was 3 by an electrodeposition coating method using an anionic acrylic emulsion having an emulsion particle size of 50 nm adjusted to
The first of 00 mg / m ² (corresponding to a thickness of 300 nm or less)
After forming the adhesive layer, the plating resist was removed by washing with toluene (sample B).

An SU having a nickel film and a first adhesive layer formed thereon
The first adhesive layer side of the S sheet (sample B) is coated with titanium oxide (T
The transparent member (sample A) on which the thin film containing iO ₂ ) was formed was overlaid on the thin film side, pressed at room temperature under a pressure of 2 MPa, and then only the SUS sheet was peeled off to remove the metal film transfer member. Obtained.

On the surface of a separately prepared ceramic green sheet, transfer the obtained metal film transfer member at room temperature and a pressure of 0.5M.
After pressing with Pa, irradiation energy 1
When the transparent substrate was removed by irradiating ultraviolet rays of 000 J / m ² for 15 seconds, the entire nickel film was transferred to the ceramic green sheet laminate.

Example 2 A PET film was prepared as a light-transmitting substrate (sample A).

On the other hand, a SUS sheet was prepared as a base. After mirror polishing one side of this SUS sheet, after printing a plating resist leaving openings of a predetermined pattern,
It was immersed in a nickel sulfamate plating bath to form a nickel plating film having a thickness of 0.5 μm in the opening of the resist. The SUS on which the nickel film of the predetermined pattern is formed
An electrodeposition coating method using an anionic acrylic emulsion having an emulsion particle diameter of 50 nm in which a neutral TiO ₂ sol is mixed on a nickel film of a sheet to adjust the emulsion concentration to 3% by mass and the TiO ₂ concentration to 1% by mass. After forming the first adhesive layer containing titanium oxide having an adhesion amount of 300 mg / m ² (equivalent to a thickness of 300 nm or less),
The plating resist was removed by washing with toluene (sample B).

The SU having the nickel film and the first adhesive layer formed thereon
The first adhesive layer side of the S sheet (sample B) was superimposed on the PET film (sample A) and pressed at room temperature under a pressure of 2 MPa, and then only the SUS sheet was peeled off to obtain a metal film transfer member. .

On the surface of a separately prepared ceramic green sheet, the obtained metal film transfer member was placed at room temperature under a pressure of 0.5M.
After pressing with Pa, irradiation energy 1
When the transparent substrate was removed by irradiating ultraviolet rays of 000 J / m ² for 10 seconds, the entire nickel film was transferred to the ceramic green sheet laminate.

[0116]

As described above, according to the present invention, an extremely thin and uniform metal film pattern can be formed.
On the surface of a delicate transfer receiving member such as a green sheet,
It is possible to provide a member for transferring a metal film, which can be transferred very easily and reliably, at a high speed and at a low cost, and a method for manufacturing the same.

According to the present invention, an extremely thin and uniform metal film pattern can be very easily and reliably transferred onto a surface of a fragile transfer-receiving member such as a green sheet at a high speed and at a low cost. In particular, it is possible to provide a metal film transfer method which is more suitable for high-speed automation of a transfer line.

According to the present invention, a multilayer ceramic electronic component having a thin and uniform internal electrode with few defects is provided.
It is possible to provide a method for manufacturing a multilayer ceramic electronic component which can be manufactured extremely easily and at low cost, and which is particularly suitable for high-speed automation of a manufacturing line.

[Brief description of the drawings]

FIG. 1 is a partially cutaway sectional view of a multilayer ceramic capacitor according to one embodiment of the present invention.

FIG. 2 is a plan view of the multilayer ceramic capacitor.

FIG. 3 is a perspective view of a green sheet used in a manufacturing process of the capacitor shown in FIGS. 1 and 2.

FIG. 4 is a perspective view showing an example of a metal film transfer member according to the first embodiment of the present invention.

FIG. 5 is a sectional view taken along line VV shown in FIG.

FIG. 6 is a process chart for explaining an example of a method of manufacturing the metal film transfer member shown in FIGS. 4 and 5.

FIG. 7 is a perspective view showing an example of a metal film transfer member according to a second embodiment of the present invention.

FIG. 8 is a sectional view taken along line VIII-VIII shown in FIG.

FIG. 9 is a process chart for explaining an example of a method of manufacturing the metal film transfer member shown in FIGS. 7 and 8.

[Explanation of symbols]

2 Multilayer ceramic capacitor (multilayer ceramic electronic component) 4 Capacitor element 6 First terminal electrode 8 Second terminal electrode 10 Dielectric layer 10a Green sheet 12 First internal electrode layer 12a Pattern 14th 2 Internal electrode layer 14a Pattern 20 Translucent substrate 20a Substrate 20c Opening 21 Thin film containing titanium oxide (photocatalytic functional thin film) 22 Metal film 24, 24a First adhesive layer 30, 30a Metal film Transfer member 31, 31a Transfer member 32 Plating resist layer

Continued on the front page F-term (reference) 4G069 AA03 AA08 BA04B BA17 BA48A CB35 DA06 EA08 EA12 FA02 FB23 FB30 4J004 AB07 CC02 CC03 CE01 FA05 5E001 AB03 AC09 AC10 AE01 AE02 AE03 AF06 AH01 AH05 AH03 EE03 AE03 FG06 FG26 FG27 FG54 GG10 GG11 JJ03 JJ12 LL02 LL03 MM06 MM22 MM24 PP09

Claims (10)

[Claims] 1. A translucent substrate on which a photocatalytic function thin film is formed, a first adhesive layer having a predetermined pattern including a thermoplastic organic polymer formed on a surface of the photocatalytic function thin film, and the first adhesive layer And a metal film formed on the surface of the metal film. 2. A translucent substrate, a first adhesive layer having a predetermined pattern including a photocatalyst and a thermoplastic organic polymer formed on the surface of the translucent substrate, and a first adhesive layer formed on the surface of the first adhesive layer. And a member for transferring a metal film. 3. The metal film transfer member according to claim 1, wherein the first adhesive layer is formed by an electrodeposition coating method. 4. The member for transferring a metal film according to claim 3, wherein the thickness of the first adhesive layer is 1 μm or less. 5. A first adhesive layer having a predetermined pattern containing a thermoplastic organic polymer is formed on a surface of a photocatalytic functional thin film formed on a surface of a light transmitting substrate, and a metal film is formed on a surface of the first adhesive layer. Contacting the metal film side of the formed metal film transfer member with the member to be transferred; and irradiating the photocatalytic function thin film with ultraviolet light from the transparent substrate side of the metal film transfer member to perform the first bonding. A method for transferring a metal film, comprising: a step of weakening an adhesive force of a layer; and a step of separating the light-transmitting substrate from the member to be transferred and transferring a metal film having a predetermined pattern to a surface of the member to be transferred. 6. A metal film transfer in which a first adhesive layer having a predetermined pattern containing a photocatalyst and a thermoplastic organic polymer is formed on a surface of a light-transmitting substrate, and a metal film is formed on a surface of the first adhesive layer. Contacting the metal film side of the member for transfer with the member to be transferred; and bonding the first adhesive layer by irradiating the first adhesive layer containing the photocatalyst with ultraviolet light from the transparent substrate side of the member for metal film transfer. A method for transferring a metal film, comprising: a step of weakening a force; and a step of separating the substrate from the member to be transferred and transferring a metal film having a predetermined pattern to a surface of the member to be transferred. 7. A first adhesive layer having a predetermined pattern containing a thermoplastic organic polymer is formed on a surface of a photocatalytic functional thin film formed on a surface of a light transmitting substrate, and a metal film is formed on a surface of the first adhesive layer. Contacting the metal film side of the formed metal film transfer member with the green sheet; and irradiating the photocatalytic function thin film with ultraviolet light from the transparent substrate side of the metal film transfer member to form the first adhesive layer. Weakening the adhesive force of the green sheet, separating the substrate from the green sheet, transferring a metal film of a predetermined pattern on the surface of the green sheet, A method for manufacturing a multilayer ceramic electronic component, comprising: a laminating step of laminating with a green sheet; and a firing step of firing the laminated green sheet. 8. A metal film transfer in which a first adhesive layer having a predetermined pattern containing a photocatalyst and a thermoplastic organic polymer is formed on a surface of a light-transmitting substrate, and a metal film is formed on a surface of the first adhesive layer. Contacting the metal film side of the member for use with the green sheet; and irradiating the first adhesive layer containing the photocatalyst with ultraviolet rays from the transparent substrate side of the member for transferring a metal film to the adhesive force of the first adhesive layer. Weakening the substrate, separating the substrate from the green sheet, and transferring a metal film of a predetermined pattern on the surface of the green sheet, and transferring the green sheet on which the metal film of the predetermined pattern is transferred, together with other green sheets. A method for manufacturing a multilayer ceramic electronic component, comprising: a laminating step of laminating; and a firing step of firing the laminated green sheets. 9. A photocatalyst in which a metal film having a predetermined pattern is formed on a surface of a substrate, and a first adhesive layer side of a transfer member having a first adhesive layer containing a thermoplastic organic polymer formed on the surface of the metal film. Contacting the light-transmissive substrate on which the functional thin film is formed with the photocatalytic functional thin film side; separating the substrate from the light-transmissive substrate; A method for producing a member for transferring a metal film, comprising a step of transferring the adhesive layer and the metal film. 10. A transfer member according to claim 1, wherein a metal film having a predetermined pattern is formed on a surface of the substrate, and a first adhesive layer containing a photocatalyst and a thermoplastic organic polymer is formed on the surface of the metal film.
A step of bringing the adhesive layer side into contact with the surface of the light-transmitting substrate; and a step of separating the substrate from the light-transmitting substrate and transferring the first adhesive layer and the metal film in a predetermined pattern to the surface of the light-transmitting substrate. A method for producing a metal film transfer member having: