JP2001358270A - Cooling system - Google Patents
Cooling systemInfo
- Publication number
- JP2001358270A JP2001358270A JP2000178170A JP2000178170A JP2001358270A JP 2001358270 A JP2001358270 A JP 2001358270A JP 2000178170 A JP2000178170 A JP 2000178170A JP 2000178170 A JP2000178170 A JP 2000178170A JP 2001358270 A JP2001358270 A JP 2001358270A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- cooling water
- flow direction
- porous member
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
(57)【要約】
【課題】 容易に冷却能力の向上が図れる冷却装置を得
る。
【解決手段】 発熱体２を冷却する流路４内に、冷却水
６の流れ方向に沿った管状の孔１２が多数本空いたポー
ラス部材１１を設け、孔１２内に冷却水６を流すように
構成する。
(57) [Problem] To provide a cooling device capable of easily improving a cooling capacity. SOLUTION: A porous member 11 having a large number of tubular holes 12 extending in a flow direction of cooling water 6 is provided in a flow path 4 for cooling a heating element 2 so that the cooling water 6 flows through the holes 12. To be configured.
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、半導体素子など
の発熱体を冷却する冷却装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for cooling a heating element such as a semiconductor device.
【０００２】[0002]
【従来の技術】図７は、例えば特開平６−７７３６８号
公報に示された従来の冷却装置を示す構成図である。図
において、１は冷却装置容器、２はＩＧＢＴなどの半導
体素子からなる発熱体であり、前記冷却装置容器１の上
面に密接して設けられている。３は前記冷却装置容器１
の内部に設けられたフィン、４は前記フィン３の間に形
成された流路、５は前記冷却装置容器１へ冷却水６が出
入りする水出入口である。前記冷却装置容器１およびフ
ィン３は通常、熱伝導率の大きな銅やアルミニウムで構
成されている。2. Description of the Related Art FIG. 7 is a block diagram showing a conventional cooling device disclosed in, for example, JP-A-6-77368. In the figure, reference numeral 1 denotes a cooling device container, and 2 denotes a heating element made of a semiconductor element such as an IGBT, which is provided in close contact with the upper surface of the cooling device container 1. 3 is the cooling device container 1
4 are flow paths formed between the fins 3, and 5 are water inlets and outlets through which cooling water 6 flows into and out of the cooling device container 1. The cooling device container 1 and the fins 3 are usually made of copper or aluminum having high thermal conductivity.
【０００３】次に動作について説明する。発熱体２で発
生した熱は、冷却装置容器１の壁面およびフィン３を熱
伝導により流れて流路４を流れる冷却水６に伝達され
る。一方、冷却水６は水出入口５から流入、排出され、
フィン３を通して冷却水６に伝えられた熱は冷却水６と
ともに出入口５から排出されることになる。このような
従来の冷却装置の冷却能力は、フィン３と冷却水６との
接触面積Ｓと、フィン３の表面から水への対流熱伝達率
ｈとの積Ｓ×ｈが大きいほど大きくなる。Next, the operation will be described. The heat generated by the heating element 2 flows through the wall surface of the cooling device container 1 and the fins 3 by heat conduction, and is transmitted to the cooling water 6 flowing through the flow path 4. On the other hand, the cooling water 6 flows in and out of the water inlet / outlet 5,
The heat transmitted to the cooling water 6 through the fins 3 is discharged from the entrance 5 together with the cooling water 6. The cooling capacity of such a conventional cooling device increases as the product S × h of the contact area S between the fin 3 and the cooling water 6 and the convective heat transfer coefficient h from the surface of the fin 3 to water increases.
【０００４】[0004]
【発明が解決しようとする課題】従来の冷却装置は以上
のように構成されているので、その冷却能力を向上させ
るために、フィン３の数を増し、表面積Ｓを大きくする
ことや、流路幅を小さくして冷却水の流速を増大させ、
熱伝達率ｈを大きくすることが試みられている。しかし
ながら、フィン３の数を増すためにはフィン３の肉圧を
薄くすることが必要となるが、その製作には限界が有
り、肉薄のフィンを多数枚製作するのが高価であった
り、また、薄くしすぎると、フィンを通しての熱伝導効
果が悪くなるため、必ずしも冷却性能の向上とならない
などの問題があった。Since the conventional cooling device is constructed as described above, in order to improve its cooling capacity, the number of fins 3 is increased, the surface area S is increased, and Reduce the width and increase the flow rate of the cooling water,
Attempts have been made to increase the heat transfer coefficient h. However, in order to increase the number of the fins 3, it is necessary to reduce the wall pressure of the fins 3. However, there is a limit in the production, and it is expensive to produce a large number of thin fins. On the other hand, if the thickness is too small, the heat conduction effect through the fins deteriorates, and there is a problem that the cooling performance is not always improved.
【０００５】また、冷却水６は熱をもらうことにより入
口から出口に向かって温度上昇するため、入口近くが最
も温度が低く、出口近くが最も温度が高くなる。その結
果、発熱体２の温度も冷却水６の温度と共に変化するた
め、冷却水の流れ方向に対して各発熱体２の温度が一様
でなくなる。その結果、温度依存性をもつ半導体素子等
の発熱体においては、各発熱体毎にその動作特性が変化
し、最適な電気的特性が得られないという問題もあっ
た。Since the temperature of the cooling water 6 rises from the inlet to the outlet by receiving heat, the temperature near the inlet is the lowest and the temperature near the outlet is the highest. As a result, the temperature of the heating elements 2 also changes with the temperature of the cooling water 6, so that the temperature of each heating element 2 is not uniform in the flow direction of the cooling water. As a result, in a heating element such as a semiconductor element having a temperature dependency, there is a problem that the operating characteristics change for each heating element, and optimum electrical characteristics cannot be obtained.
【０００６】また、フィン３は流路４の全体にわたって
設けられているため、冷却する必要がない部分の流路も
フィンにより狭くなっているため、冷却水６が通る際の
圧力損失が大きくなり、十分な冷却水量が得られず、そ
の結果冷却特性が悪くなるという問題があった。Further, since the fins 3 are provided over the entire flow path 4, the flow path in a portion that does not need to be cooled is also narrowed by the fins, so that the pressure loss when the cooling water 6 passes increases. However, there was a problem that a sufficient amount of cooling water could not be obtained, resulting in poor cooling characteristics.
【０００７】この発明はかかる課題を解決するためにな
されたものであり、容易に冷却能力の向上が図れる冷却
装置を得ることを目的としている。[0007] The present invention has been made to solve such a problem, and an object of the present invention is to provide a cooling device that can easily improve the cooling capacity.
【０００８】また、各発熱体の温度が均一になるように
冷却できる冷却装置を得ることを目的としている。It is another object of the present invention to provide a cooling device capable of cooling each heating element so that the temperature of each heating element becomes uniform.
【０００９】また、冷却水が流れる流路の圧力損失が小
さな冷却装置を得ることを目的としている。It is another object of the present invention to provide a cooling device having a small pressure loss in a flow path through which cooling water flows.
【００１０】[0010]
【課題を解決するための手段】本発明の第１の構成によ
る冷却装置は、発熱体を冷却する流路内に、冷却媒体の
流れ方向に沿った管状の孔が多数本空いた多孔材を設
け、上記孔内に上記冷却媒体を流すように構成したもの
である。According to a first aspect of the present invention, there is provided a cooling apparatus comprising a porous material having a large number of tubular holes extending in a flow direction of a cooling medium in a flow path for cooling a heating element. The cooling medium is provided in the hole.
【００１１】また、本発明の第２の構成による冷却装置
は、第１の構成において、多孔材として、金属凝固法に
より成形された部材を使用したものである。Further, the cooling device according to the second configuration of the present invention uses the member formed by the metal solidification method as the porous material in the first configuration.
【００１２】また、本発明の第３の構成による冷却装置
は、第１または第２の構成において、多孔材を冷却媒体
の流れ方向に分割して設置したものである。Further, in the cooling device according to the third configuration of the present invention, in the first or second configuration, the porous material is divided and installed in the flow direction of the cooling medium.
【００１３】また、本発明の第４の構成による冷却装置
は、第３の構成において、分割された複数の多孔材は、
冷却媒体の流れ方向に沿った長さが上記流れ方向に沿っ
て変化しているものである。The cooling device according to a fourth configuration of the present invention is the cooling device according to the third configuration, wherein the plurality of divided porous materials are:
The length of the cooling medium along the flow direction varies along the flow direction.
【００１４】また、本発明の第５の構成による冷却装置
は、第３の構成において、分割された複数の多孔材は、
孔の数または孔の径が冷却媒体の流れ方向に沿って変化
しているものである。The cooling device according to a fifth aspect of the present invention is the cooling apparatus according to the third aspect, wherein the plurality of divided porous materials are:
The number of holes or the diameter of the holes varies along the flow direction of the cooling medium.
【００１５】また、本発明の第６の構成による冷却装置
は、第３の構成において、分割された複数の多孔材の下
部に支持台を設け、各多孔材の高さが冷却媒体の流れ方
向に沿って変化するようにしたものである。In the cooling device according to a sixth aspect of the present invention, in the third aspect, a support base is provided below the plurality of divided porous materials, and the height of each porous material is set in the flow direction of the cooling medium. It changes according to.
【００１６】[0016]
【発明の実施の形態】実施の形態１．以下、本発明の実
施の形態１を図を用いて説明する。図１は本発明の実施
の形態１による冷却装置を示す構成図である。図におい
て、１は冷却装置容器、２はＩＧＢＴなどの半導体素子
からなる発熱体、４は発熱体２を冷却する流路、５は冷
却装置容器１へ冷却水６が出入りする水出入口である。
１１は銅、アルミニウムなど熱伝導率の大きな金属材料
からなるポーラス部材（多孔体）である。ポーラズ部材
１１は、発熱体２を冷却する流路内に分割して複数個配
設され、設置される位置は複数の発熱体２の直下にそれ
ぞれ配設されている。ポーラス部材１１の内部は図２に
示すように冷却水６の流れ方向に直管状の孔１２が多数
本空いた構成となっており、上記孔１２内に冷却水６を
流すように構成されている。このポーラス部材１１とし
ては、安価で製作可能な金属凝固法により成形された部
材が使用されており、例えば特開平１０−８８２５４号
公報に示された方法により、孔の径が数十μｍ〜数ｍｍ
の範囲でその空孔率を任意に設定して製造することがで
きる。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram showing a cooling device according to Embodiment 1 of the present invention. In the figure, reference numeral 1 denotes a cooling device container, 2 denotes a heating element made of a semiconductor element such as an IGBT, 4 denotes a flow path for cooling the heating element 2, and 5 denotes a water inlet / outlet through which cooling water 6 flows into and out of the cooling device container 1.
Reference numeral 11 denotes a porous member (porous body) made of a metal material having high thermal conductivity such as copper and aluminum. A plurality of the porous members 11 are divided and provided in a flow path for cooling the heating element 2, and are installed immediately below the plurality of heating elements 2. As shown in FIG. 2, the inside of the porous member 11 has a configuration in which a large number of straight tubular holes 12 are opened in the flow direction of the cooling water 6, and the cooling water 6 flows through the holes 12. I have. As the porous member 11, a member formed by a metal coagulation method that can be manufactured at low cost is used. For example, according to the method disclosed in Japanese Patent Application Laid-Open No. H10-88254, the diameter of the hole is several tens μm to several mm
The porosity can be arbitrarily set in the range of the above.
【００１７】上記のように構成された冷却装置の動作に
ついて説明する。図１において、発熱体２で発生した熱
は、冷却装置容器１の壁面およびポーラス部材１１を熱
伝導により流れてポーラス部材１１中の孔１２を流れる
冷却水６に伝達される。一方、冷却水６は水出入口５か
ら流入、排出され、ポーラス部材１１中を通って冷却水
６に伝えられた熱は水とともに出入口５から排出される
ことになる。The operation of the cooling device configured as described above will be described. In FIG. 1, the heat generated by the heating element 2 flows through the wall surface of the cooling device container 1 and the porous member 11 by heat conduction, and is transmitted to the cooling water 6 flowing through the holes 12 in the porous member 11. On the other hand, the cooling water 6 flows in and out of the water inlet / outlet 5, and the heat transmitted to the cooling water 6 through the porous member 11 is discharged from the inlet / outlet 5 together with the water.
【００１８】本実施の形態における冷却装置の冷却能力
は、ポーラス部材１１中の孔１２と冷却水６との接触面
積Ｓｐと、孔１２の表面から冷却水への対流熱伝達率ｈ
ｐとの積Ｓｐ×ｈｐが大きいほど大きくなる。本実施の
形態１の冷却装置は図１のように構成されているので、
その冷却能力を向上させるために、孔１２の数を増して
内表面積Ｓｐを大きくすることや、孔１２の直径を小さ
くして冷却水の流速を増大させ、熱伝達率ｈｐを大きく
してその冷却能力を向上させることができる。また、通
常、ポーラス部材１１の上面から孔１２への熱伝導効果
は孔の総断面積が大きいほど小さくなる、即ち空孔率が
大きいほど小さくなるが、本実施の形態で用いるポーラ
ス部材の場合、空孔率を変化させずに、孔径を小さく
し、孔の数を増やすことにより表面積を大きくできるた
め、ポーラス部材の熱伝導効果を阻害せずに冷却能力を
大きくできるという効果が得られる。The cooling capacity of the cooling device according to the present embodiment includes a contact area Sp between the hole 12 in the porous member 11 and the cooling water 6 and a convective heat transfer coefficient h from the surface of the hole 12 to the cooling water.
The value increases as the product Sp × hp with p increases. Since the cooling device of the first embodiment is configured as shown in FIG.
In order to improve the cooling capacity, the number of the holes 12 is increased to increase the inner surface area Sp, or the diameter of the holes 12 is reduced to increase the flow rate of the cooling water to increase the heat transfer coefficient hp. The cooling capacity can be improved. In general, the heat conduction effect from the upper surface of the porous member 11 to the hole 12 decreases as the total cross-sectional area of the hole increases, that is, decreases as the porosity increases. However, in the case of the porous member used in the present embodiment, Since the surface area can be increased by reducing the hole diameter and increasing the number of holes without changing the porosity, the cooling capacity can be increased without impairing the heat conduction effect of the porous member.
【００１９】また、特にこれまでポーラス部材１１の数
十μｍの直管状の孔１２を多数本同時に形成するのは困
難であったが、特開平１０−８８２５４号公報に示され
た金属凝固法により形成すれば、本冷却装置が容易かつ
安価に製作できるという効果が得られる。Although it has been difficult to simultaneously form a large number of several tens of μm straight tubular holes 12 in the porous member 11 at the same time, the metal solidification method disclosed in Japanese Patent Application Laid-Open No. If formed, the effect is obtained that the present cooling device can be manufactured easily and at low cost.
【００２０】また、ポーラス部材１１は冷却水６が流れ
る時の圧力損失を左右するが、本実施の形態において、
ポーラズ部材１１は複数の発熱体２の直下にそれぞれ分
割して複数個設けられているため、流路全体に設けられ
る場合に比べ、長さが短くなるため、圧力損失が小さく
なるという利点も得られる。なお、図１に示す本実施の
形態ではポーラス部材１１は分割されて配設されている
が、分割されず、流路全体に配設するようにしてもよ
い。但し、この場合は圧力損失は大きくなる。Although the porous member 11 affects the pressure loss when the cooling water 6 flows, in the present embodiment,
Since the plurality of porous members 11 are separately provided immediately below the plurality of heating elements 2, the length is shorter than in the case where the plurality of porous members 11 are provided over the entire flow path, so that the advantage that pressure loss is reduced is also obtained. Can be In the present embodiment shown in FIG. 1, the porous member 11 is divided and provided, but the porous member 11 is not divided and may be provided on the entire flow channel. However, in this case, the pressure loss increases.
【００２１】実施の形態２．図３は実施の形態２による
冷却装置の構成図である。図において、２１は銅、アル
ミニウムなど熱伝導率の大きな金属材料からなるポーラ
ス部材であり、発熱体２を冷却する流路内に分割して複
数個配設され、設置される位置は複数の発熱体２の直下
にそれぞれ配設されている。また、各ポーラス部材２１
は冷却水６の流れ方向に沿った長さが、上記流れ方向に
沿って次第に長くなるよう構成されている。ポーラス部
材２１の内部は冷却水６の流れ方向に直管状の孔２２が
多数本空いた構成となっている。Embodiment 2 FIG. FIG. 3 is a configuration diagram of a cooling device according to the second embodiment. In the figure, reference numeral 21 denotes a porous member made of a metal material having a high thermal conductivity such as copper or aluminum. Each of them is disposed directly below the body 2. In addition, each porous member 21
Is configured such that the length of the cooling water 6 along the flow direction gradually increases along the flow direction. The inside of the porous member 21 has a configuration in which a number of straight tubular holes 22 are opened in the flow direction of the cooling water 6.
【００２２】次に動作について説明する。図３におい
て、複数個の発熱体２で発生した熱は、冷却装置容器１
の壁面およびポーラス部材２１を熱伝導により流れてポ
ーラス部材２１中の孔２２を流れる冷却水６に伝達され
る。一方、冷却水６は水出入口５から流入、排出され、
ポーラス部材２１中を通って冷却水６に伝えられた熱は
水とともに出入口５から排出されることになる。Next, the operation will be described. In FIG. 3, heat generated by a plurality of heating elements 2 is
Of the porous member 21 and the cooling water 6 flowing through the holes 22 in the porous member 21. On the other hand, the cooling water 6 flows in and out of the water inlet / outlet 5,
The heat transmitted to the cooling water 6 through the porous member 21 is discharged from the entrance 5 together with the water.
【００２３】通常、冷却水６は熱をもらうことにより入
口から出口に向かって温度上昇するため、入口近くが最
も温度が低く、出口近くが最も温度が高くなる。図３に
示した冷却装置では、発熱体２の直下に配設される複数
のポーラス部材２２の長さを冷却水の流れ方向に次第に
長くすることにより、各ポーラス部材２２における孔２
２の総表面積を冷却水の流れ方向に沿って次第に大きく
なるようにし、冷却水６の温度が低い入口近くではポー
ラス部材２１の冷却能力が小さく、冷却水６の温度が高
い出口近くではポーラス部材２１の冷却能力が大きくな
るようにしている。この様にすることにより、複数個の
発熱体２の温度が冷却水の流れ方向に対して一様になる
ようにできる。その結果、温度依存性をもつ半導体素子
等の各発熱体２の動作特性が一様となり、半導体装置等
の装置の安定した電気的特性が得られるという効果があ
る。また、冷却水６が流れる時の圧力損失を左右するポ
ーラス部材２２の全体の長さが、実施の形態１よりもさ
らに短くなるため、圧力損失がより小さくなるという利
点もある。Normally, the temperature of the cooling water 6 rises from the inlet to the outlet by receiving heat, so that the temperature is lowest near the inlet and highest near the outlet. In the cooling device shown in FIG. 3, the length of the plurality of porous members 22 disposed immediately below the heating element 2 is gradually increased in the flow direction of the cooling water, so that the holes 2 in each of the porous members 22 are formed.
2, the cooling surface of the porous member 21 has a small cooling capacity near the inlet where the temperature of the cooling water 6 is low, and the porous member near the outlet where the temperature of the cooling water 6 is high. 21 is designed to have a large cooling capacity. By doing so, the temperature of the plurality of heating elements 2 can be made uniform in the flow direction of the cooling water. As a result, the operating characteristics of each heating element 2 such as a semiconductor element having a temperature dependency become uniform, and there is an effect that stable electric characteristics of a device such as a semiconductor device can be obtained. Further, since the entire length of the porous member 22 that affects the pressure loss when the cooling water 6 flows is further shorter than that of the first embodiment, there is an advantage that the pressure loss becomes smaller.
【００２４】実施の形態３．図４は実施の形態３による
冷却装置の構成図である。図において、３１は銅、アル
ミニウムなど熱伝導率の大きな金属材料からなるポーラ
ス部材であり、発熱体２を冷却する流路内に分割して複
数個配設され、設置される位置は複数の発熱体２の直下
にそれぞれ配設されている。また、各ポーラス部材３１
の内部は冷却水６の流れ方向に直管状の孔３２が多数本
空いた構成となっており、各ポーラス部材３１は孔３２
の数が冷却水の流れ方向に沿って増加すると共に、孔３
２の径が冷却水の流れ方向に沿って次第に小さくなるよ
うに構成されている。Embodiment 3 FIG. FIG. 4 is a configuration diagram of a cooling device according to the third embodiment. In the figure, reference numeral 31 denotes a porous member made of a metal material having a high thermal conductivity such as copper or aluminum. Each of them is disposed directly below the body 2. In addition, each porous member 31
Has a structure in which a number of straight tubular holes 32 are opened in the flow direction of the cooling water 6, and each porous member 31 has a hole 32.
Increases along the flow direction of the cooling water, and the number of holes 3 increases.
2 is configured such that the diameter thereof gradually decreases along the flow direction of the cooling water.
【００２５】次に動作について説明する。図４におい
て、複数個の発熱体２で発生した熱は、冷却装置容器１
の壁面およびポーラス部材３１を熱伝導により流れてポ
ーラス部材３１中の孔３２を流れる冷却水６に伝達され
る。一方、冷却水６は水出入口５から流入、排出され、
ポーラス部材３１中を通って冷却水６に伝えられた熱は
水とともに出入口５から排出されることになる。Next, the operation will be described. In FIG. 4, heat generated by a plurality of heating elements 2 is
Of the porous member 31 and the cooling water 6 flowing through the holes 32 in the porous member 31. On the other hand, the cooling water 6 flows in and out of the water inlet / outlet 5,
The heat transmitted to the cooling water 6 through the porous member 31 is discharged from the entrance 5 together with the water.
【００２６】前述したように、通常、冷却水６は入口近
くが最も温度が低く、出口近くが最も温度が高くなる。
図４に示した冷却装置では、発熱体２の直下に配設され
る複数のポーラス部材３１の孔径を冷却水の流れ方向に
沿って次第に小さくすることにより、各ポーラス部材３
１中の孔３２の断面積を次第に小さくし、孔内部を流れ
る冷却水の流速を次第に大きくして、冷却水６の温度が
低い入口近くではポーラス部材３１の冷却能力を小さ
く、冷却水６の温度が高い出口近くではポーラス部材３
１の冷却能力を大きくしている。また、各ポーラス部材
３１中の孔３２の数を冷却水の流れ方向に沿って次第に
増やすことにより、１つのポーラズ部材における総表面
積を流れ方向に対し次第に大きくし、孔径が小さくなる
ことによる表面積の縮小を補うようにしている。このよ
うにすることにより、複数個の発熱体２の温度が冷却水
に流れ方向に対して一様になるようにできる。その結
果、温度依存性をもつ半導体素子等の各発熱体２の動作
特性が一様となり、半導体装置等の装置の安定した電気
的特性が得られるという効果がある。As described above, the cooling water 6 usually has the lowest temperature near the inlet and the highest temperature near the outlet.
In the cooling device shown in FIG. 4, each of the porous members 3 is formed by gradually decreasing the hole diameter of the plurality of porous members 31 disposed immediately below the heating element 2 along the flow direction of the cooling water.
1, the cross-sectional area of the hole 32 is gradually reduced, the flow rate of the cooling water flowing inside the hole is gradually increased, and the cooling capacity of the porous member 31 is reduced near the inlet where the temperature of the cooling water 6 is low. The porous member 3 near the outlet where the temperature is high
1 has a large cooling capacity. Further, by gradually increasing the number of holes 32 in each porous member 31 along the flow direction of the cooling water, the total surface area of one porous member is gradually increased in the flow direction, and the surface area due to the decrease in the hole diameter is reduced. It tries to compensate for the reduction. By doing so, the temperature of the plurality of heating elements 2 can be made uniform in the flow direction of the cooling water. As a result, the operating characteristics of each heating element 2 such as a semiconductor element having a temperature dependency become uniform, and there is an effect that stable electric characteristics of a device such as a semiconductor device can be obtained.
【００２７】実施の形態４．図５は実施の形態４による
冷却装置の構成図である。図において、４１は銅、アル
ミニウムなど熱伝導率の大きな金属材料からなるポーラ
ス部材であり、発熱体２を冷却する流路内に分割して複
数個配設され、設置される位置は複数の発熱体２の直下
にそれぞれ配設されている。また、各ポーラス部材４１
の内部は冷却水６の流れ方向に直管状の孔４２が多数本
空いた構成となっており、各ポーラス部材４１は高さが
冷却水の流れ方向に沿って次第に高くなるように構成さ
れている。４３は高さの低いポーラス部材４１を流路内
で支えるための支持台である。Embodiment 4 FIG. 5 is a configuration diagram of a cooling device according to the fourth embodiment. In the figure, reference numeral 41 denotes a porous member made of a metal material having a high thermal conductivity such as copper or aluminum. The porous member 41 is divided into a plurality of passages for cooling the heating element 2, and is disposed at a plurality of positions. Each of them is disposed directly below the body 2. In addition, each porous member 41
Has a configuration in which a number of straight tubular holes 42 are opened in the flow direction of the cooling water 6, and each of the porous members 41 is configured so that the height gradually increases along the flow direction of the cooling water. I have. Reference numeral 43 denotes a support for supporting the porous member 41 having a low height in the flow path.
【００２８】次に動作について説明する。図４におい
て、複数個の発熱体２で発生した熱は、冷却装置容器１
の壁面およびポーラス部材４１を熱伝導により流れてポ
ーラス部材４１中の孔４２を流れる冷却水６に伝達され
る。一方、冷却水６は水出入口５から流入、排出され、
ポーラス部材４１中を通って冷却水６に伝えられた熱は
水とともに出入口５から排出されることになる。Next, the operation will be described. In FIG. 4, heat generated by a plurality of heating elements 2 is
Of the porous member 41 and the cooling water 6 flowing through the holes 42 in the porous member 41. On the other hand, the cooling water 6 flows in and out of the water inlet / outlet 5,
The heat transmitted to the cooling water 6 through the porous member 41 is discharged from the entrance 5 together with the water.
【００２９】前述したように、通常、冷却水６は入口近
くが最も温度が低く、出口近くが最も温度が高くなる。
図５に示した冷却装置では、発熱体２の直下に配設され
る複数のポーラス部材４１の高さを冷却水の流れ方向に
沿って次第に高くすることにより、各ポーラス部材４１
中の孔４２の総数を冷却水の流れ方向に沿って次第に増
やし、孔４２の総表面積を冷却水の流れ方向に沿って次
第に大きくして、冷却水６の温度が低い入口近くではポ
ーラス部材４１の冷却能力を小さく、冷却水６の温度が
高い出口近くではポーラス部材４１の冷却能力を大きく
している。この様にすることにより、複数個の発熱体２
の温度が冷却水の流れ方向に対して一様になるようにで
きる。その結果、温度依存性をもつ半導体素子等の各発
熱体２の動作特性が一様となり、半導体装置等の装置の
安定した電気的特性が得られるという効果がある。ま
た、本実施の形態においては、同じ製造条件で作製され
たポーラズ部材を異なる形状に加工することにより、冷
却水の流れ方向に対する冷却能力をコントロールできる
ので、実施の形態３のものと比べ、冷却装置の製造が容
易となる効果もある。As described above, the cooling water 6 usually has the lowest temperature near the inlet and the highest temperature near the outlet.
In the cooling device shown in FIG. 5, the height of the plurality of porous members 41 disposed immediately below the heating element 2 is gradually increased along the flow direction of the cooling water, so that each of the porous members 41 is formed.
The total number of the holes 42 in the cooling water 6 is gradually increased along the flow direction of the cooling water, and the total surface area of the holes 42 is gradually increased in the flow direction of the cooling water. The cooling capacity of the porous member 41 is increased near the outlet where the temperature of the cooling water 6 is high. By doing so, the plurality of heating elements 2
Can be made uniform with respect to the flow direction of the cooling water. As a result, the operating characteristics of each heating element 2 such as a semiconductor element having a temperature dependency become uniform, and there is an effect that stable electric characteristics of a device such as a semiconductor device can be obtained. Further, in this embodiment, by processing the porous members manufactured under the same manufacturing conditions into different shapes, the cooling capacity in the flow direction of the cooling water can be controlled. There is also an effect that the manufacture of the device becomes easy.
【００３０】なお、図５に示した冷却装置では、同じ空
孔率のポーラス部材４１を用い、ポーラス部材４１の下
部に支持台４３を設けることによりポーラス部材４１の
高さを変化させて、各ポーラス部材４１中の孔４２の総
数を冷却水の流れ方向に沿って次第に増やし、孔４２の
総表面積を冷却水の流れ方向に沿って次第に大きくなる
ようにしたが、支持台４３を用いず、空孔率の異なるポ
ーラス部材を用いることにより、孔の総数が冷却水の流
れ方向に対して次第に大きくなるようにして、孔４２の
総表面積を冷却水の流れ方向に沿って次第に大きくなる
ようにし、冷却水の流れ方向に対する冷却能力をコント
ロールしてもよい。In the cooling device shown in FIG. 5, the height of the porous member 41 is changed by using a porous member 41 having the same porosity and providing a support 43 below the porous member 41. The total number of holes 42 in the porous member 41 was gradually increased along the flow direction of the cooling water, and the total surface area of the holes 42 was gradually increased along the flow direction of the cooling water. By using porous members having different porosity, the total number of holes is made to gradually increase in the flow direction of the cooling water, and the total surface area of the holes 42 is made to gradually increase in the flow direction of the cooling water. Alternatively, the cooling capacity in the flow direction of the cooling water may be controlled.
【００３１】実施の形態５．図６は実施の形態５による
冷却装置の構成図である。図において、２０は発熱体で
あり、ＧＴＯなどの大型の半導体素子が発熱体２０とし
て冷却装置容器１の上面に設置されている場合を示して
いる。５１は銅、アルミニウムなど熱伝導率の大きな金
属材料からなるポーラス部材であり、発熱体２０直下の
流路内に適当な間隔を開けて分割して複数個配設されて
いる。また、各ポーラス部材５１は冷却水６の流れ方向
に沿った長さが、実施の形態２と同様に、流れ方向に沿
って次第に長くなるよう構成されている。ポーラス部材
５１の内部は冷却水６の流れ方向に直管状の孔５２が多
数本空いた構成となっている。Embodiment 5 FIG. 6 is a configuration diagram of a cooling device according to the fifth embodiment. In the figure, reference numeral 20 denotes a heating element, and shows a case where a large-sized semiconductor element such as GTO is installed on the upper surface of the cooling device container 1 as the heating element 20. Reference numeral 51 denotes a porous member made of a metal material having a high thermal conductivity such as copper or aluminum. The porous member 51 is divided and provided at appropriate intervals in a flow path immediately below the heating element 20. Further, the length of each porous member 51 along the flow direction of the cooling water 6 is configured to gradually increase along the flow direction, similarly to the second embodiment. The inside of the porous member 51 has a configuration in which a number of straight tubular holes 52 are opened in the flow direction of the cooling water 6.
【００３２】次に動作について説明する。図６におい
て、発熱体２０からの熱の一部は、冷却装置容器１の壁
面から直接冷却水６に流れ、他の一部は冷却装置容器１
の壁面およびポーラス部材５１を熱伝導により流れてポ
ーラス部材５１中の孔５２を流れる冷却水６に伝達され
る。冷却水６に伝えられた熱は水とともに出入口５から
排出される。Next, the operation will be described. In FIG. 6, a part of the heat from the heating element 20 flows directly from the wall surface of the cooling device container 1 to the cooling water 6, and the other part is the cooling device container 1.
Of the porous member 51 and the cooling water 6 flowing through the holes 52 in the porous member 51. The heat transmitted to the cooling water 6 is discharged from the entrance 5 together with the water.
【００３３】図６に示した冷却装置では、ポーラス部材
５１は発熱体２０直下の流路内に適当な間隔を開けて複
数に分割して配設されているため、冷却水６が流れる時
の圧力損失を左右するポーラス部材５１の全体の長さが
短くなるため、圧力損失が小さくなるという利点があ
る。また、図６に示した冷却装置では、各ポーラス部材
５１は冷却水６の流れ方向に沿った長さが、実施の形態
２と同様に、流れ方向に沿って次第に長くなるよう構成
されているので、冷却水６の温度が低い入口近くではポ
ーラス部材５１の冷却能力を小さく、冷却水６の温度が
高い出口近くではポーラス部材５１の冷却能力を大きく
することができ、温度依存性をもつ半導体素子等の発熱
体２０の温度が全面でほぼ均一となり、安定した電気的
特性が得られるという利点がある。In the cooling device shown in FIG. 6, the porous member 51 is divided into a plurality of parts at appropriate intervals in the flow path immediately below the heating element 20, so that when the cooling water 6 flows, Since the entire length of the porous member 51 which affects the pressure loss is reduced, there is an advantage that the pressure loss is reduced. Further, in the cooling device shown in FIG. 6, each of the porous members 51 is configured such that the length along the flow direction of the cooling water 6 gradually increases along the flow direction, similarly to the second embodiment. Therefore, the cooling capacity of the porous member 51 can be reduced near the inlet where the temperature of the cooling water 6 is low, and the cooling capacity of the porous member 51 can be increased near the outlet where the temperature of the cooling water 6 is high. There is an advantage that the temperature of the heating element 20 such as an element becomes substantially uniform over the entire surface, and stable electric characteristics can be obtained.
【００３４】なお、上記実施の形態では、各ポーラス部
材５１の長さを冷却水の流れ方向に沿って次第に長くな
るよう構成したが、実施の形態３、４と同様に、各ポー
ラス部材５１の孔径や数、空孔率、あるいは高さを冷却
水の流れ方向に次第に変化させることにより、孔５２の
総表面積や内部の流速を変化させ、冷却水６の温度が低
い入口近くではポーラス部材５１の冷却能力を小さく、
冷却水６の温度が高い出口近くではポーラス部材５１の
冷却能力を大きくするように構成してもよい。In the above embodiment, the length of each porous member 51 is configured to gradually increase along the flow direction of the cooling water. However, as in the third and fourth embodiments, the length of each porous member 51 is reduced. By gradually changing the hole diameter, the number, the porosity, or the height in the flow direction of the cooling water, the total surface area of the holes 52 and the flow velocity inside the hole 52 are changed, and the porous member 51 near the inlet where the temperature of the cooling water 6 is low. The cooling capacity of the
The cooling capacity of the porous member 51 may be increased near the outlet where the temperature of the cooling water 6 is high.
【００３５】また上記各実施の形態においては、発熱体
が冷却装置容器の上面にのみ設置された場合を示した
が、下面も含む両面に設置された場合についても同様な
効果が得られることは勿論である。In each of the above embodiments, the case where the heating element is installed only on the upper surface of the cooling device container is shown. However, the same effect can be obtained when the heating element is installed on both surfaces including the lower surface. Of course.
【００３６】また、上記各実施の形態においては、冷却
装置の冷却媒体として水を使用した場合について述べた
が、空気等、他の流体であっても同様な効果が得られる
ことは勿論である。Further, in each of the above embodiments, the case where water is used as the cooling medium of the cooling device has been described, but it is needless to say that a similar effect can be obtained with other fluids such as air. .
【００３７】[0037]
【発明の効果】以上のように、この発明の第１の構成に
よれば、発熱体を冷却する流路内に、冷却媒体の流れ方
向に沿った管状の孔が多数本空いた多孔材を設け、上記
孔内に上記冷却媒体を流すように構成したので、容易に
冷却能力の向上が図れる冷却装置が得られる効果があ
る。As described above, according to the first configuration of the present invention, a porous material having a large number of tubular holes extending in the flow direction of a cooling medium is provided in a flow path for cooling a heating element. Since the cooling medium is provided in the hole and the cooling medium flows through the hole, there is an effect that a cooling device capable of easily improving the cooling capacity can be obtained.
【００３８】また、この発明の第２の構成によれば、第
１の構成において、多孔材として、金属凝固法により成
形された部材を使用したので、上記第１の構成の冷却装
置を容易、かつ安価に製作することが可能となる。According to the second configuration of the present invention, since the member formed by the metal solidification method is used as the porous material in the first configuration, the cooling device of the first configuration can be easily manufactured. In addition, it can be manufactured at low cost.
【００３９】また、この発明の第３の構成によれば、第
１または第２の構成において、多孔材を冷却媒体の流れ
方向に分割して設置したので、冷却水が流れる流路の圧
力損失が小さな冷却装置が得られる効果がある。According to the third configuration of the present invention, in the first or second configuration, since the porous material is divided and installed in the flow direction of the cooling medium, the pressure loss of the flow path through which the cooling water flows is reduced. However, there is an effect that a small cooling device can be obtained.
【００４０】また、この発明の第４の構成によれば、第
３の構成において、分割された複数の多孔材は、冷却媒
体の流れ方向に沿った長さが上記流れ方向に沿って変化
しているので、発熱体から冷却水までの冷却能力を変化
させることができるため、発熱体の温度を均一にできる
効果がある。Further, according to the fourth configuration of the present invention, in the third configuration, the length of the plurality of divided porous materials along the flow direction of the cooling medium changes along the flow direction. Therefore, the cooling capacity from the heating element to the cooling water can be changed, so that the temperature of the heating element can be made uniform.
【００４１】また、この発明の第５の構成によれば、第
３の構成において、分割された複数の多孔材は、孔の数
または孔の径が冷却媒体の流れ方向に沿って変化してい
るので、発熱体から冷却水までの冷却能力を変化させる
ことができるため、発熱体の温度を均一にできる効果が
ある。Further, according to the fifth configuration of the present invention, in the third configuration, the number of the divided porous materials is such that the number of holes or the diameter of the holes changes along the flow direction of the cooling medium. Since the cooling capacity from the heating element to the cooling water can be changed, there is an effect that the temperature of the heating element can be made uniform.
【００４２】また、この発明の第６の構成によれば、第
３の構成において、分割された複数の多孔材の下部に支
持台を設け、各多孔材の高さが冷却媒体の流れ方向に沿
って変化するようにしたので、発熱体から冷却水までの
冷却能力を変化させることができるため、発熱体の温度
を均一にできる効果がある。According to the sixth aspect of the present invention, in the third aspect, the support is provided below the divided plurality of porous members, and the height of each porous member is set in the flow direction of the cooling medium. In this case, the cooling capacity from the heating element to the cooling water can be changed, so that the temperature of the heating element can be made uniform.
【図１】 この発明の実施の形態１による冷却装置を示
す構成図である。FIG. 1 is a configuration diagram showing a cooling device according to a first embodiment of the present invention.
【図２】 この発明の実施の形態１に係わるポーラス部
材を示す構成図である。FIG. 2 is a configuration diagram showing a porous member according to the first embodiment of the present invention.
【図３】 この発明の実施の形態２による冷却装置を示
す構成図である。FIG. 3 is a configuration diagram illustrating a cooling device according to a second embodiment of the present invention.
【図４】 この発明の実施の形態３による冷却装置を示
す構成図である。FIG. 4 is a configuration diagram illustrating a cooling device according to a third embodiment of the present invention.
【図５】 この発明の実施の形態４による冷却装置を示
す構成図である。FIG. 5 is a configuration diagram illustrating a cooling device according to a fourth embodiment of the present invention.
【図６】 この発明の実施の形態５による冷却装置を示
す構成図である。FIG. 6 is a configuration diagram showing a cooling device according to a fifth embodiment of the present invention.
【図７】 従来の冷却装置を示す構成図である。FIG. 7 is a configuration diagram showing a conventional cooling device.
１ 冷却装置容器、２，２０ 発熱体、３ フィン、４
流路、５ 水出入口、６ 冷却水、１１，２１，３
１，４１，５１ ポーラス部材、１２，２２，３２，４
２，５２ 孔、４３ 支持台。1 cooling device container, 2,20 heating element, 3 fins, 4
Channel, 5 water inlet / outlet, 6 cooling water, 11, 21, 3
1,41,51 porous member, 12,22,32,4
2,52 holes, 43 supports.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中尾 一成 東京都千代田区丸の内二丁目２番３号 三 菱電機株式会社内 (72)発明者 尾崎 永一 東京都千代田区丸の内二丁目２番３号 三 菱電機株式会社内 (72)発明者 下地 美保子 東京都千代田区丸の内二丁目２番３号 三 菱電機株式会社内 (72)発明者 中嶋 英雄 大阪府高槻市日吉台五番町６番40号 Ｆターム(参考） 5E322 AA07 EA11 FA01 FA04 5F036 AA01 BA05 BB43 BD01 ──────────────────────────────────────────────────続 き Continued on the front page (72) Kazunari Nakao 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsui Electric Co., Ltd. (72) Eiichi Ozaki 2-3-2 Marunouchi, Chiyoda-ku, Tokyo No. Miishi Electric Co., Ltd. (72) Mihoko Shimoji 2-3-2 Marunouchi, Chiyoda-ku, Tokyo 2-32 Marunouchi Electric Co., Ltd. No. F-term (reference) 5E322 AA07 EA11 FA01 FA04 5F036 AA01 BA05 BB43 BD01
Claims (6)
流れ方向に沿った管状の孔が多数本空いた多孔材を設
け、上記孔内に上記冷却媒体を流すように構成したこと
を特徴とする冷却装置。In a flow path for cooling a heating element, a porous material having a large number of tubular holes extending in a flow direction of a cooling medium is provided, and the cooling medium is caused to flow through the holes. A cooling device characterized by the above-mentioned.
れた部材を使用したことを特徴とする請求項１記載の冷
却装置。2. The cooling device according to claim 1, wherein a member formed by a metal solidification method is used as the porous material.
設置したことを特徴とする請求項１または２記載の冷却
装置。3. The cooling device according to claim 1, wherein the porous member is divided and installed in a flow direction of the cooling medium.
流れ方向に沿った長さが上記流れ方向に沿って変化して
いることを特徴とする請求項３記載の冷却装置。4. The cooling device according to claim 3, wherein the plurality of divided porous materials have a length along a flow direction of the cooling medium that changes along the flow direction.
は孔の径が冷却媒体の流れ方向に沿って変化しているこ
とを特徴とする請求項３記載の冷却装置。5. The cooling device according to claim 3, wherein the number of holes or the diameter of the holes of the plurality of divided porous materials changes along the flow direction of the cooling medium.
を設け、各多孔材の高さが冷却媒体の流れ方向に沿って
変化するようにしたことを特徴とする請求項３記載の冷
却装置。6. The method according to claim 3, wherein a support is provided below the plurality of divided porous materials, and the height of each porous material changes along the flow direction of the cooling medium. Cooling system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000178170A JP3669569B2 (en) | 2000-06-14 | 2000-06-14 | Cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000178170A JP3669569B2 (en) | 2000-06-14 | 2000-06-14 | Cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001358270A true JP2001358270A (en) | 2001-12-26 |
| JP3669569B2 JP3669569B2 (en) | 2005-07-06 |
Family
ID=18679640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000178170A Expired - Fee Related JP3669569B2 (en) | 2000-06-14 | 2000-06-14 | Cooling system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3669569B2 (en) |
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|---|---|---|---|---|
| EP1564809A1 (en) * | 2004-02-16 | 2005-08-17 | Hitachi, Ltd. | Liquid cooling system and electronic apparatus comprising that system |
| EP1729557A2 (en) * | 2005-05-31 | 2006-12-06 | Behr Industry GmbH & Co. KG | Cooling device for electronic components |
| WO2007017945A1 (en) | 2005-08-11 | 2007-02-15 | Mitsubishi Denki Kabushiki Kaisha | Heat sink and method of producing the same |
| JP2009250810A (en) * | 2008-04-07 | 2009-10-29 | Seiko Epson Corp | Temperature control device of electronic component, and handler device |
| EP1890216A3 (en) * | 2006-07-25 | 2010-12-08 | Fujitsu Ltd. | Liquid cooling unit and heat receiver therefor |
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| US8289701B2 (en) | 2006-07-25 | 2012-10-16 | Fujistu Limited | Liquid cooling unit and heat receiver therefor |
| CN105562660A (en) * | 2015-12-14 | 2016-05-11 | 北京有色金属研究总院 | Preparation method of integral toothed water-cooling plate used for IGBT and provided with S-shaped water-cooling tube |
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| WO2020019183A1 (en) * | 2018-07-25 | 2020-01-30 | 深圳市大疆创新科技有限公司 | Heat dissipation structure for controller, and controller |
| DE112022002737T5 (en) | 2021-05-20 | 2024-04-04 | Lotus Thermal Solution Inc. | Heatsink structure |
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2000
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1564809A1 (en) * | 2004-02-16 | 2005-08-17 | Hitachi, Ltd. | Liquid cooling system and electronic apparatus comprising that system |
| EP1729557A2 (en) * | 2005-05-31 | 2006-12-06 | Behr Industry GmbH & Co. KG | Cooling device for electronic components |
| WO2007017945A1 (en) | 2005-08-11 | 2007-02-15 | Mitsubishi Denki Kabushiki Kaisha | Heat sink and method of producing the same |
| JPWO2007017945A1 (en) * | 2005-08-11 | 2009-02-19 | 三菱電機株式会社 | Heat sink and manufacturing method thereof |
| US8371367B2 (en) | 2005-08-11 | 2013-02-12 | Mitsubishi Denki Kabushiki Kaisha | Heat sink and fabricating method of the same |
| JP4721193B2 (en) * | 2005-08-11 | 2011-07-13 | 三菱電機株式会社 | heatsink |
| US8289701B2 (en) | 2006-07-25 | 2012-10-16 | Fujistu Limited | Liquid cooling unit and heat receiver therefor |
| EP1890216A3 (en) * | 2006-07-25 | 2010-12-08 | Fujitsu Ltd. | Liquid cooling unit and heat receiver therefor |
| JP2009250810A (en) * | 2008-04-07 | 2009-10-29 | Seiko Epson Corp | Temperature control device of electronic component, and handler device |
| JP2011058754A (en) * | 2009-09-11 | 2011-03-24 | Toshiba Corp | Heat exchanging medium and heat exchanger |
| CN107851626A (en) * | 2015-08-05 | 2018-03-27 | 西门子股份公司 | Component Modules and Power Modules |
| CN107851626B (en) * | 2015-08-05 | 2021-08-13 | 西门子股份公司 | Component Modules and Power Modules |
| CN105562660A (en) * | 2015-12-14 | 2016-05-11 | 北京有色金属研究总院 | Preparation method of integral toothed water-cooling plate used for IGBT and provided with S-shaped water-cooling tube |
| WO2020019183A1 (en) * | 2018-07-25 | 2020-01-30 | 深圳市大疆创新科技有限公司 | Heat dissipation structure for controller, and controller |
| DE112022002737T5 (en) | 2021-05-20 | 2024-04-04 | Lotus Thermal Solution Inc. | Heatsink structure |
| DE102024122642A1 (en) | 2024-08-08 | 2026-02-12 | Connaught Electronics Ltd. | Vehicle module with a housing and a cooling device for cooling an electronic component of the vehicle module |
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