JP2002069409A - Removable adhesive composition - Google Patents
Removable adhesive compositionInfo
- Publication number
- JP2002069409A JP2002069409A JP2000265035A JP2000265035A JP2002069409A JP 2002069409 A JP2002069409 A JP 2002069409A JP 2000265035 A JP2000265035 A JP 2000265035A JP 2000265035 A JP2000265035 A JP 2000265035A JP 2002069409 A JP2002069409 A JP 2002069409A
- Authority
- JP
- Japan
- Prior art keywords
- sensitive adhesive
- group
- pressure
- parts
- ethylenically unsaturated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 45
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 45
- 239000000203 mixture Substances 0.000 title claims abstract description 43
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 103
- 125000002339 acetoacetyl group Chemical group O=C([*])C([H])([H])C(=O)C([H])([H])[H] 0.000 claims abstract description 49
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000003999 initiator Substances 0.000 claims abstract description 14
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 12
- 238000005260 corrosion Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- 239000000178 monomer Substances 0.000 description 53
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 48
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 48
- 125000000524 functional group Chemical group 0.000 description 42
- -1 urethane acrylate compound Chemical class 0.000 description 28
- 229920000058 polyacrylate Polymers 0.000 description 25
- 229920005989 resin Polymers 0.000 description 24
- 239000011347 resin Substances 0.000 description 24
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 20
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 20
- 150000001875 compounds Chemical class 0.000 description 18
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 17
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000010992 reflux Methods 0.000 description 10
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 8
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 7
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 7
- 238000011109 contamination Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000003505 polymerization initiator Substances 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 6
- WASQWSOJHCZDFK-UHFFFAOYSA-N diketene Chemical compound C=C1CC(=O)O1 WASQWSOJHCZDFK-UHFFFAOYSA-N 0.000 description 6
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 6
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- LKVFCSWBKOVHAH-UHFFFAOYSA-N 4-Ethoxyphenol Chemical compound CCOC1=CC=C(O)C=C1 LKVFCSWBKOVHAH-UHFFFAOYSA-N 0.000 description 5
- 125000003368 amide group Chemical group 0.000 description 5
- 125000003277 amino group Chemical group 0.000 description 5
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 4
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000003522 acrylic cement Substances 0.000 description 4
- 238000005809 transesterification reaction Methods 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229920006243 acrylic copolymer Polymers 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- POTYORUTRLSAGZ-UHFFFAOYSA-N (3-chloro-2-hydroxypropyl) prop-2-enoate Chemical compound ClCC(O)COC(=O)C=C POTYORUTRLSAGZ-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- FFBZKUHRIXKOSY-UHFFFAOYSA-N aziridine-1-carboxamide Chemical compound NC(=O)N1CC1 FFBZKUHRIXKOSY-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- WCRDXYSYPCEIAK-UHFFFAOYSA-N dibutylstannane Chemical compound CCCC[SnH2]CCCC WCRDXYSYPCEIAK-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000009972 noncorrosive effect Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- DDKMFQGAZVMXQV-UHFFFAOYSA-N (3-chloro-2-hydroxypropyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)CCl DDKMFQGAZVMXQV-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- BWZAUXRKSMJLMH-UHFFFAOYSA-N 1,1-diethoxyethylbenzene Chemical compound CCOC(C)(OCC)C1=CC=CC=C1 BWZAUXRKSMJLMH-UHFFFAOYSA-N 0.000 description 1
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 description 1
- UYEDESPZQLZMCL-UHFFFAOYSA-N 1,2-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(C)C(C)=CC=C3SC2=C1 UYEDESPZQLZMCL-UHFFFAOYSA-N 0.000 description 1
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- FWWWRCRHNMOYQY-UHFFFAOYSA-N 1,5-diisocyanato-2,4-dimethylbenzene Chemical compound CC1=CC(C)=C(N=C=O)C=C1N=C=O FWWWRCRHNMOYQY-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- YNSNJGRCQCDRDM-UHFFFAOYSA-N 1-chlorothioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl YNSNJGRCQCDRDM-UHFFFAOYSA-N 0.000 description 1
- CTOHEPRICOKHIV-UHFFFAOYSA-N 1-dodecylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CCCCCCCCCCCC CTOHEPRICOKHIV-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- YHYCMHWTYHPIQS-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-methoxyethanol Chemical compound COC(O)COCCO YHYCMHWTYHPIQS-UHFFFAOYSA-N 0.000 description 1
- RWXMAAYKJDQVTF-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl prop-2-enoate Chemical compound OCCOCCOC(=O)C=C RWXMAAYKJDQVTF-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- MTLWTRLYHAQCAM-UHFFFAOYSA-N 2-[(1-cyano-2-methylpropyl)diazenyl]-3-methylbutanenitrile Chemical compound CC(C)C(C#N)N=NC(C#N)C(C)C MTLWTRLYHAQCAM-UHFFFAOYSA-N 0.000 description 1
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- WVRHNZGZWMKMNE-UHFFFAOYSA-N 2-hydroxy-1-[2-(2-methylpropyl)phenyl]-2-phenylethanone Chemical compound CC(C)CC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 WVRHNZGZWMKMNE-UHFFFAOYSA-N 0.000 description 1
- NACPTFCBIGBTSJ-UHFFFAOYSA-N 2-hydroxy-2-phenyl-1-(2-propan-2-ylphenyl)ethanone Chemical compound CC(C)C1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 NACPTFCBIGBTSJ-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- XEEYSDHEOQHCDA-UHFFFAOYSA-N 2-methylprop-2-ene-1-sulfonic acid Chemical compound CC(=C)CS(O)(=O)=O XEEYSDHEOQHCDA-UHFFFAOYSA-N 0.000 description 1
- FKOZPUORKCHONH-UHFFFAOYSA-N 2-methylpropane-1-sulfonic acid Chemical compound CC(C)CS(O)(=O)=O FKOZPUORKCHONH-UHFFFAOYSA-N 0.000 description 1
- BNCADMBVWNPPIZ-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n,6-n-hexakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCN(COC)C1=NC(N(COC)COC)=NC(N(COC)COC)=N1 BNCADMBVWNPPIZ-UHFFFAOYSA-N 0.000 description 1
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
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- 239000004342 Benzoyl peroxide Substances 0.000 description 1
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- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
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- FAOSYNUKPVJLNZ-UHFFFAOYSA-N butylstannane Chemical compound CCCC[SnH3] FAOSYNUKPVJLNZ-UHFFFAOYSA-N 0.000 description 1
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- 239000001639 calcium acetate Substances 0.000 description 1
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- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
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- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
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- 125000004122 cyclic group Chemical group 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- AFSIMBWBBOJPJG-UHFFFAOYSA-N ethenyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC=C AFSIMBWBBOJPJG-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- JGEMYUOFGVHXKV-OWOJBTEDSA-N fumaraldehyde Chemical compound O=C\C=C\C=O JGEMYUOFGVHXKV-OWOJBTEDSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
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- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
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- 239000011777 magnesium Substances 0.000 description 1
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- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229940118019 malondialdehyde Drugs 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 150000005309 metal halides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
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- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
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- 239000005011 phenolic resin Substances 0.000 description 1
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Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
(57)【要約】
【課題】 初期粘着力、耐久性、再剥離性に優れ、更に
剥離後の耐汚染性、非腐食性に優れた再剥離型粘着剤組
成物を提供すること。
【解決手段】 エチレン性不飽和基及びアセトアセチル
基を含有するアクリル系粘着剤(A)、光重合開始剤
(B)及び架橋剤(C)を含有してなることを特徴とす
る再剥離型粘着剤組成物。(57) [Problem] To provide a re-peelable pressure-sensitive adhesive composition which is excellent in initial adhesive strength, durability and removability, and further excellent in stain resistance and non-corrosion after peeling. SOLUTION: A re-peelable type comprising an acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group, a photopolymerization initiator (B) and a crosslinking agent (C). Adhesive composition.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、金属板、ガラス
板、プラスチック板等の運搬、加工、切断等の際の傷防
止や汚染防止等のための一時的な表面保護用或いは仮接
着用の粘着シートの粘着剤として用いられる再剥離型粘
着剤組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for temporarily protecting a surface of a metal plate, a glass plate, a plastic plate, or the like during transportation, processing, cutting, etc., for preventing scratches and contamination, or for temporarily bonding. The present invention relates to a removable pressure-sensitive adhesive composition used as a pressure-sensitive adhesive for a pressure-sensitive adhesive sheet.
【0002】[0002]
【従来の技術】近年、金属板、ガラス板、プラスチック
板等の表面の錆の発生(金属板の場合)や、汚れや損傷
を防ぐために、表面の保護シートとして粘着シートが一
時的に用いられたり、或いは仮接着等の用途に粘着シー
トが用いられたりしている。2. Description of the Related Art In recent years, an adhesive sheet has been temporarily used as a protective sheet on a surface of a metal plate, a glass plate, a plastic plate, or the like in order to prevent rust on the surface (in the case of a metal plate), dirt or damage. Or, an adhesive sheet is used for applications such as temporary bonding.
【0003】これらの粘着シートに用いられる粘着剤は
被着体に貼り付ける際には充分な粘着力を持ち、その後
(紫外線照射等により硬化されて)剥離する際には、粘
着力が充分に低下し、かつ被着体表面に汚染(粘着剤の
残存)が無いという性質を持つことが必要であり、更に
は金属板を被着体とする場合では金属面に対する非腐食
性等も必要である。[0003] The pressure-sensitive adhesive used for these pressure-sensitive adhesive sheets has a sufficient adhesive force when applied to an adherend, and then has a sufficient adhesive force when peeled (cured by ultraviolet irradiation or the like). It is necessary to have the property that the surface of the adherend is reduced and there is no contamination (residual adhesive) on the surface of the adherend. Further, when a metal plate is used as the adherend, non-corrosiveness to the metal surface is also required. is there.
【0004】かかる用途の粘着剤として、例えば、特
開昭61−28572号公報では、アクリル系粘着剤と
ウレタンアクリレート系オリゴマーからなる放射線照射
硬化性粘着剤が、特開昭62−153376号公報で
は、アクリル系粘着剤と3000〜10000の分子量
を有するウレタンアクリレート系オリゴマーからなる粘
着剤が提案されている。For example, JP-A-61-28572 discloses a radiation-curable pressure-sensitive adhesive comprising an acrylic pressure-sensitive adhesive and a urethane acrylate-based oligomer. An adhesive comprising an acrylic adhesive and a urethane acrylate oligomer having a molecular weight of 3000 to 10,000 has been proposed.
【0005】又、特開昭53−121832号公報で
は、表面保護に用いる光硬化性粘着剤として粘着剤主成
分のポリマー中に光反応性を有する不飽和結合を1分子
あたり2個以上もたせたもの、あるいは、通常の粘着剤
中に感光性のあるモノマーなどの低分子化合物を混合さ
せたものが、特開平1−251737号公報では、カ
ルボキシル基、水酸基、アミノ基、環状酸無水物基、エ
ポキシ基及びイソシアネート基から選ばれる1つまたは
2つ以上の官能基とエチレン性不飽和二重結合とを有す
るアクリル系重合体、及び上記官能基と反応する化合物
を主成分とする放射線硬化型アクリル系粘着剤が提案さ
れており、特開平2−187478号公報では、分子
内に放射線重合性の不飽和基を有するアクリル系重合性
ポリマーと放射線重合性の多官能オリゴマーを主成分と
する粘着剤が、特開2000−44890号公報で
は、エチレン性不飽和基含有アクリル系粘着剤、ウレタ
ンアクリレート系化合物、光重合開始剤、架橋剤を含有
してなる粘着剤が提案されている。In Japanese Patent Application Laid-Open No. 53-121832, as a photocurable pressure-sensitive adhesive used for surface protection, a polymer mainly composed of a pressure-sensitive adhesive has two or more unsaturated bonds having photoreactivity per molecule. Those, or those obtained by mixing a low-molecular compound such as a photosensitive monomer in a normal pressure-sensitive adhesive, are described in JP-A-1-251737, in which a carboxyl group, a hydroxyl group, an amino group, a cyclic acid anhydride group, An acrylic polymer having one or more functional groups selected from an epoxy group and an isocyanate group and an ethylenically unsaturated double bond, and a radiation-curable acrylic containing a compound that reacts with the functional group as a main component JP-A-2-187478 proposes an acrylic polymer having a radiation-polymerizable unsaturated group in the molecule and a radiation-polymerizable polymer. JP-A-2000-44890 discloses a pressure-sensitive adhesive containing a polyfunctional oligomer as a main component, which contains an ethylenically unsaturated group-containing acrylic pressure-sensitive adhesive, a urethane acrylate compound, a photopolymerization initiator, and a crosslinking agent. Agents have been proposed.
【0006】更に、特開2000−44889号公報
では、アセトアセチル基含有アクリル系粘着剤、ウレタ
ンアクリレート系化合物、光重合開始剤、架橋剤を含有
してなる粘着剤が提案されている。Further, Japanese Patent Application Laid-Open No. 2000-44889 proposes an adhesive containing an acetoacetyl group-containing acrylic adhesive, a urethane acrylate compound, a photopolymerization initiator, and a crosslinking agent.
【0007】[0007]
【発明が解決しようとする課題】しかしながら、上記の
開示技術を検討した結果、及びの開示技術において
は、粘着剤の再剥離時(硬化後)の粘着力の低下は認め
られるものの、再剥離後に被着体表面に粘着剤が残存
(糊残り)し汚染するという問題があり、及びの開
示技術においては、官能基としてカルボキシル基を含む
系では金属への腐食性が大きく、水酸基を含む系では硬
化前に充分な粘着力が得られなかったり、又高温下での
長時間の使用において粘着シートが被着体より浮いたり
剥がれたりするなどの耐久性に劣るという問題がある。However, as a result of examining the above-disclosed technology, and in the disclosed technology, although a decrease in the adhesive strength at the time of re-peeling (after curing) the adhesive is recognized, after the re-peel, There is a problem that the pressure-sensitive adhesive remains (adhesive residue) on the surface of the adherend and becomes contaminated, and in the disclosed technology, a system containing a carboxyl group as a functional group is highly corrosive to metals, and a system containing a hydroxyl group There is a problem that sufficient adhesive strength cannot be obtained before curing, and that the adhesive sheet is inferior in durability such as floating or peeling from an adherend when used for a long time at a high temperature.
【0008】更に、及びの開示技術においても、カ
ルボキシル基を官能基として含むアクリル系粘着剤では
金属への腐食性の問題や糊残りによる汚染性の問題が生
じる恐れがある。又、の開示技術についても糊残りに
よる汚染性の問題が生じる恐れがあり、〜の開示技
術ではまだまだ満足のいくものではなく、更なる改良が
求められる。[0008] Furthermore, in the techniques disclosed in (1) and (2), an acrylic pressure-sensitive adhesive containing a carboxyl group as a functional group may cause a problem of corrosiveness to metal and a problem of contamination due to adhesive residue. Also, there is a possibility that a problem of contamination due to adhesive residue may occur in the disclosed technology, and the disclosed technology is not yet satisfactory and further improvement is required.
【0009】そこで、本発明ではこのような背景下にお
いて、初期粘着力、高温下での耐久性、再剥離性に優
れ、更に剥離後の耐汚染性、非腐食性に優れた再剥離型
粘着剤組成物を提供することを目的とするものである。Under such circumstances, the present invention provides a re-peelable adhesive which is excellent in initial adhesive strength, durability under high temperature and removability, and is excellent in stain resistance and non-corrosion after peeling. It is intended to provide an agent composition.
【0010】[0010]
【課題を解決するための手段】しかるに、本発明者等は
かかる課題を解決すべく鋭意研究を重ねた結果、エチレ
ン性不飽和基及びアセトアセチル基を含有するアクリル
系粘着剤(A)、光重合開始剤(B)及び架橋剤(C)
を含有してなる再剥離型粘着剤組成物が、上記目的に合
致することを見出し、本発明を完成した。Means for Solving the Problems However, the inventors of the present invention have conducted intensive studies to solve such problems, and as a result, have found that an acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group (A), Polymerization initiator (B) and crosslinking agent (C)
The present inventors have found that a re-peelable pressure-sensitive adhesive composition containing the above meets the above object, and completed the present invention.
【0011】[0011]
【発明の実施の形態】以下、本発明について具体的に説
明する。本発明で使用するアクリル系粘着剤(A)は、
分子内に官能基を持ったアセトアセチル基含有アクリル
系重合体(a1)に、分子内に上記の官能基と反応する
官能基とエチレン性不飽和基とを有する化合物(a2)
(官能基含有不飽和化合物という)を反応させて、アセ
トアセチル基含有アクリル系重合体(a1)の分子内、
通常は側鎖にエチレン性不飽和基が導入されてなる構造
のものである。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described specifically. The acrylic pressure-sensitive adhesive (A) used in the present invention is:
Compound (a2) having an acetoacetyl group-containing acrylic polymer (a1) having a functional group in the molecule and a functional group reactive with the above functional group and an ethylenically unsaturated group in the molecule
(Referred to as “functional group-containing unsaturated compound”) to react with each other in the molecule of the acetoacetyl group-containing acrylic polymer (a1),
Usually, it has a structure in which an ethylenically unsaturated group is introduced into a side chain.
【0012】かかる分子内に官能基を持ったアセトアセ
チル基含有アクリル系重合体(a1)は、例えば次の方
法により製造することができる。The acetoacetyl group-containing acrylic polymer (a1) having a functional group in the molecule can be produced, for example, by the following method.
【0013】(1)アセトアセチル基含有エチレン性不
飽和モノマー(イ)、官能基含有エチレン性不飽和モノ
マー(ロ)、更に必要に応じてその他のエチレン性不飽
和モノマー(ハ)を共重合する。ここで、アセトアセチ
ル基含有エチレン性不飽和モノマー(イ)は、例えば次
の方法によって製造される。(1) Copolymerize an ethylenically unsaturated monomer containing an acetoacetyl group (a), an ethylenically unsaturated monomer containing a functional group (b), and, if necessary, other ethylenically unsaturated monomers (c). . Here, the acetoacetyl group-containing ethylenically unsaturated monomer (a) is produced, for example, by the following method.
【0014】(1−1)官能基含有エチレン性不飽和モ
ノマー(ニ)にジケテンを反応させる。該官能基として
はヒドロキシル基、アミド基、ウレタン基、アミノ基、
カルボキシル基等が挙げられ、官能基含有エチレン性不
飽和モノマー(ニ)として好適なものは、2−ヒドロキ
シエチルアクリレート、2−ヒドロキシエチルメタクリ
レート、ヒドロキシプロピルメタクリレート、2−ヒド
ロキシ−3−クロロプロピルアクリレート等である。(1-1) Diketene is reacted with the functional group-containing ethylenically unsaturated monomer (d). As the functional group, a hydroxyl group, an amide group, a urethane group, an amino group,
Suitable examples of the functional group-containing ethylenically unsaturated monomer (d) include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, hydroxypropyl methacrylate, 2-hydroxy-3-chloropropyl acrylate, and the like. It is.
【0015】(1−2)該官能基含有エチレン性不飽和
モノマー(ニ)とアセト酢酸エステルとをエステル交換
反応する。(1-2) Transesterification of the functional group-containing ethylenically unsaturated monomer (d) with acetoacetic ester.
【0016】上記の(1−1)の場合のジケテンの反応
は、無触媒の他、第3級アミン、酸(硫酸等)、塩基性
塩(酢酸ナトリウム等)、有機金属化合物(ジブチルス
ズラウレート等)の触媒存在下に行うことができる。上
記の(1−2)アセト酢酸エステルの反応は、酢酸カル
シウム、酢酸亜鉛、酸化鉛等のエステル交換触媒の存在
下に行うことが好ましい。The reaction of diketene in the case of the above (1-1) is carried out without using a catalyst, a tertiary amine, an acid (such as sulfuric acid), a basic salt (such as sodium acetate), an organometallic compound (such as dibutyltin laurate). Etc.) in the presence of a catalyst. The reaction of the above (1-2) acetoacetic ester is preferably performed in the presence of a transesterification catalyst such as calcium acetate, zinc acetate, lead oxide and the like.
【0017】又、官能基含有エチレン性不飽和モノマー
(ロ)としては、アクリル酸、メタクリル酸、クロトン
酸、マレイン酸、無水マレイン酸、イタコン酸、フマー
ル酸、アクリルアミドN−グリコール酸、ケイ皮酸等の
カルボキシル基含有不飽和モノマー、2−ヒドロキシエ
チルアクリレート、2−ヒドロキシプロピルアクリレー
ト、3−クロロ2−ヒドロキシプロピルアクリレート、
2−ヒドロキシエチルメタクリレート、2−ヒドロキシ
プロピルメタクリレート、3−クロロ2−ヒドロキシプ
ロピルメタクリレート、テトラヒドロフルフリルアクリ
レート、2−ヒドロキシ3−フェノキシプロピルアクリ
レート、ジエチレングリコールアクリレート、ポリエチ
レングリコールアクリレート、N−メチロールアクリル
アミド、N−メチロールメタクリルアミド等の水酸基含
有不飽和モノマー、グリシジルメタクリレート、アリル
グリシジルメタクリレート等のグリシジル基含有不飽和
モノマー、2−アクリロイルオキシエチルイソシアネー
ト、2−メタクリロイルオキシエチルイソシアネート等
のイソシアネート基含有不飽和モノマー、アクリルアミ
ド、メタクリルアミド、N−(n−ブトキシアルキル)
アクリルアミド、N−(n−ブトキシアルキル)メタク
リルアミド等のアミド基含有不飽和モノマー、アクリル
アミド−3−メチルブチルメチルアミン、ジメチルアミ
ノアルキルアクリルアミド、ジメチルアミノアルキルメ
タクリルアミド等のアミノ基含有不飽和モノマー、エチ
レンスルホン酸、アリルスルホン酸、メタアリルスルホ
ン酸等のオレフィンスルホン酸、2−アクリルアミド−
2−メチルプロパンスルホン酸、スチレンスルホン酸あ
るいはその塩等のスルホン酸基含有不飽和モノマー等が
挙げられる。中でも、カルボキシル基含有不飽和モノマ
ー、水酸基含有不飽和モノマー、グリシジル基含有不飽
和モノマー、イソシアネート基含有不飽和モノマー、ア
ミド基含有不飽和モノマーが好適に用いられる。Examples of the functional group-containing ethylenically unsaturated monomer (b) include acrylic acid, methacrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid. Carboxyl group-containing unsaturated monomers such as 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 3-chloro-2-hydroxypropyl acrylate,
2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 3-chloro-2-hydroxypropyl methacrylate, tetrahydrofurfuryl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, diethylene glycol acrylate, polyethylene glycol acrylate, N-methylol acrylamide, N-methylol Hydroxy group-containing unsaturated monomers such as methacrylamide, glycidyl group-containing unsaturated monomers such as glycidyl methacrylate and allyl glycidyl methacrylate, isocyanate group-containing unsaturated monomers such as 2-acryloyloxyethyl isocyanate and 2-methacryloyloxyethyl isocyanate, acrylamide, methacryl Amide, N- (n-butoxyalkyl)
Amide group-containing unsaturated monomers such as acrylamide and N- (n-butoxyalkyl) methacrylamide; amino group-containing unsaturated monomers such as acrylamido-3-methylbutylmethylamine, dimethylaminoalkylacrylamide and dimethylaminoalkylmethacrylamide; ethylene Olefin sulfonic acids such as sulfonic acid, allyl sulfonic acid, and methallyl sulfonic acid, 2-acrylamide-
Examples include sulfonic acid group-containing unsaturated monomers such as 2-methylpropanesulfonic acid, styrenesulfonic acid and salts thereof. Among them, a carboxyl group-containing unsaturated monomer, a hydroxyl group-containing unsaturated monomer, a glycidyl group-containing unsaturated monomer, an isocyanate group-containing unsaturated monomer, and an amide group-containing unsaturated monomer are preferably used.
【0018】その他のエチレン性不飽和モノマー(ハ)
としては、例えば(メタ)アクリル酸エステル、特には
アルキル基の炭素数1〜12、好ましくは4〜12の
(メタ)アクリル酸アルキルエステルが挙げれ、具体例
として、n−ブチル(メタ)アクリレート、iso−ブ
チル(メタ)アクリレート、tert−ブチル(メタ)
アクリレート、n−プロピル(メタ)アクリレート、n
−ヘキシル(メタ)アクリレート、2−エチルヘキシル
(メタ)アクリレート、n−オクチル(メタ)アクリレ
ート、ラウリル(メタ)アクリレート等が挙げられる。Other ethylenically unsaturated monomers (c)
Examples thereof include (meth) acrylic acid esters, in particular, alkyl (meth) acrylic acid esters having 1 to 12 carbon atoms, preferably 4 to 12 carbon atoms, and specific examples thereof include n-butyl (meth) acrylate, iso-butyl (meth) acrylate, tert-butyl (meth)
Acrylate, n-propyl (meth) acrylate, n
-Hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, lauryl (meth) acrylate, and the like.
【0019】又、更にエチレン性不飽和モノマー(ハ)
として、2−メトキシエチル(メタ)アクリレート、3
−メトキシエチル(メタ)アクリレート、メトキシジエ
チレングリコール(メタ)アクリレート等のアルキルビ
ニルエーテル類、N−アクリルアミドメチルトリメチル
アンモニウムクロライド、アリルトリメチルアンモニウ
ムクロライド、ジメチルアリルビニルケトン、N−ビニ
ルピロリドン、プロピオン酸ビニル、ステアリン酸ビニ
ル、塩化ビニル、塩化ビニリデン、酢酸ビニル、スチレ
ン等も挙げられる。Further, an ethylenically unsaturated monomer (c)
As 2-methoxyethyl (meth) acrylate, 3
Alkyl vinyl ethers such as -methoxyethyl (meth) acrylate, methoxydiethylene glycol (meth) acrylate, N-acrylamidomethyltrimethylammonium chloride, allyltrimethylammonium chloride, dimethylallylvinylketone, N-vinylpyrrolidone, vinyl propionate, vinyl stearate , Vinyl chloride, vinylidene chloride, vinyl acetate, styrene and the like.
【0020】かくしてアセトアセチル基含有エチレン性
不飽和モノマー(イ)、官能基含有エチレン性不飽和モ
ノマー(ロ)、及びその他のエチレン性不飽和モノマー
(ハ)を共重合して、分子内に官能基を持ったアセトア
セチル基含有アクリル系重合体(a1)が得られる。Thus, the acetoacetyl group-containing ethylenically unsaturated monomer (a), the functional group-containing ethylenically unsaturated monomer (b), and the other ethylenically unsaturated monomer (c) are copolymerized to form a functional group in the molecule. An acetoacetyl group-containing acrylic polymer (a1) having a group is obtained.
【0021】かかる共重合に当たっては、有機溶媒中
に、上記アセトアセチル基含有エチレン性不飽和モノマ
ー(イ)、官能基含有エチレン性不飽和モノマー
(ロ)、及びその他のエチレン性不飽和モノマー
(ハ)、重合開始剤(アゾビスイソブチロニトリル、ア
ゾビスイソバレロニトリル、過酸化ベンゾイル等)を混
合あるいは滴下し、還流状態あるいは50〜90℃で4
〜20時間重合する。In the copolymerization, the ethylenically unsaturated monomer containing an acetoacetyl group (a), the ethylenically unsaturated monomer containing a functional group (b), and other ethylenically unsaturated monomers (c) are dissolved in an organic solvent. ) And a polymerization initiator (azobisisobutyronitrile, azobisisovaleronitrile, benzoyl peroxide, etc.) are mixed or added dropwise, and refluxed or at 50 to 90 ° C.
Polymerize for ~ 20 hours.
【0022】かかるアセトアセチル基含有エチレン性不
飽和モノマー(イ)、官能基含有エチレン性不飽和モノ
マー(ロ)、及びその他のエチレン性不飽和モノマー
(ハ)の含有割合しては、特に限定されないが、アセト
アセチル基含有エチレン性不飽和モノマー(イ)が0.
01〜40重量%(好ましくは0.1〜10重量%)、
官能基含有エチレン性不飽和モノマー(ロ)が0.05
〜30重量%(好ましくは0.1〜20重量%)、その
他のエチレン性不飽和モノマー(ハ)が50〜99重量
%(好ましくは60〜92重量%)であることが好まし
い。The content ratio of the ethylenically unsaturated monomer having an acetoacetyl group (a), the ethylenically unsaturated monomer having a functional group (b), and the other ethylenically unsaturated monomer (c) is not particularly limited. Has an acetoacetyl group-containing ethylenically unsaturated monomer (a) of 0.1%.
01 to 40% by weight (preferably 0.1 to 10% by weight),
0.05 of functional group-containing ethylenically unsaturated monomer (b)
-30% by weight (preferably 0.1-20% by weight), and the other ethylenically unsaturated monomer (c) is preferably 50-99% by weight (preferably 60-92% by weight).
【0023】又、アセトアセチル基含有アクリル系重合
体(a1)を得る方法としては、上記(1)の方法に限
定されることなく、例えば、以下の(2)〜(4)の方
法により得られるアセトアセチル基含有アクリル系重合
体中に官能基含有エチレン性不飽和モノマー(ロ)も含
有させておくことでも行うことができる。The method for obtaining the acetoacetyl group-containing acrylic polymer (a1) is not limited to the above method (1), but may be obtained, for example, by the following methods (2) to (4). The acetoacetyl group-containing acrylic polymer to be obtained can also be prepared by including a functional group-containing ethylenically unsaturated monomer (b).
【0024】(2)官能基含有エチレン性不飽和モノマ
ー(ニ)を含むアクリル共重合体にジケテンを反応させ
る。該反応は、例えば溶液状の共重合体にジケテンを添
加して加熱撹拌すればよい。 (3)アセト酢酸エステルとエステル交換可能な官能基
(ヒドロキシル基やエステル基)を含有するエチレン性
不飽和モノマー成分を含むアクリル共重合体とアセト酢
酸エステルとをエステル交換反応する。 (4)アクリル共重合体にアセトアセチル基含有エチレ
ン性不飽和モノマーをグラフト重合又は共存重合する。(2) Diketene is reacted with the acrylic copolymer containing the functional group-containing ethylenically unsaturated monomer (d). The reaction may be performed, for example, by adding diketene to the copolymer in solution and heating and stirring. (3) A transesterification reaction between an acetoacetate ester and an acrylic copolymer containing an ethylenically unsaturated monomer component containing a functional group (hydroxyl group or ester group) capable of transesterification and an acetoacetate ester. (4) Graft polymerization or coexistence polymerization of an acetoacetyl group-containing ethylenically unsaturated monomer on the acrylic copolymer.
【0025】次に、上記分子内に官能基を持ったアセト
アセチル基含有アクリル系重合体(a1)に、分子内に
上記の官能基と反応する官能基とエチレン性不飽和基と
を有する化合物(a2)(官能基含有不飽和化合物とい
う)を反応させる。Next, the acetoacetyl group-containing acrylic polymer (a1) having a functional group in the molecule is added to a compound having a functional group that reacts with the functional group and an ethylenically unsaturated group in the molecule. (A2) (referred to as a functional group-containing unsaturated compound) is reacted.
【0026】官能基含有不飽和化合物(a2)として
は、前記カルボキシル基含有不飽和モノマー、水酸基含
有不飽和モノマー、グリシジル基含有不飽和モノマー、
イソシアネート基含有不飽和モノマー、アミド基含有不
飽和モノマー、アミノ基含有不飽和モノマー、スルホン
酸基含有不飽和モノマー等を挙げることができ、更には
グリシドールジ(メタ)アクリレート、ペンタエリスリ
トールジ(メタ)アクリレート、ペンタエリスリトール
トリ(メタ)アクリレート、ジペンタエリスリトールジ
(メタ)アクリレート、ジペンタエリスリトールトリ
(メタ)アクリレート、ジペンタエリスリトールテトラ
(メタ)アクリレート、ジペンタエリスリトールペンタ
(メタ)アクリレート、トリメチロールプロパンジ(メ
タ)アクリレート等のエチレン性不飽和基を2個以上と
水酸基を有するモノマーも挙げられ、反応活性基と官能
基の反応性に応じて適宜選択される。Examples of the functional group-containing unsaturated compound (a2) include the aforementioned carboxyl group-containing unsaturated monomers, hydroxyl group-containing unsaturated monomers, glycidyl group-containing unsaturated monomers,
Examples include isocyanate group-containing unsaturated monomers, amide group-containing unsaturated monomers, amino group-containing unsaturated monomers, sulfonic acid group-containing unsaturated monomers, and the like. Further, glycidol di (meth) acrylate, pentaerythritol di (meth) Acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol di (meth) acrylate, dipentaerythritol tri (meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, trimethylolpropanedi A monomer having two or more ethylenically unsaturated groups and a hydroxyl group such as (meth) acrylate may also be used, and is appropriately selected according to the reactivity between the reactive group and the functional group.
【0027】例えば、アセトアセチル基含有アクリル系
重合体(a1)中の官能基がカルボキシル基の場合はグ
リシジル基含有不飽和モノマーやイソシアネート基含有
不飽和モノマーが、該官能基が水酸基の場合はイソシア
ネート基含有不飽和モノマーが、該官能基がグリシジル
基の場合はカルボキシル基含有不飽和モノマーやアミド
基含有不飽和モノマーが、該官能基がアミノ基の場合は
グリシジル基含有不飽和モノマーが、それぞれ用いられ
る。For example, when the functional group in the acetoacetyl group-containing acrylic polymer (a1) is a carboxyl group, a glycidyl group-containing unsaturated monomer or an isocyanate group-containing unsaturated monomer is used, and when the functional group is a hydroxyl group, isocyanate is used. When the group-containing unsaturated monomer is a carboxyl group-containing unsaturated monomer or an amide group-containing unsaturated monomer when the functional group is a glycidyl group, a glycidyl group-containing unsaturated monomer is used when the functional group is an amino group. Can be
【0028】かかる分子内に官能基を持ったアセトアセ
チル基含有アクリル系重合体(a1)と官能基含有不飽
和化合物(a2)の反応は、特に制限されないが、通常
20〜80℃で1〜50時間反応させればよく、必要に
応じて適宜触媒を使用してもよい。The reaction between the acetoacetyl group-containing acrylic polymer (a1) having a functional group in the molecule and the functional group-containing unsaturated compound (a2) is not particularly limited. The reaction may be carried out for 50 hours, and a catalyst may be used as needed.
【0029】又、分子内に官能基を持ったアセトアセチ
ル基含有アクリル系重合体(a1)の反応活性点は全て
官能基含有不飽和化合物(a2)と反応させてしまって
もよいが、多少反応活性点を残しておいたほうが、粘着
力や凝集力の向上の点で好ましい。The acrylate polymer containing an acetoacetyl group having a functional group in the molecule (a1) may have all reactive active sites reacted with the unsaturated compound having a functional group (a2). It is preferable to leave the reaction active site from the viewpoint of improving the adhesive strength and the cohesive strength.
【0030】かくして本発明のエチレン性不飽和基及び
アセトアセチル基を含有するアクリル系粘着剤(A)が
得られるが、かかるアクリル系粘着剤(A)において、
本発明では特に、アクリル系粘着剤(A)の重量平均分
子量1万当たりに占めるエチレン性不飽和基の個数が
0.1〜100個であることが好ましく、更には1〜5
0個、特には1〜10個であることが好ましい。かかる
個数が0.1個未満では紫外線或いは放射線を照射させ
た後の粘着力の低下が不充分となり、100個を越える
と紫外線或いは放射線照射前の光安定性が悪くなった
り、照射後に硬化物が硬くなり過ぎて剥離時に粘着剤の
ワレやカケが起こり好ましくない。Thus, the acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group of the present invention is obtained. In the acrylic pressure-sensitive adhesive (A),
In the present invention, the number of ethylenically unsaturated groups in the acrylic pressure-sensitive adhesive (A) per 100,000 weight average molecular weight is particularly preferably 0.1 to 100, and more preferably 1 to 5
The number is preferably 0, and particularly preferably 1 to 10. When the number is less than 0.1, the adhesive strength after irradiation with ultraviolet rays or radiation is insufficiently reduced, and when the number exceeds 100, the light stability before irradiation with ultraviolet rays or radiation deteriorates or the cured product after irradiation. Becomes too hard, and cracking and chipping of the adhesive occur at the time of peeling, which is not preferable.
【0031】又、アクリル系粘着剤(A)において、本
発明では特に、アクリル系粘着剤(A)中に占めるアセ
トアセチル基の含有量が0.01〜40重量%であるこ
とが好ましく、更には0.1〜25重量%、特には1〜
15重量%であることが好ましい。かかる含有量が0.
01重量%未満では再剥離時に粘着剤組成物が被着体面
に残存する恐れがあり、40重量%を越えると粘着剤組
成物が硬くなり過ぎて好ましくない。In the acrylic pressure-sensitive adhesive (A), in the present invention, the content of the acetoacetyl group in the acrylic pressure-sensitive adhesive (A) is particularly preferably 0.01 to 40% by weight. Is 0.1 to 25% by weight, especially 1 to 25% by weight.
It is preferably 15% by weight. When the content is 0.
If the amount is less than 01% by weight, the pressure-sensitive adhesive composition may remain on the adherend surface during re-peeling. If the amount exceeds 40% by weight, the pressure-sensitive adhesive composition becomes too hard, which is not preferable.
【0032】アクリル系粘着剤(A)の重量平均分子量
については、特に限定されないが、20万〜150万で
あることが好ましく、更には40万〜100万が好まし
い。かかる重量平均分子量が20万未満では再剥離時に
粘着剤組成物が被着体面に残存する傾向にあり、150
万を越えると粘度が高くなり過ぎて取り扱いが悪くなり
好ましくない。The weight average molecular weight of the acrylic pressure-sensitive adhesive (A) is not particularly limited, but is preferably from 200,000 to 1.5 million, more preferably from 400,000 to 1,000,000. When the weight-average molecular weight is less than 200,000, the pressure-sensitive adhesive composition tends to remain on the adherend surface during re-peeling, and the
If it exceeds 10,000, the viscosity becomes too high and the handling becomes poor, which is not preferable.
【0033】本発明で用いられる光重合開始剤(B)と
しては、特に限定されず、例えばベンゾイン、イソプロ
ピルベンゾインエーテル、イソブチルベンゾインエーテ
ル、ベンゾフェノン、ミヒラーケトン、クロロチオキサ
ントン、ドデシルチオキサントン、ジメチルチオキサン
トン、ジエチルチオキサントン、アセトフェノンジエチ
ルケタール、ベンジルジメチルケタール、1−ヒドロキ
シシクロヘキシルフェニルケトン、2−ヒドロキシ−2
−メチル−1−フェニルプロパン−1−オン等が挙げら
れるが、中でもベンジルジメチルケタール、1−ヒドロ
キシシクロヘキシルフェニルケトン、2−ヒドロキシ−
2−メチル−1−フェニルプロパン−1−オンが好適に
用いられる。The photopolymerization initiator (B) used in the present invention is not particularly restricted but includes, for example, benzoin, isopropylbenzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, Acetophenone diethyl ketal, benzyl dimethyl ketal, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2
-Methyl-1-phenylpropan-1-one and the like, among which benzyldimethylketal, 1-hydroxycyclohexylphenylketone, 2-hydroxy-
2-Methyl-1-phenylpropan-1-one is preferably used.
【0034】かかる光重合開始剤(B)の含有量は、エ
チレン性不飽和基及びアセトアセチル基を含有するアク
リル系粘着剤(A)100重量部に対して0.1〜10
重量部であることが好ましく、より好ましくは1.0〜
5.0重量部である。かかる含有量が0.1重量部未満
では紫外線あるいは照射線を照射させた後の粘着力の低
下(再剥離性)が不充分となり、10重量部を越えると
被着体面に光重合開始剤(B)が残留して汚染の原因と
なり好ましくない。The content of the photopolymerization initiator (B) is 0.1 to 10 parts by weight based on 100 parts by weight of the acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group.
Parts by weight, more preferably from 1.0 to 1.0 parts by weight.
5.0 parts by weight. When the content is less than 0.1 part by weight, the decrease in adhesive strength (removability) after irradiation with ultraviolet rays or irradiation rays is insufficient, and when it exceeds 10 parts by weight, the photopolymerization initiator ( B) remains and causes contamination, which is not preferable.
【0035】更に、本発明で用いられる架橋剤(C)と
しては、特に限定されず、例えば、ビスフェノールA・
エピクロルヒドリン型のエポキシ樹脂、エチレングリコ
ールジグリシジルエーテル、ポリエチレングリコールジ
グリシジルエーテル、グリセリンジグリシジルエーテ
ル、グリセリントリグリシジルエーテル、1,6−ヘキ
サンジオールジグリシジルエーテル、トリメチロールプ
ロパントリグリシジルエーテル、ソルビトールポリグリ
シジルエーテル、ポリグリセロールポリグリシジルエー
テル、ペンタエリスリトールポリグリシジルエリスリト
ール、ジグリセロールポリグリシジルエーテル等のエポ
キシ系化合物、テトラメチロールメタン−トリ−β−ア
ジリジニルプロピオネート、トリメチロールプロパン−
トリ−β−アジリジニルプロピオネート、N,N′−ジ
フェニルメタン−4,4′−ビス(1−アジリジンカル
ボキシアミド)、N,N′−ヘキサメチレン−1,6−
ビス(1−アジリジンカルボキシアミド)等のアジリジ
ン系化合物、ヘキサメトキシメチルメラミン、ヘキサエ
トキシメチルメラミン、ヘキサプロポキシメチルメラミ
ン、ヘキサプトキシメチルメラミン、ヘキサペンチルオ
キシメチルメラミン、ヘキサヘキシルオキシメチルメラ
ミン、メラミン樹脂等のメラミン系化合物、2,4−ト
リレンジイソシアネート、2,6−トリレンジイソシア
ネート、水素化トリレンジイソシアネート、1,3−キ
シリレンジイソシアネート、1,4−キシリレンジイソ
シアネート、ジフェニルメタン−4,4−ジイソシアネ
ート、イソホロンジイソシアネート、1,3−ビス(イ
ソシアナトメチル)シクロヘキサン、テトラメチルキシ
リレンジイソシアネート、1,5−ナフタレンジイソシ
アネート、トリメチロールプロパンのトリレンジイソシ
アネート付加物、トリメチロールプロパンのキシリレン
ジイソシアネート付加物、トリフェニルメタントリイソ
シアネート、メチレンビス(4−フェニルメタン)トリ
イソシアネート等のイソシアネート系化合物、グリオキ
ザール、マロンジアルデヒド、スクシンジアルデヒド、
マレインジアルデヒド、グルタルジアルデヒド、ホルム
アルデヒド、アセトアルデヒド、ベンズアルデヒド等の
アルデヒド系化合物、ヘキサメチレンジアミン、トリエ
チルジアミン、ポリエチレンイミン、ヘキサメチレンテ
トラアミン、ジエチレントリアミン、トリエチルテトラ
アミン、イソフォロンジアミン、アミノ樹脂、ポリアミ
ド等のアミン系化合物、アルミニウム、鉄、銅、亜鉛、
スズ、チタン、ニッケル、アンチモン、マグネシウム、
パナジウム、クロム、ジルコニウム等の多金属のアセチ
ルアセトンやアセトアセチルエステル配位化合物等の金
属キレート化合物等が挙げられ、中でも、イソシアネー
ト系化合物、アミン系化合物、金属キレート化合物が好
適に用いられる。The crosslinking agent (C) used in the present invention is not particularly limited.
Epichlorohydrin type epoxy resin, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, glycerin triglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, sorbitol polyglycidyl ether, Epoxy compounds such as polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl erythritol, diglycerol polyglycidyl ether, tetramethylolmethane-tri-β-aziridinylpropionate, trimethylolpropane-
Tri-β-aziridinylpropionate, N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), N, N′-hexamethylene-1,6-
Aziridine compounds such as bis (1-aziridinecarboxamide), hexamethoxymethylmelamine, hexaethoxymethylmelamine, hexapropoxymethylmelamine, hexaptoxymethylmelamine, hexapentyloxymethylmelamine, hexahexyloxymethylmelamine, melamine resin, etc. Melamine compound, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, hydrogenated tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane-4,4-diisocyanate , Isophorone diisocyanate, 1,3-bis (isocyanatomethyl) cyclohexane, tetramethylxylylene diisocyanate, 1,5-naphthalenediisocyanate, trime Tolylene diisocyanate adduct of trimethylolpropane, xylylene diisocyanate adduct of trimethylolpropane, triphenylmethane triisocyanate, methylene bis (4-phenyl methane) isocyanate compound triisocyanates such as glyoxal, malondialdehyde, succindialdehyde aldehyde,
Aldehyde compounds such as maleic dialdehyde, glutardialdehyde, formaldehyde, acetaldehyde, benzaldehyde, hexamethylenediamine, triethyldiamine, polyethyleneimine, hexamethylenetetraamine, diethylenetriamine, triethyltetraamine, isophoronediamine, amino resin, polyamide, etc. Amine compounds, aluminum, iron, copper, zinc,
Tin, titanium, nickel, antimony, magnesium,
Metal chelate compounds such as acetylacetone and acetoacetyl ester coordination compounds of polymetals such as vanadium, chromium, and zirconium are exemplified. Among them, isocyanate compounds, amine compounds, and metal chelate compounds are preferably used.
【0036】かかる架橋剤(C)の含有量は、エチレン
性不飽和基及びアセトアセチル基を含有するアクリル系
粘着剤(A)及び光重合開始剤(B)の合計100重量
部に対して0.005〜10重量部であることが好まし
く、より好ましくは0.05〜4重量部である。かかる
含有量が0.005重量部未満では、紫外線あるいは放
射線を照射させた後の再剥離時に被着面に粘着剤組成物
が残存して汚染の原因となり、10重量部を越えると、
紫外線あるいは放射線を照射させる前に硬化が進行して
しまい、紫外線或いは放射線照射後の粘着力の低下が十
分でないことがあり好ましくない。The content of the crosslinking agent (C) is 0 to 100 parts by weight of the total of the acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group and the photopolymerization initiator (B). It is preferably 0.005 to 10 parts by weight, more preferably 0.05 to 4 parts by weight. If the content is less than 0.005 parts by weight, the pressure-sensitive adhesive composition will remain on the adhered surface at the time of re-peeling after irradiation with ultraviolet rays or radiation, causing contamination, and if it exceeds 10 parts by weight,
The curing proceeds before irradiation with ultraviolet rays or radiation, and the adhesive strength after irradiation with ultraviolet rays or radiation may not be sufficiently reduced, which is not preferable.
【0037】本発明の再剥離型粘着剤組成物は、上記の
エチレン性不飽和基及びアセトアセチル基を含有するア
クリル系粘着剤(A)、光重合開始剤(B)及び架橋剤
(C)を含有してなるわけであるが、該再剥離型粘着剤
組成物の調製法としては、上記の(A)〜(C)を配合
(混合)すればよく、その配合順序等は特に限定されな
い。The removable pressure-sensitive adhesive composition of the present invention comprises an acrylic pressure-sensitive adhesive (A), a photopolymerization initiator (B), and a crosslinking agent (C) containing the above-mentioned ethylenically unsaturated group and acetoacetyl group. However, as a method for preparing the removable pressure-sensitive adhesive composition, the above-mentioned (A) to (C) may be blended (mixed), and the blending order and the like are not particularly limited. .
【0038】この時用いられる溶剤としては、アクリル
系粘着剤(A)、光重合開始剤(B)及び架橋剤(C)
を溶解させるものであれば特に限定されないが、酢酸メ
チル、酢酸エチル、アセト酢酸メチル、アセト酢酸エチ
ル等のエステル類、アセトン、メチルイソブチルケトン
等のケトン類、トルエン、キシレン等の芳香族化合物等
が挙げられる。しかし、溶解性、乾燥性、価格等の点か
ら酢酸エチル、トルエンが好適に用いられる。The solvent used at this time includes an acrylic pressure-sensitive adhesive (A), a photopolymerization initiator (B) and a crosslinking agent (C).
There is no particular limitation as long as it dissolves, but esters such as methyl acetate, ethyl acetate, methyl acetoacetate, and ethyl acetoacetate, ketones such as acetone and methyl isobutyl ketone, and aromatic compounds such as toluene and xylene. No. However, ethyl acetate and toluene are preferably used from the viewpoints of solubility, drying property, price and the like.
【0039】かくして本発明の再剥離型粘着剤組成物が
得られるが、本発明の効果を損なわない範囲において、
上記アクリル系粘着剤(A)以外の粘着剤、ウレタン樹
脂、ロジン、ロジンエステル、水添ロジンエステル、フ
ェノール樹脂、芳香族変性テルペン樹脂、脂肪族系石油
樹脂、脂環族系石油樹脂、スチレン系樹脂、キシレン系
樹脂等の粘着付与剤、公知の添加剤や紫外線あるいは放
射線照射により呈色あるいは変色を起こすような化合物
を添加することができる。Thus, the removable pressure-sensitive adhesive composition of the present invention is obtained, but within the range not impairing the effects of the present invention.
Pressure-sensitive adhesives other than the acrylic pressure-sensitive adhesive (A), urethane resin, rosin, rosin ester, hydrogenated rosin ester, phenolic resin, aromatic modified terpene resin, aliphatic petroleum resin, alicyclic petroleum resin, styrene-based Resins, tackifiers such as xylene resins, known additives, and compounds that cause coloration or discoloration by irradiation with ultraviolet light or radiation can be added.
【0040】本発明の再剥離型粘着剤組成物は、通常基
材シート等に塗布されて粘着シートや粘着テープ等とし
て実用に供されることが多く、かかる粘着シートや粘着
テープ等を製造するには、まず本発明の再剥離型粘着剤
組成物をそのまま又は適当な有機溶剤により、濃度調整
し、シリコン処理等が施された基材の処理面に塗工した
り、あるいは直接基材に塗工して、例えば80〜105
℃、30秒〜10分間加熱処理等により乾燥させて粘着
層を形成させることができる。The re-peelable pressure-sensitive adhesive composition of the present invention is usually applied to a substrate sheet or the like and is often put to practical use as a pressure-sensitive adhesive sheet or a pressure-sensitive adhesive tape. First, the re-peelable pressure-sensitive adhesive composition of the present invention as it is or with an appropriate organic solvent, the concentration is adjusted, and applied to the treated surface of the substrate subjected to silicon treatment or the like, or directly to the substrate. Coating, for example, 80 to 105
The adhesive layer can be formed by drying by heat treatment or the like at 30 ° C. for 30 seconds to 10 minutes.
【0041】かかる基材としては、紫外線等が透過する
フィルムであれば特に限定されず、例えば、ポリ塩化ビ
ニル、ポリブテン、ポリブタジエン、ポリウレタン、エ
チレン−酢酸ビニル共重合体、ポリエチレンテレフタレ
ート、ポリエチレン、ポリピロピレン、エチレン−プロ
ピレン共重合体、ポリメチルペンテン、ポリブチレンテ
レフタレート等の透明フィルムや紫外線透過が可能な着
色フィルムが挙げられる。The substrate is not particularly limited as long as it is a film through which ultraviolet rays and the like can pass. For example, polyvinyl chloride, polybutene, polybutadiene, polyurethane, ethylene-vinyl acetate copolymer, polyethylene terephthalate, polyethylene, polypropylene, Examples include transparent films such as ethylene-propylene copolymer, polymethylpentene, and polybutylene terephthalate, and colored films capable of transmitting ultraviolet light.
【0042】本発明の再剥離型粘着剤組成物は、金属
板、ガラス板、プラスチック板等の運搬、加工、切断等
の際の傷防止や汚染防止等のための一時的な表面保護用
或いは仮接着用の粘着シート等の粘着剤として用いられ
るものである。The removable pressure-sensitive adhesive composition of the present invention can be used for temporary surface protection for preventing scratches and contamination during transportation, processing, cutting and the like of metal plates, glass plates, plastic plates and the like. It is used as an adhesive such as an adhesive sheet for temporary bonding.
【0043】例えば、被着体の表面を保護する時には充
分な粘着剤を有しており、運搬、加工、切断等の処理が
行われた後には、粘着シートまたは粘着テープ等の基材
側から紫外線あるいは放射線を照射して硬化させ、粘着
力を低下させて再剥離する。For example, when the surface of the adherend is protected, it has a sufficient pressure-sensitive adhesive, and after processing such as transportation, processing, and cutting, is performed from the side of the base material such as a pressure-sensitive adhesive sheet or a pressure-sensitive adhesive tape. It is cured by irradiating it with ultraviolet rays or radiation, and its adhesive strength is reduced and it is removed again.
【0044】紫外線照射を行う時の光源としては、高圧
水銀灯、超高圧水銀灯カーボンアーク灯、キセノン灯、
メタルハライドランプ、ケミカルランプ、ブラックライ
ト等が用いられる。高圧水銀ランプの場合は、例えば5
〜3000mJ/cm2、好ましくは10〜500mJ
/cm2の条件で行われる。照射時間は、光源の種類、
光源と塗布面との距離、塗工厚、その他の条件によって
も異なるが、通常は数秒、場合によっては数分の1秒で
もよい。電子線照射の場合には、例えば、50〜100
0Kevの範囲のエネルギーを持つ電子線を用い、2〜
50Mradの照射量とするのがよい。As a light source for performing the ultraviolet irradiation, a high pressure mercury lamp, an ultra high pressure mercury lamp, a carbon arc lamp, a xenon lamp,
Metal halide lamps, chemical lamps, black lights and the like are used. In the case of a high-pressure mercury lamp, for example, 5
33000 mJ / cm 2 , preferably 10-500 mJ
/ Cm 2 . The irradiation time depends on the type of light source,
Although it depends on the distance between the light source and the coating surface, the coating thickness, and other conditions, it is usually several seconds, and in some cases, a fraction of a second. In the case of electron beam irradiation, for example, 50 to 100
Using an electron beam having an energy in the range of 0 Kev,
The irradiation amount is preferably 50 Mrad.
【0045】硬化前後の粘着力(JIS Z 0237
による180度ピール強度)は、基材の種類によっても
変わるが、硬化前で200g/25mm以上、好ましく
は500g/25mm以上、照射後(再剥離時)で5〜
30g/25mm程度が好ましい。又、半導体ウエハの
一時保護の場合では、硬化前で150g/25mm以
上、好ましくは300g/25mm以上、照射後(再剥
離時)で5〜30g/25mm程度が好ましい。Adhesion before and after curing (JIS Z 0237)
180 degrees peel strength) varies depending on the type of the base material, but before curing, it is 200 g / 25 mm or more, preferably 500 g / 25 mm or more, and after irradiation (at the time of re-peeling), 5 to 5 g.
About 30 g / 25 mm is preferable. In the case of temporary protection of the semiconductor wafer, it is preferably 150 g / 25 mm or more, preferably 300 g / 25 mm or more before curing, and about 5 to 30 g / 25 mm after irradiation (at the time of re-peeling).
【0046】かくして本発明の再剥離型粘着剤組成物
は、エチレン性不飽和基及びアセトアセチル基を含有す
るアクリル系粘着剤(A)、光重合開始剤(B)及び架
橋剤(C)を含有してなるため、初期粘着力、高温下で
の耐久性、再剥離性に優れ、更に剥離後の耐汚染性、非
腐食性に優れた効果を示すものであり、金属板、ガラス
板、プラスチック板等一時的な表面保護用或いは仮接着
用の粘着シートや半導体ウエハ等のダイシング工程の半
導体固定用の粘着シートに用いられる粘着剤として非常
に有用である。Thus, the removable pressure-sensitive adhesive composition of the present invention comprises an acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group, a photopolymerization initiator (B), and a crosslinking agent (C). Because it contains, it has excellent initial adhesive strength, durability under high temperature, excellent re-peelability, and also shows excellent effects on post-peeling stain resistance and non-corrosion. It is very useful as an adhesive used for an adhesive sheet for temporary surface protection or temporary adhesion such as a plastic plate or an adhesive sheet for fixing a semiconductor in a dicing process such as a semiconductor wafer.
【0047】[0047]
【実施例】以下、実施例を挙げて本発明を具体的に説明
する。尚、実施例中「%」、「部」とあるのは、断りの
ない限り重量基準を意味する。The present invention will be specifically described below with reference to examples. In the examples, “%” and “parts” mean on a weight basis unless otherwise specified.
【0048】実施例1 [分子内に官能基を持ったアセトアセチル基含有アクリ
ル系重合体(a1)]2−ヒドロキシエチルメタクリレ
ート150部を仕込み、ジケテン付加反応の触媒として
トリエチルアミン0.05部を加え、60℃まで昇温
後、ジケテン96.9部(2−ヒドロキシエチルメタク
リレートに対し当量)を2時間にわたって撹拌下に滴下
し、更に5時間反応を続行して2−ヒドロキシエチルメ
タクリレートのヒドロキシル基をアセトアセチル化し、
2−ヒドロキシエチルメタクリレートのヒドロキシル基
の全てがアセトアセチル化したアセトアセチル化2−ヒ
ドロキシエチルメタクリレートを得た。Example 1 [Acetacetyl group-containing acrylic polymer having a functional group in the molecule (a1)] 150 parts of 2-hydroxyethyl methacrylate was charged, and 0.05 part of triethylamine was added as a catalyst for the diketene addition reaction. After the temperature was raised to 60 ° C., 96.9 parts of diketene (equivalent to 2-hydroxyethyl methacrylate) was added dropwise with stirring over 2 hours, and the reaction was further continued for 5 hours to remove the hydroxyl group of 2-hydroxyethyl methacrylate. Acetoacetylated,
Acetoacetylated 2-hydroxyethyl methacrylate in which all of the hydroxyl groups of 2-hydroxyethyl methacrylate were acetoacetylated was obtained.
【0049】次に、ブチルアクリレート70部、2−ヒ
ドロキシエチルアクリレート20部、上記アセトアセチ
ル化2−ヒドロキシエチルメタクリレート10部及び酢
酸エチル80部を仕込み、加熱還流開始後、重合開始剤
としてアゾビスイソブチロニトリル0.07部を加え、
酢酸エチル還流温度で3時間反応後、アゾビスイソブチ
ロニトリル0.07部、トルエン5部を加え、更に4時
間反応し、トルエンにて希釈してアセトアセチル基含有
アクリル系重合体(a1)溶液(樹脂分40%、粘度1
2000mPa・s(25℃))を得た。Next, 70 parts of butyl acrylate, 20 parts of 2-hydroxyethyl acrylate, 10 parts of the above acetoacetylated 2-hydroxyethyl methacrylate and 80 parts of ethyl acetate were charged, and after heating under reflux, azobisisopropane was used as a polymerization initiator. Add 0.07 parts of butyronitrile,
After reacting for 3 hours at the reflux temperature of ethyl acetate, 0.07 parts of azobisisobutyronitrile and 5 parts of toluene were added, and the reaction was further continued for 4 hours, diluted with toluene and diluted with an acetoacetyl group-containing acrylic polymer (a1). Solution (resin content 40%, viscosity 1
2000 mPa · s (25 ° C.).
【0050】[エチレン性不飽和基及びアセトアセチル
基を含有するアクリル系粘着剤(A)]得られたアセト
アセチル基含有アクリル系重合体(a1)溶液(樹脂分
40%)100部に、ジラウリル酸ジ−n−ブチルスズ
0.004部、ヒドロキノンモノエチルエーテル0.0
06部及び官能基含有不飽和化合物として2−メタクリ
ロイルオキシエチルイソシアネート(a2)6.6部を
仕込み、50℃で20時間反応させて、最後にトルエン
にて希釈し、側鎖にエチレン性不飽和基を、2−ヒドロ
キシエチルアクリレートに対して60モル%付加したア
クリル系粘着剤(A)溶液(樹脂分35%、粘度190
0mPa・s(25℃))を得た。[Acrylic pressure-sensitive adhesive containing ethylenically unsaturated group and acetoacetyl group (A)] Dilauryl was added to 100 parts of the obtained acetoacetyl group-containing acrylic polymer (a1) solution (resin content: 40%). 0.004 part of di-n-butyltin acid, hydroquinone monoethyl ether 0.0
06 parts and 6.6 parts of 2-methacryloyloxyethyl isocyanate (a2) as a functional group-containing unsaturated compound were charged, reacted at 50 ° C. for 20 hours, finally diluted with toluene, and ethylenically unsaturated in the side chain. Adhesive (A) solution in which a group is added to 2-hydroxyethyl acrylate at 60 mol% (resin content 35%, viscosity 190
0 mPa · s (25 ° C.)).
【0051】かかるアクリル系粘着剤(A)の重量平均
分子量は55万で、エチレン性不飽和基の個数は重量平
均分子量1万当たり2.6個、アセトアセチル基の含有
量は8.6重量%であった。尚、重量平均分子量はゲル
パーミションクロマトグラフィーで測定した。The acrylic adhesive (A) has a weight average molecular weight of 550,000, the number of ethylenically unsaturated groups is 2.6 per 10,000 weight average molecular weight, and the content of acetoacetyl group is 8.6 weight. %Met. In addition, the weight average molecular weight was measured by gel permeation chromatography.
【0052】[再剥離型粘着剤組成物の製造]紫外線の
遮断された部屋にて、250mlのポリエチレン容器に
トルエン30部、上記アクリル系粘着剤(A)溶液(樹
脂分35%)100部、1−ヒドロキシシクロヘキシル
フェニルケトン(B)(日本チバガイギー社製、「イル
ガキュア184」)1部、トリメチロールプロパンのト
リレンジイソシアネート付加物の55%酢酸エチル溶液
(C)(日本ポリウレタン社製、「コロネートL−55
E」)0.25部を加えて撹拌し均一な溶液として再剥
離型粘着剤組成物溶液を得た。得られた再剥離型粘着剤
組成物について、下記の如く粘着シートを作製し、以下
の各物性を評価した。[Production of Removable Adhesive Composition] In a room shielded from ultraviolet rays, 30 parts of toluene, 100 parts of the above acrylic adhesive (A) solution (resin content 35%) were placed in a 250 ml polyethylene container, 1 part of 1-hydroxycyclohexylphenyl ketone (B) (“Irgacure 184” manufactured by Ciba-Geigy Japan) and a 55% ethyl acetate solution of tolylene diisocyanate adduct of trimethylolpropane (C) (“Coronate L” manufactured by Nippon Polyurethane Co., Ltd.) -55
E ") 0.25 part was added and stirred to obtain a removable pressure-sensitive adhesive composition solution as a uniform solution. With respect to the obtained removable pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets were prepared as described below, and the following physical properties were evaluated.
【0053】[粘着シートの作製]紫外線の遮断された
状態で、再剥離型粘着剤組成物溶液をシリコーン剥離処
理した厚さ38μmのポリエステルフィルムに乾燥後の
厚みが20μmとなるように塗工し、100℃、2分間
加熱乾燥した。その後基材となる110μmポリオレフ
ィンフィルム上に転写して、40℃で3日間エージング
することにより粘着シートを得た。[Preparation of Pressure-sensitive Adhesive Sheet] In a state where ultraviolet rays are blocked, a re-peelable pressure-sensitive adhesive composition solution is applied to a 38 μm-thick polyester film subjected to a silicone release treatment so that the thickness after drying becomes 20 μm. At 100 ° C. for 2 minutes. Thereafter, the adhesive sheet was transferred onto a 110 μm polyolefin film as a substrate and aged at 40 ° C. for 3 days to obtain a pressure-sensitive adhesive sheet.
【0054】(初期粘着力)上記粘着シートを被着体
(SUS板、ガラス板)に貼着して、0.5時間放
置した後、JIS Z 0237に準じて、紫外線照射
前の180度ピール強度(g/25mm)を測定した。(Initial Adhesive Strength) The above-mentioned pressure-sensitive adhesive sheet was adhered to an adherend (SUS plate, glass plate), left for 0.5 hours, and then peeled at 180 ° before ultraviolet irradiation according to JIS Z 0237. The strength (g / 25 mm) was measured.
【0055】(耐久性)上記粘着シートを、被着体(
SUS板、ガラス板)に貼り付け面積が25mm×2
5mmになるように貼着し、20℃で1日間放置した後
更に60℃で1日間放置する工程を5サイクル行った後
の被着体からの粘着シートの浮き具合を観察した。評価
基準は下記の通りである。 ○・・・浮きは見られなかった ×・・・浮きが見られた(Durability) The above pressure-sensitive adhesive sheet was adhered to an adherend (
SUS plate, glass plate) with an area of 25 mm x 2
The adhesive sheet was adhered so as to have a thickness of 5 mm, left at 20 ° C. for 1 day, and further left at 60 ° C. for 1 day. After 5 cycles, the state of floating of the pressure-sensitive adhesive sheet from the adherend was observed. The evaluation criteria are as follows. ○ ・ ・ ・ Floating was not observed × ・ ・ ・ Floating was observed
【0056】(再剥離性)上記粘着シートを被着体(
SUS板、ガラス板)に貼着して、1時間放置した
後、紫外線照射(高圧水銀ランプにて250mJ/cm
2)を行い、更に0.5時間放置した後、JIS Z
0237に準じて、紫外線照射後の180度ピール強度
(g/25mm)を測定した。(Removability) The above pressure-sensitive adhesive sheet was adhered to an adherend (
(SUS plate, glass plate), left for 1 hour, and then irradiated with ultraviolet light (250 mJ / cm with a high-pressure mercury lamp)
2 ) and leave it for 0.5 hours, then follow JIS Z
According to 0237, the 180-degree peel strength (g / 25 mm) after ultraviolet irradiation was measured.
【0057】(耐汚染性)異物が付着していない4イン
チ角の被着体(SUS板、ガラス板)の表面に上記
粘着シートを貼着し、23℃、65%RHの条件下に1
時間放置した後、紫外線照射(高圧水銀ランプにて25
0mJ/cm2)を行い、その後被着体の表面から粘着
シートを剥離し、剥離後の各被着体について、表面に残
存する0.15μm以上の異物の個数をレーザ表面検査
装置を用いて測定し、下記の通り評価した。 ○・・・4個以下 △・・・5〜29個 ×・・・30個以上(Stain resistance) The above-mentioned pressure-sensitive adhesive sheet was adhered to the surface of a 4-inch square adherend (SUS plate, glass plate) to which no foreign matter was adhered, and was placed under the conditions of 23 ° C. and 65% RH.
After standing for an hour, irradiate with ultraviolet light (25
0 mJ / cm 2 ), and then peel the adhesive sheet from the surface of the adherend. For each adherend after peeling, determine the number of foreign matter of 0.15 μm or more remaining on the surface using a laser surface inspection device. It was measured and evaluated as follows. ○ ・ ・ ・ 4 or less △ ・ ・ ・ 5 to 29 × ・ ・ ・ 30 or more
【0058】(非腐食性)上記粘着シートを銅板に貼着
して、60℃、65%RHの暗室に1週間放置した後、
23℃、65%RHの条件下に1時間放置し、紫外線照
射(高圧水銀ランプにて250mJ/cm2)を行い、
銅板から粘着シートを剥離して、銅板の剥離面をブラン
クの銅板と目視にて比較し、下記の通り評価した。 ○・・・ブランクの銅板表面と変わらない △・・・銅板表面がわずかに変色して、若干の腐食が見
られた ×・・・銅板表面が著しく変色して、かなりの腐食が見
られた(Non-corrosive) The pressure-sensitive adhesive sheet was stuck on a copper plate and left in a dark room at 60 ° C. and 65% RH for one week.
It was left for 1 hour under the conditions of 23 ° C. and 65% RH, and irradiated with ultraviolet rays (250 mJ / cm 2 with a high-pressure mercury lamp).
The adhesive sheet was peeled off from the copper plate, and the peeled surface of the copper plate was visually compared with the blank copper plate, and evaluated as follows. ○: Same as blank copper plate surface △: Copper plate surface slightly discolored and slight corrosion was observed ×: Copper plate surface was significantly discolored and considerable corrosion was observed
【0059】実施例2 実施例1において、エチレン性不飽和基及びアセトアセ
チル基を含有するアクリル系粘着剤(A)を下記の如く
変更した以外は同様に行い、再剥離型粘着剤組成物を
得、実施例1と同様の評価を行った。Example 2 A removable pressure-sensitive adhesive composition was prepared in the same manner as in Example 1 except that the acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group was changed as follows. The same evaluation as in Example 1 was performed.
【0060】[エチレン性不飽和基及びアセトアセチル
基を含有するアクリル系粘着剤(A)]実施例1におい
て、2−メタクリロイルオキシエチルイソシアネート
(a2)を11.5部に変更し、側鎖にエチレン性不飽
和基を、2−ヒドロキシエチルアクリレートに対して1
05モル%付加した以外は同様に行い、アクリル系粘着
剤(A)溶液(樹脂分35%、粘度1800mPa・s
(25℃))を得た。かかるアクリル系粘着剤(A)の
重量平均分子量は55万で、エチレン性不飽和基の個数
は重量平均分子量1万当たり4.6個、アセトアセチル
基の含有量は7.0重量%であった。[Acrylic pressure-sensitive adhesive containing ethylenically unsaturated group and acetoacetyl group (A)] In Example 1, 2-methacryloyloxyethyl isocyanate (a2) was changed to 11.5 parts and the side chain was changed to 11.5 parts. An ethylenically unsaturated group is added to 2-hydroxyethyl acrylate
Acrylic pressure-sensitive adhesive (A) solution (resin content 35%, viscosity 1800 mPa · s)
(25 ° C.)). The weight-average molecular weight of the acrylic pressure-sensitive adhesive (A) was 550,000, the number of ethylenically unsaturated groups was 4.6 per 10,000 weight-average molecular weight, and the content of acetoacetyl groups was 7.0% by weight. Was.
【0061】実施例3 [分子内に官能基を持ったアセトアセチル基含有アクリ
ル系重合体(a1)]ブチルアクリレート75部、2−
ヒドロキシエチルアクリレート20部、実施例1で用い
たアセトアセチル化2−ヒドロキシエチルメタクリレー
ト5部及び酢酸エチル80部を仕込み、加熱還流開始
後、重合開始剤としてアゾビスイソブチロニトリル0.
07部を加え、酢酸エチル還流温度で3時間反応後、ア
ゾビスイソブチロニトリル0.07部、トルエン5部を
加え、更に4時間反応し、トルエンにて希釈してアセト
アセチル基含有アクリル系重合体(a1)溶液(樹脂分
40%、粘度11000mPa・s(25℃))を得
た。Example 3 [Acetoacetyl group-containing acrylic polymer (a1) having a functional group in the molecule] 75 parts of butyl acrylate, 2-
20 parts of hydroxyethyl acrylate, 5 parts of acetoacetylated 2-hydroxyethyl methacrylate used in Example 1 and 80 parts of ethyl acetate were charged, and after heating under reflux, azobisisobutyronitrile 0.1 part was used as a polymerization initiator.
After adding 3 parts at the reflux temperature of ethyl acetate, 0.07 parts of azobisisobutyronitrile and 5 parts of toluene were added, and the mixture was further reacted for 4 hours. A polymer (a1) solution (resin content 40%, viscosity 11,000 mPa · s (25 ° C.)) was obtained.
【0062】[エチレン性不飽和基及びアセトアセチル
基を含有するアクリル系粘着剤(A)]得られたアセト
アセチル基含有アクリル系重合体(a1)溶液(樹脂分
40%)100部に、ジラウリル酸ジ−n−ブチルスズ
0.004部、ヒドロキノンモノエチルエーテル0.0
06部及び官能基含有不飽和化合物として2−メタクリ
ロイルオキシエチルイソシアネート(a2)6.6部を
仕込み、50℃で20時間反応させて、最後にトルエン
にて希釈し、側鎖にエチレン性不飽和基を、2−ヒドロ
キシエチルアクリレートに対して60モル%付加したア
クリル系粘着剤(A)溶液(樹脂分35%、粘度190
0mPa・s(25℃))を得た。[Acrylic pressure-sensitive adhesive containing ethylenically unsaturated group and acetoacetyl group (A)] Dilauryl was added to 100 parts of the obtained acetoacetyl group-containing acrylic polymer (a1) solution (resin content: 40%). 0.004 part of di-n-butyltin acid, hydroquinone monoethyl ether 0.0
06 parts and 6.6 parts of 2-methacryloyloxyethyl isocyanate (a2) as a functional group-containing unsaturated compound were charged, reacted at 50 ° C. for 20 hours, finally diluted with toluene, and ethylenically unsaturated in the side chain. Adhesive (A) solution in which a group is added to 2-hydroxyethyl acrylate at 60 mol% (resin content 35%, viscosity 190
0 mPa · s (25 ° C.)).
【0063】かかるアクリル系粘着剤(A)の重量平均
分子量は56万で、エチレン性不飽和基の個数は重量平
均分子量1万当たり2.5個、アセトアセチル基の含有
量は4.3重量%であった。上記アクリル系粘着剤
(A)溶液を用いて実施例1と同様にして再剥離型粘着
剤組成物溶液を得、実施例1と同様の評価を行った。The acrylic pressure-sensitive adhesive (A) has a weight average molecular weight of 560,000, the number of ethylenically unsaturated groups is 2.5 per 10,000 weight average molecular weight, and the content of acetoacetyl group is 4.3 weight. %Met. Using the acrylic pressure-sensitive adhesive (A) solution, a removable pressure-sensitive adhesive composition solution was obtained in the same manner as in Example 1, and the same evaluation as in Example 1 was performed.
【0064】実施例4 実施例3において、エチレン性不飽和基及びアセトアセ
チル基を含有するアクリル系粘着剤(A)を下記の如く
変更した以外は同様に行い、再剥離型粘着剤組成物を
得、実施例1と同様の評価を行った。Example 4 A peelable pressure-sensitive adhesive composition was prepared in the same manner as in Example 3, except that the acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group was changed as follows. The same evaluation as in Example 1 was performed.
【0065】[エチレン性不飽和基及びアセトアセチル
基を含有するアクリル系粘着剤(A)]実施例3におい
て、2−メタクリロイルオキシエチルイソシアネート
(a2)を11.2部に変更し、側鎖にエチレン性不飽
和基を、2−ヒドロキシエチルアクリレートに対して1
05モル%付加した以外は同様に行い、アクリル系粘着
剤(A)溶液(樹脂分35%、粘度1850mPa・s
(25℃))を得た。かかるアクリル系粘着剤(A)の
重量平均分子量は57万で、エチレン性不飽和基の個数
は重量平均分子量1万当たり4.5個、アセトアセチル
基の含有量は3.1重量%であった。[Acrylic pressure-sensitive adhesive containing an ethylenically unsaturated group and an acetoacetyl group (A)] In Example 3, 2-methacryloyloxyethyl isocyanate (a2) was changed to 11.2 parts and the side chain was changed to An ethylenically unsaturated group is added to 2-hydroxyethyl acrylate
Acrylic pressure-sensitive adhesive (A) solution (resin content 35%, viscosity 1850 mPa · s)
(25 ° C.)). The weight-average molecular weight of the acrylic pressure-sensitive adhesive (A) was 570,000, the number of ethylenically unsaturated groups was 4.5 per 10,000, and the content of acetoacetyl groups was 3.1% by weight. Was.
【0066】実施例5 実施例1において、1−ヒドロキシシクロヘキシルフェ
ニルケトン(B)(日本チバガイギー社製、「イルガキ
ュア184」)を、ベンジルジメチルケタール(日本チ
バガイギー社製、「イルガキュア651」)1部に変更
した以外は同様に行い、再剥離型粘着剤組成物を得、実
施例1と同様の評価を行った。Example 5 In Example 1, 1 part of 1-hydroxycyclohexyl phenyl ketone (B) (Irgacure 184, manufactured by Ciba-Geigy Japan) was added to 1 part of benzyl dimethyl ketal (Irgacure 651, manufactured by Ciba-Geigy Japan). Except having changed, it carried out similarly and obtained the removable pressure-sensitive adhesive composition, and performed the same evaluation as Example 1.
【0067】実施例6 実施例1において、トリメチロールプロパンのトリレン
ジイソシアネート付加物の55%酢酸エチル溶液(C)
(日本ポリウレタン社製、「コロネートL−55E」)
を、ポリアミド系化合物(日本合成化学工業社製、「コ
ーポニールN−3331」)0.25部に変更した以外
は同様に行い、再剥離型粘着剤組成物を得、実施例1と
同様の評価を行った。Example 6 In Example 1, a 55% solution of tolylene diisocyanate adduct of trimethylolpropane in ethyl acetate (C)
("Coronate L-55E", manufactured by Nippon Polyurethane Co.)
Was changed to 0.25 parts of a polyamide-based compound (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., "Corponyl N-3331"), and a removable pressure-sensitive adhesive composition was obtained. An evaluation was performed.
【0068】比較例1 実施例1で得られたアセトアセチル基含有アクリル系重
合体(a1)溶液(樹脂分40%)100部に、2−メ
タクリロイルオキシエチルイソシアネート(a2)を反
応させることなく、1−ヒドロキシシクロヘキシルフェ
ニルケトン(B)(日本チバガイギー社製、「イルガキ
ュア184」)1.14部、トリメチロールプロパンの
トリレンジイソシアネート付加物の55%酢酸エチル溶
液(日本ポリウレタン社製、「コロネートL−55
E」)0.29部を加えて撹拌し均一な溶液として再剥
離型粘着剤組成物溶液を得、実施例1と同様の評価を行
った。Comparative Example 1 100 parts of the acetoacetyl group-containing acrylic polymer (a1) solution (resin content: 40%) obtained in Example 1 was reacted without reacting 2-methacryloyloxyethyl isocyanate (a2). 1.14 parts of 1-hydroxycyclohexyl phenyl ketone (B) ("Irgacure 184", manufactured by Ciba-Geigy Japan) and a 55% ethyl acetate solution of tolylene diisocyanate adduct of trimethylolpropane (manufactured by Nippon Polyurethanes, "Coronate L- 55
E ") 0.29 part was added and stirred to obtain a removable pressure-sensitive adhesive composition solution as a uniform solution. The same evaluation as in Example 1 was performed.
【0069】比較例2 ブチルアクリレート80部、2−ヒドロキシエチルメタ
クリレート20部及び酢酸エチル80部を仕込み、加熱
還流開始後、重合開始剤としてアゾビスイソブチロニト
リル0.07部を加え、酢酸エチル還流温度で3時間反
応後、アゾビスイソブチロニトリル0.07部、トルエ
ン5部を加え、更に4時間反応し、トルエンにて希釈し
てアクリル系重合体溶液(樹脂分35%、粘度1500
0mPa・s(25℃))を得た後、該アクリル系重合
体溶液(樹脂分35%)100部に、ジラウリル酸ジ−
n−ブチルスズ0.004部、ヒドロキノンモノエチル
エーテル0.006部及び官能基含有不飽和化合物とし
て2−メタクリロイルオキシエチルイソシアネート(a
2)7.6部を仕込み、50℃で20時間反応させて、
最後にトルエンにて希釈し、側鎖にエチレン性不飽和基
を、2−ヒドロキシエチルアクリレートに対して80モ
ル%付加したアクリル系粘着剤溶液(樹脂分30%、粘
度2500mPa・s(25℃))を得た。Comparative Example 2 80 parts of butyl acrylate, 20 parts of 2-hydroxyethyl methacrylate and 80 parts of ethyl acetate were charged, and after heating under reflux, 0.07 part of azobisisobutyronitrile was added as a polymerization initiator, and ethyl acetate was added. After reacting at the reflux temperature for 3 hours, azobisisobutyronitrile (0.07 part) and toluene (5 parts) were added, and the mixture was further reacted for 4 hours, diluted with toluene and diluted with an acrylic polymer solution (resin content 35%, viscosity 1500).
0 mPa · s (25 ° C.)), 100 parts of the acrylic polymer solution (resin content 35%) was added to dilaurate di-
0.004 part of n-butyltin, 0.006 part of hydroquinone monoethyl ether and 2-methacryloyloxyethyl isocyanate (a
2) Charge 7.6 parts, react at 50 ° C. for 20 hours,
Lastly, the mixture was diluted with toluene, and an acrylic pressure-sensitive adhesive solution in which an ethylenically unsaturated group was added to the side chain at 80 mol% with respect to 2-hydroxyethyl acrylate (resin content: 30%, viscosity: 2500 mPa · s (25 ° C.) ) Got.
【0070】かかるアクリル系粘着剤の重量平均分子量
は52万で、エチレン性不飽和基の個数は重量平均分子
量1万当たり3.36個であった。上記アクリル系粘着
剤溶液を用いて実施例1と同様にして再剥離型粘着剤組
成物溶液を得、実施例1と同様の評価を行った。The weight average molecular weight of this acrylic pressure-sensitive adhesive was 520,000, and the number of ethylenically unsaturated groups was 3.36 per 10,000 weight average molecular weight. Using the acrylic pressure-sensitive adhesive solution described above, a removable pressure-sensitive adhesive composition solution was obtained in the same manner as in Example 1, and the same evaluation as in Example 1 was performed.
【0071】比較例3 ブチルアクリレート64部、メチルメタクリレート30
部、アクリル酸1部、2−ヒドロキシエチルメタクリレ
ート5部及び酢酸エチル90部を仕込み、加熱還流開始
後、重合開始剤としてアゾビスイソブチロニトリル0.
07部を加え、酢酸エチル還流温度で3時間反応後、ア
ゾビスイソブチロニトリル0.07部、トルエン5部を
加え、更に4時間反応し、トルエンにて希釈してアクリ
ル系重合体溶液(樹脂分35%、粘度14500mPa
・s(25℃))を得、該アクリル系重合体溶液(樹脂
分35%)100部に、ジラウリル酸ジ−n−ブチルス
ズ0.004部、ヒドロキノンモノエチルエーテル0.
006部及び官能基含有不飽和化合物として2−メタク
リロイルオキシエチルイソシアネート(a2)1.9部
を仕込み、50℃で30時間反応させて、最後にトルエ
ンにて希釈し、側鎖にエチレン性不飽和基を、2−ヒド
ロキシエチルアクリレートに対して80モル%付加した
アクリル系粘着剤溶液(樹脂分30%、粘度2800m
Pa・s(25℃))を得た。Comparative Example 3 64 parts of butyl acrylate, 30 of methyl methacrylate
Parts, 1 part of acrylic acid, 5 parts of 2-hydroxyethyl methacrylate and 90 parts of ethyl acetate, and after heating under reflux, azobisisobutyronitrile 0.1 part was used as a polymerization initiator.
After adding 3 parts at the reflux temperature of ethyl acetate, 0.07 parts of azobisisobutyronitrile and 5 parts of toluene were added, and the mixture was further reacted for 4 hours, diluted with toluene and diluted with an acrylic polymer solution ( Resin content 35%, viscosity 14500mPa
S (25 ° C.)), and 0.004 part of di-n-butyltin dilaurate and 0.1 part of hydroquinone monoethyl ether were added to 100 parts of the acrylic polymer solution (resin content: 35%).
006 parts and 1.9 parts of 2-methacryloyloxyethyl isocyanate (a2) as a functional group-containing unsaturated compound were charged, reacted at 50 ° C. for 30 hours, finally diluted with toluene, and ethylenically unsaturated in the side chain. Pressure-sensitive adhesive solution (resin content 30%, viscosity 2800 m
Pa · s (25 ° C.)).
【0072】かかるアクリル系粘着剤の重量平均分子量
は49万で、エチレン性不飽和基の個数は重量平均分子
量1万当たり0.78個であった。上記アクリル系粘着
剤溶液を用いて実施例1と同様にして再剥離型粘着剤組
成物溶液を得、実施例1と同様の評価を行った。The weight average molecular weight of this acrylic pressure-sensitive adhesive was 490,000, and the number of ethylenically unsaturated groups was 0.78 per 10,000 weight average molecular weight. Using the acrylic pressure-sensitive adhesive solution described above, a removable pressure-sensitive adhesive composition solution was obtained in the same manner as in Example 1, and the same evaluation as in Example 1 was performed.
【0073】比較例4 ブチルアクリレート64部、メチルメタクリレート30
部、アクリル酸1部、2−ヒドロキシエチルメタクリレ
ート5部及び酢酸エチル90部を仕込み、加熱還流開始
後、重合開始剤としてアゾビスイソブチロニトリル0.
07部を加え、酢酸エチル還流温度で3時間反応後、ア
ゾビスイソブチロニトリル0.07部、トルエン5部を
加え、更に4時間反応し、トルエンにて希釈してアクリ
ル系重合体溶液(樹脂分35%、粘度14500mPa
・s(25℃))を得、該アクリル系重合体溶液(樹脂
分35%)100部に、下記のウレタンアクリレート2
5部、1−ヒドロキシシクロヘキシルフェニルケトン
(B)(日本チバガイギー社製、「イルガキュア18
4」)0.85部、トリメチロールプロパンのトリレン
ジイソシアネート付加物の55%酢酸エチル溶液(C)
(日本ポリウレタン社製、「コロネートL−55E」)
0.35部を加えて撹拌し均一な溶液として再剥離型粘
着剤組成物溶液を得、実施例1と同様の評価を行った。Comparative Example 4 64 parts of butyl acrylate, 30 of methyl methacrylate
Parts, 1 part of acrylic acid, 5 parts of 2-hydroxyethyl methacrylate and 90 parts of ethyl acetate, and after heating under reflux, azobisisobutyronitrile 0.1 part was used as a polymerization initiator.
After adding 3 parts at the reflux temperature of ethyl acetate, 0.07 parts of azobisisobutyronitrile and 5 parts of toluene were added, and the mixture was further reacted for 4 hours, diluted with toluene and diluted with an acrylic polymer solution ( Resin content 35%, viscosity 14500mPa
.S (25 ° C.)), and the following urethane acrylate 2 was added to 100 parts of the acrylic polymer solution (resin content: 35%).
5 parts, 1-hydroxycyclohexylphenyl ketone (B) (manufactured by Nippon Ciba Geigy, "Irgacure 18")
4 ") 0.85 part of a 55% solution of tolylene diisocyanate adduct of trimethylolpropane in ethyl acetate (C)
("Coronate L-55E", manufactured by Nippon Polyurethane Co.)
0.35 parts was added and stirred to obtain a removable pressure-sensitive adhesive composition solution as a uniform solution, and the same evaluation as in Example 1 was performed.
【0074】[ウレタンアクリレート]イソホロンジイ
ソシアネート17.5部、ジペンタエリスリトールペン
タアクリレート82.5部、ジラウリル酸ジ−n−ブチ
ルスズ0.02部、ヒドロキノンモノエチルエーテル
0.03部を仕込み50℃にて7時間反応させ、重量平
均分子量1300のウレタンアクリレートを得た。[Urethane acrylate] 17.5 parts of isophorone diisocyanate, 82.5 parts of dipentaerythritol pentaacrylate, 0.02 part of di-n-butyltin dilaurate, and 0.03 part of hydroquinone monoethyl ether were charged at 50 ° C. The reaction was carried out for 7 hours to obtain a urethane acrylate having a weight average molecular weight of 1300.
【0075】比較例5 実施例1で得られたアセトアセチル基含有アクリル系重
合体(a1)溶液(樹脂分40%)100部に、2−メ
タクリロイルオキシエチルイソシアネート(a2)を反
応させることなく、上記比較例4で用いたウレタンアク
リレート25部、1−ヒドロキシシクロヘキシルフェニ
ルケトン(B)(日本チバガイギー社製、「イルガキュ
ア184」)0.85部、トリメチロールプロパンのト
リレンジイソシアネート付加物の55%酢酸エチル溶液
(日本ポリウレタン社製、「コロネートL−55E」)
0.35部を加えて撹拌し均一な溶液として再剥離型粘
着剤組成物溶液を得、実施例1と同様の評価を行った。
実施例及び比較例の評価結果を表1に示す。Comparative Example 5 100 parts of the acetoacetyl group-containing acrylic polymer (a1) solution (resin content: 40%) obtained in Example 1 was reacted without reacting 2-methacryloyloxyethyl isocyanate (a2). 25 parts of the urethane acrylate used in Comparative Example 4, 0.85 part of 1-hydroxycyclohexylphenyl ketone (B) (“Irgacure 184”, manufactured by Ciba-Geigy Japan), 55% acetic acid of tolylene diisocyanate adduct of trimethylolpropane Ethyl solution (manufactured by Nippon Polyurethanes, "Coronate L-55E")
0.35 parts was added and stirred to obtain a removable pressure-sensitive adhesive composition solution as a uniform solution, and the same evaluation as in Example 1 was performed.
Table 1 shows the evaluation results of the examples and the comparative examples.
【0076】 〔表1〕 初期粘着力 耐久性 再剥離性 耐汚染性 非腐食性 (g/25mm) (g/25mm) 実施例1 520 520 ○ ○ 20 20 ○ ○ ○ 〃 2 810 820 ○ ○ 14 15 ○ ○ ○ 〃 3 505 515 ○ ○ 20 20 ○ ○ ○ 〃 4 750 770 ○ ○ 15 15 ○ ○ ○ 〃 5 500 510 ○ ○ 21 22 ○ ○ ○ 〃 6 550 565 ○ ○ 18 19 ○ ○ ○ 比較例1 340 345 ○ ○ 150 160 △ △ ○ 〃 2 170 180 × × 13 12 ○ ○ ○ 〃 3 330 340 ○ ○ 60 65 ○ ○ × 〃 4 310 310 ○ ○ 20 22 △ △ × 〃 5 430 435 ○ ○ 12 13 △ △ ○ [Table 1] Initial adhesive strength Durability Removability Stain resistance Non-corrosive(g / 25mm) (g / 25mm) Example 1 520 520 ○ 20 20 20 ○ ○ 〃 〃 2 810 820 〃 14 14 15 ○ ○ 〃 〃 3 505 515 ○ 20 20 20 ○ ○ 〃 4 4 750 770 ○ 15 15 15 ○ ○ 〃 5 5 500 510 ○ ○ 21 22 ○ ○ ○6 6 550 565 ○ ○ 18 19 ○ ○ ○ Comparative Example 1 340 345 ○ ○ 150 160 △ △ ○ 〃 2 170 180 × × 13 12 ○ ○ ○ 3 3 330 340 ○ ○ 60 65 ○ ○ × 4 4 310 310 ○ ○ 20 22 △ △ ×5 5 430 435 ○ ○ 12 13 △ △ ○
【0077】[0077]
【発明の効果】本発明の再剥離型粘着剤組成物は、エチ
レン性不飽和基及びアセトアセチル基を含有するアクリ
ル系粘着剤(A)、光重合開始剤(B)及び架橋剤
(C)を含有してなるため、初期粘着力、高温下での耐
久性、再剥離性に優れ、更に剥離後の耐汚染性、非腐食
性に優れた効果を示すものであり、金属板、ガラス板、
プラスチック板等一時的な表面保護用或いは仮接着用の
粘着シートや半導体ウエハ等のダイシング工程の半導体
固定用の粘着シートに用いられる粘着剤として非常に有
用である。The removable pressure-sensitive adhesive composition of the present invention comprises an acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group, a photopolymerization initiator (B) and a crosslinking agent (C). It is excellent in initial adhesive strength, durability under high temperature and re-peelability, and also shows excellent effects of stain resistance and non-corrosion after peeling, metal plate, glass plate ,
It is very useful as an adhesive used for an adhesive sheet for temporary surface protection or temporary adhesion such as a plastic plate or an adhesive sheet for fixing a semiconductor in a dicing process such as a semiconductor wafer.
フロントページの続き Fターム(参考) 4J040 EB112 EB132 EC032 EC062 EF301 EF311 EG002 FA231 GA05 GA06 GA07 GA11 GA13 GA22 GA25 HB17 HB19 HC04 HC05 HC09 HC22 HC25 HD19 HD41 JA09 JB09 KA13 KA16 LA06 LA07 LA08 MA02 MA05 MA10 MB05 PA20 PA42 Continued on the front page F-term (reference) 4J040 EB112 EB132 EC032 EC062 EF301 EF311 EG002 FA231 GA05 GA06 GA07 GA11 GA13 GA22 GA25 HB17 HB19 HC04 HC05 HC09 HC22 HC25 HD19 HD41 JA09 JB09 KA13 KA16 LA06 LA07 LA08 MA02 MA05 MA10 MB05 PA05
Claims (5)
基を含有するアクリル系粘着剤(A)、光重合開始剤
(B)及び架橋剤(C)を含有してなることを特徴とす
る再剥離型粘着剤組成物。1. Re-peeling characterized by comprising an acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group, a photopolymerization initiator (B) and a crosslinking agent (C). Type pressure-sensitive adhesive composition.
基を含有してなるアクリル系粘着剤(A)において、該
アクリル系粘着剤(A)の重量平均分子量1万当たりに
占めるエチレン性不飽和基の個数が0.1〜100個で
あることを特徴とする請求項1記載の再剥離型粘着剤組
成物。2. An acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group, wherein the ethylenically unsaturated group accounts for 10,000 per weight average molecular weight of the acrylic pressure-sensitive adhesive (A). 2. The removable pressure-sensitive adhesive composition according to claim 1, wherein the number of the adhesive is 0.1 to 100.
基を含有してなるアクリル系粘着剤(A)において、該
アクリル系粘着剤(A)中に占めるアセトアセチル基の
含有量が0.01〜40重量%であることを特徴とする
請求項1又は2記載の再剥離型粘着剤組成物。3. An acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group, wherein the content of the acetoacetyl group in the acrylic pressure-sensitive adhesive (A) is 0.01 to 0.01. 3. The removable pressure-sensitive adhesive composition according to claim 1, wherein the content is 40% by weight.
ン性不飽和基及びアセトアセチル基を含有してなるアク
リル系粘着剤(A)100重量部に対して0.1〜10
重量部であることを特徴とする請求項1〜3いずれか記
載の再剥離型粘着剤組成物。4. The content of the photopolymerization initiator (B) is 0.1 to 10 with respect to 100 parts by weight of an acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group.
The removable pressure-sensitive adhesive composition according to any one of claims 1 to 3, which is part by weight.
飽和基及びアセトアセチル基を含有してなるアクリル系
粘着剤(A)及び光重合開始剤(B)の合計100重量
部に対して0.005〜10重量部であることを特徴と
する請求項1〜4いずれか記載の再剥離型粘着剤組成
物。5. The content of the crosslinking agent (C) is 100 parts by weight of the total of the acrylic pressure-sensitive adhesive (A) containing an ethylenically unsaturated group and an acetoacetyl group and the photopolymerization initiator (B). The removable pressure-sensitive adhesive composition according to any one of claims 1 to 4, wherein the content is 0.005 to 10 parts by weight based on the weight of the pressure-sensitive adhesive composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000265035A JP4707809B2 (en) | 2000-09-01 | 2000-09-01 | Re-peelable pressure-sensitive adhesive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000265035A JP4707809B2 (en) | 2000-09-01 | 2000-09-01 | Re-peelable pressure-sensitive adhesive composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002069409A true JP2002069409A (en) | 2002-03-08 |
| JP4707809B2 JP4707809B2 (en) | 2011-06-22 |
Family
ID=18752365
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000265035A Expired - Lifetime JP4707809B2 (en) | 2000-09-01 | 2000-09-01 | Re-peelable pressure-sensitive adhesive composition |
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| JP2005325250A (en) * | 2004-05-14 | 2005-11-24 | Nitto Denko Corp | Pressure-sensitive adhesive sheets for application to metal surfaces and articles having metal surfaces |
| JP2006035277A (en) * | 2004-07-28 | 2006-02-09 | Nitto Denko Corp | Manufacturing method of laser processed product and pressure-sensitive adhesive sheet for laser processing |
| JP2006035270A (en) * | 2004-07-27 | 2006-02-09 | Nitto Denko Corp | Protective sheet for laser processing and method of manufacturing laser processed product using the same |
| JP2008143924A (en) * | 2006-12-06 | 2008-06-26 | Nitto Denko Corp | Re-peelable pressure-sensitive adhesive composition, and pressure-sensitive adhesive tape or sheet |
| JP2008214368A (en) * | 2007-02-28 | 2008-09-18 | Lintec Corp | Adhesive sheet |
| JP2009029947A (en) * | 2007-07-27 | 2009-02-12 | Cheil Industries Inc | Pressure-sensitive adhesive composition and optical member |
| JP2010106283A (en) * | 2010-01-05 | 2010-05-13 | Nitto Denko Corp | Re-peelable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet |
| JP2015131945A (en) * | 2013-12-10 | 2015-07-23 | 日本合成化学工業株式会社 | Adhesive composition, adhesive, adhesive sheet, surface protection adhesive and surface protection adhesive sheet |
| EP2975098A4 (en) * | 2013-03-11 | 2016-11-30 | Lintec Corp | ADHESIVE SHEET, AND METHODS FOR PRODUCING COMPONENTS ASSOCIATED WITH A PROCESSED DEVICE |
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| JP2005325250A (en) * | 2004-05-14 | 2005-11-24 | Nitto Denko Corp | Pressure-sensitive adhesive sheets for application to metal surfaces and articles having metal surfaces |
| JP2006035270A (en) * | 2004-07-27 | 2006-02-09 | Nitto Denko Corp | Protective sheet for laser processing and method of manufacturing laser processed product using the same |
| JP2006035277A (en) * | 2004-07-28 | 2006-02-09 | Nitto Denko Corp | Manufacturing method of laser processed product and pressure-sensitive adhesive sheet for laser processing |
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| JP2009029947A (en) * | 2007-07-27 | 2009-02-12 | Cheil Industries Inc | Pressure-sensitive adhesive composition and optical member |
| JP2010106283A (en) * | 2010-01-05 | 2010-05-13 | Nitto Denko Corp | Re-peelable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet |
| EP2975098A4 (en) * | 2013-03-11 | 2016-11-30 | Lintec Corp | ADHESIVE SHEET, AND METHODS FOR PRODUCING COMPONENTS ASSOCIATED WITH A PROCESSED DEVICE |
| JP2015131945A (en) * | 2013-12-10 | 2015-07-23 | 日本合成化学工業株式会社 | Adhesive composition, adhesive, adhesive sheet, surface protection adhesive and surface protection adhesive sheet |
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