JP2002076694A - Component mounting device and component mounting method - Google Patents

Abstract

(57) [Summary] To provide a component mounting apparatus and a component mounting method capable of obtaining accurate mount data for arranging components with high accuracy at a mounting position at the time of component mounting. A component mounting apparatus (20) for mounting components on each land on a substrate (40) on which solder (46) is screen-printed based on mount data of each component (47) on the land of the substrate, A data acquisition unit 21 for acquiring a solder print position, a correction unit 22 for correcting mount data of each component based on the solder print position acquired by the data acquisition unit, and a mounting unit for mounting the component on each land The component mounting apparatus 20 is configured to include a control unit 23 that drives and controls the mounting unit based on the corrected mount data.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus and a component mounting method for mounting components on a substrate on which solder is printed at a predetermined position.

[0002]

2. Description of the Related Art Conventionally, when components are mounted on a substrate such as a printed circuit board or a glass substrate by a component mounting machine, cream solder is applied to a land at a predetermined position of the substrate by screen printing, and then the solder is applied on the substrate. A component is mounted on each land, and then the cream solder is melted by a reflow process to solder the component to each land on the substrate.

[0003] Here, the component mounter has data (mount data) of a mounting position (ie, a land position) of the component on the board as NC data, and at the time of component mounting, two points (for example, diagonal lines) on the board. (Two points provided above)
The mount data is corrected by imaging the alignment mark by an imaging means such as a CCD camera, measuring the position of the alignment mark in the captured image, and calculating the amount of deviation from the design value. .
This is because the substrate itself has an error of, for example, about several tens of μm in the manufacturing process.

The correction of the mount data is performed as shown in FIG. First, FIG. 12A shows a coordinate system based on design values, and the substrate 1 is designed to have, for example, alignment marks 2a and 2b at coordinate positions (0, 0) and (80, 60), respectively. It has. In the board 1, the position (x, y) of the land on which each component is to be mounted is set as mount data.

[0005] As shown in FIG. 12 (B), the component mounter corrects the displacement in the xy direction with respect to the actual substrate 1 with reference to one of the alignment marks 2 a of the substrate 1. As shown, alignment mark 2
The shift in the rotation direction θ is corrected based on the direction (angle α) from a to 2b, and finally, as shown in FIG.
The magnification correction is performed based on the distance from the alignment mark 2a to the alignment mark 2b. Here, this magnification correction is performed, for example, when the actual distance between the alignments is 100.03.
The coordinate position (NC data) of each land is 100.03 / 1
This is done by multiplying by 00.

[0006] In this manner, the component mounter operates the alignment mark 2 on the actual substrate 1 as shown in FIG.
a, 2b are measured, and the deviation (x, y, θ) and magnification between the position coordinate (NC data) D1 of the alignment mark according to the design value and the measured value D2 are calculated, and the correction value D3 of the mount data is calculated. I'm trying to get Thus, each component is mounted on the land on the substrate 1 with high accuracy.

On the other hand, the printing of the cream solder described above is performed by a cream solder printing machine in a process before mounting. At this time, the cream solder printing machine similarly positions the screen with reference to the alignment marks 2a and 2b on the substrate 1, and applies the cream solder through holes provided corresponding to each land of the screen. Performs screen printing of cream solder.

[0008]

As described above, since the printing of the cream solder and the mounting of the components on each land on the substrate described above are performed separately and independently, each land has its own unique design. Has errors. If such an error is within a certain range, during reflow soldering, there is a habit (self-alignment function) that the component is brought closer to the center of the land due to the melting of the cream solder, and the component 4 moves with respect to the land 1a. It will be correctly positioned and soldered.

For example, as shown in FIG. 14, when the solder 3 is printed on the land 1a of the substrate 1 without displacement, the component 4 is mounted on the land 1a with an error 1 = 0 (FIG. 14). (A)), the solder 3 is melted in the reflow step, and the component 4 is soldered to the land 1a without displacement. On the other hand, the component 4 is mounted on the land 1a with a small error l1 (FIG. 14).
(Refer to (B)), and the solder 3 is melted in the reflow process,
Since the component 4 moves so as to face the land 1a by the self-alignment function described above, the component 4 is soldered to the land 1a without displacement. Further, the component 4 has a large error l with respect to the land 1a.
2 (see FIG. 14C), even if the solder 3 melts in the reflow process, the above-described self-alignment function does not work, and the component 4 is soldered in a state where it is displaced to the land 1a. Will be done.

[0010] For example, as shown in FIG.
When the solder 4 is printed on the land 1a with an error L1, if the component 4 is mounted on the land 1a with an error 1 = 0 (see FIG. 15A), the solder 3 is removed in the reflow process. By melting, the component 4 is soldered to the land 1a without displacement. On the other hand, when the component 4 is mounted on the land 1a with a small error 13 (= 11) (see FIG. 15B), the solder 3 is melted in the reflow process, and the solder 3 itself becomes the land 1a. , The part 4 moves to the opposite side to the land 1a,
The component 4 is soldered in a state where it is displaced from the land 1a. This is because the deviation (L1 + l3)> l2 between the solder 3 and the component 4 is larger than the error, and the self-alignment function does not work.

In this way, if the component 4 is soldered in a state shifted from the land 1a, a soldering failure occurs, and the entire board 1 to which each component 4 is soldered becomes defective, so that the yield is reduced. There was a problem that would.

In view of the above, the present invention provides a component mounting apparatus and a component mounting method capable of obtaining accurate mount data for arranging components with high accuracy at a mounting position when mounting components. It is intended to be.

[0013]

Means for Solving the Problems In order to achieve the above object, the present inventors have made intensive studies and have obtained the following findings. That is, since the component should be finally aligned with the land, it is better to align the component with the land of the substrate when mounting the component to be mounted on the substrate. It is thought to be. However, as a result of various studies through the mounting work, it is actually more effective to position and place the parts on the solder printed on the board in the reflow process during mounting, and the self-alignment function described later is more effective It has been found that the components to be mounted can be positioned with respect to the land with higher precision than before in the prior art. Further, in order to position the component with respect to the solder with high accuracy as described above, it is necessary to accurately know the position of the printed solder on the board. Here, the deviation amount of the solder printing position on the substrate from the design value (target value) greatly depends on the deviation amount in the alignment of the screen with the substrate during printing and the processing error of the screen during screen manufacturing. It has been found that the processing error needs to be corrected for the expansion and contraction error of the entire screen. That is, according to the first aspect of the present invention, a component is mounted on a land on a substrate on which solder is screen-printed on a land, based on mount data for the land of the substrate corresponding to the component to be mounted. Acquiring the solder print position, correcting the mount data of the component based on the solder print position, and mounting the component on the land according to the corrected mount data. This is achieved by a component mounting method including:

According to the first aspect of the present invention, at the time of component mounting,
Aiming at solder printed on the land, mount data is corrected and components are mounted. As a result, the individual components are mounted with high precision on the solder printed on the lands, and then, when the solder is melted in the reflow process, the solder is brought closer to the corresponding lands by a self-alignment function. This means that the parts are drawn to the land together with the solder. Therefore, the solder print position is obtained with respect to the conventional component mounting method,
With a simple configuration that simply corrects the mount data based on the solder printing position, the components are positioned with high precision and soldered, and the yield of the board on which the components are mounted is improved. Become.

According to a second aspect of the present invention, in the first aspect, the solder printing position is obtained by actually measuring the solder printing position on the substrate. According to the configuration of claim 2, the actual solder printing position is measured, the mount data is corrected with the actual solder printing position as a target, and the component is mounted. As a result, the individual components are mounted with higher precision on the solder printed on each land.

According to a third aspect of the present invention, in the configuration of the first aspect, the solder printing position is obtained by using screen data used in screen printing of the solder. According to the third aspect of the present invention, the screen data used in the solder printing, that is, the alignment mark provided on the screen is measured instead of the actual solder printing position, so that the solder indicated by the screen data is measured. The mount data is corrected with the print position as the target, and the component is mounted. In this case, once the screen data is measured, the mount data can be corrected without any variation, and the tact time at the time of component mounting does not increase, thereby improving the production efficiency.

According to a fourth aspect of the present invention, in the configuration of the first aspect, the solder printing position is obtained by combining a measurement value obtained by actually measuring a solder printing position on a substrate with screen data used in screen printing of solder. And acquired. According to the configuration of the fourth aspect, the mount data is optimally corrected by combining the actual solder print position and the solder position indicated by the screen data, and appropriately selecting the distribution of the correction values for both mount data. Can be. As a result, the individual components are mounted with high precision on the solder printed on each land, and the yield of the board on which the components are mounted is improved.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the correction of the mount data is performed by combining a solder printing position and a position of an alignment mark on the substrate. And According to the configuration of the fifth aspect, the distribution of the correction value for each mount data is appropriately selected by combining the actual solder printing position, the solder position indicated by the screen data, and the position of the alignment mark on the substrate. Thereby, the mount data can be further optimally corrected. As a result, the individual components are mounted with high precision on the solder printed on each land, and the yield of the board on which the components are mounted is improved.

According to the sixth aspect of the present invention, there is provided a method for mounting a board on which solder is screen-printed on a land on the basis of mount data for the land of the board corresponding to a component to be mounted. A component mounting apparatus for mounting the component, a data acquisition unit that acquires a solder printing position, and a correction unit that corrects the mount data of the component based on the solder printing position acquired by the acquisition unit,
This is achieved by a component mounting apparatus including a mounting unit that mounts a component on the land and a control unit that drives and controls the mounting unit based on the corrected mount data.

According to the sixth aspect of the present invention, the data acquisition unit acquires the solder printing position screen-printed on each land, and the correction unit corrects the mount data with the solder printing position as a target. The part is mounted by the unit. As a result, individual components will be mounted with high precision on the solder printed on each land,
Thereafter, when the solder is melted in the reflow step, the solder comes closer to the corresponding land by the self-alignment function, and the component is drawn to the land together with the solder. Accordingly, the component is positioned with respect to the land with high accuracy and soldered, and the yield of the board on which the component is mounted is improved. Then, with respect to the conventional component mounting apparatus, the data acquisition unit acquires the solder printing position without changing the mechanical structure, and the correction unit corrects the mount data based on the solder printing position. With this configuration, the component is positioned with high precision with respect to the land and soldered.

According to a seventh aspect of the present invention, in the configuration of the sixth aspect, the data acquisition section acquires the solder printing position by actually measuring the solder printing position on the substrate. According to the configuration of claim 7, the data acquisition section measures the actual solder printing position, the correction section corrects the mount data with the actual solder printing position as a target, and the mounting section mounts the component. I do. As a result, the individual components are mounted with higher precision on the solder printed on each land.

According to an eighth aspect of the present invention, in the configuration of the sixth aspect, the data acquiring section acquires the solder printing position using screen data used in screen printing of the solder. According to the configuration of claim 8, the data acquisition unit measures the screen data used in the solder printing, that is, the alignment mark provided on the screen, so that the correction unit indicates the screen data. The mount data is corrected with the solder print position as a target, and the mounting unit mounts the component. In this case, once the screen data is measured, the mount data can be corrected without any variation, and the tact time at the time of component mounting does not increase, thereby improving the production efficiency.

According to a ninth aspect of the present invention, in the configuration of the sixth aspect, the data acquisition unit combines a measured value obtained by actually measuring a solder printing position on the substrate with screen data used in screen printing of the solder. And acquiring a solder printing position. According to the configuration of claim 9, the correction unit combines the actual solder print position acquired by the data acquisition unit and the solder position indicated by the screen data, and appropriately selects the distribution of the correction value for both mount data. This makes it possible to optimally correct the mount data. As a result, the individual components are mounted with high precision on the solder printed on each land, and the yield of the board on which the components are mounted is improved.

According to a tenth aspect of the present invention, in any one of the sixth to ninth aspects, the apparatus further comprises a measuring unit for measuring an alignment mark of the substrate, wherein the correction unit is obtained by a data obtaining unit. The mount data is corrected by combining the solder printing position and the position of the alignment mark of the substrate measured by the measuring unit. According to the configuration of claim 10, the correction unit determines the actual solder printing position acquired by the data acquisition unit and the solder position indicated by the screen data, and the position of the alignment mark of the substrate measured by the measurement unit. By appropriately selecting the distribution of the correction value for each mount data in combination, the mount data can be further optimally corrected. As a result, the individual components are mounted with high precision on the solder printed on each land, and the yield of the board on which the components are mounted is improved.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS.
The embodiment described below is a preferred specific example of the present invention, and thus various technically preferable limitations are added. However, the scope of the present invention particularly limits the present invention in the following description. The embodiment is not limited to these embodiments unless otherwise stated.

FIG. 1 shows the overall configuration of a component mounting system incorporating the first embodiment of the component mounting apparatus according to the present invention. In FIG. 1, the component mounting system 10
A cream solder printing device 11, a component mounting device 20,
And a reflow furnace 30. The cream solder printing apparatus 11 is configured to screen-print cream solder on each land of the substrate 40 to be supplied. The component mounting apparatus 20 includes the cream solder printing apparatus 1
At 1, components are mounted on each land of the substrate 40 on which cream solder is printed on each land. The reflow furnace 30 is configured to heat the substrate 40 on which each component is mounted by the component mounting apparatus 20 to melt the cream solder and solder each component to a corresponding land.

More specifically, as shown in FIG. 2, the component mounting apparatus 20 includes a data acquisition unit 21, a correction unit 22, a mounting unit 23, and a control unit 24 for controlling the driving of the mounting unit 23. The control unit 24 has mount data of each component to be mounted on the board 13 as NC data.

The data acquisition section 21 acquires a cream solder printing position on the substrate 40 in the cream solder printing apparatus 11 which is a pre-process. here,
The printing of the cream solder is performed using, for example, the screen 12 shown in FIG. The screen 12 has a frame-shaped frame 13 and a pattern stainless steel plate 14 provided in the frame 13. The stainless steel plate for pattern 14 has a thickness of, for example, about 0.1 mm, and as shown in FIG. 3B, a through hole (not shown) provided at a position corresponding to each land of the substrate 40. And alignment marks 15 and 16 formed of concave portions provided at substantially diagonal positions of the peripheral edge, and reference position solder printing holes 17 and 18 provided adjacent to the alignment marks 15 and 16 respectively. ing. The alignment marks 15 and 16 do not penetrate the pattern stainless steel plate 14 as shown in FIG. 3C, and the reference position solder printing holes 17 and 18 are formed as shown in FIG. 3D. , Penetrating the pattern stainless steel plate 14.

On the other hand, as shown in FIG. 4, the substrate 40 has alignment marks 41 and 42 provided at substantially diagonal positions on the peripheral edge thereof, for example, at the same time as the lands and a conductive pattern. This allows
In the cream solder printing process by the cream solder printing device 11, the screen 12 is placed on the substrate 40 with the alignment marks 15 and 16 aligned with the alignment marks 41 and 42 of the substrate 40, and the entire surface of the screen 12 is coated with cream solder. And apply cream solder printing. Thus, the reference position solder 4 is provided on the substrate 40 adjacent to the alignment marks 41 and 42.
3, 44 will be printed.

Here, the data acquisition section 21 captures the position data of the screen 12 with respect to the substrate 40 in the cream solder printing apparatus 11, that is, the alignment marks 15 and 16 of the screen 12 by an imaging means such as a CCD camera or a microscope. Then, the position data (screen data) D11 is measured and taken in advance, so that the data is represented as a solder printing position.

As shown in FIG. 5, the correction unit 22 includes a solder printing position D11 acquired by the data acquisition unit 21.
The amount of displacement (x, y, θ direction and magnification) between the position of the alignment marks 41 and 42 on the substrate 40 as a design value based on the mount data (NC data) D10 held by the control unit 24 based on The actual mount data D12 is obtained by calculating and correcting the mount data. Here, the data acquisition unit 21
The reference position solders 43 and 44 are imaged by, for example, a CCD camera, and the reference position solder
3 and 44, the alignment marks 15 and 16 on the screen 12 and the reference position solder printing hole 1 are measured.
The solder printing position D11 with respect to the substrate 40 may be calculated and acquired from the distances from the positions 7 and 18.

The mounting section 23 has the same configuration as the mounting section in the conventional component mounting apparatus. For example, a component supplied from a component supply section is sucked and held by a component suction head.
The substrate is sequentially transported to a predetermined position on a substrate supported on a support table, and components are mounted. At this time, the mounting unit 23
Is controlled by the control unit 24 to convey a component sucked and held by the component suction head to a mounting position on the substrate 40 determined by mount data set in advance. .

The component mounting apparatus 10 according to the present embodiment is configured as described above. The components are mounted according to one embodiment of the component mounting method according to the present invention in accordance with the flowchart of FIG. It is done in. First, in step ST1, as a pre-process, the substrate 40 is put into the cream solder printing apparatus 11, and solder is screen-printed on each land of the substrate 40. Next, in step ST2, the data acquisition unit 21 determines the position of the screen 12 at the time of screen printing in the cream solder printing apparatus 11, that is, the position data (screen data) D11 of the alignment marks 15 and 16 of the screen 12.
Is obtained as the solder printing position.

Subsequently, in step ST3, the correction section 22
Corrects the position data of each land as a design value based on the mount data (NC data) D10 held by the control unit 24 based on the solder printing position D11 acquired by the data acquisition unit 21. Then, in step ST4, the mounting unit 23 controls the control unit 24 in accordance with the mount data D12 corrected by the correction unit 22, thereby mounting components on each land on the board 40. Finally, in step ST5, as a post-process, the substrate 40 is accommodated in the reflow furnace 30, the solder printed on each land is melted, and then cooled, so that each component is placed on the corresponding land. Soldered. Thus, the board 45 on which the components are mounted (see FIG. 1)
Is completed.

As described above, according to the component mounting apparatus 20 of the present embodiment, when mounting components on each land of the board, each component is not a corresponding land of the board,
The solder printed on the land is placed as a target.

At this time, for example, as shown in FIG.
If the component 47 is mounted on the land 40a with an error 1 = 0 when the solder 46 is printed on the land 40a with the error L1, the solder 46 is printed in the reflow process.
Is melted, and the solder 46 itself approaches the land 40a, so that the component 47
The component 47 is also drawn to the land 40a together with the solder 46, so that the component 47 is soldered to the land 40a without displacement. On the other hand, as shown in FIG. 8, when the component 47 is mounted in the reverse direction with respect to the solder 46 with a small error 13, the solder 46 is reflowed.
Is melted, and also in this case, the solder 46 itself becomes the land 40a.
As a result, the component 47 is attracted to the land 40a together with the solder 46, so that the component 47 is soldered to the land 1a without displacement. This is because the deviation between the solder 46 and the component 47 is as small as 13 and the self-alignment function operates. That is, since the component 47 is placed with solder as a target, the error l3 is only for the solder position and is small. In particular, when the solder position data D11 is actually measured, the error 13 becomes smaller, and components can be mounted with high accuracy.

Accordingly, the component mounting apparatus 2 according to the present embodiment
According to the method and the component mounting method, the individual components are mounted on the solder printed on each land with high precision, and when the solder is melted in the reflow process, the solder has a self-alignment function. As a result, the part comes closer to the corresponding land, and the parts are drawn to the land together with the solder. Therefore, in comparison with the conventional component mounting method, the component is positioned with respect to the land with high accuracy by a simple configuration in which the solder printing position is acquired and the mount data is corrected by the solder printing position. As a result, the yield of the board on which the components are mounted is improved. In this case, since the solder printing position is obtained by using the screen data in the previous solder printing process, it is not necessary to obtain the solder printing position for each substrate, so that the tact time is shortened and the production efficiency is reduced. Will be improved.

FIG. 9 shows correction of mount data by the correction unit 22 in the second embodiment of the component mounting method according to the present invention. In this embodiment, the other configuration is the same as that of the first embodiment shown in FIGS. 2 to 4, and the description of the configuration and operation will be omitted. In this case, based on the solder print position D11 as the screen data acquired by the data acquisition unit 21, the correction unit 22 uses the mount data (N
C data) The position data of each land as a design value based on D10 is corrected, the alignment marks 41 and 42 of the substrate 40 are measured for each substrate, and the mount data is corrected with reference to the substrate alignment mark data D13. The value D14 is obtained.

According to such a configuration, since the position of the substrate 40 fixed and held by the mounting section 23 is determined for each board 40, it is possible to eliminate the variation in the fixed holding position of the substrate 40 in the mounting section 23. it can. Therefore, each substrate 4
At every 0, the component is positioned with higher precision with respect to the land and soldered, and the yield of the board on which the component is mounted is improved. Since the measurement of the alignment marks 41 and 42 of the substrate 40 is also performed in a conventional component mounting apparatus, the component mounting apparatus 20 can be used without any special modification.

FIG. 10 shows the correction of mount data by the correction unit 22 in the third embodiment of the component mounting method according to the present invention. In this embodiment, the other configuration is the same as that of the first embodiment shown in FIGS. 2 to 4, and the description of the configuration and operation will be omitted.
In this case, the correction unit 22 determines, based on the actual measurement solder printing position D15 for each board acquired by the data acquisition unit 21,
Mount data (NC data) held by the control unit 24
The position data of each land as a design value by D10 is corrected, the alignment marks 41 and 42 of the substrate 40 are measured for each substrate, and the correction value D16 of the mount data is referred to by referring to the substrate alignment mark data D13.
I'm trying to get

According to such a configuration, for each substrate 40, the reference position solder 43, 44 screen-printed on the substrate 40 at the time of solder printing is measured, and the substrate fixed and held by the mounting portion 23 I ’ll figure out 40 positions,
Variations in the fixed holding position of the substrate 40 in the mounting section 23 can be eliminated. Therefore, for each board 40, the component is positioned with higher precision with respect to the land and soldered, and the yield of the board on which the component is mounted is improved. Since the measurement of the alignment marks 41 and 42 of the substrate 40 is also performed in the conventional component mounting apparatus,
0 can be used as it is without particular modification, and the reference position solders 43 and 44 can be measured.

FIG. 11 shows the correction of mount data by the correction unit 22 in the component mounting method according to the fourth embodiment of the present invention. In this embodiment, the other configuration is the same as that of the first embodiment shown in FIGS. 2 to 4, and the description of the configuration and operation will be omitted.
In this case, the correction unit 22 includes the solder printing position D1 as the screen data acquired by the data acquisition unit 21.
1. The actual solder printing position D15 for each board, and the alignment marks 41, 4 of the board 40 measured for each board.
2 position data, ie, substrate alignment mark data D1
3, a correction value D17 of the position data as a design value based on the mount data (NC data) held by the control unit 24 is obtained.

According to such a configuration, since the position of the substrate 40 fixed and held by the mounting section 23 is determined for each board 40, it is possible to eliminate variations in the fixed holding position of the substrate 40 in the mounting section 23. it can. Therefore, each substrate 4
At every 0, the component is positioned with higher precision with respect to the land and soldered, and the yield of the board on which the component is mounted is improved. Since the measurement of the alignment marks 41 and 42 of the substrate 40 is also performed in a conventional component mounting apparatus, the component mounting apparatus 20 can be used as it is without any special modification, and can be used as a reference. Measurement of the position solders 43 and 44 can also be performed.

In the above-described embodiment, the screen data and / or the measured solder printing position are used as the solder printing position, and the position data of the alignment mark of the substrate is additionally referred to when correcting the mount data. However, the present invention is not limited to this, and an arbitrary combination of these is also possible, for example, when the mount data is corrected using the actually measured reference position solders 43 and 44 as the solder printing positions. Here, the combination of the data at the time of the mount data correction is performed, for example, by appropriately allocating the correction value based on each data. For example, when the screen data and the actually measured solder printing position are combined, the correction value based on these data is used. The mount data may be corrected 1: 1 based on the average value of, or for example, 1:
The correction may be made with a weighted average value such as 2, 2: 1 or the like, approaching the screen data side or the measured solder printing position side.

[0045]

As described above, according to the present invention, at the time of component mounting, a component mounting apparatus and a component mounting device capable of obtaining accurate mount data for arranging components with high precision at a mounting position. A method can be provided.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an overall configuration of a component mounting system using a component mounting apparatus according to the present invention.

FIG. 2 is a block diagram showing a first embodiment of the component mounting apparatus according to the present invention.

3A is a perspective view of a screen used in a cream solder printing apparatus in the component mounting system of FIG. 1, FIG.
(B) is a plan view, (C) is a sectional view of an alignment mark, and (D) is a sectional view of a reference position solder printing hole.

FIG. 4 is a plan view of a board on which components are to be mounted by the component mounting system of FIG. 1;

FIG. 5 is a schematic diagram illustrating an operation of a correction unit in the component mounting apparatus of FIG. 2;

FIG. 6 is a flowchart showing a component mounting operation in the component mounting system of FIG. 1;

FIG. 7 is a partially enlarged cross-sectional view showing a component mounting state when the component mounting apparatus of FIG. 2 has no component displacement with respect to solder.

FIG. 8 is a partially enlarged cross-sectional view showing a component mounting state when a component is displaced from solder by the component mounting apparatus of FIG. 2;

FIG. 9 is a schematic diagram showing an operation of a correction unit in the second embodiment of the component mounting apparatus according to the present invention.

FIG. 10 is a schematic diagram illustrating an operation of a correction unit in the third embodiment of the component mounting apparatus according to the present invention.

FIG. 11 is a schematic diagram illustrating an operation of a correction unit in a fourth embodiment of the component mounting apparatus according to the present invention.

FIG. 12 is a schematic diagram sequentially showing an example of a method of correcting mount data in a conventional component mounting apparatus.

FIG. 13 is a schematic diagram showing correction of mount data in a conventional component mounting apparatus.

FIG. 14 is a partially enlarged cross-sectional view showing a component mounting state when the solder by the conventional component mounting apparatus has no displacement with respect to a land.

FIG. 15 is a partially enlarged cross-sectional view showing a component mounting state when a solder by a conventional component mounting apparatus is displaced from a land.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Component mounting system, 11 ... Cream solder printing apparatus, 12 ... Screen, 15, 16 ...
Screen alignment mark, 17, 18 ... Reference position solder printing hole, 20 ... Component mounting device, 21
.. a data acquisition unit, 22 correction unit, 23 mounting unit, 24 control unit, 30 reflow furnace, 40
..Substrate, 40a land, 41, 42 alignment mark 43, 44 reference position solder, 45
... Completed board, 46 ... Solder, 47 ... Parts

Claims (10)

[Claims] 1. A solder printing position is obtained when mounting a component on a land on a board on which solder is screen-printed on a land, based on mount data for the land of the board corresponding to the component to be mounted. And correcting the mount data of the component based on the solder printing position; and mounting the component on the land according to the corrected mount data.
Component mounting method. 2. The component mounting method according to claim 1, wherein the solder printing position is obtained by actually measuring a solder printing position on a substrate. 3. The component mounting method according to claim 1, wherein the solder printing position is obtained by using screen data used in screen printing of the solder. 4. The method according to claim 1, wherein the solder printing position is obtained by combining a measurement value obtained by actually measuring a solder printing position on a substrate with screen data used in screen printing of the solder. The component mounting method according to claim 1. 5. The method according to claim 1, wherein the correction of the mount data is performed by combining a solder printing position and a position of an alignment mark on a substrate.
The component mounting method according to any one of the above. 6. A component mounting apparatus for mounting components on lands based on mount data for lands on a substrate corresponding to components to be mounted, on a substrate on which solder is screen-printed on lands. A data acquisition unit for acquiring the position, a correction unit for correcting the mount data of the component based on the solder printing position acquired by the acquisition unit, and a mounting unit for mounting the component on the land. A component mounting apparatus, comprising: a control unit that drives and controls a mounting unit based on mount data. 7. The component mounting apparatus according to claim 6, wherein the data acquisition unit acquires the solder printing position by actually measuring the solder printing position on the board. 8. The component mounting apparatus according to claim 6, wherein the data acquisition unit acquires a solder printing position using screen data used in screen printing of the solder. 9. The method according to claim 9, wherein the data acquisition unit acquires the solder printing position by combining a measurement value obtained by actually measuring a solder printing position on the substrate with screen data used for screen printing of the solder. The component mounting apparatus according to claim 6, wherein: 10. A measurement unit for measuring an alignment mark of a substrate, wherein the correction unit determines a solder printing position acquired by the data acquisition unit and a position of the alignment mark of the substrate measured by the measurement unit. 10. The component mounting apparatus according to claim 6, wherein the mount data is corrected in combination.