JP2001296458A - Optical communication module - Google Patents

Abstract

(57) [Problem] To provide an optical communication module capable of reducing thermal resistance. An optical communication module includes optical-electrical conversion devices and a housing. Light
The electrical conversion devices 12, 14 can convert one of the optical signal and the electrical signal into the other. Housing 2
Has receptacles 24 and 26 provided to receive an optical connector. The housing 2 defines an accommodation space in which the optical-electrical conversion device is accommodated so as to be optically connectable to the optical connector at the receptacles 24 and 26. The housing 2 has a ventilation hole 8 communicating with the accommodation space.
e, 10 g, 10 h. Ventilation holes 8e, 10g, 1
The gas flowing through 0h cools the opto-electrical conversion devices 12,14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to an optical communication module.

[0002]

2. Description of the Related Art British Patent Publication (GB2294412)
No. 5) describes an optoelectronic transceiver. As shown in FIG. 9, the transceiver 100 includes a storage container, in which a photodiode package and a laser diode package are stored. The storage container has a front end portion 102 and a rear end portion 104.
And the front end portion 102 has a pair of receptacles 106 and 108 into which the optical connector is inserted. One of the pair of receptacles 106 and 108 is for a plug for transmission, and the other is for a plug for reception.

[0003]

The inventor has been studying an optical communication module typified by this optoelectronic transceiver. In the course of the study, we discovered a problem with the heat dissipation performance of the optical communication module.

Therefore, an object of the present invention is to provide an optical communication module capable of reducing the thermal resistance.

[0005]

First, the inventor considered the optical communication module from the viewpoint of heat radiation characteristics. In such an optical communication module, the generated heat is finally released to the atmosphere. Heat is generated in a device mounting area such as a semiconductor light emitting device, a driving integrated circuit therefor, and a signal amplification integrated circuit for a semiconductor light receiving device. Since these circuits are mounted on a printed circuit board, the following routes can be considered for releasing generated heat.

That is, the path is: integrated circuit (heat source) → conductive layer of substrate → lead pin of optical communication module → mounting board of optical communication module → atmosphere. According to the study of the inventor, when the thermal resistance of the mounting board is small, this path is considered to be a main heat radiation path, but many elements pass through to the atmosphere. For this reason, it is conceivable that some measure is required to reduce the thermal resistance.

The inventor has made various trial and error attempts to achieve this object.

An optical communication module according to the present invention has a first
And a housing.
The first optical-to-electrical conversion device can convert one of the optical signal and the electrical signal to the other. The housing has a receptacle provided to receive the optical connector. The housing may also include a first optical connector for optically coupling with the optical connector at the receptacle.
An accommodation space for accommodating the electric conversion device is defined. The housing has first and second through holes communicating with the housing space.

In the housing space, a first light-to-electricity conversion device that can be a heat source is housed. The housing space communicates with the outside of the housing space via the first and second through holes. The gas circulating through the first and second through holes cools the first photoelectric conversion device.

The features according to the present invention described below can be arbitrarily combined, whereby the respective actions and effects and the actions and effects obtained by the combination can be enjoyed.

In the optical communication module according to the present invention, the housing may include a receptacle member provided with the first receptacle and a housing member supporting the first optical-electrical conversion device. The first and second through holes are provided in the housing member. Therefore, the through hole is
It can be provided close to the first light-to-electric conversion device to be cooled.

In the optical communication module according to the present invention, the accommodating member is provided between the mounting member having the mounting portion for mounting the first optical-electrical conversion device and the mounting member for mounting the first optical-electrical conversion device. It may have a covering member provided so as to sandwich it.

In such an optical communication module, the first through hole can be provided in the mounting member, and the second through hole can be provided in the cover member. Since the first photoelectric conversion device is arranged between the mounting member and the cover member, the first and second through holes may be provided at positions sandwiching the first photoelectric conversion device. it can. This arrangement is effective for cooling the first photoelectric conversion device.

In such an optical communication module, the first and second through holes can be provided in the mounting member. Further, the first and second through holes can be provided in the cover member. Since the first photoelectric conversion device is mounted on the mounting member, the first and second through holes can be arranged in accordance with the arrangement position on the mounting member.

In the optical communication module according to the present invention, the first optical-electrical conversion device is a conversion semiconductor element for converting an optical signal and an electric signal in any direction, and is electrically connected to the conversion semiconductor element. A wiring board can be included.

In such an optical communication module,
The wiring board of the first photoelectric conversion device can be arranged along a predetermined plane. The first and second through holes can be provided in a wall of the housing member that intersects a predetermined plane. Since the through hole is provided in the wall intersecting this plane, the gas flows along a predetermined plane. Thereby, the wiring board is cooled.

In such an optical communication module, the cover member may include a conductive member, and the first member may include a first member.
Of the present invention can have a conductive piece bent so as to be in contact with the wiring board of the photoelectric conversion device. The conductive piece enables heat to be conducted from the wiring board to the cover member.

In such an optical communication module,
The housing may have lead terminals connected to the wiring board of the first photoelectric conversion device. Since the lead terminals are connected to the conductive layer of the wiring member, they are useful for conducting heat from the wiring board.

The optical communication module according to the present invention can further include a second optical-electrical conversion device capable of converting one of an optical signal and an electric signal into the other. The housing can have a second receptacle provided to receive the optical connector. Second
May be housed in the housing space of the housing so as to be optically connectable to the optical connector in the second receptacle.

According to this embodiment, the features of the present invention described above and the features of the present invention described below can be applied to an optical communication module including a pair of optical-electrical conversion devices. .

That is, the first and second optical-electrical conversion devices that can be heat sources are accommodated in the accommodation space. The housing space communicates with the outside of the housing space via the first and second through holes. The first and second photoelectric conversion devices are cooled by the gas circulating through the first and second through holes.

In the optical communication module according to the present invention, the housing member may have a wall provided between the first and second optical-electrical conversion devices. The second optical-electrical conversion device can include a conversion semiconductor element that converts an optical signal and an electric signal in any direction, and a wiring board that is electrically connected to the conversion semiconductor element. First
The wiring board of the photoelectric conversion device and the wiring board of the second photoelectric conversion device can be arranged along the wall of the housing member. Therefore, the gas flow can be guided in the direction along this direction. Since the gas flow is unlikely to be disturbed, the gas flows along the wiring board, and the cooling effect is enhanced.

In the optical communication module according to the present invention, the first and second receptacles can be arranged side by side in the housing in the first direction.
The wiring board of the first photoelectric conversion device and the wiring board of the second photoelectric conversion device are arranged along a plane extending in the first direction. Since the wiring board of the first photoelectric conversion device and the wiring board of the second photoelectric conversion device are both arranged along the same plane,
The gas flow can be guided in a direction along this plane. Therefore, the gas flow is hardly disturbed. Further, since the gas flows along the wiring board, the cooling effect is enhanced.

An optical communication module according to the present invention includes a first optical-electrical conversion device and a housing. The first optical-electrical conversion device has a conversion semiconductor element for converting an optical signal and an electric signal in any direction, and a wiring board electrically connected to the conversion semiconductor element. The wiring board includes a component mounting surface on which electronic components are mounted, and a facing surface facing the component mounting surface. The housing has a receptacle provided to receive the optical connector. The housing also defines an accommodation space in which the first photoelectric conversion device is accommodated so as to be optically connectable to the optical connector in the receptacle. Further, the wiring board of the first photoelectric conversion device has a first conductive layer provided on the component mounting surface on which the electronic component is mounted, a second conductive layer provided on the facing surface, and a wiring. A conductive portion that connects the first conductive layer and the second conductive layer provided to penetrate the substrate; The housing includes a conductive member, and the conductive member has a contact portion that contacts a second conductive layer provided on a facing surface of a wiring board included in the first photoelectric conversion device.

Heat from the electronic component, which is a main heat source, is radiated from the housing including the conductive member through the first conductive layer, the conductive portion, the second conductive layer, and the contact portion.

The features according to the present invention described below can be arbitrarily combined, whereby the respective actions and effects and the actions and effects obtained by the combination can be enjoyed.

In the optical communication module according to the present invention, the contact portion of the conductive member is located at a position on the facing surface corresponding to a position on the component mounting surface on which the first conductive layer on which the electronic component is mounted is provided. , And the second conductive layer. In this case, the heat radiation path is shortened, and the thermal resistance is reduced.

In the optical communication module according to the present invention, the housing has a receptacle member provided with the first receptacle, and a housing member for housing the first optical-electrical conversion device. And the accommodation member contains a conductive member. With this configuration, the contact portion is provided on the housing member including the conductive member.

In the optical communication module according to the present invention, the first
The wiring board of the optical-electrical conversion device is arranged along a predetermined plane. The contact portion is provided on a wall of the housing member extending along a predetermined plane. In this case, the heat radiation path is shortened, and the thermal resistance is reduced.

[0030] In the optical communication module according to the present invention, the accommodating member is provided between the mounting member having the mounting portion for mounting the first optical-electrical conversion device and the mounting member for mounting the first optical-electrical conversion device. There is a cover member provided so as to sandwich the cover member, and the cover member includes a conductive member. If you do this,
The contact portion is provided on a cover member including a conductive member.

In the optical communication module according to the present invention, the contact portion includes a conductive piece cut out from a part of the conductive member and bent. With this configuration, heat is conducted to the conductive member by the conductive piece cut out from the conductive member and bent.

In the optical communication module according to the present invention, the housing has a lead terminal electrically connected to the wiring board of the first photoelectric conversion device. The lead terminals are
Helps to conduct heat from the wiring board.

[0033]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The knowledge of the present invention can be easily understood by considering the following detailed description with reference to the accompanying drawings. Subsequently, embodiments of the present invention will be described with reference to the accompanying drawings. If possible,
The same portions are denoted by the same reference numerals, and redundant description will be omitted.

Referring to FIGS. 1 to 3, an optical communication module 1 according to an embodiment of the present invention is shown.

The optical communication module 1 includes a housing 2 and
A first optical-electrical conversion device 12 and a second optical-electrical conversion device 14 are provided. The housing 2 can include a housing member 4 and a receptacle member 6. The housing member 4 supports first and second optical-electrical conversion devices 12 and 14. The receptacle member 6 includes receptacles 24, 2 extending along a predetermined axis.
6 are provided. The receptacles 24 and 26 are provided to receive an optical connector (eg, 52 in FIG. 6). The housing member 4 includes the mounting member 8 and the cover member 1.
Has zero. The mounting member 8 is a light-electric conversion device 1
2, 14 are mounted. The cover member 10 is installed on the mounting member 8 such that the photoelectric conversion devices 12 and 14 are sandwiched between the cover member 10 and the mounting member 8.

The housing 2, that is, the receptacle member 6, the mounting member 8, and the cover member 10 accommodate the optical-electrical conversion devices 12, 14 so that they can be optically coupled to the optical connectors at the receptacles 24, 26. Define the space.

The receptacle member 6 is connected to the receptacle 2
It has an outer wall portion 28a and a partition wall 28b provided along a predetermined axis so as to define 4, 26. Partition wall 28b
Are provided so as to form the receptacles 24 and 26 in cooperation with the outer wall 28a. Receptacle 24, 26
Have a guide hole 30 extending along a predetermined axis at the bottom portion 28c. The guide holes 30 guide the heads of the optical-electrical conversion devices 12 and 14 so as to protrude into the receptacles 24 and 26 along a predetermined axis. The material of the receptacle member 6 is preferably formed of a synthetic resin material such as a liquid crystal polymer because it is easy to form a fine form. The receptacle member 6 is preferably coated on its surface with a conductive film such as a plating film to enable electrical shielding. The receptacle member 6 can also have a wall surface 28e provided between the heads of the photoelectric conversion devices 12, 14 inserted into the respective guide holes 30. This wall 28e
Serve to electrically shield between the opto-electrical conversion devices 12,14.

The receptacle member 6 can have a recess 34a on one surface of the outer wall. The concave portion 34a can have a first engagement portion 34b for latching, and the first engagement portion 34b can include, for example, at least one of a hole and a projection. The first engagement portion 34b can be used when the receptacle member 6 is fitted and fixed to the mounting member 8.

The receptacle member 6 has the guide hole 3
It has a protection unit 35 for protecting the light-to-electricity conversion devices 12 and 14 inserted into 0. The protection section 35 extends along a predetermined reference plane and has a second engagement section 35a for latch. The second engagement portion 35a can include at least one of a hole and a protrusion. In the present embodiment,
The second engagement portion 35a can be, but is not limited to, an engagement hole. The protection section 35 is guided to a guide recess provided on the outer wall of the mounting section 8 a of the mounting member 8. The engaging portion 35a is provided on the mounting portion 8 of the mounting member 8.
a is fitted to the engaging portion provided on the outer wall of FIG. The engagement portion may include at least one of a hole and a protrusion.

The terminal member 36 is arranged so as to be in contact with the receptacle member 6. The terminal member 36 has a conductive property and a conductive material such as a metal (for example, phosphor bronze).
It is preferable to be formed by. Thereby, predetermined mechanical strength can be secured while securing electrical connection.

The terminal member 36 is connected to the receptacles 24 and 26.
Are arranged so as to be in contact with each other along the bottom portion 28c. Thereby, the terminal member 36 is used to connect the receptacle member 6 to the reference potential line of the mounting board. For this reason, the terminal member 36 includes one or a plurality of connection terminals 36a called stud pins extending in a direction along the terminal pins 32a. When there are a plurality of connection terminals 36a, the terminal member 36 has a bridge portion that connects the pair of terminals 36a via the bottom surface of the receptacle member 6. For this reason, the bridge portion is accommodated in a concave portion provided on the bottom surface of the receptacle member 6. The terminal member 36 is held by the receptacle member 6 by being positioned in the outer frame of the guide hole 30 and the concave portion and being fitted into a groove provided in the outer frame of the guide hole 30.

The mounting member 8 has a mounting portion 8a extending along a predetermined reference plane. The mounting portion 8a has a series of terminal pins 32a for enabling electrical connection of the optical-electrical conversion devices 12, 14. The terminal pins 32a are provided on the bottom surface of the mounting portion 8a facing the mounting board (not shown),
It is bent at a predetermined position from the mounting surface of the mounting portion. The terminal pins 32a are arranged along the direction in which the wiring boards 18 and 22 are arranged. In the present embodiment, the terminal pins 32a
Are provided along a predetermined axis.

The mounting member 8 can have a wall 8b along a plane extending in a direction intersecting a predetermined reference plane. The wall 8b is provided on the mounting surface. Wall 8
b is provided so as to separate the accommodating space for the photoelectric conversion devices 12 and 14. For this reason, it is helpful to reduce the thermal effect of one of the photoelectric conversion devices 12, 14 directly on the other. In addition, this wall 8
Providing a conductive member (not shown) along “b” helps to reduce the electric influence.

The mounting member 8 has a latch 8c supported at one end of the wall 8b. The latch portion 8c is provided with a latch piece extending along a predetermined reference plane,
The latch piece includes a latch engaging portion 3 of the receptacle member 6.
4b can be provided with an engaging portion 8d. The engagement portion 8d can be at least one of an engagement hole and an engagement protrusion. The concave portion 34a of the receptacle member 6 serves to guide the latch piece.

First and second photoelectric conversion devices 1
Each of 2, 14 is capable of converting one of the optical and electrical signals to the other. These include a semiconductor light receiving device that converts an optical signal into an electric signal and a semiconductor light emitting device that converts an electric signal into an optical signal. The semiconductor light receiving device can include a photoelectric conversion element unit and a first wiring board arranged along a predetermined axis. The semiconductor light emitting device can include an electro-optical conversion element unit and a second wiring board arranged along a predetermined axis.

The wiring boards 18 and 22 have component mounting surfaces 18 a and 22 a on which various electronic components are mounted, and the opposing surface 18.
b, 22b. The component mounting surfaces 18a, 22a and the opposing surfaces 18b, 22b extend along a predetermined axis.
A conductive layer (18e, 22e in FIG. 5) formed of a metal such as copper can be provided on almost the entire surface of the opposing surfaces 18b, 22b. The conductive layers 18e and 22e are preferably connected to a reference potential line. Component mounting surface 18a,
22a is provided with a wiring layer for enabling electrical connection between mounted components. The wiring boards 18 and 22 are also provided with connection pins for photoelectric conversion elements or electro-optical conversion elements.
(50 in FIGS. 4A and 4B) into which the first holes 18c and 22c are inserted, and the lead terminal 3 provided in the housing member.
2a are provided with second holes 18d and 22d.
First hole 18c, 22c and second hole 18d, 22d
Penetrates from one of the component mounting surface and the opposing surface to the other. The first holes 18c and 22c are
Is provided along a predetermined axis on one side. Second hole 1
8d and 22d are provided at one end of the wiring board extending along a predetermined axis.

The wiring boards 18 and 22 are mounted on the component mounting surface 18.
a, 22a are preferably arranged so as to face the side surface of the wall portion 8b. Thereby, the wiring board 18,
A predetermined space is secured between the wall 22 and the wall 8b. The wiring boards 18 and 22 are arranged in parallel with the wall 8b interposed therebetween.
This is supported by the terminal pins 32 a provided on the mounting member 8, and the conductive pieces 10 f
Of the conductive piece 10f and the supporting portions 8h, 8
i, 8j. The terminal pins 32a are connected to the conductive layers 18e of the wiring boards 18 and 22,
Since it is connected to 22e, it serves to discharge the heat generated in the wiring boards 18 and 22 to the outside of the optical module 1.

Each of the wiring boards 18 and 22 has a thermal via (conductive portion) 18 formed of a metal such as copper in its insulating layer.
f, 22f. FIG.
It is sectional drawing which shows typically the structure in the site | part where 8 and 22 electronic components 19 are mounted. As shown in FIG. 5, conductive layers 18g and 22g are provided on the component mounting surfaces 18a and 22a of the wiring boards 18 and 22 by a metal such as copper, and the electronic component 19 is provided on the conductive layers 18g and 22g. And sealed with a potting resin 21. The thermal vias 18f and 22f
g, 22g and the conductive layers 18e, 22e provided on the opposing surfaces 18b, 22b are thermally and electrically connected.

The covering member 10 is combined with the mounting member 8 to form the first and second photoelectric conversion devices 12 and 14.
The space for accommodating is formed. It is preferable that at least a part of the covering member 10 is formed of a conductive material such as a copper alloy. This serves to electrically shield the first and second opto-electrical conversion devices 12, 14 such as the wiring boards 18, 22 and to release heat.

The covering member 10 has side surfaces 10a, 10b
, A lid 10c, and a rear surface 10d. Side part 1
0a, 10b extend along the wall 8b of the mounting member 8,
Wiring boards 18 and 22 of photoelectric conversion devices 12 and 14
Is sandwiched from both sides. Further, the side portions 10a and 10b can be arranged so as to face the opposing surfaces of the wiring boards 18 and 22. The lid part 10c faces the mounting part 8a,
Side portions 10a and 10b are provided on opposite sides of the lid 10c. The rear surface portion 10d includes the side surface portions 10a, 10
b and the lid 10c, and the receptacles 24, 26
Intersects a predetermined axis along the direction in which The covering member 10 also includes side surfaces 10a and 10b and a rear surface 1
0d, a connection terminal 10e provided on at least one of
Can be provided. The connection terminal 10e is provided so as to be connected to a reference potential line of the mounting board when the optical communication module 1 is mounted on the mounting board.
As a result, the reference potential line is applied to the cover member 10, so that the electric shield characteristics can be reliably obtained.

One or a plurality of conductive pieces 10f are provided on the side surfaces 10a and 10b. The conductive piece 10f is formed by cutting out a part of the side surfaces 10a and 10b, and is bent from a plane including the side surfaces 10a and 10b into the storage space. This bending is caused by the fact that the conductive piece 10f is
Conductive layer 1 provided on opposing surfaces 18b, 22b of 8, 8
8e and 22e. By this contact, the electronic component 19 is used as a main heat source to
The heat generated in 8 and 22 is transmitted to the cover member 10. The cover member 10 releases this heat to the air through the surface of the cover member 10. That is, the cover member 10 also serves as a heat sink.

Here, the conductive piece 10f of the covering member 10 is
As shown in FIG. 5, the conductive layer 1 on which the electronic component 19 is mounted
It is preferable to contact the conductive layers 18e, 22e at positions on the opposing surfaces 18b, 22b corresponding to positions on the component mounting surfaces 18a, 22a provided with 8g, 22g. By doing so, the heat radiation path is shortened, heat is efficiently radiated, and the thermal resistance is reduced.

The lid 10c has one or more openings 10
g is provided. The opening 10g preferably has a shape extending in a direction along a predetermined axis. This direction matches the direction in which the wiring boards 18 and 22 are arranged. In addition, these openings 10g are connected to the wiring board 1
8 and 22 can be arranged according to the area in the storage space where they are located.

The rear surface portion 10d has one or more openings 10
h is provided. The opening 10h preferably has a shape extending in a direction from the lid 10c toward the mounting member 8. This direction matches the direction in which the wiring boards 18 and 22 are arranged with respect to the mounting surface, or the direction in which the wall 8b of the mounting member 8 extends from the mounting surface. Also, it is preferable that these openings 10h are arranged in accordance with the positions in the storage space where the wiring boards 18 and 22 are fixed.

FIG. 3 shows the optical communication module 1 as viewed obliquely from below. In the mounting part 8a,
One or more openings 8e are provided. Opening 8e
Extend along the arrangement direction of the wiring boards 18 and 22. In the present embodiment, the opening 8e is provided along the predetermined axis at the position of the wiring boards 18 and 22.

Referring to FIG. 2 and FIG. 3, there is shown an optical communication module 1 in which the parts shown in FIG. 1 are assembled and completed. A procedure necessary for obtaining such an optical communication module 1 is schematically shown. First, the semiconductor light receiving device and the semiconductor light emitting devices 12, 14 are assembled. For this assembly, the photoelectric conversion element is fixed to the wiring board and / or the electro-optical conversion element is fixed to the wiring board (arrow A in FIG. 1). Next, the receptacle member 6 and the terminal member 36 are plated respectively, and the receptacle member 6 and the terminal member 36 are assembled. Semiconductor light receiving device and semiconductor light emitting devices 12, 14
Is attached to the mounting member 8 (arrow B in FIG. 1). Subsequently, the mounting member 8 to which these devices 12 and 14 are attached is fitted to the receptacle member 6 (arrow C in FIG. 1). Thereafter, the cover member 10 is fitted to the receptacle member 6 and the mounting member 8 so as to form an accommodation space (FIG. 1).
Arrow D). In this fitting, the engaging portion 8g (for example, one of the concave portion and the convex portion) of the mounting member 8 and the engaging portion 10i (for example, the other of the concave portion and the convex portion) of the cover member 10 shown in FIG. Utilization can be done.

Referring to FIGS. 4A and 4B, the photoelectric conversion element and the photoelectric conversion element 40 included in the first and second photoelectric conversion devices 12 and 14 are shown. . As an example of the photoelectric conversion element 40, there is a semiconductor light receiving element such as a photodiode (a pin photodiode or an avalanche photodiode). As an example of the electro-optical conversion device 40, there is a semiconductor light emitting device such as a light emitting diode and a semiconductor laser.

Photoelectric conversion element and electro-optical conversion element 40
Can be respectively housed in a container 42 such as a package. The container 42 has an element housing part 42a and a guide part 42b.

The element accommodating portion 42a of the container 42 has a photoelectric conversion element and an electro-optical conversion element 44 sealed therein.
The element accommodating portion 42a has a base 42c formed of a metal material such as Kovar. A lens cap 42 made of a metal material such as stainless steel is provided on the base 42c.
d is mounted. The element accommodating portion 42a is provided with a window 48 fixed to the lens cap 42d. The window 48 allows light associated with the photoelectric conversion element and the electro-optical conversion element 40 to pass therethrough, and may include a condenser lens. The lens cap 42d is inserted into a holder 40d made of a metal material such as stainless steel. The base 42c can also have a connection pin 50 for making an electrical connection between the photoelectric conversion element and the photoelectric conversion element 40. The container 42 is fixed to the wiring boards 18 and 22 for each via connection pins 50.
The connection pins 50 are each bent such that the optical axis 46 of the element 44 is along a predetermined axis.

The guide portion 42b has a guide member 42e made of a metal material such as stainless steel. The guide member 42e is fixed on the holder 42d. A sleeve 42f made of a metal material such as stainless steel is disposed outside the guide member 42e. Guide member 42
In e, a split sleeve 42g formed of a material such as zirconia is housed. The split sleeve 42g positions the stub 42h in which the optical fiber is stored. The split sleeve 42g is fixed to the sleeve 42f via a fixing member 42i.

FIG. 6 is a side view of the optical communication module 1 according to the present embodiment. The optical connector 52 is inserted into the optical communication module 1 from the direction of the arrow 51.

FIG. 7 shows a drawing in section II in FIG. In this cross section, the opening 8e of the mounting portion 8a provided on the mounting member 8, the conductive piece 10f of the side surface portion 10a provided on the cover member 10, and the opening 10h of the rear surface portion 10d appear. Between the opening 8e of the mounting portion 8a provided on the mounting member 8 and the opening 10h of the rear surface portion 10d provided on the cover member 10, flows A and B of a heat medium such as air may occur. These openings allow gas to flow along the wiring boards 18, 22 and thus serve to cool the wiring boards 18, 22. Further, an opening is provided in association with the conductive piece 10f of the cover member 10. Since the flows C and D of the heat medium flow along the wiring boards 18 and 22, they serve to cool the wiring boards 18 and 22.

FIG. 8 is a drawing showing a section taken along the line II-II in FIG. According to this drawing, the wiring boards 18 and 22 are supported on the support surface 8f, and are fixed by the terminal pins 32a. In this cross section, an opening 8e of the mounting portion 8a provided on the mounting member 8 and an opening 10g of the lid 10c provided on the cover member 10 appear. An opening 8e of a mounting portion 8a provided in the mounting member 8;
A flow E and F of a heat medium such as air can be generated between the cover 10c and the opening 10g of the cover 10c. These openings serve to cool the wiring boards 18, 22 as they allow gas to flow along the wiring boards 18, 22.

In the optical communication module according to the embodiment described so far, the optical-electrical conversion device has the wiring board 1 arranged substantially parallel to the wall 8 b of the housing member 4.
Although the case where the wiring boards 18 and 22 are provided has been described as an example, the arrangement of the wiring boards 18 and 22 is not limited to the embodiment of the present invention.

The wiring board provided in the photoelectric conversion device can be arranged along the mounting portion of the mounting member 8. In addition, the wiring board can be arranged in a direction intersecting an axis along which the receptacle provided on the receptacle member extends. In these cases, in order to guide the heat medium along the wiring board in this arrangement, it is preferable to provide ventilation holes in the opposing walls of the housing member 4.

Even in such a form, if the guide wall is provided so as to control the flow of the heat medium, the flow of the gas is less likely to be disturbed, and the gas flows along the wiring board, so that the cooling effect is enhanced. Further, by providing a contact portion in contact with the conductive layer of the wiring board on the housing, heat is efficiently dissipated and the cooling effect is enhanced.

As described above, since the accommodation space is connected to the outside by the holes performing the ventilation function, the optical-electrical conversion devices 12 and 14 can be cooled by the air flowing through the ventilation holes. It is now possible. The ventilation holes are preferably arranged so as to form a flow of air along the wiring boards 18 and 22. For this purpose, it is preferable to provide ventilation holes on the opposite wall surfaces of the storage container. Further, since the wall portion 8b of the mounting member 8 has a guide function for guiding the flow of gas, the flow of gas can be effectively guided and used for heat radiation. Further, through the thermal via 18 and the conductive piece 10f, heat from the electronic component 19, which is a main heat source, can be efficiently radiated.

According to the experiment performed by the inventor, the semiconductor light emitting device generates 0.25 W to 0.5 W as a whole and the semiconductor light receiving device generates 0.3 W to 0.4 W as a whole.
It turned out that there was heat generation of W. In such a semiconductor light receiving device and an optical communication module including the semiconductor light emitting device, the temperature rise ΔT during operation is 6
It was about 5 deg. However, it has been found that, when this optical communication module adopts the form as in the present embodiment, the temperature of the optical communication module can be suppressed to about 55 ° C. even during operation.

Although the above description exemplifies the case where the optical communication module includes a semiconductor light emitting device and a semiconductor light receiving device, the present invention is not limited to only such a combination. The present invention can be applied to an optical communication module including at least any number of semiconductor light emitting devices and semiconductor light receiving devices.

As described above, according to the optical communication module according to the present invention, a medium having a relatively low thermal conductivity, for example, a plastic and a resin material can be used without passing through the medium.
Since heat is directly emitted to a heat medium such as the atmosphere, or heat is emitted in a short path through a conductor, heat radiation characteristics are excellent. Therefore, an optical communication module that can reduce the thermal resistance can be obtained.

[0071]

As described above in detail, according to the present invention, there is provided an optical communication module capable of reducing thermal resistance. Therefore, operation failure due to heat is suppressed, and characteristics are improved.

[Brief description of the drawings]

FIG. 1 is a drawing showing main components constituting an optical communication module according to an embodiment of the present invention.

FIG. 2 is a drawing showing an optical communication module according to an embodiment of the present invention.

FIG. 3 is a drawing showing an optical communication module according to an embodiment of the present invention.

FIGS. 4 (a) and 4 (b) are drawings showing an optical-electrical conversion device.

FIG. 5 is a cross-sectional view schematically showing a structure of a portion of the wiring board on which electronic components are mounted.

FIG. 5 is a side view showing the optical communication module according to the embodiment of the present invention.

FIG. 7 is a cross-sectional view of the optical communication module according to the embodiment of the present invention, taken along section II of the optical communication module;

FIG. 8 is a sectional view taken along line II-II of the optical communication module according to the embodiment of the present invention;

FIG. 9 is a drawing of an optical communication module according to a conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Optical communication module, 2 ... Housing, 4 ... Housing member, 6 ... Receptacle member, 8 ... Mounting member, 10 ... Covering member, 10f ... Conductive piece, 12, 14 ... Light-electric conversion device, 18, 22 ... Wiring Substrate, 18a, 22a: Component mounting surface, 18b, 22b: Opposing surface, 18e, 22e: Conductive layer, 18f, 22f: Thermal via, 18g, 22g ...
Conductive layer, 19: electronic component, 8e, 10g, 10h: vent, 24, 26: receptacle

Claims (17)

[Claims] 1. A first optical-electrical conversion device capable of converting one of an optical signal and an electric signal to the other, and a receptacle provided so as to receive an optical connector, wherein the light is transmitted through the receptacle. And a housing defining an accommodation space in which the first light-to-electrical conversion device is accommodated so as to be optically connectable to a connector, wherein the housing is connected to the accommodation space by first and second passages.
An optical communication module having a through hole. 2. The housing has a receptacle member on which the first receptacle is provided, and a housing member for housing the first photoelectric conversion device. The first and second through holes are The optical communication module according to claim 1, wherein the optical communication module is provided in the housing member. 3. The mounting member includes a mounting member having a mounting portion for mounting the first optical-electrical conversion device, and the mounting member has the first optical-electrical conversion device sandwiched between the mounting member and the mounting member. 3. The device according to claim 2, further comprising a cover member provided, wherein the first through hole is provided on the mounting member, and the second through hole is provided on the cover member. 4. Optical communication module. 4. The mounting member includes a mounting member having a mounting portion for mounting the first optical-electrical conversion device, and the mounting member has the first optical-electrical conversion device sandwiched between the mounting member and the mounting member. The optical communication module according to claim 2, further comprising a cover member provided, wherein the first and second through holes are provided in the cover member. 5. The first light-to-electricity conversion device includes a conversion semiconductor element for converting an optical signal and an electric signal in any direction, and a wiring board electrically connected to the conversion semiconductor element. The wiring board of the first photoelectric conversion device is disposed along a predetermined plane, and the first and second through holes are provided on a wall of the housing member that intersects the predetermined plane. The optical communication module according to any one of claims 2 to 4, wherein: 6. The first light-to-electricity conversion device includes a conversion semiconductor element for converting an optical signal and an electric signal in any direction, and a wiring board electrically connected to the conversion semiconductor element. The covering member includes a conductive member, and the conductive member includes:
The optical communication module according to claim 3, further comprising a conductive piece bent to contact the wiring board of the first optical-electrical conversion device. 7. The first light-to-electricity conversion device includes a conversion semiconductor element for converting an optical signal and an electric signal in any direction, and a wiring board electrically connected to the conversion semiconductor element. The optical communication module according to any one of claims 1 to 6, wherein the housing has a lead terminal electrically connected to the wiring board of the first photoelectric conversion device. 8. A second receptacle, further comprising a second optical-to-electrical conversion device capable of converting one of an optical signal and an electrical signal to the other, wherein the housing is provided to receive an optical connector. Wherein the second optical-electrical conversion device is supported in the housing space of the housing so as to be optically connectable to the optical connector in the second receptacle.
The optical communication module according to claim 1. 9. The housing member has a wall provided between the first and second optical-electrical conversion devices, and the second optical-electrical conversion device converts an optical signal and an electrical signal A conversion semiconductor element for converting in any direction, and a wiring board electrically connected to the conversion semiconductor element, wherein the wiring board of the first photoelectric conversion device and the second photoelectric conversion device The optical communication module according to claim 8, wherein the wiring board is disposed along the wall of the housing member. 10. The first and second receptacles are arranged side by side in the housing along a first direction, and a wiring board of the first optical-electrical conversion device and the second optical-electrical device. The optical communication module according to claim 8, wherein the wiring board of the electric conversion device is arranged along a plane extending in the first direction. 11. A conversion semiconductor device for converting an optical signal and an electric signal to any direction, a component mounting surface on which an electronic component is mounted, and an opposing surface facing the component mounting surface, the conversion semiconductor device being electrically connected to the conversion semiconductor device. A first optical-to-electrical conversion device having a wiring board connected to the optical connector, and a receptacle provided to receive the optical connector, wherein the receptacle is optically coupled to the optical connector at the receptacle. A housing defining a housing space in which the first photoelectric conversion device is accommodated, wherein the wiring board of the first photoelectric conversion device is provided with the electronic component provided on the component mounting surface. A first conductive layer on which the first conductive layer is mounted, a second conductive layer provided on the facing surface, and the first conductive layer and the second conductive layer provided so as to penetrate the wiring board. The housing includes a conductive member, and the conductive member is provided on the facing surface of the wiring substrate included in the first photoelectric conversion device. An optical communication module having a contact portion that contacts the second conductive layer. 12. The contact portion of the conductive member, at a position on the facing surface corresponding to a position on the component mounting surface provided with the first conductive layer on which the electronic component is mounted, 12. The method according to claim 11, wherein the second conductive layer is in contact with the second conductive layer.
An optical communication module according to item 1. 13. The housing, wherein the housing is provided with the first receptacle, and the first member is provided with the first receptacle.
The optical communication module according to claim 11, further comprising a housing member that houses the light-electricity conversion device, wherein the housing member includes the conductive member. 14. The wiring board of the first photoelectric conversion device, wherein the wiring board is disposed along a predetermined plane, and the contact portion is provided on a wall of the housing member extending along the predetermined plane. The optical communication module according to claim 13, wherein: 15. The accommodation member having a mounting portion for mounting the first optical-electrical conversion device, and the first optical-electrical conversion device is sandwiched between the accommodation member and the mounting member. 15. A cover member provided, wherein the cover member includes the conductive member.
An optical communication module according to item 1. 16. The optical communication module according to claim 11, wherein the contact portion includes a conductive piece cut out from a part of the conductive member and bent. 17. The optical communication module according to claim 11, wherein the housing has a lead terminal electrically connected to the wiring board of the first photoelectric conversion device. .