JP2001347391A - Low-cost gas supply system for purging - Google Patents
Low-cost gas supply system for purgingInfo
- Publication number
- JP2001347391A JP2001347391A JP2000169016A JP2000169016A JP2001347391A JP 2001347391 A JP2001347391 A JP 2001347391A JP 2000169016 A JP2000169016 A JP 2000169016A JP 2000169016 A JP2000169016 A JP 2000169016A JP 2001347391 A JP2001347391 A JP 2001347391A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- gas supply
- purging
- amount
- purge gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010926 purge Methods 0.000 title claims abstract description 66
- 230000008602 contraction Effects 0.000 claims abstract description 15
- 230000003287 optical effect Effects 0.000 claims abstract description 9
- 238000007599 discharging Methods 0.000 claims abstract 3
- 238000001514 detection method Methods 0.000 claims description 11
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 84
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【0001】[0001]
【従来の技術】従来、レーザー加工機の加工操作時に光
路内にパージ用ガスを流し、加工操作の安定化を目的と
する技術がある。即ち、光路内の清浄化、レーザービー
ムの安定化、更には外気からの塵埃や湿気等の侵入を防
止する為、清浄空気やCO2等の不活性ガスを供給する
ものである。2. Description of the Related Art Conventionally, there is a technique for stabilizing a processing operation by flowing a purge gas into an optical path during a processing operation of a laser processing machine. That is, an inert gas such as clean air or CO 2 is supplied in order to clean the inside of the optical path, stabilize the laser beam, and prevent intrusion of dust and moisture from the outside air.
【0002】例えば、パージ用ガス供給装置により、3
00l/minのパージ用ガスを光軸内に常に流し込ん
でいる事例がある。For example, a purging gas supply device
There is a case where a purge gas of 00 l / min is always flowing into the optical axis.
【0003】[0003]
【発明が解決しようとする課題】然しながら上述の従来
例のように、フロントオープン型(別称、フライングオ
プティクス型)レーザー加工機の場合、供給されたパー
ジ用ガスがX軸及びY軸の蛇腹状伸縮管の伸縮動作によ
りフィルターを有するガス排出口から排出されてしま
い、例えば、軸の伸縮速度が80m/minでは、約2
秒間で蛇腹が縮み、パージ用ガスが排出されてしまい、
この結果、パージ用ガス排出後、供給装置からのガス
供給が不十分となり(排出量=42l/2sec、供給
量=10l/2secとなり、32l/2secの不
足)、32l分の外気(O2)をフィルター部から吸
引してしまう(ふいご効果)。パージ用ガス濃度の低
下が生ずる。加工操作(切断等の)の不安定化、品質
不良の発生。パージ用ガスの供給量を4倍にする為ガ
ス供給装置を大型化しなければならない。カウンター
蛇腹を設けるとなるとX+Yの蛇腹分の容積が必要で、
スペースを大きく占有することとなり、設備費用やラン
ニングコストが大となり、これらがネックとなるという
課題が有る。However, in the case of a front open type (also called a flying optics type) laser beam machine, as in the above-mentioned conventional example, the supplied purge gas is caused to have a bellows-like expansion and contraction along the X-axis and the Y-axis. The gas is discharged from the gas outlet having the filter by the expansion and contraction operation of the pipe. For example, when the expansion and contraction speed of the shaft is 80 m / min, about 2 m
Within seconds, the bellows shrinks and purge gas is discharged,
As a result, after the purging gas is discharged, the gas supply from the supply device becomes insufficient (discharge amount = 42 l / 2 sec, supply amount = 10 l / 2 sec, and 32 l / 2 sec shortage), and 32 l of outside air (O 2 ) Is sucked from the filter (bellows effect). The concentration of the purge gas is reduced. Instability of processing operations (such as cutting) and occurrence of poor quality. In order to quadruple the supply amount of the purge gas, the gas supply device must be increased in size. If you have a counter bellows, you need a volume of X + Y bellows,
A large space is occupied, and equipment costs and running costs are increased, which causes a problem that these become bottlenecks.
【0004】この発明は、上述の事情に鑑みて成された
もので、パージ用ガスの安定供給、切断等の加工操作の
安定化、延いては品質の向上が図れ、且つ低価格で実現
可能とするローコスト型パージ用ガス供給システムを提
供することを目的とする。[0004] The present invention has been made in view of the above circumstances, and can achieve a stable supply of a purge gas, stabilize processing operations such as cutting, and further improve quality, and can be realized at a low price. It is an object of the present invention to provide a low-cost purge gas supply system.
【0005】[0005]
【課題を解決するための手段】この発明は、下記構成を
備えることにより上記課題を解決できるものである。The present invention can solve the above-mentioned problems by providing the following constitution.
【0006】(1)NC装置を有するレーザー加工機等
の加工操作時におけるパージ用ガス供給システムであっ
て、レーザー光のX軸及びY軸光路を保護する蛇腹状の
伸縮管からなる管路をパージ用ガス供給装置に流量調整
弁を介して接続し、且つ前記管路の同一系統内にバッフ
ァータンク及びガス排出口を設け、伸縮管の伸縮ストロ
ーク量に応じてパージ用ガスの供給量を調整制御するガ
ス供給量調整制御手段を備え、前記バッファータンク内
にガス残量検知手段を取り付け、前記ガス残量検知手段
の検知結果に基づいて前記パージ用ガス供給装置のON
/OFF制御を行い、またX軸及びY軸のストローク量
をパージ用ガスの消費量に変換し、この変換した値に応
じて前記流量調整弁の開口量を指令制御し、更に前記ガ
ス排出口からのガス排出量の多少に応じて、前記パージ
用ガス供給装置のON/OFF制御を行うように構成し
たことを特徴とするローコスト型パージ用ガス供給シス
テム。(1) A purging gas supply system at the time of a processing operation of a laser processing machine or the like having an NC device, wherein a pipe formed of a bellows-like telescopic tube for protecting the X-axis and Y-axis optical paths of laser light is provided. It is connected to the purging gas supply device via a flow control valve, and a buffer tank and a gas outlet are provided in the same system of the pipe line, and the supply amount of the purging gas is adjusted according to the amount of expansion / contraction stroke of the expansion / contraction tube. A gas supply amount adjustment control unit for controlling the gas supply amount, a gas remaining amount detection unit is mounted in the buffer tank, and the purging gas supply device is turned on based on a detection result of the gas remaining amount detection unit.
/ OFF control, converts the stroke amounts of the X-axis and the Y-axis into the consumption amount of the purge gas, controls the opening amount of the flow control valve according to the converted value, and further controls the gas discharge port. A low-cost purge gas supply system characterized in that the on / off control of the purge gas supply device is performed in accordance with the amount of gas discharged from the gas supply system.
【0007】(2)前記バッファータンクは、合成樹脂
等の柔軟性のある袋体を筐体内に収納し、前記蛇腹状の
伸縮管の伸縮動作に連動して前記袋体がパージ用ガスを
吸引・吐出自在な構造とすると共に、前記ガス残量検知
手段が前記袋体の膨張・収縮動作に応じて機能するよう
に構成して成ることを特徴とする前項(1)記載のロー
コスト型パージ用ガス供給システム。(2) The buffer tank accommodates a flexible bag made of synthetic resin or the like in a housing, and the bag sucks a purging gas in conjunction with the expansion and contraction of the bellows-shaped expansion and contraction tube. The low cost purging described in the above item (1), characterized in that the gas remaining amount detecting means is configured to function in accordance with the inflation / deflation operation of the bag body, in addition to having a dischargeable structure. Gas supply system.
【0008】(3)前記ガス供給量調整制御手段は、前
記流量調整弁の開口量を指令制御する制御手段であるこ
とを特徴とする前項(1)記載のローコスト型パージ用
ガス供給システム。(3) The low-cost purge gas supply system according to (1), wherein the gas supply amount adjustment control means is a control means for command-controlling the opening amount of the flow rate control valve.
【0009】[0009]
【発明の実施の形態】以下にこの発明の一実施の形態を
説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below.
【0010】図1は、本発明に係るローコスト型パージ
用ガス供給システムの構成を示す説明図、図2は、同バ
ッファータンク取り付け図、図3は、同ローコスト型パ
ージ用ガス供給システムの制御動作例を示すフローチャ
ート、図4は、レーザー光路内のパージ系統図(従来
例)である。FIG. 1 is an explanatory view showing the configuration of a low-cost type purge gas supply system according to the present invention, FIG. 2 is a view showing the installation of the buffer tank, and FIG. 3 is a control operation of the low-cost type purge gas supply system. FIG. 4 is a flowchart showing an example, and FIG. 4 is a diagram of a purge system in a laser beam path (conventional example).
【0011】以下図面を参照して説明する。A description will be given below with reference to the drawings.
【0012】NC装置を有するレーザー加工機等の加工
操作時におけるパージ用ガス供給システムであって、レ
ーザー光のX軸及びY軸光路を保護する蛇腹状の伸縮管
からなる管路1をパージ用ガス供給装置2に流量調整弁
3を介して接続し、且つ前記管路1と同一系統内にバッ
ファータンクBT及びガス排出口6を設け、伸縮管の伸
縮ストローク量Xst及びYstに応じてパージ用ガスの供
給量を調整制御するガス供給量調整制御手段を備え、更
に、前記バッファータンクBT内にガス残量検知手段5
を取り付け、前記ガス残量検知手段5の検知結果に基づ
いて前記パージ用ガス供給装置2のON/OFF制御を
行い、またX軸及びY軸のストローク量Xst及びYstを
パージ用ガスの消費量に変換し、この変換した値に応じ
て前記流量調整弁3の開口量を指令制御し、更に前記ガ
ス排出口6からのガス排出量の多少に応じて、前記パー
ジ用ガス供給装置2のON/OFF制御を行うように構
成してある。A purging gas supply system during a processing operation of a laser processing machine or the like having an NC device, which purges a pipe line 1 consisting of a bellows-shaped telescopic tube for protecting the X-axis and Y-axis optical paths of laser light. It is connected to a gas supply device 2 via a flow control valve 3 and a buffer tank BT and a gas discharge port 6 are provided in the same system as the pipe line 1, for purging according to the expansion and contraction stroke amounts Xst and Yst of the expansion and contraction tube. A gas supply amount adjustment control means for adjusting and controlling the gas supply amount; and a gas remaining amount detection means 5 in the buffer tank BT.
And controls the on / off control of the purging gas supply device 2 based on the detection result of the gas remaining amount detecting means 5, and determines the stroke amounts Xst and Yst of the X-axis and the Y-axis by the consumption amount of the purging gas. The opening amount of the flow control valve 3 is command-controlled in accordance with the converted value, and the purge gas supply device 2 is turned on in accordance with the amount of gas discharged from the gas outlet 6. / OFF control is performed.
【0013】前記バッファータンクBTは、合成樹脂等
の柔軟性のある袋体4aを筐体4内に収納し、前記蛇腹
状の伸縮管の伸縮動作に連動して前記袋体4がパージ用
ガスを吸引・吐出自在な構造とすると共に、前記ガス残
量検知手段(ガス残量検知センサ)5が前記袋体4の膨
張・収縮動作に応じて機能する構成となっている。In the buffer tank BT, a flexible bag 4a made of synthetic resin or the like is housed in a housing 4, and the bag 4 is purged with a purging gas in conjunction with the expansion and contraction of the bellows-shaped expansion and contraction tube. And the gas remaining amount detecting means (gas remaining amount detecting sensor) 5 functions according to the inflation / deflation operation of the bag body 4.
【0014】更に、前記ガス供給量調整制御手段は、前
記流量調整弁3の開口量を指令制御する制御手段であ
る。尚、上述の制御手段は、全てNC装置内に搭載され
ているものとする。Further, the gas supply amount adjustment control means is a control means for command-controlling the opening amount of the flow rate adjustment valve 3. It is assumed that all of the above control means are mounted in the NC device.
【0015】上述の構成及び図3のフローチャートに基
づいて動作を説明する。The operation will be described based on the above configuration and the flowchart of FIG.
【0016】装置のSWがONされて、レーザー加工操
作がスタートすると、ステップS1でパージ用ガス供給
装置2から所定の種類のパージ用ガスが供給を開始し、
ステップS2で、流量調整弁3が作動して、次のステッ
プS3で、バッファータンクBT内へパージ用ガスをス
トックし、ステップS4で、前記バッファータンクBT
内のガス・ストック量は所定量をオーバーしたかを、ガ
ス残量検知センサ5で判別し、YESとなってオーバー
であれば、NC装置を通してOFF指令が出され、ステ
ップS1へ戻って、パージ用ガス供給装置が停止する。When the switch of the apparatus is turned on and the laser processing operation is started, a predetermined type of purge gas is started to be supplied from the purge gas supply apparatus 2 in step S1,
In step S2, the flow control valve 3 is operated, and in the next step S3, the purging gas is stored in the buffer tank BT. In step S4, the buffer tank BT is stored.
It is determined by the gas remaining amount detection sensor 5 whether the gas stock amount in the gas exceeds a predetermined amount. If the result is YES and the gas stock amount is over, an OFF command is issued through the NC device, and the process returns to step S1 to purge Gas supply device stops.
【0017】一方、ステップS4で、NOと判別された
場合、ステップS5へ進み、X及びY光軸内へパージ用
ガスを供給・吸引する状態となるが、ステップS6で、
X軸及びY軸のストローク量Xst及びYstをNC装置
で、例えば、単位時間1時間当たりのストローク量Xst
及びYstをモニタリングし、このストローク量Xst及び
Ystをガス消費量に変換演算し、この結果に基づいてガ
ス供給量を、ステップS2に戻って流量調整弁3により
調整する。ステップS7で、ガス排出口6の自動開閉操
作、例えば、30分毎に前記ガス排出口6の開口部を全
開にすることにより、光路内の古いパージ用ガスを排出
し、新しいパージ用ガスを供給して更新する。次のステ
ップS8では、パージ用ガスの排出量は大かどうかをガ
ス残量検知センサ5で判別し、大であれば、NC装置は
ガス残量検知センサ5からの信号に応じてパージ用ガス
供給装置2に対しON指令を出し、ステップS1へ戻り
パージ用ガスの供給を行う。また、ステップS8で、前
記ガス排出口6からの排出量が大でなければ、其の侭、
安定状態を維持して加工操作が継続される。On the other hand, if NO is determined in the step S4, the process proceeds to a step S5 in which the purging gas is supplied and sucked into the X and Y optical axes.
The X-axis and Y-axis stroke amounts Xst and Yst are determined by an NC device, for example, the stroke amount Xst per unit time per hour.
And Yst are monitored, the stroke amounts Xst and Yst are converted into gas consumption amounts, and based on the results, the gas supply amount is returned to step S2 to be adjusted by the flow control valve 3. In step S7, the old purge gas in the optical path is discharged and the new purge gas is discharged by automatically opening and closing the gas discharge port 6, for example, by fully opening the opening of the gas discharge port 6 every 30 minutes. Supply and renew. In the next step S8, the gas remaining amount detection sensor 5 determines whether or not the amount of purge gas discharged is large. An ON command is issued to the supply device 2, and the process returns to step S1 to supply the purge gas. In step S8, if the discharge amount from the gas discharge port 6 is not large,
The machining operation is continued while maintaining a stable state.
【0018】尚、X軸及びY軸のストローク量Xst及び
Yst、または移動量を駆動モータの回転数に置き換えて
NC装置で、この回転数を読取り、この値の多少に応じ
て、流量調整弁3を介して、ガス供給量を自動調整して
も良い。The stroke amount Xst and Yst of the X-axis and Y-axis, or the movement amount is replaced by the rotational speed of the drive motor, and the rotational speed is read by an NC device. Via 3, the gas supply amount may be automatically adjusted.
【0019】尚また、パージ用ガスの種類は、製品、ま
たは加工条件に合わせて、清浄空気、またはN2、CO2
等の不活性ガス、或いは、その他の条件に適合するガス
(気体)を選択自由であることは勿論である。The type of the purge gas is selected from the group consisting of clean air, N 2 and CO 2 according to the product or processing conditions.
Needless to say, an inert gas such as the above, or a gas (gas) suitable for other conditions can be freely selected.
【0020】[0020]
【発明の効果】この発明によれば、レーザー光路を保護
する蛇腹状の伸縮管の伸縮動作に連動してパージ用ガス
を吸引・吐出自在、且つ柔軟に対応可能な袋体を主体と
する安価な構造のバッファータンクを用い、且つガス残
量検知センサ及びX軸及びY軸のストローク量に基づい
てパージ用ガスの供給量を制御することにより、パージ
用ガスの安定供給、切断等の加工操作の安定化、延いて
は品質の向上が図れ、且つ低価格で実現可能であるとい
う効果を呈する。According to the present invention, the purging gas can be freely sucked / discharged in conjunction with the expansion / contraction operation of the bellows-shaped telescopic tube for protecting the laser beam path, and the bag is mainly made of a bag which can flexibly cope with it. Processing operations such as stable supply and cutting of purge gas by using a buffer tank with a simple structure and controlling the supply amount of purge gas based on the gas remaining amount detection sensor and the stroke amount of the X axis and Y axis. Of the present invention can be improved, and the quality can be improved, and it can be realized at a low price.
【図1】 本発明に係るローコスト型パージ用ガス供給
システムの構成を示す説明図FIG. 1 is an explanatory diagram showing a configuration of a low-cost type purge gas supply system according to the present invention.
【図2】 同バッファータンク取り付け図Fig. 2 Installation drawing of the buffer tank
【図3】 同ローコスト型パージ用ガス供給システムの
制御動作例を示すフローチャートFIG. 3 is a flowchart showing a control operation example of the low-cost type purge gas supply system.
【図4】 レーザー光路内のパージ系統図(従来例)FIG. 4 is a diagram of a purge system in a laser beam path (conventional example)
1 伸縮管からなる管路 2 パージ用ガス供給装置 3 流量調整弁 4 筐体 4a 袋体 5 ガス残量検知手段(センサ) 6 ガス排出口 BT バッファータンク Xst X軸ストローク Yst Y軸ストローク DESCRIPTION OF SYMBOLS 1 Pipe line which consists of an expansion tube 2 Gas supply device for purging 3 Flow control valve 4 Housing 4a Bag 5 Gas remaining amount detection means (sensor) 6 Gas outlet BT Buffer tank Xst X-axis stroke Yst Y-axis stroke
Claims (3)
工操作時におけるパージ用ガス供給システムであって、
レーザー光のX軸及びY軸光路を保護する蛇腹状の伸縮
管からなる管路をパージ用ガス供給装置に流量調整弁を
介して接続し、且つ前記管路の同一系統内にバッファー
タンク及びガス排出口を設け、前記バッファータンク内
にガス残量検知手段を取り付け、前記ガス残量検知手段
の検知結果に基づいて前記パージ用ガス供給装置のON
/OFF制御を行い、またX軸及びY軸のストローク量
をパージ用ガスの消費量に変換し、この変換した値に応
じてパージ用ガスの供給量を調整制御するガス供給量調
整制御手段を備え、更に前記ガス排出口からのガス排出
量の多少に応じて、前記パージ用ガス供給装置のON/
OFF制御を行うように構成したことを特徴とするロー
コスト型パージ用ガス供給システム。1. A purging gas supply system during a processing operation of a laser processing machine or the like having an NC device,
A pipe made of a bellows-shaped telescopic pipe for protecting the X-axis and Y-axis optical paths of the laser light is connected to a purge gas supply device via a flow control valve, and a buffer tank and a gas are provided in the same system of the pipe. A discharge port is provided, a gas remaining amount detecting means is installed in the buffer tank, and the purge gas supply device is turned on based on a detection result of the gas remaining amount detecting means.
/ OFF control, converts the stroke amount of the X-axis and the Y-axis into the consumption amount of the purge gas, and adjusts and controls the supply amount of the purge gas according to the converted value. The purge gas supply device is turned on / off according to the amount of gas discharged from the gas discharge port.
A low-cost purge gas supply system configured to perform an OFF control.
柔軟性のある袋体を筐体内に収納し、前記蛇腹状の伸縮
管の伸縮動作に連動して前記袋体がパージ用ガスを吸引
・吐出自在な構造とすると共に、前記ガス残量検知手段
が前記袋体の膨張・収縮動作に応じて機能するように構
成して成ることを特徴とする請求項1記載のローコスト
型パージ用ガス供給システム。2. The buffer tank stores a flexible bag made of synthetic resin or the like in a housing, and the bag sucks and purges gas for purging in conjunction with the expansion and contraction of the bellows-shaped expansion and contraction tube. 2. A low-cost purge gas supply according to claim 1, wherein the gas supply means is configured to be capable of discharging freely, and the gas remaining amount detection means is configured to function in accordance with the inflation / deflation operation of the bag body. system.
量調整弁の開口量を指令制御する制御手段であることを
特徴とする請求項1記載のローコスト型パージ用ガス供
給システム。3. The low-cost purge gas supply system according to claim 1, wherein said gas supply amount adjustment control means is a control means for command-controlling an opening amount of said flow rate adjustment valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000169016A JP2001347391A (en) | 2000-06-06 | 2000-06-06 | Low-cost gas supply system for purging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000169016A JP2001347391A (en) | 2000-06-06 | 2000-06-06 | Low-cost gas supply system for purging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001347391A true JP2001347391A (en) | 2001-12-18 |
Family
ID=18671940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000169016A Pending JP2001347391A (en) | 2000-06-06 | 2000-06-06 | Low-cost gas supply system for purging |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001347391A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008207222A (en) * | 2007-02-27 | 2008-09-11 | Mitsubishi Electric Corp | Laser processing machine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02295697A (en) * | 1989-05-10 | 1990-12-06 | Toshiba Corp | Processing device for laser oscillator |
| JPH1029084A (en) * | 1996-07-17 | 1998-02-03 | Mitsubishi Electric Corp | Optical scanning laser processing machine |
| JPH1190671A (en) * | 1997-09-17 | 1999-04-06 | Shin Nippon Koki Co Ltd | Method and device for controlling jetting pressure of assist gas in laser beam machine |
| JPH11114688A (en) * | 1997-08-13 | 1999-04-27 | Trumpf Gmbh & Co | Laser processing machine equipped with gas amount adjustment device |
| JPH11207484A (en) * | 1998-01-23 | 1999-08-03 | Amada Co Ltd | Laser beam machining method and its device |
| JP2000135585A (en) * | 1998-10-28 | 2000-05-16 | Amada Co Ltd | Method and device for shielding optical system of laser processing device |
-
2000
- 2000-06-06 JP JP2000169016A patent/JP2001347391A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02295697A (en) * | 1989-05-10 | 1990-12-06 | Toshiba Corp | Processing device for laser oscillator |
| JPH1029084A (en) * | 1996-07-17 | 1998-02-03 | Mitsubishi Electric Corp | Optical scanning laser processing machine |
| JPH11114688A (en) * | 1997-08-13 | 1999-04-27 | Trumpf Gmbh & Co | Laser processing machine equipped with gas amount adjustment device |
| JPH1190671A (en) * | 1997-09-17 | 1999-04-06 | Shin Nippon Koki Co Ltd | Method and device for controlling jetting pressure of assist gas in laser beam machine |
| JPH11207484A (en) * | 1998-01-23 | 1999-08-03 | Amada Co Ltd | Laser beam machining method and its device |
| JP2000135585A (en) * | 1998-10-28 | 2000-05-16 | Amada Co Ltd | Method and device for shielding optical system of laser processing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008207222A (en) * | 2007-02-27 | 2008-09-11 | Mitsubishi Electric Corp | Laser processing machine |
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