JP2001311063A - Conductive adhesive tape - Google Patents
Conductive adhesive tapeInfo
- Publication number
- JP2001311063A JP2001311063A JP2001070530A JP2001070530A JP2001311063A JP 2001311063 A JP2001311063 A JP 2001311063A JP 2001070530 A JP2001070530 A JP 2001070530A JP 2001070530 A JP2001070530 A JP 2001070530A JP 2001311063 A JP2001311063 A JP 2001311063A
- Authority
- JP
- Japan
- Prior art keywords
- conductive adhesive
- metal film
- conductive
- thickness
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- 229920006267 polyester film Polymers 0.000 claims abstract description 22
- 239000000853 adhesive Substances 0.000 claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 claims abstract description 19
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000011888 foil Substances 0.000 description 31
- 230000003078 antioxidant effect Effects 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
- C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、導電性接着テー
プ、特に導電性金属フィルムをポリエステルフィルム、
例えばポリ(エチレンテレフタレート)(PET)ウェブ
支持体上に蒸着し、次いで導電性接着剤の層を上記導電
性金属フィルム上に被覆することにより形成され、酸化
防止性能および可撓性が向上され、かつ製造コストが低
減された導電性接着テープに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive adhesive tape, in particular, a conductive metal film formed of a polyester film,
For example, formed by vapor deposition on a poly (ethylene terephthalate) (PET) web support, and then coating a layer of conductive adhesive on the conductive metal film to improve antioxidant performance and flexibility; The present invention relates to a conductive adhesive tape with reduced manufacturing cost.
【0002】[0002]
【従来の技術】「ホイルテープ(foil tap
e)」は電気接続用に2つ以上の導電体間を接着するの
に用いられる金属箔を含む1種の接着テープであり、コ
ンピュータモニター、TVスクリーン、自動車携帯電
話、または電磁妨害(EMI)遮蔽および静電散逸(s
tatic dissipation)に対する、TC
O‐99(または95、92)および/またはMPR
IIに適合することが必要な装置に一般に広く用いられ
てきた。例えば、図1または2に示したホイルテープの
用途では、ホイルテープTはそれぞれ所定の長さを有
し、ブラウン管(CRT)Sのまわりの金属フレームに
接着しており、上記CRTの静電荷を上記テープTによ
り散逸し、上記CRTにEMI遮蔽を確立する。2. Description of the Related Art "Foil tap"
e) "is a type of adhesive tape that includes a metal foil used to bond between two or more conductors for electrical connection, such as a computer monitor, TV screen, car phone, or electromagnetic interference (EMI). Shielding and electrostatic dissipation (s
TC for static disposition
O-99 (or 95, 92) and / or MPR
It has been widely used in devices that need to meet II. For example, in the foil tape application shown in FIG. 1 or 2, the foil tapes T each have a predetermined length and are adhered to a metal frame around a cathode ray tube (CRT) S, so that the electrostatic charge of the CRT is reduced. Dissipated by the tape T to establish EMI shielding on the CRT.
【0003】通常、従来のホイルテープは、延性金属、
例えばアルミニウムまたは銅から成り、約50μmの厚
さD1を有する金属箔11および上記金属箔11上に平
坦に適用した約30μmの厚さD2を有する導電性また
は非導電性接着剤の層12を主に含む実質的に図3に示
した構造から成る。上記従来のホイルテープ1のそのよ
うな構造および製造方法のために、最終ホイルテープに
製造する前に長時間空気に暴露され、反対面を酸化され
るので、予備作製した金属箔(例えば、アルミニウムま
たは銅箔)を予め準備しなければならない。このこと
は、上記ホイルテープの導電性を低下させる。さもなけ
れば、上記金属箔が酸化するのを防止するため、上記金
属箔に酸化防止処理を施すことが必要である。所望の引
張強さを保持するために、従来のホイルテープはより厚
くしてあり(一般に50μm以上)、そのために上記金
属箔11は損傷を受けないかまたは強靭である。そのこ
とが、上記ホイルテープが適用される物体の外形に伴っ
て曲がる能力に悪影響を与える。従来のホイルテープ1
はより厚い金属箔11を必要とするので、上記金属箔1
1の取り扱い、移送および貯蔵が複雑になり、かつ経費
がかかり、上記ホイルテープの製造コストが高くなる。[0003] Usually, conventional foil tapes are made of ductile metal,
A metal foil 11 made of, for example, aluminum or copper and having a thickness D 1 of about 50 μm and a layer 12 of a conductive or non-conductive adhesive having a thickness D 2 of about 30 μm applied flat on said metal foil 11 , And substantially the structure shown in FIG. Due to such a structure and the manufacturing method of the above-mentioned conventional foil tape 1, a prefabricated metal foil (for example, aluminum Or copper foil) must be prepared in advance. This reduces the conductivity of the foil tape. Otherwise, in order to prevent the metal foil from being oxidized, it is necessary to perform an antioxidation treatment on the metal foil. In order to maintain the desired tensile strength, conventional foil tapes are made thicker (typically 50 μm or more), so that the metal foil 11 is undamaged or tough. That adversely affects the ability to bend with the outer shape of the object to which the foil tape is applied. Conventional foil tape 1
Requires a thicker metal foil 11, the above metal foil 1
The handling, transport and storage of 1 are complicated and costly, and the production cost of the foil tape is high.
【0004】[0004]
【発明が解決しようとする課題】上記のような問題を解
決するため、本発明の第1の目的は、金属フィルムの厚
さおよび総テープ厚さを低減して、金属フィルムが酸化
するのを抑制し、テープの可撓性を向上し、製造コスト
を低減した導電性接着テープを提供することである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a first object of the present invention is to reduce the thickness of the metal film and the total tape thickness to prevent the metal film from being oxidized. An object of the present invention is to provide a conductive adhesive tape that suppresses the pressure, improves the flexibility of the tape, and reduces the manufacturing cost.
【0005】[0005]
【課題を解決するための手段】特に、本発明の導電性接
着テープは、ポリエステルフィルムのウェブ、ポリエス
テルフィルムのウェブ上に導電性金属を蒸着することに
より形成される導電性金属フィルム、および上記金属フ
ィルム上に平坦に適用された導電性接着剤を含み;それ
によって、上記ポリエステルフィルムのウェブは上記テ
ープに要求される十分な引張強さを提供し、そして上記
金属フィルムの厚さおよび上記テープの総厚さがかなり
低減され、かつ上記テープの可撓性が向上される。上記
金属フィルムはポリエステルフィルムのウェブと導電性
接着剤との間に挟むので、外気から隔離され、上記テー
プの酸化防止性および導電性が向上する。In particular, the conductive adhesive tape of the present invention comprises a polyester film web, a conductive metal film formed by depositing a conductive metal on a polyester film web, and the above-mentioned metal. A conductive adhesive applied flat on the film; whereby the web of polyester film provides sufficient tensile strength required for the tape, and the thickness of the metal film and the thickness of the tape The overall thickness is significantly reduced and the flexibility of the tape is improved. Since the metal film is sandwiched between the polyester film web and the conductive adhesive, the metal film is isolated from the outside air, and the antioxidant property and the conductivity of the tape are improved.
【0006】[0006]
【発明の実施の形態】ここで、図4に関して、本発明の
導電性接着テープ2の好ましい態様の1つは、主にポリ
エステルフィルムのウェブ21、導電性金属フィルム2
2および導電性接着剤23を含み、上記ポリエステルフ
ィルム21は第1および第2表面を有し、25μmの厚
さD3を有するポリエチレンテレ(フタレート)製のウェ
ブ材料であってもよい。上記導電性金属フィルム22
(例えば、銅またはアルミニウムフィルム)は、金属材
料を上記ポリエステルフィルム21の第2表面上に蒸着
またはスパッタリングすることにより形成され、約15
μmの厚さD4を有する。上記導電性接着剤23は、ど
のような従来の導電性接着剤であってもよい。上記接着
剤を、30μmの厚さD5を有する導電性金属フィルム
22上に適用する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring now to FIG. 4, one of the preferred embodiments of the conductive adhesive tape 2 of the present invention is mainly a web 21 of a polyester film, a conductive metal film 2 or the like.
It includes 2 and the conductive adhesive 23, the above-mentioned polyester film 21 having first and second surfaces, may be a web material made of polyethylene terephthalate (phthalates) having a thickness D 3 of 25 [mu] m. The conductive metal film 22
(For example, a copper or aluminum film) is formed by evaporating or sputtering a metal material on the second surface of the polyester film 21, and is formed by about 15 minutes.
It has a thickness D 4 of the [mu] m. The conductive adhesive 23 may be any conventional conductive adhesive. The adhesive is applied on the conductive metal film 22 having a thickness D 5 of 30 [mu] m.
【0007】上記ポリエステルフィルムのウェブ21
(例えばPETウェブ)は良好な可撓性および引張強さ
を有するので、上記テープ構造を維持するのに必要不可
欠な強度を有する本発明の導電性接着テープ2を提供す
ることができる。また、上記導電性金属フィルム22は
蒸着により上記ポリエステルフィルム21の第2表面上
に直接被覆されるので、上記導電性金属フィルム22は
上記ポリエステルフィルム21上に被覆されると片面だ
け空気に暴露される。上記導電性接着剤23は、上記導
電性金属フィルム22が蒸着により形成されるとすぐに
上記導電性金属フィルム22上に適用され、そして上記
導電性金属フィルム22は上記ポリエステルフィルム2
1と導電性接着剤23との間に挟まれて上記導電性金属
フィルム22を空気から隔離する。従って、上記導電性
金属フィルム22の酸化が大きく低減される。使用に際
して、上記導電性接着剤23の表面は電気的に接続され
る物体間に直接被覆されてもよい。上記ポリエステルフ
ィルム21は上記導電性金属フィルム22を覆うので、
上記導電性接着剤23を適用すると上記導電性金属フィ
ルム22を表面酸化または腐食から保護することができ
る。The above-mentioned polyester film web 21
(For example, a PET web) has good flexibility and tensile strength, so that it is possible to provide the conductive adhesive tape 2 of the present invention having a strength necessary for maintaining the tape structure. Also, since the conductive metal film 22 is directly coated on the second surface of the polyester film 21 by vapor deposition, when the conductive metal film 22 is coated on the polyester film 21, only one surface is exposed to air. You. The conductive adhesive 23 is applied on the conductive metal film 22 as soon as the conductive metal film 22 is formed by vapor deposition, and the conductive metal film 22 is
1 and the conductive adhesive 23 to isolate the conductive metal film 22 from the air. Therefore, oxidation of the conductive metal film 22 is greatly reduced. In use, the surface of the conductive adhesive 23 may be directly coated between electrically connected objects. Since the polyester film 21 covers the conductive metal film 22,
When the conductive adhesive 23 is applied, the conductive metal film 22 can be protected from surface oxidation or corrosion.
【0008】上記ポリエステルフィルム21は良好な可
撓性および引張強さを有するので、上記テープに必要不
可欠な強度を低下することなく、上記導電性金属フィル
ム22の厚さを大きく低減することができる。上記導電
性金属フィルム22の厚さを低減することにより、上記
導電性接着テープ2の可撓性が向上され、かつ、上記テ
ープ2のコーナーで末端剥がれ(flagging)を
生じることなく、上記テープを適用する物体の表面の外
形に順応する能力が大きく向上する。Since the polyester film 21 has good flexibility and tensile strength, the thickness of the conductive metal film 22 can be greatly reduced without lowering the strength necessary for the tape. . By reducing the thickness of the conductive metal film 22, the flexibility of the conductive adhesive tape 2 is improved, and the tape can be removed without causing end peeling (flagging) at the corners of the tape 2. The ability to adapt to the contour of the surface of the object to which it is applied is greatly improved.
【0009】上記ポリエステルウェブ材料(例えばPE
Tウェブ)は金属箔より非常に安価であるので、結果と
して本発明により出発原料および製造コストを低減する
ことができる。更に、製造に際して、上記導電性接着剤
は上記導電性金属フィルムが蒸着により上記ポリエステ
ルウェブ材料上に形成されるとすぐに上記導電性金属フ
ィルム上に適用されるので、上記導電性金属フィルムに
は酸化防止処理は必要なく、金属箔の取り扱いおよび貯
蔵の必要が排除されて、製造コストが低減される。The above polyester web material (eg, PE
T-webs) are much cheaper than metal foils, and consequently the starting material and production costs can be reduced by the present invention. Further, during manufacture, the conductive adhesive is applied on the conductive metal film as soon as the conductive metal film is formed on the polyester web material by vapor deposition. No antioxidant treatment is required, eliminating the need for handling and storage of the metal foil, reducing manufacturing costs.
【0010】本発明の好ましい態様の導電性接着テープ
および現行のホイルテープの比較を以下の表に示す。A comparison between the conductive adhesive tape of the preferred embodiment of the present invention and the current foil tape is shown in the following table.
【0011】[0011]
【表1】 [Table 1]
【0012】[0012]
【発明の効果】結論として、明らかに本発明は改良され
た導電性接着テープを提供し、そしてその総厚さおよび
導電性金属フィルムの厚さを低減し、金属フィルムの酸
化防止特性および導電性接着テープの可撓性を向上し、
かつ製造コストを低減する。In conclusion, it is apparent that the present invention provides an improved conductive adhesive tape and reduces its total thickness and the thickness of the conductive metal film, and the antioxidant properties and conductivity of the metal film. Improve the flexibility of the adhesive tape,
And reduce manufacturing costs.
【図1】 コンピュータモニターまたはTVスクリーン
の外周にそれぞれ適用された4つの分離ホイルテープの
状態を示す概略図である。FIG. 1 is a schematic view showing a state of four separation foil tapes respectively applied to the outer periphery of a computer monitor or a TV screen.
【図2】 4つのホイルテープの細長いストリップがコ
ンピュータモニターまたはTVスクリーンの外周に適用
された状態を示す概略図である。FIG. 2 is a schematic diagram showing an elongated strip of four foil tapes applied to the outer periphery of a computer monitor or TV screen.
【図3】 従来のホイルテープの構造を示す概略図であ
る。FIG. 3 is a schematic view showing the structure of a conventional foil tape.
【図4】 本発明の1つの好ましい態様の導電性接着テ
ープの構造を示す断面概略図である。FIG. 4 is a schematic sectional view showing the structure of a conductive adhesive tape according to one preferred embodiment of the present invention.
1 … 従来のホイルテープ 11 … 金属箔 12 … 導電性接着剤 2 … 本発明の導電性接着テープ 21 … ポリエステルフィルムのウェブ 22 … 導電性金属フィルムコーティング 23 … 導電性接着剤 D1 … 従来のホイルテープの金属箔の厚さ D2 … 従来のホイルテープの導電性接着剤の厚さ D3 … ポリエステルフィルムのウェブの厚さ D4 … 金属フィルムの厚さ D5 … 導電性接着剤の厚さ S … スクリーン T … 導電性接着テープのホイルテープ1 ... conventional foil tape 11 ... metal foil 12 ... conductive adhesive 2 ... conductive adhesive tape 21 ... Web 22 ... conductive metal film coating 23 ... conductive adhesive D 1 ... conventional foil of the polyester film of the present invention the thickness D 2 ... thickness D 3 ... thickness thickness D 5 ... conductive adhesive web thickness D 4 ... metal film of a polyester film of a conventional foil tape conductive adhesive tape of the metal foil S: Screen T: Conductive adhesive tape foil tape
Claims (4)
ステルフィルムのウェブ;該ポリエステルフィルムの第
2表面に直接被覆された導電性金属フィルム;および該
導電性金属フィルム上に適用された導電性接着剤の層を
含む導電性接着テープ。1. A web of a polyester film having a first surface and a second surface; a conductive metal film directly coated on a second surface of the polyester film; and a conductive adhesive applied on the conductive metal film. Conductive adhesive tape containing a layer of agent.
μmを有するポリ(エチレンテレフタレート)ウェブ材料
から成る請求項1記載の導電性接着テープ。2. The method according to claim 1, wherein the polyester film has a thickness of 25.
2. The conductive adhesive tape according to claim 1, comprising a poly (ethylene terephthalate) web material having a micrometer.
ステルフィルムの第2表面上へのアルミニウム蒸着によ
って形成され、かつ厚さ15μmを有する請求項1記載
の導電性接着テープ。3. The conductive adhesive tape according to claim 1, wherein the conductive metal film is formed by aluminum deposition on the second surface of the polyester film and has a thickness of 15 μm.
さ25μmを有するポリ(エチレンテレフタレート)フィ
ルムのウェブ;該ポリエステルフィルムの第2表面に直
接蒸着され、かつ厚さ15μmを有するアルミニウム金
属フィルム;および該導電性金属フィルム上に適用さ
れ、かつ厚さ30μmを有する導電性接着剤の層を含む
請求項1記載の導電性接着テープ。4. A web of poly (ethylene terephthalate) film having a first surface and a second surface and having a thickness of 25 μm; aluminum deposited directly on the second surface of the polyester film and having a thickness of 15 μm The conductive adhesive tape according to claim 1, comprising: a metal film; and a layer of a conductive adhesive applied on the conductive metal film and having a thickness of 30 µm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW89204029 | 2000-03-14 | ||
| TW89204029 | 2000-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001311063A true JP2001311063A (en) | 2001-11-09 |
Family
ID=21665238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001070530A Pending JP2001311063A (en) | 2000-03-14 | 2001-03-13 | Conductive adhesive tape |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2001311063A (en) |
| DE (1) | DE10110394A1 (en) |
| GB (1) | GB2360228A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008516407A (en) * | 2004-10-12 | 2008-05-15 | マイ エフシー エイビー | Electrochemical device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10231065A1 (en) * | 2002-03-22 | 2003-10-23 | Tesa Ag | Pressure sensitive adhesive tape and method of manufacture |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6340216A (en) * | 1986-08-05 | 1988-02-20 | 住友スリ−エム株式会社 | Conductive tape |
| US5676812A (en) * | 1990-03-24 | 1997-10-14 | Canon Kabushiki Kaisha | Electronic equipment with an adhesive member to intercept electromagnetic waves |
| US5441809A (en) * | 1993-10-28 | 1995-08-15 | Brady U.S.A., Inc. | Dissipative cover tape surface mount device packaging |
| JPH10145080A (en) * | 1996-11-08 | 1998-05-29 | Nitto Denko Corp | Electromagnetic shield tape and electromagnetic shield wire |
| DE19930490A1 (en) * | 1998-07-02 | 2000-01-05 | Samsung Display Devices Co Ltd | Conductive adhesive tape and cathode ray tube with such an adhesive tape |
-
2001
- 2001-02-14 GB GB0103614A patent/GB2360228A/en not_active Withdrawn
- 2001-03-03 DE DE10110394A patent/DE10110394A1/en not_active Withdrawn
- 2001-03-13 JP JP2001070530A patent/JP2001311063A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008516407A (en) * | 2004-10-12 | 2008-05-15 | マイ エフシー エイビー | Electrochemical device |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2360228A (en) | 2001-09-19 |
| DE10110394A1 (en) | 2001-09-20 |
| GB0103614D0 (en) | 2001-03-28 |
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