JP2002060967A - Surface treatment of copper or copper alloy - Google Patents
Surface treatment of copper or copper alloyInfo
- Publication number
- JP2002060967A JP2002060967A JP2000252912A JP2000252912A JP2002060967A JP 2002060967 A JP2002060967 A JP 2002060967A JP 2000252912 A JP2000252912 A JP 2000252912A JP 2000252912 A JP2000252912 A JP 2000252912A JP 2002060967 A JP2002060967 A JP 2002060967A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- resin
- copper oxide
- oxide
- roughened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemical Treatment Of Metals (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板の
製造等に有用な銅または銅合金の表面処理法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for treating a surface of copper or a copper alloy which is useful for manufacturing a printed wiring board.
【０００２】[0002]
【従来の技術】プリント配線板の製造工程においては、
銅の回路パターン上にプリプレグ、エッチングレジス
ト、ソルダーレジスト等の樹脂が、積層または塗布され
る。例えば多層プリント配線板の製造工程においては、
表面に銅の回路パターンを有する内層基板が、プレプレ
グを挟んで他の内層基板や銅箔と積層プレスされる。一
般に銅と樹脂とは接着性に劣るが、表面を酸化して針状
の酸化銅を形成すると樹脂との接着性が向上することが
知られている。そこで、前記積層プレスの前にも、内層
基板の銅表面とプリプレグとの接着性を向上させるため
に、銅表面を酸化することが行われている。その処理
は、プリント配線板基材を、亜塩素酸ナトリウムなどの
酸化剤を含有するアルカリ性水溶液中に、９０℃前後で
数分間浸漬することにより行われている。この処理によ
って形成される酸化銅の量は、通常３０〜６０ｍｇ／ｄ
ｍ2である。2. Description of the Related Art In a manufacturing process of a printed wiring board,
A resin such as a prepreg, an etching resist, or a solder resist is laminated or coated on the copper circuit pattern. For example, in the manufacturing process of a multilayer printed wiring board,
An inner layer substrate having a copper circuit pattern on its surface is laminated and pressed with another inner layer substrate or copper foil with a prepreg interposed therebetween. In general, copper and resin have poor adhesiveness, but it is known that when the surface is oxidized to form acicular copper oxide, the adhesiveness with resin is improved. Therefore, even before the lamination press, the copper surface is oxidized in order to improve the adhesiveness between the copper surface of the inner layer substrate and the prepreg. The treatment is performed by immersing the printed wiring board base material in an alkaline aqueous solution containing an oxidizing agent such as sodium chlorite at about 90 ° C. for several minutes. The amount of copper oxide formed by this treatment is usually 30 to 60 mg / d
m 2 .
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前記酸
化銅は、その後のめっき工程において酸性液と接触した
場合、バイアホールの周囲で溶解し、ハローイングと呼
ばれる欠陥を生じる問題がある。また、この酸化銅は針
状結晶であるため壊れやすく、取り扱いに充分な注意を
要する。さらに、酸化銅を形成する処理は、前記のごと
く高温のアルカリ性水溶液を用いるため、プリント配線
板の製造工程の中でも作業性が悪く、時間がかかり、生
産性に問題のある処理となっている。したがって、本発
明は、従来技術の欠点を克服し、ハローイングの問題が
生じず、従来の針状の酸化銅を形成する方法に比べて生
産性が良く、得られる酸化銅表面の取り扱い性も向上で
きる銅または銅合金の表面処理法を提供することを目的
とする。However, when the copper oxide is brought into contact with an acidic solution in a subsequent plating step, there is a problem that the copper oxide dissolves around the via hole and causes a defect called haloing. In addition, since the copper oxide is a needle-shaped crystal, it is fragile and requires careful handling. Further, since the treatment for forming copper oxide uses a high-temperature alkaline aqueous solution as described above, the workability is poor in the production process of the printed wiring board, it takes time, and there is a problem in productivity. Therefore, the present invention overcomes the drawbacks of the prior art, does not cause the problem of haloing, has better productivity than the conventional method of forming acicular copper oxide, and has a better handleability of the obtained copper oxide surface. It is an object of the present invention to provide a method for improving the surface treatment of copper or copper alloy which can be improved.
【０００４】[0004]
【課題を解決するための手段】本発明者らは、前記のご
とき問題を解決するために鋭意研究を重ねた結果、銅表
面を粗化したのち、この表面に従来よりも大幅に少ない
特定量の酸化銅を形成すると、プリプレグなどの樹脂と
の接着性に優れた銅表面になり、かつ酸性液と接触した
場合にもハローイングが生じないことを見出した。しか
も粗化された銅表面に少量の酸化銅を形成する処理は、
従来の酸化銅を形成する処理に比べて温和な条件で可能
であり、生産性に優れていることを見出した。Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, after roughening a copper surface, a specific amount which is much smaller than in the prior art has been formed on this surface. It has been found that when copper oxide is formed, a copper surface having excellent adhesiveness to a resin such as a prepreg is formed, and haloing does not occur even when it comes into contact with an acidic liquid. Moreover, the process of forming a small amount of copper oxide on the roughened copper surface,
It has been found that it is possible under mild conditions as compared with the conventional treatment for forming copper oxide, and is excellent in productivity.
【０００５】本発明は、銅または銅合金の表面を粗化
し、ついでこの表面に２〜２０ｍｇ／ｄｍ2の酸化銅を
形成することを特徴とする銅または銅合金の表面処理法
に関する。[0005] The present invention relates to a method for surface treating copper or copper alloy, comprising roughening the surface of copper or copper alloy and then forming 2 to 20 mg / dm 2 of copper oxide on the surface.
【０００６】[0006]
【発明の実施の形態】以下に、本発明について詳細に説
明する。本発明の処理法においては、まず銅または銅合
金の表面が粗化される。前記粗化法に特に限定はない
が、例えばマイクロエッチング法、電気めっき法、無電
解めっき法、ジェットスクラブ法等があげられる。前記
マイクロエッチング法としては、例えば硫酸・過酸化水
素タイプエッチング剤、過硫酸塩タイプエッチング剤、
塩化銅タイプエッチング剤、塩化鉄タイプエッチング
剤、硝酸タイプエッチング剤（メック（株）製のＣＺ−
５４８０等）、有機酸タイプエッチング剤（メック
（株）製のＣＺ−８１００等）等を用いる方法があげら
れる。前記粗化表面のうちでは、メック（株）製のＣＺ
−８１００による粗化表面のような、微細なこぶ状の突
起が密に形成されたような深い凹凸のある粗化表面が、
樹脂と接着させた場合にアンカー効果が生じるので好ま
しい。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. In the processing method of the present invention, first, the surface of copper or a copper alloy is roughened. The roughening method is not particularly limited, and examples thereof include a microetching method, an electroplating method, an electroless plating method, and a jet scrub method. Examples of the micro-etching method include a sulfuric acid / hydrogen peroxide type etching agent, a persulfate type etching agent,
Copper chloride type etching agent, iron chloride type etching agent, nitric acid type etching agent (CZ-
5480) and an organic acid type etching agent (such as CZ-8100 manufactured by Mec Co., Ltd.). Among the roughened surfaces, CZ manufactured by Mec Co., Ltd.
A roughened surface having deep irregularities such as fine bumps formed densely, such as a roughened surface by -8100,
It is preferable because the anchor effect occurs when the resin is bonded to a resin.
【０００７】本発明においては、樹脂との接着性をさら
に向上させるために、前記粗化表面に、２〜２０ｍｇ／
ｄｍ2、好ましくは３〜１５ｍｇ／ｄｍ2、さらに好まし
くは３〜１０ｍｇ／ｄｍ2の酸化銅が形成される。前記
酸化銅が２ｍｇ／ｄｍ2未満では銅または銅合金の表面
に均一に酸化銅を形成することができず、樹脂との接着
性を向上させる効果が不充分になる。一方２０ｍｇ／ｄ
ｍ2を超えるとハローイングが発生するおそれがある。In the present invention, in order to further improve the adhesiveness to the resin, 2 to 20 mg /
dm 2 , preferably 3-15 mg / dm 2 , more preferably 3-10 mg / dm 2 of copper oxide is formed. When the amount of the copper oxide is less than 2 mg / dm 2 , the copper oxide cannot be uniformly formed on the surface of the copper or copper alloy, and the effect of improving the adhesiveness to the resin becomes insufficient. 20 mg / d
If it exceeds m 2 , haloing may occur.
【０００８】この酸化銅の量は、酸化されていない銅と
の酸性水溶液に対する溶解度の違いを利用することによ
り確認することができる。例えば、被処理材を１０重量
％の硫酸水溶液中に浸漬して酸化銅をのみを溶解させ、
被処理材の重量変化を測定することにより確認すること
ができる。[0008] The amount of copper oxide can be confirmed by utilizing the difference in solubility of unoxidized copper in an acidic aqueous solution. For example, the material to be treated is immersed in a 10% by weight sulfuric acid aqueous solution to dissolve only copper oxide,
It can be confirmed by measuring the weight change of the material to be treated.
【０００９】前記酸化銅の形成方法に特に限定はない
が、例えば過硫酸カリウム２０〜５０ｇ／リットルおよ
び水酸化ナトリウム１５〜４０ｇ／リットルを含有する
水溶液に、４０〜６０℃で１５〜６０秒間浸漬する方法
や、亜塩素酸ナトリウム１２０〜２２０ｇ／リットルお
よび水酸化ナトリウム１５〜４０ｇ／リットルを含有す
る水溶液に、４０〜６０℃で１５〜６０秒間浸漬する方
法などがあげられる。The method for forming the copper oxide is not particularly limited. For example, the copper oxide is immersed in an aqueous solution containing 20 to 50 g / l of potassium persulfate and 15 to 40 g / l of sodium hydroxide at 40 to 60 ° C. for 15 to 60 seconds. And a method of dipping in an aqueous solution containing 120 to 220 g / liter of sodium chlorite and 15 to 40 g / liter of sodium hydroxide at 40 to 60 ° C. for 15 to 60 seconds.
【００１０】本発明においては、酸化銅の形成がこのよ
うな低温かつ短時間で行われるため、水平コンベアで連
続処理することが可能であり、生産性に優れている。In the present invention, since the formation of copper oxide is carried out at such a low temperature and in a short time, it is possible to carry out a continuous treatment on a horizontal conveyor, and the productivity is excellent.
【００１１】前記処理により、銅または銅合金の表面に
酸化銅が形成されると、その表面の色調が変化する。こ
れを電子顕微鏡にて７０００倍に拡大して観察すると、
被処理材の粗化表面を構成する凹凸のそれぞれの表面
に、さらに微細な凹凸が形成されているのが確認でき
る。例えば前記メック（株）製のＣＺ−８１００で粗化
された銅表面は明るい褐色であるが、酸化銅が形成され
ることにより、黒褐色になる。えられた表面の凹凸は、
通常の取り扱いでは壊れることがないため、その取り扱
いに格別の注意を要しない。When copper oxide is formed on the surface of copper or a copper alloy by the above treatment, the color tone of the surface changes. Observing this at a magnification of 7000 times with an electron microscope,
It can be confirmed that finer irregularities are formed on each of the irregularities constituting the roughened surface of the material to be treated. For example, the copper surface roughened by CZ-8100 manufactured by Mec Co., Ltd. is light brown, but becomes black brown due to the formation of copper oxide. The unevenness of the obtained surface is
No special care is required for handling since it will not break during normal handling.
【００１２】前記水溶液による処理の後、必要に応じて
特開７−３８２５４号や同１１−４３７７８号に開示さ
れているような防錆剤水溶液で処理してもよく、シラン
カップリング剤や有機チタネートカップリング剤で処理
してもよい。After the treatment with the aqueous solution, if necessary, it may be treated with a rust inhibitor aqueous solution as disclosed in JP-A-7-38254 or JP-A-11-43778. It may be treated with a titanate coupling agent.
【００１３】本発明によって処理された銅または銅合金
を樹脂と接着させると、あらかじめ形成されている粗化
形状によるアンカー効果と、酸化銅（酸化されていない
銅よりも樹脂との接着性が良好である）の効果との相乗
効果により、優れた接着力をうることができる。When the copper or copper alloy treated according to the present invention is bonded to a resin, the anchor effect due to the preformed roughened shape and the copper oxide (the adhesiveness to the resin is better than that of unoxidized copper) ), It is possible to obtain an excellent adhesive force.
【００１４】前記樹脂に特に限定はなく、例えばＡＳ樹
脂、ＡＢＳ樹脂、フッ素樹脂、ポリアミド、ポリエチレ
ン、ポリエチレンテレフタレート、ポリ塩化ビニリデ
ン、ポリ塩化ビニル、ポリカーボネート、ポリスチレ
ン、ポリサルホン、ポリプロピレン、液晶ポリマー等の
熱可塑性樹脂や、フェノール樹脂、エポキシ樹脂、ポリ
イミド、ポリウレタン、ビスマレイミド・トリアジン樹
脂、変性ポリフェニレンエーテル等の熱硬化性樹脂等が
あげられる。The resin is not particularly limited. For example, thermoplastic resins such as AS resin, ABS resin, fluororesin, polyamide, polyethylene, polyethylene terephthalate, polyvinylidene chloride, polyvinyl chloride, polycarbonate, polystyrene, polysulfone, polypropylene, liquid crystal polymer, etc. Resins, thermosetting resins such as phenolic resins, epoxy resins, polyimides, polyurethanes, bismaleimide / triazine resins, and modified polyphenylene ethers.
【００１５】本発明の表面処理法は種々の用途に使用す
ることができる。例えば配線板の導電層の銅と、層間絶
縁樹脂（プリプレグ、無電解めっき用接着剤、フィルム
状樹脂、液状樹脂、感光性樹脂、熱硬化性樹脂、熱可塑
性樹脂）、ソルダーレジスト、導電性樹脂、導電性ペー
スト、導電性接着剤、穴埋め用樹脂、フレキシブルカバ
ーレイフィルム等との接着性を向上させるために使用す
ることができる。The surface treatment method of the present invention can be used for various applications. For example, copper of the conductive layer of the wiring board, interlayer insulating resin (prepreg, adhesive for electroless plating, film resin, liquid resin, photosensitive resin, thermosetting resin, thermoplastic resin), solder resist, conductive resin , A conductive paste, a conductive adhesive, a resin for filling holes, a flexible cover lay film, or the like to improve the adhesiveness.
【００１６】例えば、多層プリント配線板を製造する際
の内層基板の銅表面処理に用いると、プリプレグとの接
着性が著しく向上し、後に続くめっき工程でハローイン
グが生じないという効果が得られる。また、ビルドアッ
ププリント配線板の層間絶縁樹脂との接着性を向上させ
るためにも有効である。さらにリードフレームの表面処
理にも有用であり、封止樹脂との接着性を向上させるこ
とができる。For example, when used for copper surface treatment of an inner layer substrate when a multilayer printed wiring board is manufactured, the adhesiveness to a prepreg is remarkably improved, and an effect that no haloing occurs in a subsequent plating step can be obtained. It is also effective for improving the adhesiveness between the build-up printed wiring board and the interlayer insulating resin. Further, it is useful for the surface treatment of a lead frame, and can improve the adhesiveness with a sealing resin.
【００１７】さらに、本発明の処理法によってえられて
銅表面は、赤褐色〜黒褐色の色調を示すため、感光性樹
脂の下地とした場合に解像度が向上する効果が得られ、
またプリント配線板回路の自動光学検査機（ＡＯＩ）の
誤動作が少なくなるという効果が得られる。Furthermore, since the copper surface obtained by the treatment method of the present invention exhibits a reddish-brown color tone, the effect of improving the resolution can be obtained when used as a base for a photosensitive resin.
Further, an effect is obtained that the malfunction of the automatic optical inspection machine (AOI) of the printed wiring board circuit is reduced.
【００１８】また、プリント配線板のバイアホールの形
成に、従来のドリルにかわり、炭酸ガス、ＹＡＧ、エキ
シマなどのレーザが使用され始めているが、本発明の処
理法によって銅表面を赤褐色〜黒褐色の色調にすること
により、レーザ光の反射が少なくなり、エネルギー吸収
が向上し、銅と樹脂の両方をレーザで孔あけできるとい
う効果が得られる。従来、炭酸ガスレーザやＹＡＧレー
ザで発振されたレーザ光は銅表面で反射され、銅に孔あ
けすることができないため、この部分の銅をあらかじめ
エッチングにより除去したのち、絶縁樹脂層をレーザで
孔あけしていた。Lasers such as carbon dioxide, YAG, and excimer have begun to be used instead of conventional drills to form via holes in printed wiring boards. By providing a color tone, the effect of reducing the reflection of laser light, improving energy absorption, and drilling both copper and resin with a laser can be obtained. Conventionally, laser light emitted by a carbon dioxide gas laser or a YAG laser is reflected on the copper surface and cannot be drilled in copper. Therefore, after removing this portion of copper by etching in advance, the insulating resin layer is drilled with a laser. Was.
【００１９】本発明の処理法を用いる場合は、例えば多
層プリント配線板の外層の銅箔（通常厚さ９〜１８μ
ｍ）を、メック（株）製のＣＺ−８１００等でエッチン
グして３〜７μｍ程度の厚さにするとともに（細線パタ
ーンの形成を可能にするため）、かつ表面を深い凹凸の
ある形状に粗化したのち、この表面に２〜２０ｍｇ／ｄ
ｍ2の酸化銅を形成して黒褐色にし、炭酸ガスレーザで
孔あけする方法が好ましい。前記酸化銅を形成するかわ
りに、硫化銅を形成したり、樹脂で被覆したりすること
によってもレーザ光のエネルギー吸収を向上させること
が可能であるが、酸化銅を形成する方法は作業性がよ
く、孔あけ後に樹脂膜を除去する必要がないという点で
好ましい。When the processing method of the present invention is used, for example, a copper foil (usually having a thickness of 9 to 18 μm) as an outer layer of a multilayer printed wiring board is used.
m) is etched with CZ-8100 or the like manufactured by Mec Co., Ltd. to a thickness of about 3 to 7 μm (to enable formation of a fine line pattern), and the surface is roughened into a shape with deep irregularities. After that, 2 to 20 mg / d
the dark brown to form a copper oxide m 2, a method of drilling with a carbon dioxide gas laser is preferred. Instead of forming the copper oxide, it is possible to improve the energy absorption of the laser beam by forming copper sulfide or coating with a resin, but the method of forming the copper oxide has low workability. This is preferable because it is not necessary to remove the resin film after drilling.
【００２０】[0020]
【実施例】次に実施例により、本発明をさらに具体的に
説明する。 実施例１〜３および比較例１〜３ （はんだ耐熱性）両面に厚さ１８μｍの銅箔を張り合わ
せたガラス布エポキシ樹脂含浸銅張積層板（ＦＲ−４グ
レード）を、メック（株）製のＣＺ−８１００で処理
し、銅表面を粗化した。えられた表面は明るい褐色であ
った。次に表１に示す組成の水溶液に浸漬し、銅表面に
酸化銅を形成した。この表面の酸化銅量および色調を表
１に示す。Next, the present invention will be described more specifically with reference to examples. Examples 1 to 3 and Comparative Examples 1 to 3 (Solder heat resistance) A glass cloth epoxy resin impregnated copper-clad laminate (FR-4 grade) having 18 μm-thick copper foil laminated on both sides was manufactured by Mec Corporation. Treatment with CZ-8100 roughened the copper surface. The resulting surface was light brown. Next, it was immersed in an aqueous solution having the composition shown in Table 1 to form copper oxide on the copper surface. Table 1 shows the amount of copper oxide and the color tone of this surface.
【００２１】えられた銅張積層板の両面にガラス布エポ
キシ樹脂含浸プリプレグ（ＦＲ−４グレード）を積層プ
レスした後、周辺部を切り取り、テストピースを作製し
た。次に、えられたテストピースにプレッシャークッカ
ーにて１２１℃、１００％ＲＨ、２気圧、４時間の負荷
を与えた後、ＪＩＳ Ｃ ６４８１に準じて２６０℃の
溶融はんだ浴中に１分間浸漬し、はんだ耐熱性を評価し
た。結果を表１に示す。After prepreg impregnated with glass cloth epoxy resin (FR-4 grade) was laminated and pressed on both sides of the obtained copper-clad laminate, the periphery was cut off to prepare a test piece. Next, after applying a load of 121 ° C., 100% RH, 2 atm, and 4 hours to the obtained test piece with a pressure cooker, the test piece was immersed in a molten solder bath at 260 ° C. for 1 minute according to JIS C6481. The solder heat resistance was evaluated. Table 1 shows the results.
【００２２】（引きはがし強さ）厚さ７０μｍの電解銅
箔のＳ面を前記ＣＺ−８１００で処理して粗化した後、
表１に示す組成の水溶液に浸漬し、銅表面に酸化銅を形
成した。えられた銅箔の処理面に、前記プリプレグを積
層プレスした後、ＪＩＳ Ｃ ６４８１に準じて幅１ｃ
ｍの銅箔を残して残りの銅箔を除去し、引きはがしき強
さを測定した。結果を表１に示す。(Peel off strength) After the S surface of the electrolytic copper foil having a thickness of 70 μm is roughened by treating with the CZ-8100,
It was immersed in an aqueous solution having the composition shown in Table 1 to form copper oxide on the copper surface. After the prepreg is laminated and pressed on the treated surface of the obtained copper foil, the width is 1 c in accordance with JIS C6481.
The remaining copper foil was removed except for the copper foil of m, and the peel strength was measured. Table 1 shows the results.
【００２３】（ハローイング）両面に厚さ３５μｍの銅
箔を張り合わせたガラス布エポキシ樹脂含浸銅張積層板
（ＦＲ−４グレード、厚さ０．３ｍｍ）を、メック
（株）製のＣＺ−８１００で処理し、銅表面を粗化し
た。次に表１に示す組成の水溶液に浸漬し、銅表面に酸
化銅を形成した。えられた積層板に前記プリプレグを挟
んで厚さ１８μｍの銅箔を積層プレスし、４層板を作製
した。得られた４層板に、径０．４ｍｍ、回転数７００
００ｒｐｍのドリルで孔あけを行なった。次に、得られ
た４層板を４規定の塩酸に２時間浸漬したのち取り出
し、内層の銅箔が観察できるように水平研磨し、内層銅
箔のハローの発生状況を顕微鏡により１００倍で観察し
た。結果を表１に示す。(Hellowing) A glass cloth epoxy resin-impregnated copper-clad laminate (FR-4 grade, 0.3 mm thick) having a 35 μm-thick copper foil laminated on both sides was manufactured by CZ-8100 manufactured by Mec Corporation. To roughen the copper surface. Next, it was immersed in an aqueous solution having the composition shown in Table 1 to form copper oxide on the copper surface. A copper foil having a thickness of 18 μm was laminated and pressed on the obtained laminated plate with the prepreg interposed therebetween to produce a four-layer plate. A diameter of 0.4 mm and a rotation speed of 700 were obtained on the obtained four-layer plate.
Drilling was performed with a 00 rpm drill. Next, the obtained four-layer plate was immersed in 4N hydrochloric acid for 2 hours, taken out, and horizontally polished so that the inner layer copper foil could be observed. The occurrence of halos in the inner layer copper foil was observed at 100 × with a microscope. did. Table 1 shows the results.
【００２４】[0024]
【表１】 [Table 1]
【００２５】表１に示されるように、実施例１〜３は、
ハローイングが生じず、はんだ耐熱性、引き剥がし強さ
に優れていた。これに対し、比較例１、３の場合には、
酸化銅量が多くなり、ハローイングが生じた。また、比
較例２は、酸化銅量が少なくなり、ハローイングは生じ
ないものの、はんだ耐熱性、引き剥がし強さに劣ってい
た。As shown in Table 1, Examples 1 to 3
Haloing did not occur, and the solder heat resistance and peel strength were excellent. In contrast, in Comparative Examples 1 and 3,
The amount of copper oxide increased and haloing occurred. In Comparative Example 2, although the amount of copper oxide was small and no haloing occurred, the solder heat resistance and peel strength were poor.
【００２６】[0026]
【発明の効果】本発明の銅または銅合金の表面処理法よ
り、ハローイングの問題が生じず、従来の針状の酸化銅
を形成する方法に比べて生産性が良く、得られる酸化銅
表面の取り扱い性も向上できる。According to the surface treatment method of copper or copper alloy of the present invention, the problem of haloing does not occur, the productivity is better than the conventional method of forming acicular copper oxide, and the obtained copper oxide surface can be obtained. Can also be improved.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 高垣 秀一 兵庫県尼崎市東初島町１番地 メック株式 会社内 (72)発明者 小野 秀一郎 兵庫県尼崎市東初島町１番地 メック株式 会社内 (72)発明者 中村 幸子 兵庫県尼崎市東初島町１番地 メック株式 会社内 Ｆターム(参考） 4K026 AA06 BA08 BA12 BB06 CA16 CA33 CA34 CA36 DA03 EA02 EB08 5E343 AA15 AA17 BB24 BB67 CC01 CC03 CC04 CC46 DD76 EE52 EE55 GG01 GG11 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Shuichi Takagaki 1 Higashi Hatsushima-cho, Amagasaki-shi, Hyogo Pref. (72) Inventor Shuichiro Ono 1-Higashi-Hatsushima-cho, Amagasaki-shi, Hyogo Mech Co., Ltd. (72) Inventor Sachiko Nakamura 1 Higashi-Hatsushima-cho, Amagasaki-shi, Hyogo FEC term (reference) 4K026 AA06 BA08 BA12 BB06 CA16 CA33 CA34 CA36 DA03 EA02 EB08 5E343 AA15 AA17 BB24 BB67 CC01 CC03 CC04 CC46 DD76 EE52 EE55 GG01 GG11GG
Claims (1)
この表面に２〜２０ｍｇ／ｄｍ2の酸化銅を形成するこ
とを特徴とする銅または銅合金の表面処理法。1. A method for surface-treating copper or a copper alloy, comprising roughening the surface of copper or a copper alloy and then forming 2 to 20 mg / dm 2 of copper oxide on the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000252912A JP2002060967A (en) | 2000-08-23 | 2000-08-23 | Surface treatment of copper or copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000252912A JP2002060967A (en) | 2000-08-23 | 2000-08-23 | Surface treatment of copper or copper alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002060967A true JP2002060967A (en) | 2002-02-28 |
Family
ID=18742084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000252912A Pending JP2002060967A (en) | 2000-08-23 | 2000-08-23 | Surface treatment of copper or copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002060967A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005150211A (en) * | 2003-11-12 | 2005-06-09 | Hitachi Chem Co Ltd | Multilayer wiring board and its manufacturing method |
| JP2005340785A (en) * | 2004-04-30 | 2005-12-08 | Hitachi Via Mechanics Ltd | Printed circuit board, processing method of printed circuit board, and manufacturing method of printed circuit board |
| KR100541581B1 (en) * | 2002-06-07 | 2006-01-11 | 후지쯔 가부시끼가이샤 | Lead frame, manufacturing method thereof and semiconductor device |
| CN100347853C (en) * | 2003-08-07 | 2007-11-07 | 富士通株式会社 | Lead frame and its manufacturing method and semiconductor device |
| JP2008307842A (en) * | 2007-06-18 | 2008-12-25 | Taisei Plas Co Ltd | Tubular composite and manufacturing method thereof |
| JP2009084652A (en) * | 2007-10-01 | 2009-04-23 | Hitachi Chem Co Ltd | Oxidation treatment method and oxidation treatment liquid for metal |
| WO2009113396A1 (en) * | 2008-03-10 | 2009-09-17 | 日立ビアメカニクス株式会社 | Method of treating surface of copper and method of treating surface of printed wiring board |
| JPWO2008126812A1 (en) * | 2007-04-06 | 2010-07-22 | 大成プラス株式会社 | Copper alloy composite and manufacturing method thereof |
-
2000
- 2000-08-23 JP JP2000252912A patent/JP2002060967A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100541581B1 (en) * | 2002-06-07 | 2006-01-11 | 후지쯔 가부시끼가이샤 | Lead frame, manufacturing method thereof and semiconductor device |
| US8664046B2 (en) | 2002-06-07 | 2014-03-04 | Fujitsu Semiconductor Limited | Manufacturing method thereof and a semiconductor device |
| US8940583B2 (en) | 2002-06-07 | 2015-01-27 | Fujitsu Semiconductor Limited | Manufacturing method of a lead frame |
| CN100347853C (en) * | 2003-08-07 | 2007-11-07 | 富士通株式会社 | Lead frame and its manufacturing method and semiconductor device |
| JP2005150211A (en) * | 2003-11-12 | 2005-06-09 | Hitachi Chem Co Ltd | Multilayer wiring board and its manufacturing method |
| JP2005340785A (en) * | 2004-04-30 | 2005-12-08 | Hitachi Via Mechanics Ltd | Printed circuit board, processing method of printed circuit board, and manufacturing method of printed circuit board |
| JPWO2008126812A1 (en) * | 2007-04-06 | 2010-07-22 | 大成プラス株式会社 | Copper alloy composite and manufacturing method thereof |
| JP2008307842A (en) * | 2007-06-18 | 2008-12-25 | Taisei Plas Co Ltd | Tubular composite and manufacturing method thereof |
| JP2009084652A (en) * | 2007-10-01 | 2009-04-23 | Hitachi Chem Co Ltd | Oxidation treatment method and oxidation treatment liquid for metal |
| WO2009113396A1 (en) * | 2008-03-10 | 2009-09-17 | 日立ビアメカニクス株式会社 | Method of treating surface of copper and method of treating surface of printed wiring board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI481325B (en) | Method for manufacturing printed wiring board and copper foil for laser processing | |
| JP4629048B2 (en) | An improved method for micro-roughening treatment of copper and mixed metal circuits | |
| JP4831783B2 (en) | Conductive layer, laminate using the same, and production method thereof | |
| JP3752161B2 (en) | Method for roughening copper surface of printed wiring board, printed wiring board, and manufacturing method thereof | |
| US4981560A (en) | Method of surface treatment of copper foil or a copper clad laminate for internal layer | |
| JP2002047583A (en) | Copper or copper alloy microetching agent and microetching method using the same | |
| JP2002060967A (en) | Surface treatment of copper or copper alloy | |
| JP2007129147A (en) | Printed wiring board using laser processing and its manufacturing method | |
| JPH0217953B2 (en) | ||
| JP5288168B2 (en) | Multilayer printed wiring board and manufacturing method thereof | |
| JP2009041112A (en) | Copper etching liquid and manufacturing method of printed wiring board using the same | |
| JP3928392B2 (en) | Method for manufacturing printed wiring board | |
| JP2000261149A (en) | Mutilayer printed wiring board and manufacture thereof | |
| JP3615973B2 (en) | Novel composite foil and manufacturing method thereof, copper-clad laminate | |
| JP6304829B2 (en) | Copper foil for laser processing, copper foil for laser processing with carrier foil, copper-clad laminate, and method for producing printed wiring board | |
| JP2002266087A (en) | Etchant for copper and method for manufacturing printed circuit board using the same | |
| JP4555998B2 (en) | Printed wiring board | |
| JP3951938B2 (en) | Etching method and printed wiring board manufacturing method using the same | |
| JPH06216520A (en) | Manufacture of multilayer printed board | |
| JP4453703B2 (en) | Printed wiring board | |
| JPH0637447A (en) | Manufacture of multilayered printed-circuit board | |
| JPH04155993A (en) | Manufacture of multilayer printed wiring board | |
| JPH06120675A (en) | Production of multilayer printed wiring board | |
| JPH0752791B2 (en) | Method for treating copper circuit of circuit board for inner layer | |
| JPH07162148A (en) | Multilayer printed wiring board and inner board used therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20060425 |