JP2001298042A - Electrical connection method for electronic components - Google Patents

Abstract

(57) [Summary] To perform electrical inspection of a wafer having solder balls so as to prevent electrical connection failure from occurring. SOLUTION: An elastically deformable bag-like body 11 made of silicon resin or the like filled with a liquid such as water is arranged on a stage 14, and a connection electrode of a flexible substrate 12 attached to an upper surface of the bag-like body 11. The solder balls 16 of the wafer 15 are arranged on the wafer 13, and the pressing plate 17 for weight adjustment is placed on the wafer 15.
Place. Then, the solder balls 16 and the connection electrodes 1
3, the upper surface of the bag-like body 11 is elastically deformed together with the flexible substrate 12 in accordance with the height variation of the solder balls 1.
6 is in contact with each connection electrode 13 to be electrically connected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for electrically connecting electronic components.

[0002]

2. Description of the Related Art In the field of semiconductor technology such as LSI, for example, electrical inspection is sometimes performed on a wafer. In this case, even if there is a variation in the height of the plurality of bump electrodes provided on the wafer, it is necessary to perform an electrical inspection irrespective of the variation. For this reason, conventionally, as an example, as shown in FIG.
A plurality of connection electrodes 2 made of conductive rubber are formed on the lower surface of the wafer, and each of the connection electrodes 2 is connected to an inspection device (not shown) to prepare a wafer 4 placed on a stage 3.
The connection electrodes 2 of the hard substrate 1 are arranged on a plurality of bump electrodes 5 made of solder balls, and the variation of the height of the bump electrodes 5 is absorbed by the elastic deformation of each connection electrode 2, and each connection electrode 2 is formed. The bump electrodes 5 are brought into contact with each other to be electrically connected. In this case, in order to minimize the load applied to the wafer 4, the elastic deformation of the connection electrode 2 is caused by the weight of the hard substrate 1.

[0003]

However, in such a conventional electrical inspection method, since the connection electrode 2 is elastically deformed by the weight of the hard substrate 1, the connection electrode 2
Is difficult to uniformly pressurize, and there is a limit to the elastic deformation of the connection electrode 2. Therefore, if the height of the bump electrode 5 has a large variation, the variation of the height of the bump electrode 5 can be reduced by the elastic deformation of the connection electrode 2. There is a problem that the electric connection cannot be absorbed and a poor electrical connection may occur. An object of the present invention is to prevent an electrical connection failure from occurring.

[0004]

According to the present invention, a plurality of bump electrodes and a plurality of connection electrodes provided on an electronic component are arranged so as to face each other, and are elastically deformable on the back side of the plurality of connection electrodes. A plurality of bump electrodes of the electronic component are pressed against the plurality of connection electrodes by disposing a closed container, and the closed container is elastically deformed, thereby absorbing at least a variation in the height of the bump electrodes. The bump electrode and the connection electrode are connected to each other. According to the present invention, since the internal pressure of the closed container is uniform,
The plurality of connection electrodes can be uniformly pressed by the closed container arranged on the back side of the plurality of connection electrodes, and even if the height variation of the bump electrodes of the electronic component is large, the electronic deformation is caused by the elastic deformation of the closed container. All variations in the height of the bump electrode of the component can be absorbed, and therefore, an electrical connection failure can be prevented.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an electrical inspection (electrical connection) method for a wafer (electronic component) according to an embodiment of the present invention will be described with reference to FIG. First, as a test jig, a flexible substrate 12 is provided on a generally flat upper surface of an elastically deformable cubic bag-like body (sealed container) 11 made of silicon resin or the like filled with a liquid such as water (not shown).
Prepare the one on which is pasted. In this case, the connection electrode 13 made of a gold bump electrode is provided on the upper surface of the flexible substrate 12.
Is provided. Each connection electrode 13 is connected to an inspection device (not shown) for measuring electrical characteristics such as contact resistance and storage contents of a memory element provided on the wafer.

Then, the bag-like body 11 is arranged on a stage 14, and solder balls (low-melting metal balls, bump electrodes) 16 provided on the lower surface of the wafer 15 are arranged on the connection electrodes 13 of the flexible substrate 12. A pressure plate 17 for weight adjustment is arranged on the wafer 15. Then, the solder balls 16
The upper surface of the bag-like body 11 is elastically deformed together with the flexible substrate 12 in accordance with the variation in the height of the connection electrodes 13, and the solder balls 16 are brought into contact with the connection electrodes 13 to be electrically connected. In this case, since the internal pressure of the bag 11 is uniform, the connection electrodes 13
Has a uniform reaction force. Further, since there is considerable flexibility in the elastic deformation of the upper surface side of the bag-like body 11 and the flexible substrate 12, even if there is a large variation in the height of the solder balls 16 and the connection electrodes 13, the variation in the height is all reduced. Can be absorbed. Therefore, it is possible to prevent an electrical connection failure from occurring.

The wafer 15 may be attached to the lower surface of the pressure plate 17. In addition, the flexible substrate 1
A concave portion may be provided on the upper surface of the second connection electrode 13, and the solder ball 16 of the wafer 15 may be placed in the concave portion for positioning. Conversely, a wafer 15 is placed on the stage 14 and the flexible substrate 1 is placed on the wafer 15.
2 and the bag-like body 11 may be arranged. In this case, the bag-like body 11 may be simply arranged on the flexible substrate 12. In addition, the flexible substrate 1
As 2, a thin silicon substrate having a thickness of about 100 μ may be used. Further, the connection electrode 13 and the wiring associated therewith may be provided directly on the normally flat surface of the bag-like body 11 without using the flexible substrate 12.

Next, a method of mounting (electrically connecting) a semiconductor device (electronic component) according to another embodiment of the present invention will be described with reference to FIG. In this case, the semiconductor device 22 is arranged on a stage 21 with a built-in heater (not shown). The semiconductor device 22 has a solder ball 23 provided on the upper surface. Then, the connection electrodes 25 made of copper foil or the like provided on the lower surface of the flexible substrate 24 are arranged on the solder balls 23 of the semiconductor device 22, and the bag-like body 26 having the same structure as above is arranged on the flexible substrate 24. .

Then, the lower surface of the bag-like body 26 is attached to the flexible substrate 24 according to the variation in the height of the solder balls 23.
And the connection electrodes 25 are connected to the solder balls 23.
Contacted. Then, in this state, when the heater of the stage 21 is heated, the solder balls 23 are reflowed and joined to the connection electrodes 25.
4, a semiconductor device 22 is mounted.

[0010] Also in this case, since the internal pressure of the bag-like body 26 is uniform, the connection electrodes 25 of the flexible substrate 24 are uniformly pressed. Further, since there is considerable freedom in the elastic deformation of the lower surface side of the bag-like body 26 and the flexible substrate 24, even if the height variation of the solder ball 23 is large, it is possible to absorb all the height variation. it can. Therefore, it is possible to prevent an electrical connection (bonding) failure from occurring.

In the case of heating or a burn-in test as described above, the liquid to be filled in the bag-like body is
A material having a high boiling point and a low viscosity at a high temperature, for example, aniline may be used. Further, a gas instead of a liquid may be sealed at an appropriate pressure.

[0012]

As described above, according to the present invention, since the internal pressure of the closed container is uniform, the plurality of connection electrodes are uniformly applied by the closed container disposed on the back side of the plurality of connection electrodes. Pressure, and even if there is a large variation in the height of the bump electrodes of the electronic component, the variation in the height of the bump electrodes of the electronic component can be completely absorbed by the elastic deformation of the sealed container. Can be prevented from occurring.

[Brief description of the drawings]

FIG. 1 is a view for explaining a method for electrically inspecting a wafer according to an embodiment of the present invention.

FIG. 2 is a view illustrating a method for mounting a semiconductor device according to another embodiment of the present invention;

FIG. 3 is a view for explaining a conventional wafer electrical inspection method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Bag-shaped body 12 Flexible board 13 Connection electrode 15 Wafer 16 Solder ball 22 Semiconductor device 23 Solder ball 24 Flexible board 25 Connection electrode 26 Bag-shaped body

Claims (7)

[Claims] 1. A method according to claim 1, wherein a plurality of bump electrodes and a plurality of connection electrodes provided on the electronic component are arranged to face each other, and an elastically deformable hermetically sealed container is arranged on a back side of the plurality of connection electrodes. By pressing a plurality of bump electrodes of the component and the plurality of connection electrodes, and the closed container is elastically deformed,
An electrical connection method for an electronic component, wherein the bump electrode and the connection electrode are connected to each other by absorbing at least a variation in height of the bump electrode. 2. The method according to claim 1, wherein a liquid is filled in the closed container. 3. The electrical connection of an electronic component according to claim 1, wherein the connection electrode is provided on a surface of a flexible substrate closely contacted with a surface of the closed container. Method. 4. The method according to claim 3, wherein the flexible substrate is a thin silicon substrate. 5. The method according to claim 1, wherein the connection electrode is connected to an electrical inspection device. 6. The method according to claim 5, wherein the bump electrodes of the electronic component are made of low-melting metal balls. 7. The method according to claim 6, wherein said connection electrode comprises a bump electrode having a concave portion on a protruding surface.