JP2001210548A - Composite dry metal film capacitor - Google Patents
Composite dry metal film capacitorInfo
- Publication number
- JP2001210548A JP2001210548A JP2000013837A JP2000013837A JP2001210548A JP 2001210548 A JP2001210548 A JP 2001210548A JP 2000013837 A JP2000013837 A JP 2000013837A JP 2000013837 A JP2000013837 A JP 2000013837A JP 2001210548 A JP2001210548 A JP 2001210548A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- resin case
- electronic component
- capacitor element
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 59
- 239000002131 composite material Substances 0.000 title claims abstract description 16
- 239000002184 metal Substances 0.000 title claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 76
- 239000011347 resin Substances 0.000 claims abstract description 76
- 239000011104 metalized film Substances 0.000 claims abstract description 19
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000005192 partition Methods 0.000 claims description 17
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 abstract description 6
- 238000000638 solvent extraction Methods 0.000 abstract 2
- 239000010408 film Substances 0.000 abstract 1
- 238000007751 thermal spraying Methods 0.000 abstract 1
- 238000004804 winding Methods 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、スナバ回路などに
使用される複合型乾式金属化フィルムコンデンサに関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite dry metallized film capacitor used for a snubber circuit or the like.
【０００２】[0002]
【従来の技術】従来、この種の複合型乾式金属化フィル
ムコンデンサは、図１１に示したようなものが知られて
おり、たとえば、実開平２−７３７２２号公報に記載さ
れている。図１１には、コンデンサ素子１とダイオード
１１とを直列接続し、該ダイオード１１と外部引出用端
子１２との間に放熱シート１３を介在させ、固定用ビス
１６で固定し、さらに放熱シート１３を延伸し、上記ダ
イオードと上記素子との間に配置して絶縁性を保ち、開
口部が同一高さである樹脂ケース１４に収納し絶縁性樹
脂１５を充填、硬化させた構成が記載されている。2. Description of the Related Art Conventionally, a composite type dry metallized film capacitor of this type is known as shown in FIG. 11 and is described in, for example, Japanese Utility Model Laid-Open No. 2-73722. In FIG. 11, the capacitor element 1 and the diode 11 are connected in series, a heat radiating sheet 13 is interposed between the diode 11 and the external lead-out terminal 12, fixed with fixing screws 16, and the heat radiating sheet 13 is further fixed. A configuration is described in which the insulating resin is stretched, placed between the diode and the element to maintain insulation, housed in a resin case 14 having the same height as the opening, filled with an insulating resin 15, and cured. .
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記の
構成では、樹脂ケースの開口部付近に端子位置決め部を
設けていないので、治具を用いてコンデンサ素子および
ダイオードと外部引出用端子とをはんだ付けし、樹脂ケ
ースに収納後、端子間ピッチを調整して、絶縁性樹脂を
充填、硬化していた。しかし、このような方式では、端
子間ピッチのバラツキが大きく、また、コンデンサ素子
とダイオードとの間に介挿した放熱シートがずれて固定
用ビスとコンデンサ素子とが短絡するなどの問題があ
り、端子間ピッチの精度を向上させるとともに、コンデ
ンサ素子とダイオードとの間の絶縁性を確保するための
手段が要求されていた。However, in the above configuration, since the terminal positioning portion is not provided near the opening of the resin case, the capacitor element and the diode are soldered to the external lead terminal using a jig. Then, after being housed in the resin case, the pitch between the terminals was adjusted, and the insulating resin was filled and cured. However, in such a method, there is a problem that a variation in a pitch between terminals is large, a heat radiation sheet inserted between the capacitor element and the diode is displaced, and the fixing screw and the capacitor element are short-circuited. Means have been required to improve the accuracy of the terminal pitch and to ensure insulation between the capacitor element and the diode.
【０００４】[0004]
【課題を解決するための手段】本発明は、上記の課題を
解決するためになされたもので、コンデンサ素子と電子
部品とを樹脂ケースに設けられた仕切板により分離して
該ケースに収納し、第１、第２の端子に形成した切欠き
部を上記ケースの開口部端面に設けられた端子位置決め
用の凹部にそれぞれ嵌合し、また、上記切欠き部と樹脂
ケースの凹部との嵌合部を溶着固定することにより、品
質特性が良好で、端子間のピッチ精度が高い複合型乾式
金属化フィルムコンデンサを提供しようとするものであ
る。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and separates a capacitor element and an electronic component from each other by a partition plate provided in a resin case, and stores the separated capacitor element and the electronic component in the case. The notches formed in the first and second terminals are respectively fitted into terminal positioning recesses provided on the end face of the opening of the case, and the notches are fitted into the recesses of the resin case. It is an object of the present invention to provide a composite dry-type metallized film capacitor having good quality characteristics and high terminal pitch accuracy by welding and fixing the joint portion.
【０００５】すなわち、一対の金属化フィルムを重ね合
せて巻回し、巻回端面に金属を溶射してなるコンデンサ
素子１と他の電子部品２とを外部引出用リード線８で接
続し、樹脂ケース３に収納し、絶縁性樹脂７を充填、硬
化してなる複合型乾式金属化フィルムコンデンサにおい
て、樹脂ケース３の内面に仕切板３ｃ、開口部端面に端
子位置決め部３ａ、３ｂを設け、コンデンサ素子１と電
子部品２とを仕切り板３を隔てて収納するとともに、電
子部品２と端子６との間に放熱シート４を介在させ、上
記の端子位置決め部に端子を嵌合してなることを特徴と
している。That is, a pair of metallized films are superposed and wound, and a capacitor element 1 formed by spraying a metal on the wound end surface and another electronic component 2 are connected by an external lead wire 8 to form a resin case. 3, a composite type dry metallized film capacitor which is filled with an insulating resin 7 and cured, provided with a partition plate 3c on the inner surface of the resin case 3 and terminal positioning portions 3a and 3b on the end surface of the opening. The electronic component 1 and the electronic component 2 are housed with the partition plate 3 therebetween, and the heat radiation sheet 4 is interposed between the electronic component 2 and the terminal 6 to fit the terminal into the terminal positioning portion. And
【０００６】また、樹脂ケースの位置決め部が凹状であ
り、該凹部と嵌合する切欠き部を端子に形成し、端子を
固定したことを特徴としている。あるいは、樹脂ケース
の位置決め部が凸状であり、該凸部と嵌合する穴を端子
に形成し、端子を固定したことを特徴としている。さら
に、樹脂ケース３の端子位置決め部を溶融し、端子に固
着させたことを特徴としている。Further, the positioning portion of the resin case is concave, a cutout portion to be fitted in the concave portion is formed in the terminal, and the terminal is fixed. Alternatively, it is characterized in that the positioning portion of the resin case is convex, a hole that fits into the convex portion is formed in the terminal, and the terminal is fixed. Further, the terminal positioning portion of the resin case 3 is melted and fixed to the terminal.
【０００７】[0007]
【発明の実施の形態】電子部品に直列接続したコンデン
サ素子より外部引出リード線を引出し、該部品と第２の
端子との間に放熱シートを介在させ、コンデンサ素子と
電子部品とを樹脂ケースに設けられた仕切板にて分離し
て、収納する。上記仕切板を配することにより、コンデ
ンサ素子と電子部品との短絡を確実に防止することがで
き、また、放熱シートを介在させることにより、第２の
端子へ放熱させることができる。さらに、樹脂ケースの
開口部端面に凹状または凸状に形成された端子位置決め
部を設ける。凹状の端子位置決め部には端子の切欠き部
を嵌合させ、凸状の端子位置決め部には端子の貫通穴を
嵌合させることにより、樹脂ケースの開口部端面に端子
が確実に嵌合されるので、端子間ピッチ精度の高いコン
デンサを得ることができる。BEST MODE FOR CARRYING OUT THE INVENTION An external lead wire is drawn out of a capacitor element connected in series to an electronic component, a heat dissipation sheet is interposed between the component and a second terminal, and the capacitor element and the electronic component are mounted in a resin case. Separated by the provided partition plate and stored. By arranging the partition plate, a short circuit between the capacitor element and the electronic component can be reliably prevented, and heat can be radiated to the second terminal by interposing a heat radiation sheet. Further, a terminal positioning portion formed in a concave or convex shape is provided on the end face of the opening of the resin case. By fitting the notch of the terminal to the concave terminal positioning part and fitting the through hole of the terminal to the convex terminal positioning part, the terminal is securely fitted to the end face of the opening of the resin case. Therefore, a capacitor with high terminal pitch accuracy can be obtained.
【０００８】[0008]
【実施例】〔実施例１〕図１は本発明の複合型乾式金属
化フィルムコンデンサの一実施例の図面で、（ａ）は平
面図、（ｂ）は縦断面図、（ｃ）は要部拡大の斜視図で
あり、図３は樹脂ケースの一実施例の図面で、（ａ）は
平面図、（ｂ）は縦断面図、（ｃ）は側面図、図４はコ
ンデンサ素子に接合される第１の端子の一実施例の図面
で、（ａ）は平面図、（ｂ）は正面図、（ｃ）は側面
図、図５は電子部品と接合される第２の端子の一実施例
の図面で、（ａ）は平面図、（ｂ）は正面図、（ｃ）は
側面図である。[Embodiment 1] FIGS. 1A and 1B are drawings of an embodiment of a composite type dry metallized film capacitor according to the present invention, in which FIG. 1A is a plan view, FIG. 3 is a drawing of an embodiment of a resin case, (a) is a plan view, (b) is a longitudinal sectional view, (c) is a side view, and FIG. 4 is bonded to a capacitor element. 5A is a plan view, FIG. 5B is a front view, FIG. 5C is a side view, and FIG. 5 is a view of a second terminal to be joined to an electronic component. In the drawings of the embodiment, (a) is a plan view, (b) is a front view, and (c) is a side view.
【０００９】以下、本発明の一実施例について、図面を
参照しながら説明する。図１において、１はコンデンサ
素子で、アルミニウム、亜鉛などを蒸着した一対の金属
化フィルムを重ね合せて巻回し、その巻回端面に亜鉛ま
たははんだなどの金属を溶射して電極引出部１ａ、１ｂ
が形成されている。２はダイオードなどからなる電子部
品で、２ａ、２ｂは電子部品より導出された引出線であ
る。４は放熱性のよいシリコンゴムなどの放熱シート、
５、６は銅、真鍮などに錫鍍金を施した第１、第２の端
子で、５ａ、６ａは樹脂ケースに設けられた凹部に嵌合
する切欠き部、５ｂ、６ｂは外部接続用穴である。ま
た、３は樹脂ケース、７はエポキシ樹脂、ウレタン樹脂
などの熱硬化性樹脂からなる絶縁性樹脂、８は外部引出
用リード線、９は固定用ビスである。図３に示す樹脂ケ
ース３は、ポリブチレンテレフタレート、ポリカーボネ
ートなどの絶縁性樹脂よりなり、３ａ、３ｂは開口部端
面に設けられた凹部、３ｃは内面に設けられた仕切板で
ある。An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 1 denotes a capacitor element, which is formed by laminating a pair of metallized films on which aluminum, zinc, or the like is vapor-deposited, and spraying a metal such as zinc or solder on the wound end surface to form electrode lead portions 1a, 1b.
Are formed. Reference numeral 2 denotes an electronic component such as a diode, and reference numerals 2a and 2b denote lead lines derived from the electronic component. 4 is a heat radiating sheet made of silicon rubber having good heat radiating properties,
Reference numerals 5 and 6 denote first and second terminals formed by tinning copper, brass, or the like, and reference numerals 5a and 6a denote cutouts that fit into recesses provided in a resin case, and reference numerals 5b and 6b denote external connection holes. It is. Reference numeral 3 denotes a resin case, 7 denotes an insulating resin made of a thermosetting resin such as an epoxy resin or a urethane resin, 8 denotes an external lead wire, and 9 denotes a fixing screw. The resin case 3 shown in FIG. 3 is made of an insulating resin such as polybutylene terephthalate or polycarbonate, and 3a and 3b are concave portions provided on the end surface of the opening, and 3c is a partition plate provided on the inner surface.
【００１０】図４に示す第１の端子５と外部引出用リー
ド線８とをコンデンサ素子１の電極引出部１ａ、１ｂに
それぞれ接合し、次に図５に示す第２の端子６のネジ部
６ｃを用いて、電子部品２に放熱シート４を介して第２
の端子６を固定用ビス９にて取付ける。さらに電子部品
２の引出線２ａ、２ｂをコンデンサ素子１の電極引出部
１ｂ、第２の端子６とにそれぞれ接合し、コンデンサ素
子１と電子部品２とを樹脂ケース３の仕切板３ｃにより
分離し、収納する。そして、第１、第２の端子５、６に
形成した切欠き部５ａ、６ａを樹脂ケース３の開口部端
面の凹部３ａ、３ｂにそれぞれ嵌合させ、絶縁性樹脂７
を充填、硬化して完成させる。The first terminal 5 and the external lead wire 8 shown in FIG. 4 are joined to the electrode lead portions 1a and 1b of the capacitor element 1, respectively, and then the screw portion of the second terminal 6 shown in FIG. 6c to the electronic component 2 via the heat dissipation sheet 4
Terminal 6 is fixed with a fixing screw 9. Further, the lead wires 2a and 2b of the electronic component 2 are joined to the electrode lead portion 1b and the second terminal 6 of the capacitor element 1, respectively, and the capacitor element 1 and the electronic component 2 are separated by the partition plate 3c of the resin case 3. , Store. Then, the notches 5a, 6a formed in the first and second terminals 5, 6 are fitted into the recesses 3a, 3b on the end face of the opening of the resin case 3, respectively.
Fill and cure to complete.
【００１１】上記構成によれば、電子部品と第２の端子
との間に放熱シートを介在させているので、電子部品と
第２の端子との絶縁ならびに第２の端子への放熱作用の
向上を図ることができる。また、樹脂ケースに仕切板を
設け、コンデンサ素子と電子部品とを仕切板により分離
しているので、電子部品と第２の端子とを固定している
固定用ビスと、コンデンサ素子の電極引出部とが完全に
分離でき、短絡を防止することができ、品質特性の安定
化が図れる。さらに、第１、第２の端子に形成した切欠
き部を樹脂ケースの開口部端面に設けている凹部に嵌合
させるので、絶縁性樹脂を充填、硬化させても、その位
置がずれることなく、端子間ピッチの精度向上が図れ
る。According to the above configuration, since the heat radiating sheet is interposed between the electronic component and the second terminal, the insulation between the electronic component and the second terminal is improved and the heat radiating action to the second terminal is improved. Can be achieved. In addition, since a partition plate is provided in the resin case and the capacitor element and the electronic component are separated by the partition plate, a fixing screw for fixing the electronic component and the second terminal and an electrode lead portion of the capacitor element are provided. Can be completely separated from each other, a short circuit can be prevented, and the quality characteristics can be stabilized. Furthermore, since the notch formed in the first and second terminals is fitted into the recess provided in the opening end face of the resin case, even if the insulating resin is filled and cured, its position does not shift. In addition, the accuracy of the terminal pitch can be improved.
【００１２】上記実施例では、第１、第２の端子に形成
した切欠き部を樹脂ケースの開口部端面に設けた凹部に
嵌合させたが、図２に示すようにはんだ鏝などの発熱体
で、この嵌合部の樹脂ケース素材を溶かし溶着固定する
ことで、より一層強固に第１、第２の端子を樹脂ケース
に固着でき、絶縁性樹脂を充填、硬化させても、絶縁性
樹脂とコンデンサ素子との比重差によるコンデンサ素子
の浮き上がりがなく、端子間ピッチの精度向上を一層図
ることができる。In the above embodiment, the cutouts formed in the first and second terminals are fitted into the recesses formed in the end surface of the opening of the resin case. However, as shown in FIG. The first and second terminals can be more firmly fixed to the resin case by melting and welding and fixing the resin case material of the fitting portion with the body. There is no lifting of the capacitor element due to a difference in specific gravity between the resin and the capacitor element, and the accuracy of the terminal pitch can be further improved.
【００１３】また、上記実施例では、樹脂ケースの長手
方向に対して直角方向の開口部端面に凹部を設けたが、
この凹部を設ける位置は、これに限定されることなく、
どの位置に設けてもよく、片側の開口部端面のみに凹部
を設けても同様の効果を奏する。In the above embodiment, the concave portion is provided on the end face of the opening perpendicular to the longitudinal direction of the resin case.
The position where this concave portion is provided is not limited to this,
The same effect can be obtained by providing a concave portion only on one end face of the opening portion.
【００１４】〔実施例２〕図６は本発明の複合型乾式金
属化フィルムコンデンサの一実施例の図面であり、
（ａ）は平面図、（ｂ）は縦断面図、（ｃ）は要部拡大
の斜視図、図８は樹脂ケースの一実施例の図面で、
（ａ）は平面図、（ｂ）は縦断面図、（ｃ）は側面図、
図９はコンデンサ素子に接合される第１の端子の一実施
例の図面で、（ａ）は平面図、（ｂ）は正面図、（ｃ）
は側面図、図１０は電子部品と接合される第２の端子の
一実施例の図面で、（ａ）は平面図、（ｂ）は正面図、
（ｃ）は側面図である。[Embodiment 2] FIG. 6 is a drawing showing one embodiment of a composite type dry metallized film capacitor of the present invention.
(A) is a plan view, (b) is a longitudinal sectional view, (c) is a perspective view of an enlarged main part, and FIG. 8 is a drawing of one embodiment of a resin case.
(A) is a plan view, (b) is a longitudinal sectional view, (c) is a side view,
9A and 9B are drawings of an embodiment of the first terminal to be joined to the capacitor element, wherein FIG. 9A is a plan view, FIG. 9B is a front view, and FIG.
10 is a side view, FIG. 10 is a drawing of an embodiment of the second terminal to be joined to the electronic component, (a) is a plan view, (b) is a front view,
(C) is a side view.
【００１５】以下、本発明の一実施例について、図面を
参照しながら説明する。図６において、１はコンデンサ
素子で、アルミニウム、亜鉛などを蒸着した一対の金属
化フィルムを重ね合せて巻回し、その巻回端面に亜鉛ま
たははんだなどの金属を溶射して電極引出部１ａ、１ｂ
が形成されている。２はダイオードなどからなる電子部
品で、２ａ、２ｂは電子部品より導出された引出線であ
る。４は放熱性のよいシリコンゴムなどの放熱シート、
５、６は銅、真鍮などに錫鍍金を施した第１、第２の端
子で、５ｃ、６ｃは樹脂ケースに設けられた凸部に嵌合
する貫通穴、５ｂ、６ｂは外部接続用穴である。また、
３は樹脂ケース、７はエポキシ樹脂、ウレタン樹脂など
の熱硬化性樹脂からなる絶縁性樹脂、８は外部引出用リ
ード線、９は固定用ビスである。図８に示す樹脂ケース
３は、ポリブチレンテレフタレート、ポリカーボネート
などの絶縁性樹脂よりなり、３ｄ、３ｅは開口部端面に
設けられた凸部、３ｃは内面に設けられた仕切板であ
る。An embodiment of the present invention will be described below with reference to the drawings. In FIG. 6, reference numeral 1 denotes a capacitor element, and a pair of metallized films on which aluminum, zinc, or the like is vapor-deposited and wound, and a metal such as zinc or solder is sprayed on the wound end face to extract electrode lead portions 1a, 1b.
Are formed. Reference numeral 2 denotes an electronic component such as a diode, and reference numerals 2a and 2b denote lead lines derived from the electronic component. 4 is a heat radiating sheet made of silicon rubber having good heat radiating properties,
Reference numerals 5 and 6 denote first and second terminals obtained by tinning copper, brass, or the like, and reference numerals 5c and 6c denote through holes that are fitted into convex portions provided on the resin case, and 5b and 6b denote external connection holes. It is. Also,
Reference numeral 3 denotes a resin case, 7 denotes an insulating resin made of a thermosetting resin such as an epoxy resin or urethane resin, 8 denotes an external lead wire, and 9 denotes a fixing screw. The resin case 3 shown in FIG. 8 is made of an insulating resin such as polybutylene terephthalate or polycarbonate, and 3d and 3e are convex portions provided on the end face of the opening, and 3c is a partition plate provided on the inner surface.
【００１６】図９に示す第１の端子５と外部引出用リー
ド線８とをコンデンサ素子１の電極引出部１ａ、１ｂに
それぞれ接合し、次に図10に示す第２の端子６のネジ部
６ｄを用いて、電子部品２に放熱シート４を介して第２
の端子６を固定用ビス９にて取付ける。さらに電子部品
２の引出線２ａ、２ｂをコンデンサ素子１の電極引出部
１ｂ、第２の端子６とにそれぞれ接合し、コンデンサ素
子１と電子部品２とを樹脂ケース３の仕切板３ｃにより
分離し、収納する。そして、第１、第２の端子５、６に
形成した貫通穴５ｃ、６ｃを樹脂ケース３の開口部端面
の凸部３ｄ、３ｅにそれぞれ嵌合させ、絶縁性樹脂７を
充填、硬化して完成させる。The first terminal 5 and the external lead wire 8 shown in FIG. 9 are respectively joined to the electrode lead portions 1a and 1b of the capacitor element 1, and then the screw portion of the second terminal 6 shown in FIG. 6d to the electronic component 2 via the heat dissipation sheet 4
Terminal 6 is fixed with a fixing screw 9. Further, the lead wires 2a and 2b of the electronic component 2 are joined to the electrode lead portion 1b and the second terminal 6 of the capacitor element 1, respectively, and the capacitor element 1 and the electronic component 2 are separated by the partition plate 3c of the resin case 3. , Store. Then, the through holes 5c and 6c formed in the first and second terminals 5 and 6 are fitted into the convex portions 3d and 3e of the opening end surface of the resin case 3, respectively, and the insulating resin 7 is filled and cured. Finalize.
【００１７】上記構成によれば、電子部品と第２の端子
との間に放熱シートを介在させているので、電子部品と
第２の端子との絶縁ならびに第２の端子への放熱作用の
向上を図ることができる。また、樹脂ケースに仕切板を
設け、コンデンサ素子と電子部品とを仕切板により分離
しているので、電子部品と第２の端子とを固定している
固定用ビスと、コンデンサ素子の電極引出部とが完全に
分離でき、短絡を防止することができ、品質特性の安定
化が図れる。さらに、第１、第２の端子に形成した貫通
穴を樹脂ケースの開口部端面に設けている凸部に嵌合さ
せるので、絶縁性樹脂を充填、硬化させても、その位置
がずれることなく、端子間ピッチの精度向上が図れる。According to the above configuration, since the heat radiating sheet is interposed between the electronic component and the second terminal, the insulation between the electronic component and the second terminal is improved and the heat radiating action to the second terminal is improved. Can be achieved. In addition, since a partition plate is provided in the resin case and the capacitor element and the electronic component are separated by the partition plate, a fixing screw for fixing the electronic component and the second terminal and an electrode lead portion of the capacitor element are provided. Can be completely separated from each other, a short circuit can be prevented, and the quality characteristics can be stabilized. Further, since the through holes formed in the first and second terminals are fitted to the convex portions provided on the end surface of the opening of the resin case, the positions thereof do not shift even if the insulating resin is filled and cured. In addition, the accuracy of the terminal pitch can be improved.
【００１８】上記実施例では、第１、第２の端子に形成
した貫通穴を樹脂ケースの開口部端面に設けた凸部に嵌
合させたが、図７に示すようにはんだ鏝などの発熱体
で、この嵌合部の樹脂ケース素材を溶かし溶着固定する
ことで、より一層強固に第１、第２の端子を樹脂ケース
に固着でき、絶縁性樹脂を充填、硬化させても、絶縁性
樹脂とコンデンサ素子との比重差によるコンデンサ素子
の浮き上がりがなく、端子間ピッチの精度向上を一層図
ることができる。In the above embodiment, the through holes formed in the first and second terminals were fitted into the convex portions provided on the end surface of the opening of the resin case. However, as shown in FIG. The first and second terminals can be more firmly fixed to the resin case by melting and welding and fixing the resin case material of the fitting portion with the body. There is no lifting of the capacitor element due to a difference in specific gravity between the resin and the capacitor element, and the accuracy of the terminal pitch can be further improved.
【００１９】また、上記実施例では、樹脂ケースの長手
方向に対して直角方向の開口部端面に凸部を設けたが、
この凸部を設ける位置は、これに限定されることなく、
どの位置に設けてもよく、片側の開口部端面のみに凸部
を設けても同様の効果を奏する。In the above embodiment, the convex portion is provided on the end face of the opening perpendicular to the longitudinal direction of the resin case.
The position where this convex portion is provided is not limited to this,
It may be provided at any position, and the same effect can be obtained even if the protrusion is provided only on one end face of the opening.
【００２０】[0020]
【発明の効果】本発明の複合型乾式金属化フィルムコン
デンサは、樹脂ケースに仕切板を設け、コンデンサ素子
と電子部品とを仕切板により分離して収納しているの
で、電子部品および該部品を第２の端子に固定している
固定用ビスと、コンデンサ素子の電極引出部とが完全に
分離でき、短絡を防止することができ、品質特性の向上
を図ることができる。そして、第１、第２の端子に切欠
き部を形成し、該切欠き部を樹脂ケースの開口部端面に
設けた位置決め用の凹部に嵌合させているか、または、
上記端子に貫通穴を形成し、該貫通穴を樹脂ケースの開
口部端面に設けた位置決め用の凸部に嵌合させているの
で、絶縁性樹脂を充填、硬化させても、その位置がずれ
ることなく、端子間ピッチの精度向上を図ることができ
る。また、電子部品と第２の端子との間に放熱シートを
介在させているので、電子部品と第２の端子との絶縁な
らびに第２の端子への放熱作用の向上を図ることができ
る。さらに、第１、第２の端子に形成した切欠き部と樹
脂ケースの開口部端面に設けた凹部との嵌合部の樹脂ケ
ース素材をはんだ鏝などの発熱体で溶かし、溶着固定す
ることにより、より一層強固に第１、第２の端子を樹脂
ケースに固着することができ、絶縁性樹脂を充填、硬化
しても、コンデンサ素子が浮き上がることを防止でき、
端子間ピッチの精度向上を一層図ることができるなど工
業的、実用的にその価値は極めて大なるものがある。According to the composite type dry metallized film capacitor of the present invention, a partition plate is provided in a resin case, and the capacitor element and the electronic component are separated and stored by the partition plate. The fixing screw fixed to the second terminal and the electrode lead portion of the capacitor element can be completely separated, a short circuit can be prevented, and quality characteristics can be improved. A notch is formed in the first and second terminals, and the notch is fitted into a positioning recess provided on an end face of the opening of the resin case, or
Since the through-hole is formed in the terminal and the through-hole is fitted to the positioning protrusion provided on the end face of the opening of the resin case, the position is shifted even if the insulating resin is filled and cured. Without this, the accuracy of the terminal pitch can be improved. Further, since the heat radiating sheet is interposed between the electronic component and the second terminal, the insulation between the electronic component and the second terminal and the heat radiating action to the second terminal can be improved. Further, the resin case material of the fitting portion of the notch formed in the first and second terminals and the concave portion provided in the end face of the opening of the resin case is melted with a heating element such as a soldering iron and fixed by welding. The first and second terminals can be more firmly fixed to the resin case, and even if the insulating resin is filled and cured, the capacitor element can be prevented from floating.
Industrial and practical values are extremely large, for example, the accuracy of the terminal pitch can be further improved.
【図１】図１は、本発明の複合型乾式金属化フィルムコ
ンデンサの一実施例を示す図面で、（ａ）は平面図、
（ｂ）は縦断面図、（ｃ）は要部拡大の斜視図である。FIG. 1 is a drawing showing one embodiment of a composite type dry metallized film capacitor of the present invention, wherein (a) is a plan view,
(B) is a longitudinal sectional view, and (c) is an enlarged perspective view of a main part.
【図２】図２は、本発明の要部拡大の斜視図である。FIG. 2 is an enlarged perspective view of a main part of the present invention.
【図３】図３は、本発明の樹脂ケースの一実施例を示す
図面で、（ａ）は平面図、（ｂ）は縦断面図、（ｃ）は
側面図である。3A and 3B are drawings showing one embodiment of the resin case of the present invention, wherein FIG. 3A is a plan view, FIG. 3B is a longitudinal sectional view, and FIG. 3C is a side view.
【図４】図４は、本発明のコンデンサ素子に接合される
第１の端子の一実施例を示す図面で、（ａ）は平面図、
（ｂ）は正面図、（ｃ）は側面図である。FIG. 4 is a drawing showing one embodiment of a first terminal joined to the capacitor element of the present invention, wherein (a) is a plan view,
(B) is a front view, (c) is a side view.
【図５】図５は、本発明の電子部品に接合される第２の
端子の一実施例を示す図面で、（ａ）は平面図、（ｂ）
は正面図、（ｃ）は側面図である。FIGS. 5A and 5B are views showing one embodiment of a second terminal joined to the electronic component of the present invention, wherein FIG. 5A is a plan view and FIG.
Is a front view, and (c) is a side view.
【図６】図６は、本発明の複合型乾式金属化フィルムコ
ンデンサの他の実施例を示す図面で、（ａ）は平面図、
（ｂ）は縦断面図、（ｃ）は要部拡大の斜視図である。FIG. 6 is a drawing showing another embodiment of the composite dry metallized film capacitor of the present invention, wherein (a) is a plan view,
(B) is a longitudinal sectional view, and (c) is an enlarged perspective view of a main part.
【図７】図７は、本発明の他の実施例の要部拡大の斜視
図である。FIG. 7 is an enlarged perspective view of a main part of another embodiment of the present invention.
【図８】図８は、本発明の樹脂ケースの他の実施例を示
す図面で、（ａ）は平面図、（ｂ）は縦断面図、（ｃ）
は側面図である。FIG. 8 is a drawing showing another embodiment of the resin case of the present invention, wherein (a) is a plan view, (b) is a longitudinal sectional view, and (c).
Is a side view.
【図９】図９は、本発明のコンデンサ素子に接合される
第１の端子の他の実施例を示す図面で、（ａ）は平面
図、（ｂ）は縦断面図、（ｃ）は側面図である。FIGS. 9A and 9B are drawings showing another embodiment of the first terminal joined to the capacitor element of the present invention, wherein FIG. 9A is a plan view, FIG. 9B is a longitudinal sectional view, and FIG. It is a side view.
【図１０】図１０は、本発明の電子部品に接合される第
２の端子の他の実施例を示す図面で、（ａ）は平面図、
（ｂ）は縦断面図、（ｃ）は側面図である。FIG. 10 is a drawing showing another embodiment of the second terminal joined to the electronic component of the present invention, wherein (a) is a plan view,
(B) is a longitudinal sectional view, and (c) is a side view.
【図１１】図１１は、従来のダイオード内蔵コンデンサ
の縦断面図である。FIG. 11 is a longitudinal sectional view of a conventional capacitor with a built-in diode.
１ コンデンサ素子 １ａ、１ｂ 電極引出部 ２ 電子部品 ２ａ、２ｂ 引出線 ３ 樹脂ケース ３ａ、３ｂ 凹部 ３ｃ 仕切板 ３ｄ、３ｅ 凸部 ４ 放熱シート ５ 第１の端子 ６ 第２の端子 ５ａ、６ａ 切欠き部 ５ｂ、６ｂ 外部接続用穴 ５ｃ、６ｃ 貫通穴 ６ｄ ネジ部 ７ 絶縁性樹脂 ８ 外部引出用リード線 ９ 固定用ビス １０ 発熱体 １１ ダイオード １２ａ 第１の外部引出用端子 １２ｂ 第２の外部引出用端子 １３ 放熱シート １４ 樹脂ケース １５ 絶縁性樹脂 １６ 固定用ビス DESCRIPTION OF SYMBOLS 1 Capacitor element 1a, 1b Electrode lead-out part 2 Electronic component 2a, 2b Lead wire 3 Resin case 3a, 3b Concave part 3c Partition plate 3d, 3e Convex part 4 Heat radiation sheet 5 First terminal 6 Second terminal 5a, 6a Notch Part 5b, 6b External connection hole 5c, 6c Through hole 6d Screw part 7 Insulating resin 8 External lead wire 9 Fixing screw 10 Heating element 11 Diode 12a First external lead terminal 12b Second external lead Terminal 13 Heat dissipation sheet 14 Resin case 15 Insulating resin 16 Screw for fixing
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5E082 AA11 AB04 BC36 BC38 DD13 EE05 EE07 EE24 EE25 EE37 FG34 GG04 GG08 GG11 GG26 HH03 HH06 HH08 HH28 HH47 HH48 HH50 JJ12 JJ22 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E082 AA11 AB04 BC36 BC38 DD13 EE05 EE07 EE24 EE25 EE37 FG34 GG04 GG08 GG11 GG26 HH03 HH06 HH08 HH28 HH47 HH48 HH50 JJ12 JJ22
Claims (4)
し、巻回端面に金属を溶射してなるコンデンサ素子と他
の電子部品とを外部引出用リード線で接続し、樹脂ケー
スに収納し、絶縁性樹脂を充填、硬化してなる複合型乾
式金属化フィルムコンデンサにおいて、 樹脂ケースの内面に仕切板、開口部端面に端子位置決め
部を設け、コンデンサ素子と電子部品とを仕切り板を隔
てて収納するとともに、電子部品と端子との間に放熱シ
ートを介在させ、上記端子位置決め部に端子を嵌合して
なることを特徴とする複合型乾式金属化フィルムコンデ
ンサ。1. A pair of metallized films are superimposed and wound, and a capacitor element formed by spraying metal on the wound end face is connected to another electronic component by an external lead wire, and stored in a resin case. In the composite type dry metallized film capacitor that is filled and cured with an insulating resin, a partition plate is provided on the inner surface of the resin case, and a terminal positioning portion is provided on the end surface of the opening to separate the capacitor element and the electronic component from each other. A composite dry-type metallized film capacitor comprising: a heat dissipation sheet interposed between an electronic component and a terminal; and a terminal fitted to the terminal positioning portion.
が凹状であり、該凹部と嵌合する切欠き部を端子に形成
し、端子を固定したことを特徴とする複合型乾式金属化
フィルムコンデンサ。2. The composite dry metallized film according to claim 1, wherein the positioning portion of the resin case according to claim 1 has a concave shape, a notch portion fitted with the concave portion is formed in the terminal, and the terminal is fixed. Capacitors.
が凸状であり、該凸部と嵌合する穴を端子に形成し、端
子を固定したことを特徴とする複合型乾式金属化フィル
ムコンデンサ。3. The composite dry metallized film according to claim 1, wherein the positioning portion of the resin case according to claim 1 has a convex shape, a hole for fitting with the convex portion is formed in the terminal, and the terminal is fixed. Capacitors.
スの端子位置決め部を溶融し、端子に固着させたことを
特徴とする複合型乾式金属化フィルムコンデンサ。4. A composite dry-type metallized film capacitor, characterized in that the terminal positioning portion of the resin case according to claim 2 is melted and fixed to the terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000013837A JP2001210548A (en) | 2000-01-24 | 2000-01-24 | Composite dry metal film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000013837A JP2001210548A (en) | 2000-01-24 | 2000-01-24 | Composite dry metal film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001210548A true JP2001210548A (en) | 2001-08-03 |
Family
ID=18541374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000013837A Pending JP2001210548A (en) | 2000-01-24 | 2000-01-24 | Composite dry metal film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001210548A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006216756A (en) * | 2005-02-03 | 2006-08-17 | Matsushita Electric Ind Co Ltd | Case mold type capacitor and manufacturing method thereof |
| JP2006216618A (en) * | 2005-02-01 | 2006-08-17 | Shizuki Electric Co Inc | Cased capacitor |
| JP2006332493A (en) * | 2005-05-30 | 2006-12-07 | Shizuki Electric Co Inc | Cased capacitor |
| JP2007507876A (en) * | 2003-10-06 | 2007-03-29 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Apparatus and method for packaging capacitors |
| KR200455487Y1 (en) * | 2009-09-15 | 2011-09-07 | 오영전자(주) | Snubber Capacitors for ITV |
| JP2016111232A (en) * | 2014-12-08 | 2016-06-20 | パナソニックＩｐマネジメント株式会社 | Capacitor and inverter |
| JP2018182066A (en) * | 2017-04-13 | 2018-11-15 | ニチコン株式会社 | Case mold type film capacitor |
| CN109786110A (en) * | 2019-02-03 | 2019-05-21 | 佛山市欣源电子股份有限公司 | A double-sided metallized string high-current film capacitor |
| JP2019140241A (en) * | 2018-02-09 | 2019-08-22 | 株式会社指月電機製作所 | Capacitor |
| WO2021220918A1 (en) | 2020-04-28 | 2021-11-04 | 株式会社村田製作所 | Capacitor module |
-
2000
- 2000-01-24 JP JP2000013837A patent/JP2001210548A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007507876A (en) * | 2003-10-06 | 2007-03-29 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Apparatus and method for packaging capacitors |
| US7899529B2 (en) | 2003-10-06 | 2011-03-01 | Koninklijke Philips Electronics N.V. | Apparatus and method for packaging a capacitor |
| JP2006216618A (en) * | 2005-02-01 | 2006-08-17 | Shizuki Electric Co Inc | Cased capacitor |
| JP2006216756A (en) * | 2005-02-03 | 2006-08-17 | Matsushita Electric Ind Co Ltd | Case mold type capacitor and manufacturing method thereof |
| JP2006332493A (en) * | 2005-05-30 | 2006-12-07 | Shizuki Electric Co Inc | Cased capacitor |
| KR200455487Y1 (en) * | 2009-09-15 | 2011-09-07 | 오영전자(주) | Snubber Capacitors for ITV |
| JP2016111232A (en) * | 2014-12-08 | 2016-06-20 | パナソニックＩｐマネジメント株式会社 | Capacitor and inverter |
| JP2018182066A (en) * | 2017-04-13 | 2018-11-15 | ニチコン株式会社 | Case mold type film capacitor |
| JP2019140241A (en) * | 2018-02-09 | 2019-08-22 | 株式会社指月電機製作所 | Capacitor |
| JP7093990B2 (en) | 2018-02-09 | 2022-07-01 | 株式会社指月電機製作所 | Capacitor |
| CN109786110A (en) * | 2019-02-03 | 2019-05-21 | 佛山市欣源电子股份有限公司 | A double-sided metallized string high-current film capacitor |
| WO2021220918A1 (en) | 2020-04-28 | 2021-11-04 | 株式会社村田製作所 | Capacitor module |
| US12537141B2 (en) | 2020-04-28 | 2026-01-27 | Murata Manufacturing Co., Ltd. | Capacitor module and a method of making thereof with plurality of bus bars |
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