JP2002069392A - Thermal conductive adhesive film, method for producing the same, and electronic component - Google Patents

Abstract

[PROBLEMS] An electronic component bonded with a thermally conductive adhesive film in which boron nitride powder having high thermal conductivity, excellent heat dissipation, good electrical insulation and good peeling strength is oriented in a certain direction. SOLUTION: A heat conductive adhesive film obtained by applying a magnetic field to a film composition containing boron nitride powder to orient and solidify the boron nitride powder in the composition in a certain direction, a method for producing the same, and an element that generates heat An electronic component characterized in that the heat transfer members are bonded with a heat conductive adhesive film in which boron nitride powder is oriented in a certain direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat conductive adhesive film requiring high heat conductivity, a method for producing the same, and an electronic component. More specifically, an electrically insulating heat conductive adhesive film capable of effectively dissipating heat generated from components such as a semiconductor element, a power source, and a light source used in an electric product, a method of manufacturing the same, and a heat radiation property. Electronic components.

[0002]

2. Description of the Related Art Conventionally, various heat conductive adhesive films have been used for the purpose of bonding a semiconductor element or the like that generates heat to a heat transfer member or an insulating substrate that dissipates heat and a metal foil or an electrode. These thermally conductive adhesive films include:
In order to increase thermal conductivity, metals, alloys and compounds with high thermal conductivity such as silver, copper, gold and aluminum, or aluminum oxide, magnesium oxide, silicon oxide, boron nitride, aluminum nitride, silicon nitride, silicon carbide, etc. A powdered or fibrous heat conductive filler such as electrically insulating ceramics, carbon black, graphite, diamond, etc. is blended. Above all, an electrically insulating heat conductive adhesive film filled with a boron nitride powder, an aluminum oxide powder, an aluminum nitride powder, or the like, which is excellent in heat conductivity and electric insulation, has been widely used.

[0003]

However, the hexagonal boron nitride powder is in the form of scales (flakes), and the thermal conductivity in the thickness direction (perpendicular to the plane) is greater in the plane direction (parallel to the plane). Direction) is smaller than the thermal conductivity in the case of an adhesive film obtained by simply blending boron nitride powder with a solid adhesive and spreading it, the plane direction of the scale-like boron nitride powder is This simple method did not provide an adhesive film having sufficient thermal conductivity because the film was filled parallel to the direction.

[0004] That is, since an adhesive film having good electric insulation and high thermal conductivity has not been developed, electrochemical migration is accelerated due to a large amount of heat generated from electronic parts such as semiconductor elements, or wiring and wiring. Corrosion of the pad part is promoted, cracks and breaks occur in the constituent materials due to the generated thermal stress, and various troubles that shorten the life of electronic components due to separation of the interface of the joints of the constituent materials have occurred. Was. On the other hand, in the heat conductive adhesive film of Japanese Patent Application No. 11-87482 by the present applicant,
Although a diamagnetic filler having a thermal conductivity of 20 W / m · K or more is oriented in a certain direction in a solid adhesive, boron nitride powder has not been considered as a diamagnetic filler.

[0005]

Means for Solving the Problems As a result of diligent studies for solving the above-mentioned problems, a heat conductive adhesive film in which boron nitride powder is oriented in a fixed direction in a solid adhesive has an electrical insulating property and a thermal conductivity. A method for producing a thermally conductive adhesive film utilizing the property of being excellent in conductivity and the property that boron nitride powder is oriented along a magnetic field line in a magnetic field, and providing an electronic component having excellent heat dissipation characteristics using the same. It is.

That is, the present invention is a heat conductive adhesive film characterized in that boron nitride powder is oriented in a fixed direction in a solid adhesive. Further, the present invention provides a method for producing a thermally conductive adhesive film, which comprises applying a magnetic field to a film composition containing boron nitride powder to orient and solidify the boron nitride powder in the composition in a certain direction, and An electronic component characterized in that the heat-generating element and the heat transfer member are bonded with a heat conductive adhesive film in which boron nitride powder is oriented in a certain direction.

The boron nitride powder used in the present invention does not specify the type of crystal system, the shape and size of the powder particles, the degree of aggregation of the powder particles, and their distribution. As the crystal system, hexagonal, cubic, wurtzite cubic, rhombohedral, and any other boron nitride powder can be used. Above all, the thermal conductivity is about several tens to 100 W / m · K, but the hexagonal structure that can be easily obtained or the thermal conductivity is 1300 W / m · K at the maximum.
Boron nitride powder having a cubic structure very large as K is preferable.

[0008] The particle shape of the boron nitride powder is not limited to scaly or flat, but may be various, such as granular, massive, spherical, fibrous, whisker-like, or a crushed product thereof. Can be used. Although the particle size of the boron nitride powder is not specified, the average primary particle size of each is 0.01 to 100 μm.
And more preferably in the range of 0.1 to 20 μm. If it is smaller than 0.01 μm, it becomes difficult to fill a large amount into the heat conductive adhesive film, and
Boron nitride powder larger than 00 μm is difficult to produce and disadvantageous in price. Further, when a thin adhesive film layer is required, it cannot be handled. In the case of scaly boron nitride powder, the range of 0.5 to 50 μm as the maximum diameter is practical because it is easy to mix the film with the film to orient the magnetic field. Further, a boron nitride powder having a structure in which primary particles are aggregated is used.

The concentration of the boron nitride powder in the heat conductive adhesive film is preferably 2 to 80% by volume. If it is less than 2% by volume, the effect of improving thermal conductivity is small, and
If the content exceeds 10% by volume, the viscosity of the composition increases, the fluidity is impaired, the handling becomes difficult, and the incorporation of air bubbles is unavoidable, and the desired heat conductive adhesive film cannot be produced. It is. More preferably, the concentration of the boron nitride powder in the heat conductive adhesive film is 5 to 50% by volume,
More preferably, the content is 10 to 40% by volume. It is also possible to increase the concentration by using a combination of boron nitride powders having different powder particle diameters or by performing a surface treatment.

The solid adhesive used in the present invention includes:
Epoxy-based, polyimide-based, acrylic-based, which becomes solid at room temperature or becomes semi-cured by heating etc.
Vinyl-based such as polyvinyl acetate, urethane-based, silicone-based, olefin-based, polyamide-based, polyamide-imide-based, phenol-based, amino-based, bismaleimide-based, polyimide silicone-based, saturated and unsaturated polyester-based, diallyl phthalate-based, urea Materials made of known resins and rubbers such as styrene, melamine, alkyd, benzocyclobutene, synthetic rubber such as polybutadiene, chloroprene rubber, and nitrile rubber, natural rubber, and styrene thermoplastic elastomer are preferable.

As for the curing mode, any of known adhesive curing polymers such as thermosetting property, ultraviolet ray / visible light curing property, room temperature curing property, and moisture curing property can be used. Above all,
At least one thermosetting solid selected from epoxy, polyimide, acrylic, urethane, and silicone, which has good adhesion to various metals, ceramics, plastics, rubbers, and elastomers of materials that make up electronic components Shaped adhesives are preferred.

Further, when the solid adhesive is thermosetting, a heat conductive adhesive film in which a boron nitride powder is blended and orientated in a certain direction and then semi-cured such as a B stage is used. It is preferable in terms of reliability. In addition, for the purpose of surface treatment of boron nitride powder, a heat conductive adhesive film in which the surface of boron nitride powder is treated with a known coupling agent to improve wettability with a solid adhesive or to improve filling properties. It is possible to obtain

The heat-conductive adhesive film of the present invention contains a solvent, a thixotropic agent, a dispersant, a curing agent, a curing accelerator, a retarder, a tackifier, a plasticizer, a flame retardant, an antioxidant, and a stabilizer. A known additive such as a colorant can be blended. Particularly when the viscosity of the composition when the solid adhesive and the boron nitride powder are blended is large, the magnetic field orientation of the boron nitride powder can be promoted by adding a solvent to reduce the viscosity of the composition. it can.

[0014] Further, conventional heats such as powdered or fibrous metals and ceramics, such as silver, copper, gold, aluminum oxide, magnesium oxide, aluminum nitride, silicon nitride, silicon carbide, and metal-coated resins. It is also possible to appropriately use a filler or the like used for the conductive film in combination. However, one of the features of the heat conductive adhesive film of the present invention is that it has excellent electrical insulation properties, and it is preferable that a filler such as a metal having high conductivity be mixed as little as possible.

The thickness of the film is not specified, but is preferably in the range of 10 μm to 2 mm.
When the boron nitride powder to be blended is oriented in the thickness direction, it is preferable that the film thickness be larger than the oriented maximum length of the boron nitride powder to be used because the heat conductive adhesive film tends to be flat.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION As a method for orienting boron nitride powder in a solid adhesive in a certain direction, a method using a flow field or a shear field, a method using a magnetic field, a method using an electric field, and the like are mentioned. Can be In any case, the boron nitride powder can be oriented in a fixed direction in the solid adhesive, and the heat conductive adhesive film of the present invention can be obtained.

However, in the present invention, the method of applying the magnetic field to orient the boron nitride powder by utilizing the anisotropy of the diamagnetic susceptibility of the boron nitride powder is particularly effective in orienting the boron nitride powder in an arbitrary direction. This is suitable as a method for easily producing a heat conductive adhesive film having excellent heat conductivity. That is, a feature of the method for producing a thermally conductive adhesive film of the present invention is to apply a magnetic field to a film composition containing boron nitride powder to orient and solidify the boron nitride powder in the composition in a certain direction.

An external magnetic field is applied to orient the boron nitride powder in the film composition in a certain direction along the lines of magnetic force, making use of the high thermal conductivity of the oriented boron nitride powder to significantly improve the thermal conductivity in a certain direction. Thus, a thermally conductive adhesive film can be obtained. For example, in order to align and orient the boron nitride powder in the thickness direction (direction perpendicular to the plane) of the thermally conductive adhesive film, the N pole and the S pole of a permanent magnet or an electromagnet are opposed in the thickness direction, and the direction of the lines of magnetic force is desired. Is provided so as to correspond to the orientation direction of the boron nitride powder.

On the other hand, in the case where the thermal conductivity in a certain direction is improved in a vertical direction perpendicular to the plane in the plane of the heat conductive adhesive film and in a horizontal direction parallel to the plane or in a direction parallel to the vertical and horizontal planes,
If the N and S poles of the magnet are opposed to each other in a direction perpendicular to the plane, the boron nitride powder can be oriented in a direction parallel to the plane in the plane. Alternatively, the N and N poles of the magnet or S
Even when the pole and the S pole are opposed to each other in the thickness direction, the boron nitride powder can be aligned in a direction parallel to the in-plane plane. Further, the lines of magnetic force need not necessarily be linear, but may be curved, rectangular, or two or more directions. That is, it is possible to impart anisotropy of thermal conductivity by orienting the boron nitride powder in any given direction. Further, it is not always necessary to oppose both sides of the magnet, and it is possible to orient the boron nitride powder in the film composition by using a magnet arranged only on one side.

The magnetic field generating means used as the external magnetic field may be a permanent magnet, an electromagnet, or a coil, but the magnetic flux density in the range of 0.05 to 30 Tesla can achieve a practical orientation of the boron nitride powder.
Further, the present invention utilizes the very weak diamagnetic anisotropic susceptibility of boron nitride powder, so that in a stronger magnetic field atmosphere, the boron nitride powder is sufficiently oriented and then subjected to a thermosetting reaction or cooling. The matrix needs to be solidified. A preferred magnetic flux density for easy orientation is 0.5 Tesla or more, more preferably 1 Tesla or more.

In order to improve the wettability and adhesion between the boron nitride powder and the solid adhesive, the surface of the boron nitride powder is previously degreased or washed, or a silane, titanium or aluminum coupling is used. By performing the surface treatment with the agent, a larger amount of boron nitride powder can be easily dispersed and mixed, and the thermal conductivity of the resulting thermally conductive adhesive film can be further increased.

The electronic component of the present invention can be manufactured by bonding the heat generating element and the heat transfer member with the heat conductive adhesive film of the present invention. Examples of the heat transfer member include ordinary radiators and coolers, heat sinks, heat spreaders, lead frames, die pads, printed boards, cooling fans, heat pipes, housings, and the like. Also,
It can also be used for the purpose of bonding metal foil for printed wiring boards such as copper foil and electrodes.

Hereinafter, the present invention will be described in more detail with reference to Examples. In addition, the thermal conductivity in an Example and a comparative example was measured by the laser flash method. The 90-degree peel strength of the copper foil was sandwiched between a 35-μm-thick copper foil and a 1.5-mm-thick aluminum plate according to JIS C6471 and bonded by pressure heating at 170 ° C. for 30 minutes at a pressure of 2 MPa. Measured on samples. The volume resistivity was measured according to JIS-K6911.

[0024]

Example 1 45 parts by weight of a bisphenol A type epoxy resin (Epicoat 828 manufactured by Yuka Shell Epoxy Co., Ltd.), 15 parts by weight of a cresol novolak type epoxy resin (ESCN001 manufactured by Sumitomo Chemical Co., Ltd.), and bisphenol A as a curing agent 40 parts by weight of a novolak resin (manufactured by Dainippon Ink and Chemicals, Inc .: LF2882), and 1-cyanoethyl-2-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd .: Cureazole 2PN-C) as a curing accelerator
N) 100 parts by weight of an epoxy-based solid adhesive composition comprising 1 part by weight of the same amount of methyl ethyl ketone was added to 100 parts by weight, and then the concentration of boron nitride powder in the final heat conductive adhesive film was 13 vol. %, A boron nitride powder (UHP-S1: manufactured by Showa Denko KK) having an average particle diameter of 1 to 2 μm was mixed and kneaded with three rolls, followed by vacuum defoaming.

The obtained epoxy-based thermally conductive adhesive film composition was applied to a 100 μm-thick single-sided release-treated polyethylene terephthalate sheet 11 by a doctor blade method, and was subjected to the method shown in FIGS. 5 (1) to 5 (3). In a magnetic field atmosphere where the N and S poles with a magnetic flux density of 6 Tesla
The resultant was dried by heating at 10 ° C. for 15 minutes to prepare a heat conductive adhesive film 3 in a B-stage state having a thickness of 120 μm. The thermal conductivity of the heat conductive adhesive film alone in the thickness direction is 1.8.
W / mK, 90 degree peel strength is 1.4kN / m,
The volume resistivity was 10 ¹² Ω · cm. FIG. 1 shows an example of an electronic component in which the ball grid array type semiconductor package 2 and the radiator 4 are bonded by the heat conductive adhesive film 3. FIG. 2 shows an example of an electronic component in which the chip size type semiconductor package 2 and the printed board 1 are bonded, and FIG. 3 shows an example of an electronic component in which the pin grid array type semiconductor package 2 and the heat sink 5 are bonded.

[0026]

Example 2 30 parts by weight of methyl methacrylate, 40 parts by weight of 2-hydroxyethyl methacrylate, 30 parts by weight of a styrene-based thermoplastic elastomer (Clayton G1650, manufactured by Shell Chemical Co., Ltd.), and Perhexa 3M (manufactured by NOF Corporation) as a curing agent ) To 100 parts by weight of the acrylic solid adhesive composition consisting of 3 parts by weight, add the same part by weight of a mixed solvent of toluene and methyl ethyl ketone, and then reduce the concentration of boron nitride powder in the final heat conductive adhesive film. Boron nitride powder (UHP-S1: average particle size: 1 to 2 μm, manufactured by Showa Denko KK) was mixed so as to have a volume of 13% by volume, kneaded with three rolls, and vacuum defoamed.

The resulting acrylic heat conductive adhesive film composition was applied on a 100 μm-thick single-sided release-treated polyethylene terephthalate sheet by a bar coater method.
Heat and dry at 120 ° C for 20 minutes in a magnetic field atmosphere where the N and S poles with a magnetic flux density of 6 Tesla face each other in the thickness direction.
A heat conductive adhesive film in a B-stage state of 0 μm was produced. The heat conductivity and peel strength of the obtained heat conductive adhesive film were measured, and the results are shown in Table 1.
The thermal conductivity, 90 degree peel strength, and volume resistivity were evaluated in the same manner as in Example 1, and the results are shown in Table 1.

[0028]

Examples 3 to 12 In the same manner as in Example 1, the same epoxy-based thermally conductive adhesive film as in Example 1 or the same acrylic-based thermally conductive adhesive film as in Example 2 having the concentrations shown in Table 1 was used. A composition having the boron nitride powder concentration described in 1 was used, and a heat conductive adhesive film was produced under the magnetic flux density conditions shown in the table. In addition, as the kind of the solid adhesive of the heat conductive adhesive film shown in Table 1, polyimide is a heat-curable polyimide, urethane is a heat-curable two-component urethane, and silicone is an addition-type liquid silicone rubber. It was used. The thermal conductivity, 90 degree peel strength, and volume resistivity were evaluated in the same manner as in Example 1, and the results are shown in Table 1.

[0029]

Comparative Example 1 45 parts by weight of a bisphenol A type epoxy resin (Epicoat 828 manufactured by Yuka Shell Epoxy Co., Ltd.), 15 parts by weight of a cresol novolak type epoxy resin (ESCN001 manufactured by Sumitomo Chemical Co., Ltd.), and bisphenol A as a curing agent 40 parts by weight of a novolak resin (manufactured by Dainippon Ink and Chemicals, Inc .: LF2882), and 1-cyanoethyl-2-methylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd .: Cureazole 2PN-C) as a curing accelerator
N) To 100 parts by weight of the epoxy-based solid adhesive composition consisting of 1 part by weight, the same part by weight of methyl ethyl ketone is added, and then the concentration of the boron nitride powder in the final heat conductive adhesive film is reduced to 13% by volume. Boron nitride powder (UHP-S1: Showa Denko KK)
μm) and kneaded with three rolls, followed by vacuum defoaming.

The obtained composition was applied on a 100 μm-thick single-sided release-treated polyethylene terephthalate sheet by a doctor blade method, and was applied at 110 ° C. without applying a magnetic field.
For 15 minutes to produce a B-staged thermally conductive adhesive film having a thickness of 120 μm. Thermal conductivity, 9
The 0-degree peel strength and the volume resistivity were evaluated in the same manner as in Example 1, and the results are shown in Table 1.

[0031]

[Comparative Example 2] Boron nitride powder (UHP-S manufactured by Showa Denko KK: average particle size: 1 to 2 µm) so that the concentration of boron nitride powder in the heat conductive adhesive film becomes 13% by volume.
Is heated at 110 ° C. for 15 minutes in a magnetic field atmosphere in which the N-pole and the S-pole have a magnetic flux density of 0.2 Tesla in the thickness direction in the same manner as in Example 1 using an epoxy-based solid adhesive composition containing It dried and produced the 120-micrometer-thick heat conductive adhesive film of the B stage state. The thermal conductivity, 90 degree peel strength, and volume resistivity were evaluated in the same manner as in Example 1, and the results are shown in Table 1.

[0032]

Comparative Examples 3 and 4 In the same manner as in Comparative Example 1, a film composition comprising the solid adhesive and the boron nitride powder at the concentrations shown in Table 1 was prepared. An adhesive film was prepared. The thermal conductivity, 90 degree peel strength, and volume resistivity were evaluated in the same manner as in Example 1, and the results are shown in Table 1.
It was noted in.

[0033]

Embodiment 13 The silicone-based heat conductive adhesive film 3 of Embodiment 5 of the present invention is used on a ball grid array type semiconductor package 2 mounted on a printed circuit board 1 shown in FIG. 2), the radiator 4 is arranged on the upper part as shown in FIG.
(4)) was prepared. The electronic component was energized, and the thermal resistance after 10 minutes was measured to be 0.27 ° C./W.

[0034]

COMPARATIVE EXAMPLE 5 In the same manner as in Example 13, a silicone-based heat conductive adhesive film 3 of Comparative Example 3 in Table 1 was used on a ball grid array type semiconductor package mounted on a printed circuit board, and a radiator 4 was provided on the upper part. An electronic component (FIG. 7) was prepared by placing and heating under pressure. As in Example 13, when the electronic component was energized and the thermal resistance after 10 minutes was measured,
0.38 ° C / W.

[0035]

Embodiment 14 As shown in FIGS. 8 (1) and 8 (2), between the die pad 7 of the lead frame 6 and the semiconductor chip 8, the epoxy-based heat conductive adhesive film 3 of Embodiment 1 of the present invention is provided.
8 (3), and heat-cured while applying a magnetic field having a magnetic flux density of 6 Tesla in the thickness direction with the magnet 12 arranged as shown in FIG. 8 (3). Further, the semiconductor chip 8 is connected with the bonding wire 9.
The electrode part was electrically connected to the lead part of the lead frame 11 (FIG. 8 (4)), and transfer-molded with the epoxy-based sealant 10 to manufacture an electronic component (FIG. 4). FIG.
(5) shows a state where the nitrogen boron powder in the heat conductive adhesive film is oriented. The electronic component was energized, and the thermal resistance after 10 minutes was measured to be 0.28 ° C./W.

[0036]

Comparative Example 6 As in Example 14, the die pad 7 of the lead frame 6 and the semiconductor chip 8 were cured by heating with the epoxy-based heat conductive adhesive film 3 of Comparative Example 1. Further, the electrode part of the semiconductor chip 8 and the lead part of the lead frame 11 were electrically connected with the bonding wire 9, and transfer-molded with the epoxy-based sealant 10, thereby producing the same electronic component as that of FIG. As in Example 14, when the electronic component was energized and the thermal resistance value was measured after 10 minutes,
0.42 ° C / W.

[0037]

[Table 1]

[0038]

Comparative Example 4 is an example in which boron nitride powder is not blended and has a low thermal conductivity. Comparative Examples 1 and 3 are examples of a thermally conductive adhesive film in which boron nitride powder is blended. However, since the boron nitride powder is not oriented in a certain direction without applying a magnetic field, the thermal conductivity is small and the heat dissipation property is low. Is inferior.
In Comparative Example 2, although the magnetic field was applied, the thermal conductivity was small because the orientation of the boron nitride powder was insufficient.

As in Examples 1 to 12, the heat conductive adhesive film of the present invention is obtained by orienting boron nitride powder in a constant thickness direction by applying a magnetic field. It has excellent electrical insulation and good peel strength. Further, as is apparent from Examples 13 and 14, the electronic component in which the boron nitride powder of the present invention is bonded with a thermally conductive adhesive film oriented in a certain direction is a semiconductor package having a large calorific value and a radiator such as a heat sink. It is possible to provide a useful electronic component having a low thermal resistance and excellent heat radiation characteristics by applying the bonding to a semiconductor chip or a die pad portion.

[Brief description of the drawings]

FIG. 1 shows an example of an electronic component (a ball grid array type semiconductor package 2) using a heat conductive adhesive film of the present invention.
(Used to bond the radiator 4 to the radiator 4)

FIG. 2 shows an example of an electronic component using the heat conductive adhesive film of the present invention (used for bonding a chip size semiconductor package 2 and a printed circuit board 1).

FIG. 3 shows an example of an electronic component using the heat conductive adhesive film of the present invention (used for bonding the pin grid array type semiconductor package 2 and the heat sink 5).

FIG. 4 shows an example of an electronic component using the heat conductive adhesive film of the present invention (used for bonding a semiconductor chip 8 and a die pad 7).

FIGS. 5 (1) to (3) are conceptual diagrams showing a method for producing the heat conductive adhesive film of the present invention.

FIGS. 6 (1) to (4) are conceptual diagrams showing a method for manufacturing the electronic component of the present invention of FIG. 1, and (5) is a conceptual diagram showing an orientation state of boron nitride powder in the heat conductive adhesive film of (4).

FIG. 7 shows an example of an electronic component using a conventional heat conductive adhesive film containing a filler.

8 is a method for manufacturing the electronic component of the present invention shown in FIG. 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed board 2 Semiconductor package 3 Heat conductive adhesive film 4 Heat sink 5 Heat sink 6 Lead frame 7 Die pad 8 Semiconductor chip 9 Bonding wire 10 Sealant 11 Polyethylene terephthalate sheet 12 Magnet 13 Oriented boron nitride powder

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tsunehisa Kimura 2-18-2 Shibasaki, Chofu-shi, Tokyo Excel Heights 301 (72) Inventor Masafumi Yamato 5-7-13-302 Minami-Osawa, Hachioji-shi, Tokyo F term (for reference) 4J004 AA05 AA06 AA07 AA08 AA09 AA10 AA11 AA12 AA13 AA14 AA15 AA16 AA18 AB03 BA02 FA05 FA10 4J040 CA001 DA001 DB001 DE001 DF001 DG001 EB021 EC001 ED001 EF001 EG001 E0403A02 MA03 HA031A02 BA23 BB21 BD21 5F047 BA21 BA33 BA54 BB03

Claims (6)

[Claims] 1. A thermally conductive adhesive film, wherein boron nitride powder is oriented in a fixed direction in a solid adhesive. 2. The heat conductive adhesive film according to claim 1, wherein the concentration of the boron nitride powder in the heat conductive adhesive film is 2 to 80% by volume. 3. The solid adhesive according to claim 1 or 2, wherein the solid adhesive is at least one selected from epoxy, polyimide, acrylic, urethane, vinyl, silicone and thermoplastic elastomers. Heat conductive adhesive film 4. The heat conductive adhesive film according to claim 1, wherein the solid adhesive is thermosetting and is in a semi-cured state. 5. A method for producing a thermally conductive adhesive film, comprising applying a magnetic field to a film composition containing boron nitride powder to orient and solidify the boron nitride powder in the composition in a certain direction. 6. An electronic component wherein the heat-generating element and the heat transfer member are bonded with a heat conductive adhesive film in which boron nitride powder is oriented in a predetermined direction.