JP2001230594A - Vacuum suction apparatus of mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum suction apparatus of a mounting device, where the effect of the dead weight of a rod is reduced for controlling the speed, when a sucked object contacts a substrate and the like. SOLUTION: A rod 5, inserted vertically in a rod insertion hole 4 of a bearing body 3 is provided with an axle part 5a and a protruding part 5b, and a recessed part 4a, corresponding to the protruding part 5b, is provided in the rod insert hole 4. Pressurizing ports 6 and 7, which supply pressure fluid between pressure-receiving surfaces 5b1 and 5b2 of the protruding part 5b and pressure-receiving surfaces 4a1 and 4a2 of the recessed part 4a for providing vertical thrust to the rod 5, are formed at the bearing body 3. A pair of static-pressure bearing parts 11 and 12 are provided on both the upper and lower, sides of the pressurizing ports 6 and 7 which support the rod 5 to the bearing body 3 in a noncontact manner. The rod 5 is supported, being floated, as the pressure fluid is jetted from the static-pressure bearing parts 11 and 12. A suction port 5c for vacuum-suction of the object is formed at the tip of the rod 5, and a vacuum port 16 is formed at the bearing body 3, which corresponds to the outer peripheral part opening end of an internal suction path 5d which runs the axial core part of the rod 5 from the suction port 5c and opens at the outer peripheral part of the rod.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum suction device for a mounting machine which has a very small pressing load on an object to be suctioned and can control the pressing load.

[0002]

2. Description of the Related Art Conventionally, there is known a vacuum suction device of a mounting machine in which a sliding resistance of a rod is reduced and a pressing force of the rod against an IC chip is reduced (Japanese Patent Application Laid-Open No. Hei 8-210354). This vacuum suction device reduces the sliding resistance of the rod by using a hydrostatic bearing in place of the ball bearing, eliminates the exhaust pipe, and provides a vacuum passage inside the bearing body to affect the pressing force. , And by providing the magnet of the voice coil motor on the rod, fluctuations in the pressing force due to wiring are eliminated. As a result, the pressing force on the IC chip is reduced to 20 g to 10 g.
It can be reduced to about 0 g.

[0003]

However, in the above-mentioned vacuum suction apparatus, when the rod moves in the vertical direction, the weight of the rod is applied when the IC chip is mounted, and the point that the pressing force is increased is not considered. Also, the pressing force of the rod is controlled using a voice coil motor,
Since the voice coil motor is driven with the same pressing force over the entire stroke, the speed at which the IC chip contacts the wiring board cannot be controlled. That is, the impact load received by the IC chip is determined by the speed at the time of contact and the mass of the movable part. However, since the speed at the time of contact cannot be controlled, the impact load received by the IC chip cannot be controlled.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a vacuum suction device of a mounting machine capable of reducing the influence of the weight of a rod and controlling the speed at which an object comes into contact with a substrate or the like.

[0005]

The above object is attained by the present invention. The invention according to claim 1 includes a bearing body having a vertical rod insertion hole, and a rod that is vertically movably inserted into the rod insertion hole, and vacuum-adsorbs an object to be adsorbed to a lower end portion of the rod. The suction port is formed in the vacuum suction device of a mounting machine connected to a negative pressure source via an internal suction passage passing through the inside of the rod and an external suction passage provided outside the rod. A downward pressure-receiving surface is provided on the outer peripheral surface of the rod, an upward pressure-receiving surface facing the pressure-receiving surface is provided in the rod insertion hole of the bearing body, and the downward pressure-receiving surface of the rod and the upward direction of the bearing body are provided. Thrust generating means for supplying a pressure fluid between the pressure receiving surface and the rod to apply an upward thrust to the rod by the pressure of the pressure fluid is provided, and a downward force larger than the upward thrust is applied to the rod. To provide a vacuum suction device of the mounting apparatus, characterized in that the pressing means for providing a thrust temporarily are provided. According to a fourth aspect of the present invention, there is provided a bearing body having a rod insertion hole in a vertical direction, and a rod inserted vertically movably into the rod insertion hole, and vacuum-adsorbs an object to be adsorbed to a lower end portion of the rod. The suction port is formed in the vacuum suction device of a mounting machine connected to a negative pressure source via an internal suction passage passing through the inside of the rod and an external suction passage provided outside the rod. A downward pressure-receiving surface is provided on the outer peripheral surface of the rod, an upward pressure-receiving surface facing the pressure-receiving surface is provided in the rod insertion hole of the bearing body, and the downward pressure-receiving surface of the rod and the upward direction of the bearing body are provided. A thrust control means for controlling a pressure of a pressure fluid supplied between the pressure receiving surface and the pressure receiving surface to apply a thrust upward or downward to the rod; To provide a wearing equipment.

In the first aspect, a suction port is formed at a tip end of the rod, and the suction port is connected to a negative pressure source via an internal suction passage and an external suction passage of the rod. Since the rod is vertically movably inserted into the rod insertion hole of the bearing main body, the rod can be smoothly moved in the vertical direction. For example, a pressure fluid is supplied from the thrust generating means between the downward pressure receiving surface of the rod and the upward pressure receiving surface of the bearing body, and in a state where an upward thrust is given to the rod, a downward thrust is applied to the rod by the pressing means. When given, the rod can be moved downward while applying a brake to the pressing speed by the pressing means. Therefore, even if the pressing force of the pressing means is large, the moving speed of the rod can be freely controlled by controlling the pressure of the pressurized fluid by the thrust generating means. In addition, the effect of the rod's own weight is offset by controlling the pressure of the pressure fluid supplied between the downward pressure receiving surface of the rod and the upward pressure receiving surface of the bearing body. In this case, the load on the electronic component can be reduced, and a mounting machine with a small load can be obtained. In claim 4, the moving speed of the rod can be freely controlled only by controlling the pressure of the pressurized fluid by the thrust control means, instead of using the balance between the thrust generating means and the pressing means as in claim 1. Control can be simplified.

According to a second aspect of the present invention, the pressing means supplies pressure fluid between the upward pressure receiving surface of the rod and the downward pressure receiving surface of the bearing body, and applies downward thrust to the rod by the pressure of the pressure fluid. Can be configured. That is,
Similarly to the thrust generating means, the pressing means obtains the thrust by the pressurized fluid, and both the upward thrust and the downward thrust on the rod are obtained by the pressurized fluid, so that the movement of the rod is controlled only by controlling the pressure of the pressurized fluid. Speed can be controlled freely.

According to a third aspect of the present invention, the pressing means includes a magnet provided on one of the rod or the bearing main body and a coil provided on the other of the rod or the bearing main body. A means for applying a downward thrust, that is, a voice coil motor.
In this case, by controlling the current flowing through the coil, a downward thrust can be freely generated.

It is desirable that a scale be provided on the rod, and a detection unit for detecting the amount of movement of the rod be provided on the bearing body, which is paired with the scale. In this case,
By performing feedback control of the position of the rod, the electronic component is lowered at a high speed just before contacting the wiring board,
It is possible to perform the control of lowering at a low speed from immediately before the contact to the contact position with high accuracy.

According to a sixth aspect of the present invention, there is provided a cam device which includes a cam follower provided on a rod, a cam provided on a bearing body and capable of coming in contact with and separating from the cam follower, and applying a downward thrust to the rod by rotating the cam. It is provided. In this case, the rod can be forcibly lowered by a predetermined stroke only by rotating the cam, and thereafter the rod can be lowered at a low speed by the thrust generating means and the pressing means.

It is preferable that at least one pair of bearing portions for supporting the rod in a non-contact manner with the rod insertion hole be provided on the upper and lower sides of the pressure receiving surface of the rod. Such bearings include, for example, hydrostatic bearings. Accordingly, resistance due to sliding friction or the like does not act on the rod, and the rod can move up and down very smoothly, so that control of the rod becomes easy.

According to another aspect of the present invention, there is provided a control device for controlling the thrust generating means and the pressing means, wherein the control device lowers the rod at a high speed near the pickup position or the place position of the object to be sucked, Is desirably controlled so as to descend at a low speed from the nearby position to the pickup position or the place position. In this case, even when the stroke amount of the rod in the vertical direction is large, the tact time can be shortened, and the impact load applied to the object (electronic component) can be reduced.

According to a ninth aspect of the present invention, similarly to the eighth aspect, the rod is lowered at a high speed to a position near a pickup position or a place position of an object to be sucked, and then lowered at a low speed. It differs in that it is implemented in a device.

According to a tenth aspect of the present invention, a control is applied to the apparatus of the fourth aspect, in which the rod is lowered at a high speed to a position near a pickup position or a place position of an object to be sucked, and then lowered at a low speed thereafter. That is, the thrust control means:
The supply pressure of the pressurized fluid is controlled so that the rod is lowered at a high speed near the pickup position or the place position of the object to be adsorbed, and then the rod is lowered at a low speed from the vicinity position to the pickup position or the place position.

According to an eleventh aspect of the present invention, a control is applied to the apparatus according to the sixth aspect, wherein the rod is lowered at a high speed to a position near a pickup position or a place position of an object to be adsorbed, and at a low speed thereafter. It was done. That is, a thrust control means and a control device for controlling the cam device are provided, and the control device lowers the rod at a high speed near the pickup position or the place position of the object to be attracted by the cam device, and thereafter, the thrust control means sets the rod. At a low speed from the nearby position to the pickup position or the place position.

[0016]

1 and 2 show a first embodiment in which a vacuum suction apparatus according to the present invention is applied to a bonding apparatus. The bonding apparatus includes a base plate 1 attached to a head portion of an XY robot, a bearing body 3 fixed to a side surface of the base plate 1 via a connection block 2, and a vertical rod insertion provided on the bearing body 3. A rod 5 and the like are inserted through the hole 4 so as to be vertically movable. The cross sections of the rod insertion hole 4 and the rod 5 may be circular or square.

The rod 5 has shaft portions 5a having smaller diameters at both upper and lower ends, and a convex portion 5 having a larger diameter than the shaft portion 5a at the center.
b, the downward end surface (pressure receiving surface) 5b of the convex portion 5b
₁ and upward facing surface (pressure receiving surface) 5b ₂
Is set to be considerably smaller (for example, 1/10 or less). The pressure receiving area of the convex portion 5b is given by the difference between the cross-sectional area of the convex portion 5b and the cross-sectional area of the shaft portion 5a.
It is desirable to set it to m ² or less.

A concave portion 4a corresponding to the convex portion 5b is formed in the rod insertion hole 4 of the bearing body 3. Bearing body 3
Are formed with first and second pressurizing ports 6 and 7 for supplying a pressurized fluid to a gap between the pressure receiving surfaces 5b ₁ and 5b ₂ of the convex portion 5b and the pressure receiving surfaces 4a ₁ and 4a ₂ of the concave portion 4a. Have been. That is, the pressure port 6 supplies pressure fluid between the downward end face of the convex portion 5b (pressure receiving surface) 5b ₁ and the upward end face of the recess 4a (pressure receiving surface) 4a _1, thrust upward to the rod 5 This constitutes a thrust generating means for giving. Pressurizing port 7
Are the upward end surface (pressure receiving surface) 5b ₂ of the convex portion 5b and the concave portion 4a
Of supplying a pressurized fluid between the downward end face (pressure receiving surface) 4a _2, constitute a pressing means for giving a thrust downward to the rod 5. The pressurizing port 6 is connected to the positive pressure air source 1 through the pressure reducing valve 8.
The pressure port 7 is connected to a positive pressure air source 10 via an electromagnetic pressure control valve 9. The positive pressure air source 10 is constituted by, for example, a compressed air pump or a compressed air cylinder. The pressure reducing valve 8 is a valve that reduces the air pressure supplied from the positive pressure air source 10 to a constant pressure, and the pressure control valve 9 is an air pressure supplied to the pressurizing port 7 according to an electric signal input from the controller 100. Is a variable valve. Therefore, ignoring the weight of the rod 5 and assuming that the areas of the pressure receiving surfaces 5b ₁ and 5b ₂ are the same, the supply air pressure of the pressure control valve 9 is made lower than the air pressure by the pressure reducing valve 8 so that the rod 5 Generates a thrust upward, and conversely, if the supply air pressure of the pressure control valve 9 is made higher than the air pressure by the pressure reducing valve 8, a downward thrust is generated in the rod 5.

An orifice hole 1 forming a hydrostatic bearing is provided on the inner surface of the rod insertion hole 4 through which the shaft portion 5a of the rod 5 is inserted.
1 and 12 are formed. These orifice holes 11,
As shown in FIG. 2, 12 are formed on the inner periphery of the rod insertion hole 4 at equal intervals in the circumferential direction, and open toward the axis. Orifice holes 11 and 12 are bearing ports 13 and 1
4 and the bearing ports 13 and 14 are connected to the pressure reducing valve 1
5 is connected to a positive pressure air source 10. Therefore, the air pressure blown out from the orifice holes 11 and 12 is the same. The pressure reducing valve 15 reduces the air pressure supplied from the positive pressure air source 10 to a constant pressure suitable for a hydrostatic bearing. The clearance between the shaft 5a of the rod 5 and the rod insertion hole 4 and the clearance between the protrusion 5b and the recess 4a are each set to 10 μm or less (preferably 5 μm or less). Therefore, the backlash in the radial direction of the rod 5 is very small.

At the lower end of the rod 5, a suction port 5c for vacuum-sucking an object W such as an IC chip is formed, and at the axis of the rod 5, the outer peripheral surface of the projection 5b extends from the suction port 5c. 5d is formed. A vacuum port 16 is opened on the inner peripheral surface of the concave portion 4a corresponding to the outer peripheral opening end of the internal suction passage 5d, and the vacuum port 16 is connected to a negative pressure air source 17 through an external suction passage 19 and an on-off valve 18. Is connected to For example, a vacuum pump or the like may be used as the negative pressure air source 17. The opening of the vacuum port 16 is formed to be longer in the vertical direction according to the stroke of the rod 5. Therefore, the suction passage 5d can always correspond to the vacuum port 16 regardless of the position of the rod 5. The opening / closing valve 18 is also controlled by the controller 100 to open and close. As described above, the upper end of the internal suction passage 5d is opened on the outer peripheral surface of the rod 5, and the external suction connected to the negative pressure source 17 is formed on the inner peripheral surface of the bearing body 3 corresponding to the opening of the internal suction passage 5d. If one end 16 of the passage 19 is open, an exhaust tube or the like is not connected to the rod 5, so that the weight of the exhaust tube or the like does not affect the pressing force of the rod 5.

The operation of the bonding apparatus having the above configuration will be described below. When air at a constant pressure is supplied from the bearing ports 13 and 14, air is blown out from the orifices 11 and 12, and the function of a hydrostatic bearing that supports the rod 5 in a non-contact manner with respect to the bearing body 3 is exhibited. Therefore, no sliding resistance is generated between the rod 5 and the bearing body 3, and no static friction resistance is generated at the time of starting. In this state, the rod 5 can be moved up and down by increasing or decreasing the air pressure supplied from the pressurizing port 7 by the pressure control valve 9 while supplying air at a constant pressure from the pressurizing port 6 by the pressure reducing valve 8. it can.

When picking up an IC chip W on a pallet by the above-mentioned bonding apparatus, first, the bonding apparatus is moved to a position above the pallet pickup position by an XY robot or the like. When the lower end of the rod 5 comes above the IC chip W, the air pressure higher than the air pressure supplied from the pressure port 6 is supplied from the pressure port 7 to lower the rod 5 and attract the rod 5. The mouth 5c is brought into contact with or close to the IC chip W. Set the suction port 5c to I
Close to the C chip W and open the on-off valve 18,
External suction passage 19, vacuum port 16, internal suction passage 5
d, vacuum suction is performed through the suction port 5c, and the IC chip W
At the suction port 5c. Thereafter, the air pressure of the pressurizing port 7 is released, and the rod 5 is raised. When bonding the sucked IC chip W, the XY robot moves the rod 5 horizontally above the wiring board P while the IC chip W is sucked. After the horizontal movement, a predetermined air pressure is supplied from the pressurizing port 7 to lower the rod 5, and the IC chip W is bonded to the wiring board P or the bonding agent B with a constant pressing force as shown in FIG.

When the rod 5 is lowered during pickup, it is desirable to control the lowering speed of the rod 5 by adjusting the pressure difference between the pressure port 6 and the pressure port 7.
That is, the rod 5 is lowered at a high speed until the lower end of the rod 5 approaches the IC chip W within a certain distance, and is lowered at a low speed until the lower end of the rod 5 contacts or approaches the IC chip W. It is better to let. Thereby, the operation speed can be improved, and the impact force on the IC chip W can be reduced. The same control is applied to the IC during bonding.
It can also be used when the chip W is brought into contact with the wiring board P or the bonding agent B. Especially when bonding IC
Since it is necessary to bring the chip W into contact with the wiring board P, the load on the IC chip W can be reduced by controlling the descending speed of the rod 5.

The air pressure supplied from the pressurizing port 6 is P
₁ , the air pressure supplied from the pressure port 7 is P ₂ ,
b is the pressure receiving area of the pressure receiving surfaces 5b ₁ and 5b ₂
Is assumed to be G (including the own weight of the IC chip W at the time of bonding), the downward thrust F acting on the rod 5
Is as follows. F = G + (P ₂ −P ₁ ) Sa Therefore, by controlling the pressure control valve 9 so that P ₂ <P ₁ , the thrust F, that is, the load acting on the IC chip W can be reduced by the weight G of the rod 5. Can be smaller.

At the time of pickup or bonding, it is necessary to reduce not only the pressing force on the IC chip W but also the dispersion of the pressing force. In this embodiment, since the pressure receiving areas of the pressure receiving surfaces 5b ₁ and 5b ₂ of the convex portion 5b are very small, the thrust and the variation in the thrust are very small, and the thrust can be controlled with high accuracy. For example, the protrusion 5b
When the pressure receiving area Sa is 0.1 cm ² , 0.2 MPa ± 0.5% compressed air is supplied from the pressurization port using a commercially available pressure reducing valve, and ± 9.8 × 10 ^-3
The thrust can be controlled with an accuracy of N or less. Therefore, the rod 5 can be operated in the axial direction with extremely small thrust and high precision.

FIG. 3 shows a second embodiment of the bonding apparatus according to the present invention. The same parts as those in FIG. In this embodiment, a cam follower 21 is attached to the upper end of the rod 5 via an attachment member 20, and a rotating shaft 22 rotatably attached to the base plate 1.
To which a cam 23 is attached. Cam Follower 21
Is movable toward and away from the lower surface of the cam 23.

When bonding the IC chip W using the bonding apparatus, the pressure port 7 is released, and the rod 5 is pressed by the air pressure supplied from the pressure port 6.
To the cam 23 to bring the cam follower 21 into contact with the cam 23. When the rotating shaft 22 is rotated in this state, the rod 5 rapidly descends to a position indicated by a two-dot chain line in FIG.
At this time, the IC chip W adsorbed on the lower end of the rod 5 is placed on the bonding position (place position) of the wiring board P.
It is located near.

Next, an air pressure equal to or higher than the air pressure supplied from the pressure port 6 is supplied from the pressure port 7, and the rod 5 is lowered at a low speed. Then, the IC chip W is pressed against the bonding agent B applied on the wiring board P and bonded (indicated by a solid line in FIG. 3). At this time, since the lowering speed of the rod 5 is low and the load applied to the IC chip W can be reduced, damage to the IC chip W can be prevented. After the IC chip W is mounted and the air pressure supplied to the pressurizing port 7 is released, the rod 5 rises due to the air pressure from the pressurizing port 6 and comes into contact with the cam 23. Follows and rises. As described above, after the rod 5 is rapidly lowered by the cam 23, the rod 5 is lowered at a low speed by the pressure difference between the pressurizing ports 6 and 7, so that the tact time associated with the vertical movement of the rod 5 is reduced. , IC chip W
And the impact load applied to it can be reduced.

In the above embodiment, the cam device is used as a means for lowering the rod 5 at a high speed. However, the pushing side (the cam 23 in FIG. 3) and the pushed side (the cam follower 21 in FIG. 3) are used. Other actuators (such as voice coil motors and air cylinders) can be used if they are separated.

FIG. 4 shows a third embodiment of the bonding apparatus according to the present invention. The same parts as those in FIG. In this embodiment, a stepped rod 5 having a large diameter portion 5f at the upper portion and a small diameter portion 5e smaller than the large diameter portion 5f at the lower portion is used. Large diameter part 5 of rod 5
downward end face of the f (pressure receiving surface) 5f ₁ and the upward end face of the recess 4a by supplying compressed air between the (pressure receiving surface) 4a _1, pressure port 6 which gives a thrust upward to the rod 5 within the bearing body 3 Is formed. The rod 5 is not provided with a pressure port for applying a downward thrust.

The large diameter portion 5f of the rod 5 protrudes upward from the bearing body 3, and has a voice coil motor 3
0 is provided. That is, the bobbin 31 around which the coil 32 is wound is fixed to the upper end of the rod 5, and a permanent magnet 33 that generates a magnetic flux in a direction perpendicular to the coil 32 is disposed at a portion opposed to the bobbin 31. The permanent magnet 33 is fixed to the base plate 1 via a mounting block 34.
A scale 36 of a displacement sensor is attached to a portion of the rod 5 protruding upward from the bearing body 3 via a stay 35, and a detection unit 37 of the displacement sensor is attached to the attachment block 34 in opposition to the scale 36. I have. The vertical displacement (position) of the rod 5 is detected by the scale 36 and the detection unit 37. The signal of the detection unit 37 is input to the controller 100, and the controller 100 controls the voice coil motor 30 and the on-off valve 18 according to the position of the rod 5.

Compressed air of a predetermined pressure is constantly supplied to the pressurizing port 6, and the large diameter portion 5f of the rod 5 has a downward end face 5f.
The thrust is always given upward to the rod 5 with ₁ as the pressure receiving area. Now, when a current in a predetermined direction is applied to the coil 32,
A downward thrust is generated in the rod 5 to which the coil 32 is attached. If the current flowing through the coil 32 is set in advance so that the downward thrust is sufficiently larger than the upward thrust due to the compressed air, the rod 5 moves down rapidly. When the displacement sensors 36 and 37 detect that the IC chip W adsorbed on the rod 5 has been lowered to just before the wiring board P, the supply of current to the coil 32 is stopped or reduced. Thereby, the brake is applied to the descending speed of the rod 5, and the rod 5 is stopped or decelerated. Thereafter, the IC chip W is mounted on the wiring board P while controlling the current flowing through the coil 32 and lowering the rod 5 at a low speed. After the mounting, the on-off valve 18 is closed to release the IC chip W, the power supply to the coil 32 is stopped, and the rod 5 is raised by the compressed air supplied from the pressurizing port 6.

FIG. 5 shows a fourth embodiment of the bonding apparatus according to the present invention, and the same parts as those in FIG. In this embodiment, as in the third embodiment, a rod 5 having a large-diameter portion 5f at the upper portion and a small-diameter portion 5e at the lower portion having a smaller diameter than the large-diameter portion 5f is used. Downward end face 5f of the large diameter portion 5f of the rod 5 ₁ and the recess 4
The port 6 opened between the upper end face 4a1 of the _first pressure sensor 4a1 is connected to the positive pressure air source 10 via an electromagnetic switching valve 40 and a pressure reducing valve 8, and a pressure reducing valve 41 provided in parallel with the pressure reducing valve 8. Is connected to the positive pressure air source 10. The controller 100 controls the switching valve 40 according to the position of the rod 5.
And the on-off valve 18 are controlled. Note that a stopper 42 is attached to the lower end of the rod 5 to define the upper limit position of the rod 5.

The air pressure regulated by the two pressure reducing valves 8 and 41 is different. When the switching valve 40 is switched to the pressure reducing valve 8 side, an upward thrust larger than the own weight of the rod 5 is generated in the rod 5, and when the switching valve 40 is switched to the pressure reducing valve 41 side, the rod 5 , An upward thrust smaller than the own weight of the rod 5 is generated. Together with the switching control of the switching valve 40, the rod 5 can be operated in the vertical direction. In the fourth embodiment, the air pressure supplied to the port 6 is switched in two stages by the switching valve 40. However, instead of the combination of the switching valve 40 and the pressure reducing valves 8, 41, the air pressure is arbitrarily adjusted. A pressure control valve that can be pressurized may be provided. In this case, the vertical movement of the rod 5 can be more finely controlled.

In the fourth embodiment, only one port 6 for generating thrust is required, and the weight of the rod 5 is used. Therefore, no special pressing means is required, the structure is simple and the size is reduced. Is possible. The positive pressure air source 10 can be used both for the hydrostatic bearing and for generating the upward thrust, so that downsizing and cost reduction can be realized. If the negative pressure air source 17 is connected to the port 6 via the switching valve 40, the rod 5 can be lowered with a load greater than its own weight.

In the above embodiment, the hydrostatic bearing is constituted by the orifice hole formed in the inner peripheral surface of the rod insertion hole of the bearing body. However, the hydrostatic bearing is constituted by using a porous sleeve as in the prior art. Can also. In addition, various known methods may be used. In the third embodiment, the coil is fixed to the rod and the permanent magnet is fixed to the bearing body (mounting block 34). Conversely, the permanent magnet is fixed to the rod and the coil is fixed to the bearing body. Is also good. The vacuum suction device of the present invention is suitable for suctioning not only IC chips but also piezoelectric components such as piezoelectric resonators which are weak against an impact load because the lowering speed of the rod can be freely controlled.

[0037]

As is apparent from the above description, claim 1
According to the invention described in the above, while supplying a pressure fluid between the downward pressure receiving surface of the rod and the upward pressure receiving surface of the bearing body, while constantly applying an upward thrust to the rod by the pressure of the pressure fluid, By temporarily applying a downward thrust to the rod by the pressing means to move the rod downward while applying a brake to the pressing speed by the pressing means, the moving speed of the rod is controlled by the pressure control of the pressure fluid. Can be controlled freely, and the influence of the weight of the rod can be eliminated. As a result, when the electronic component is mounted on the wiring board, the load applied to the electronic component can be reduced, and a mounting machine with a small load can be obtained. Similarly, according to the invention described in claim 4, by controlling the pressure of the pressure fluid supplied between the downward pressure receiving surface of the rod and the upward pressure receiving surface of the bearing main body, the pressure of the pressure fluid is increased with respect to the rod. Alternatively, since the thrust control means for applying a downward thrust is provided, the movement speed of the rod can be freely controlled by controlling only the thrust control means, and the influence of the weight of the rod can be eliminated.

[Brief description of the drawings]

FIG. 1 is a structural diagram of a first embodiment of a bonding apparatus according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a structural diagram of a second embodiment of the bonding apparatus according to the present invention.

FIG. 4 is a structural diagram of a third embodiment of the bonding apparatus according to the present invention.

FIG. 5 is a structural diagram of a fourth embodiment of the bonding apparatus according to the present invention.

[Explanation of symbols]

3 Bearing body 4 Rod insertion hole 4a ₁ Pressure receiving surface (upward end surface) 4a ₂ Pressure receiving surface (downward end surface) 5 Rod 5a Shaft 5b ₁ Pressure receiving surface (downward end surface) 5b ₂ Pressure receiving surface (upward end surface) 5c Suction port 5d Internal suction Passage 6,7 Pressurization port 10 Positive pressure air source 11,12 Orifice (static pressure bearing part) 17 Negative pressure air source 19 External suction passage

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Koichi Nitta 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto F-term in Murata Manufacturing Co., Ltd. (reference) 3C007 DS01 FS01 FU00 FU10 NS17 3F061 AA01 CA01 CC00 DB06 DD07 3J102 AA02 BA05 CA11 CA40 EA02 EA06 EA13 EB07 GA01 5E313 AA02 AA11 AA31 CC01 CC02 CC03 CC08 EE01 EE02 EE03 EE05 EE24 EE33 EE38 FF31 FG10

Claims (11)

[Claims] A suction body for vertically adsorbing an object to be adsorbed at a lower end portion of the rod, the bearing body having a rod insertion hole in a vertical direction, and a rod vertically movably inserted into the rod insertion hole. Is formed, and the suction port is connected to a negative pressure source via an internal suction passage passing through the inside of the rod and an external suction passage provided outside the rod. A downward pressure receiving surface is provided on the outer peripheral surface, and an upward pressure receiving surface facing the pressure receiving surface is provided in the rod insertion hole of the bearing main body, and a downward pressure receiving surface of the rod and an upward pressure receiving surface of the bearing main body are provided. Thrust generating means for supplying a pressure fluid therebetween and giving an upward thrust to the rod by the pressure of the pressure fluid is provided, and a downward thrust larger than the upward thrust is temporarily applied to the rod. Vacuum suction device of the mounting apparatus, characterized in that the pressing means is provided to give the. 2. The pressure means includes an upward pressure-receiving surface provided on an outer peripheral surface of the rod, a downward pressure-receiving surface provided in a rod insertion hole of the bearing main body and opposed to the pressure-receiving surface, and Means for supplying a pressure fluid between the upward pressure receiving surface of the bearing body and the downward pressure receiving surface of the bearing body, and for temporarily applying a downward thrust to the rod by the pressure of the pressure fluid. A vacuum suction device for a mounting machine according to claim 1. 3. The pressing means includes a magnet provided on one of the rod or the bearing main body and a coil provided on the other of the rod or the bearing main body. 2. A vacuum suction device for a mounting machine according to claim 1, wherein the device is a means for applying a downward thrust. 4. A suction body for vertically adsorbing an object to be adsorbed at a lower end portion of the rod, the bearing body having a rod insertion hole in a vertical direction and a rod inserted vertically movably into the rod insertion hole. Is formed, and the suction port is connected to a negative pressure source via an internal suction passage passing through the inside of the rod and an external suction passage provided outside the rod. A downward pressure receiving surface is provided on the outer peripheral surface, and an upward pressure receiving surface facing the pressure receiving surface is provided in the rod insertion hole of the bearing main body, and a downward pressure receiving surface of the rod and an upward pressure receiving surface of the bearing main body are provided. A vacuum suction device for a mounting machine, comprising: a thrust control means for applying a thrust upward or downward to a rod by controlling a pressure of a pressure fluid supplied therebetween. 5. A scale according to claim 1, wherein said rod is provided with a scale, and said bearing body is provided with a detecting portion for detecting a moving amount of said rod, which is paired with said scale. A vacuum suction device for a mounting machine as described in Crab. 6. A cam follower provided on the rod,
6. A cam device which is provided on the bearing body, includes a cam follower and a cam which can be separated from and separated from each other, and a cam device for applying a downward thrust to the rod by rotating the cam is provided. A vacuum suction device for the mounting machine according to any one of the above. 7. The bearing body according to claim 1, wherein at least one pair of bearing portions for supporting the rod in a non-contact manner with respect to the rod insertion hole are provided on both upper and lower sides of the pressure receiving surface of the rod. 7. A vacuum suction device for a mounting machine according to any one of 6. 8. A control device for controlling the thrust generating means and the pressing means, wherein the control device lowers the rod at high speed to a position near a pickup position or a place position of the object to be sucked, and then controls the rod. 8. The vacuum suction device for a mounting machine according to claim 1, wherein the device is controlled so as to lower at a low speed from a nearby position to a pickup position or a place position. 9. A control device for controlling the thrust generating means, the pressing means and the cam device, wherein the control device moves the rod by the cam device at a high speed to a position near a pickup position or a place position of an object to be attracted. After letting
7. The control device according to claim 6, wherein the thrust generating means and the pressing means control the rod to descend at a low speed from a nearby position to a pickup position or a place position.
4. A vacuum suction device for a mounting machine according to claim 1. 10. The thrust control means lowers the rod at a high speed to a position near a pickup position or a place position of an object to be attracted, and then lowers the rod at a low speed from a vicinity position to a pickup position or a place position. 5. The vacuum suction device for a mounting machine according to claim 4, wherein a supply pressure of the pressure fluid is controlled. 11. A control device for controlling said thrust control means and a cam device, wherein said control device lowers said rod at a high speed to a position near a pickup position or a place position of an object to be attracted by said cam device. 7. The vacuum suction device for a mounting machine according to claim 6, wherein the thrust control means controls the rod to descend at a low speed from a nearby position to a pickup position or a place position.