JP2001230368A - Package structure of integrated circuit - Google Patents

Abstract

(57) [Summary] A mounting density of a film carrier type semiconductor component is doubled. SOLUTION: The package structure of the integrated circuit of the present invention comprises:
Using a film carrier tape having double-sided wiring 2 and 3, a semiconductor chip 4 having bump electrodes is mirror-reversed on one side and a semiconductor chip 5 manufactured by mirror inversion on the other side from both sides of the film carrier tape. It is a structure to be mounted. The mirror-inverted semiconductor chip 5
The bump electrode is located at the same position as the bump electrode position of the semiconductor chip 4.
The mounting density and the wiring density can be doubled, and the load at the time of connection between the bump electrode and the wiring conductor of the film carrier tape can be made uniform.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a film carrier type semiconductor component, and more particularly, to a package structure of an integrated circuit on which a semiconductor chip is mounted.

[0002]

2. Description of the Related Art Conventionally, there are many publications in which semiconductor elements are mounted on both sides of a film carrier tape. The semiconductor device described in Japanese Utility Model Laid-Open Publication No.
A semiconductor characterized in that two semiconductor chips are mounted on both sides of a film carrier tape on a circuit wiring board formed on both sides of a film carrier tape such that the circuit forming surface faces the circuit wiring board side. Device. The method of manufacturing a semiconductor device described in JP-A-62-205636 and the two-layer type semiconductor integrated circuit described in JP-A-63-136642 are formed on one surface of a film carrier tape. There is disclosed an example in which a semiconductor chip is connected to both surfaces of a lead frame or a finger lead as a wiring conductor by a bump or the like. Further, in the semiconductor device described in JP-A-64-77135 and the semiconductor integrated circuit device described in JP-A-4-279052, the wiring conductor formed on one side of the film carrier tape is also used. An example in which a semiconductor chip is connected to both sides of a certain lead terminal or inner lead by a bump or the like is disclosed. These disclosed examples are all made to increase the packaging density of semiconductor chips, and are not intended to increase the packaging density of wiring.

[0003]

That is, as shown in FIG. 3, in each of the above publications, a semiconductor chip is mounted on both sides of a film carrier to increase the mounting density, but they are provided on the same plane. Since the bumps of the semiconductor chip are connected from both sides of the wiring conductor, the number of mounted semiconductor chips can be increased, but improvement in the wiring density cannot be expected.

In the semiconductor device described in Japanese Utility Model Application Laid-Open No. 6197857, an improvement in wiring density can be expected because two semiconductor chips are mounted on a circuit wiring board formed on both sides of a film carrier tape. The purpose and effect of the invention are high-density mounting and protection of the surface of the semiconductor chip, and it is impossible to imagine an improvement in the wiring density from FIGS. 1 and 2 showing the invention.

In the semiconductor integrated circuit devices described in JP-A-63-136642 and JP-A-4-279052, the surface electrodes of the semiconductor chips mounted on the front and back are opposed to each other at the same position. Therefore, since a stable load for connection cannot be applied between the film carrier wiring electrode and the semiconductor chip surface bump, there is a risk that the connection may be incomplete.

In order to solve this problem, it is possible to provide electrically insulated dummy surface bumps at opposing portions. However, the size of the semiconductor chip itself is increased by the size of the dummy surface electrodes. It is necessary and goes against the original purpose of improving the mounting density.

As described above, if both the wiring density of the film carrier and the semiconductor chip to be mounted are not satisfied, the mounting density cannot be improved.

An object of the present invention is to improve the mounting density of a film carrier type semiconductor component by simultaneously doubling the wiring density and the mounting density of a semiconductor chip about twice.

[0009]

According to the present invention, there is provided an integrated circuit package structure in which a semiconductor chip having bumps formed on a surface electrode is mounted on a film carrier tape having metal foil wiring on both sides. At
At least electrode portions of the metal foil conductors on both surfaces that are connected to the front surface bumps of the semiconductor chip are formed at the same position facing each other, and the semiconductor chip is mounted on each of the front and back opposite electrodes.

[0010] Further, the present invention is characterized in that the surface electrode bump positions of the semiconductor chips mounted on both sides of the film carrier tape are at the same position facing each other.

Further, the position of the surface electrode bumps is characterized in that one semiconductor chip is mirror-inverted and manufactured on the other semiconductor chip so as to face the same position.

Further, the semiconductor chip having bumps formed on the surface electrodes may be a semiconductor chip having bumps formed after forming bonding pads on the surface electrodes.

Further, since at least the electrode portions of the metal foil conductors on both surfaces connected to the surface bumps of the semiconductor chip are formed at the same position facing each other, through holes may be provided in the film carrier tape.

Furthermore, when the semiconductor chips are mounted on the front and back facing electrodes, bonding may be performed using an anisotropic resin having shrinkage characteristics.

[0015]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing a package structure of an integrated circuit according to the present invention.

The package structure of the present integrated circuit includes a film carrier tape 1, a wiring conductor group 2 formed on the front surface of the film carrier tape 1, a wiring conductor group 3 formed on the back surface of the film carrier tape 1, and a wiring The semiconductor chip 4 is connected to the conductor group 2 via the bump electrodes 6, and the semiconductor chip 5 is connected to the wiring conductor group 3 via the other bump electrodes 6.
The package structure is made of a resin 7 in which these elements are integrated.

The semiconductor chip 4 mounted on the film carrier tape 1 has bump electrodes 6 on its surface. The semiconductor chip 5 is manufactured by mirror-inverting the semiconductor chip 4, and also has bump electrodes 6.

Note that the semiconductor chip 5 is not necessarily manufactured by mirror inversion as long as the semiconductor chip 5 can be opposed to the position facing the bump electrode of the semiconductor chip 4 without waste in the semiconductor size.

The bump electrodes 6 of the semiconductor chips 4 and 5 are connected to the wiring electrodes 2 and 3 of the film carrier tape 1.
Then, the semiconductor chips 4 and 5 are connected and mounted by a thermocompression bonding method using heat applied from the back surface or the periphery of the semiconductor chips 4 and 5 and a load from the back surface of the semiconductor chips 4 and 5.

The resin 7 is a resin for protecting the surfaces of the semiconductor chips 4 and 5 and for mechanically holding the semiconductor chips 4 and 5 on both sides and the film carrier 1. The through hole 8 is a through hole of the film carrier tape. This is useful for fixing the semiconductor chips 4 and 5 on both sides and separating the wiring conductor groups 2 and 3.
Therefore, the through hole 8 may not be provided as long as the wiring conductor groups 2 and 3 are separated from each other.

Further, as shown in FIG.
May have bump electrodes 6 on the surface after forming the bonding pads on the surface electrodes.

Further, the surface protection of the semiconductor chips 4, 5 and the semiconductor chips 4, 5 on both sides and the film carrier 1 are mechanically held by an anisotropic resin having shrinkage characteristics.

[0023]

By providing the wiring conductors on both sides of the film carrier tape, the wiring density is improved about twice that of the prior art, and the semiconductor chip 4 and the other are provided on one side of the double-sided wiring of the film carrier tape. By mounting the semiconductor chip 5 manufactured by mirror inversion with the same function as the semiconductor chip 4 on the surface, the mounting density of the semiconductor chip can be doubled. That is, by providing the wiring conductors on both sides of the film carrier tape, electrically independent wiring can be obtained about twice as much as the conventional wiring.

The wiring conductors can be connected to the wiring conductors on both sides of the film carrier as necessary by through holes or the like.

Next, as for the semiconductor chip, the semiconductor chip 4 is mounted on one side of the film carrier tape, and the semiconductor chip 5 manufactured by mirror inversion is mounted on the other side of the film carrier tape. The density can be doubled.

In addition, by using a semiconductor chip manufactured by mirror inversion, the surface electrodes of the semiconductor chip can be positioned to face each other from both sides of the film carrier tape, so that a stable and uniform connection load is applied. It is possible to obtain sufficient connection reliability.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a package structure of an integrated circuit according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a package structure of an integrated circuit according to a second embodiment.

FIG. 3 is a cross-sectional view illustrating a package structure of a conventional integrated circuit.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 film carrier tape 2, 3 conductor wiring group 4, 5 semiconductor chip 6 bump electrode 7 resin such as epoxy 8 through hole 9 bonding pad 11 finger electrode

Claims (6)

[Claims] 1. A package structure of an integrated circuit in which a semiconductor chip having bumps formed on a surface electrode is mounted on a film carrier tape having metal foil wiring on both sides, wherein at least the semiconductor chip surface bumps of the metal foil conductors on both sides are provided. An integrated circuit package structure, wherein electrode portions connected to the front and back are formed at the same position facing each other, and a semiconductor chip is mounted on each of the front and back opposite electrodes. 2. The integrated circuit package structure according to claim 1, wherein the positions of the surface electrode bumps of the semiconductor chips mounted on both sides of the film carrier tape are at the same position facing each other. 3. The semiconductor device according to claim 2, wherein one of the semiconductor chips is mirror-inverted and the other semiconductor chip is manufactured so that the surface electrode bumps face each other at the same position. 3. The integrated circuit package structure according to claim 1. 4. The integrated circuit package structure according to claim 1, wherein the semiconductor chip having bumps formed on the surface electrode is a semiconductor chip having bumps formed after forming bonding pads on the surface electrode. 5. A through hole is provided in the film carrier tape so that at least electrode portions of the metal foil conductors on both surfaces that are connected to surface bumps of the semiconductor chip are formed at the same position facing each other. The integrated circuit package structure according to claim 1, wherein: 6. The integrated circuit package structure according to claim 1, wherein a semiconductor chip is mounted on each of the front and back facing electrodes by bonding with an anisotropic resin having shrinkage characteristics.