JP2001210954A - Multilayer board - Google Patents
Multilayer boardInfo
- Publication number
- JP2001210954A JP2001210954A JP2000014762A JP2000014762A JP2001210954A JP 2001210954 A JP2001210954 A JP 2001210954A JP 2000014762 A JP2000014762 A JP 2000014762A JP 2000014762 A JP2000014762 A JP 2000014762A JP 2001210954 A JP2001210954 A JP 2001210954A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component mounting
- board
- substrates
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/877—
-
- H10W74/15—
-
- H10W90/724—
-
- H10W90/734—
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】
【課題】 高密度実装化を実現でき，放熱性に優れ，か
つ完成前の電気特性検査が可能な多層基板を提供する。
【解決手段】 多層基板７は，電子部品７０を搭載した
２つ以上の電子部品搭載用基板１，２を，電気導通路を
有する枠体６を介して積層している。２つ以上の電子部
品搭載用基板１，２にはそれぞれ，マザーボード実装面
側７１１と反対側７１２に，電子部品７０が搭載されて
いる。また，２つ以上の電子部品搭載用基板は，電子部
品の搭載面が互いに向かい合うように配置されていても
よい。
(57) [Problem] To provide a multi-layer substrate capable of realizing high-density mounting, having excellent heat dissipation, and capable of inspecting electrical characteristics before completion. A multilayer board (7) has two or more electronic component mounting boards (1) and (2) on which electronic components (70) are mounted via a frame (6) having an electrical conduction path. The electronic components 70 are mounted on the two or more electronic component mounting substrates 1 and 2, respectively, on the motherboard mounting surface side 711 and the opposite side 712. Further, the two or more electronic component mounting boards may be arranged so that the mounting surfaces of the electronic components face each other.
Description
【０００１】[0001]
【技術分野】本発明は，電子部品を搭載した多層基板に
関する。TECHNICAL FIELD The present invention relates to a multilayer board on which electronic components are mounted.
【０００２】[0002]
【従来技術】近年，電子部品搭載用基板の高密度実装化
に対応するべく，ビルドアップ基板が汎用されるように
なってきている。しかし，従来のビルドアップ多層基板
では，内部配線による発熱を外部放出することが困難で
ある。また，従来のビルドアップ多層基板は多数の熱履
歴が重ねられるため，基板に反りが発生しやすい。ま
た，製造途中の電子部品搭載用基板の電気特性を検査し
製品信頼性を確保したいという要望がある。2. Description of the Related Art In recent years, build-up boards have been widely used in order to cope with high-density mounting of electronic component mounting boards. However, in the conventional build-up multilayer substrate, it is difficult to externally release heat generated by the internal wiring. In addition, the conventional build-up multilayer substrate has a large number of thermal histories, so that the substrate is likely to be warped. In addition, there is a demand that the electrical characteristics of the electronic component mounting substrate being manufactured be inspected to ensure product reliability.
【０００３】[0003]
【解決しようとする課題】本発明は，高密度実装化を実
現でき，放熱性に優れ，かつ完成前の電気特性検査が可
能な多層基板を提供しようとするものである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a multilayer substrate which can realize high-density mounting, has excellent heat dissipation properties, and is capable of inspecting electrical characteristics before completion.
【０００４】[0004]
【課題の解決手段】まず，第１に，請求項１の発明のよ
うに，電子部品を搭載した２つ以上の電子部品搭載用基
板を，電気導通路を有する枠体を介して積層してなると
ともに，上記２つ以上の電子部品搭載用基板にはそれぞ
れ，マザーボード実装面側と反対側に，電子部品が搭載
されていることを特徴とする多層基板がある。First, two or more electronic component mounting substrates on which electronic components are mounted are laminated via a frame having an electrical conduction path, as in the first aspect of the present invention. In addition, there is a multilayer board characterized in that electronic components are mounted on the two or more electronic component mounting substrates on the opposite side of the motherboard mounting surface.
【０００５】本発明の多層基板においては，電子部品を
搭載した２つ以上の電子部品搭載用基板を積層している
ため，高密度実装化を実現できる。また，１つの電子部
品搭載用基板を多層基板とするよりも，電子部品搭載用
基板を２以上に分けて作製することになるため，１つの
電子部品搭載用基板の層数を少なくすることができる。
それゆえ，各電子部品搭載用基板をビルドアップ法によ
り作製する場合にも，熱履歴を少なくすることができ，
電子部品搭載用基板の反り発生を防止することができ
る。また，電子部品搭載用基板は電子部品を搭載した後
に積層される。そのため，積層前に各電子部品搭載用基
板について電気特性検査を行うことができ，導通不良品
の早期発見ができる。In the multilayer board of the present invention, since two or more electronic component mounting boards on which electronic components are mounted are stacked, high-density mounting can be realized. Further, since the electronic component mounting substrate is manufactured by dividing the substrate into two or more parts instead of using one electronic component mounting substrate as a multilayer substrate, the number of layers of one electronic component mounting substrate can be reduced. it can.
Therefore, even when each electronic component mounting substrate is manufactured by the build-up method, the heat history can be reduced,
Warpage of the electronic component mounting substrate can be prevented. The electronic component mounting board is stacked after the electronic components are mounted. Therefore, it is possible to perform an electrical characteristic test on each electronic component mounting substrate before lamination, and to quickly detect a defective conduction product.
【０００６】２つ以上の電子部品搭載用基板には，それ
ぞれマザーボード実装面側と反対側に電子部品が搭載さ
れている。このため，電子部品搭載用基板の間に電子部
品が内蔵されることになる。内蔵された電子部品は，電
子部品搭載用基板及び枠体に囲まれているため，外部衝
撃から保護される状態にある。そのため，内蔵された電
子部品は，樹脂などにより封止する必要はない。また，
封止しないことにより，電子部品搭載用基板の間に空気
が流れ，放熱性が高まる。また，それぞれの電子部品搭
載用基板の間は，枠体を介して積層されている。枠体は
ある程度の厚みを有するため，電子部品搭載用基板の間
に配置される電子部品用の空間を十分に確保できる。ま
た，電子部品搭載用基板の間の通気性，放熱性も優れて
いる。Electronic components are mounted on two or more electronic component mounting boards, respectively, on the side opposite to the motherboard mounting surface side. For this reason, the electronic components are embedded between the electronic component mounting boards. Since the built-in electronic components are surrounded by the electronic component mounting board and the frame, they are in a state of being protected from external impact. Therefore, it is not necessary to seal the built-in electronic components with resin or the like. Also,
By not sealing, air flows between the electronic component mounting substrates, and heat dissipation is improved. The electronic component mounting substrates are stacked via a frame. Since the frame has a certain thickness, a sufficient space for electronic components arranged between the electronic component mounting substrates can be secured. Also, the air permeability and heat radiation between the electronic component mounting boards are excellent.
【０００７】請求項３の発明のように，上記電子部品搭
載用基板には，向かい合う他の電子部品搭載用基板に搭
載された電子部品を収容するための凹部が設けられてい
ることが好ましい。これにより，多層基板の薄層化を実
現できる。Preferably, the electronic component mounting substrate is provided with a concave portion for accommodating the electronic components mounted on the other opposing electronic component mounting substrate. As a result, the thickness of the multilayer substrate can be reduced.
【０００８】請求項４の発明のように，マザーボード実
装面側の電子部品搭載用基板は，金属コア基板を設けて
いることが好ましい。マザーボード実装面側の電子部品
搭載用基板は，マザーボード実装面側と，その反対側に
配置されている他の電子部品搭載用基板との間に配置さ
れるため，外部に露出している面積が少なく，熱が蓄積
しやすい。そこで，マザーボード実装面側の電子部品搭
載用基板として，放熱性の高い金属コア基板を用いるこ
とにより，多層基板全体の放熱性が高くなる。According to a fourth aspect of the present invention, it is preferable that the electronic component mounting board on the mother board mounting surface side is provided with a metal core board. The electronic component mounting board on the motherboard mounting surface is located between the motherboard mounting surface and the other electronic component mounting board located on the opposite side, so the area exposed to the outside is limited. Low, heat easily accumulates. Therefore, by using a metal core substrate having a high heat dissipation property as the electronic component mounting board on the mother board mounting surface side, the heat dissipation property of the entire multilayer board is enhanced.
【０００９】請求項５の発明のように，互いに隣接する
電子部品搭載用基板の間には，通気性の空洞部が設けら
れていることが好ましい。これにより，多層基板の放熱
性が向上する。通気性の空洞部は，電子部品搭載用基板
の間に形成されており，かつ多層基板の外部と連通して
いる空洞部であって，半田ボール間の隙間を含み，放熱
性を高めている。なお，本多層基板は，少なくとも２つ
の電子部品搭載用基板を積層したものであるが，更に多
くの電子部品搭載用基板を積層することもできる。[0009] As in the invention of claim 5, it is preferable that a permeable cavity is provided between the electronic component mounting substrates adjacent to each other. This improves the heat dissipation of the multilayer substrate. The air-permeable cavity is formed between the electronic component mounting boards and communicates with the outside of the multi-layer substrate, including the gap between the solder balls, to enhance heat dissipation. . Although the multilayer board is formed by laminating at least two electronic component mounting boards, it is also possible to stack more electronic component mounting boards.
【００１０】第２に，請求項２の発明のように，電子部
品を搭載した２つ以上の電子部品搭載用基板を，電気導
通手段を介して積層してなるとともに，上記２つ以上の
電子部品搭載用基板は，電子部品の搭載面が互いに向か
い合うように配置されていることを特徴とする多層基板
がある。Secondly, two or more electronic component mounting substrates on which electronic components are mounted are laminated via an electric conduction means, and the two or more electronic components are mounted. The component mounting board includes a multi-layer board in which electronic component mounting surfaces are arranged so as to face each other.
【００１１】本多層基板も，上記第１の多層基板と同様
に，電子部品搭載用基板を積層した構造であるため，高
密度実装が実現でき，反り発生を防止できる。また各電
子部品搭載用基板の間を通じて熱を外部に放散させるこ
とができる。また，各電子部品搭載用基板の電気特性検
査を多層基板完成前に行うことができる。The multilayer substrate has a structure in which electronic component mounting substrates are laminated, similarly to the first multilayer substrate, so that high-density mounting can be realized and warpage can be prevented. Further, heat can be dissipated to the outside through between the electronic component mounting substrates. In addition, the electrical characteristic inspection of each electronic component mounting substrate can be performed before the completion of the multilayer substrate.
【００１２】また，本多層基板においては，電子部品の
搭載面が互いに向かい合うように電子部品搭載用基板を
配置しているため，互いに隣接する電子部品搭載用基板
に設けられた電子部品が，電子部品搭載用基板の間に内
蔵されることになる。内蔵された電子部品は，電子部品
搭載用基板により囲まれているため，外部衝撃から保護
される状態にある。そのため，内蔵された電子部品は，
樹脂などにより封止する必要はなく，これにより，電子
部品搭載用基板の間に空気が流れ，放熱性が高まる。Further, in the present multilayer board, since the electronic component mounting boards are arranged so that the mounting surfaces of the electronic components face each other, the electronic components provided on the electronic component mounting boards adjacent to each other are not electronically mounted. It will be built in between the component mounting boards. Since the built-in electronic components are surrounded by the electronic component mounting board, they are in a state of being protected from external impact. Therefore, the built-in electronic components
It is not necessary to seal with a resin or the like, so that air flows between the electronic component mounting substrates, and heat dissipation is improved.
【００１３】請求項６の発明のように，上記電気導通手
段は，電気導通路を有する枠体であることが好ましい。
枠体の厚みにより，電子部品搭載用基板の間に配置され
る電子部品用の空間を十分に確保できる。また，基板の
間の通気性も高くなる。電気導通路は，例えば，導体パ
ターン，スルーホールなどである。It is preferable that the electric conduction means is a frame having an electric conduction path.
Due to the thickness of the frame, a sufficient space for electronic components arranged between the electronic component mounting substrates can be secured. In addition, the air permeability between the substrates is increased. The electric conduction path is, for example, a conductor pattern, a through hole, or the like.
【００１４】また，請求項７の発明のように，上記電気
導通手段は，半田ボールであってもよく，枠体に設けら
れた半田ボールの間の空洞部を通じて電子部品周囲の空
洞部へと通気を確保できる。Further, as in the present invention, the electric conduction means may be a solder ball, and is connected to a cavity around the electronic component through a cavity between the solder balls provided on the frame. Ventilation can be secured.
【００１５】請求項８の発明のように，マザーボード実
装面側と反対側に配置された電子部品搭載用基板には，
ヒートスラグが設けられていることが好ましい。これに
より，放熱性が更に向上する。The electronic component mounting board disposed on the side opposite to the motherboard mounting surface as in the invention of claim 8 includes:
Preferably, a heat slag is provided. This further improves the heat dissipation.
【００１６】上記マザーボード実装面側と反対側に電子
部品を搭載した第１の多層基板と，電子部品の搭載面が
互いに向かい合うように電子部品を配置した第２の多層
基板とは，積層することができる。The first multilayer board on which the electronic components are mounted on the side opposite to the mother board mounting surface side and the second multilayer board on which the electronic components are arranged so that the mounting faces of the electronic components face each other are laminated. Can be.
【００１７】[0017]
【発明の実施の形態】実施形態例１ 本発明の実施形態に係る多層基板について，図１〜図２
を用いて説明する。本例の多層基板７は，図１に示すご
とく，電子部品搭載用基板１，２を，枠体６を介して積
層している。２つの電子部品搭載用基板１，２にはそれ
ぞれ，マザーボード実装面側７１１と反対側７１２に，
電子部品７０が搭載されている。枠体６は，電子部品搭
載用基板１，２の外周縁に沿って形成されている。枠体
６は，例えば，四角枠６０１（図２（ａ）），互いに平
行な２本の棒６０２（図２（ｂ）），２本のＬ字枠６０
３（図２（ｃ））から構成されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment A multilayer substrate according to an embodiment of the present invention is shown in FIGS.
This will be described with reference to FIG. As shown in FIG. 1, the multilayer board 7 of this embodiment has electronic component mounting boards 1 and 2 laminated via a frame 6. The two electronic component mounting substrates 1 and 2 have a motherboard mounting surface side 711 and an opposite side 712, respectively.
An electronic component 70 is mounted. The frame 6 is formed along the outer peripheral edge of the electronic component mounting substrates 1 and 2. The frame body 6 includes, for example, a square frame 601 (FIG. 2A), two bars 602 (FIG. 2B) parallel to each other, and two L-shaped frames 60.
3 (FIG. 2C).
【００１８】枠体６は，ガラスエポキシ基板の打抜き，
切断加工などにより形成される。枠体６には，図１に示
すごとく，２つの電子部品搭載用基板１，２の間の電気
導通を行うための導体パターン６１及びスルーホール６
２が設けられている。枠体６の導体パターン６１は，半
田ボール６５を介して，２つの電子部品搭載用基板１，
２の導体パターン７５と接合されている。２つの電子部
品搭載用基板１，２及び枠体６により囲まれた部分は，
通気性を有する空洞部４を形成している。多層基板７の
内部で発生した熱は，主として，空洞部４，及び半田ボ
ール６５の間を流れる空気により冷却される。The frame 6 is formed by punching a glass epoxy substrate,
It is formed by cutting or the like. As shown in FIG. 1, the frame 6 has a conductor pattern 61 and a through-hole 6 for electrically connecting the two electronic component mounting substrates 1 and 2 to each other.
2 are provided. The conductor pattern 61 of the frame 6 is connected to the two electronic component
And the second conductive pattern 75. The portion surrounded by the two electronic component mounting substrates 1 and 2 and the frame 6 is
A cavity 4 having air permeability is formed. The heat generated inside the multilayer substrate 7 is mainly cooled by the air flowing between the cavity 4 and the solder balls 65.
【００１９】電子部品７０の厚みは０．４ｍｍ，電子部
品搭載用の半田ボール７７の高さは０．０５ｍｍであ
る。また，枠体６の厚みは０．３〜０．４ｍｍであり，
その上下に接合されている半田ボール６５の高さは０．
１ｍｍである。したがって，空洞部４の厚みは，枠体６
の厚みと２つの半田ボール６５の高さとの合計と等しく
なり，空洞部４には電子部品７０を内蔵するために十分
な厚みを有するといえる。The thickness of the electronic component 70 is 0.4 mm, and the height of the solder ball 77 for mounting the electronic component is 0.05 mm. The thickness of the frame 6 is 0.3 to 0.4 mm.
The height of the solder ball 65 joined above and below is 0.
1 mm. Therefore, the thickness of the cavity 4 is
Is equal to the sum of the thickness of the solder balls 65 and the height of the two solder balls 65, and it can be said that the cavity 4 has a sufficient thickness for incorporating the electronic component 70.
【００２０】２つの電子部品搭載用基板１，２は，ガラ
スエポキシ樹脂などからなる絶縁基板７２と，電子部品
７０と電気的に接続している導体パターン７５及びスル
ーホール７６とが設けられている。電子部品７０と導体
パターン７５との間は半田ボール７７により接合されて
いる。電子部品搭載用基板１，２と電子部品７０との間
には，アンダーフィル樹脂７９が充填されている。マザ
ーボード実装面側７１１の電子部品搭載用基板１は，３
層の導体パターン７５を積層した構造を有し，そのマザ
ーボード実装面側７１１の導体パターン７５には，半田
ボール７８が接合されている。多層基板７のマザーボー
ド実装面側７１１は，マザーボード８に実装される。The two electronic component mounting substrates 1 and 2 are provided with an insulating substrate 72 made of glass epoxy resin or the like, a conductor pattern 75 electrically connected to the electronic component 70, and a through hole 76. . The electronic component 70 and the conductor pattern 75 are joined by solder balls 77. An underfill resin 79 is filled between the electronic component mounting substrates 1 and 2 and the electronic component 70. The electronic component mounting board 1 on the motherboard mounting surface side 711 is 3
It has a structure in which conductive patterns 75 of layers are stacked, and solder balls 78 are joined to the conductive patterns 75 on the mother board mounting surface side 711. The motherboard mounting surface side 711 of the multilayer substrate 7 is mounted on the motherboard 8.
【００２１】本例の作用及び効果について説明する。本
例の多層基板７は，電子部品７０を搭載した２つの電子
部品搭載用基板１，２を積層したものであるため，高密
度実装化を実現できる。また，各電子部品搭載用基板
１，２の層数を減少することができるため，熱履歴が減
少し，反りの発生を防止できる。また，電子部品搭載用
基板１，２は，電子部品７０を搭載した後に積層され
る。そのため，積層前に各電子部品搭載用基板１，２に
ついて電気特性検査を行うことができ，導通不良品の早
期発見ができる。The operation and effect of this embodiment will be described. The multilayer board 7 of this embodiment is formed by laminating two electronic component mounting boards 1 and 2 on which the electronic components 70 are mounted, so that high-density mounting can be realized. Further, since the number of layers of each of the electronic component mounting substrates 1 and 2 can be reduced, the heat history is reduced and the occurrence of warpage can be prevented. The electronic component mounting substrates 1 and 2 are stacked after the electronic component 70 is mounted. Therefore, electrical characteristics inspection can be performed on each of the electronic component mounting substrates 1 and 2 before lamination, and a defective conduction product can be detected early.
【００２２】また，２つの電子部品搭載用基板１，２に
は，それぞれマザーボード実装面側７１１と反対側７１
２に電子部品７０が搭載されている。このため，２つの
電子部品搭載用基板１，２の間に電子部品７０が内蔵さ
れることになる。内蔵された電子部品７０は，電子部品
搭載用基板１，２及び枠体６に囲まれ，外部衝撃から保
護される状態にある。そのため，内蔵された電子部品７
０は，樹脂などにより封止する必要はない。また，封止
しないことにより，電子部品搭載用基板１，２の間に空
気が流れ，放熱性が高まる。特に，図２（ｂ），（ｃ）
に示すごとく，枠体６が通気路６０を有する構造の場合
には，電子部品搭載用基板１，２の間の空気の流れが更
によくなり，放熱性が向上する。The two electronic component mounting boards 1 and 2 have a mother board mounting surface side 711 and an opposite side 71, respectively.
The electronic component 70 is mounted on 2. For this reason, the electronic component 70 is built in between the two electronic component mounting substrates 1 and 2. The built-in electronic component 70 is surrounded by the electronic component mounting substrates 1 and 2 and the frame 6, and is in a state of being protected from external impact. Therefore, the built-in electronic components 7
0 does not need to be sealed with a resin or the like. In addition, by not sealing, air flows between the electronic component mounting substrates 1 and 2 and heat dissipation is enhanced. In particular, FIGS.
As shown in (1), when the frame body 6 has a structure having the ventilation path 60, the flow of air between the electronic component mounting substrates 1 and 2 is further improved, and the heat dissipation is improved.
【００２３】また，それぞれの電子部品搭載用基板１，
２は，枠体６を介して，電気的に接続されつつ積層され
ている。枠体６は上記のごとくある程度の厚みを有する
ため，電子部品搭載用基板１，２の間に配置される電子
部品用の空間を十分に確保できる。また，電子部品搭載
用基板１，２の間の通気性も高い。Each of the electronic component mounting substrates 1 and 2
2 are laminated while being electrically connected via a frame 6. Since the frame 6 has a certain thickness as described above, a sufficient space for electronic components disposed between the electronic component mounting substrates 1 and 2 can be secured. In addition, the air permeability between the electronic component mounting substrates 1 and 2 is high.
【００２４】実施形態例２ 本例の多層基板においては，図３に示すごとく，２つの
電子部品搭載用基板１，２が，電子部品７０の搭載面７
１３が互いに向かい合うように配置されている。電子部
品搭載用基板１，２には，向かい合う他の電子部品搭載
用基板２，１に搭載された電子部品７０を収容するため
の凹部７１が設けられている。Embodiment 2 In the multilayer board of this embodiment, as shown in FIG. 3, two electronic component mounting substrates 1 and 2 are mounted on the mounting surface 7 of the electronic component 70.
13 are arranged so as to face each other. The electronic component mounting substrates 1 and 2 are provided with a concave portion 71 for accommodating the electronic component 70 mounted on the other opposing electronic component mounting substrates 2 and 1.
【００２５】マザーボード実装面側７１１の電子部品搭
載用基板１は，銅からなる金属コア基板７３を設けてい
る。金属コア基板７３の表面及びスルーホール７６の内
壁は，図示しない絶縁性樹脂により被覆されている。ス
ルーホール７６の中には，銅などの導電材が充填されて
いる。The electronic component mounting board 1 on the mother board mounting surface side 711 is provided with a metal core board 73 made of copper. The surface of the metal core substrate 73 and the inner wall of the through hole 76 are covered with an insulating resin (not shown). The through holes 76 are filled with a conductive material such as copper.
【００２６】マザーボード実装面側７１１の電子部品搭
載用基板１には，マザーボード接合用の半田ボール７８
が接合されている。マザーボード実装面側７１１と反対
側７１２に配置された電子部品搭載用基板２は，ガラス
エポキシ基板からなり，その表面には銅からなるヒート
スラグ５が設けられている。ヒートスラグ５は，電子部
品搭載用基板２における凹部７１の底部を構成してい
る。The electronic component mounting substrate 1 on the mother board mounting surface side 711 has solder balls 78 for mother board bonding.
Are joined. The electronic component mounting substrate 2 disposed on the opposite side 712 from the motherboard mounting surface 711 is made of a glass epoxy substrate, and the surface thereof is provided with a heat slug 5 made of copper. The heat slug 5 forms the bottom of the concave portion 71 in the electronic component mounting board 2.
【００２７】凹部７１内に収容された電子部品７０は，
向かい合う電子部品搭載用基板に設けられた凹部７１の
底部に対して，銀ペースト７４により固定されている。
電子部品搭載用基板１，２のいずれにも，導体パターン
７５及びスルーホール７６が設けられている。２つの電
子部品搭載用基板１，２の間は，接続用の半田ボール６
０により電気的導通を確保して接続されている。２つの
電子部品搭載用基板１，２により囲まれた部分は，通気
性を有する空洞部４を形成している。多層基板７の内部
で発生した熱は，主として，空洞部４，及び半田ボール
６０の間を流れる空気により冷却される。電子部品７０
を固定している銀ペースト７４と，電子部品搭載用基板
接続用の半田ボール６０とは，同時に溶融接合されてい
ることから，電子部品７０は半田ボール６０の凝集によ
って凹部７１の底部に対して確実に固定される。The electronic component 70 housed in the recess 71 is
The bottom of the concave portion 71 provided on the opposing electronic component mounting substrate is fixed with a silver paste 74.
Each of the electronic component mounting substrates 1 and 2 is provided with a conductor pattern 75 and a through hole 76. Solder balls 6 for connection are provided between the two electronic component mounting substrates 1 and 2.
0 is connected while ensuring electrical continuity. A portion surrounded by the two electronic component mounting substrates 1 and 2 forms a cavity 4 having air permeability. The heat generated inside the multilayer substrate 7 is mainly cooled by the air flowing between the cavities 4 and the solder balls 60. Electronic component 70
Since the silver paste 74 for fixing the electronic component 70 and the solder ball 60 for connecting the electronic component mounting substrate are simultaneously melt-bonded, the electronic component 70 is brought into contact with the bottom of the concave portion 71 by agglomeration of the solder ball 60. Securely fixed.
【００２８】電子部品搭載用基板１，２には，導体パタ
ーン７５及びスルーホール７６が設けられている。電子
部品搭載用基板１，２と電子部品７０との間にはアンダ
ーフィル樹脂７９が充填されている。また，電子部品搭
載用基板１，２には，電子部品７０の他に，チップコン
デンサ７０１も搭載されている。The electronic component mounting boards 1 and 2 are provided with a conductor pattern 75 and a through hole 76. An underfill resin 79 is filled between the electronic component mounting substrates 1 and 2 and the electronic component 70. In addition to the electronic component 70, a chip capacitor 701 is also mounted on the electronic component mounting substrates 1 and 2.
【００２９】本例の多層基板７は，２つの電子部品搭載
用基板１，２を積層した構造であるため，高密度実装が
実現でき，また各電子部品搭載用基板１，２の間を通じ
て熱を外部に放散させることができる。また，各電子部
品搭載用基板の電気特性検査を製品完成前に行うことが
できる。The multilayer board 7 of this embodiment has a structure in which two electronic component mounting substrates 1 and 2 are stacked, so that high-density mounting can be realized, and heat is passed between the electronic component mounting substrates 1 and 2. Can be diffused to the outside. In addition, it is possible to inspect the electrical characteristics of each electronic component mounting board before completing the product.
【００３０】また，電子部品の搭載面７１３が互いに向
かい合うように電子部品搭載用基板１，２を配置してい
るため，互いに隣接する電子部品搭載用基板１，２に設
けられた電子部品７０が，電子部品搭載用基板１，２の
間に内蔵されることになる。内蔵された電子部品７０
は，電子部品搭載用基板１，２及び接続用の半田ボール
６０に囲まれているため，外部衝撃から保護される状態
にある。そのため，内蔵された電子部品は，樹脂などに
より封止する必要はなく，これにより，電子部品搭載用
基板１，２の間に空気が流れ，放熱性が高まる。Since the electronic component mounting substrates 1 and 2 are arranged so that the mounting surfaces 713 of the electronic components face each other, the electronic components 70 provided on the electronic component mounting substrates 1 and 2 adjacent to each other can be removed. , Between the electronic component mounting substrates 1 and 2. Built-in electronic components 70
Are protected from external impacts because they are surrounded by the electronic component mounting substrates 1 and 2 and the connection solder balls 60. Therefore, the built-in electronic components do not need to be sealed with a resin or the like, whereby air flows between the electronic component mounting substrates 1 and 2 and heat dissipation is improved.
【００３１】また，電子部品搭載用基板２の表面に接着
されたヒートスラグ５は，電子部品収容用の凹部７１の
底部を構成していることから，電子部品７０は銀ペース
ト７４によりヒートスラグ５に対して直接接着されるこ
とになる。このため，電子部品７０は，銀ペースト７４
を通じてヒートスラグ５に熱を逃がすことができ，放熱
性が更に向上する。Since the heat slag 5 bonded to the surface of the electronic component mounting substrate 2 forms the bottom of the concave portion 71 for accommodating the electronic component, the electronic component 70 is formed of the heat slag 5 by the silver paste 74. Will be directly adhered to. Therefore, the electronic component 70 is made of silver paste 74.
Through the heat, heat can be released to the heat slag 5, and the heat dissipation is further improved.
【００３２】実施形態例３ 本例の多層基板は，図４に示すごとく，３つの電子部品
搭載用基板１，２，３を，枠体６を介して積層したもの
である。電子部品搭載用基板１，２，３は，いずれもマ
ザーボード実装面側７１１と反対側７１２に，電子部品
７０を搭載している。Embodiment 3 As shown in FIG. 4, the multilayer board of this embodiment is formed by stacking three electronic component mounting boards 1, 2, 3 with a frame 6 interposed therebetween. Each of the electronic component mounting boards 1, 2, and 3 has the electronic component 70 mounted on the side 712 opposite to the mother board mounting surface 711.
【００３３】マザーボード実装面側７１１に配置された
電子部品搭載用基板１と，中央層に配置された電子部品
搭載用基板２は，実施形態例１と同様の構成である。マ
ザーボード実装面側７１１と反対側７１２に配置された
電子部品搭載用基板３は，中央層に配置された電子部品
搭載用基板２と同様の構成である。電子部品搭載用基板
１，２の間，電子部品搭載用基板２，３の間には，空洞
部４が設けられている。各電子部品搭載用基板１，２，
３の間は，枠体６により電気的に接続している。その他
は，実施形態例１と同様である。本例においては，３つ
の電子部品搭載用基板１，２，３を枠体６を介して積層
しているため，より高密度実装を図ることができる。そ
の他，実施形態例１と同様の効果を得ることができる。The electronic component mounting board 1 arranged on the mother board mounting surface side 711 and the electronic component mounting board 2 arranged on the central layer have the same configuration as in the first embodiment. The electronic component mounting board 3 arranged on the opposite side 712 from the motherboard mounting surface 711 has the same configuration as the electronic component mounting board 2 arranged on the central layer. A cavity 4 is provided between the electronic component mounting substrates 1 and 2 and between the electronic component mounting substrates 2 and 3. Each electronic component mounting board 1,2,
3 are electrically connected by a frame 6. Other configurations are the same as those of the first embodiment. In this example, since the three electronic component mounting substrates 1, 2, 3 are laminated via the frame 6, higher density mounting can be achieved. In addition, the same effects as those of the first embodiment can be obtained.
【００３４】実施形態例４ 本例の多層基板７は，図５に示すごとく，４つの電子部
品搭載用基板１，２，３，４を積層したものである。多
層基板７のマザーボード実装側７１１に配置された２つ
の電子部品搭載用基板１，２は実施形態例１の多層基板
と同様の構成である。マザーボード実装面側７１１と反
対側７１２に配置された電子部品搭載用基板３，４は，
実施形態例２の多層基板と同様の構成である。Embodiment 4 As shown in FIG. 5, the multilayer board 7 of this embodiment is formed by laminating four electronic component mounting boards 1, 2, 3, and 4. The two electronic component mounting substrates 1 and 2 arranged on the motherboard mounting side 711 of the multilayer substrate 7 have the same configuration as the multilayer substrate of the first embodiment. The electronic component mounting substrates 3 and 4 arranged on the motherboard mounting surface side 711 and the opposite side 712 are:
It has the same configuration as the multilayer substrate of the second embodiment.
【００３５】電子部品搭載用基板１，２には，マザーボ
ード実装面側７１１と反対側７１２に電子部品７０が搭
載されている。電子部品搭載用基板３，４には，電子部
品７０が互いに向かい合うように配置されている。電子
部品搭載用基板１，２，３の間は，導体パターン６１及
びスルーホール６２を有する枠体６を介して，電気的に
接続されている。また，電子部品搭載用基板３，４の間
は，半田ボール６０を介して電気的に接続されている。
各電子部品搭載用基板１〜４の間には，空洞部４が設け
られている。その他は，上記実施形態例１，２と同様で
ある。本例の多層基板７は，４つの電子部品搭載用基板
１〜４を積層したものであるため，更なる高密度実装化
を実現できる。その他，実施形態例１，２と同様の効果
を発揮できる。The electronic components 70 are mounted on the electronic component mounting substrates 1 and 2 on the side 712 opposite to the mother board mounting surface 711. Electronic components 70 are arranged on the electronic component mounting substrates 3 and 4 so as to face each other. The electronic component mounting boards 1, 2, and 3 are electrically connected via a frame 6 having a conductor pattern 61 and a through hole 62. The electronic component mounting substrates 3 and 4 are electrically connected via solder balls 60.
A cavity 4 is provided between the electronic component mounting substrates 1 to 4. Other configurations are the same as those of the first and second embodiments. The multilayer board 7 of the present embodiment is obtained by laminating four electronic component mounting boards 1 to 4, so that a higher density mounting can be realized. In addition, the same effects as in the first and second embodiments can be exerted.
【００３６】[0036]
【発明の効果】本発明によれば，高密度実装化を実現で
き，放熱性に優れ，かつ完成前の電気特性検査が可能な
多層基板を提供することができる。According to the present invention, it is possible to provide a multilayer substrate which can realize high-density mounting, has excellent heat dissipation, and can perform an electrical characteristic inspection before completion.
【図面の簡単な説明】[Brief description of the drawings]
【図１】実施形態例１の多層基板の断面図。FIG. 1 is a sectional view of a multilayer substrate according to a first embodiment.
【図２】実施形態例１における，枠体の平面図。FIG. 2 is a plan view of a frame according to the first embodiment.
【図３】実施形態例２の多層基板の断面図。FIG. 3 is a sectional view of a multilayer substrate according to a second embodiment.
【図４】実施形態例３の多層基板の断面図。FIG. 4 is a cross-sectional view of a multilayer substrate according to a third embodiment.
【図５】実施形態例４の多層基板の断面図。FIG. 5 is a cross-sectional view of a multilayer substrate according to a fourth embodiment.
１，２，３，４．．．電子部品搭載用基板， ４．．．空洞部， ５．．．ヒートスラグ， ６．．．枠体， ６０，６５，７７，７８．．．半田ボール， ６１，７５．．．導体パターン， ６２，７６．．．スルーホール， ７．．．多層基板， ７０．．．電子部品， ７１．．．凹部， ７２．．．絶縁基板， ７３．．．金属コア基板， ７４．．．銀ペースト， ７９．．．アンダーフィル樹脂， ７１１．．．マザーボード実装面側， ７１２．．．マザーボード実装面側と反対側， ７１３．．．搭載面， ８．．．マザーボード， 1,2,3,4. . . 3. electronic component mounting board; . . Cavity, 5. . . Heat slag, 6. . . Frame, 60, 65, 77, 78. . . Solder balls, 61, 75. . . Conductor pattern, 62, 76. . . 6. through-hole, . . 70. multilayer substrate, . . Electronic components, 71. . . Recess, 72. . . Insulating substrate, 73. . . Metal core substrate, 74. . . Silver paste, 79. . . Underfill resin, 711. . . 712. Motherboard mounting surface side . . 713. Side opposite to motherboard mounting surface side . . 7. mounting surface . . Motherboard,
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｋ 1/02 Ｈ０５Ｋ 1/18 Ｒ 1/14 Ｈ０１Ｌ 25/08 Ｚ 1/18 (72)発明者 寺崎 達 東京都品川区北品川６丁目７番35号 ソニ ー株式会社内 Ｆターム(参考） 5E336 AA07 AA08 AA12 AA13 BB03 BB19 BC02 BC16 BC26 CC32 CC36 CC44 CC53 DD24 DD32 EE01 EE05 GG03 GG05 5E338 AA03 AA15 BB03 BB05 BB13 BB19 BB72 EE02 EE32 5E344 AA01 AA16 AA22 AA23 AA26 AA28 BB02 BB03 BB06 BB09 CC05 CD18 CD27 DD03 EE02 EE21 5E346 AA12 AA15 AA22 AA32 AA51 AA60 BB20 CC04 CC09 EE43 FF45 GG25 HH17 HH22 HH25Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (Reference) H05K 1/02 H05K 1/18 R 1/14 H01L 25/08 Z 1/18 (72) Inventor Tatsu Terasaki Shinagawa, Tokyo 6-35, Kita-Shinagawa, Ward Sony Corporation F-term (reference) 5E336 AA07 AA08 AA12 AA13 BB03 BB19 BC02 BC16 BC26 CC32 CC36 CC44 CC53 DD24 DD32 EE01 EE05 GG03 GG05 5E338 AA03 AA15 BB03 BB05 5 AA01 AA16 AA22 AA23 AA26 AA28 BB02 BB03 BB06 BB09 CC05 CD18 CD27 DD03 EE02 EE21 5E346 AA12 AA15 AA22 AA32 AA51 AA60 BB20 CC04 CC09 EE43 FF45 GG25 HH17 HH22 HH25
Claims (8)
搭載用基板を，電気導通路を有する枠体を介して積層し
てなるとともに，上記２つ以上の電子部品搭載用基板に
はそれぞれ，マザーボード実装面側と反対側に，電子部
品が搭載されていることを特徴とする多層基板。An electronic component mounting board on which electronic components are mounted is laminated via a frame having an electrical conduction path, and the two or more electronic component mounting boards are respectively provided on the two or more electronic component mounting boards. A multi-layer board on which electronic components are mounted on the side opposite to the motherboard mounting surface.
搭載用基板を，電気導通手段を介して積層してなるとと
もに，上記２つ以上の電子部品搭載用基板は，電子部品
の搭載面が互いに向かい合うように配置されていること
を特徴とする多層基板。2. An electronic component mounting board comprising electronic components mounted thereon, wherein two or more electronic component mounting substrates are laminated via an electrical conduction means, and said two or more electronic component mounting substrates are provided on an electronic component mounting surface. Are arranged so as to face each other.
品搭載用基板には，向かい合う他の電子部品搭載用基板
に搭載された電子部品を収容するための凹部が設けられ
ていることを特徴とする多層基板。3. The electronic component mounting board according to claim 1, wherein the electronic component mounting board is provided with a recess for accommodating an electronic component mounted on another facing electronic component mounting board. Multi-layer substrate.
ド実装面側の電子部品搭載用基板は，金属コア基板を設
けていることを特徴とする多層基板。4. The multilayer board according to claim 1, wherein the electronic component mounting board on the mother board mounting surface side is provided with a metal core board.
する電子部品搭載用基板の間には，通気性の空洞部が設
けられていることを特徴とする多層基板。5. The multilayer substrate according to claim 1, wherein a gas-permeable cavity is provided between adjacent electronic component mounting substrates.
は，電気導通路を有する枠体であることを特徴とする多
層基板。6. The multilayer substrate according to claim 2, wherein said electric conduction means is a frame having an electric conduction path.
は，半田ボールであることを特徴とする多層基板。7. The multilayer board according to claim 2, wherein said electric conduction means is a solder ball.
側と反対側に配置された電子部品搭載用基板には，ヒー
トスラグが設けられていることを特徴とする多層基板。8. The multilayer board according to claim 2, wherein the electronic component mounting board disposed on the side opposite to the mother board mounting surface side is provided with a heat slug.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000014762A JP2001210954A (en) | 2000-01-24 | 2000-01-24 | Multilayer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000014762A JP2001210954A (en) | 2000-01-24 | 2000-01-24 | Multilayer board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001210954A true JP2001210954A (en) | 2001-08-03 |
Family
ID=18542168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000014762A Pending JP2001210954A (en) | 2000-01-24 | 2000-01-24 | Multilayer board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001210954A (en) |
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| JP2003060353A (en) * | 2001-08-09 | 2003-02-28 | Murata Mfg Co Ltd | Electronic component unit and manufacturing method therefor |
| JP2003086755A (en) * | 2001-09-11 | 2003-03-20 | Sony Corp | Hybrid module |
| JP2003101080A (en) * | 2001-09-26 | 2003-04-04 | Ibiden Co Ltd | Substrate for mounting IC chips |
| WO2003071603A1 (en) * | 2002-02-19 | 2003-08-28 | Matsushita Electric Industrial Co., Ltd. | Module part |
| JP2004165318A (en) * | 2002-11-12 | 2004-06-10 | Ibiden Co Ltd | Multilayer printed wiring board |
| JP2004172425A (en) * | 2002-11-21 | 2004-06-17 | Hitachi Ltd | Electronic equipment |
| JP2005136380A (en) * | 2003-10-06 | 2005-05-26 | Elpida Memory Inc | Semiconductor component mounting structure and semiconductor device |
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