JP2001348664A - Method and apparatus for assembling mask assembly - Google Patents
Method and apparatus for assembling mask assemblyInfo
- Publication number
- JP2001348664A JP2001348664A JP2000169317A JP2000169317A JP2001348664A JP 2001348664 A JP2001348664 A JP 2001348664A JP 2000169317 A JP2000169317 A JP 2000169317A JP 2000169317 A JP2000169317 A JP 2000169317A JP 2001348664 A JP2001348664 A JP 2001348664A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- substrate
- holder
- pressing
- liquid crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 230000008021 deposition Effects 0.000 claims abstract description 4
- 238000006073 displacement reaction Methods 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000011521 glass Substances 0.000 abstract description 43
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 41
- 239000000463 material Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 230000007723 transport mechanism Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Liquid Crystal (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術の分野】本発明は、液晶ガラス基板
等にマスク成膜を行なうためのマスク成膜ラインにおい
て成膜材料源に対向して配置・移動されるマスク組立体
の組立方法と、かかるマスク組立体の組み立てに利用さ
れる組立装置とに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of assembling a mask assembly which is disposed and moved to face a film forming material source in a mask film forming line for forming a mask on a liquid crystal glass substrate or the like. The present invention relates to an assembling apparatus used for assembling such a mask assembly.
【0002】[0002]
【従来の技術】液晶ガラス基板のマスク成膜ラインで
は、例えば成膜材料源が下側にあるデポアップ形の装置
構成とする場合、マスクの上側に液晶ガラス基板を載
せ、マスクとともに液晶ガラス基板を成膜材料源上方で
一定方向に移動させることによってマスク成膜を行って
いる。2. Description of the Related Art In a film forming line for forming a mask on a liquid crystal glass substrate, for example, in the case of a deposition-type apparatus configuration in which a film forming material source is on the lower side, the liquid crystal glass substrate is placed on the upper side of the mask, and the liquid crystal glass substrate is mounted together with the mask. The mask film is formed by moving the film in a certain direction above the film forming material source.
【0003】[0003]
【発明が解決しようとする課題】この際、マスク上に液
晶ガラス基板を載せただけでは、成膜中にガラス基板と
マスクとの間にずれが発生し、品質の良い成膜が行えな
い可能性がある。このため、液晶ガラス基板の上にさら
にマグネットを埋め込んだ押さえ板を載せ、液晶ガラス
基板を介して磁性体であるマスクを吸引・固定するマス
ク組立体とすることが考えられる。そして、このような
マスク組立体を成膜材料源上方で一定速度で搬送するこ
とにより、マスクから露出した基板部分に所望の成膜を
行うことができる。At this time, if the liquid crystal glass substrate is simply placed on the mask, a gap occurs between the glass substrate and the mask during the film formation, and high quality film formation cannot be performed. There is. Therefore, it is conceivable to provide a mask assembly in which a holding plate in which a magnet is embedded is further mounted on the liquid crystal glass substrate, and a magnetic mask is sucked and fixed through the liquid crystal glass substrate. Then, by carrying such a mask assembly at a constant speed above the film-forming material source, a desired film can be formed on the substrate portion exposed from the mask.
【0004】しかし、マスク上に位置決めして配置され
た液晶ガラス基板の上にホルダをそのまま載せようとす
ると、マグネットの磁力によりマスク及び液晶ガラス基
板がホルダに吸引されて浮き上がり、マスクと液晶ガラ
ス基板とを精度良く位置決めしたままで保持することが
できない。このため、マスクホルダを液晶ガラス基板上
へ載せる場合は、ガラス基板を押さえておく必要があ
る。この作業を手作業で行うことも可能ではあるが、作
業性が悪く十分な精度が得られない。However, if the holder is to be placed on the liquid crystal glass substrate positioned on the mask, the mask and the liquid crystal glass substrate are attracted to the holder by the magnetic force of the magnet and float up, and the mask and the liquid crystal glass substrate are lifted. Cannot be held while being accurately positioned. Therefore, when placing the mask holder on the liquid crystal glass substrate, it is necessary to hold down the glass substrate. Although this work can be performed manually, workability is poor and sufficient accuracy cannot be obtained.
【0005】そこで、本発明は、上記のようなマスク組
立体を簡易かつ精度良く組み立てるための方法を提供す
ることを目的とする。Accordingly, an object of the present invention is to provide a method for assembling the above mask assembly simply and accurately.
【0006】また、本発明は、上記マスク組立体を簡易
かつ精度良く組み立てる際に用いる組立装置を提供する
ことを目的とする。Another object of the present invention is to provide an assembling apparatus used for assembling the mask assembly simply and accurately.
【0007】[0007]
【課題を解決するための手段】上記課題を解決するた
め、本発明に係るマスク組立体の組立方法は、成膜の対
象となる基板と、この基板の成膜面を部分的に支持し遮
蔽するマスクと、このマスクとの間の吸引力によって基
板を裏面側から前記マスクに押し付けるホルダとを備え
るマスク組立体の組立方法であって、前記マスク上に成
膜面を下側にして位置決めして載置された基板の上方
に、ホルダをマスクから離間させた状態で保持する第1
工程と、マスク上の基板の裏面をホルダに設けた複数の
開口にそれぞれ挿通させた複数の押付ピンによって押圧
することによって、この基板をマスクに対して付勢して
位置ずれを防止する第2工程と、複数の押付ピンによっ
て基板をマスクに対して付勢している状態で、ホルダを
基板へ近接させて吸引力によってこの基板に押し付けさ
せる第3工程とを備える。In order to solve the above-mentioned problems, a method of assembling a mask assembly according to the present invention comprises a substrate to be formed and a film-forming surface of the substrate which is partially supported and shielded. And a holder for pressing a substrate against the mask from the back side by a suction force between the mask and the holder, wherein the positioning is performed with the film-forming surface on the mask facing down. Holding the holder above the substrate on which the holder has been separated from the mask
A second step of pressing the substrate against the mask by pressing the back surface of the substrate on the mask with a plurality of pressing pins respectively inserted through a plurality of openings provided in the holder, thereby preventing displacement. And a third step of bringing the holder close to the substrate and pressing the holder against the substrate with a suction force while the substrate is being urged against the mask by the plurality of pressing pins.
【0008】ここで、マスク上の基板の裏面を押圧する
複数の押付ピンは、空圧シリンダによって駆動すること
が望ましい。これにより、ホルダを基板に近接させる際
に、押付ピンを後退させることとなっても、押付ピンに
よる基板の裏面への押圧力を一定に保つことができる。Here, it is desirable that the plurality of pressing pins for pressing the back surface of the substrate on the mask be driven by a pneumatic cylinder. Accordingly, even when the pressing pins are retracted when the holder is brought close to the substrate, the pressing force of the pressing pins against the back surface of the substrate can be kept constant.
【0009】上記組立方法では、第2工程で、マスク上
の基板の裏面をホルダに設けた複数の開口にそれぞれ挿
通させた複数の押付ピンによって押圧することによっ
て、この基板をマスクに対して付勢して位置ずれを防止
するので、第3工程でホルダを基板へ近接させて吸引力
によってこの基板に押し付けさせる際に、マスクと基板
との間に位置ずれが発生せず、簡易な作業によって位置
ずれのないマスク組立体を得ることができる。In the above assembling method, in a second step, the back surface of the substrate on the mask is pressed by a plurality of pressing pins inserted through a plurality of openings provided in the holder, thereby attaching the substrate to the mask. When the holder is brought close to the substrate and pressed against the substrate by the suction force in the third step, no positional deviation occurs between the mask and the substrate. A mask assembly with no displacement can be obtained.
【0010】また、本発明に係る組立装置は、基板の成
膜面を部分的に支持し遮蔽するためのマスクとの間の吸
引力によって基板を裏面側からマスクに押し付け可能な
ホルダを、マスクから離間させた状態で保持するホルダ
保持手段と、ホルダに設けた複数の開口にそれぞれ挿通
されるとともに、マスク上に位置決めされた基板の裏面
に当接可能な複数の押付ピンと、複数の押付ピンを基板
の裏面に押圧してこの基板をマスクに対して付勢するこ
とによって基板及びマスクの位置ずれを防止することが
できるピン駆動手段とを備える。Further, the assembling apparatus according to the present invention comprises a holder capable of pressing the substrate against the mask from the back side by a suction force between the mask and the mask for partially supporting and shielding the film-forming surface of the substrate. Holder holding means for holding in a state of being separated from the plurality of pressing pins, a plurality of pressing pins which are inserted through a plurality of openings provided in the holder and which can abut on the back surface of the substrate positioned on the mask, and a plurality of pressing pins And pin driving means for pressing the substrate against the back surface of the substrate to urge the substrate against the mask, thereby preventing displacement of the substrate and the mask.
【0011】上記組立装置では、ホルダをホルダ保持手
段によってマスクから離間させた状態で、マスク上に位
置合わせされた基板の裏面を複数の押付ピンによって押
圧することによって、この基板をマスクに対して付勢し
て基板及びマスクの位置ずれを防止することができるの
で、ホルダの保持を解除してホルダを基板へ近接させて
吸引力によってこの基板に押し付けさせる際にも、マス
クと基板との間に位置ずれが発生せず、簡易な作業によ
ってマスク組立体を精密に組み立てることができる。In the above assembling apparatus, the back surface of the substrate positioned on the mask is pressed by a plurality of pressing pins in a state where the holder is separated from the mask by the holder holding means. When the holder is released, the holder is brought close to the substrate, and the holder is pressed against the substrate by a suction force, the bias between the mask and the substrate can be prevented. The mask assembly can be accurately assembled by a simple operation without causing any positional deviation.
【0012】[0012]
【発明の実施の形態】以下、本発明に係るマスク組立体
の組立方法及び組立装置の実施形態を図面を参照しつつ
具体的に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a method and an apparatus for assembling a mask assembly according to the present invention will be specifically described below with reference to the drawings.
【0013】図1は、マスク組立体を用いてマスク成膜
を行う成膜装置の構造を説明する図である。この成膜装
置は、成膜室である真空容器10と、真空容器10中に
プラズマビームPBを供給するプラズマ源であるプラズ
マガン30と、真空容器10内の底部に配置されてプラ
ズマビームPBが入射する陽極部材50と、真空容器1
0上部に配置されてマスク組立体MAを陽極部材50の
上方で移動させる搬送機構70と、真空容器10内を所
定の真空度及び雰囲気に調整する真空排気装置等からな
る雰囲気調整装置90とを備える。FIG. 1 is a view for explaining the structure of a film forming apparatus for forming a mask using a mask assembly. The film forming apparatus includes a vacuum chamber 10 serving as a film forming chamber, a plasma gun 30 serving as a plasma source for supplying a plasma beam PB into the vacuum chamber 10, and a plasma beam PB disposed at the bottom in the vacuum chamber 10. The incident anode member 50 and the vacuum vessel 1
A transport mechanism 70 arranged above the anode member 50 to move the mask assembly MA above the anode member 50, and an atmosphere adjusting device 90 such as a vacuum exhaust device for adjusting the inside of the vacuum vessel 10 to a predetermined degree of vacuum and atmosphere. Prepare.
【0014】ここで、プラズマガン30は、プラズマビ
ームPBを発生する圧力勾配型のプラズマガンであり、
プラズマガン30と真空容器10との間には、プラズマ
ビームPBを真空容器10まで導く中間電極41、4
2、ステアリングコイル44等が配置されている。ま
た、陽極部材50は、プラズマガン30からのプラズマ
ビームPBを下方に導くとともに蒸発材料を収容するハ
ース本体53を有するハース51と、その周囲に配置さ
れた環状の補助陽極52とからなる。搬送機構70は、
搬送路71内に水平方向に等間隔で配列された複数のコ
ロ72と、これらのコロ72を適当な速度で回転させて
マスク組立体MAを一定速度で移動させる駆動装置(図
示を省略)とを備える。Here, the plasma gun 30 is a pressure gradient type plasma gun for generating a plasma beam PB.
Between the plasma gun 30 and the vacuum vessel 10, intermediate electrodes 41 and 4 for guiding the plasma beam PB to the vacuum vessel 10 are provided.
2. The steering coil 44 and the like are arranged. The anode member 50 includes a hearth 51 having a hearth body 53 that guides the plasma beam PB from the plasma gun 30 downward and contains an evaporating material, and an annular auxiliary anode 52 disposed around the hearth 51. The transport mechanism 70
A plurality of rollers 72 arranged at equal intervals in the horizontal direction in the transport path 71, and a driving device (not shown) for rotating these rollers 72 at an appropriate speed to move the mask assembly MA at a constant speed. Is provided.
【0015】この成膜装置においては、プラズマガン3
0の陰極31と真空容器10内のハース51との間で放
電が生じ、これによりプラズマビームPBが生成され
る。このプラズマビームPBは、ステアリングコイル4
4や補助陽極52内の永久磁石等により決定される磁界
に案内されてハース51に到達する。ハース本体53に
収納された例えばITO(インジウム錫酸化物)等の蒸
発材料は、プラズマビームPBにより加熱されて蒸発す
る。この蒸発粒子は、プラズマビームPBによりイオン
化され、搬送機構70によって一定速度で移動するマス
ク組立体MAの下面に露出する液晶ガラス基板の表面に
付着し、ここにITO(インジウム錫酸化物)等の被膜
が形成される。In this film forming apparatus, the plasma gun 3
Discharge occurs between the 0 cathode 31 and the hearth 51 in the vacuum vessel 10, thereby generating a plasma beam PB. This plasma beam PB is applied to the steering coil 4
4 and a magnetic field determined by a permanent magnet or the like in the auxiliary anode 52 to reach the hearth 51. The evaporation material such as ITO (indium tin oxide) stored in the hearth body 53 is heated and evaporated by the plasma beam PB. These vaporized particles are ionized by the plasma beam PB and adhere to the surface of the liquid crystal glass substrate exposed on the lower surface of the mask assembly MA that moves at a constant speed by the transport mechanism 70, where it is made of ITO (indium tin oxide) or the like. A coating is formed.
【0016】図2は、マスク組立体MAの構造を説明す
る分解斜視図である。マスク組立体MAは、成膜の対象
となる液晶ガラス基板Wを、マスクMとホルダHとで挟
んだ構造になっている。FIG. 2 is an exploded perspective view illustrating the structure of the mask assembly MA. The mask assembly MA has a structure in which a liquid crystal glass substrate W to be formed into a film is sandwiched between a mask M and a holder H.
【0017】液晶ガラス基板Wは、矩形の薄板であり、
成膜面WaがマスクMに対向し、裏面WbがホルダHに
対向する。マスクMは、一対の開口を有するフレーム状
の薄板であり、磁性体で形成されている。ホルダHは、
マスクMと同様の外形を有するが、ある程度の厚みがあ
り、マスクMを吸引するマグネットを内蔵する。なお、
ホルダHには、後に説明する組立装置の押付ピンを挿通
させるため、多数の開口Haが等間隔で形成されてい
る。The liquid crystal glass substrate W is a rectangular thin plate,
The film formation surface Wa faces the mask M, and the back surface Wb faces the holder H. The mask M is a frame-shaped thin plate having a pair of openings, and is formed of a magnetic material. Holder H is
It has the same outer shape as the mask M, but has a certain thickness, and incorporates a magnet for attracting the mask M. In addition,
A large number of openings Ha are formed in the holder H at equal intervals in order to allow a pressing pin of an assembly device described later to pass therethrough.
【0018】マスクMは、成膜に際して液晶ガラス基板
Wの成膜面Waを部分的に支持し遮蔽する。ホルダH
は、マスクMとの間の磁気吸引力によって液晶ガラス基
板Wをその裏面Wb側からマスクMに押し付ける。これ
により、マスクMと液晶ガラス基板Wとをアライメント
した状態で保持することができる。The mask M partially supports and shields the film formation surface Wa of the liquid crystal glass substrate W during film formation. Holder H
Presses the liquid crystal glass substrate W against the mask M from the back surface Wb side by the magnetic attraction force between the substrate and the mask M. Thereby, the mask M and the liquid crystal glass substrate W can be held in an aligned state.
【0019】図3は、マスク組立体MAの組立装置の構
造を説明する図である。この組立装置は、保持したホル
ダHを液晶ガラス基板Wを載せたマスクM上にセットす
るための組立用ハンド100と、組立用ハンド100を
目的の場所に搬送する搬送ロボットである搬送装置20
0と、組立用ハンド100の位置を検出して搬送装置2
00にフィードバックする位置センサ300と、組立用
ハンド100に設けた後述する吸着パッドや空圧シリン
ダ等を適当なタイミングで動作させる吸排気装置400
とを備える。なお、搬送装置200、位置センサ30
0、及び吸排気装置400は、図示を省略するコンピュ
ータによってその動作が統括的に制御される。FIG. 3 is a view for explaining the structure of an assembling apparatus for the mask assembly MA. The assembling apparatus includes an assembling hand 100 for setting a holder H held on a mask M on which a liquid crystal glass substrate W is placed, and a transfer device 20 as a transfer robot for transferring the assembling hand 100 to a target location.
0 and the position of the assembling hand 100, and
00 and a suction / exhaust device 400 for operating a suction pad, a pneumatic cylinder, and the like, which will be described later, provided on the assembly hand 100 at appropriate timing.
And The transfer device 200 and the position sensor 30
0 and the operation of the intake / exhaust device 400 are totally controlled by a computer not shown.
【0020】組立用ハンド100は、ハンド本体2の下
部に等間隔で取り付けられ下方に延びる多数の吸着部材
3と、ハンド本体2に近接したりこれから離間する可動
部材4と、可動部材4の下面に等間隔で取り付けられ下
方に延びる多数の押付ピン5と、可動部材4を昇降移動
させる空圧シリンダ6とを備える。The assembling hand 100 includes a plurality of suction members 3 attached to a lower portion of the hand main body 2 at equal intervals and extending downward, a movable member 4 approaching to or separated from the hand main body 2, and a lower surface of the movable member 4. A plurality of pressing pins 5 attached at equal intervals and extending downward, and a pneumatic cylinder 6 for moving the movable member 4 up and down.
【0021】吸着部材3はホルダ保持手段であり、各吸
着部材3は先端に吸着パッド3aを有する。各吸着パッ
ド3aは、吸排気装置400により負圧を形成すること
によって、図2に示すマスク組立体MAのホルダHの上
面の適所を吸着することができる。可動部材4は、ハン
ド本体2に設けた開口2aに通されているガイド棒4a
を有し、ハンド本体2に対して滑らかに昇降する。可動
部材4には、複数の開口4dが設けてあり、これらに各
吸着部材3をそれぞれ通すことによって、可動部材4と
各吸着部材3との干渉を避ける構造になっている。可動
部材4から延びる各押付ピン5の下端は、高さが一致し
ており同一面上に配置される。このような配置の押付ピ
ン5により、後に詳細に説明するが、マスクM上に載置
された液晶ガラス基板Wを裏面から均一に押し付けるこ
とができる。空圧シリンダ6は、ピン駆動手段として連
結部材7を介して可動部材4に接続されており、押付ピ
ン5の下端が吸着パッド3aの下端よりも所定距離だけ
下側になる下端位置まで降下させることができる。The suction members 3 are holder holding means, and each suction member 3 has a suction pad 3a at the tip. Each suction pad 3a can suction a proper position on the upper surface of the holder H of the mask assembly MA shown in FIG. 2 by generating a negative pressure by the suction and exhaust device 400. The movable member 4 is provided with a guide rod 4 a that is passed through an opening 2 a provided in the hand body 2.
And moves up and down smoothly with respect to the hand body 2. The movable member 4 is provided with a plurality of openings 4d, and each of the suction members 3 is passed through the openings 4d so that interference between the movable member 4 and each of the suction members 3 is avoided. The lower ends of the pressing pins 5 extending from the movable member 4 have the same height and are arranged on the same plane. With the pressing pins 5 having such an arrangement, the liquid crystal glass substrate W placed on the mask M can be pressed uniformly from the back surface, which will be described later in detail. The pneumatic cylinder 6 is connected to the movable member 4 via a connecting member 7 as a pin driving means, and lowers the lower end of the pressing pin 5 to a lower end position that is lower than the lower end of the suction pad 3a by a predetermined distance. be able to.
【0022】図4〜6は、図3に示す組立装置を用いた
マスク組立体MAの組み立てを説明する図である。FIGS. 4 to 6 are views for explaining the assembling of the mask assembly MA using the assembling apparatus shown in FIG.
【0023】まず、組立用ハンド100において空圧シ
リンダ6に適当な圧力のガスを供給して可動部材4を下
端位置まで降下させる。さらに、搬送装置200と位置
センサ300とを利用して、組立用ハンド100を支持
ピンSP上に載置されたホルダH上方まで移動させここ
で降下させる。これにより、ホルダHの裏面に吸着パッ
ド3aを吸着させ、ホルダHを組立用ハンド100の下
部に保持することができる(図4(a)参照)。この
際、ホルダHに設けた開口Haに押付ピン5が通される
ので、ホルダHと押付ピン5との干渉が回避される。First, in the assembling hand 100, gas at an appropriate pressure is supplied to the pneumatic cylinder 6 to lower the movable member 4 to the lower end position. Further, by using the transport device 200 and the position sensor 300, the assembling hand 100 is moved to a position above the holder H placed on the support pin SP and lowered there. Thereby, the suction pad 3a can be sucked to the back surface of the holder H, and the holder H can be held at the lower part of the assembling hand 100 (see FIG. 4A). At this time, since the pressing pin 5 is passed through the opening Ha provided in the holder H, interference between the holder H and the pressing pin 5 is avoided.
【0024】次に、搬送装置200と位置センサ300
とを利用して、ホルダHを保持した組立用ハンド100
をマスクM上の液晶ガラス基板W上方に移動させる(図
4(b)参照)。ここで、マスクMと成膜面を下側にし
た液晶ガラス基板Wとは予め精密に位置決めされて配置
されている。Next, the transfer device 200 and the position sensor 300
And the assembling hand 100 holding the holder H
Is moved above the liquid crystal glass substrate W on the mask M (see FIG. 4B). Here, the mask M and the liquid crystal glass substrate W with the film-forming surface on the lower side are precisely positioned and arranged in advance.
【0025】次に、搬送装置200と位置センサ300
とを利用して、ホルダHを保持した組立用ハンド100
を適宜降下させ、押付ピン5の先端でマスクM上の液晶
ガラス基板Wを裏面側から押圧し、液晶ガラス基板Wを
マスクMに付勢して、液晶ガラス基板WとマスクMとを
相互に固定する(図5(a)参照)。この際、空圧シリ
ンダ6の内圧は適当な値に調整されているので、液晶ガ
ラス基板WをマスクMに押圧する力を適当な値に保持す
ることができる。Next, the transport device 200 and the position sensor 300
And the assembling hand 100 holding the holder H
Is appropriately lowered, and the liquid crystal glass substrate W on the mask M is pressed from the back side by the tip of the pressing pin 5 to urge the liquid crystal glass substrate W against the mask M, and the liquid crystal glass substrate W and the mask M are mutually moved. Fix (see FIG. 5A). At this time, since the internal pressure of the pneumatic cylinder 6 is adjusted to an appropriate value, the force for pressing the liquid crystal glass substrate W against the mask M can be maintained at an appropriate value.
【0026】なお、図示の状態では、ホルダHからの磁
力はマスクMに及ばない。すなわち、可動部材4が下端
位置にあるとき、押付ピン5の下端は、吸着パッド3a
の下端よりも、ホルダHの厚さとホルダHの磁場が十分
に減衰する距離とを加算した距離だけ下側になってい
る。In the illustrated state, the magnetic force from the holder H does not reach the mask M. That is, when the movable member 4 is at the lower end position, the lower end of the pressing pin 5 is
Is lower than the lower end by a distance obtained by adding the thickness of the holder H and the distance at which the magnetic field of the holder H is sufficiently attenuated.
【0027】次に、搬送装置200と位置センサ300
とを利用して、ホルダHを保持した組立用ハンド100
をさらに降下させ、ホルダHを液晶ガラス基板Wの裏面
に徐々に近接させ、ホルダHを液晶ガラス基板Wの裏面
に当接させる。(図5(b)参照)。ここで、組立用ハ
ンド100を降下させても、空圧シリンダ6が干渉部材
となって、可動部材4が上昇するので、液晶ガラス基板
WはマスクMに予め設定した一定の押圧力で固定され
る。つまり、ホルダH内のマグネットの磁力によりマス
クMがホルダHに引き付けられても、押付ピン5により
液晶ガラス基板Wを押し付けているため、マスクM及び
液晶ガラス基板Wは位置決めされたままで移動しない。
なお、押付ピン5による液晶ガラス基板Wの押付力は、
組立用ハンド100を降下させても、空圧シリンダ6の
供給圧及び受圧面積にて定まる一定値に維持される。Next, the transfer device 200 and the position sensor 300
And the assembling hand 100 holding the holder H
Is further lowered, the holder H is gradually approached to the back surface of the liquid crystal glass substrate W, and the holder H is brought into contact with the back surface of the liquid crystal glass substrate W. (See FIG. 5B). Here, even if the assembling hand 100 is lowered, the pneumatic cylinder 6 becomes an interference member and the movable member 4 rises, so that the liquid crystal glass substrate W is fixed to the mask M with a predetermined pressing force. You. That is, even when the mask M is attracted to the holder H by the magnetic force of the magnet in the holder H, the mask M and the liquid crystal glass substrate W are not moved while being positioned because the pressing pins 5 press the liquid crystal glass substrate W.
The pressing force of the pressing pin 5 on the liquid crystal glass substrate W is
Even if the assembling hand 100 is lowered, it is maintained at a constant value determined by the supply pressure and the pressure receiving area of the pneumatic cylinder 6.
【0028】次に、吸着パッド3aによる吸着を解除
し、搬送装置200と位置センサ300とを利用して組
立用ハンド100を上昇させる(図6(a)参照)。さ
らに、組立用ハンド100を上昇させ、押付ピン5の先
端がホルダH上端よりも高い位置になるようにする(図
6(b)参照)。この段階で、マスクMは、ホルダH内
のマグネットの磁力により引き付けられているため、マ
スクM、液晶ガラス基板W及びホルダHの3点は密着し
ている。Next, the suction by the suction pad 3a is released, and the assembling hand 100 is raised using the transfer device 200 and the position sensor 300 (see FIG. 6A). Further, the assembling hand 100 is raised so that the tip of the pressing pin 5 is higher than the upper end of the holder H (see FIG. 6B). At this stage, since the mask M is attracted by the magnetic force of the magnet in the holder H, the three points of the mask M, the liquid crystal glass substrate W, and the holder H are in close contact.
【0029】以上により、マスクMとホルダHとの間に
液晶ガラス基板Wを位置決めして挟むことができ、図1
の成膜装置に投入すべきマスク組立体MAを組み立てる
ことができる。As described above, the liquid crystal glass substrate W can be positioned and sandwiched between the mask M and the holder H.
The mask assembly MA to be put into the film forming apparatus can be assembled.
【0030】以上実施形態に即してこの発明を説明した
が、この発明は上記実施形態に限定されるものではな
い。例えば、上記マスク組立体MAは、図1のようなデ
ポアップ形のマスク成膜ラインだけでなく、材料源が上
側でマスク組立体MAが下側となるようなデポダウン形
のマスク成膜ラインでも用いることができる。Although the present invention has been described with reference to the embodiment, the present invention is not limited to the above embodiment. For example, the mask assembly MA is used not only in a deposition film formation line of a depot-up type as shown in FIG. 1 but also in a deposition film line of a deposition-down type in which the material source is on the upper side and the mask assembly MA is on the lower side. be able to.
【0031】また、上記マスク組立体MAを用いて成膜
する材料もITO等の透明導電膜材料に限らず、金属
膜、誘電体膜、絶縁膜等の各種のものとすることができ
る。The material to be formed by using the mask assembly MA is not limited to a transparent conductive film material such as ITO, but may be various materials such as a metal film, a dielectric film, and an insulating film.
【0032】[0032]
【発明の効果】以上の説明から明らかなように、本発明
に係るマスク組立体の組立方法によれば、第2工程で、
マスク上の基板の裏面をホルダに設けた複数の開口にそ
れぞれ挿通させた複数の押付ピンによって押圧すること
によって、この基板をマスクに対して付勢して位置ずれ
を防止するので、第3工程で前記ホルダを前記基板へ近
接させて前記吸引力によって当該基板に押し付けさせる
際に、マスクと基板との間に位置ずれが発生せず、簡易
な作業によって位置ずれの発生を防止できる。As is apparent from the above description, according to the method for assembling a mask assembly according to the present invention, in the second step,
By pressing the back surface of the substrate on the mask with a plurality of pressing pins respectively inserted through a plurality of openings provided in the holder, the substrate is urged against the mask to prevent positional displacement. When the holder is brought close to the substrate and pressed against the substrate by the suction force, no displacement occurs between the mask and the substrate, and the displacement can be prevented by a simple operation.
【0033】また、本発明に係る組立装置によれば、上
記組立装置では、ホルダをホルダ保持手段によってマス
クから離間させた状態で、マスク上に位置合わせされた
基板の裏面を複数の押付ピンによって押圧することによ
って、この基板をマスクに対して付勢して位置ずれを防
止することができるので、ホルダの保持を解除してホル
ダを基板へ近接させて吸引力によってこの基板に押し付
けさせる際にも、マスクと基板との間に位置ずれが発生
せず、簡易な作業によってマスク組立体を精密に組み立
てることができる。Further, according to the assembling apparatus according to the present invention, in the assembling apparatus, the back surface of the substrate positioned on the mask is held by the plurality of pressing pins while the holder is separated from the mask by the holder holding means. By pressing, this substrate can be urged against the mask to prevent displacement, so when holding the holder is released and the holder is brought close to the substrate and pressed against this substrate by suction force Also, no displacement occurs between the mask and the substrate, and the mask assembly can be accurately assembled by a simple operation.
【図1】マスク組立体を用いてマスク成膜を行う成膜装
置の構造図である。FIG. 1 is a structural diagram of a film forming apparatus that performs mask film formation using a mask assembly.
【図2】マスク組立体の構造を説明する分解斜視図であ
る。FIG. 2 is an exploded perspective view illustrating the structure of a mask assembly.
【図3】マスク組立体の組立装置の構造を説明する図で
ある。FIG. 3 is a diagram illustrating the structure of a mask assembly assembling apparatus.
【図4】(a)、(b)は、図3の装置を用いたマスク
組立体の組み立て工程を説明する図である。FIGS. 4A and 4B are diagrams illustrating a process of assembling a mask assembly using the apparatus of FIG. 3;
【図5】(a)、(b)は、図3の装置を用いたマスク
組立体の組み立て工程を説明する図である。5 (a) and 5 (b) are diagrams illustrating a process of assembling a mask assembly using the apparatus of FIG.
【図6】(a)、(b)は、図3の装置を用いたマスク
組立体の組み立て工程を説明する図である。FIGS. 6A and 6B are diagrams illustrating an assembly process of a mask assembly using the apparatus of FIG. 3;
2 ハンド本体 3 吸着部材 3a 吸着パッド 4 可動部材 5 押付ピン 6 空圧シリンダ 10 真空容器 30 プラズマガン 50 陽極部材 51 ハース 70 搬送機構 71 搬送路 72 コロ 100 組立用ハンド 200 搬送装置 300 位置センサ 400 吸排気装置 H ホルダ M マスク MA マスク組立体 PB プラズマビーム W 液晶ガラス基板 2 Hand body 3 Suction member 3a Suction pad 4 Movable member 5 Pressing pin 6 Pneumatic cylinder 10 Vacuum container 30 Plasma gun 50 Anode member 51 Hearth 70 Transport mechanism 71 Transport path 72 Roller 100 Assembly hand 200 Transport device 300 Position sensor 400 Exhaust device H Holder M Mask MA Mask assembly PB Plasma beam W Liquid crystal glass substrate
Claims (2)
膜面を部分的に支持し遮蔽するマスクと、当該マスクと
の間の吸引力によって基板を裏面側から前記マスクに押
し付けるホルダとを備えるマスク組立体の組立方法であ
って、 前記マスク上に成膜面を下側にして位置決めして載置さ
れた前記基板の上方に、前記ホルダを前記マスクから離
間させた状態で保持する第1工程と、 前記マスク上の前記基板の裏面を前記ホルダに設けた複
数の開口にそれぞれ挿通させた複数の押し付けピンによ
って押圧することによって、当該基板をマスクに対して
付勢して位置ずれを防止する第2工程と、 前記複数の押付ピンによって前記基板を前記マスクに対
して付勢している状態で、前記ホルダを前記基板へ近接
させて前記吸引力によって当該基板に押し付けさせる第
3工程とを備えるマスク組立体の組立方法。1. A substrate on which a film is to be formed, a mask that partially supports and shields a film formation surface of the substrate, and a holder that presses the substrate against the mask from a back surface side by a suction force between the mask and the mask. A method of assembling a mask assembly, comprising: holding the holder above the mask, the holder being separated from the mask, above the substrate positioned and placed with the film-forming surface facing down. A first step of: pressing the back surface of the substrate on the mask by a plurality of pressing pins respectively inserted through a plurality of openings provided in the holder, thereby urging the substrate with respect to the mask; A second step of preventing displacement, and in a state where the substrate is urged against the mask by the plurality of pressing pins, the holder is brought close to the substrate and pressed against the substrate by the suction force. And a third step of attaching the mask assembly.
ためのマスクとの間の吸引力によって前記基板を裏面側
から前記マスクに押し付け可能なホルダを、前記マスク
から離間させた状態で保持するホルダ保持手段と、 前記ホルダに設けた複数の開口にそれぞれ挿通されると
ともに、前記マスク上に位置決めされた前記基板の裏面
に当接可能な複数の押付ピンと、 前記複数の押付ピンを前記基板の裏面に押圧して当該基
板を前記マスクに対して付勢することによって前記基板
及び前記マスクの位置ずれを防止することができるピン
駆動手段とを備える組立装置。2. A state in which a holder capable of pressing the substrate against the mask from the back surface side by a suction force between the mask and a mask for partially supporting and shielding the deposition surface of the substrate is separated from the mask. A plurality of pressing pins that are respectively inserted through a plurality of openings provided in the holder and that can contact the back surface of the substrate positioned on the mask, and a plurality of pressing pins. An assembling apparatus comprising: a pin driving unit capable of preventing a positional shift between the substrate and the mask by pressing the substrate against the mask by pressing against the back surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000169317A JP3971884B2 (en) | 2000-06-06 | 2000-06-06 | Method and apparatus for assembling mask assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000169317A JP3971884B2 (en) | 2000-06-06 | 2000-06-06 | Method and apparatus for assembling mask assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001348664A true JP2001348664A (en) | 2001-12-18 |
| JP3971884B2 JP3971884B2 (en) | 2007-09-05 |
Family
ID=18672196
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000169317A Expired - Fee Related JP3971884B2 (en) | 2000-06-06 | 2000-06-06 | Method and apparatus for assembling mask assembly |
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| Country | Link |
|---|---|
| JP (1) | JP3971884B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007217767A (en) * | 2006-02-17 | 2007-08-30 | Sumitomo Heavy Ind Ltd | Substrate holder and method for treating substrate holder |
| WO2009090839A1 (en) * | 2008-01-16 | 2009-07-23 | Tokki Corporation | Film-forming apparatus |
-
2000
- 2000-06-06 JP JP2000169317A patent/JP3971884B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007217767A (en) * | 2006-02-17 | 2007-08-30 | Sumitomo Heavy Ind Ltd | Substrate holder and method for treating substrate holder |
| WO2009090839A1 (en) * | 2008-01-16 | 2009-07-23 | Tokki Corporation | Film-forming apparatus |
| US8359999B2 (en) | 2008-01-16 | 2013-01-29 | Tokki Corporation | Film forming device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3971884B2 (en) | 2007-09-05 |
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