JP2001351999A - Package forming method and apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming a package, capable of making a device used for forming a package compact and forming a package highly hermetic sealed, and a device therefor. SOLUTION: A box 22 and an upper cover 24 are disposed in a bonding chamber 26. The bonding chamber 26 is partitioned into two chambers, by a removable separating wall 28, and the upper cover 24 and the box 22 are disposed in separate chambers. The box 22 is held in an inert gas atmosphere, and the upper cover 24 is fluorinated. The upper cover 24 and the box 22 are bonded to teach other in an inert gas to form a package.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for forming a package, and more particularly to a method and an apparatus for forming a package of an electronic device having a quartz oscillator or the like.

[0002]

2. Description of the Related Art Conventionally, as a method of forming a package by joining a box and an upper lid, there is a method of forming a package via a brazing material. For example, an alloy of gold and tin, a compound of silver and tin, or the like is used as a brazing material, and the joining surface of either a box or an upper lid is pre-coated with the brazing material. Then, by bringing the joining surfaces of the box body and the upper lid into contact with each other and heating, the brazing material is melted, and the box body and the upper lid are joined to form a package. Or, using solder or indium as a brazing material,
A package can be formed by pre-coating the joining surface of the box or the upper lid and heating and melting solder or indium at the time of joining using a flux.

There is also a method in which a package is formed without interposing a bonding material (a brazing material) by performing a halogenation treatment on one or both of the bonding surface of the box and the upper lid. When the bonded surfaces subjected to the halogenation treatment (for example, fluoridation treatment) are brought into contact with each other, the active fluorine-based gas on the bonded surface enters the inside while cutting off the atomic bond in the bonded surface. The atoms of the bonding surface whose bonding has been broken are recombined with the atoms of the bonding surface which are in contact with each other, so that the bonding surfaces are bonded to each other to form a package.

[0004]

However, there have been the following problems in the prior art.

When the box body and the upper lid are joined by heating and melting the brazing material, it is necessary to heat the material to a temperature higher than the melting point of the brazing material or the like. there were.

In particular, when using a flux,
The flux gasifies when heated. If the gasified flux enters the package, it may adversely affect the members sealed in the package.

Further, in a method of forming a package by subjecting a bonding surface to a halogenation treatment, the package may be exposed to the air for a long time due to a process or the like. When water or oxygen contained in the air comes into contact with a halogenated (for example, fluorinated) bonding surface, fluorine and oxygen on the bonding surface are bonded. When fluorine is bonded to oxygen as described above, fluorine does not enter the bonding surface, so that bonding processing cannot be performed, and leakage may occur at the bonding surface. Also,
In the case where a package to be formed has a member such as a quartz oscillator, the quartz oscillator is damaged when exposed to a halogenated gas. For this reason, it is necessary to isolate the crystal unit from the halogenated gas during the halogenation treatment, and it has been difficult to form a package.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and a method and apparatus for forming a package capable of reducing the size of an apparatus for forming a package and forming a package with high adhesion. Is to provide.

[0009]

In order to achieve the above object, in a package forming method according to the present invention, at least one joint surface between a package main body and a lid which are joined to each other and enclose an object is formed. After the halogenation treatment, the package body is held in a non-oxidizing atmosphere, and the package body and the lid are joined. With this configuration, the halogenated joint surface is prevented from being deteriorated by the influence of water or oxygen contained in the atmosphere. For this reason, it is possible to prevent a leak from occurring at the joint surface, and to form a package having high adhesion. In addition, since the bonding strength of the bonding surface is strengthened by the halogenation treatment, it is not necessary to heat to a temperature higher than the melting point, and the apparatus can be made more compact.

In the above structure, the halogenation treatment may be a fluorination treatment. The fluorination treatment may be performed by bringing a reactive fluorine-based gas into contact with the bonding surface. The reactive fluorine-based gas includes a single atom of fluorine, a fluorinated gas, a fluorine radical, a free radical containing a fluorine atom, and the like. Such a reactive fluorine-based gas has a high reactivity among gases for halogenation, and thus can exhibit high bonding strength. The fluorination treatment may be performed by applying hydrofluoric acid to the bonding surface or exposing the bonding surface to a vapor of hydrofluoric acid.

In the above configuration, the halogenation treatment may be a chlorination treatment. Chlorine is not as reactive as fluorine, but can easily control chlorination. The chlorination treatment may be performed by applying hydrochloric acid to the bonding surface or exposing the bonding surface to hydrochloric acid vapor.

In the above configuration, the bonding may be performed by heating the bonding surface. By doing so, the halogenation treatment of the bonding surface can be promoted, and the bonding strength is enhanced.

In the above structure, the non-oxidizing atmosphere is
It may be configured to be an inert gas atmosphere. In the above structure, the non-oxidizing atmosphere may be a vacuum.

In the package forming apparatus according to the present invention, a joining processing chamber in which a package body and a lid to be joined to each other are arranged, a halogenating gas supply means for supplying a halogenating gas into the joining processing chamber, A non-oxidizing atmosphere forming means for making the inside of the processing chamber a non-oxidizing atmosphere, and a pressurizing means for mutually pressing the joint surfaces of the package body and the lid are provided.

In the above construction, the joining processing chamber is divided by an openable and closable partition member into a joining chamber in which the package body is disposed and a halogenating chamber in which the lid is disposed, and The gas supply means can be configured to be connected to the halogenation chamber.

In the above structure, the bonding chamber is formed at a lower portion of the bonding chamber, the halogenating chamber is formed on the bonding chamber, and the pressurizing means is provided in the halogenating chamber. , The lid may be mounted.

In the above structure, the non-oxidizing atmosphere forming means may be an inert gas supply means for supplying an inert gas into the bonding chamber.

In the above structure, the non-oxidizing atmosphere forming means may be a vacuum pump for reducing the pressure in the bonding chamber.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A package forming method and apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings. In the present embodiment, the package is formed by subjecting the bonding surface of the upper lid, which is the lid, to halogenation treatment with a fluorinated gas, and bonding the package with the box, which is the package main body, in a non-oxidizing atmosphere. The case of forming will be described.

FIG. 1, FIG. 2, and FIG. 3 are explanatory views of a package forming step in the embodiment of the present invention. As shown in FIG. 1, the package forming apparatus 20 according to the present embodiment includes:
It has a joining chamber 26 in which a box 22 and an upper lid 24 are arranged. In the joining chamber 26, a partition wall plate 28 is provided so as to be freely opened and closed. By partitioning the inside of the joining chamber 26 by the partition wall plate 28, a plurality of compartments 3
0 and 32 are formed. In the present embodiment, the upper lid 24 is arranged with the upper compartment 30 partitioned by the partition wall plate 28 as a halogenated chamber, and the box 22 is arranged with the lower compartment 32 as a jointed chamber.

FIG. 5 is a plan view of the box 22. FIG.
Is a sectional view of the box 22. FIG. As shown in FIG.
The box 22 has a rectangular parallelepiped shape with an open upper surface. The box body 22 has a substrate portion 34 formed in a U-shaped cross section as shown in FIG. The substrate 34 is formed of ceramic. On the upper surface of the substrate part 34, a tungsten layer 36 formed by screen printing is formed.
Is baked. On the surface of the tungsten layer 36, a gold plating layer 38 is formed. In the present embodiment, the surface of the gold plating layer 38 serves as a bonding surface. By forming the gold plating layer 38 in this manner, the bonding strength can be enhanced. The tungsten layer 36
May be formed of another metal. In addition, the substrate unit 34
In addition to the ceramics described above, other metals such as copper and glass can be used.

A quartz oscillator 40 as an electronic component is provided in the box 22. The quartz oscillator 40 includes:
It is made of thin quartz crystal. As shown in FIG. 6, thin-film-like excitation electrodes 42 and 44 are integrally formed on both front and back surfaces of the crystal unit 40. The excitation electrodes 42 and 44 can be formed by evaporating silver or the like, but are not limited thereto. The excitation electrodes 42 and 44 thus formed are connected to a pair of conductive adhesives 4.
It is connected to a conductive pattern (not shown) printed on the substrate unit 34 via the connectors 6 and 48. This conductive adhesive 46, 4
As the material of No. 8, a material mainly containing epoxy, polyimide, silicon or the like is preferably used.

On the other hand, an upper lid 24 joined to the box 22
Is formed as a substantially rectangular plate. The upper lid 2
4 can be formed, for example, by plating copper or the like on the surface of Kovar (an alloy of iron, nickel, and cobalt).

A lower compartment 32 in which the box 22 is disposed;
The upper compartment 30 in which the upper lid 24 is arranged will be described below. First, the lower compartment 32 will be described.

A box heater 45 is provided on the floor of the lower compartment 32. The box body heater 45 supports the box body 22 on the upper surface thereof and also heats the box body 22 so that the joining force can be strengthened. In this embodiment, the box 2
Heating is performed so that the bonding surface of No. 2 becomes approximately 90 ° C.
Further, a lower gas supply port 47 is connected to the lower compartment 32, and the lower gas supply port 47 supplies nitrogen 50.
Such an inert gas flows into the lower compartment 32. The lower compartment 32 is provided with a lower gas outlet 49. The lower gas exhaust port 49 is connected to a lower gas exhaust pump 51, and the lower gas exhaust pump 51 can forcibly exhaust the gas in the lower compartment 32 through the lower gas exhaust port 49.

Next, the upper compartment 30 will be described. At the center of the upper surface of the upper compartment 30, a cylinder body 52 is provided to protrude. The cylinder main body 52 is formed in a cylindrical shape, and its lower surface is open to face the floor of the upper compartment 30. An elevating rod 53 is inserted into the cylinder body 52 so as to be slidable in the vertical direction. An upper heater (hot plate) 56 is provided at the lower end of the lifting rod 53. Further, the upper heater 5
A holder 54 is disposed at a lower portion of the holder 6, and the upper lid 24 is attached to a lower surface of the holder 54. In this way, the upper lid 24 is moved up and down by the lifting rod 53. Further, the upper lid 24 can be heated to about 90 ° C. by the upper heater 56.

An upper gas supply port 58 is provided in the upper compartment 30, and a fluorinated gas is supplied into the upper compartment 30 through the upper gas supply port 58. In addition, the upper compartment 30 is provided with an upper gas outlet 59 so that the gas in the upper compartment 30 can be discharged. The upper gas discharge port 59 is connected to an upper gas discharge pump 60,
By driving the upper gas discharge pump 60, the upper compartment 3
The gas in 0 can be forcibly exhausted.

Hereinafter, the upper compartment 30 and the lower compartment 32
A description will be given of the supply path of the gas supplied to the above. FIG.
FIG. 1 is a system diagram showing a gas supply path in the present embodiment. As shown in FIG. 4, the upper compartment 30 is connected to a carbon tetrafluoride (CF ₄ ) supply source 62 which is a raw material of a fluorinated gas. The carbon tetrafluoride supply source 62 is connected to one end of a source gas supply pipe 64 so that the carbon tetrafluoride can flow through the source gas supply pipe 64. The source gas supply pipe 64 is provided with an on-off valve 66,
The on-off valve 66 can supply and shut off carbon tetrafluoride. The source gas supply pipe 64 is branched at the subsequent stage of the on-off valve 66, and the tip of the branch pipe 68 is inserted into the water 72 of the water holding container 70. Thus, water can be mixed with the carbon tetrafluoride flowing from the branch pipe 68. On the upper surface of the water holding container 70, the tip of a branch pipe 74 from the source gas supply pipe 64 faces, and carbon tetrafluoride containing water is supplied from the branch pipe 74 to the source gas supply pipe 64. It can flow into.

The branch pipe 68 is provided with a flow control valve 76 for controlling the flow of carbon tetrafluoride.
Further, the branch pipe 68 in the source gas supply pipe 64 is used.
A flow control valve 78 is also provided between the fuel cell and the branch pipe 74.
Thus, by controlling the flow control valves 76 and 78, the amount of water contained in the carbon tetrafluoride can be adjusted.

The leading end of the combined source gas supply pipe 64 is introduced into the discharge unit 80 at the inlet side under atmospheric pressure. The discharge unit 80 can generate a gas discharge through the inflowing carbon tetrafluoride to generate a fluorinated gas 55 such as fluorine (F) or hydrogen fluoride (HF).

One end of a fluorinated gas supply pipe 81 is inserted and arranged on the outlet side of the discharge unit 80. The other end of the fluorinated gas supply pipe 81 is inserted into the upper gas supply port 58 of the upper compartment 30 so that the fluorinated gas can be introduced into the upper compartment 30.

On the other hand, the lower compartment 32 is connected to a nitrogen gas source 82 which is a source of nitrogen as an inert gas. The nitrogen gas supply source 82 is connected to a nitrogen gas supply pipe 84. The nitrogen gas supply pipe 84 is provided with a control valve 96 so that the amount of nitrogen gas supplied can be controlled. The end of the supply pipe 84 is inserted and arranged in the lower gas supply port 47 of the lower compartment 32, so that an inert gas can flow into the supply pipe 84.

The nitrogen supply pipe 84 and the fluorine gas supply pipe 81 are connected via a connection pipe 85. On-off valves 86 and 87 are provided on the fluorine gas supply pipe 81 and the connection pipe 85, respectively. By controlling the opening and closing of the on-off valves 86 and 87, the inert gas flowing into the nitrogen supply pipe 84 can be introduced into the upper compartment 30 via the fluorine gas supply pipe 81.

The package forming apparatus 2 thus configured
The operation of 0 is as follows. First, as shown in FIG. 1, the joining chamber 26 is blocked off by a partition plate 28 and partitioned into an upper compartment 30 and a lower compartment 32. The upper lid 24 is attached to the holder 54 in the upper compartment 30 and the box 22 is placed on the box heater 45 in the lower compartment 32.
Is fixedly arranged.

Then, as shown in FIG. 4, a fluorinated gas is introduced into the upper compartment 30. That is, carbon tetrafluoride is supplied from the carbon tetrafluoride supply source 62 to the source gas supply pipe 64. In the present embodiment, the control valve 78 of the source gas supply pipe 64 and the control valve 76 of the branch pipe 68 are controlled to supply the mixed gas containing the water 72 to the discharge unit 80. Thus, the discharge unit 80 generates the fluorinated gas 55 and introduces the fluorinated gas 55 into the upper compartment 30. The lower surface side of the upper lid 24 disposed in the upper compartment 30 can be fluorinated by the fluorinated gas 55. By fluorinating the bonding surface of the upper lid 24, bonding can be performed without using a flux.

As described above, the lower compartment 32 is isolated from the upper compartment 30 by the partition wall plate 28. Therefore, the lower compartment 32 is not affected by the fluorinated gas 55 introduced into the upper compartment 30. Therefore, the box 22 disposed in the lower compartment 32 is not affected by the fluorinated gas 55, and the quartz oscillator 40 in the box 22 is not likely to be adversely affected by the fluorinated gas. In the present embodiment, the nitrogen gas is supplied from the nitrogen gas supply source 82 to the supply pipe 84 into the lower compartment 32.
By filling the lower compartment 32 with an inert gas such as nitrogen gas, the box 22 can be isolated from water and oxygen in the atmosphere. Thereby, oxidation by heating of the box body 22 can be prevented. In the embodiment, the inside of the lower compartment 32 is kept in an inert gas atmosphere. However, the configuration is not limited to this as long as the inside of the lower compartment 32 can be protected from the fluorinated gas.

As described above, the upper cover 24 in the upper compartment 30
After performing the fluoridation process, the fluorinated gas in the upper compartment 30 is discharged from the upper gas outlet 59 by the upper gas discharge pump 60. Then, in the present embodiment, an inert gas such as a nitrogen gas is introduced into the upper compartment 30 to maintain the inside of the upper compartment 30 in an inert gas atmosphere.

After doing so, as shown in FIG.
The partition wall plate 28 blocking the joining chamber 26 is removed, and the upper compartment 30 and the lower compartment 32 are integrated to form the joining chamber 26. At this time, since the fluorinated gas has been removed from the inside of the bonding chamber 26 as described above, there is no adverse effect on the crystal unit 40 in the box 22. And
Since the inside of the bonding chamber 26 is in a nitrogen gas atmosphere, the fluorinated bonding surface of the upper lid 24 can be bonded without being adversely affected by oxygen or water.

The joining process of the upper lid 24 and the box 22 is performed as follows. The upper lid 24 is lowered by the lifting rod 53 and comes into contact with the surface of the gold plating layer 38 of the opposing box 22 as shown in FIG. Since the lower surface of the upper lid 24 is fluorinated as described above, the upper lid 24 and the gold plating layer 38 can be joined without interposing a joining material.
Such a bonding effect by halogenation is considered as follows. That is, the fluorine adhered to the surface of the upper lid 24 at the time of the bonding process is diffused into the upper lid 24 to cut the bonds forming crystals, and partly diffuses into the gold plating layer 38 of the box body 22 to diffuse the bonds. Cut the bond. For this reason, a free bond is generated in the surface layer portion of the upper lid 24 and the gold plating layer 38, and they are joined to each other, so that solid joining can be performed. The pressure applied by the lifting rod 53 at this time depends on the strength and shape of the box 22 and the upper lid 24 to be joined, but it is desirable that the pressure be as large as possible. Further, when heating is performed at the time of bonding, the fluorine attached to the upper lid 24 is activated, and diffusion into the upper lid 24 proceeds at an early stage. As for the heating temperature at this time, a higher temperature is preferable unless the box body 22 and the upper lid 24 are softened.

In the embodiment, the box 22 and the upper lid 24 are joined in one joining chamber 26. However, during the fluoridation of the upper lid 24 and the joining process with the upper lid 24, the box 22 is The embodiment is not limited to this as long as it can protect the 22 from the fluorinated gas. For example, the upper cover 24 after the fluorinated treatment is transferred by a transfer robot or the like to perform the joining process on the box 22 protected from the fluorinated gas. You may.

The fluoridation treatment of the upper lid 24 is not limited to fluorine and hydrogen fluoride, and active fluorine such as a single atom of fluorine, a fluorinated gas, or a free radical containing a fluorine radical or a fluorine atom is brought into contact with the upper lid 24. It can be done by doing. In this way, by introducing active fluorine, a high bonding force can be exhibited. The halogenation of the upper lid 24 can be performed by applying a processing liquid containing fluorine (such as hydrofluoric acid) or by bringing the processing liquid into contact with the vapor of the processing liquid containing fluorine. Thus, since it is not necessary to perform a process such as converting fluorine into plasma, the cost can be reduced as compared with the case where plasma is converted into plasma. Further, the joining of the upper lid 24 and the box body 22 is performed by heating to below the melting point, but may be performed by heating to above the melting point. Thereby, the joining force can be greatly enhanced. Also, bonding can be performed without heating. The halogenation of the upper lid 24 can be performed by chlorination. Since chlorine is not as reactive as fluorine, control of the chlorination treatment can be performed easily.

In the embodiment, the joining process of the upper lid 24 and the box 22 is performed in an inert gas atmosphere, but may be performed in a vacuum. This is the lower gas outlet 4
9 or by exhausting the gas in the joining chamber 26 from the upper gas outlet 59.

[0043]

FIG. 7 shows a halogenating means 1 in the embodiment.
It is explanatory drawing which shows 00. Halogenation treatment means 100
Has a Teflon (registered trademark) beaker 112.
The Teflon beaker 112 contains an aqueous HF solution (hydrofluoric acid).
Solution 114 such as water or HCl aqueous solution (hydrochloric acid)
Contains. A Teflon jig 115 is inserted into the Teflon beaker 112. The Teflon jig 11
Reference numeral 5 denotes an end face of a cylindrical support shaft 118 abutting against the center of a flat support plate 116,
It is formed so as to have a character shape. In this embodiment, as shown in FIG. 7, the Teflon jig 115 is moved so that the support plate 116 is positioned near the halogenated solution 114 in the Teflon beaker 112 and the tip of the support shaft 118 is Teflon beaker. It is arranged to protrude from the upper surface of 112. The Teflon beaker 112 is covered with the Teflon lid 120 on the upper surface of the Teflon beaker 112.
The inside of the jig 12 is held tightly and the jig 115 made of Teflon can be fixedly held.

On the other hand, on the support plate 116, a Teflon container 122 is arranged. The volume of the Teflon container 112 is 1000 ml. A work 110 is arranged in the Teflon container 112. Teflon beaker 1
12 is heated to evaporate the halogenated solution 114, and the Teflon beaker 112 is filled with a halogenated gas such as hydrofluoric acid vapor or hydrochloric acid vapor. Thereby, the work 110 is exposed to the halogenation processing gas to be halogenated. Within 5 minutes after removing the work 110 from the Teflon beaker 112, the work 110 was held under the atmosphere and pressure shown in Examples 1 to 6. Thereafter, the work 110 is attached to a main body disposed in a joining device (not shown).
Were bonded to form a package, and the presence or absence of leakage from the bonding surface of the package was measured. The work 110 of the first, third, and fifth embodiments is a case where the halogenation treatment is performed with a hydrofluoric acid solution. Further, the workpieces 110 of the second, fourth, and sixth embodiments are obtained by performing a halogenation treatment with a hydrochloric acid solution.

Example 1 A work 110 halogenated with a hydrofluoric acid solution was taken out of a Teflon beaker 112 and kept in the air within 5 minutes. At this time, the work 110 was not pressurized but was maintained at the atmospheric pressure. In this state, the work 110 was held for 3 hours.

Thereafter, the workpiece 110 was lowered toward a main body disposed in a bonding apparatus (not shown) to perform a bonding process to form a package. In the package formed by bonding the work 110 in this manner, a leak occurred from the bonding surface.

Example 2 A work 110 halogenated with a hydrochloric acid solution was taken out of the Teflon beaker 112 and kept in the air within 5 minutes. At this time work 1
10 was not pressurized and kept at atmospheric pressure. In this state, the work 110 was held for 3 hours.

Thereafter, the workpiece 110 was lowered toward a main body disposed in a bonding apparatus (not shown) to perform a bonding process to form a package. In the package formed by bonding the work 110 in this manner, a leak occurred from the bonding surface.

Example 3 A work 110 which had been halogenated with a hydrofluoric acid solution was taken out of a Teflon beaker 112 and placed within a joining apparatus (not shown) maintained in a nitrogen atmosphere within 5 minutes. At this time, the work 110 was not pressurized but was maintained at the atmospheric pressure. Work 11 in such a state
0 was held for 3 hours.

Thereafter, the workpiece 110 was lowered toward a main body disposed in a bonding apparatus (not shown) to perform a bonding process to form a package. In the package formed by bonding the work 110 in this manner, no leak occurred from the bonding surface.

Example 4 A work 110 halogenated with a hydrochloric acid solution was placed in a joining apparatus (not shown) maintained in a nitrogen atmosphere within 5 minutes after being taken out of the Teflon beaker 112. At this time, the work 110 is not pressurized,
It was kept at atmospheric pressure. In this state, the work 110 was held for 3 hours.

Thereafter, the workpiece 110 was lowered toward the main body disposed in a bonding apparatus (not shown) to perform a bonding process to form a package. In the package formed by bonding the work 110 in this manner, no leak occurred from the bonding surface.

Example 5 A work 110 which had been halogenated with a hydrofluoric acid solution was taken out of a Teflon beaker 112 and, within 5 minutes, placed in a vacuum-reduced joining apparatus (not shown). At this time, the pressure in the joining device is 1.33 ×
The ^{pressure was set to} 10 ⁻³ Pa (1 × 10 ⁻⁵ Torr). In this state, the work 110 was held for 3 hours.

Thereafter, the workpiece 110 was lowered toward the main body disposed in a bonding apparatus (not shown) to perform a bonding process to form a package. In the package formed by bonding the work 110 in this manner, no leak occurred from the bonding surface.

Example 6 A work 110 which had been halogenated with a hydrochloric acid solution was taken out of a Teflon beaker 112 and placed within a not-shown bonding apparatus (not shown) within 5 minutes. At this time, the pressure in the joining device was 1.33 × 1
The ^{pressure was set to} 0 ⁻³ Pa (1 × 10 ⁻⁵ Torr). In this state, the work 110 was held for 3 hours.

Thereafter, the workpiece 110 was lowered toward the main body disposed in a bonding apparatus (not shown) to perform a bonding process to form a package. In the package formed by bonding the work 110 in this manner, no leak occurred from the bonding surface.

As shown in the above embodiments, the sealing performance of the package is improved by holding the halogenated work in an inert gas atmosphere or in a vacuum and performing the bonding process continuously. I understand.

[0058]

As described above, in the present invention, the joint surface subjected to the halogenation treatment is prevented from being deteriorated by the influence of water or oxygen contained in the atmosphere. For this reason,
Leakage can be prevented from occurring at the joint surface, and a package with high adhesion can be formed. In addition, since the bonding strength of the bonding surface is strengthened by the halogenation treatment, it is not necessary to heat to a temperature higher than the melting point, and the apparatus can be made more compact.

[0059]

[Brief description of the drawings]

FIG. 1 is a process chart showing a package forming process in an embodiment of the present invention.

FIG. 2 is a process chart showing a package forming process in the embodiment of the present invention.

FIG. 3 is a process chart showing a package forming process in the embodiment of the present invention.

FIG. 4 is a conceptual diagram illustrating a package forming method according to the embodiment.

FIG. 5 is a plan view of a box.

FIG. 6 is a sectional view of a box.

FIG. 7 is a cross-sectional view of the measuring device in the example.

[Explanation of symbols]

 20 package forming apparatus 22 box 24 top cover 26 joining chamber 28 partition wall plate 30 upper compartment 32 lower compartment 34 substrate Section 36 Tungsten layer 38 Gold plating layer 40 Crystal oscillator 42 Excitation electrode 44 Excitation electrode 45 Box heater 46 Conductive adhesive 47 Lower gas supply port 48 Conductive adhesive 49 Lower gas discharge port 50 Nitrogen 51 Lower gas discharge pump 52 Cylinder body 53 Lifting rod 54 Holder 55 Halogenated gas 56 Upper heater 58 Upper gas supply port 59 Upper gas discharge port 60 Upper gas discharge pump 62 Carbon tetrafluoride Supply source 64: Source gas supply pipe 6 ... On-off valve 68 ... Branch pipe 70 ... Water holding container 72 ... Water 74 ... Branch pipe 76 ... Flow control valve 78 ... Flow control valve 80 ... Discharge unit 81 Fluorination treatment gas supply pipe 82 Nitrogen gas supply source 84 Supply pipe 85 Connection pipe 86 On-off valve 87 On-off valve 96 Control valve 100 … Halogenating means 110… Workpiece 112… Teflon beaker 114… Halogenated solution 115… Teflon jig 116… Support plate 118… Support shaft 120… Teflon lid 122 ... Teflon container

Claims (16)

[Claims] At least one joining surface of a package body and a lid, which are joined to each other and enclose an object, is halogenated, and then held in a non-oxidizing atmosphere to form a package body and a lid. A package forming method. 2. The package forming method according to claim 1, wherein the halogenating process is a fluorinating process. 3. The package forming method according to claim 2, wherein the fluorination treatment is performed by bringing a reactive fluorine-based gas into contact with the bonding surface. 4. The package formation according to claim 2, wherein the fluoridation treatment is performed by applying hydrofluoric acid to the bonding surface or exposing the bonding surface to hydrofluoric acid vapor. Method. 5. The package forming method according to claim 1, wherein said halogenation treatment is a chlorination treatment. 6. The package forming method according to claim 5, wherein the chlorination treatment is performed by applying hydrochloric acid to the joint surface or exposing the joint surface to hydrochloric acid vapor. 7. The package forming method according to claim 1, wherein the bonding is performed by heating the bonding surface. 8. The package forming method according to claim 1, wherein the bonding is performed by connecting a bonding surface of the package body and a bonding surface of the lid to each other. . 9. The method according to claim 1, wherein the non-oxidizing atmosphere is an inert gas atmosphere. 10. The package forming method according to claim 1, wherein the non-oxidizing atmosphere is a vacuum. 11. A bonding processing chamber in which a package body and a lid to be bonded to each other are disposed, a halogenating gas supply unit for supplying a halogenating gas into the bonding processing chamber, and a non-oxidizing atmosphere in the bonding processing chamber. Means for forming a non-oxidizing atmosphere,
A package forming apparatus, comprising: a pressurizing unit that presses the joining surfaces of the package body and the lid to each other. 12. The joining processing chamber is partitioned by an openable and closable partition member into a joining chamber in which the package body is arranged and a halogenation chamber in which the lid is arranged.
The package forming apparatus according to claim 11, wherein the halogenated gas supply means is connected to a halogenation chamber. 13. The bonding chamber is formed below the bonding chamber, the halogenation chamber is formed above the bonding chamber, and the pressurizing means is provided in the halogenation chamber, 13. The package forming apparatus according to claim 12, wherein a lid is mounted. 14. The package forming apparatus according to claim 11, wherein said non-oxidizing atmosphere forming means is an inert gas supply means for supplying an inert gas into said bonding chamber. . 15. The package forming apparatus according to claim 11, wherein said non-oxidizing atmosphere forming means is a vacuum pump for reducing the pressure in said bonding chamber. 16. The bonding processing chamber according to claim 11, further comprising a heating unit configured to heat at least one of the package body and the lid. Package forming equipment.