JP2002081661A - Floor heating panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a floor heating panel which efficiently transfers the quantity of heat radiated from a heating medium flow tube to a surface plate. SOLUTION: The floor heating panel comprises a plate of base material 4 having fitting grooves 5 wherein heating medium flow tubes 6 are fitted and a surface plate 7 for soaking provided on the upper surface of the base material 4 on the side where the grooves 5 are formed in the state that the heating medium flow tubes 6 are embedded in the grooves 5. The floor heating panel is further provided with heat transfer accelerating members S which increase the quantity of heat transferred from the tubes 6 and transferred to the upper surface of the base material 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a state in which a plate-like base material is provided with a concave groove for burying a heat medium flow pipe, and the heat medium flow pipe is buried in the concave groove so as to be piped. The present invention also relates to a floor heating panel in which a heat equalizing surface plate is provided on an upper surface of the plate-shaped substrate on the opening side of the concave groove.

[0002]

2. Description of the Related Art In a floor heating panel as described above, a heat medium flow pipe is buried in a recessed groove of a plate-like base material, and the heat is uniformly applied to the entire upper surface of the plate-like base material. The heat medium such as hot water is passed through the heat medium flow pipe embedded in the recessed groove, and the heat from the heat medium flow pipe is transferred to the plate-shaped substrate. The heat is transferred to the surface plate on the upper surface. As shown in FIG. 11, this type of floor heating panel is embedded with the heat medium flow pipe 6a in contact with the concave groove 5d formed in the plate-shaped base material 4a, and In the circumferential direction of the heat medium flow pipe 6a embedded in the groove 5d, the heat medium flow pipe 6a is in contact with the surface plate 7a along a straight line (dotted line portion in the drawing) along the length direction of the heat medium flow pipe 6a on the opening side of the concave groove 5d. Then, the heat from the heat medium flow tube 6a is transferred to the surface plate 7a by the contact between the heat medium flow tube 6a and the surface plate 7a (for example, JP-A-11-230560).

[0003]

However, in the above-mentioned prior art, since the heat medium flow pipe is buried in a state of contact with the concave groove, the heat transfer pipe is in contact with the plate-like base material having the concave groove. Due to the contact with the heat medium flow pipe, heat from the heat medium flow pipe is not transferred to the upper surface of the plate-shaped substrate, but is radiated to a portion other than the upper surface of the plate-shaped substrate. Of the heat radiated from the medium flow pipe, the heat transferred to the surface plate is reduced. Further, in the above-mentioned conventional one, in the circumferential direction of the heat medium flow pipe embedded in the concave groove, the heat medium flow pipe comes into contact with the surface plate along a straight line along the length direction of the heat medium flow pipe on the concave groove opening side. Therefore, the contact between the heat medium flow tube and the surface plate is on a straight line along the length direction of the heat medium flow tube among the circumferential side surfaces of the heat medium flow tube. The heat transfer area for transferring the generated heat to the surface plate is reduced, and the amount of heat that can be transferred to the surface plate by the amount of heat radiated from the heat medium flow pipe is reduced.

Therefore, in the above-described conventional apparatus, the amount of heat radiated from the heat medium flow tube is radiated to a portion other than the upper surface of the plate-shaped substrate, or the amount of heat radiated from the heat medium flow tube is transferred to the surface plate. The amount of heat that can be produced is reduced, and as a result, the amount of heat radiated from the heat medium flow pipe cannot be efficiently transferred to the surface plate.

The present invention has been made in view of such a point, and an object of the present invention is to provide a floor heating panel capable of efficiently transferring the amount of heat radiated from the heat medium flow pipe to the surface plate. The point is to provide.

[0006]

According to the first aspect of the present invention, there is provided a plate-like base material provided with a concave groove for burying a heat medium flow tube therein. In a floor heating panel in which a surface plate for soaking is provided on an upper surface of the plate-like base material on the opening side of the concave groove, in a state where the heat medium flow pipe is buried in the inlet groove and piped, A heat transfer promoting member for increasing the amount of heat transferred to the upper surface of the plate-like substrate among the amounts of heat radiated from the heat medium flow pipe is provided.

[0007] That is, as a configuration for increasing the amount of heat transferred from the heat medium flow tube to the upper surface of the plate-like base material out of the heat amount radiated from the heat medium flow tube, for example, A structure that prevents heat from being radiated to portions other than the top surface of the plate-shaped base material without transferring heat to the top surface of the plate-shaped base material, and increases the contact area between the heat medium flow pipe and the surface plate to allow the heat medium flow The heat transfer area for increasing the heat transfer area for transferring the heat radiated from the tube to the surface plate is increased, and by providing a heat transfer promoting member having the structure, the heat amount radiated from the heat medium flow tube is reduced. The amount of heat transferred to the face plate can be increased. Therefore, it has become possible to provide a floor heating panel capable of efficiently transferring the amount of heat radiated from the heat medium flow pipe to the surface plate.

According to the second aspect of the present invention, the heat transfer promoting member is connected to the heat medium flow pipe while the heat medium flow pipe is buried in the recess groove. An air layer space forming part that forms an air layer space between the groove and the groove is provided. That is, the configuration according to claim 2 is
Claim 1 which specifies the above claim 1, wherein the heat transfer promoting member is piped with the heat medium flow pipe embedded in the recessed groove,
A state in which an air layer space is formed between the heat medium flow pipe and the recessed groove by including an air layer space forming portion that forms an air layer space between the heat medium flow pipe and the recessed groove. Thus, the heat medium flow pipe can be buried in the recessed groove and piped. Therefore, the air layer space makes it possible to prevent the heat radiated from the heat medium flow tube from being radiated to a portion other than the upper surface of the plate-shaped base material. It is possible to increase the amount of heat transferred to the surface plate out of the heat amount.

According to the third aspect of the present invention, the heat transfer promoting member is provided between the recessed groove and the heat medium flow pipe, and the heat transfer promoting member is provided between the heat medium flow pipe and the plate-like base material. It is provided with a heat transfer member that transfers heat radiated to portions other than the upper surface to the upper surface of the plate-shaped substrate. In other words, the configuration according to claim 3 is the one according to claim 1, wherein the heat transfer promoting member is provided between the recessed groove and the heat medium flow pipe, and By providing a heat transfer member that transfers heat radiated to a portion other than the upper surface of the plate-shaped base material to the upper surface of the plate-shaped base material, a portion other than the upper surface of the plate-shaped base material from the heat medium flow pipe is configured. It is possible to transfer the heat radiated to the upper surface of the plate-shaped base material, and to transfer the transferred heat to the surface plate. Therefore, the heat that has been radiated to portions other than the upper surface of the plate-shaped substrate can be transferred to the surface plate by the heat transfer member. As a result, the amount of heat radiated from the heat medium flow pipe can be reduced. Of these, the amount of heat transferred to the surface plate can be increased.

According to the fourth aspect of the present invention, the heat transfer promoting member is provided between the heat medium flow pipe and the surface plate, and the heat transfer promotion member is provided in the circumferential direction of the heat medium flow pipe. It is provided with a heat transfer area expanding member that comes into contact with the side surface on the entrance opening side and that comes into contact with the surface plate in a plane. That is, the configuration according to claim 4 is the one according to claim 1 in which the heat transfer promoting member is provided between the heat medium flow pipe and the surface plate, and the heat transfer promotion member is provided around the heat medium flow pipe. In the direction, by contacting the side surface portion on the concave groove opening side, and by comprising a heat transfer area expansion member that comes into contact with the surface plate in a plane, the heat medium flow pipe and the heat transfer area expansion member And increasing the contact area between the heat transfer area expanding member and the surface plate while increasing the heat radiated from the heat medium flow pipe to the surface plate via the heat transfer area expanding member. It becomes possible. Therefore, it is possible to increase the heat transfer area for transferring the heat radiated from the heat medium flow tube to the surface plate. It is possible to increase the amount of heat transferred.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A floor heating panel according to the present invention will be described with reference to the drawings. [First Embodiment] This floor heating panel P is shown in FIGS.
As shown in the figure, a unit panel portion 1 having a substantially same thickness and width and having a rectangular plate shape has a thickness substantially equal to that of the unit panel portion 1 and a width almost twice as large as the width of the unit panel portion 1. It has a wide end panel portion 2 having a rectangular plate shape and a narrow end panel portion 3 having a width substantially equal to the width of the unit panel portion 1. A plurality of unit panel portions 1 are arranged adjacent to each other with the width direction of the unit panel portion 1 being the same direction, and end panel portions 2 and 3 are arranged at both ends in the length direction of the unit panel portion 1. It is configured.

The unit panel portion 1 and the end panel portions 2 and 3 are made of a foamed resin plate-like base material 4 having a heat-insulating action and capable of reducing weight, and a concave groove 5 of the plate-like base material 4. A heat-medium distribution pipe 6 is embedded in the inside of the pipe, and is formed of a surface plate 7 for heat equalization provided on the upper surface of the plate-shaped base material 4 on the opening side of the concave groove. The plate-shaped base material 4 of the unit panel portion 1 is formed with a recessed groove 5a for embedding a heat medium flow pipe 6 over the entire length thereof, and a wide end panel portion 2 and a narrow end panel portion 3 are provided. Are formed with curved concave grooves 5b and 5c for embedding the heat medium flow pipe 6, respectively.

Incidentally, the material of the plate-shaped base material 4 is not limited to those made of a foamed resin, and those made of wood or resin may be used. Various foams such as foams and polystyrene foams can be applied, and a resin sheet molded body made of synthetic resin is laminated on the upper surface of the foam, and if necessary, use small joists for reinforcement. You may. The surface plate 7 for heat equalization is made of aluminum foil or a thin flexible metal having good thermal conductivity.

The linear concave groove 5a of the unit panel portion 1
Is provided linearly over the entire length of the unit panel portion 1, and has a sectional shape, as shown in FIG. 3A, which firmly holds the heat medium flow pipe 6 and prevents the heat medium flow pipe 6 from being displaced. For this purpose, only one heat medium flow pipe 6 is formed. Also, wide end panel portion 2
The curved concave groove 5b is provided to be curved over the unit panel portion 1 adjacent in the width direction of the panel portion 1,
As shown in FIG. 3 (b), the heat medium flow pipe 6 is formed so that four heat medium flow pipes 6 can be provided, and the heat medium flow pipe 6 is brought into pressure contact with the inner surface of the curved concave groove 5b by the elastic restoring force of the heat medium flow pipe 6. Tube 6
Is configured to be able to prevent the displacement of the position. In addition, the curved concave groove 5 of the narrow end panel portion 3
c is provided so as to be curved between the same unit panel portions 1 so that two heat medium flow pipes 6 can be piped, and the curved concave groove 5 c is formed by the elastic restoring force of the heat medium flow pipe 6.
It is configured such that the heat medium flow pipe 6 can be prevented from being displaced by being pressed against the inner surface of the heat medium. By the way, Figure 3
(A) and (b) are longitudinal sectional side views of the recessed groove 5 where a protruding portion 11 described later is formed.

As the heat medium flow pipe 6, a crosslinked polyethylene pipe or a polybutene resin pipe is generally used, and is composed of two heat medium flow pipes 6 having no connection. That is, in order to enhance the reliability of the pipe, the heat medium flow pipe 6 is formed by a pipe having no connection portion, and the two heat medium flow pipes 6 are connected to the concave groove 5a of the unit panel portion 1 and the end panel portion. It is configured so that two pipes are buried in each of the curved concave grooves 5b and 5c.

Both ends of the two heat medium flow pipes 6 are connected to a heat medium supply section 10 provided on one of the wide end panel portions 2, and a heat medium such as hot water is supplied from a heat source unit (not shown). The heat medium is supplied to each of the heat medium flow pipes 6 via the outgoing side of the heat medium supply unit 10. Then, the hot water supplied to the heat medium flow pipe 6 flows through the heat medium flow pipe 6 and passes through the heat medium supply unit 1.
It is configured to be supplied to the return side of 0 and discharged. That is, the unit panel portion 1 and the end panel portions 2 and 3
The floor to be heated is configured to be heated by flowing hot water from a heat source unit (not shown) through the heat medium supply unit 10 through the heat medium flow pipe 6, which is provided over the heat medium flow pipe 6.

The heat transfer promoting member S for increasing the amount of heat transferred from the heat medium flow pipe 6 to the upper surface of the plate-like base material 4 out of the heat medium flow pipe 6 moves the heat medium flow pipe 6 into the heat medium flow pipe 6. An air space forming section 9 for forming an air space 8 between the heat medium flow pipe 6 and the recessed groove 5 in a state of being buried in the groove 5 and being piped.
It is provided with.

More specifically, in the unit panel portion 1, as shown in FIGS. 2, 3A and 4, and in the linear recess groove 5a, Linear concave groove 5 over the entire circumferential direction of the linear concave groove 5a.
a protruding portion 11 protruding inward from the straight groove 5a.
Are formed at a plurality of locations in the length direction of the unit panel portion 1. The heat medium flow pipe 6 is supported by the plurality of protrusions 11 in a state where the heat medium flow pipe 6 is buried and piped in the linear recess groove 5a. The air space 8 is formed between the air gap 5a and the air groove 5a. FIG. 4 is a longitudinal sectional front view of the unit panel portion 1.

In the end panel portions 2 and 3,
As shown in (b) of FIG. 3, similarly to the unit panel part 1 described above, the curved recessed grooves 5 b,
A projecting portion 11 projecting inward of the curved concave grooves 5b, 5c is formed over the entire circumferential direction of 5c.

By providing the air layer space forming portion 9 in this manner, the heat medium flow pipe 6 is not directly buried in the inner peripheral surface of the recess groove 5 and is piped. Can be buried in the recessed groove 5 via the air space 8 between the heat medium flow pipe 6 and the recessed groove 5. 8, it is possible to prevent the heat radiated from the heat medium flow tube 6 from being radiated to a portion other than the upper surface of the plate-shaped substrate 4 without being transmitted to the upper surface of the plate-shaped substrate 4. Becomes As a result, it is possible to increase the amount of heat transferred to the surface plate 7 out of the amount of heat radiated from the heat medium flow tube 6, and efficiently transfer the heat radiated from the heat medium flow tube 6 to the surface plate 7. Heat can be transferred.

[Second Embodiment] The second embodiment shows another embodiment of the heat transfer promoting member S in the first embodiment, and the structure of the heat transfer promoting member will be described. Note that, in the second embodiment, the configuration other than the heat transfer promoting unit is the same as that of the first embodiment. Therefore, the detailed description of the configuration other than the heat transfer promoting unit is indicated by the same reference numerals and the like. Omitted.

The heat transfer promoting member S radiates heat from the heat medium flow pipe 6 to a portion other than the upper surface of the plate-like substrate 4 in a state where the heat medium flow pipe 6 is buried in the concave groove 5 and piped. A heat transfer member 12 for transferring the heat to the upper surface of the plate-shaped substrate 4, and an air space 8 between the heat transfer member 12 and the recessed groove 5 with the heat transfer member 12 installed. Is formed.

The heat transfer promoting member S in the unit panel portion 1 will be specifically described with reference to FIGS. 5 and 6. As the air layer space forming portion 9, a linear concave groove 5a
Are formed at a plurality of locations in the length direction of the linear recessed groove 5a which protrude inward of the linear recessed groove 5a throughout the circumferential direction. And the heat transfer member 12
Are installed at each of the locations where the protruding portions 11 are formed in the length direction of the linear concave groove 5a, and a U-shaped U-shaped portion 12a and horizontal ends at both ends of the U-shaped portion 12a. And a plane portion 12b extending in the direction.

The configuration of the air layer forming portion 9 in the end panel portions 2 and 3 is the same as in the first embodiment.
The heat transfer member 12 installed in the end panel portions 2 and 3 is configured such that the shape of the U-shaped portion 12a is configured to fit into the curved concave grooves 5b and 5c, and the unit panel described above is used. Only the shape is different from that of the heat transfer member 12 installed in the portion 1, and thus the detailed description of the configuration of the heat transfer promoting member S in the end panel portions 2 and 3 is omitted. In the unit panel portion 1, a plurality of heat transfer members 12 are provided at intervals in the length direction of the unit panel portion 1, and in the end panel portions 2 and 3, one heat transfer member 12 is provided. Have been.

As described above, the heat transfer member 12 is
Is inserted in a state where an air space 8 is formed between the heat transfer member 12 and the U-shaped portion 12 a of the heat transfer member 12 embedded in the recess 5. The flow pipe 6 is configured so as to be buried in the recessed groove 5 and piped, and the U-shaped portion 12 a and the heat medium flow pipe 6 are brought into contact with each other, from the heat medium flow pipe 6 to other than the upper surface of the plate-shaped base material 4. Is transferred to the U-shaped portion 12 a of the heat transfer member 12, and the transferred heat is radiated to a portion other than the upper surface of the plate-shaped substrate 4 by the air space 8. While preventing, heat transfer member 1
The heat is transmitted to the plane portion 12b in FIG.

Incidentally, the linear recessed groove 5a and the curved recessed grooves 5b and 5c at the place where the heat transfer member 12 is installed are formed on the upper surface of the flat portion 12b of the heat transfer member 12 when the heat transfer member 12 is installed. The upper surface portion of the plate-shaped base material 4 corresponding to both the lateral sides of the linear recessed groove 5a and the curved recessed grooves 5b, 5c is transferred so that the upper surface of the plate-shaped base material 4 is flush with the upper surface of the plate-shaped base material 4. Heating member 1
It is configured to be lower than the upper surface portion of the plate-shaped base material 4 corresponding to both lateral side portions of the linear recessed groove 5a and the curved recessed grooves 5b, 5c where no 2 is provided.

In this manner, the heat radiated from the heat medium flow pipe 6 to a portion other than the upper surface of the plate-shaped substrate 4 is transferred to the heat transfer member 12.
To the upper surface of the plate-shaped base material 4 while preventing the transferred heat from being dissipated to portions other than the upper surface of the plate-shaped base material 4. It is possible to increase the amount of heat transmitted to the surface plate 7 out of the amount of heat radiated from the flow pipe 6, and to more efficiently transfer the heat radiated from the heat medium flow pipe 6 to the surface plate 7. You can do it.

[Third Embodiment] The third embodiment shows another embodiment of the heat transfer promoting member S in the first embodiment, and the configuration of the heat transfer promoting member will be described. Note that, in the third embodiment, the configuration other than the heat transfer promoting unit is the same as that of the above-described first embodiment. Omitted.

The heat transfer promoting member S is installed between the heat medium flow pipe 6 and the surface plate 7, and comes into contact with the side surface of the heat medium flow pipe 6 on the opening side of the concave groove 5 in the circumferential direction. And a heat transfer area expanding member 13 that comes into contact with the surface plate 7 in a plane. The configuration of the heat transfer promoting member S in the unit panel portion 1 will be described with reference to FIG. 7. The heat transfer area expanding member 13 is a state in which the heat medium flow pipe 6 is buried in the concave groove 5 and piped. In the circumferential direction of the heat medium flow pipe 6, a lower contact portion 13a that contacts the side surface exposed on the opening side of the concave groove 5, and an upper contact portion 13b that contacts the surface plate 7 in a plane. And the heat radiated from the heat medium flow pipe 6 is transferred to the lower contact portion 13a, and the transferred heat is transferred to the surface plate 7 at the upper contact portion 13b. ing. In addition, the end panel portions 2 and 3
In the configuration of the heat transfer promoting member S in the above, only the shape of the heat transfer area expanding member 13 in the unit panel portion 1 is different, and therefore a detailed description thereof is omitted.

As described above, by the heat transfer area expanding member 13, the contact area with the heat medium flow pipe 6 is increased in the circumferential direction of the heat medium flow pipe 6 toward the opening side of the concave groove 5. By making the contact area with the surface plate 7 a plane, the surface portion surrounded by the dotted line in FIG. 7 is used to transfer heat radiated from the heat medium flow pipe 6 to the surface plate 7. Since the heat transfer area can be used, the heat transfer area can be increased, and the amount of heat transferred to the surface plate 7 out of the amount of heat radiated from the heat medium flow pipe 6 can be increased.

Incidentally, the heat transfer area expanding member 13 is provided over the entire length of the recessed groove 5, and the upper surface of the plate-shaped base material 4 corresponding to both lateral sides of the recessed groove 5 is provided with a heat transfer area expanding member. 13
In a state where is installed, the plate corresponding to both lateral sides of the linear recessed groove 5a such that the upper surface of the upper contact portion of the heat transfer area expanding member 13 and the upper surface of the plate-shaped base material 4 are flush with each other. Base material 4
Is configured to be lower than the upper surface of the plate-shaped base material 4 in other portions.

In this way, the heat transfer area for transferring the heat radiated from the heat medium flow pipe 6 to the surface plate 7 is increased by the heat transfer area expansion member 13, and the heat medium flow pipe 6
By increasing the amount of heat transmitted to the surface plate 7 out of the amount of heat radiated from the surface plate, the heat radiated from the heat medium flow pipe 6 can be efficiently transferred to the surface plate 7.

[Another Embodiment] (1) In the first embodiment, the projecting portion 11 is formed so as to project inward of the linear concave groove 5a over the entire circumferential direction of the linear concave groove 5a. However, in place of this configuration, as shown in FIG.
It is also possible to configure and implement such that a part of the concave groove 5a in the circumferential direction protrudes inward of the concave groove 5a. FIG. 8 shows the configuration of the protruding portion 11a in the unit panel portion 1. Although not shown, the end panel portions 2 and 3 have the same shape as the shape of the protruding portion 11a in FIG. I do.

Further, as shown in FIGS. 2 and 8, the shape of the protruding portion 11 is not limited to a triangular shape whose width is narrower from the base end to the distal end, but is the same from the base end to the distal end. An air space 8 may be formed between the heat medium flow pipe 6 and the concave groove 5 in a state where the heat medium flow pipe 6 is buried in the concave groove 5 and piped. Any shape may be used.

(2) In the second embodiment, the example in which the heat transfer promoting member S is configured to include the air space forming section 9 and the heat transfer member 12 has been described. It is also possible to implement as a configuration including only the heat transfer member 12.

(3) In the third embodiment, the example in which the heat transfer promoting member S is configured to include only the heat transfer area expanding member 13 has been described. It is also possible to implement as a configuration including the portion 9, the heat transfer member 12, and the heat transfer area expansion member 13. That is,
The configuration of the heat transfer promoting member S in the unit panel portion 1 will be described with reference to FIGS. 9 and 10. The heat transfer member 12 is formed between the heat transfer promoting member S and the linear recess groove 5 a by the air space forming section 9. The heat medium flow pipe 6 is embedded so as to form an air space 8 in the heat transfer member 12 and is in contact with the U-shaped portion 12 a of the heat transfer member 12. In the circumferential direction of the flow pipe 6, the heat transfer area expanding member 13 is provided on the side surface on the opening side of the linear concave groove 5a.
Is configured such that the heat transfer area expanding member 13 is installed so that the lower contact portion 13 in the contact area of FIG.

Therefore, the heat radiated from the heat medium flow pipe 6 to a portion other than the opening side of the linear recessed groove 5 a is dissipated by the heat transfer member 12 and the air space 8 to a portion other than the upper surface of the plate-shaped substrate 4. While preventing heat from being radiated to the portion, heat is transferred to the upper surface of the plate-shaped base material 4 and heat radiated from the heat medium flow pipe 6 is transferred to the surface plate 7 by the heat transfer area expanding member 13. Heat transfer area for the heat medium flow pipe 6
The amount of heat transferred from the heat medium to the surface plate 7 is increased to the maximum, and the heat transferred from the heat medium flow pipe 6 can be efficiently transferred to the surface plate 7.

In the third embodiment, the heat transfer promoting member S is replaced with the structure shown in FIGS.
May be configured to include the air layer space forming portion 9 and the heat transfer area expanding member, or may be configured to include the heat transfer member 12 and the heat transfer area expanding member.

(4) In the first to third embodiments, the curved concave grooves 5b and 5c of the end panel portions 2 and 3 are configured such that four or two heat medium flow tubes 6 are provided. But
Also in the curved concave grooves 5b and 5c of the end panel portions 2 and 3, similarly to the concave groove 5 of the unit panel portion 1, the heat medium flow pipe 6 may be configured so as to pipe one heat pipe. It is possible.

(5) In the first to third embodiments, the floor heating panel is replaced with the unit panel portion 1 and the end panel portions 2, 3
However, the size of the floor heating panel can be changed as appropriate.

(6) In the first to third embodiments, the example in which the heat transfer promoting members S are provided on both the panel portion 1 and the end panel portions 2 and 3 has been described. It is also possible to provide the heat transfer promoting member 1 only on the end portion, or to provide the heat transfer promoting member 1 only on the end panel portions 2 and 3.

[Brief description of the drawings]

FIG. 1 is a plan view of a floor heating panel.

FIG. 2 is an exploded perspective view of the floor heating panel according to the first embodiment.

FIG. 3 is a longitudinal sectional side view of the floor heating panel in the first embodiment.

FIG. 4 is a vertical sectional front view of the floor heating panel in the first embodiment.

FIG. 5 is an exploded perspective view and a mounting perspective view of a floor heating panel according to a second embodiment.

FIG. 6 is a vertical side view and a vertical front view of a floor heating panel according to a second embodiment.

FIG. 7 is an exploded perspective view and a mounting perspective view of a floor heating panel according to a third embodiment.

FIG. 8 is an exploded perspective view of a floor heating panel according to another embodiment.

FIG. 9 is an exploded perspective view and a mounting perspective view of a floor heating panel in another embodiment.

FIG. 10 is a vertical side view and a vertical front view of a floor heating panel according to another embodiment.

FIG. 11 is a perspective view showing how a floor heating panel is mounted in a conventional example.

[Explanation of symbols]

 Reference Signs List 4 plate-shaped base material 5 concave groove 6 heat medium flow pipe 7 surface plate 8 air layer space 9 air layer space forming section 12 heat transfer member 13 heat transfer area expansion member S heat transfer promotion member

Claims (4)

[Claims] 1. A recessed groove for embedding a heat medium flow pipe in a plate-like base material, wherein the heat medium flow pipe is embedded and piped in the groove, and A floor heating panel in which a surface plate for heat equalization is provided on an upper surface of the plate-shaped base material on an opening side, wherein the amount of heat radiated from the heat medium flow pipe is to the upper surface of the plate-shaped base material. A floor heating panel provided with a heat transfer promoting member for increasing the amount of heat transferred. 2. An air space is provided between the heat medium flow pipe and the concave groove in a state in which the heat transfer promoting member is buried in the heat medium flow pipe in the concave groove. The floor heating panel according to claim 1, further comprising: an air space space forming part to be formed. 3. The heat transfer promoting member is disposed between the recessed groove and the heat medium flow pipe, and heat radiated from the heat medium flow pipe to a portion other than the upper surface of the plate-shaped substrate. The floor heating panel according to claim 1 or 2, further comprising a heat transfer member that transfers heat to an upper surface of the plate-shaped base material. 4. The heat transfer promoting member is provided between the heat medium flow pipe and the surface plate, and is in contact with a side surface of the heat medium flow pipe on the opening side of the recessed groove in a circumferential direction of the heat medium flow pipe. The floor heating panel according to any one of claims 1 to 3, further comprising a heat transfer area expanding member that comes into contact with the surface plate in a plane.