JP2001358482A - Heat radiative module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiative module which can efficiently radiate heat with simple structure. SOLUTION: This heat radiative module is equipped with a board 10 having a heat generating part 11, and a heat radiative board 12 having its heat radiative fin 13 projected toward the heat generating part. The heat radiative board 12 keeps the heat radiative fin 13 in direct pressure contact with the heating part 11. A space 14 for air circulation is made between the heat generating part, the heat radiative fin 13 in direct pressure contact with the heat generating part 11 can radiate heat efficiently, and also the radiated heat is carried out of the space by flowing air, thus heat radiation efficiency can be raised more.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating module for effectively releasing heat generated from an electric element such as a CSP (abbreviation for chip size package) and an MCM (abbreviation for multi-chip module).

[0002]

2. Description of the Related Art In recent years, higher efficiency of electronic devices and the like has been demanded from the viewpoint of energy saving. A conventional heat dissipation module disclosed in Japanese Utility Model Laid-Open No. 5-31924 will be described below with reference to FIG. The heat sink body 1
A shield part 4 fixed to the printed circuit board 2 and covering the electric component 3 mounted on the printed circuit board 2 and a radiation fin 5 outside the shield part are provided. And the noise generated from the electric component 3 is blocked by the shield part 4,
The heat generated from the electric component 3 is radiated from the radiating fins 5 through the shield portion 4.

[0003]

In such a conventional heat dissipating module, the electric component 3 is covered by the shield part 4,
Since the heat radiation fins 5 are provided outside the shield part 4 in contact with the electric component 3, the heat generated from the electric part 3 is once trapped in the shield part 4 and then transmitted mainly through the shield part 4 to radiate heat. The heat is indirectly dissipated from the fins 5, and as a result, it is expected that the heat dissipating efficiency is low.

The present invention solves the above-mentioned conventional problems and provides a heat dissipation module that can efficiently dissipate heat with a simple structure.

[0005]

In order to solve the above-mentioned conventional problems, the present invention comprises a substrate on which a heat-generating component is mounted, and a heat-radiating substrate formed by projecting a heat-radiating fin toward the heat-generating component. The substrate is a heat dissipating module in which the heat dissipating fin is directly pressed against the heat generating component and a space through which air flows is formed between the substrate and the heat generating component.

According to the above-mentioned means, heat can be efficiently dissipated from the heat dissipating fins directly in contact with the heat-generating component, and the heat dissipated is conveyed by the flowing air, so that the heat dissipating efficiency can be further enhanced.

[0007]

The invention according to claim 1 of the present invention comprises a substrate on which a heat-generating component is mounted, and a heat-radiation substrate formed by projecting a heat-radiating fin to the heat-generating component side, wherein the heat-radiating substrate is provided with a heat-radiating substrate. A heat dissipating module in which a fin is directly pressed into contact with the heat generating component and a space through which air flows is formed between the fin and the heat generating component.

In the above-described embodiment, since the heat-radiating substrate directly presses the heat-radiating fin to the heat-generating component and the flowing air is present between the heat-generating component and the heat-generating component, the heat generated by the heat-generating component is directly transmitted to the heat-radiating fin to reliably dissipate heat. Further, the heat is conveyed by the air flowing between the heat radiating substrate and the heat generating component, so that the surrounding environment of the heat generating component is always kept good.

According to a second aspect of the present invention, there is provided a circuit board having a plurality of heat-generating components mounted thereon, and a heat-dissipating substrate formed by forming heat-dissipating fins opposed to the heat-generating components toward the heat-generating components. The substrate is a heat dissipating module in which each heat dissipating fin is directly pressed into contact with each of the heat generating components and forms a space through which air flows between the heat generating components.

In the above-described embodiment, since the heat-radiating substrate directly presses each heat-radiating fin to each heat-generating component and there is flowing air between each heat-generating component, the heat generated by each heat-generating component is directly transmitted to each heat-generating component. The heat is surely dissipated by the fins, and the heat is conveyed by the air flowing between the heat dissipating substrate and each heat-generating component, so that the surrounding environment of each heat-generating component is always kept good.

According to a third aspect of the present invention, there is provided a substrate on which a plurality of heat-generating components are mounted, and a heat-radiating substrate formed by projecting a plurality of heat-radiating fins toward the heat-generating components. A heat dissipating module in which a fin is directly pressed into contact with at least two or more of the heat generating components and a space through which air flows is formed between the fins and the heat generating components.

In the above-described embodiment, the heat-radiating substrate presses one heat-radiating fin directly across at least two or more heat-generating components, and since there is flowing air between each heat-generating component, at least two or more heat-radiating fins are formed. The heat generated by the heat-generating component is directly transmitted to one heat-radiating fin to reliably dissipate heat. If there is a difference in heat generation between two or more heat-generating components, the heat generated by one heat-radiating fin is large. The heat is transferred from the portion in contact with the component to the portion in contact with the heat-generating component having a small amount of heat generation, and the heat can be dissipated in a balanced manner by one radiating fin. Further, the respective heat radiation is conveyed to the outside by air flowing between the heat radiating substrate and each heat generating component, so that the surrounding environment of each heat generating component is always kept good.

According to a fourth aspect of the present invention, there is provided a substrate on which a heat-generating component is mounted, and a heat-radiating substrate formed by projecting a heat-radiating fin toward the heat-generating component. A heat dissipating module that is directly pressed and provided with a plurality of slits having cut-and-raised pieces on the side of the heat-generating component or on the side opposite to the heat-generating component, and forming a space through which air flows between the heat-radiating substrate and the heat-generating component. It is.

In the above-described embodiment, the heat-radiating board has the heat-radiating fins directly pressed against the heat-generating component, has a plurality of cut-and-raised pieces by a plurality of slits, and has flowing air between the heat-generating component. The heat generated by the heat-generating component is directly and indirectly transmitted to the plurality of cut-and-raised pieces indirectly with the heat-radiating fins, so that the heat is reliably dissipated. As a result, the environment around the heat-generating component is always kept better.

The invention described in claim 5 is the first invention.
The heat dissipation module according to claim 4, wherein the heat dissipation fins are formed by subjecting a heat dissipation substrate to a substantially semicircular or trapezoidal projection process.

In the above-described embodiment, the heat radiation fins of the heat radiation substrate can be reliably brought into contact with the heat-generating component by making use of a springback effect by processing a substantially semicircular or trapezoidal projection.

The invention described in claim 6 is the first invention.
In the description of any one of claims 4, the heat dissipation board,
This is a heat dissipation module formed by joining heat dissipation fins having a substantially semicircular arc shape, a substantially trapezoidal shape, or a continuous wave shape.

In the above-described embodiment, the radiating fins of the radiating substrate are formed separately and joined to the radiating substrate. The fins can be selected and joined to the heat dissipation board.

The invention according to claim 7 is the first invention.
The heat radiation module according to any one of claims 4 to 5, wherein the heat radiation fins are formed by processing slits, louvers, holes, or corrugations.

In the above embodiment, the radiating fins of the radiating board smoothly guide the flow of air flowing between the radiating board and each heat-generating component by slits, louvers, holes, or waveforms. It is possible to increase efficiency.

The invention described in claim 8 is the first invention.
The heat radiation module according to claim 4, wherein the heat radiation fins are configured by arranging a plurality of strips or lines processed in an arc shape or a wave shape in parallel.

In the above embodiment, the radiating fins of the radiating substrate have a flexible spring-back effect due to a plurality of strips arranged side by side or an arc or a wave formed in a linear shape, so that the fins can be flexibly attached to the heat generating component. It is possible to make contact.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A heat radiation module according to the present invention will be described below with reference to FIGS.

(Embodiment 1) FIG. 1 is a schematic side view showing a heat radiating module according to an embodiment corresponding to the first and second aspects of the present invention. FIG. 2 is an exploded view of the heat radiating module. FIG. 3 is an exploded perspective view showing a heat dissipation board and a mounting board.

Reference numeral 10 denotes a printed circuit board or the like on which a plurality of heat generating components 11 such as semiconductors such as CSP (abbreviation of chip size package) and MCM (abbreviation of multi chip module) are mounted. One set of groups arranged side by side and three further sets are arranged. Reference numeral 12 denotes a heat dissipation substrate formed of a thin flat plate made of an aluminum alloy.
A plurality of heat dissipating fins 13 having substantially the same size as 0 and protruding in a substantially trapezoidal shape integrally with each heat generating component 11 to face each heat generating component 11 are provided. The heat radiating board 12 directly presses the heat radiating fins 13 to the respective heat generating components 11 by making use of the spring back action of the heat radiating fins 13 themselves.
A space 14 in which air flows is formed between the substrate 10 and the substrate 10.
It is attached to. The means for attaching the heat radiating substrate 12 to the substrate 10 includes a plurality of mounting bolts 15 provided on the substrate 10.
And a nut 16 screwed to a mounting bolt 15 for holding down the heat dissipation board 12 fitted to the board. Reference numeral 17 denotes a spring coil wound around the mounting bolt 15 and provided between the heat radiating board 12 and the nut 16, and a spring coil serving as a biasing body of the heat radiating board 12, for pressing the heat radiating fin 13 more against the heat generating component 11. . Reference numeral 18 denotes a heat-generating component 1 in a space 14 between the substrate 10 and the heat-radiating substrate 12, cooling of the heat-radiating fins 13 and heat radiation of the heat-radiating fins 13 being transported out of the space.
1 is a cooling fan as a cooling means for always keeping the surrounding environment favorable.

In the above embodiment, when the heat-generating component 11 performs work and generates heat, this heat is transmitted to the heat-radiating fins 13 which are directly pressed against the heat-generating component 11 and is mainly radiated to the space 14. Is transported out of the space 14 by the cooling air flowing.

Therefore, the heat dissipation board 12 presses the heat dissipation fins 13 directly against the heat-generating components 11, and since the flowing air exists in the space 14 between the heat-generating components 11, the heat generated by the heat-generating components 11 is directly applied to the heat-radiation fins 13. The heat is transmitted and reliably dissipated.

In particular, the radiating board 12 presses the radiating fins 13 directly against the respective heat-generating components 11, and since there is a flowing air in the space 14 between the heat-generating components 11,
The heat generated by each heating component 11 is directly
3, the heat is reliably dissipated, and furthermore, the heat dissipated is conveyed out of the space 14 by the air flowing in the space 14 between the heat dissipating substrate and each heat-generating component, and the surrounding environment of each heat-generating component 11 is always kept good. be able to.

Further, since each of the radiation fins 13 directly pressed against each heat-generating component 11 is directly pressed against the heat-generating component 11 by utilizing the action of its own springback, such a configuration can be extremely simplified. Things.

In the above-described embodiment, the spring coil 17 is used in addition to the spring back function of the radiating fin 13 itself to press the radiating fin 13 against the heat generating component 11.
It should be used properly depending on the degree of action of the springback, which depends on the shape of No. 3, and is not necessarily required in the present invention.

(Embodiment 2) FIG. 3 is a schematic side view showing a heat dissipation module according to an embodiment corresponding to the third aspect of the present invention. The present invention is different from the first embodiment in that the structure in which one heat radiation fin of the heat radiation substrate is directly pressed into contact with at least two or more heat-generating components is different from that of the first embodiment. Are denoted by the same reference numerals, detailed description thereof will be omitted, and different configurations will be mainly described.

Since the heat radiating substrate 12 is directly pressed into contact with the three heat generating components 11 arranged side by side on the substrate 10, the heat radiating substrate 12 has a substantially trapezoidal shape opposed to each heat generating component 11 and integrally formed on each heat generating component 11 side. And a plurality of radiating fins 13a (shown in FIG. 8 (g)) having a springback function and protruding from the fins. The heat dissipation board 12 has a long heat dissipation fin 13a,
The heat radiation fins 13a are directly pressed into contact with each other by utilizing the spring back action of the heat radiation fins 13a over the three heat generating components 11, and a space 1 in which air flows between the heat generating components 11 and the heat generating fins 13a.
4 is formed and attached to the substrate 10.

In the above embodiment, when the heat-generating component 11 performs work and generates heat, the heat is transmitted to the heat-radiating fins 13a that are directly pressed against the heat-generating component 11, and is mainly radiated to the space 14, and then to the space 14. Is transported out of the space 14 by the cooling air flowing.

Accordingly, the heat radiation board 12 is provided with a heat radiation fin 13a.
Is directly pressed against the heat-generating component 11, and since the flowing air exists in the space 14 between the heat-generating component 11 and the heat-generating component 1,
1 is directly transmitted to the radiating fins 13a to reliably dissipate the heat.

In particular, the heat radiation substrate 12 is composed of one heat radiation fin 1
3a is directly pressed into contact with at least two or more heat generating components 11, and since there is a flowing air between each heat generating component 11, heat generated by at least two or more heat generating components 11 is directly applied to one heat radiation fin. 13a, the heat is reliably dissipated, and when there is a difference in heat generation between two or more heat generating components 11, one heat dissipating fin 13a
The heat is transferred from the portion in contact with the heat-generating component 11 having a large amount of heat generation to the portion in contact with the heat-generating component 11 having a small amount of heat generation, and the heat can be dissipated in a balanced manner by one heat radiation fin 13a. Further, the respective heat radiation is conveyed by the air flowing in the space 14 between the heat radiating substrate 12 and each heat generating component 11, so that the surrounding environment of each heat generating component 11 can be always kept in a good condition.

Each of the radiating fins 13a directly pressed against the three heat-generating components 11 arranged side by side is directly pressed against the heat-generating component 11 by utilizing the action of the respective springbacks. It is very easy.

In the above embodiment, in order to press the radiating fin 13a against the heat-generating component 11, the radiating fin 13a has a spring coil 1
7, the spring coil 17 may be selectively used depending on the degree of springback action which depends on the shape of the radiation fin 13a, and is not necessarily required in the present invention.

(Embodiment 3) FIG. 4 is a schematic side view showing a heat dissipating module according to an embodiment of the present invention, FIG. 5 is a schematic perspective view of the heat dissipating board, and FIG.
Is a schematic side view showing a heat dissipation module in another embodiment, and FIG. 7 is a schematic perspective view of the heat dissipation board. The present invention is different from the first embodiment in that a plurality of cut-and-raised pieces are provided on the heat-radiating substrate by forming slits in addition to the heat-radiating fins. The detailed description is omitted by attaching the reference numerals, and different configurations are mainly described.

The heat radiating substrate 12 is separated from the heat radiating fins 13 directly press-fitted on the heat-generating component 11 and is located before and after in the direction of the fluid flowing through the space 14, and on both sides of the heat radiating fins 13, A plurality of slits 40 are provided perpendicularly to the direction and a plurality of cut-and-raised pieces 41 are formed on the side opposite to the heat-generating component 11 as shown in FIGS. 4 and 5, or as shown in FIGS. It is formed on the component 11 side to further promote heat dissipation. Reference numeral 42 is a flat protective cover having substantially no holes for protecting the heat radiation substrate 12.
It also has a function of guiding the fluid flowing through the space 14 so as to face the zero.

In the above embodiment, when the heat-generating component 11 performs work and generates heat, the heat is directly transmitted to the heat-radiating fins 13 that are directly pressed against the heat-generating component 11.
The heat is mainly transmitted to the space 14 by being indirectly transmitted to the plurality of cut-and-raised pieces 41 located on both sides of the space 14, and is conveyed out of the space 14 by the cooling air flowing through the space 14.

Therefore, the radiating board 12 presses the radiating fin 13 directly against the heat generating component 11 and forms a cut-and-raised piece 41 by a slit other than the heat radiating fin 13, and the flowing air flows into the space 14 between the heat generating component. Because of the presence, the heat generated by the heat-generating component 11 is transmitted directly to the radiating fins 13 and indirectly to the cut-and-raised pieces 41, so that the heat is reliably radiated.

In particular, the heat radiating substrate 12 is located separately from each heat radiating fin 13 before and after the direction of the fluid flowing through the space 14, and on both sides of each heat radiating fin 13 at right angles to the direction of the fluid flowing through the space 14. The plurality of cut-and-raised pieces 41 formed by the plurality of slits 40 are placed on the side opposite to the heat-generating component 11 or the heat-generating component 1.
One side, and a space 14 between each heat generating component 11
, The heat generated by each heat generating component 11 is
Directly transmitted to each radiating fin 13 and indirectly transmitted to each cut-and-raised piece, the heat is reliably dissipated, and furthermore, the respective heat dissipated to the outside of the space 14 by the air flowing through the space 14 between the heat dissipating substrate and each heat generating component. It is conveyed, and the surrounding environment of each heat-generating component 11 can always be kept better.

In particular, the cut-and-raised piece 41 of the heat dissipation board 12
4 and 5 in which the second space 14a is formed between the heat-generating component 11 and the protective cover 42, the cut-and-raised piece 41 functions as a spacer, and the second space 14a is formed. The air flow also occurs in the space 14a, and the cut and raised pieces 4
The heat radiation of No. 1 was strongly promoted, and the heat radiation from both surfaces of the heat radiation substrate 12 was also promoted, so that a better result was obtained than in the case of the heat radiation module shown in FIGS.

(Embodiment 4) FIGS. 8 (a) to 8 (g) show heat radiation of Embodiments 1, 2 and 3 in one embodiment corresponding to the fifth to seventh aspects of the present invention. It is a perspective view of the principal part which shows the specific structure of a fin.

As shown in FIGS. 8A to 8G, the heat radiation substrate 12
The heat radiation fins 13 and 13a have a substantially trapezoidal shape or a substantially semicircular shape and have a relatively wide contact plane 23 that contacts the heat generating component 11 for the action of heat radiation and springback. It is cut and raised by molding.

Further, as shown in FIGS. 8B and 8G, the radiating fins 13 and 13a of the radiating board 12 are louvers 24, and as shown in FIG.
8A, a hole 25 is formed, and as shown in FIG. 8D, the radiating fins 13 and 13a of the radiating substrate 12 form slits 26, respectively, for cooling air flowing in the space 14 between the substrate 10 and the radiating substrate 12. Guidance is provided for smooth flow and heat dissipation efficiency is enhanced.

Further, as shown in FIG. 8E, the radiating fins 13 and 13a of the radiating substrate 12 are provided with a plurality of elongated holes 25a and a fin piece therebetween to provide a step 27 so that cooling air can be smoothly guided and radiation efficiency can be improved. As well as increasing the effect of springback.

Further, as shown in FIG. 8 (f), the radiating fins 13 and 13a of the radiating substrate 12 are cut in the middle of the contact plane 23 to form unevenness 28 on the fin pieces on both sides in order to enhance the effect of springback. Things.

In the above embodiment, the heat radiation fins 13 and 13a of the heat radiation substrate 12 are formed in a substantially semicircular or trapezoidal projection.
3a itself can positively exert a spring-back effect, and since the contact plane 23 is provided, the heat-generating component 11
Can be reliably pressed over a wide area.

In the above embodiment, the heat radiation substrate 12
Are formed in the shape of a louver 24, a hole 25, a slit 26, or a wavy shape, so that the flow of air flowing between the heat radiating substrate 12 and each heat-generating component 11 along these fins 13, 13a. Can be smoothly guided.

In the above embodiment, the heat radiation substrate 12
Although the radiating fins 13 and 13a are formed integrally with the radiating substrate 12, the radiating fins shown in FIG. 8 may be formed separately and joined to the radiating substrate 12. In the case of the radiation fins 13 and 13a having the above-described configuration, the individual heat generating components 1
Since heat radiation fins of various shapes can be selected and joined according to the degree of heat generation of 1, the heat radiation can be performed more efficiently and accurately.

(Embodiment 5) FIGS. 9 (a) to 9 (d) show specific examples of the radiation fins of Embodiment 1, Embodiment 2 and Embodiment 3 in an embodiment corresponding to the eighth aspect of the present invention. FIG. 10 is a schematic side view showing a heat dissipation module in which the heat dissipation fins shown in FIG. 9C are implemented.

As shown in FIGS. 9A to 9D, the radiating fins 13 and 13a of the radiating board 12 are formed integrally with or separately from the radiating board 12 in order to make the action of heat radiation and springback flexible. A plurality of strip-shaped pieces 29 processed in an arc shape or a wave shape to be attached are arranged side by side. In other words, the radiation fins 13 and 13a shown in FIG. 9A are provided integrally with the roots of the plurality of strips 29 arranged in a line at the left end and the right end of the radiation board 12 and alternately and integrally with each other. 12 and gradually inclined toward the heat-generating component side so as to form a circular arc at the tip end which is in pressure contact with the heat-generating component 11, and a gap of 3 between the strips 29.
0 is provided.

The heat radiation fins 13 and 13a shown in FIG. 9B have notches 31 provided between the respective strips 29 instead of the intervals 30 provided in the fins shown in FIG. Is increased. In the figure, reference numeral 32 denotes an opening formed by processing.

The heat radiation fins 13 and 13a shown in FIG. 9 (c) are arranged so that a plurality of cuts 31 are arranged at the distal end thereof from the root 29a and the distal end which presses against the heat generating component 11 at a portion extending toward the heat generating component. A plurality of strips 29 having a corrugated portion are formed separately and integrally, and a group of the separately formed strips 29 is further arranged in three groups with further intervals, and a root 29a is formed on the heat radiation substrate 12. It is provided in one body.

The heat radiation fins 13 and 13a shown in FIG. 9D are arranged from the left end and the right end of the root 29a, and a plurality of cuts 31 are formed at the front end thereof. A plurality of strips 29 each having a corrugated shape formed on the front end portion of the plurality of strips 2 formed separately are integrally formed.
9, the base 29 a is provided integrally with the heat dissipation substrate 12. The plurality of strips 29 may be formed of a plurality of thin lines. Further, the plurality of strips 29 or the linear shape may be formed integrally with the heat dissipation board 12 by cutting and bending the heat dissipation board 12, or may be separately formed and finally attached to the heat dissipation board 12. is there.

In the above embodiment, the radiation fins 13 and 13a are arranged side by side and the plurality of strips 29 having one end provided on the radiation substrate 12 are processed into an arc shape or a wave shape to make them flexible. The spring-back effect of pressing against the heat-generating component 11 also becomes flexible, and the pressure on the heat-generating component pressed against is weakened. Therefore, the present invention can be easily applied to heat radiation of a heat-generating component that is vulnerable to pressure.

The heat radiation fins 13 and 13a shown in FIGS. 9 (c) and 9 (d) separately form a plurality of strips 29 having a root 29a as a mounting portion, and attach the root 29a to the heat radiation substrate 12. Since the heat-generating components 11 on the substrate 10 have different heights as shown in FIG. 10, the plural heat-generating components 11 are appropriately attached to the heat-generating components 11 having different heights. If the length of the piece 29, the wave shape, or the like is adjusted and attached to the heat dissipation board 11, it can be relatively easily handled. Therefore, even in such a case, the radiation fins can be applied in a well-balanced manner when viewed from both the heat radiation performance and the processing. Needless to say, the plurality of strips 2 are integrally formed on the heat dissipation board 12 in accordance with the height of the heat generating components 11.
9 can be dealt with by forming each of them.

The radiating fins of the radiating substrate in the above embodiment are not limited to the above-described shapes as long as the intended object of the present invention is achieved.

[0060]

According to a first aspect of the present invention, there is provided a substrate on which a heat-generating component is mounted, and a heat-radiating substrate formed by projecting a heat-radiating fin toward the heat-generating component. Pressing directly against the heat-generating component,
A heat radiating module that forms a space through which air flows between the heat generating components, and can efficiently radiate heat from the heat radiating fins that are directly pressed against the heat generating components, and the heat is conveyed to the flowing air, so that the surroundings of the heat generating components are always present. The environment can be kept good.

According to a second aspect of the present invention, there is provided a heat-radiating board comprising a plurality of heat-generating components mounted thereon, and a heat-radiating fin opposed to each of the heat-generating components formed to project toward the heat-generating components. The board is a heat radiating module in which each heat radiating fin is directly pressed into contact with each of the heat generating components, and a space through which air flows between the heat generating components is formed. The heat can be efficiently dissipated by being transmitted to the fins, and the respective heat dissipated is conveyed by the flowing air, so that the surrounding environment of each heat-generating component can always be kept in a good condition.

According to a third aspect of the present invention, there is provided a substrate on which a plurality of heat-generating components are mounted, and a heat-radiating substrate formed by projecting a plurality of heat-radiating fins toward the heat-generating components. A fin is directly pressed into contact with at least two or more of the heat-generating components, and a heat-dissipating module that forms a space through which air flows with the heat-generating components. Not only is heat transmitted directly to one heat radiation fin and heat is efficiently dissipated, but even if there is a difference in heat generation between two or more heat radiation fins, one heat radiation fin is in contact with a heat generation component with a small amount of heat generation The portion can be used for heat radiation from a heat-generating component that generates a large amount of heat to efficiently radiate heat. In addition, the heat radiation is carried by the flowing air, so that the surrounding environment of each heat-generating component can always be kept good.

According to a fourth aspect of the present invention, there is provided a substrate on which a heat-generating component is mounted, and a heat-radiating substrate formed by projecting a heat-radiating fin toward the heat-generating component. A heat dissipating module that is directly pressed and provided with a plurality of slits having cut-and-raised pieces on the side of the heat-generating component or on the side opposite to the heat-generating component, and forming a space through which air flows between the heat-radiating substrate and the heat-generating component. The heat generated by the heat-generating component is transmitted directly to the heat-radiating fins and indirectly to the plurality of cut-and-raised pieces to reliably radiate heat, and the heat-radiating fins and the cut-and-raised pieces are formed by air flowing between the heat-radiating substrate and the heat-generating component. Is dissipated, and the surrounding environment of the heat-generating component can be kept good.

The invention described in claim 5 is the first invention.
5. The heat radiation module according to claim 4, wherein the heat radiation fin is formed by subjecting a heat radiation substrate to a substantially semi-arc or trapezoidal projection. The spring-back effect of the fins makes it possible to make reliable contact with the heat-generating component, and it is possible to simplify the structure of making sure contact with the heat-generating component by using the radiation fins.

The invention according to claim 6 is the first invention.
In the description of any one of claims 4, the heat dissipation board,
A heat dissipation module formed by joining heat dissipation fins having a substantially semicircular or trapezoidal shape or a continuous wave shape, and a single heat dissipation board can efficiently dissipate heat according to the heat value of each heat generating component.

The invention described in claim 7 is the first invention.
5. The heat dissipating fin of claim 4, wherein the heat dissipating fin is a slit, a louver, a hole, or a heat dissipating module formed by applying a wave-shaped processing, wherein the heat dissipating fin of the heat dissipating substrate is a slit, or a louver, Or, by the hole or the wave shape, while the flow of the air flowing between the heat dissipation board and each heat generating component can be smooth,
Heat dissipation efficiency can be increased.

The invention described in claim 8 is the first invention.
5. The heat dissipating module according to claim 4, wherein the heat dissipating fin is a heat dissipating module in which a plurality of strips or wires processed in an arc shape or a wave shape are arranged side by side. The shape can be flexibly contacted with the heat-generating component, and it can also be applied to heat radiation of a heat-generating component that is vulnerable to pressure. Further, even when heat-generating components having different shapes such as heights are juxtaposed, the heat-radiating fins can be brought into pressure contact with the heat-generating components, which is convenient.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing a heat dissipation module according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view showing a heat dissipating board and a mounting board in which the heat dissipating module is disassembled.

FIG. 3 is a schematic side view showing a heat dissipation module according to a second embodiment of the present invention.

FIG. 4 is a schematic side view showing a heat dissipation module according to a third embodiment of the present invention.

FIG. 5 is a schematic perspective view showing a heat dissipation board of the heat dissipation module.

FIG. 6 is a schematic side view showing a heat dissipation module according to another example of the third embodiment.

FIG. 7 is a schematic perspective view showing a heat dissipation board of a heat dissipation module in another example of the third embodiment.

8 (a) to 8 (g) are perspective views of a main part showing radiating fins of a radiating substrate according to a fourth embodiment of the present invention.

FIGS. 9A to 9D are perspective views of a main part showing heat radiation fins of a heat radiation substrate according to a fifth embodiment of the present invention.

FIG. 10 is a schematic side view showing a heat radiation module in which the heat radiation fins shown in FIG.

FIG. 11 is a schematic diagram showing a heat dissipation module of the prior art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate 11 Heat generating component 12 Heat dissipation board 13 and 13a Heat dissipation fin 14 Space 29 Band-shaped piece 40 Slit 41 Cut-and-raised piece

 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Hiroaki Suga 4-5-2-5 Takaida Hondori, Higashi-Osaka City, Osaka Inside Matsushita Refrigerating Machinery Co., Ltd. Matsushita Refrigerating Machinery Co., Ltd. (2-5) Matsushita Refrigerating Machinery Co., Ltd. (72) Inventor 4-2-1-5 Takaida Hondori, Higashi-Osaka City, Osaka Prefecture F-term in Matsushita Refrigerating Machinery Co., Ltd. 5E322 AA11 AB04 AB07 BB03 5F036 AA01 BA04 BB05 BB06 BB35 BC08

Claims (8)

[Claims] A heat dissipating board having a heat dissipating fin protruding toward the heat dissipating component side;
A heat dissipating module, wherein the heat dissipating board has a heat dissipating fin directly pressed against the heat generating component and a space through which air flows between the heat generating component and the heat generating component. 2. A heat dissipating board comprising: a board on which a plurality of heat generating components are mounted; and a heat dissipating board formed by projecting a heat dissipating fin opposed to each of the heat generating components toward the heat dissipating component. A heat radiating module which is directly pressed into contact with each heat generating component and has a space through which air flows between each heat generating component. 3. A heat dissipating board comprising: a substrate on which a plurality of heat generating components are mounted; and a heat dissipating substrate formed by projecting a plurality of heat dissipating fins toward the heat generating component.
A heat dissipating module comprising: a pressure member that is directly press-contacted across at least two or more of the heat-generating components and forms a space through which air flows between the heat-generating components. 4. A substrate having a heat-generating component mounted thereon, and a heat-radiating substrate formed by projecting a heat-radiating fin toward the heat-generating component.
The heat dissipating substrate has its heat dissipating fins directly pressed against the heat generating component, and a plurality of slits having cut-and-raised pieces provided on the heat generating component side or on the side opposite to the heat generating component, and between the heat dissipating substrate and the heat generating component. A heat dissipation module that forms a space through which air flows. 5. The radiating fin is formed by subjecting a radiating substrate to a substantially semicircular or substantially trapezoidal projection process.
A heat dissipation module according to claim 4. 6. The heat dissipating module according to claim 1, wherein the heat dissipating board is formed by joining heat dissipating fins having a substantially semicircular arc shape, a substantially trapezoidal shape, or a continuous wave shape. 7. The heat dissipating module according to claim 1, wherein the heat dissipating fins are formed by processing slits, louvers, holes, or corrugations. 8. The radiating fin according to claim 1, wherein a plurality of strips or lines processed in an arc shape or a wave shape are arranged in parallel. Heat dissipation module.