JP2001307050A - Non-contact data carrier - Google Patents

Abstract

(57) [Summary] [Problem] When mounting an IC chip on an antenna coil,
Provided is a non-contact data carrier capable of suppressing sagging and shrinkage of a resin base material. A non-contact data carrier includes a resin base material (1).
1, a metal antenna coil 13 provided in substantially the entire area of one side of the resin base material 11, and an IC chip 20 connected to the antenna coil 13. On the other side of the resin base 11 corresponding to the IC chip 20, a resin base 11 is provided.
Is provided. When the IC chip 20 is heat-pressed to the antenna coil 13, the provision of the metal reinforcing member 26 can prevent the resin base material 11 from sagging or contracting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact data carrier having a resin base, an antenna coil and an IC chip, and more particularly to a non-contact data carrier capable of reinforcing the resin base when mounting an IC chip. About career.

[0002]

2. Description of the Related Art Conventionally, non-contact data carriers have been used in distribution systems and the like. Such a non-contact data carrier is used, for example, by being attached to a product packaging box or the product itself.

A non-contact data carrier generally includes a resin base material, a metal antenna coil provided on the resin base material, and an IC chip connected to the antenna coil.

When an electromagnetic wave is emitted from a reader to a non-contact type data carrier, an induced voltage is generated in an antenna coil to operate an IC chip.

[0005]

The non-contact type data carrier includes the metal antenna coil provided on the resin substrate as described above and the IC chip connected to the antenna coil. When mounting an IC chip on an antenna coil, it is necessary to heat-press the IC chip to the antenna coil using a heating head.

However, when an IC chip is heated and pressed by using a heating head, an excessive force or heat is applied to the resin substrate, so that the resin substrate sags or contracts, so that a non-contact data carrier can be manufactured with high precision. Can not.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide a non-contact type data carrier in which a resin substrate does not sag or shrink even when an IC chip is mounted. .

[0008]

The present invention provides a resin substrate,
An antenna provided on one side of the resin base, and an IC chip connected to the antenna, a metal reinforcing member provided on a portion corresponding to the IC chip on the other side of the resin base, A non-contact type data carrier comprising:

According to the present invention, since the metal reinforcing member is provided at a portion corresponding to the IC chip with the resin base material interposed therebetween, the IC
When the IC chip is heated and pressed to connect the chip to the antenna and mount it, heat and force applied to the IC chip can be received by the metal reinforcing member.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 are views showing one embodiment of a contactless data carrier according to the present invention.

As shown in FIG. 1, a non-contact data carrier 10 such as an IC card or an IC tag is made of PET.
Resin base material 11 and the upper surface of resin base material 11 (resin base material 11
The antenna coil 13 made of aluminum formed by etching using a photoresist layer (not shown) and the IC chip 20 connected to the antenna coil 13 are provided over substantially the entire area of one side of the antenna coil 13. .

The IC chip 20 includes an IC chip body 20a and bumps 22 provided on the bottom surface of the IC chip body 20a. The IC chip 20 holds the resin base 11 and the antenna coil 1 with the insulating adhesive 14 in a state where the bumps 22 are in contact with the antenna coil 13.
3 is fixed. Further, instead of the antenna coil 13 formed by etching, a pattern antenna formed by printing using a conductive ink or the like, or a coil-shaped antenna of a metal pattern formed by punching may be used.

As shown in FIG. 4, an area transmitting / receiving antenna 33 may be used.

On the lower surface of the resin substrate 11 (the other side of the resin substrate 11), the strength of the IC chip 20 when the IC chip 20 is heat-pressed to the antenna coil 13 is enhanced and the IC chip 2
In order to effectively release the heat from zero, a metal reinforcing member 26 made of a metal plate is provided.

The metal reinforcing member 26 will be described in more detail. As described above, the metal reinforcing member 26 corresponds to the IC chip 20 provided on one side of the resin base material 11.
On the other side. That is, the metal reinforcing member 26 is disposed to face the IC chip 20 with the resin substrate 11 interposed therebetween.

The metal reinforcing member 26 is an IC of the IC chip 20.
It has a larger outer shape than the chip body 20a, and is formed on the resin base material 11 by etching, or formed by attaching a metal plate to the resin base material 11.

When the IC chip 20 is mounted on the antenna coil 13 by heating and pressing with a heating head (not shown) via the insulating adhesive 14, a force from the heating head can be received by the metal reinforcing member 26. . Further, heat transmitted from the heating head to the IC chip 20 can be released to the metal reinforcing member 26 via the resin base material 11. Therefore IC
At the time of mounting the chip 20, excessive heat and force are not applied to the resin base 11, so that the resin base 11 can be prevented from sagging and shrinking.

As shown in FIGS. 2 and 3, a pair of ends of the antenna coil 13 are arranged inside and outside the antenna coil 13, respectively.

As shown in FIG. 1, a buffer layer 15 is provided on the upper surface of the resin base 11 so as to cover the antenna coil 13 and the IC chip 20. Further, the first protective layer 18 is provided on the buffer layer 15 via an adhesive layer (not shown).
Is provided, but the adhesive layer is not necessarily provided. Further, a metal reinforcing member 26 is provided on the lower surface of the resin base material 11.
The second protective layer 18 is provided so as to cover.

Next, the material and shape of each part will be described.

As the resin substrate 11, for example, paper or nonwoven fabric can be used in addition to a plastic film such as polyester, polyethylene, polypropylene, and polyimide. Polyester and polyimide are mainly used because of their chemical resistance and heat resistance. . Usually, the shape of the antenna coil 13 is about 40 mm × 40 mm, but the antenna coil 13 may be formed in a card shape or the like depending on the intended use and required performance. The thickness of the resin substrate 11 is 30 to 200 μm.
It has become.

The metal antenna coil 13 is made of aluminum and has a thickness of about 5 to 100 μm, but preferably 15 to 30 μm in view of cost and electrical characteristics. Further, the IC chip body 20a of the IC chip 20
Generally has a size of 1.5 mm x 1.5 mm square and a thickness of about 1
80 μm is used.

The metal reinforcing member 26 is made of aluminum, but may be made of another metal. Metal reinforcement member 2
6 is the IC chip body 20 of the IC chip 20 as described above.
a.

The buffer layer 15 is made of, for example, polyester, PVC, polyimide, polypropylene, polyethylene, or the like. However, polyester or the like is mainly used in terms of strength and heat resistance. The buffer layer 15 has a thickness of IC
Larger than the thickness of the chip 20, for example 180 to 200 μm
m.

The first protective layer 18 and the second protective layer 19
Is made of PET and has a thickness of 50 to 100 μm. Further, printing may be performed on the protective layer 18.

The non-contact data carrier 10 having such a configuration is used, for example, by being attached to a product packaging box or a product itself, and is provided with an IC chip 20 by electromagnetic waves from a reader of a distribution system (not shown). Is activated, and information from the IC chip 20 is transmitted to the reader.

Next, a description will be given of a method of manufacturing a non-contact data carrier having such a configuration. First, the resin substrate 11 is prepared, and the antenna coil 13 is formed on the upper surface of the resin substrate 11 by an etching method using a photoresist layer.

A metal reinforcing member 26 is provided on the lower surface of the resin substrate 11 by an etching method or a bonding method.

Next, the resin substrate 11 and the antenna coil 1
The IC chip 20 is mounted on the substrate 3 via the insulating adhesive 14, and the IC chip 20 is fixed by being heated and pressed by a heating head (not shown). In this case, since the metal reinforcing member 26 is formed at a position corresponding to the IC chip 20 with the resin substrate 11 interposed therebetween, the IC chip 20
The resin substrate 11 does not sag or shrink even if the substrate is heated and pressed by a heating head. That is, when the metal reinforcing member 26 is not provided, the IC
It is also conceivable that the resin base material 11 sags or shrinks due to the force and heat applied to the chip 20. However, according to the present invention, since the metal reinforcing member 26 is provided, the force and heat applied to the IC chip 20 can be received by the metal reinforcing member 26, and the sagging and shrinkage of the resin substrate 11 can be prevented.

Thereafter, the buffer layer 15 and the first protective layer 18 are superimposed on the antenna coil 13 and the IC chip 20 on the upper surface side of the resin base material 11, and the first protective layer 18 is formed on the metal reinforcing member 26 on the lower surface side of the resin base material 11. Two protective layers 19 are stacked. Next, the buffer layer 15 and the first protective layer 18 are fixed to the antenna coil 13 and the IC chip 20 by pressure bonding by a lamination method. At the same time, the second protective layer is fixed on the metal reinforcing member 26 by pressing.

[0031]

As described above, according to the present invention, when an IC chip is heat-pressed in order to connect the IC chip to an antenna coil for mounting, the IC chip is provided at a portion corresponding to the IC chip with a resin base material interposed therebetween. IC with the metal reinforcement
Heat and force applied to the chip can be received, so that sagging and shrinkage of the resin base material can be prevented. Therefore, it is possible to obtain a highly accurate non-contact data carrier in which the resin base material is not deformed.

[Brief description of the drawings]

FIG. 1 is a side view showing one embodiment of a contactless data carrier according to the present invention.

FIG. 2 is a plan view showing one embodiment of a non-contact data carrier according to the present invention.

FIG. 3 is an enlarged view showing one embodiment of a non-contact data carrier according to the present invention.

FIG. 4 is a diagram showing an area transmitting / receiving antenna.

[Explanation of symbols]

 Reference Signs List 10 Non-contact data carrier 11 Resin base material 13 Antenna coil 15 Buffer layer 20 IC chip 26 Metal reinforcing member

Claims (4)

[Claims] 1. An electronic device comprising: a resin base; an antenna provided on one side of the resin base; and an IC chip connected to the antenna, the other side of the resin base corresponding to the IC chip. And a metal reinforcing member provided on a portion thereof. 2. The non-contact data carrier according to claim 1, wherein the metal reinforcing member has an outer shape larger than that of the IC chip. 3. The non-contact data carrier according to claim 1, wherein the metal reinforcing member is formed of a metal plate formed on a resin substrate by etching. 4. The non-contact data carrier according to claim 1, wherein the metal reinforcing member is formed of a metal plate adhered on a resin base material.