JP2002076028A - Fixture for transferring substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fixture for transferring substrate which can firmly hold a piece of substrate used for BGA, etc., with excellent positional accuracy. SOLUTION: The fixture consists of a rectangular opening 6 formed on a frame portion 5 and a substrate-supporting bar 7 which is formed on two sides adjoining each other on the opening portion 6 and supports the side of the substrate 2 elastically. The substrate-supporting bar 7 includes a connecting portion 8 connected with the frame portion 5, an arm portion 9 which is connected with the connecting portion 8 and extends along the surface forming the connecting portion 8, and a plural of abutting-substrate portions 10 which are connected with the arm portion 9 and abut against the side of the substrate 2, and the substrate 2 is fitted into the inside of the opening portion 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for transferring a substrate, and more particularly to a jig for transferring a plurality of substrates singulated from a substrate material and applied to the assembly of a semiconductor device. It is.

[0002]

2. Description of the Related Art A substrate used in a semiconductor device such as a BGA (Ball Grid Array) is formed by cutting a thin plate made of an insulating material such as a glass epoxy resin into a desired outer diameter. However, since such a substrate generally has a small outer diameter, it is difficult to handle such a substrate during a manufacturing process.
For this reason, conventionally, as shown in FIG. 6, a substrate material is cut into a strip frame 1 shape so as to include a plurality of board units. After performing assembly work such as mounting of a semiconductor chip and sealing with a resin for each of the two, the above-described method of separating each of the substrate units is adopted.

However, according to this method, the portion of the strip frame 1 other than the portion serving as the substrate 2 (the portion shown by the dotted line in the figure) is discarded. Due to the necessity of formation, etc., the area of the discarded portion becomes relatively large as a result, and not only is this material wasted, but also there is an environmental problem of generation of waste. Further, when an expensive material such as a multilayer material is used as the substrate material, there is a problem that the cost of the semiconductor device is increased. Also, even when some defective units are mixed in the same frame, as long as there is a non-defective product, assembling work of all units is performed.
This has been a waste of man-hours, which has been a factor in hindering the cost reduction of semiconductor devices.

To solve the above problem, as shown in FIG. 5, a plurality of recesses 3 corresponding to the outer diameter of the substrate 2 are provided.
In a state in which the individual substrates 2 singulated from the substrate material are placed in the recesses 3 of the substrate transport jig 4 provided with the substrate, the mounting of the semiconductor chip and the resin sealing for each substrate 2 are performed. A method of performing assembly work was adopted. According to this method, waste of materials can be prevented, and assembling work can be performed only on non-defective products. Therefore, there is an advantage that the yield in the semiconductor device manufacturing process can be improved and the cost can be reduced. Further, since such a jig is usually formed of a metal such as SUS, there is an advantage that it can be used repeatedly.

[0005]

However, according to this method, since the substrate 2 is merely placed in the recess 3, the substrate 2 may jump out of the recess 3 due to, for example, vibration during transportation. Was. The recess 3 is provided on the substrate 2
Is placed slightly larger than the outer diameter of the substrate 2 due to the nature of the substrate 2, and therefore, when the substrate 2 is placed, there is a slight gap between the outer diameter end surface of the substrate 2 and the inner wall of the concave portion 3. This makes it difficult to accurately position the substrate 2, and this has been an obstacle that cannot be ignored in assembling a semiconductor device that requires an accuracy on the order of several microns. Further, when external connection terminals such as solder balls are formed on the back surface of the semiconductor chip mounting surface of the substrate 2, the back surface of the semiconductor chip mounting surface of the substrate 2 is in contact with the bottom surface of the concave portion 3 and is not exposed. In the above-described external connection terminal forming step, each substrate 2 is removed from the substrate transport jig 4,
This has to be done individually or by using another jig, which is inconvenient.

[0006]

In order to solve the above-mentioned problems, the present invention provides a substrate transport jig having a rectangular opening corresponding to the outer diameter of each substrate. By providing a substrate support bar that elastically supports only the side surface of the substrate, the substrate can be firmly and accurately mounted on the substrate transfer jig.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A substrate transfer jig according to the present invention comprises a frame, a rectangular opening formed in the frame, and substrate support bars formed on two sides adjacent to the opening. The substrate support bar is connected to a frame, a connecting portion connected to the frame, an arm extending along a side of the opening where the connecting portion is formed, and an arm connected to the arm. And has a substrate contact portion that contacts one side of the substrate.

[0008] According to the jig for transporting a substrate having the above-described structure, the side surface of the substrate is supported in the opening of the jig for transporting the substrate by the substrate support bars formed on two sides adjacent to the opening. In addition, the substrate support bar is pressed against the side opposite to the side on which the substrate support bar is formed by the elastic force of the substrate support bar, so that the substrate can be held elastically and firmly, and the substrate can be easily attached to and detached from the jig. It is. Further, since the end face of the side of the opening opposite to the side on which the substrate support bar is formed can be used as a reference plane for positioning the substrate, the positioning accuracy of the substrate is greatly improved. Furthermore, since only the side surface of the substrate is supported by the jig and both the upper surface and the lower surface are exposed, not only the mounting of the semiconductor chip and resin sealing, but also the formation of external connection terminals such as solder balls on the back surface of the substrate. , The same jig can be used consistently in all steps of semiconductor device assembly.

[0009]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. The same parts as those in the related art will be described using the same reference numerals. FIG. 1 is a perspective view showing a substrate carrying jig of the present invention. As shown in FIG. 1, the substrate transport jig 4 a includes a frame portion 5 made of a known metal such as a SUS material, and a frame portion 5 formed on the frame portion 5.
A substrate support bar 7 is formed on two sides 11 a and 11 b adjacent to the opening 6. Substrate support bar 7
A connecting portion 8 connected to the frame portion 5; an arm portion 9 connected to the connecting portion 8 and extending along a side of the opening 6 where the connecting portion 8 is formed; Is connected to
It has a plurality of substrate contact portions 10 that contact the side surface of one side of the substrate 2.

[0010] Such a substrate transport jig 4a is shown in FIG.
As shown in (a), usually, a frame portion 5 is formed in a strip shape so that a plurality of substrates 2 can be mounted, and a plurality of openings 6 are formed. Each of the openings 6 is provided with the above-described substrate support bar 7 on two adjacent sides.
In this embodiment, a predetermined number of individual pieces of the substrate 2 having an outer diameter of 18 mm × 18 mm are formed in advance by cutting a thin substrate material made of an insulating material such as a glass epoxy resin or a polyimide resin. As described above, each substrate 2 is mounted in the opening 6 of the substrate transfer jig 4a. FIG. 2B is a diagram showing a state in which each substrate 2 is mounted on the substrate transport jig 4a. In this embodiment, the thickness of the substrate transfer jig 4a and the thickness of the substrate 2 are set to be substantially the same.

Here, the function of each part of the substrate transport jig 4a when mounting the substrate 2 will be described. To mount the substrate 2, first, the substrate 2 is placed in the opening 6 of the substrate transport jig 4a. Push in. Then, since the arm 9 of the substrate support bar 7 is only supported by the connecting portion 8, the side 11 of the opening 6
The substrate 2 is received after being elastically deformed in the directions a and 11b. Then, a restoring force is generated in the substrate support bar 7 and the opening 6
The substrate support bar 7 formed on the side 11a of the
The substrate support bar 7 formed in the direction 1c and on the side 11b
Presses the substrate 2 in the direction of the opposite side 11d. As a result, the substrate 2 fits into the opening 6, and two adjacent side surfaces of the substrate 2 are supported by the substrate contacting portion 10 of the substrate support bar 7, and the other side surfaces are opposed to the side 11 c. 11
d is pressed against the end face. Thus, the substrate support bar 7
The substrate 2 is firmly and easily attached to and detached from the opening 6 by the elastic force described above. Also, sides 11c and 11d of the opening 6
Of the substrate 2 serves as a reference plane when the substrate 2 is aligned, so that the positional accuracy of the substrate 2 is also good. Furthermore,
Since the upper surface and the lower surface of the substrate 2 in the mounted state are both exposed, for example, a semiconductor chip is mounted on one surface, and then external connection terminals such as solder balls are formed on the back surface side of the semiconductor chip mounting surface. Even in this case, the substrate transfer jig 4a of the present invention can be applied to all steps.

Here, the substrate transfer jig 4a according to the present invention.
Other notable effects of are described. Semiconductor devices
Depending on the specifications, there are various types of chip sizes, and naturally, the outer diameter of the substrate 2 used therein also varies. As described above, in this embodiment, the outer diameter is 18 mm.
The jig 4a for transporting the substrate is designed according to the substrate 2 of × 18 mm. At this time, as shown in FIG. 3A, the substrate contact portion 10 of the substrate support bar 7 is formed slightly longer. In other words, as shown in FIG. 3B, the substrate transport jig 4a is slightly larger than the substrate 2 having an outer diameter of 18 mm × 18 mm indicated by a dotted line in the figure, for example, 22 mm × 22.
In order to apply it to the substrate 2a of
It can be applied only by cutting and removing a portion of the substrate contact portion 10 indicated by a dotted line in the figure by a predetermined size. As described above, according to the substrate transfer jig 4a of the present invention, it is possible to easily cope with a case where the outer diameter of the substrate is different, so that there is an effect that the versatility is extremely high.

In the present embodiment, the substrate contact portion 10 is connected to the end of the arm portion 9, but is not limited to this, and can be formed at any portion of the arm portion 9. Further, two substrate contact portions 10 are formed on each substrate support bar 7, but may be one, or three or four or more. However, when supporting the substrate 2, if only one substrate contact portion 10 is used, the supporting force of the substrate 2 is slightly weakened. Therefore, the side surface of one side of the substrate 2 is supported by two or more substrate contact portions 10. It is desirable to be done. Further, the tip of the substrate contact portion 10 is formed in a rectangular shape,
Alternatively, a point contact may be made with the side surface of the substrate 2 by forming a wedge shape.

Further, the number and shape of the connecting portions 8 and the arm portions 9 are not limited to those of the present embodiment, and the
The elastic force can be changed as long as the condition that the elastic force of the substrate 2 can be maintained and the substrate 2 can be sufficiently held is satisfied. As another example, another embodiment will be described below.

[0015]

Embodiment 2 FIG. 4 is a view showing a second embodiment of the present invention. As shown in the figure, in the present embodiment, the substrate carrying jig 4b is composed of a frame portion 5a and a rectangular opening 6a formed in the frame portion 5a for mounting the substrate 2, A connecting portion 8a connected to the frame portion 5a and a connecting portion 8a connected to the adjacent two sides of the opening 6a are provided to extend along the sides of the opening 6a where the connecting portion 8a is formed. A pair of substrate support bars 7a each including an arm portion 9a and a substrate contact portion 10a that is provided at an end of the arm portion 9a and that contacts a side surface of one side of the substrate 2 is formed on each side. The substrate support bar 7a of the present embodiment divides the substrate support bar 7 of the above-described embodiment as shown in FIG.
Since the connecting portion 8a and the arm portion 9a are formed independently, the amount of deformation of each substrate support bar 7a becomes larger than before, and the elastic force further increases.

[0016]

The present invention is embodied in the form described above and has the following effects.

According to the present invention, the substrate is provided in the opening of the substrate transfer jig by the substrate supporting bars formed on two sides adjacent to the opening, respectively. Since the opposing sides are pressed by the elastic force of the substrate support bar, the substrate can be firmly held and can be easily attached to and detached from the jig.

Further, since the end face of the side of the opening opposite to the side on which the substrate support bar is formed can be used as a reference plane for positioning, the positioning accuracy of the substrate is greatly improved. Further, according to the substrate transfer jig of the present invention, since only the side surface of the substrate is supported by the jig and both the upper surface and the lower surface are exposed, the same jig is consistently used in all steps of semiconductor device assembly. Can be used.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a plan view showing an embodiment of the present invention.

FIG. 3 is a plan view showing another embodiment of the present invention.

FIG. 4 is a plan view showing another embodiment of the present invention.

FIG. 5 is a perspective view showing a conventional example.

FIG. 6 is a plan view showing a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 strip frame 2, 2 a substrate 3 recess 4, 4 a, 4 b substrate transfer jig 5, 5 a frame portion 6, 6 a opening 7, 7 a substrate support bar 8, 8 a coupling portion 9, 9 a arm portion 10, 10 a substrate contact Contact portions 11a, 11b, 11c, 11d Each side of the opening 6

Claims (1)

[Claims] 1. A frame part, a rectangular opening formed in the frame part, and substrate support bars formed on two sides adjacent to the opening, respectively, wherein the substrate support bar comprises:
A connecting portion connected to the frame portion, an arm portion connected to the connecting portion and extending along a side where the connecting portion of the opening is formed, and an arm portion connected to the arm portion and connected to one side of the substrate. A jig for transporting a substrate, comprising: a substrate abutting portion that abuts.