JP2002050777A - Aggregate type light-receiving/emitting device - Google Patents
Aggregate type light-receiving/emitting deviceInfo
- Publication number
- JP2002050777A JP2002050777A JP2000232550A JP2000232550A JP2002050777A JP 2002050777 A JP2002050777 A JP 2002050777A JP 2000232550 A JP2000232550 A JP 2000232550A JP 2000232550 A JP2000232550 A JP 2000232550A JP 2002050777 A JP2002050777 A JP 2002050777A
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving
- emitting
- light guide
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Landscapes
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は複数の受発光素子を
整列配置した集合型受発光装置に係わり、照明、電光表
示板、面受発光板等の新規技術に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collective light emitting / receiving device in which a plurality of light receiving / emitting elements are arranged in an array, and relates to a novel technology for lighting, an electric display panel, a surface light emitting / receiving plate, and the like.
【0002】[0002]
【従来の技術】現在、照明分野では一般的に蛍光灯や電
球等が用いられているが、これらはエネルギーの消費量
が大きいのでより効率的な照明が要求されている。最
近、省エネルギー型発光装置として有機ELが提案され
ているが、現状では湿気に弱い等の問題があり実用化に
は相当大きな問題を抱えている。又、表示分野では発光
ダイオード(LED)ランプを整列配置した小型の表示
装置が交通機関等で利用されているが、これらも電力消
費効率や指向性は悪い。さらに、現在の液晶表示装置は
室内で使用できる性能が限度であり、室外で鮮明に判読
できる表示装置が求められている。2. Description of the Related Art At present, fluorescent lamps, electric bulbs and the like are generally used in the field of lighting, but since these consume a large amount of energy, more efficient lighting is required. Recently, an organic EL has been proposed as an energy-saving light-emitting device. However, at present, there is a problem that the organic EL is weak to moisture, and there is a considerable problem in practical use. In the display field, small-sized display devices in which light-emitting diode (LED) lamps are arranged are used in transportation and the like, but they also have poor power consumption efficiency and directivity. Furthermore, the performance of a current liquid crystal display device that can be used indoors is limited, and a display device that can read clearly outdoors is required.
【0003】省エネルギー対応は多くの国で懸案問題と
なり対策が叫ばれるようになってきた。例えば、我が国
では国連決議に基づく地球温暖化防止対策として、照明
用途でのLED利用等、太陽光発電でのPD利用等を通
商産業省が母体となり関連業界で検討に着手した。この
要求に対応するためには、可視光を発する汎用で高効率
の光源や効率の高い太陽電池を開発することが急務とな
っている。[0003] Energy saving measures have become a matter of concern in many countries, and measures have been called for. For example, in Japan, as measures to prevent global warming based on the UN resolution, the Ministry of International Trade and Industry has begun studying related industries through the use of LEDs for lighting and the use of PD for solar power generation. In order to meet this demand, there is an urgent need to develop a general-purpose and highly efficient light source that emits visible light and a highly efficient solar cell.
【0004】又、情報通信分野では高速通信網の整備が
緊急課題となっている。各種情報網特にインターネット
の急速な普及を支えるためには光通信システムの汎用化
が必須とされている。現在の光通信網は、石英ファイバ
を敷設し幹線系の一部で利用されているにすぎない。最
近、安価で簡便なプラスチック光ファイバ(POF)を
利用するシステムの実用化検討が活発となってきた。従
来の石英ファイバ系通信では受発光部品は高価な機密封
止品が主流であり、今後のPOF系通信で必要とされる
一般家庭でも使用できる廉価汎用品の開発が望まれてい
る。[0004] In the information communication field, the development of a high-speed communication network is an urgent issue. In order to support the rapid spread of various information networks, particularly the Internet, generalization of optical communication systems is essential. In the current optical communication network, a quartz fiber is laid and used only for a part of a trunk system. Recently, studies on practical use of a system using a cheap and simple plastic optical fiber (POF) have become active. In the conventional quartz fiber communication, an expensive confidential sealing component is mainly used as the light receiving and emitting component, and development of an inexpensive general-purpose product that can be used in ordinary households required for future POF communication is desired.
【0005】会社や一般家庭で多くの人が光通信を利用
するためには、外部と内部の信号光を分光及び集光し接
続する装置、集合型の受発光装置が必要となる。光通信
用途で使用される光半導体としては、半導体レーザ(L
D、VCSEL等)やフォトダイオード(PD)を挙げ
ることができる。[0005] In order for many people to use optical communication in a company or a general home, a device for separating and condensing external and internal signal lights and connecting them, and a collective light emitting and receiving device are required. Optical semiconductors used in optical communication applications include semiconductor lasers (L
D, VCSEL, etc.) and a photodiode (PD).
【0006】[0006]
【発明が解決しようとする課題】本発明は、地球規模で
有益であり、効率が良く廉価な発光装置に係わるもので
あり、地球温暖化防止に有用な省エネルギー型の表示照
明や高速光通信の普及に役立つ汎用受発信器に関する技
術を提供するものである。SUMMARY OF THE INVENTION The present invention relates to a light-emitting device which is useful on a global scale, is efficient and inexpensive, and is useful for energy-saving display lighting and high-speed optical communication useful for preventing global warming. It is intended to provide technology related to general-purpose receivers and transmitters that are useful for dissemination.
【0007】[0007]
【課題を解決するための手段】本発明は、可視光及び赤
外光を有効に入出射する集合型の受発光半導体装置を提
案するものである。効率的な光反射形状を有する導光体
と受発光素子の受発光面と接続させ且つ受発光素子と導
光体を集合体にすることにより、低コストで多目的使用
が可能な集合型の受発光装置を提供するものである。SUMMARY OF THE INVENTION The present invention proposes a collective light-emitting / emitting semiconductor device which effectively emits and emits visible light and infrared light. By connecting the light guide having an efficient light reflection shape to the light receiving / emitting surface of the light receiving / emitting element and forming the light receiving / emitting element and the light guide as an assembly, a low cost, multi-purpose collective type receiver is provided. A light-emitting device is provided.
【0008】本発明は、反射面で囲まれた導光体を整列
配置した導光板と受発光素子を整列配置した受発光板を
一体化した装置において、導光体が受発光素子側に向け
て先細りとなる形状を有しており、導光体と受発光素子
が同一光軸上に整列配置されていることを特徴とする集
合型受発光装置である。According to the present invention, in a device in which a light guide plate in which light guides surrounded by a reflection surface are arranged and a light receiving and emitting plate in which light receiving and emitting elements are arranged are integrated, the light guide is directed toward the light receiving and emitting element side. A collective type light receiving / emitting device having a tapered shape, wherein the light guide and the light receiving / emitting element are arranged on the same optical axis.
【0009】請求項2は、導光板は反射面で囲まれた凸
型導光体を整列配置した構造を有しており、凸型導光体
が光反射性中空金属の内部に光透過体を充填する方法ま
たは凸状光透過体の外側を反射加工する方法等で製造さ
れていることを特徴とする請求項1に記載の集合型受発
光装置である。According to a second aspect of the present invention, the light guide plate has a structure in which convex light guides surrounded by a reflecting surface are arranged and arranged, and the convex light guide is provided inside the light reflective hollow metal. 2. The collective type light emitting / receiving device according to claim 1, wherein the light receiving / emitting device is manufactured by a method of filling the surface or a method of reflecting the outside of the convex light transmitting body.
【0010】請求項3は、受発光素子の受発光側電極が
受発光面の外周に配置されており、導光体の先端部と受
発光素子の受発光部が接続していることを特徴とする請
求項1又は請求項2に記載の集合型受発光装置である。According to a third aspect of the present invention, the light emitting / receiving side electrode of the light emitting / receiving element is arranged on the outer periphery of the light emitting / receiving surface, and the tip of the light guide is connected to the light emitting / receiving section of the light receiving / emitting element. A collective type light emitting / receiving device according to claim 1 or 2.
【0011】請求項4は、請求項3において導光体と受
発光素子が柔軟な透明材料を介在し接続されていること
を特徴とするものである。According to a fourth aspect, in the third aspect, the light guide and the light receiving / emitting element are connected with a flexible transparent material interposed therebetween.
【0012】請求項5は、導光板及び受発光板が柔軟で
あることを特徴とする請求項1から請求項4のいずれか
1項に記載の集合型受発光装置である。According to a fifth aspect of the present invention, there is provided the collective type light receiving / emitting device according to any one of the first to fourth aspects, wherein the light guide plate and the light receiving / emitting plate are flexible.
【0013】請求項6は、受発光装置が全面使用だけで
なく、1単位(導光体と受発光素子の一組)から複数の
単位で、部分的に使用又は切断分離し使用することがで
きる構造であることを特徴とする請求項1から請求項5
のいずれか1項に記載の集合型受発光装置である。According to a sixth aspect of the present invention, the light emitting and receiving device is used not only for the entire surface but also for a plurality of units from one unit (one set of the light guide and the light emitting and receiving element). 6. A structure that can be used.
The collective type light receiving and emitting device according to any one of the above.
【0014】照明、表示用途として光半導体を使用する
場合、及び光通信の分光又は集光用途として光半導体を
使用する場合には平面集合型にする必要がある。明る
さ、文字表示及び複数接続の要求を満足するためであ
る。When an optical semiconductor is used for illumination and display purposes, and when an optical semiconductor is used for spectral or condensing purposes in optical communications, it is necessary to use a planar assembly type. This is to satisfy the requirements for brightness, character display, and multiple connections.
【0015】又、受発光効率を向上させるため光半導体
に導光体を取り付け、両部品の光軸を合わせることも必
要である。In order to improve the light receiving / emitting efficiency, it is necessary to attach a light guide to the optical semiconductor and align the optical axes of both parts.
【0016】導光板は凸型導光体を整列配置した形状が
工業性及び加工性の点で好ましい。凸型導光体は光反射
性中空金属の内部に光透過体を充填したり凸状光透過体
の外側を反射加工し製造できる。例えば、反射処理した
金属板を押圧して中空としその内部に光透過体を充填し
たり、光透過性の樹脂を凸状に射出成形しその外部を反
射処理することにより製造する。また、導光体表面を光
反射性にする加工方法としては、メッキ、PVD(蒸
着、スパッタ等)及びCVD等を挙げることができる。The light guide plate preferably has a shape in which convex light guides are arranged and arranged in view of industrial and workability. The convex light guide can be manufactured by filling the light reflective hollow metal with a light transmissive body or reflecting the outside of the convex light transmissive body. For example, it is manufactured by pressing a reflection-treated metal plate to make it hollow, and filling the inside with a light transmitting body, or by injection-molding a light-transmitting resin in a convex shape, and reflecting the outside thereof. Examples of a processing method for making the light guide surface light-reflective include plating, PVD (evaporation, sputtering, etc.), CVD, and the like.
【0017】光透過体としては、目的とする波長の光を
透過させる樹脂なら何でも良いが、例えば、ポリカーボ
ネート、ポリメチルメタクリレート、ポリシクロペンタ
ジエン、ポリウレタン、ポリスチレン、ポリエーテル、
エポキシ、シリコーン等の熱硬化性または熱可塑性の透
明樹脂及びその誘導体を挙げることができる。As the light transmitting body, any resin can be used as long as it transmits light having a desired wavelength. Examples of the light transmitting body include polycarbonate, polymethyl methacrylate, polycyclopentadiene, polyurethane, polystyrene, polyether, and the like.
Examples thereof include thermosetting or thermoplastic transparent resins such as epoxy and silicone and derivatives thereof.
【0018】受発光素子と導光体の光伝送効率を良くす
るためには、信号光の漏れをなくし受発光素子と導光体
を最短距離で接合することが重要である。即ち、受発光
素子の受発光部と導光体の受発光素子側端面を接続させ
ることが有効である。このためには、受発光素子の受発
光側電極を受発光面の外周部に配置することが好まし
い。In order to improve the light transmission efficiency between the light emitting / receiving element and the light guide, it is important to prevent the signal light from leaking and to join the light emitting / receiving element and the light guide at the shortest distance. That is, it is effective to connect the light emitting / receiving section of the light emitting / receiving element and the end face of the light guide on the light emitting / receiving element side. For this purpose, it is preferable to arrange the light emitting / receiving side electrode of the light emitting / receiving element on the outer periphery of the light emitting / receiving surface.
【0019】また、柔軟な透明材料を導光体端面と受発
光素子の間隙に挟み接続することが応力面及び気密面で
望ましい。これに適する樹脂類は、シリコーン系、アク
リル系、エポキシ系、熱可塑性エラストマー系、及びこ
れらの誘導体を挙げることができる。市販品は信越化学
工業、東芝シリコーン、東亞合成、日本化薬、旭化成等
の製品カタログより選択することができる。It is desirable that a flexible transparent material be connected between the end face of the light guide and the light receiving / emitting element in terms of stress and airtightness. Suitable resins include silicones, acrylics, epoxies, thermoplastic elastomers, and derivatives thereof. Commercial products can be selected from product catalogs such as Shin-Etsu Chemical Co., Toshiba Silicone, Toagosei, Nippon Kayaku, and Asahi Kasei.
【0020】導光板及び受発光板は柔軟であることが好
ましい。柔軟性があると本発明の集合型受発光装置を柱
の角や曲面にも取り付けることができる。The light guide plate and the light receiving / emitting plate are preferably flexible. With flexibility, the collective light emitting and receiving device of the present invention can be attached to a corner or a curved surface of a pillar.
【0021】更に、受発光装置は全面使用だけでなく、
部分的に使用又は切断分離し使用できることが好まし
い。これにより、取付場所に制約がある場合(面積の大
小及び特殊な形状)にも対応が可能となる。Further, the light emitting and receiving device is not only used for the entire surface,
It is preferable that it can be partially used or cut and separated for use. Thereby, it is possible to cope with a case where the mounting place is restricted (large and small area and special shape).
【0022】図1は、本発明による面受発光装置の外観
図の一例を示す図である。導光体3を整列配置した導光
板1が受発光板4と一体化されている。FIG. 1 is a view showing an example of an external view of a surface light emitting / receiving device according to the present invention. The light guide plate 1 in which the light guides 3 are arranged and arranged is integrated with the light receiving / emitting plate 4.
【0023】図2は、本発明による集合型受発光装置の
一例を示す断面図である。(1)は一体化後の図、
(2)は一体化前の図である。反射面22に囲まれた導
光体23を整列配置した導光板21と、受発光素子25
を回路基板20及び26に整列配置した受発光板24が
一体化されている。導光体の端面と受発光素子の受発光
面27が接続されている。尚、導光体の内部は光透過体
で充填されている。FIG. 2 is a sectional view showing an example of the collective light emitting and receiving device according to the present invention. (1) is a diagram after integration,
(2) is a diagram before integration. A light guide plate 21 in which light guides 23 surrounded by a reflection surface 22 are arranged and arranged;
The light emitting and receiving plate 24 in which are arranged on the circuit boards 20 and 26 is integrated. The end face of the light guide and the light receiving / emitting surface 27 of the light receiving / emitting element are connected. The inside of the light guide is filled with a light transmitting body.
【0024】図3は、本発明による集合型受発光装置の
別の一例を示す断面図である。図2とは、導光体の形
状、製法及び受発光素子の搭載方法が異なる。31は導
光板、32は反射面、33は導光体、34は受発光板、
35は受発光素子、36は回路基板、37は受発光部、
38は金線、39は封止樹脂である。FIG. 3 is a sectional view showing another example of the collective light emitting and receiving device according to the present invention. 2 differs from FIG. 2 in the shape of the light guide, the manufacturing method, and the mounting method of the light receiving / emitting element. 31 is a light guide plate, 32 is a reflection surface, 33 is a light guide, 34 is a light receiving / emitting plate,
35 is a light emitting / receiving element, 36 is a circuit board, 37 is a light receiving / emitting section,
38 is a gold wire, and 39 is a sealing resin.
【0025】[0025]
【実施形態】本発明の実施形態を説明する。以下、実施
例にて具体的に説明する。Embodiments of the present invention will be described. Hereinafter, specific examples will be described.
【0026】[0026]
【実施例1】図2のような集合型受光装置を次のように
製造した。 1.導光板の製造 ポリメチルメタクリレート樹脂を原料として射出成形法
により円錐状突起物23を有する透明板を加工し、次に
円錐部分をメッキ法により反射処理を22に施した。こ
れにより凸型導光体を整列配置した導光板21が得られ
た。Embodiment 1 A collective light receiving device as shown in FIG. 2 was manufactured as follows. 1. Production of Light Guide Plate A transparent plate having conical projections 23 was processed by injection molding using polymethyl methacrylate resin as a raw material, and then the conical portion was subjected to reflection treatment 22 by plating. Thereby, the light guide plate 21 in which the convex light guides were arranged was obtained.
【0027】2.受光板の製造 ポリイミドフィルム回路基板(住友金属鉱山製)20に
電気回路をエッチングし、受光通路穴を打ち抜き、PD
(浜松ホトニクス製)25を搭載しフィルムキャリアを
作成した。次に、電気配線を加工した片面プリント配線
用銅張積層板(利昌工業製)にPD格納穴を加工した絶
縁体を接着し回路基板26を作成した。最後に、フィル
ムキャリアと収納基板を貼り合わせ受光板24を製造し
た。尚、受光部27は柔軟エポキシ系透明樹脂(日本化
薬製)で封止した。2. Manufacture of light receiving plate An electric circuit is etched on a polyimide film circuit board (manufactured by Sumitomo Metal Mining) 20, a light receiving passage hole is punched, and
(Hamamatsu Photonics) 25 was mounted to prepare a film carrier. Next, a circuit board 26 was formed by bonding an insulator having a PD storage hole formed thereon to a copper-clad laminate for single-sided printed wiring (manufactured by Risho Kogyo) having processed electric wiring. Finally, the light receiving plate 24 was manufactured by bonding the film carrier and the storage substrate. The light receiving section 27 was sealed with a flexible epoxy-based transparent resin (manufactured by Nippon Kayaku).
【0028】3.集合型受光装置の製造 導光板21と受光板24を、導光体とPDの光軸を合わ
せながら一体化し集合型受光装置を製造した。外観形状
は図1のようである。3. Production of Collective-Type Light-Receiving Device The light-guide plate 21 and the light-receiving plate 24 were integrated while aligning the optical axes of the light guide and the PD to produce a collective-type light-receiving device. The external shape is as shown in FIG.
【0029】この集合型受光装置を高速輪転機の光セン
サー部品に使用したところ、位置精度が抜群に良くなっ
た。When this collective light receiving device was used for an optical sensor component of a high-speed rotary press, the positional accuracy was remarkably improved.
【0030】[0030]
【実施例2】図3のような集合型発光装置を次のように
製造した。光沢金属フィルムを押圧し反射面32を加工
し、その内部に導光体33として透明シリコーン樹脂
(信越化学工業製)を充填し導光板31を製造した。次
にフレキシブル回路基板(新藤電子製)36に電気回路
を加工後、発光通路を穴あけし、更にRC−LED(イ
ンフィニオン製)35の搭載、金線38の結線、絶縁樹
脂(ナミックス製)39の封止を行い34のような発光
板を製造した。尚、発光部37は導光体として使用した
透明シリコーン樹脂にて封止した。その後、導光板と発
光板を一体化し集合型光装置を製造した。Example 2 A collective light emitting device as shown in FIG. 3 was manufactured as follows. The reflective surface 32 was processed by pressing the glossy metal film, and the inside thereof was filled with a transparent silicone resin (manufactured by Shin-Etsu Chemical Co., Ltd.) as the light guide 33 to manufacture the light guide plate 31. Next, after processing an electric circuit on a flexible circuit board (manufactured by Shindo Electronics) 36, a light emitting passage is drilled, further mounting of an RC-LED (manufactured by Infineon) 35, connection of a gold wire 38, and formation of an insulating resin (manufactured by Namics) 39. Sealing was performed to produce a light emitting plate such as 34. The light emitting section 37 was sealed with a transparent silicone resin used as a light guide. Thereafter, the light guide plate and the light emitting plate were integrated to produce a collective optical device.
【0031】この集合型発光装置を文字表示部品に採用
したところ、従来の表示装置に比べて情報量が数倍で数
段に鮮明な表示が可能となった。When this collective light emitting device is used as a character display component, the amount of information is several times as large as that of a conventional display device, and a clear display in several steps is possible.
【0032】[0032]
【発明の効果】本発明は、入出射光効率の良い集合型受
発光装置を提案するものであり、複数の導光体と複数の
受発光素子を接続させることにより、低コストで多目的
使用が可能な面受発光装置を提供するものである。The present invention proposes a collective type light receiving / emitting device having high light input / output efficiency. By connecting a plurality of light guides and a plurality of light receiving / emitting elements, it can be used at low cost for multipurpose use. It is intended to provide a simple surface light emitting and receiving device.
【図1】 本発明の受発光装置の一例を示す図である。FIG. 1 is a diagram showing an example of a light emitting and receiving device of the present invention.
【図2】 本発明の受発光装置(断面)の一例を示す図
である。FIG. 2 is a diagram showing an example of a light emitting / receiving device (cross section) of the present invention.
【図3】 本発明の受発光装置(断面)の一例を示す図
である。FIG. 3 is a diagram illustrating an example of a light emitting / receiving device (cross section) of the present invention.
1、21、31 導光板 22、32 反射面 3、23、33 導光体 4、24、34 受発光板 25、35 受発光素子 20、26、36 回路基板 27、37 受発光面 38 金線 39 封止材料 1, 21, 31 Light guide plate 22, 32 Reflective surface 3, 23, 33 Light guide 4, 24, 34 Light emitting / receiving plate 25, 35 Light emitting / receiving element 20, 26, 36 Circuit board 27, 37 Light emitting / receiving surface 38 Gold wire 39 sealing material
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 5C096 AA00 AA21 BA04 CC06 CD04 CD22 FA01 5F073 AB02 AB25 BA01 FA29 5F088 AA01 BA16 BA20 BB01 BB10 EA04 JA14 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 5C096 AA00 AA21 BA04 CC06 CD04 CD22 FA01 5F073 AB02 AB25 BA01 FA29 5F088 AA01 BA16 BA20 BB01 BB10 EA04 JA14
Claims (6)
光板と受発光素子を整列配置した受発光板を一体化した
装置において、導光体が受発光素子側に向けて先細りと
なる形状を有しており、導光体と受発光素子が同一光軸
上に整列配置されていることを特徴とする集合型受発光
装置。In an apparatus in which a light guide plate in which light guides surrounded by a reflection surface are arranged and a light receiving and emitting plate in which light receiving and emitting elements are arranged are integrated, the light guide tapers toward the light receiving and emitting element side. Wherein the light guide and the light receiving / emitting element are arranged on the same optical axis.
列配置した構造を有しており、該凸型導光体が光反射性
中空金属の内部に光透過体を充填する方法または凸状光
透過体の外側を反射加工する方法等で製造されているこ
とを特徴とする請求項1に記載の集合型受発光装置。2. The light guide plate has a structure in which convex light guides surrounded by a reflection surface are arranged and arranged, and the convex light guide fills a light reflective hollow metal with a light transmitting body. 2. The collective light emitting / receiving device according to claim 1, wherein the light emitting / receiving device is manufactured by a method of performing reflection processing on the outside of the convex light transmitting body.
周に配置されており、導光体の受発光素子側先端部と受
発光素子の受発光部が接続していることを特徴とする請
求項1又は請求項2に記載の集合型受発光装置。3. A light receiving / emitting element of the light receiving / emitting element is arranged on an outer periphery of a light receiving / emitting surface, and a light emitting / receiving element of the light receiving / emitting element is connected to a front end of the light guide on the light receiving / emitting element side. The collective type light emitting / receiving device according to claim 1 or 2, characterized in that:
在し接続されていることを特徴とする請求項3に記載の
集合型受発光装置。4. The collective type light receiving / emitting device according to claim 3, wherein the light guide and the light receiving / emitting element are connected via a flexible transparent material.
ことを特徴とする請求項1から請求項4のいずれか1項
に記載の集合型受発光装置。5. The collective type light emitting / receiving device according to claim 1, wherein the light guide plate and the light receiving / emitting plate have a flexible structure.
(導光体と受発光素子の一組)から複数の単位で部分的
に使用又は切断分離し使用することができる構造である
ことを特徴とする請求項1から請求項5のいずれか1項
に記載の集合型受発光装置。6. A structure in which the light emitting and receiving device can be used not only for the entire surface but also for one unit (a set of a light guide and a light emitting and receiving element), which is partially used or cut and separated in a plurality of units. The collective type light emitting / receiving device according to any one of claims 1 to 5, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000232550A JP2002050777A (en) | 2000-08-01 | 2000-08-01 | Aggregate type light-receiving/emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000232550A JP2002050777A (en) | 2000-08-01 | 2000-08-01 | Aggregate type light-receiving/emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002050777A true JP2002050777A (en) | 2002-02-15 |
Family
ID=18725218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000232550A Pending JP2002050777A (en) | 2000-08-01 | 2000-08-01 | Aggregate type light-receiving/emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002050777A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007127909A (en) * | 2005-11-07 | 2007-05-24 | Meidensha Corp | Led indicator, surface panel of led indicator, and light shielding plate |
| JPWO2009008117A1 (en) * | 2007-07-09 | 2010-09-02 | 三菱電機株式会社 | Infrared signal transmitter |
| JP2011211179A (en) * | 2010-03-09 | 2011-10-20 | Jsr Corp | Device and method for photoelectric conversion, and composition for forming optical waveguide, and cured product of the optical waveguide |
-
2000
- 2000-08-01 JP JP2000232550A patent/JP2002050777A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007127909A (en) * | 2005-11-07 | 2007-05-24 | Meidensha Corp | Led indicator, surface panel of led indicator, and light shielding plate |
| JPWO2009008117A1 (en) * | 2007-07-09 | 2010-09-02 | 三菱電機株式会社 | Infrared signal transmitter |
| JP4931998B2 (en) * | 2007-07-09 | 2012-05-16 | 三菱電機株式会社 | Infrared signal transmitter |
| JP2011211179A (en) * | 2010-03-09 | 2011-10-20 | Jsr Corp | Device and method for photoelectric conversion, and composition for forming optical waveguide, and cured product of the optical waveguide |
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