JP2002050289A - Plasma display panel and method of manufacturing the same - Google Patents

Abstract

(57) Abstract: A large-sized PDP is manufactured by combining a plurality of substrates of a size that can be manufactured by the current technology. SOLUTION: A plurality of sub-back substrates each having a rectangular shape and having an electrode having a lead terminal on one side are arranged on a back support substrate which abuts end faces without lead terminals and supports the plurality of sub-back substrates in a joined state, A plurality of sub-front substrates, each having a rectangular electrode having a lead terminal on one side, are arranged facing the sub-back substrate, with the end faces having no lead terminals facing each other, and the plurality of sub-front substrates are bonded thereon. The front support substrate to be supported by is disposed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel (PDP) and a method of manufacturing the same, and more particularly, to a large-sized 120-inch class PDP and a method of manufacturing the same.

[0002]

2. Description of the Related Art A PDP is a self-luminous display panel in which a pair of substrates (usually, glass substrates) are opposed to each other with a small space therebetween, and a sealed gas discharge space is formed by sealing the periphery. It is.

[0003] An AC type surface discharge PDP will be described as an example of the prior art. This type of PDP is usually composed of a front substrate and a rear substrate. A display electrode, a dielectric layer, and a protective layer for generating a display discharge are formed inside the front substrate, and an address electrode for writing display data and a discharge space are formed inside the rear substrate. Partition walls for partitioning and phosphor layers are formed.

In order to form these structures on a substrate, usually, a photo process is used for electrodes, a printing method is used for a dielectric layer and a phosphor layer, and a sand blast method is used for partition walls. In the panel to be a display device, a front substrate (front panel assembly) on which these structures are formed and a rear substrate (rear panel assembly) are arranged to face each other, and the periphery is sealed with low-melting glass. And a discharge gas is sealed in the discharge space.

[0005]

In recent years, PDPs can be manufactured up to large flat panel displays with a diagonal of 40 to 60 inches. However, as the panel size becomes larger, the increase in manufacturing equipment cost and the decrease in production yield become more serious problems. Further, for those exceeding 60 inches, there is practically no manufacturing equipment that can be used in the photo process or the printing process, and it is extremely difficult from a technical and economical point of view to produce a large display of 60 inches or more. there were.

The present invention has been made in view of such circumstances, and is intended to manufacture a plasma display panel in which a large-sized PDP is manufactured by combining a plurality of substrates of a size that can be manufactured by the current technology. It provides a method.

[0007]

SUMMARY OF THE INVENTION According to the present invention, a plurality of one-sided sub-boards are formed by abutting a plurality of one-sided sub-boards each having a rectangular electrode having at least one side with a drawn-out terminal on an end surface having no drawn-out terminal. Are disposed on a first support substrate that supports in a bonded state, and a plurality of sub-substrates on the other side in which a rectangular electrode having a lead-out terminal on at least one side is formed facing the one sub-substrate. A method for manufacturing a plasma display panel, comprising the steps of arranging end faces without holes and abutting thereon, and arranging a second support substrate for supporting a plurality of other sub-boards in a joined state.

According to the present invention, a plurality of one-sided sub-boards and a plurality of other-sided sub-boards are sandwiched between the first support substrate and the second support substrate to form one large PDP. Therefore, most of the production lines of 40-60 inch diagonal which are currently in practical use are applied as they are, and large PD
P can be produced. For example, if four substrates are used, a large PDP having a diagonal size of 80 to 120 inches can be relatively easily manufactured.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, as one of the sub-substrate and the other-side sub-substrate, an insulating substrate made of glass, quartz, ceramic, or the like having a rectangular electrode having at least one extraction terminal formed thereon, Substrates in which the surface of a metal plate is covered with an insulating film, and substrates on which desired components such as an insulating film, a dielectric layer, and a protective film are formed, are included.

The electrode only needs to have a lead terminal on at least one side. This electrode is not particularly limited, and can be formed using any electrode material and formation method known in the art. As the electrode material, for example, I
Transparent materials such as TO, SnO ₂ , ZnO, Ag, Au,
Metal materials such as Al, Cu, Cr and alloys thereof, and a laminate thereof (for example, a laminate structure of Cr / Cu / Cr) can be used. As a method of forming the electrode,
By combining a film formation method such as a vapor deposition method or a sputtering method with an etching method, electrodes can be formed in a desired number, thickness, width, and interval.

The first support substrate and the second support substrate are not particularly limited, and any of a flat glass substrate, a ceramic substrate, and a metal plate (only a back substrate) known in the art can be applied. it can.

In the above configuration, the plurality of one-sided sub-boards can be composed of, for example, two or four sub-backed boards, and correspondingly, the plurality of the other-sided sub-boards are also composed of, for example, two. It can be composed of one or four sub-front substrates. In the case of a configuration including two sub-back substrates and two sub-front substrates, these sub-substrates may be joined in a vertical direction or in a left-right direction. In addition, one of the sub rear substrate and the sub front substrate is made into two sheets,
It is good also as composition which made the other four pieces.

This configuration is merely an example, and the number of divisions of the sub-substrate is not limited to this. For the sub-back substrate, for example, if the substrate has electrode lead terminals extending vertically, In the vertical direction, the substrate is divided into two at the maximum, but in the horizontal direction, the substrate may be divided into two or more parts. Also, regarding the sub front substrate,
For example, in the case of a substrate on which the lead-out terminals of the electrodes extend in the left-right direction, the substrate is divided into two at the maximum in the left-right direction, but may be two or more in the vertical direction.

When the number of the sub-back substrate and the number of the sub-front substrate are the same and oppose each other, the sub-display unit composed of the sub-back substrate and the sub-front substrate installed opposite thereto is independent. The display unit can be driven by an independent driver by a lead terminal formed on one or two sides of the display unit.

It is desirable that a boundary between adjacent sub-display units is provided in a non-display area.
By allocating an area that does not affect the display of the completed large PDP to the boundary, it is possible to eliminate the influence of the boundary on the display.

A ventilation space is provided between one or both of the first support substrate and one of the sub-substrates and between the second support substrate and the other sub-substrate. Is also good. In other words, in principle, the support substrate may be a substrate having the same surface smoothness as the sub-substrate, but when the panel is finally sealed and sealed, the support substrate and the sub-substrate are ventilated. If you have any problems,
The sub-substrate may be arranged on the support substrate via a spacer such as a bead, and the ventilation conductance may be taken.
Also, a method of rushing the surface of the support substrate by sandblasting or the like is effective. Without providing a ventilation space, a heat-resistant adhesive or a low-melting glass fired film whose softening point is about the same as that of a sealing material is formed on the support substrate. The sub-substrate may be completely bonded.

Further, a strip-shaped plate having a thickness substantially equal to that of each sub-board is pressed against a side perpendicular to the side from which the terminals of each of the sub-boards on the front and back sides are taken out, and on the side where no contact is made. The substrate and the support substrate on each side are sealed, and at the same time, the height between the substrates is increased, and leakage of the abutting portion is prevented.

An abutting surface between the sub-boards on one side;
A bonding hole is provided on the mating surface between the sub-boards on the other side, and after the sub-boards on the one side are mated, and after the sub-boards on the other side are mated, sealing holes are respectively formed in the bonding holes. It is desirable to fill the material. Thereby, the confidentiality in the thickness direction of the sub-substrate can be reliably ensured.

Hereinafter, embodiments of the present invention will be described based on examples with reference to the drawings. Note that the present invention is not limited by this.

First, the PD manufactured by the manufacturing method of the present invention
The basic configuration of P will be described using the PDP shown in FIG. 1 as an example.

FIG. 1 is a perspective view partially showing a typical AC type three-electrode surface discharge type PDP as a color display PDP. It should be noted that the configuration shown in the drawing is an example, and the manufacturing method of the present invention is not limited to the PDP having this configuration, and any display panel including a front substrate and a rear substrate can be used. The present invention can be applied to a display panel.

The PDP 10 includes a front panel assembly and a rear panel assembly.

The front panel assembly is generally
A pair of stripe-shaped display (sustain) electrodes X and Y are formed on the front substrate 11 made of glass for each display line L in parallel in the horizontal direction, and a dielectric layer 17 is formed so as to cover the display electrodes X and Y. Is formed, and a protective film 18 is formed on the dielectric layer 17.
Is formed.

The display electrodes X and Y are usually made of ITO, SnO
₂ to reduce the resistance of the transparent electrode 12 and the electrode,
For example, the bus electrodes 13 are made of metal such as Ag, Au, Al, Cu, Cr and a laminate thereof (for example, a laminate structure of Cr / Cu / Cr). Display electrodes X, Y
Can be formed in a desired number, thickness, width and interval by combining a film forming method such as a vapor deposition method and a sputtering method with an etching method. Of the display electrodes X and Y, the display electrode Y is usually used as a scan electrode.

The dielectric layer 17 is formed of a material usually used for a PDP. Specifically, for example, it can be formed by applying a paste composed of a low-melting glass powder and a binder on a substrate by a screen printing method or the like, and firing the paste.

The protective film 18 is provided to protect the dielectric layer 17 from damage caused by ion collisions caused by discharge during display. The protective film 18 is made of, for example, MgO, C
It is made of aO, SrO, BaO or the like.

The back panel assembly is generally
A plurality of stripe-shaped address (data) electrodes A are formed in a vertical direction on a rear substrate 21 made of glass, and a dielectric layer 24 is formed so as to cover the address electrodes A. A plurality of stripe-shaped partitions 29 for partitioning the discharge space 30 are formed in parallel between the address electrodes A, and stripe-shaped phosphor layers 28R, 28G, 28B are formed on the bottom and side surfaces in the groove between the partitions 29. It has a formed configuration.

As the dielectric layer 24, the same type as the dielectric layer 17 on the front substrate 11 can be used.

The address electrodes A are, for example, Ag, Au, A
l, Cu, Cr and their laminates (eg Cr / Cu
/ Cr laminated structure). Address electrode A
Similarly to the display electrodes X and Y, a desired number, thickness, width and interval are formed by combining a film forming method such as a vapor deposition method and a sputtering method and an etching method (in the case of Ag, a printing method is used). can do.

The partition 29 is formed by a sand blast method, a printing method,
It can be formed by a photoetching method or the like. For example, it can be formed by applying a paste composed of a low-melting glass powder and a binder on the dielectric layer 24 and firing it, followed by cutting by a sand blast method. Alternatively, it can be formed by using a photosensitive resin as a binder, baking after exposure and development using a mask.

The phosphor layers 28R, 28G, and 28B are formed by partitioning a phosphor paste containing phosphor powder and a binder.
In the groove between the screen printing, or applied by a method using a dispenser, etc., after repeating this for each color,
It can be formed by firing. The phosphor layers 28R, 28G, and 28B can be formed by a photolithography method using a sheet-like phosphor layer material (a so-called green sheet) containing a phosphor powder and a binder. In this case, a sheet of a desired color is attached to the entire display area on the substrate, exposure and development are performed, and this is repeated for each color, whereby a phosphor layer of each color can be formed between the corresponding partition walls. it can.

In the PDP 10, the above-mentioned front panel assembly and the rear panel assembly are arranged so as to face each other so that the display electrodes X and Y and the address electrodes A are orthogonal to each other. It is manufactured by filling the enclosed discharge space 30 with a discharge gas such as neon or xenon. In this PDP 10, a pair of display electrodes X,
The discharge space 30 at the intersection of Y and the address electrode A becomes one cell area (unit light emitting area) which is the minimum unit of display.

Hereinafter, a method of manufacturing the PDP of the present invention applied to the manufacturing of the PDP 10 as described above will be described. In this example, a 120 inch diagonal VGA (640 × 480 pixels)
PDP for SXGA (1280 x 1024 pixels)
Will be described. In this case, the pixel size is about 3 mm square (the sub-pixel size is 1 × 3 mm).

FIGS. 2 to 4 are explanatory views showing an outline of the manufacturing method of the present invention. FIG. 2 shows a back support substrate and a sub back substrate. FIG. 3 shows a sub front substrate. 1 shows a substrate. First, the manufacturing method of the present invention will be briefly described. In the manufacturing method of the present invention, a sub-back substrate on which an address electrode, a dielectric layer, a partition and a phosphor layer are formed, a display electrode, a dielectric layer and A sub-front substrate on which a protective layer is formed is manufactured by a conventional process. Next, four sub-back substrates 32a, 32b, 32c, and 32d are arranged on a back support substrate 31 which is a housing for a large PDP and also serves as an airtight substrate (see FIG. 2). Subsequently, the four sub front substrates 33a, 33b, 33c, 33d are arranged thereon as shown in FIG. 3 (see FIG. 3), and the front support substrate 34 is overlaid thereon (see FIG. 4). Each substrate is hermetically sealed in a timely manner in consideration of hermeticity. After assembling and sealing, the inside of the panel is evacuated and a discharge gas is sealed to produce a large PDP.

Next, details of the manufacturing method of the present invention will be described. 5 to 26 are explanatory views showing one embodiment of a method of manufacturing a PDP according to the present invention in the order of steps. In these figures,
6 shows a cross section taken along the line AA 'in FIG. 5, and FIG. 7 shows a vertical cross section taken along the line BB' in FIG. 9 shows a cross section taken along line AA 'of FIG. 8, and FIG. 10 shows a vertical cross section taken along line BB' of FIG. FIG. 12 is a sectional view taken along line AA ′ of FIG.
FIG. 13 shows a cross section taken along a line BB 'in FIG. Figure 1
5 is a cross section taken along the line AA 'in FIG. 14, and FIG.
The B 'vertical section is shown. FIG. 18 is a cross section taken along the line AA ′ of FIG.
FIG. 19 shows a vertical section taken along line BB 'of FIG. FIG. 21 shows FIG.
FIG. 22 shows a vertical cross section taken along the line BB 'of FIG. 20. 24 shows a cross section taken along the line AA 'in FIG. 23, FIG. 25 shows a cross section taken along the line CC' in FIG. 23, and FIG. 26 shows a vertical cross section taken along the line BB 'in FIG.

First, four sub-back substrates having structures such as an address electrode, a dielectric layer, partition walls, and a phosphor layer formed on a glass substrate are manufactured. Glass substrates having the same thickness and substantially the same size are used. The four sub-sub boards are an upper left sub-rear board, an upper right sub-rear board, a lower left sub-sub board, and a lower right sub-back board, and the end faces of these four substrates are abutted. In this case, the substrate is one large rear panel assembly.

On the other hand, four sub-front substrates having structures such as a display electrode, a dielectric layer and a protective layer formed on a glass substrate are manufactured. Glass substrates having the same thickness and substantially the same size are used. These four sub-front boards are also an upper left sub-front board, an upper right sub-front board, a lower left sub-front board, and a lower right sub-front board.
The substrate is such that one large front panel assembly is obtained by abutting the end faces of the two substrates.

The four sub rear substrates and the four sub front substrates are manufactured by the manufacturing method known in the art described with reference to FIG.

Next, as shown in FIGS. 5 to 7, on one large back support substrate 31, an upper left sub back substrate 32a, an upper right sub back substrate 32b, and a lower left sub back substrate 32c are provided. , Four sub-back substrates 32d for the lower right sub-back substrate 32d are arranged. Back support board 31 to be used
Any substrate can be used as long as it can withstand a heat cycle (about 450 ° C.) in a subsequent sealing step (a step of melting and bonding a sealing material). Examples of the support substrate include a glass substrate, a ceramic substrate, and a metal substrate. Substrate (for example, titanium)
And the like. If the working point (the temperature for bonding) of the sealing material may be low, the heat-resistant temperature of the support substrate is correspondingly lowered.

Next, as shown in FIGS. 8 to 10, the sub-back substrates 32a, 32
After applying the sealing material 35 to the peripheral portions of b, 32c, and 32d with a dispenser or the like, drying and curing (or ultraviolet curing)
Let it. Examples of the sealing material 35 include a paste obtained by adding a binder resin, a solvent, and the like to a low-melting glass frit.

At this time, in order to further ensure the confidentiality when the large PDP is completed, a semi-lunar bonding hole described below is provided in the sub-back substrate.

FIG. 27 is an explanatory view showing a bonding hole provided in the sub-back substrate, FIG. 28 is an explanatory diagram showing a state where the sub-back substrate having the bonding hole is bonded, and FIG. 29 is an enlarged view showing a longitudinal section of the bonding hole. It is. For example, the semi-lunar bonding hole 36 is formed by connecting the edge (butting surface) of the sub-back substrate 32a to the sub-back substrate 3a.
After processing to the edge of 2b (see FIG. 27) and arranging the two sub-back substrates 32a and 32b (see FIG. 28), a sealing material 35 is injected into the joint hole 36 (FIG. 29). ), And confidentiality in the thickness direction of the sub-back substrate can also be ensured.

Next, as shown in FIGS. 11 to 13, a sealing material 35 is applied in advance to the upper and lower surfaces of a strip-shaped glass member 37 having a thickness of about a sub-back substrate (or a material obtained by firing the sealing material once). ) Are placed on the back support substrate 31 next to the sub-back substrates 32a and 32c and next to the sub-back substrates 32b and 32d. The glass member 37 seals between two short sides of the back support substrate 31 and a portion of the side on which the electrode terminals of the sub front substrates 33a to 33d described below are arranged inside the terminals. And at the same time, also serves to adjust the height when the sub-front substrate is later placed on the sub-back substrate and to prevent leakage at the abutting portion of the sub-back substrate.

Next, as shown in FIGS. 14 to 16, the sub front substrates 33a, 33b, 33c, 33d are arranged on the sub rear substrates 32a, 32b, 32c, 32d so as to face each other. Sub front substrates 33a, 33b, 33c, 33d
Also, a semi-lunar joining hole 38 is provided.

Next, as shown in FIGS. 17 to 19, on the sub front substrates 33a, 33b, 33c, 33d, and
The sealing material 35 is applied to the bonding holes 38 of the sub front substrate with a dispenser or the like and dried.

Next, as shown in FIGS. 20 to 22, the sealing material 35 is applied in advance to the upper and lower surfaces of a strip-shaped glass member 39 having a thickness of about the sub-front substrate (or a material obtained by firing it once). ) On the sub back substrate, next to the sub front substrates 33a, 33b, and the sub front substrates 33c, 3c.
Place next to 3d. The glass member 39 is provided between the two long sides of the front support substrate and the sub-back substrate 3 described in the next procedure.
Sealing is performed between the side on which the electrode terminals 2a to 32d are arranged and the portion inside the terminal, and at the same time, the height adjustment between the sub front substrate and the sub rear substrate and the protrusion of the sub front substrate are performed. It also serves to prevent leaks at the contact area.
The glass member 3 is located at the four corners of this large PDP.
7 and the glass member 39 are overlapped and sealed in a cross-girder shape, thereby strengthening the sealing at this portion.

Finally, as shown in FIGS. 23 to 26, the front support substrate 34 is placed on the sub front substrate.
The size of the front support substrate 34 is the size up to the outer end of the glass member 39 in the up-down direction and the size of the seal material 35 applied to the sub-front substrate in the left-right direction. Further, a tempered glass substrate can be used as the front support substrate.

Then, the periphery is clamped by clips and heated to about 450 ° C. in a sealing furnace to melt the sealing material 35 and seal the panel. After that, the inside of the panel is evacuated and then filled with a discharge gas, and the exhaust pipe (not shown) provided on the back support substrate 31 is chipped off to complete the panel.

The relationship between the exhaust of the support substrate and the sub-substrate and the bonding in the above steps will be described. In principle, the support substrate only needs to be a substrate having the same surface smoothness as the sub-substrate.However, when the panel is finally sealed and sealed, there is a problem in exhausting the support substrate and the sub-substrate. In such a case, the sub-substrate may be arranged on the support substrate via a spacer such as a bead, and the exhaust conductance may be taken. Further, a method of rushing the surface of the support substrate by sandblasting or polishing is also effective.

A heat-resistant adhesive or a low-melting glass fired film having a softening point equivalent to that of a sealing material is formed on the support substrate, and the support substrate and the sub-substrate are completely completed in the process of finally sealing a large PDP. May be adhered to.

In the above-mentioned manufacturing process, a sealing material is used everywhere in order to keep the inside of the panel airtight. However, a sealing portion may be added if necessary.

Although the support substrate and the sub-substrate are basically fixed only by the sealing material at the periphery thereof, when the positioning accuracy is improved and the exhaust conductance is improved, a heat-resistant adhesive or a softened material is used. The whole surface or a partial region may be surface-bonded using a low-melting-point glass fired film whose point is about the same as a sealing material.

FIG. 30 is an explanatory diagram showing details of the sub-back substrate. The sub-back substrate used has an address electrode, a dielectric layer, barrier ribs, and a phosphor layer formed thereon, and most of the area is not different from the conventional one. Characteristically, the structure is such that a boundary portion (joined junction portion) between the sub-substrates is a non-display portion.

That is, in the drawing, the boundary Ky of the sub-substrate along the Y-axis direction is made to be the center of the partition wall. Therefore, a partition wall 29a having a smaller width than usual is formed at an end of each sub-substrate, and when two sub-substrates are arranged, the partition wall 29 having a normal width is formed by two narrow partitions 29a. Keep it.

In the figure, a boundary portion Kx of the sub-substrate along the X-axis direction is set between display electrode pairs in which the portion becomes a non-discharge slit (usually called a reverse slit). In the reverse slit, the presence or absence of the partition wall 29 and the address electrode A is irrelevant to the display.
Even if an unconnected portion (cut portion) between the partition wall 29 and the address electrode A is formed at the boundary portion Kx of the sub-substrate, the display is not affected.

FIG. 31 is an explanatory view showing details of a boundary portion of the sub-back substrate, and FIG. 32 is an enlarged view thereof. As shown in these figures, at the boundary portion Ky of the sub-back substrate, two partitions having a small width are used as partitions having a normal width W. As a specific example, in a display with a diagonal size of 120 inches, the pixel size is about 3 mm, so that the partition wall pitch is also required to be about 1 mm. In that case, the width of the partition is about 240 μm.

Therefore, 40 degrees from the end of the sub rear substrate.
A width W1 of approximately 80 μm is set at a position separated by a distance S of μm.
Is formed in advance. As a result, the boundary Ky of the sub rear substrate is 240 μm in total across the boundary Ky.
Is formed, and the thickness of the partition wall at the sub-substrate boundary is substantially 240 μm (see FIG. 32).

In this case, the partition 29 at the end of the sub rear substrate is used.
a may have a width of, for example, about 120 μm and may be formed to the last minute of the sub-back substrate. However, in consideration of the production stability of the sub-back substrate and the accuracy of exposing the boundary portion, the partition wall may be formed with a margin. It is better to keep it.

FIG. 33 is an explanatory diagram showing the relationship between the relative positions of the four sub-back substrates and the sub-front substrate superimposed thereon. In the drawing, the boundary between the four sub-substrates is shown in an enlarged manner, and the center position where the four sub-back substrates are arranged and the center position where the four sub-front substrates are arranged are overlapped in a plane. The display electrodes X and Y are provided on the sub front substrate, and the partition walls 29 and the address electrodes A are provided on the sub back substrate.

As shown in this figure, at the boundary Ky of the sub-substrate along the Y-axis in the figure, there are two thin partitions 29a.
It is composed of For this reason, the boundary Ky is in a state of being sandwiched between the partition walls. Further, the display electrodes X and Y of the sub front substrate are not connected to each other (disconnected portions) at the position of the boundary Ky.
Is formed, but this unconnected portion is located at the partition wall portion.

At the boundary Kx of the sub-substrate along the X-axis in the figure, unconnected portions (disconnected portions) are formed in the partitions 29a, 29, the address electrodes A, and the phosphor layers (not shown). However, the unconnected portion is located in a region of the reverse slit N between the display lines L. As described above, areas that do not affect the display of the completed large PDP are allocated to the boundary Ky and the boundary Kx.

FIG. 34 is an explanatory view showing the connection state of the electrodes of the completed large PDP. As shown in this figure, a large-sized PDP manufactured by the manufacturing method of the present invention includes a display unit a including an upper left sub rear substrate 32a and an upper left sub front substrate 33a, an upper right sub rear substrate 32b and an upper right sub rear substrate 32b. Upper right display unit b composed of a lower front sub substrate 33c, lower left display unit c composed of a lower left sub rear substrate 32c and lower left sub front substrate 33c, lower right sub rear substrate 32d and lower right sub front substrate It is composed of four sets of sub-display units including a lower right display unit d composed of 33d. The display electrodes X and Y and the address electrodes A of these sub-display units are independent of each other.

Accordingly, the display electrodes X and Y of the sub-display unit a and the display electrodes X and Y of the sub-display unit c are pulled out to the left in the drawing and connected to the driver, and the display electrodes X and Y of the sub-display unit b are connected. Y and the display electrodes X and Y of the sub display unit d are drawn rightward in the figure and connected to the driver.

The address electrode A of the sub-display unit a and the address electrode A of the sub-display unit b are drawn upward in the figure and connected to a driver, and the address electrode A of the sub-display unit c and the sub-display unit d are connected. Address electrode A is drawn out downward in the figure and connected to the driver.

As these drivers for driving a large PDP, a driver for a large PDP may be manufactured, or if there is a driver corresponding to one sub-display unit,
It may be diverted and each driver may be linked.

In the above embodiment, an example was described in which a large PDP was manufactured using four sub-back substrates and four sub-front substrates, but two sub-back substrates and two sub-front substrates were used. A large PDP may be manufactured with a substrate.
In this case, the two sub-substrates may be joined in the up-down direction or in the left-right direction, and both can be easily manufactured by applying the above embodiment. Further, it is also possible to adopt a configuration in which one of the sub rear substrate and the sub front substrate is made into two sheets and the other is made into four sheets.

[0067]

According to the present invention, for example, two or four substrates having a diagonal of 40 to 60 inches which are currently in practical use are used.
A large-sized PDP having a diagonal size of 80 to 120 inches can be relatively easily manufactured by using a single PDP.

[Brief description of the drawings]

FIG. 1 is a perspective view partially showing an AC type three-electrode surface discharge type PDP.

FIG. 2 is an explanatory view showing a back support substrate and a sub back substrate in the manufacturing method of the present invention.

FIG. 3 is an explanatory view showing a sub front substrate in the manufacturing method of the present invention.

FIG. 4 is an explanatory view showing a front support substrate in the manufacturing method of the present invention.

FIG. 5 is an explanatory view showing one embodiment of a method of manufacturing a PDP according to the present invention in the order of steps.

FIG. 6 is an explanatory view showing a cross section taken along line AA ′ of FIG. 5;

FIG. 7 is an explanatory view showing a vertical section taken along the line BB ′ of FIG. 5;

FIG. 8 is an explanatory view showing one embodiment of a method of manufacturing a PDP according to the present invention in the order of steps.

FIG. 9 is an explanatory diagram showing a cross section taken along line AA ′ of FIG. 8;

FIG. 10 is an explanatory view showing a vertical section taken along line BB ′ of FIG. 8;

FIG. 11 is an explanatory view showing one embodiment of a method of manufacturing a PDP of the present invention in the order of steps.

FIG. 12 is an explanatory diagram showing a cross section taken along line AA ′ of FIG. 11;

FIG. 13 is an explanatory view showing a vertical section taken along line BB ′ of FIG. 11;

FIG. 14 is an explanatory view showing one embodiment of a method of manufacturing a PDP according to the present invention in the order of steps.

FIG. 15 is an explanatory view showing a cross section taken along line AA ′ of FIG. 14;

FIG. 16 is an explanatory view showing a vertical section taken along line BB ′ of FIG. 14;

FIG. 17 is an explanatory view showing one embodiment of the method of manufacturing a PDP of the present invention in the order of steps.

FIG. 18 is an explanatory diagram showing a cross section taken along line AA ′ of FIG. 17;

FIG. 19 is an explanatory view showing a vertical section taken along line BB ′ of FIG. 17;

FIG. 20 is an explanatory view showing one embodiment of the method of manufacturing a PDP of the present invention in the order of steps.

FIG. 21 is an explanatory view showing a cross section taken along the line AA ′ of FIG. 20;

FIG. 22 is an explanatory view showing a vertical section taken along line BB ′ of FIG. 20;

FIG. 23 is an explanatory view showing one embodiment of the method of manufacturing a PDP of the present invention in the order of steps.

FIG. 24 is an explanatory view showing a cross section taken along line AA ′ of FIG. 23;

FIG. 25 is an explanatory diagram showing a cross section taken along line CC ′ of FIG. 23;

FIG. 26 is an explanatory view showing a vertical section taken along line BB ′ of FIG. 23;

FIG. 27 is an explanatory diagram showing bonding holes provided in the sub back substrate of the example.

FIG. 28 is an explanatory diagram showing a state in which the sub-back substrates having the joining holes according to the embodiment are joined.

FIG. 29 is an enlarged view showing a vertical cross section of a joining hole of an example.

FIG. 30 is an explanatory diagram showing details of a sub rear substrate of the example.

FIG. 31 is an explanatory diagram showing details of a boundary portion of the sub-back substrate of the example.

FIG. 32 is an enlarged view showing details of a boundary portion of the sub rear substrate of the example.

FIG. 33 is an explanatory diagram showing a relative relationship between a sub-back substrate and a sub-front substrate in the example.

FIG. 34 is an explanatory diagram showing a connection state of electrodes of a large PDP according to the manufacturing method of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 PDP 11 Front side board 12 Transparent electrode 13 Bus electrode 17 Dielectric layer 18 Protective film 21 Back side substrate 24 Dielectric layer 28R, 28G, 28B Phosphor layer 29 Partition wall 30 Discharge space 31 Back support substrate 32a, 32b, 32c, 32d Sub rear substrate 33a, 33b, 33c, 33d Sub front substrate 34 Front support substrate 35 Seal material 36, 38 Bonding hole 37, 39 Glass member A Address electrode L Display line X, Y Display electrode

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Akira Tomikai 4-1-1, Kamidadanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Motonari Kifune 4 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture 1-1, Fujitsu Limited (72) Inventor Hitoshi Yamada 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa F-term within Fujitsu Limited (reference) 5C012 AA09 BC03 5C040 FA01 GA10 GB03 GB14 HA01 MA25 5C058 AA11 AB06 BA23 5C094 AA14 AA43 BA31 EA05 EB02 5G435 AA00 AA17 BB06 KK05

Claims (7)

[Claims] 1. A first method for supporting a plurality of one-sided sub-boards in a joined state, wherein a plurality of one-sided sub-boards each having a rectangular shape and having an electrode having a drawn-out terminal on at least one side are abutted on end surfaces having no drawn-out terminals. A plurality of rectangular sub-boards each having an electrode having a lead-out terminal on at least one side thereof are arranged on the support substrate, and the end faces without the lead-out terminals are arranged so as to face each other. A method for manufacturing a plasma display panel, comprising a step of disposing a second support substrate that supports a plurality of other sub-substrates in a bonded state thereon. 2. A first method for supporting a plurality of one-sided sub-boards, each of which has a rectangular electrode having a lead-out terminal on one side, with end faces having no lead-out terminals and supporting the plurality of one-sided sub-boards in a joined state. Disposed on a support substrate, in a direction perpendicular to the arrangement direction of the lead terminals of the one side sub-board, and on a side where no butting is performed, a sealing material is formed on at least one surface; A first strip-shaped plate having substantially the same thickness is abutted, and a plurality of rectangular sub-boards each having an electrode having a lead-out terminal formed on one side are opposed to the one sub-board. The sealing material is formed on at least one surface in a direction perpendicular to the arrangement direction of the lead terminals of the sub-substrate on the other side and on the side where the butting is not performed. A second strip-shaped plate having substantially the same thickness as the other-side sub-board is abutted, and the second sub-board is supported on the plurality of other-side sub-boards in a joined state. A method for manufacturing a plasma display panel, comprising the step of disposing a support substrate. 3. An abutting surface between sub-boards on one side and an abutting surface between sub-boards on the other side,
2. The method according to claim 1, further comprising the step of: providing a bonding hole, filling the bonding holes with a sealing material after the sub-substrates on one side and the sub-substrates on the other side are butted together. Or the method for manufacturing a plasma display panel according to 2. 4. A first support substrate and an electrode disposed on the first support substrate and having a rectangular shape and having a lead-out terminal on one side are formed, and end faces having no lead-out terminal are brought into contact with each other to form a first support substrate. A plurality of one-sided sub-boards supported in a joined state on the support board, and arranged in a direction perpendicular to the arrangement direction of the lead-out terminals of the one-sided sub-board, and in contact with a side that does not abut,
A first strip-shaped plate having a seal material formed on at least one surface and having substantially the same thickness as the sub-substrate on one side; and a rectangular-shaped lead-out terminal disposed on one side of the sub-substrate. And a plurality of sub-boards on the other side, which are arranged with their end faces having no lead-out terminals abutted with each other, in a direction perpendicular to the arrangement direction of the lead-out terminals on the other side of the sub-board, and no butting is performed. Placed in contact with the side,
A second strip-like plate having a seal material formed on at least one surface and having substantially the same thickness as the other sub-substrate; and a plurality of other sub-substrates disposed on the other sub-substrate. And a second support substrate for supporting the substrates in a bonded state, wherein a discharge gas is sealed in a space surrounded by a seal material between the plurality of one-side sub-substrates and the plurality of other sub-substrates opposed to each other in the bonded state. Plasma display panel. 5. The plasma display panel according to claim 4, wherein a boundary between adjacent sub-display units is provided in a non-display area. 6. A sub-display unit composed of a sub-back substrate and a sub-front substrate disposed opposite to the sub-rear substrate, is provided with lead terminals formed on two sides of the display unit.
The plasma display panel according to claim 4, wherein the plasma display panel is driven by an independent driver. 7. The plasma according to claim 4, wherein ventilation spaces are provided between the first support substrate and the one-side sub-substrate and between the second support substrate and the other-side sub-substrate. Display panel.