JP2001351883A - Abrasive for semiconductor insulation film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-quality abrasive for insulation film of a semiconductor which can increase a polishing speed while at the same time reducing scratches and dust when polishing an insulation film of a semiconductor by CMP method. SOLUTION: The abrasive for an insulation layer of a semiconductor consists of a slurry prepared by dispersing composite oxide particles of cerium and zirconium into an aqueous solution.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor substrate, a wiring substrate, a semiconductor device, a glass material, a hard disk, a photomask, a glass substrate such as a liquid crystal display, an optical lens, a crystal oscillator, a magnetic head, a video deck head,
The present invention relates to an abrasive for an optical fiber connector or the like. More specifically, the present invention relates to a polishing slurry for an insulating film layer of a semiconductor, comprising a slurry liquid in which composite oxide particles of cerium and zirconium are dispersed in an aqueous solution.

[0002]

2. Description of the Related Art In recent years, with the increase in the degree of integration of semiconductor devices, the minimum processing line width accompanying the increase in the number of wiring layers and the miniaturization of wiring patterns has been progressing in the direction of adopting fine line widths on the order of 0.1 μm. I am doing it.

Accordingly, in order to compensate for the lack of depth of focus of an exposure apparatus for drawing a wiring pattern, it is necessary to flatten the device surface in an intermediate step of semiconductor device manufacturing.

[0004] As a method of such flattening, an etch-back method, a reflow method, or a chemical mechanical polishing method (abbreviated as CMP method) is used.
g), etc., a technology to polish the interlayer insulating film such as silica so as to have a uniform thickness has been developed. However, since it is particularly effective for global flattening derived from the density of wiring,
The CMP method has become mainstream.

At present, in the CMP method, a technique using a slurry liquid containing silica particles and a slurry liquid containing cerium oxide particles has been industrially put to practical use.

Among them, the slurry liquid containing silica particles has the highest versatility, but the slurry liquid containing silica particles has
In order for the polishing liquid to have an etching action, it is necessary to make the polishing liquid highly alkaline, and there are problems such as an increase in impurities such as potassium and a reduction in polishing rate, depending on the strong alkaline solution used.

On the other hand, the slurry containing cerium oxide particles has a high polishing rate because of its high reactivity with silica as a material of the insulating film. However, scratches called scratches are generated on the surface of the material to be polished. In addition, there is a problem that cerium oxide particles easily remain on the surface to be polished, generating so-called dust.

[0008]

An object of the present invention is to provide a CM
An object of the present invention is to provide a high-performance semiconductor insulating film layer polishing agent which can improve the polishing rate in polishing a semiconductor insulating film layer by the P method and can reduce scratches and dust.

[0009]

Means for Solving the Problems To solve such problems, the abrasive of the present invention has the following constitution. That is, it is a polishing slurry for a semiconductor insulating film layer comprising a slurry liquid in which composite oxide particles of cerium and zirconium are dispersed in an aqueous solution.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The present inventors have conducted intensive studies and as a result,
Surprisingly, it has been found that the above-mentioned problems can be solved at once by a polishing agent comprising a slurry liquid in which composite oxide particles of cerium and zirconium (hereinafter simply referred to as composite oxide particles) are dispersed in an aqueous solution. Things.

The abrasive according to the present invention is used for polishing an insulating film layer in a semiconductor manufacturing process. In particular, it can be preferably applied to a method called STI (Shallow Trench Isolation) for uniformly polishing the surface of an insulating film by utilizing the difference in polishing rate between a stop film made of silicon nitride or the like and an insulating film made of silica or the like.

In the present invention, the composite oxide particles used for the abrasive are formed by oxidizing cerium oxide or ceric oxide (hereinafter collectively referred to as cerium oxide) and zirconium oxide to form a solid solution. A compound in which cerium and zirconium oxide have reacted to form a compound can be preferably used, but a simple mixture can also be used.

In the present invention, the composite oxide particles forming a solid solution can be obtained, for example, by the following method.

A water-soluble trivalent cerium compound such as cerium nitrate, cerium sulfate and cerium chloride is mixed with a water-soluble zirconium compound such as zirconium oxychloride in an aqueous solution, and the mixture is reacted by adding aqueous ammonia or the like. Then, a water-insoluble compound of cerium and zirconium is formed, and an oxidizing agent such as hydrogen peroxide is further added to perform oxidation treatment.

Next, the solution is filtered and centrifuged to collect a coprecipitate composed of composite oxide particles. Here, in order to increase the purity of the composite oxide particles, it is effective to repeatedly wash the coprecipitate with ultrapure water or the like.

Next, after drying the coprecipitate, the coprecipitate is dried in an oven for 3 hours.
By performing a heat treatment at a temperature of 00 ° C. or higher, powder of composite oxide particles is obtained.

The composite oxide particles have an average primary particle diameter of 10 to 1000 nm, preferably 50 to 5 nm.
The thickness is preferably 00 nm, more preferably 50 to 250 nm. If it is less than 10 nm, the particles are too fine, and the polishing performance may be poor when used as an abrasive for a semiconductor insulating film layer.
Scratch may occur on the surface to be polished. here,
"Primary particles" refers to the smallest unit of particles constituting a powder or agglomerate that can exist without breaking bonds between molecules.

The average particle diameter of the primary particles is determined, for example, by observing a TEM photograph obtained by a transmission electron microscope (TEM) for each primary particle under magnification, determining the equivalent circle diameter by image processing, and determining the equivalent circle diameter. Can be determined from the 50% diameter (median diameter) in the particle size distribution.

In the present invention, the content of cerium oxide contained in the composite oxide particles is 25 to 99.9% by weight, preferably 30 to 100% by weight based on the total composite oxide particles.
The content is preferably from 95 to 95% by weight, more preferably from 35 to 90% by weight, and still more preferably from 40 to 85% by weight. If the content is less than 25% by weight, scratches may occur on the surface to be polished when used as an abrasive for a semiconductor insulating film layer.

In the present invention, the composite oxide particles are
The content of impurities such as sodium, copper, iron, aluminum, and calcium is preferably less than 1% by weight, and preferably less than 0.5% by weight, based on 100% by weight of the total composite oxide particles. If the content of the impurities is 1% by weight or more, the impurities may remain in the semiconductor to be polished, thereby deteriorating the quality of the semiconductor. The content of the impurity can be measured by ICP emission spectroscopy.

The slurry of the present invention, that is, the slurry containing the composite oxide particles, can be obtained by dispersing the composite oxide particles obtained by the above-described method in an aqueous solution as usual. . The distribution method here is
For example, a method using an ordinary stirrer, a method using a ball mill or the like can be adopted.

For dispersion, it is preferable to add a dispersant. As the dispersant, those containing no metal ions can be preferably used. Specifically, water-soluble organic polymers such as ammonium salts of polyacrylic acid and polyvinyl alcohol; water-soluble anionic surfactants such as ammonium lauryl sulfate; and water-soluble nonionic surfactants such as polyethylene glycol monostearate. Activators and water-soluble amines such as monoethanolamine. If the dispersant is not added, particles may adhere to the surface of the material to be polished to form so-called dust, or the dispersibility of the slurry liquid may decrease. In the present invention, the pH of the abrasive made of a slurry liquid in which composite oxide particles are dispersed in an aqueous solution is preferably 3 to 11, and more preferably 5 to 9.
When the pH is out of the above range, the degree of acidity or alkalinity is increased, which may make it difficult to treat wastewater or corrode a manufacturing apparatus.

[0023]

(Example 1) 2080 g of an aqueous solution of cerous chloride containing 24% by weight of ceric oxide and 2080 g of zirconium oxide so that the mixing ratio of cerium oxide and zirconium oxide becomes 50:50 in terms of weight. Was mixed and stirred with 2500 g of an aqueous solution of zirconium oxychloride having a concentration of 20% by weight to prepare a mixed aqueous solution of cerous chloride and zirconium oxychloride.

Next, 3000 g of 7% by weight ammonia water was added to the aqueous solution and stirred to adjust the pH of the aqueous solution to 7%.
And Furthermore, 77 g of hydrogen peroxide solution was added and stirred,
A coprecipitate of cerium hydroxide and zirconium hydroxide was obtained.

The aqueous solution containing the coprecipitate was heated in an autoclave at 150 ° C. for 24 hours, and filtration and washing were repeated several times, followed by drying to obtain a composite oxide powder.

This powder was fired at 1000 ° C. for 2 hours to obtain a powder of composite oxide particles. The average particle diameter of the primary particles of the particles constituting the present powder is 70 nm, and the total composite oxide particles 10
Based on 0% by weight, the content of cerium oxide was 49.9% by weight, and the content of impurities was 0.2% by weight.

Next, 2700 g of pure water was added to 300 g of the powder of the composite oxide particles and mixed with a ball mill for 24 hours to obtain a slurry liquid containing the composite oxide particles.

Next, the concentration of the composite oxide particles in the slurry liquid was adjusted to 10% by weight, and an ammonium salt of polyacrylic acid as a dispersant was added to 100% by weight of the composite oxide particles contained in the slurry liquid. 10% by weight, stirred and diluted with pure water to a concentration of 1% by weight, pH 7.3.
An abrasive comprising a slurry liquid in which the composite oxide particles were dispersed in an aqueous solution was obtained.

Using this abrasive, a silicon oxide film (insulating film layer) on a silicon wafer (size, type: 15 mm ×
(15 mm square) was polished with the following apparatus and conditions.

Polishing device: Lapping machine (Musashino Electronics Co., Ltd., model number: MA-200) Polishing pad: IC1000 / SUBA400 (Rodel Nitta) Load: 200 g / cm ² Platen rotation speed: 60 rpm Work rotation Number: 60 rpm Polishing time: 5 minutes Abrasive supply amount: 24 cc / min Here, the silicon oxide film after polishing was evaluated by the following apparatus and method.

Film thickness measurement: Film thickness meter (Lambda Ace, manufactured by Dainippon Screen Co., Ltd.) Observation of scratches and dust: Observed visually with a microscope (manufactured by Keyence Corporation). The polishing rate was determined by dividing the change in film thickness by the polishing time (5 minutes). From the above, the following results were obtained.

Polishing rate: 133 nm / min. Scratch: not recognized.

Dust: not observed. (Example 2) A polishing agent was adjusted in the same manner as in Example 1 except that the mixing ratio of cerium oxide and zirconium oxide was 80:20 in terms of weight, and a silicon oxide film was formed on a silicon wafer. Was polished and evaluated.

Here, the composite oxide particles have an average particle diameter of primary particles of 80 nm, the content of cerium oxide is 79.8% by weight, and the content of impurities is 0.1% based on 100% by weight of all composite oxide particles. It was 2% by weight. Further, the prepared abrasive had a concentration of 1% by weight and a pH of 7.1. From the above, the following results were obtained.

Polishing rate: 117 nm / min. Scratch: not recognized.

Dust: not observed. Example 3 A polishing agent was prepared in the same manner as in Example 1 except that the mixing ratio of cerium oxide and zirconium oxide was 90:10 in terms of weight, and a silicon oxide film was formed on a silicon wafer. Was polished and evaluated.

Here, the composite oxide particles have an average primary particle diameter of 90 nm, a cerium oxide content of 89.8% by weight and an impurity content of 0% with respect to 100% by weight of all the composite oxide particles. 0.2% by weight. Further, the prepared abrasive had a concentration of 1% by weight and a pH of 7.1. From the above, the following results were obtained.

Polishing rate: 95 nm / min. Scratch: not recognized.

Dust: not observed. Comparative Example 1 An abrasive was prepared, and a silicon oxide film was polished on a silicon wafer and evaluated in the same manner as in Example 1 except that cerium oxide powder obtained by pulverizing a natural mineral was used. .

The oxide particles had an average primary particle diameter of 1500 nm and an impurity content of 30%. Further, the prepared abrasive had a concentration of 1% by weight and a pH of 7.4. From the above, the following results were obtained.

Polishing rate: 76 nm / min. Scratch: Many were observed.

Dust: not observed. (Comparative Example 2) A silicon wafer was prepared in the same manner as in Example 1, except that a silica slurry liquid (fumed silica, purity: 99.7%) was used and a slurry liquid abrasive having a particle concentration of 10% by weight was prepared. A silicon silicon oxide film was polished thereon and evaluated.

Here, the particles have an average primary particle diameter of 3
0 nm and the impurity content was 0.3%. Further, the prepared abrasive had a concentration of 10% by weight and a pH of 11.
From the above, the following results were obtained.

Polishing rate: 35 nm / min. Scratch: not recognized.

Dust: not observed.

[0046]

According to the present invention, since an abrasive made of a slurry liquid in which cerium and zirconium composite oxide particles are dispersed in an aqueous solution is used, the polishing of the semiconductor insulating film layer by the CMP method is performed. While significantly improving the speed, scratches and dust can be significantly reduced at the same time.

Claims (7)

[Claims] An abrasive for a semiconductor insulating film layer comprising a slurry in which cerium and zirconium composite oxide particles are dispersed in an aqueous solution. 2. The abrasive for an insulating film layer according to claim 1, which is used for shallow trench isolation. 3. The insulating material according to claim 1, wherein the content of cerium oxide contained in the composite oxide particles is 25 to 99.9% by weight based on 100% by weight of all the composite oxide particles. Abrasive for film layer. 4. The abrasive for an insulating film layer according to claim 1, wherein the primary particles of the composite oxide particles have an average particle size of 10 to 1000 nm. 5. The insulating film according to claim 1, wherein the content of impurities contained in the composite oxide particles is less than 1% by weight based on 100% by weight of all composite oxide particles. Abrasive for layer. 6. The abrasive for an insulating film layer according to claim 1, wherein a dispersant is added to said slurry liquid. 7. The abrasive for an insulating film layer according to claim 1, which has a pH of 3 to 11.