JP2001203480A - Electronic device housing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a casing of electronic equipment which can be made thinner and lighter. SOLUTION: This casing has an outer portion 30, made of metal and an inner portion 34, which is disposed inside the outer portion 30 and made of a metal. The outer portion 34 and the inner portion 34 are jointed by caulking.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a housing for an electronic device.

[0002]

2. Description of the Related Art Electronic devices have a housing for protecting circuit boards, electronic components, and the like housed therein. This type of housing is usually manufactured by injection molding of a thermoplastic resin, and the outer surface of the housing is subjected to design processing, and a circuit board and the like are disposed inside. By the way, recent electronic devices have been reduced in weight, size, density and the like, and the housing of the electronic devices has been required to be lighter and thinner. Japanese Patent Application Laid-Open No. 5-269787 proposes a method of manufacturing a housing by laminating a metal plate on a synthetic resin.

[0003]

However, such a housing made by laminating a metal and a synthetic resin by injection molding requires a large number of manufacturing steps, resulting in a significant increase in cost. It has also been proposed to make a housing from a magnesium alloy. When a magnesium alloy is used, the housing is manufactured by thixomolding or molding by die casting. However, this method requires secondary processing after the housing is made, which increases costs and may cause ignition problems during the manufacturing process, and furthermore, the average thickness of the magnesium alloy housing But,
There are various restrictions such as the fact that it is impossible to make the one 0.8 mm or less. Therefore, the present invention has solved the above-mentioned problems,
An object of the present invention is to provide a housing of an electronic device that can be reduced in thickness and weight.

[0004]

The invention according to claim 1 has an outer portion made of metal, and an inner portion disposed inside the outer portion and made of metal, wherein the outer portion is made of metal. An outer part and the inner part are joined by caulking, which is a housing of the electronic device. In claim 1,
The outer part is made of metal. The inner part is disposed inside the outer part and is made of metal. The outer portion and the inner portion are joined by caulking. By doing so, the outer part can be given a design appearance, and the inner part can protect the elements housed inside. The outer and inner parts can be joined and integrated by caulking, the structure is simple, and since the outer and inner parts are made of metal, they excel in heat dissipation and are lightweight and thin. Can be achieved.

According to a second aspect of the present invention, in the electronic device case according to the first aspect, the outer portion and the inner portion are further adhered by an adhesive. According to the second aspect, the outer portion and the inner portion are further attached with an adhesive in addition to the joining by caulking. By doing this,
The outer part and the inner part can be joined more firmly.

According to a third aspect of the present invention, in the electronic device case according to the first aspect, the outer portion and the inner portion are further joined by welding. According to the third aspect, by joining the outer portion and the inner portion by welding in addition to joining by caulking, the outer portion and the inner portion can be joined more firmly.

According to a fourth aspect of the present invention, in the electronic device case according to the second aspect, the outer portion and the inner portion are further joined by welding. According to the fourth aspect, the outer portion and the inner portion can be more firmly joined by performing joining by caulking, joining by bonding with an adhesive, and joining by welding.

According to a fifth aspect of the present invention, in the electronic device casing according to the first aspect, the inner portion is fitted toward an inner surface of the outer portion, and the inner portion is attached to the outer portion. Positioned. According to the fifth aspect, the inner portion is fitted and joined toward the inner surface of the outer portion, and the inner portion is positioned with respect to the outer portion, so that the inner portion can be joined to the outer portion at a correct position.

According to a sixth aspect of the present invention, in the electronic device case according to the first aspect, at least one of the outer portion and the inner portion is formed by pressing aluminum. According to the sixth aspect, since at least one of the outer portion and the inner portion uses aluminum having extremely excellent heat dissipation, the heat dissipation and the weight of the housing of the electronic device can be reduced.

[0010] The invention according to claim 7 has an outer portion made of metal, and an inner portion disposed inside the outer portion and made of metal, wherein the inner portion is formed of the outer portion. By sliding on the inner surface side of the electronic device, the inner portion is fitted into and joined to the outer portion, and the inner portion is positioned with respect to the outer portion. In claim 7, the outer portion is made of metal, and the inner portion is disposed inside the outer portion and made of metal. When the inner part slides on the inner surface side of the outer part, the inner part is fitted and joined to the outer part, and the inner part is positioned with respect to the outer part. Thus, the inner portion and the outer portion slide and slide on the inner portion so that the inner portion is fitted into and joined to the outer portion, so that the joining structure between the outer portion and the inner portion can be simplified. Can be joined accurately.

According to an eighth aspect of the present invention, in the electronic device case according to the seventh aspect, the outer portion and the inner portion are further adhered by an adhesive. According to the eighth aspect, the inside portion is fitted into and joined to the outside portion, and is further attached with an adhesive. Thereby, the outer portion and the inner portion can be more firmly joined.

According to a ninth aspect of the present invention, in the electronic device casing according to the seventh aspect, the outer portion and the inner portion are further joined by welding. In the ninth aspect, the inner portion is fitted and joined to the outer portion, and further joined by welding. Thereby, the outer portion and the inner portion can be more firmly joined.

According to a tenth aspect of the present invention, in the electronic device casing according to the seventh aspect, the outer portion and the inner portion slide and join the inner portion on the inner surface side of the outer portion,
Glued and joined by welding.

[0014]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

FIG. 1 shows an example of an electronic device of the present invention and a housing of the electronic device. The electronic device 10 is, for example, a small information reproducing device, and the electronic device 10 is
Two. This housing 12 is provided with an upper housing portion (first
And a lower housing portion (corresponding to the second portion) 16. The upper housing part 14 is also called the cabinet upper part, and the lower housing part 16 is also called the cabinet lower part. In the example of the electronic device 10 of FIG. 1, an input device 18 which is a device for inputting information is provided on the upper housing portion 14 side. An output section 20 and another interface section 22 are provided between the upper casing section 14 and the lower casing section 16. The input device 18 is a portion from which a user can input necessary information to various elements built in the electronic device 10 from outside. For example, a plurality of key tops 2 are provided in the hole 40.
4 are arranged in series at equal intervals.

The output section 20 is arranged on the end face 26 side of the upper casing section 14 and the lower casing section 16 and is a section capable of outputting necessary information from the electronic device 10 to the outside. The interface part 22 is provided on the end face 28 side, and the interface part 22 is
It is a part that can interface with the elements built in and other devices such as a computer. The upper housing part 14 and the lower housing part 16 of FIG.
For example, both of them are configured by pasting substantially the outer portion and the inner portion with an adhesive layer. 2 to 4 show the upper housing part 14, and FIGS. 5 to 8 show examples of the structure of the lower housing part 16 of FIG.

As shown in FIG. 2 to FIG.
Reference numeral 4 denotes a substantially rectangular shaped member. As shown in FIG. 2, the upper housing portion 14 is formed by laminating the outer portion 30 and the inner portion 34 over substantially the entire area. The outer portion 30 and the inner portion 34 are bonded and integrated by, for example, an adhesive layer 36. Outer part 30
And the inner portion 34 are a metal plate having excellent heat dissipation and workability,
For example, it is formed using an aluminum plate. However, the outer portion 30 and the inner portion 34 are not limited to the aluminum plate, and may be made of a magnesium alloy, SUS (stainless steel), a copper-based material, or an iron-based material. The adhesive layer 36 may be a solvent-evaporating type such as vinyl acetate, vinyl chloride-vinyl acetate, polyvinyl alcohol, acrylic emulsion, or rubber, phenol, urethane, etc. Adopted from the chemical reaction types such as resorcinol, epoxy, acrylic, polyester, cyanoacrylate and other mixed systems, and the hot melt types such as ethylene-vinyl acetate, polyamide, polyester, polyisobutylene etc. can do.

The outer portion 30 is also referred to as an outer member, and is a portion for forming an external appearance surface to improve the appearance and design. The inner portion 34 is also called an inner portion, and is a portion for mainly protecting the built-in electrical components. As shown in FIG.
Is formed with an oblong hole 40. This hole 40
This is a hole for forming the input device 18 of FIG. 1, in which the key tops 24 are arranged in series at equal intervals. As shown in FIG. 3, a plurality of protrusions 42 are formed on the side surfaces 14A and 14B of the upper housing portion 14. As shown in FIG. 2, the shape of the projection 42 is a substantially hemispherical projection when viewed in cross section. The projection 42 is formed by molding the outer portion 30, and the projection 4
2 is located in the hole 44 of the inner part 34. The holes 40 shown in FIGS. 1, 2 and 3 are formed by drawing out the outer portion 30 to expose the surface 34 </ b> A of the inner portion 34.

FIG. 9 shows an example of a sectional structure taken along line XX of FIG. FIG. 9 shows the structure of the input device 18, wherein the outer portion 30 and the inner portion 34 are adhered by an adhesive layer 36. However, a portion of the outer portion 30 is formed by drawing and is formed to be substantially semicircular as a drawn portion 48. From this, the aperture portion 48
A void portion 50 is formed between the inner portion 34 and the inner portion 34. A circuit board 52 is arranged inside the inner part 34.
The circuit board 52 has a tact switch 54 mounted thereon, and the tact switch 54 is electrically connected to the circuit board 52 by a lead 56. The tact switch 54 has electrodes 58 and 59. The key top 24 is provided corresponding to the tact switch 54. The projection 62 of the key top 24 projects outward from a hole 64 of the inner part 34.

By adopting such a structure, when the user touches the projection 62 of the key top 24 with the finger, the finger can be reliably guided to the projection 62 of the key top 24 by the narrowed portions 48, 48. Then, when the user presses down the protrusion 62 of the key top 24 in the P direction, the electrodes 58 and 59 of the tact switch 54 come into electrical contact, so that, for example, certain information (for example, an ON signal) is transmitted to the electronic device. 10 mounted on the circuit board 52 inside
It can be provided to a PU (Central Processing Unit) or the like.

Next, an example of the structure of the lower housing portion 16 in FIG. 1 will be described with reference to FIGS. As shown in FIG. 5, the lower housing part 16 is formed in a substantially rectangular parallelepiped shape, and forms the housing 12 shown in FIG. 1 by overlapping with the upper housing part 14 shown in FIG. Most of the lower housing portion 16 is formed by bonding an outer portion 30 and an inner portion 34 with an adhesive layer 36 as shown in FIGS. 8A and 8B, for example, similarly to the upper housing portion 14. are doing. FIG. 5A is an enlarged view of FIG. 8A, and FIG. 5B is an enlarged view of FIG. 8B.

As shown in FIG. 6A and FIG.
0, and these four holes 60 are shown in FIG.
(A), (B), and (C), where the projections 42 of the upper housing portion 14 are fitted. That is, FIG.
As shown in (B), the hole 60 is formed in the mating portion 62 of the lower housing portion 16. On the other hand, FIG.
In the upper housing portion 14 shown in (B) and (C), four projections 42 are formed on the mating portion 66.

Next, referring to FIG. 10, FIG.
An example of a mounting structure of the output portion 20 to the housing 12 will be described. FIG. 10 shows an example of a cross-sectional structure taken along line BB of FIG. The upper housing portion 14 includes an outer portion 30.
And an inner portion 34 are adhered and laminated by an adhesive layer 36. Similarly, the lower housing portion 16 also has a structure in which the outer portion 30 and the inner portion 34 are laminated by bonding with an adhesive layer 36. A gap 76 is formed between the outer portion 30 and the inner portion 34 of the upper housing portion 14. Similarly, a gap 78 is formed between the outer portion 30 and the inner portion 34 of the lower housing portion 16. The output portion 20 is fitted and attached using these gaps 76 and 78.
That is, the projection 20A of the output portion 20 is fitted into the gap 76, and the projection 20B is fitted into the gap 78. The output portion 20 is made of, for example, plastic, and the output portion 20 is made of a metal contact 20C.
It has. The contact 20 </ b> C is electrically connected to a conductor portion of the circuit board 52 by using a soldering portion 80. The output portion 20 is a connector for electrically connecting the internal circuit board 52 to an external device such as an earphone. Interface part 2 of FIG.
The same mounting structure as the structure of the output portion 20 shown in FIG.

Referring now to FIG. 11, a description will be given of an example of a fitting structure of the fitting portion 66 of the upper housing portion 14 and the fitting portion 62 of the lower housing portion 16 of FIG. The upper housing portion 14 has a structure in which an outer portion 30 and an inner portion 34 are laminated by bonding with an adhesive layer 36. Lower housing part 16
Has a structure in which the outer portion 30 and the inner portion 34 are laminated by bonding with an adhesive layer 36. Outer portion 30 of upper housing portion 14
A portion 80 of the mating portion 66 and a portion 82 of the mating portion 62 of the inner portion 34 of the lower housing portion 16 have tapered portions 80A and 82A, respectively, as enlarged in FIG. By doing so, the lower housing part 1
When the upper housing portion 14 is superimposed on and integrated with 6, the taper portions 80A and 82A are provided, so that the upper housing portion 14 can be easily superimposed and integrated. That is, the upper housing portion 14 and the lower housing portion 16 are easily fitted by using the tapered portions 80A and 82A at the time of fitting.
The tapered portions 80A and 82A are formed by, for example, crushing.

Next, referring to FIG. 13, a portion 90 of the mating portion 66 of the outer portion 30 of the upper housing portion 14 has a projection 42. On the other hand, a portion 92 of the mating portion 62 of the inner portion 34 of the lower housing portion 16 has the hole 44. Accordingly, when the housing 12 is configured by overlapping the upper housing portion 14 with the lower housing portion 16, the upper housing portion 14 and the lower housing portion 14 are fitted into the holes 44 of the projections 42. 16 can be integrated. Such a structure of the projection 42 is also shown in FIG.

The projection 42 in FIG. 13 may be formed on the outer portion 30 of the lower housing portion 16 and the hole 44 may be formed on the inner portion 34 of the upper housing portion 14.
With such a structure that the projection 42 is fitted into the hole 44, the removal force of the upper housing portion 14 and the lower housing portion 16 is securely held. The coupling portions by such projections and holes are not limited to the four locations shown in FIG.
Of course, there may be no less than two, three or five locations. Alternatively, the projections and the holes may be provided on the inner portion 34 of the upper housing portion 14 and the inner portion 34 of the lower housing portion 16 for connection.

Next, reference is made to FIG. FIG. 14 shows still another embodiment of the present invention, in which the outer portion 30 of the upper housing portion 14 of FIG. 14 is integrally fixed to the inner portion 34 by an adhesive layer 36. Lower housing part 1
The outer portion 30 of 6 is integrated with the inner portion 34 by an adhesive layer 36. A hole 100 is formed in the inner portion 34 of the upper housing portion 14. Inner part 3 of lower housing part 16
4 has a tongue-shaped projection 102 formed thereon. This projection 1
Numeral 02 denotes a cantilever type projection. When the upper housing portion 14 is superimposed on the lower housing portion 16, the protrusion 102
Is fitted in the hole 100. This prevents the upper housing portion 14 from coming off the T direction with respect to the lower housing portion 16. Although various shapes of such combinations are conceivable, a hole 100 may be provided on the lower housing portion 16 and a protrusion 102 may be provided on the upper housing portion 14.

FIG. 15 shows still another embodiment, which is different from the embodiment of FIG.
5 in that the protrusion 104 has a triangular pyramid shape. The projection 104 is made by half blanking or the like and has a hole 34e. In the example of FIG. 16, the projection 104 has a triangular pyramid shape, but may have a quarter spherical shape as shown in FIG. In this way, in the case of FIG. 15 as well, the projection 104 fits into the hole 100, thereby preventing the upper housing portion 14 from coming off the T direction with respect to the lower housing portion 16.

FIG. 18 shows an example of the structure of the upper housing portion 14, for example. The outer portion 30 and the inner portion 34 of the upper housing portion 14 are integrated by an adhesive layer 36. A part of the inner portion 34 is formed as a tongue-shaped projection 110. The protrusion 110 is in thermal contact with the heating element 112. The heating element 112 is, for example, a CPU (central processing unit) or a driver IC (integrated circuit), and the heating element 112 is mounted on the circuit board 52. As a result, the heat generated when the heating element 112 is actuated causes the protrusion 110, the inner portion 34, the protrusion 110, and
Can be released to the outside via It is desirable that the adhesive layer 36 is not formed in the vicinity of the protrusion 110 in order to easily radiate heat to the outside. This is because the heat dissipation efficiency is improved except for the adhesive layer 36.

In the embodiment shown in FIG. 19, for example, an example of the upper housing portion 14 is shown, and an outer portion 30 and an inner portion 34 are shown.
Are joined by an adhesive layer 36. The protrusion 124 formed on the inner part 34 is in contact with the inner surface of the outer part 30.
Thus, heat generated by the heating element disposed inside the housing is transmitted to the outer portion 30 via the inner portion 34 and the protrusion 124 of the inner portion 34, and the outer portion 30 can radiate the heat to the outside. it can. Also in this case, since the adhesive layer 36 is not formed at least in the vicinity of the protrusion 124, the heat radiation efficiency can be improved.

FIG. 20 shows still another embodiment of the present invention. FIG. 20 shows a structural example of the lower housing portion 16, for example, and the outer portion 30 is joined to the inner portion 34 by an adhesive layer 36. A part of the inner portion 34 is formed vertically as a protrusion 130. This projection 1
The circuit board 52 is securely held in the lower housing portion 16 by inserting the 30 into a part of the circuit board 52 or supporting the circuit board 52.
One or a plurality of such protrusions 130 may be formed, or two of the protrusions 130 may be used to hold the circuit board 52 therebetween.

Next, returning to FIG. In FIG.
As described above, an example of the lower housing portion 16 of the upper housing portion 14 and the lower housing portion 16 is shown. The lower housing portion 16 has been described with reference to FIG. 5 in the example in which the outer portion 30 and the inner portion 34 are joined by an adhesive layer.
And the inner portion 34 without the adhesive layer or in addition to the bonding by the adhesive layer, for example, in FIG.
Mechanically firmly. FIG. 21 shows FIG.
2 shows an example of a cross-sectional structure taken along line CC of FIG. The caulking part 300 is formed by caulking the end of the outer part 30. The caulking part 300 fixes the inner part 34 to the outer part 30 by caulking the end 34 e of the inner part 34. In the case where the end portion 34e of the inner portion 34 is fixed by caulking the caulking portion 300 in this way, as shown in FIG.
Is pressed in the direction f, the caulking portion 300 can fix the end portion 34e of the inner portion 34.

FIG. 23 is a view of the caulking portion 300 and the end 34e of the inner portion 34 viewed from the direction g in FIG. 22. The end 34e is located near the caulking portion 300. The end portion 34e has a leaf spring portion 34h, and the leaf spring portion 34h has a guide portion 34i. As shown in FIG. 23B, the guide portion 34i is a guide portion for inserting the inner portion 34 as the inner into the outer portion 30 as the outer, and can be inserted by a jig or a hand. The guide portion 34i includes an end portion 34e provided on the inside portion 34 when the caulking portion 300 is caulked using the tool 303 after the outer portion 30 is inserted into the inner portion 34, and after the caulking process is performed. The movement of the spring portion 34h is restricted only in the vertical direction. The left and right directions are regulated by the outer dimensions of the inner part and the inner dimensions of the outer part. When the mechanical joining structure of the outer portion 30 and the inner portion 34 using the caulking portion 300 in FIGS. 21 to 23 is adopted, the joining by the adhesive layer 36 may be used together as described above, Layer 3
You do not have to have 6.

FIG. 24 shows an example of the welded portion 400 in FIG. Welds 400 are formed at four locations, for example, as shown in FIG. The welded portion 400 is, for example, a spot welded portion and is formed at an intermediate position between the outer portion 30 and the inner portion 34 as shown in FIG. However, the spot welds 400 may be formed on the side surfaces of the end of the outer portion 30 and the end of the inner portion 34. When such a spot weld 400 is formed, the adhesive layer 36 as shown in FIG. 21 may or may not be provided. Further, even when the spot welded portion 400 is provided, the caulked portion 300
May or may not be provided. That is, the outer portion 3
At least one, two, or three of the bonding of the inner and outer portions 34 by the adhesive layer, the bonding by the caulking portion 300, and the bonding by the welding portion 400 may be performed. Outer part 3
In order to most strongly join the inner portion 34 and the inner portion 34, the welded portion 400, the caulked portion 300, and the adhesive layer 36 are used together. Combination or caulking part 300
Needless to say, it may be used in combination with the adhesive layer 36 or only the adhesive layer. In FIG. 5, the lower housing part 16 is taken as an example, but the structure of the upper housing part 14 can be similarly applied to the structure described above.

FIG. 25 is a view similar to FIG.
Is shown as an example. The joining structure of the lower housing portion 16 in FIG. 5 or 25 can be applied to the upper housing portion 14 as a matter of course. Lower housing part 1 of FIG.
In 6, the inner part 34 can be fitted and joined by sliding along the inner surface 30d of the outer part 30. That is, the inner portion 34 is the inner surface 3 of the outer portion 30.
By sliding in the direction A along 0d, FIG.
As shown in FIG. 5, the inner portion 34 can be aligned with the inner surface 30d of the outer portion 30 and integrally joined.

Such a fitting structure 500 is similar to that shown in FIG.
In the example of 5, four locations are formed. FIGS. 26 and 27 show examples of the structure of the region E of the fitting structure 500 in FIG. 26 shows a state after the inner portion 34 has slid in the A direction with respect to the outer portion 30. FIG. 27 shows a fitted state before the inner portion 34 has slid in the A direction with respect to the outer portion 30. Is shown. The stopper 540 is
It hits the positioning part 510. A positioning portion 510 is formed on the outer portion 30. In contrast, the inner part 34
Includes a claw 520 and a portion 530 for holding the claw 520.
Is provided.

FIG. 28 is a sectional view taken along line JJ of FIG. 26, and FIG. 29 is a sectional view taken along line HH of FIG. FIG. 28 shows a state in which the inner portion 34 has already moved and fitted in the A direction with respect to the outer portion 30 and finished. In FIG. 28, the inner part 34 is slid and fitted in the direction A, and since the claw 520 is lifted in an oblique direction, it hits the positioning part 510. It does not move in the opposite direction A1. When the inner portion 34 moves in the direction A and fits into the outer portion 30, the claw 520 passes through the passage 512 of the positioning portion 510 while elastically deforming. After the passage, the pawl 520 is elastically restored and hits the positioning portion 510 as shown in FIG. As described above, the fitting structure portion 500 using a slide described with reference to FIG. 25 and the like can be combined with the joining by welding as shown in FIG. 5 described above, or the fitting structure portion 500 can be combined with the joining using an adhesive layer. Alternatively, the fitting structure 500 may be used in combination with welding and bonding with an adhesive layer. Further, the fitting structure 500 may be combined with the joining by the caulking part 300 in FIG.

Next, reference is made to FIG. FIG. 30 shows another embodiment of the present invention, in which the inner portion 34 is fitted into the outer portion 30 by one-touch operation. That is, the inner part 34 is fixed using the fitting part 700 of the outer part 30. This fitting part 7
00 is, for example, a nail shape. FIG. 31 is a plan view seen from the direction K in FIG. 30, and FIG.
3 is a sectional view taken along line GG of FIG. FIG.
4 is an example showing a state where the fitting portion 700 provided on the outer portion 30 is positioned in the height direction. That is,
The tongue-like portion 34m extending from the bottom surface of the inner portion to the side surface is elastically deformed at the time of fitting with the outer portion 30, so that the fitting is carried out.
4h abuts on the back surface of the fitting portion 700 provided on the outer portion 30 to restrain the vertical movement,
By moving the end of the fitting portion 700 into contact with the end 34p of the side surface after the formation of the tongue-shaped portion 34m, the movement in the left-right direction is also restricted. In FIG. 32, the inner portion 34 is fitted in close contact with the inner surface portion 30 </ b> A of the outer portion 30, and the end 34 m of the inner portion 34 abuts the fitting portion 700, so that the inner portion 34 is It does not come off from inside. FIG. 33 shows a state where the inner portion 34 is being inserted and fitted into the outer portion 30. That is,
When the inner portion 34 is pushed in the P direction, the outer surface of the inner portion 34 is elastically deformed by the fitting portion 700, and the fitting portion 700 enters the hole 34h of the inner portion 34 as shown in FIG. As a result, the inner portion 34 is integrated with the outer portion 30 inside. Note that the portion 34n is the fitting portion 70
This is an escape portion for the inner portion 34 and is provided as a guide for facilitating the insertion of the inner portion 34 at the time of insertion.

Next, FIGS. 34 and 35 show still another embodiment of the present invention. FIG. 35 is a sectional view taken along line NN in FIG. The inside portion 34 is fitted inside the outside portion 30. Hole 810 is provided in fitting portion 800 of outer portion 30. Inside part 3
4 is formed with a claw 34j. While the inner portion 34 is tightly fitted into the outer portion 30, the claw 34j passes through the hole 810 in the direction of the arrow p, and the claw 34j is formed.
j abuts on the inner surface side of the fitting portion 800. As a result, the inner portion 34 does not protrude from the outer portion 30 and is positioned. The fitting portion 800 is a positioning portion that fits and holds the inner portion 34 and positions the inner portion 34 in the outer portion 30. 35 of FIG. 35
36 is shown in FIG. 36, and FIG. 37 is a diagram viewed from the direction of arrow I in FIG. In this manner, the nail 34j can be easily formed by cutting and standing up in a substantially triangular shape.

In the above-described embodiment, the information recording / reproducing apparatus or the information reproducing apparatus including the input device 18 as the electronic apparatus is used. However, the present invention is not limited to this, and the casing of the electronic apparatus of the present invention may be applied to other types or other fields. The body can be applied. For example, the present invention can be applied to many portable devices such as a notebook personal computer, a video camera, a still camera, and a telephone.

By adopting the above-described embodiment of the present invention, the structure is simple, the cost can be reduced, and the production yield can be improved. The outer part is on the appearance side of the electronic device, and can be formed mainly by drawing, drilling, outer shape punching, and the like. I do not care. The inner portion is for protecting components inside the electronic device, for example, circuit boards and electronic components, but the inner portion is mainly used for bending, drilling, punching, drawing, drawing, and doweling. Of course, a half blanking process may be performed.

By adopting the structure of the housing as in the embodiment of the present invention, even if the total thickness of the upper housing portion and the lower housing portion made of, for example, aluminum is 0.5 mm on average, it can be manufactured. can do. For this reason, the mounting volume for the circuit board and other electronic components housed inside the housing can be increased if the outer diameters are the same. The outer and inner parts of the upper and lower casing parts are made of a material with excellent heat dissipation properties such as aluminum, so that heat dissipation and magnetic shielding properties are ensured, so that circuit boards, electronic components, etc. Since the generated electromagnetic wave is absorbed / reflected, no extra electromagnetic wave is emitted to the outside of the electronic component. By adopting the housing structure as in the embodiment of the present invention, it is possible to easily set a heat radiation path for releasing heat generated by an internal circuit board and components to the outside.

In the embodiment of the present invention, the upper casing portion and the lower casing portion are formed by joining two metal plates, for example, an aluminum plate. The upper housing part and the lower housing part are each formed by caulking structure, or a structure having a caulking structure and an adhesive layer, or a structure combining caulking structure and welding, or a structure combining bonding and welding, or combining caulking, bonding and welding A structure or the like can be adopted. Also, in the case where the so-called one-touch fitting and stopping structure shown in FIGS. 26 and 32 using the fitting portion or the fitting structure is adopted in the upper housing portion and the lower housing portion, the bonding structure by the adhesive or the bonding by welding is adopted. Alternatively, it is a matter of course that the joining by the caulking structure may be used together. The upper housing portion and the lower housing portion are each made of two metal plates, and for example, one or both of the outer and inner portions of the two metal plates are made of an aluminum plate. It can be made by pressing. In this case, drawing or bending can be employed.

When the inner portion is fitted into the outer portion and stopped by one touch, the fitting structure or the fitted portion also serves as a positioning mechanism for positioning the inner portion in the outer portion. The inner portion may be fitted and joined by sliding the inner portion inside the outer portion, and bonded and welded. By employing the embodiment of the present invention, the thickness and volume of the housing of the electronic device can be reduced, the cost can be reduced, and the reliability of the housing can be improved. Further, the number of parts constituting the housing can be reduced. In other words, since screws and the like conventionally used for stopping are unnecessary,
The number of parts of the housing can be reduced. By adopting aluminum, for example, which has excellent heat dissipation, as the material of the housing, the heat dissipation effect of the heat-dissipating components placed inside the housing can be enhanced, and the housing is made of metal and can be reused. It is.

[0045]

As described above, according to the present invention,
The thickness and weight of the housing can be reduced.

[Brief description of the drawings]

FIG. 1 is an exemplary perspective view showing an example of an electronic device including a housing of the electronic device of the present invention.

FIG. 2 is an exemplary plan view showing a configuration example of an upper housing portion of the housing of the electronic device in FIG. 1;

FIG. 3 is a side view of an upper housing part of FIG. 2;

FIG. 4 is another side view of the upper housing part.

FIG. 5 is a plan view of a lower housing part.

FIG. 6 is a side view of a lower housing part.

FIG. 7 is another side view of the lower housing portion.

FIG. 8 is an enlarged view of a structure of a part A and a part B of a lower housing part in FIG. 5;

FIG. 9 is a sectional view of the input device taken along line XX of FIG. 1;

FIG. 10 is a diagram showing an example of a cross-sectional structure taken along line BB of FIG. 1;

FIG. 11 is a diagram showing a joining example of a joining portion of an upper housing portion and a lower housing portion.

FIG. 12 is an enlarged view of a structure of a portion C in FIG. 11;

FIG. 13 is a diagram showing a fitting example of a mating portion of an upper housing portion and a lower housing portion.

FIG. 14 is a diagram showing another example of mating fitting of an upper housing part and a lower housing part.

FIG. 15 is a diagram showing another example of fitting of a mating portion of an upper housing portion and a lower housing portion.

FIG. 16 is a diagram showing an example of the shape of a projection in the example of fitting of the mating portion in FIG. 15;

FIG. 17 is a view showing another example of the shape of the projection in FIG. 15;

FIG. 18 is a diagram showing a structural example in which heat generated by a heating element is released to the outside.

FIG. 19 is a diagram showing an example of forming a heat transfer path between an inner portion and an outer portion.

FIG. 20 is a diagram showing an example of a structure for holding a circuit board.

FIG. 21 is a sectional structural view taken along line CC of the embodiment in FIG. 5;

FIG. 22 is a diagram showing a state before the caulking portion in FIG. 21 is caulked.

FIG. 23 is a view as seen from a direction g in FIG. 22;

FIG. 24 is a diagram showing a state where an outer portion and an inner portion are welded at a spot weld.

FIG. 25 is a view showing still another embodiment of the present invention, showing a state in which the inner portion is inserted into the outer portion by sliding, fitted, and joined.

FIG. 26 is an enlarged view of a portion E of FIG. 25, showing a state after the inside portion has been slid and fitted into the outside portion.

FIG. 27 is a diagram showing a state before the inside portion is slid and fitted into the outside portion.

FIG. 28 is a sectional view taken along the line JJ of FIG. 26;

FIG. 29 is a sectional view taken along line HH of FIG. 26;

FIG. 30 is a view showing still another embodiment of the present invention.

FIG. 31 is a view as viewed from a direction K in FIG. 30;

FIG. 32 is a cross-sectional view taken along line GG of FIG. 31, showing a state after the inside portion has been fitted into the outside portion.

FIG. 33 is a diagram showing a state in which the inner part is being fitted into the outer part.

FIG. 34 is a view showing still another embodiment of the present invention.

FIG. 35 is a sectional view taken along line NN of FIG. 34;

FIG. 36 is a perspective view showing an example of the shape of the nail shown in FIG. 35;

FIG. 37 is a view of the nail as viewed from a direction I in FIG. 36;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Electronic device, 12 ... Case, 14 ... Upper case part (1st part), 16 ... Lower case part (2nd)
Part), 18 ... input device, 20 ... output part, 2
4 key top, 30 outer part, 34 inner part, 36 adhesive layer, 300 caulking part, 40
0: welded part, 500: fitting structure part, 700
... fitting part, 800 ... fitting part

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kenichi Ogura 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd. F-term (reference) 4E360 AB04 AB12 ED03 ED06 ED07 ED08 GA06 GA52 GB26 GC04

Claims (10)

[Claims] 1. An outer part made of metal, and an inner part arranged inside the outer part and made of metal, wherein the outer part and the inner part are joined by caulking. A housing for an electronic device, which is characterized in that: 2. The electronic device housing according to claim 1, wherein the outer portion and the inner portion are further attached with an adhesive. 3. The electronic device housing according to claim 1, wherein the outer portion and the inner portion are further joined by welding. 4. The electronic device casing according to claim 2, wherein the outer portion and the inner portion are further joined by welding. 5. The electronic device housing according to claim 1, wherein the inner portion is fitted toward an inner surface of the outer portion, and the inner portion is positioned with respect to the outer portion. 6. The electronic device housing according to claim 1, wherein at least one of the outer portion and the inner portion is formed by pressing aluminum. 7. An outer part made of metal, and an inner part arranged inside the outer part and made of metal, wherein the inner part slides on an inner surface side of the outer part. The housing of the electronic device, wherein the inner portion is fitted into and joined to the outer portion, and the inner portion is positioned with respect to the outer portion. 8. The housing for an electronic device according to claim 7, wherein said outer portion and said inner portion are further adhered by an adhesive. 9. The housing for an electronic device according to claim 7, wherein said outer portion and said inner portion are further joined by welding. 10. The electronic device according to claim 7, wherein the outer portion and the inner portion are joined by sliding, joining, bonding, and welding the inner portion on the inner surface side of the outer portion. Equipment housing.