JP2002066994A - Backing plate and drilling device and drilling method - Google Patents

Abstract

(57) [Summary] [Problem] To reduce the amount of use of a cover plate. An abutment plate (10) is formed in an elongated strip shape and wound around a supply roll (11). The backing plate 10 is taken up by a take-up roll 12, and a portion without a hole is continuously supplied to a boring position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backing plate which is used in close contact with the upper surface of a printed wiring board when drilling a printed wiring board or the like.

[0002]

2. Description of the Related Art Conventionally, when drilling a printed wiring board using a small drill, as shown in FIG.
For example, four printed wiring boards 3 are laminated, and a contact plate 1 is adhered to the upper surface thereof, and a bottom plate 2 is adhered to the lower surface thereof.
In order to prevent the floating of the printed circuit board, four printed wiring boards 3 are drilled together with the plate 1 with a small drill 4 while pressing the plate 1 with the pressure foot 5.
Next, the drilling machine table 6 to which the printed wiring board 3 is fixed and which is movable in the plane direction is moved to the next drilling position, so that drilling is performed according to the pattern of the printed wiring board 3. Go on. Further, during the drilling process, air is sucked from the inside of the pressure foot 5 to remove chips generated by the drilling, and the chips are collected.

[0003] Here, the contact plate 1 which is brought into close contact with the upper surface of the printed wiring board 3 is formed of a metal such as aluminum or an aluminum alloy, and is formed to have substantially the same size as the printed wiring board 3. The board 1 is placed on the upper surface of the printed wiring board 3 and attached by tape for use. Drilling is performed according to the pattern of the printed wiring board 3 as described above. After all the drilling is completed, the patch 1 is removed and discarded, and a new patch 1 is mounted on the next printed wiring board 3. Drilling is performed in the same manner as the pattern of the printed wiring board 3 by pasting with a tape.

[0004]

However, conventionally,
Since the position of the pattern of the printed wiring board 3 is uneven and the hole diameter to be drilled is small, only a very small portion of the backing plate 1 that is actually used effectively is used for the total area. However, since the backing plate 1 is expensive, the cost is extremely low. In addition, various types of the support plate 1 must be prepared in accordance with the size and shape of the printed wiring board 3, and almost the same type as the printed wiring board 3 must be prepared. In addition, in order to attach the contact board 1 to the upper surface of the printed wiring board 3 to be punched without any gap, a tape attaching operation is required on the edge portion, and each time the printed wiring board 3 or the small drill 4 is replaced. Since the work of attaching the plate 1 must be performed, enormous labor is required.

[0005] Further, since the cover plate 1 is adhered over the entire upper surface of the printed wiring board 3, if a chip discharge failure occurs, the back surface of the cover plate 1 and the upper surface of the printed circuit board 3 are connected. A gap is created between the two by the intrusion of chips between the two. As a result, when drilling is performed in the vicinity of the position where the chip discharge failure has occurred, the presence of the gap as described above continuously induces the chip to protrude into the gap, thereby causing the chip discharge. Failure occurs, resulting in poor hole quality, clogging of chips, and in the worst case, breakage of the drill. Also, the destination plate 1 is a printed wiring board 3
Therefore, the state of the drilling process of the printed wiring board 3 cannot be confirmed until all the drilling processes are completed and the plate 1 is removed. In the vicinity of the central portion of the printed wiring board 3, the plate 1 rises due to the warp of the plate 1 and the dust collected from the inside of the pressure foot 5, and the chip 1 rises in the same manner as the above-mentioned gap. It can cause poor discharge.

Further, as disclosed in Japanese Patent Application Laid-Open No. 5-177599, the plate 1 is attached to the side of a drilling machine on which a small drill is mounted. Some drilling methods are used.However, even if such a drilling method is used, it is necessary to attach a patch plate when replacing a printed wiring board or a small drill, or if the same hole is used. There remains a problem that the plate does not function to prevent displacement and burrs of the drill when drilling a diameter one.

The present invention has been made in view of the above problems, and has as its object to provide a reclamation plate, a perforator, and a perforation method capable of reducing the amount of the reclamation plate used.

[0008]

Means for Solving the Problems To solve the above problems,
In order to achieve such an object, the present invention relates to a contact plate which is brought into close contact with the upper surface of the printed wiring board and is drilled together with the printed wiring board when the printed wiring board is drilled. The plate is formed in an elongated strip shape, and is moved relative to the small drill each time one hole is drilled by, for example, a roll provided in the drilling device, and the portion without a hole is continuously connected to the next drilling position. It is characterized in that it is supplied on a regular basis. According to the present invention, the addressing plate can be effectively used without wasteful portions.
It is possible to reduce the use of the contact plate compared to the conventional one,
There is no need to prepare various plates according to the shape and size of the printed wiring board, which is economical. In addition, it is not necessary to attach the addressing plate to the upper surface of the printed wiring board with tape, and the working time can be reduced. Also, even in the event that chip discharge failure occurs, the perforated portion of the backing plate is moved relative to the printed circuit board and shifted each time the perforation is performed. Can be prevented from affecting other drilling. Further, since the backing plate is formed in an elongated strip shape, when the printed wiring board is moved so as to be shifted in the width direction of the backing plate, the state of the hole processing can be confirmed, and a hole processing defect or the like can be found. In addition, since the contact plate is formed in an elongated strip shape, appropriate tension can be easily applied to the contact plate that is in close contact with the printed wiring board. By giving the setting conditions of the plate, it is possible to prevent the rise of the plate.

[0009] The backing plate may be wound in a roll shape. With this configuration, the size of the device for supplying the backing plate can be reduced, and the size of the punching device itself can be reduced.

[0010] The backing plate wound in a roll shape may be housed in a cartridge, and the whole cartridge may be replaceable. With this configuration, when the supply plate has been used up, the replacement plate can be replaced simply by replacing the cartridge in which the supply plate is stored, thereby shortening the operation time.

[0011] Further, by moving the contact plate relative to the small drill in both directions in the longitudinal direction thereof, a portion having no hole is continuously supplied to the next drilling position. Is also good. With such a drilling method,
Since the non-drilled portion existing between the holes drilled in the backing plate can be supplied to the drilling position, the backing plate can be more effectively used.

[0012] Further, by moving the above-mentioned backing plate relative to the small drill also in the direction intersecting the length direction thereof, it is possible to continuously supply an unperforated portion to the next boring position. Good. By using such a perforation method, even if the width of the above-mentioned contact plate is increased to some extent, the entire area can be effectively used and most of the portion can be supplied to the perforation position, so that the plate until the replacement of the contact plate is changed. The number of perforations can be increased, and the number of times of replacement of the backing plate can be reduced.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the attached drawings, but the same or similar parts as those of the above-mentioned prior art will be denoted by the same reference numerals and description thereof will be omitted. FIG. 1 is a schematic front view showing a state in which a printed circuit board is punched by using a backing plate according to an embodiment of the present invention, and FIG. 2 is an enlarged perspective view of a main part in FIG.

The backing plate 10 according to the present embodiment is made of a metal such as aluminum or an aluminum alloy, which has a good bite of a drill and is easily prone to plastic deformation. Several mm
As shown in FIG. 1, it is wound around a supply roll 11 to form a roll. The width of the support plate 10 is formed slightly larger than the diameter of the small drill 4. The roll-shaped backing plate 10 wound around the supply roll 11 is wound in one direction by a winding roll 12 that is driven to rotate, and is rotated by a pair of pressing rolls 13 provided outside both ends of the printed wiring board 3. It is brought into close contact with the upper surface of the printed wiring board 3.

A method for making a hole in the printed wiring board 3 using the above-mentioned contact plate 10 will be described.
The printed wiring board 3 to be punched is formed by attaching aluminum foil, copper foil, glass fiber, or the like to a synthetic resin plate. For example, four printed wiring boards are stacked and moved in the same plane direction as the printed wiring board 3. It is fixed on a free punch table 6. Further, a bottom plate 2 made of, for example, a bakelite plate is in close contact with the lower surface of the printed wiring board 3 in which four sheets are stacked. On the upper surface of the printed wiring board 3 installed in this way, the support plate 10 wound around the supply roll 11
, Through a pair of pressing rolls 13, the winding roll 1
2 and is brought into close contact with the upper surface of the printed wiring board 3. In this state, the plate 10 is pressed with the pressure foot 5 and the small
Drilling is performed at a predetermined position of the pattern of the printed wiring boards 3. Further, in order to remove chips generated by the drilling process, air is sucked from the inside of the pressure foot 5 to collect the chips.

In order to perform drilling at the next drilling position, first, the drilling machine table 6 which is movable in the same plane direction as the printed wiring board 3 is moved, and immediately above the predetermined drilling position. So that the tip of the small drill 4 comes to the end. Simultaneously with the movement of the drilling machine table 6, as shown in FIG. 2, the backing plate 10 is wound up by the winding roll 12 by one hole, and the unperforated portion is located immediately below the small drill 4. Supplied. And a small drill 4
As a result, the next drilling process is performed. Further, the small drill 4 is exchanged according to the change of the hole diameter. By repeating the above operation, the boring process is performed according to the pattern of the printed wiring board 3.

Drilling is performed by using the above-described patching plate 10 and the drilling method, so that the patching plate 10 can be used effectively without wasteful portions. In addition, there is no need to prepare various addressing plates 10 according to the shape and size of the printed wiring board 3, which is economical. Further, it is not necessary to attach the addressing plate 10 to the upper surface of the printed wiring board 3 with tape, so that the working time can be reduced. Also, even in the event that a chip discharge failure occurs, the perforated portion of the backing plate 10 is moved relative to the printed wiring board 3 every time the perforation is performed, so that it is shifted. Influence on other drilling can be prevented. Further, the support plate 10
Is formed in an elongated strip shape, so that when the printed wiring board 3 is moved such that the printed wiring board 3 is shifted in the width direction of the support plate 10, the state of the hole processing can be confirmed, and a hole processing defect or the like can be found. Further, since the contact plate 10 is brought into close contact with the printed wiring board 3 with an appropriate tension by the pressing roll 13, the lifting of the contact plate 10 can be prevented.

Further, in the present embodiment, the take-up roll 12 winds the contact plate 10 only in one direction. However, the present invention is not limited to this. If possible, a portion of the backing plate 10 where no holes are drilled may be supplied to the drilling position. For example, after the feeding plate 10 is once supplied in one direction by the take-up roll 12, while the feeding plate 10 is rewound in the reverse direction, a hole is formed in a portion between the holes where no hole is present. You may make it dawn. By using such a perforation method, the backing plate 10 can be used more effectively without waste.

As a modification of the present embodiment, as shown in FIG. 3, a backing plate 20 having a wider width than the above embodiment may be used. In this case, in addition to winding the support plate 20 in both directions in its length direction, the drive mechanism provided on the supply roll 11 and the take-up roll 12 causes the support plate 20 to move in the direction intersecting the length direction. It is also effective to continuously move the non-perforated portion to the next perforated position by moving it. For example, as shown in FIG. 3, in the same manner as in the present embodiment, after the supply plate 20 is completely supplied in one direction by the winding roll 12, the support plate 20 is slightly moved in the width direction of the support plate 20. After that, the non-perforated portion of the backing plate 20 is supplied to the perforated position so as to be further rewound in the reverse direction. When such a drilling method is used, even if the width of the cover plate 20 is increased to some extent, the entire area thereof can be effectively used without waste, and most of the portion can be supplied to the drilling position. Thus, the number of drilling operations before the mounting is increased, and the number of replacement work of the support plate 20 can be reduced.

In this embodiment, the backing plate 10
Is in the form of a roll.
May be housed in a cartridge A as shown by a dashed line in FIG. With such a configuration, when the supply plate 10 to be supplied has been used up, the replacement plate 10 can be replaced simply by replacing the cartridge A in which the supply plate 10 is stored, and the working time can be reduced. .

[0021]

According to the present invention, the following effects can be obtained. In the present invention, the backing plate is formed in an elongated strip shape, and is relatively moved with respect to the small drill each time one drilling process is performed by a roll provided in the drilling device, and a portion where no hole is drilled is used to form the next hole. It is characterized in that it is supplied continuously to the position, so that it can be used effectively without wasted parts, the amount of used plate is smaller than before, and it can be adjusted according to the shape and size of the printed wiring board. It is economical because there is no need to prepare various plates. In addition, it is not necessary to attach the addressing plate to the upper surface of the printed wiring board with tape, and the working time can be reduced. Also,
In the unlikely event of chip ejection failure, the perforated part of the backing plate will be moved relative to the printed circuit board every time the perforation is performed and will shift, thus affecting other perforations. Can be prevented. Further, since the backing plate is formed in an elongated strip shape, when the printed wiring board is moved so as to be displaced in the width direction of the backing plate, the state of drilling can be confirmed, and defective drilling or the like can be found. Also, by being formed in the shape of an elongated strip, appropriate tension can be easily applied to the contact plate closely attached to the printed wiring board, and an appropriate contact plate can be provided at any position on the printed wiring board. By setting the setting conditions, it is possible to prevent the lifting plate from rising.

Further, the backing plate may be wound in a roll shape, and a device for supplying the backing plate is reduced in size, and the size of the punching device itself can be reduced. Also,
The contact plate wound in a roll shape is stored in the cartridge, and the cartridge may be replaceable.When the supply plate is completely used, the cartridge in which the contact plate is stored is used. The replacement plate can be replaced simply by replacement, and the working time can be reduced.

Further, the portion having no hole may be continuously supplied to the next drilling position while the above-mentioned contact plate is moved relative to the small drill in both directions in the longitudinal direction thereof. Since a portion of the backing plate where there is no hole between holes formed in the backing plate can be supplied to the drilling position, the backing plate can be more effectively used.

In addition, the plate may be moved relative to the small drill also in a direction intersecting the length direction thereof, so that a portion without a hole is continuously supplied to a next hole position. Even if the width of the cover plate is increased to some extent, the entire area can be effectively used without waste, so that the number of drilling times until the use of the cover plate is increased, and the number of replacement work of the cover plate can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic front view showing a state of drilling using a backing plate according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view of a main part showing a state of drilling using a backing plate according to the embodiment of the present invention.

FIG. 3 is an enlarged perspective view of a main part showing a state of drilling using a backing plate according to a modification of the embodiment of the present invention.

FIG. 4 is a schematic front view showing a state of conventional drilling.

[Explanation of symbols]

 2 Base plate 3 Printed wiring board 4 Small drill 5 Pressure foot 6 Drilling machine table 10, 20 Plate 11 Supply roll 12 Winding roll 13 Pressing roll A Cartridge

Claims (7)

[Claims] When drilling a printed wiring board,
A reclamation plate which is brought into close contact with the upper surface of the printed wiring board and is drilled together with the printed wiring board, wherein the reclamation plate is formed in an elongated strip shape. 2. The support plate according to claim 1, wherein the support plate is wound in a roll shape. 3. The backing plate according to claim 2, wherein the backing plate is housed in a cartridge, and the whole cartridge is replaceable. 4. A small drill for drilling a hole in a printed wiring board, and a printed wiring board having a plate adhered to an upper surface below the small drill, wherein a drilling position of the printed wiring board is determined. A drilling device that performs drilling by moving relatively to a small drill, The drilling process is performed while relatively moving the backing plate according to any one of claims 1 to 3 with respect to the small drill. A drilling device characterized in that the drilling is performed. 5. The drilling device according to claim 4, wherein the backing plate is movable relative to the small drill in both directions in the longitudinal direction. 6. The drilling device according to claim 4, wherein the backing plate is also moved relative to the small drill in a direction intersecting the length direction. . 7. When drilling a printed wiring board,
4. A punching method in which a plate is brought into close contact with an upper surface of the printed wiring board and drilled together with the printed wiring board. A drilling method characterized in that a part having no hole is continuously supplied to a next drilling position by relatively moving the small drill.