JP2001283738A - Plasma display panel and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide a technique for easily suppressing swelling of a partition end portion in a PDP, thereby realizing a PDP capable of displaying a high-quality image. SOLUTION: In a partition wall 30 of a PDP, a sub-partition wall portion 32 extending from each end of a plurality of main partition wall portions 31 in a direction orthogonal to the extending direction of the main partition wall portion 31 is formed. The end portion was formed wider than the center portion (the portion excluding the end portion). Further, when forming the partition walls of the PDP, the end portions of the partition walls after firing are locally heat-treated to a temperature higher than the softening point of the partition wall material. As a specific method for locally heating the end of the partition, a method of irradiating the end of the partition with laser light is excellent.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a plasma display panel used for a display device or the like and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, a plasma display panel (PDP) has attracted attention as a flat display used in computers, televisions, and the like. PDPs are roughly classified into a direct current type (DC type) and an alternating current type (AC type). At present, the AC type suitable for a large screen is mainly used.

The AC type PDP turns on a discharge cell by applying an AC pulse to an electrode covered with a dielectric layer for maintaining a discharge, and a sustain electrode pair is arranged in parallel to a front panel side. There are known a surface discharge type and a counter discharge type in which a sustain electrode pair is disposed to face a front panel and a rear panel. FIG. 10 shows a general AC surface discharge type P.
4 shows an example of a DP.

In this PDP, a front panel 610 and a rear panel 620 are arranged to face each other, and the outer peripheral edge (not shown) is sealed with a sealing material made of low-melting glass. The front panel 610 includes a display electrode pair 612 on a surface facing the front substrate 611 (the surface facing the rear panel).
a, 612b are formed, and a dielectric layer 613 made of dielectric glass and a protective layer 614 made of MgO are covered therewith.
Are formed.

On the other hand, the back panel 620 is
The address electrodes 622 are formed in stripes on the opposing surface (the surface facing the front panel), and a back dielectric layer 623 is formed so as to cover the stripes. The partition 630 is formed in a stripe shape, and the phosphor layer 64 of each color of RGB is provided in a groove between the partition 630.
0 is formed.

[0006] The display electrode pairs 612a and 612b have discharge cells formed where they intersect and intersect with the address electrodes 622 at right angles. In this PDP, after an address pulse is applied between the address electrode 622 and the display electrode 612a based on the image data to be displayed, the pair of display electrodes 6
By applying a sustain pulse between 12a and the display electrode 612b, a sustain discharge is selectively generated in each discharge cell. As a result, in the discharge cells having undergone the sustain discharge, ultraviolet rays are generated, and visible light is emitted from the RGB phosphor layers 140 excited by the ultraviolet rays, thereby displaying an image.

Here, adjacent discharge cells are separated from each other by partition walls 6.
The partition 30 prevents crosstalk (a phenomenon in which discharges are mixed at the interface between discharge cells). By the way, as a method of forming the partition, first, a partition material such as a glass material is formed into a partition pattern (striped partition shape), and the formed partition material is at least the softening point of the glass material in the partition material. Baking method is common

[0008]

Here, as a method of forming the partition wall material into a partition wall pattern, first, a printing method in which a paste containing the partition wall material is pattern-printed by a screen printing method or the like, and second, a partition wall material is formed. After applying a paste containing the same to the entire surface of the rear substrate, forming a photosensitive film layer thereon and forming a predetermined pattern by a photographic method, and then removing unnecessary portions of the partition wall material by sandblasting. After applying a photosensitive paste containing a partition material to the entire surface of the rear substrate, a photo paste method of removing unnecessary portions by a photographic method can be used.

In any of the molding methods, the partition 630 formed through the firing step has an end 630a protruding as shown in FIG. 11, and the height of the end 630a is increased to the center 630b (end). 1) compared to the height of
It tends to be about 0 to 20% larger. In particular, when the back dielectric layer 623 is formed on the back substrate 621 and the partition 630 is formed thereon, this swelling is likely to occur.

[0010] When a bulge occurs at the end of the partition wall, it is difficult to bond the rear substrate with the front substrate without any gap between the partition wall and the front substrate when assembling the PDP. If a gap is formed between the partition and the front substrate in the assembled PDP, erroneous discharge or abnormal discharge is likely to occur in an adjacent cell when the gap is driven. In addition, the presence of the gap causes the front panel plate to vibrate during driving, thereby easily causing noise.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and provides a technique for easily forming a partition wall without swelling at an end portion of the PDP, thereby providing a PDP capable of displaying a high-quality image. It is intended to be realized.

[0012]

According to the present invention, in order to achieve the above object, in a partition of a PDP, an end of a main partition is formed wider than a central portion (a portion excluding the end).
According to this PDP, it is possible to suppress the end portions from rising when firing the partition walls.

In forming the partition pattern, a general method such as a sand blast method or a screen printing method can be used as it is. The reason why the bulge of the partition wall end can be prevented in this way will be described below. Generally, at the time of partition baking, a large tension is applied in the direction in which the main partition part extends because the partition pattern before baking tends to shrink. Here, at the center of the main partition, the main partition is pulled in opposite directions along the direction in which the main partition extends, whereas at the end of the main partition, the center of the main partition is It is pulled toward the part but not outward.

[0014] It is considered that the end of the partition wall is pulled in the direction of the center during the firing, so that the material near the surface of the end moves, thereby causing a swell. However, if the width at the end of the main partition is formed to be wider than the width at the center, the tensile force applied to the end of the main partition is dispersed widely, so that the partition material is less likely to move. . Further, since the end portion is widened in the width direction, in addition to the force pulled toward the center of the main partition, a tension is also applied in the width direction of the main partition. Therefore, it is considered that the swelling is suppressed by this tension.

In order to form the end of the partition wider than the center, a sub-partition is formed from each end of the plurality of main partitions in a direction perpendicular to the direction in which the main partition extends. Then, the width of the main partition may be expanded by the sub-partition. There are various forms of forming the sub-partition, and the ends of the adjacent main partitions may be connected to each other by the sub-partition, or the sub-partition may be formed at the end of the main partition to form a T-shape. Shape or L-shape.

In particular, when the ends of the adjacent main partitions are connected to each other by the sub-partition, a large tension is applied in the extension direction of the sub-partition, so that the effect of reducing the height of the end of the main partition is great. In order to apply sufficient tension in the extension direction of the sub-partition, the width of the sub-partition is preferably set to be not less than the width of the main partition, and preferably not less than 1.5 times. In the case where the entire end portion is connected by the sub-partition, even if the width of the sub-partition is set to be smaller than the width of the main partition, it is possible to apply sufficient tension in the extension direction of the sub-partition. it can.

In the present invention, when forming the partition walls of the PDP, the end portions of the partition walls after firing are locally subjected to a heat treatment at a temperature higher than the softening point of the partition wall material. In this case, even if the end of the partition wall rises after firing, the rise is reduced. The reason that the bulge is reduced by locally softening the end of the partition wall is that the locally softened part solidifies, so that surface tension is applied to this part, so that the partition wall material of the raised part is surrounded by It is thought to be dispersed.

As a specific method of locally heating the end of the partition, a method of irradiating the end of the partition with a laser beam is excellent. As described above, according to the present invention, the swelling at the end of the partition wall of the PDP can be reduced, so that a gap is hardly generated between the partition wall and the opposing substrate. Therefore, it is possible to prevent erroneous discharge or abnormal discharge from occurring in the adjacent cells during driving, and to prevent the substrate from vibrating during driving.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] (Regarding Overall Configuration of PDP) FIG. 1 is a perspective view of an essential part showing a configuration of an AC surface discharge type PDP according to a first embodiment.

This PDP is formed on a front glass substrate 11 by
The display electrode pair 12 (the scan electrode 12a and the sustain electrode 12
b), a front panel plate 10 on which a transparent dielectric layer 13 and a protective layer 14 are disposed, and a rear panel plate 2 on which an address electrode 22 and a back dielectric layer 23 are disposed on a rear glass substrate 21
0 are arranged parallel to each other with an interval in a state where the display electrode pair 12 and the address electrode 22 face each other.

The display electrode pair 12 and the address electrode 22 are both stripe-shaped, and the display electrode pair 12 is in the longitudinal direction (X direction) of the rear glass substrate 21, and the address electrode 22 is in the direction orthogonal to the longitudinal direction (Y direction). It is arranged in. The panel configuration is such that cells emitting red, green, and blue light are formed where the display electrode pairs 12 and the address electrodes 22 intersect.

The address electrode 22 is a metal electrode (for example,
(A silver electrode or a Cr—Cu—Cr electrode). The display electrode pair 12 may be formed of a metal electrode like the address electrode 22, but as shown in FIG. 1, ITO, SnO ₂ ,
A configuration in which a thin bus electrode 122 (silver electrode, Cr—Cu—Cr electrode) is stacked on a wide transparent electrode 121 made of ZnO or the like can also be used.

The transparent dielectric layer 13 is formed on the front glass substrate 11
Is a layer made of a dielectric material disposed over the entire surface on which the display electrode pair 12 is disposed, and is formed of, for example, a lead-based low-melting glass or a bismuth-based low-melting glass. Protective layer 1
Reference numeral 4 denotes a thin layer made of magnesium oxide (MgO), which covers the entire surface of the transparent dielectric layer 13.

On the back dielectric layer 23 of the rear panel plate 20, a partition 30 is disposed.
The gap between 0 and rear panel plate 20 is defined by the height of partition 30. As will be described in detail later, the partition 30 is composed of a main partition 31 having a stripe shape and a sub-part 32 extending from an end of the main partition 31.

Each main partition 31 is located between the adjacent address electrodes 22, and a red,
Green and blue phosphor layers 40 are provided. A discharge space is formed between the main partition walls 31 by filling a discharge gas. When used in a 40-inch class high-definition television, the following specifications are generally used. , The distance between adjacent address electrodes 22 is set to 0.1.
Set to about 2 mm or less. A typical partition pitch is 360 μm per color, and the top width of the main partition 31 is 50 to 10 μm.
0 μm, and the height of the main partition 31 is 100 to 150 μm.

As the discharge gas to be filled, He,
A rare gas consisting of Ne and Xe is used, and its sealing pressure is 6
It is set to 6.5 kPa to 80 kPa. When the PDP is driven, a driving circuit (not shown) applies an address discharge pulse to the scan electrode 12a and the address electrode 22, thereby accumulating wall charges in a cell to emit light. A sustain discharge pulse is applied between the pair 12. At this time, sustain discharge is performed in the cell in which the wall charges are accumulated, and light is emitted. By repeating such an operation, an image is displayed in the central part (image display area) of the PDP.

(Regarding Shape of Partition) FIG. 2 is a top view showing a state in which the partition 30 is formed on the back dielectric layer 23 in the rear panel plate 20. The partition 30 includes a stripe-shaped main partition 31 extending in the Y direction along the address electrode 22 and a sub-part 32 extending in the X direction to connect the ends of the main partition 31 to each other. A groove 33 is formed between the main partition portions 31.

Here, the "end of the main partition 31" refers to a range from the terminal end of the main partition 31 (31c in FIG. 2) to a length about the width of the main partition 31. . (Regarding Method of Manufacturing PDP) A method of manufacturing the PDP having the above configuration will be described. Front panel plate manufacturing process: ITO is formed on the surface of front glass substrate 11 made of soda glass having a thickness of about 2.8 mm.
(Indium Tin Oxide) or a transparent material having a thickness of about 3000 Å is formed in parallel with a conductive material such as SnO ₂ . Further, a display electrode pair 12 is formed by laminating a bus electrode composed of three layers of silver or chromium-copper-chromium on the transparent electrode.

These electrodes can be manufactured by a known manufacturing method such as a screen printing method and a photolithography method. Next, on the front glass substrate 11 on which the display electrode pairs 12 are formed, a dielectric paste containing lead-based glass is coated over the entire surface and baked, whereby about 20 to
The transparent dielectric layer 13 is formed with a thickness of 30 μm. Then, on the surface of the transparent dielectric layer 13, a vapor deposition method or a CVD method is used.
The protective layer 14 made of magnesium oxide (MgO) is formed using, for example. Thus, the front panel plate 10 is manufactured.

Back panel plate manufacturing process: about 2.6 mm thick
By applying a conductive material mainly composed of silver in a stripe shape on a rear glass substrate 21 made of soda glass by a screen printing method, the address electrodes 2 are formed.
2 is formed with a thickness of about 5 to 10 μm. Subsequently, the entire surface of the rear glass substrate 21 on which the address electrodes 22 are formed is coated with a dielectric glass paste and baked, so that the back dielectric layer 23 has a thickness of 20 to 30 μm.
It is formed with a thickness of about.

Subsequently, the partition 30 is formed by using a sand blast method described later. Then, the red, green, and blue phosphor pastes are applied to the gaps between the partitions 30 by a screen printing method, and fired in air to form the phosphor layers 40 for each color, thereby producing the rear panel substrate 20. I do. In addition, in forming the phosphor layer 40, in addition to the screen printing method, a method of scanning while discharging the phosphor ink from the nozzle, or attaching a sheet of a photosensitive resin containing a phosphor material of each color, It can also be formed by a method of patterning and developing by lithography.

Sealing step, evacuation and discharge gas sealing step: A sealing material (glass frit paste for sealing) is applied to the outer peripheral portion of one or both of the front panel plate 10 and the rear panel plate 20 produced as described above. The sealing material layer is formed by coating, and the display electrode pairs 12 of the front panel plate 10 and the address electrodes 22 of the rear panel plate 20 are overlapped so as to be orthogonal to each other, and heated to form a sealing material. Seal by softening.

After sealing in this manner, the panel plate is fired while evacuating the internal space of the sealed panel plate (3).
3 hours at 50 ° C). Thereafter, a PDP is manufactured by filling the discharge gas at a predetermined pressure. (Partition Forming Step by Sandblasting) FIG.
(D) is a figure explaining the partition formation process by a sandblast method.

The first step shown in FIG. 3A (the step of coating and forming a partition film), the second step shown in FIG. 3B (the step of forming a photosensitive coating film pattern), and the first step shown in FIG. 3 step (blast processing step), 4th step (coating film peeling step) shown in FIG.
It consists of a step (a partition baking step). Hereinafter, each step will be described.

Partition Film Forming Step (a) The polymer resin ethyl cellulose is mixed with an organic solvent in which α-terpineol and EP acetate diethylene glycol mono-n-butyl ether (BCA) are mixed at a weight ratio of 50:50 to prepare a vehicle. Similar lead glass as used for the dielectric paste _{(PbO-B 2 O 3 -SiO} 2 -
A CaO) powder, a filler powder (aggregate) made of alumina, and a pigment powder made of titanium oxide (TiO ₂ ) are mixed at a weight ratio of 80:10:10 to prepare a partition wall material mixture. Then, the vehicle is mixed with the partition wall material mixture to prepare a partition wall paste.

By repeating the process of uniformly printing and drying the paste for the partition wall using a screen printing method or the like over the entire central portion (the region corresponding to the image display region) on the back dielectric layer 23, The barrier film 300 is formed with a thickness of about 150 μm. Step of Forming Photosensitive Coating Film Pattern (b) A coating film 310 of a photosensitive material is formed on the partition wall film 300 formed as described above. In the present embodiment, the thickness 50
A coating film 310 is formed by laminating this DFR using a photosensitive dry film resist (hereinafter, referred to as DFR) of μm.

Next, a photomask covering only a portion corresponding to the pattern of the partition 30 (see FIG. 2) is placed on the coating film 310, and exposure is performed by irradiating ultraviolet light (UV light). Here, the appropriate exposure amount varies depending on the pattern width and the pitch of the photomask, and is set in consideration of these factors. Next, development is performed using a developing solution of a 1% aqueous solution of sodium carbonate, and washing is performed immediately after development. Thus, a stripe-shaped groove 311 (opening) is formed in the coating film 310. The groove 311 corresponds to the groove 33 between the main partition walls 31 in FIG. 2. A typical groove size is such that the opening width at the top of the groove is 80 μm and the pitch is 3 μm.
60 μm.

Blasting step (c) After patterning the coating film 310 as described above, the partition film 300 is sandblasted. Specifically, an abrasive (eg, a glass bead material) is supplied from the blast nozzle 400.
While blasting 401 at an Air flow rate of 1500 NL / min and an abrasive supply amount of 1500 g / min, the blast nozzle 400 is applied to the surface of the coating film 310 as shown by a white arrow in FIG. Along the entire surface.

Here, a blast nozzle 400 having the same length (length in the Y direction) as the groove 33 may be used, and the blast nozzle 400 may be scanned in the X direction. It is also possible to use a short one and scan it slowly in the X direction while scanning it in the Y direction. In this manner, the abrasive 40 over the entire surface of the coating film 310
By spraying 1, only the portion of the partition wall film 300 exposed from the groove 311 is blasted,
A groove 301 (opening) is formed.

The degree of the blast processing is as follows.
Typically, the process is performed until the portion corresponding to the groove 301 in the partition wall film 300 is completely removed by blasting. Coating film stripping step (d) The back glass substrate 21 having the grooves 301 formed in the partition wall film 300 as described above is immersed in a stripping solution (for example, a 5% aqueous sodium hydroxide solution) to form a coating film 310. Is peeled off.

FIG. 4A is a partially enlarged view of the partition wall 302 before firing formed as described above. The pattern of the pre-fired partition 302 is the same as the pattern of the partition 30 shown in FIG. 2, and the main partition 303 (FIG. 2) extending in the Y direction.
No. 31 of FIG. ) Extend in the X direction so as to connect the ends 303a of the sub-partitions 304 (FIG. 2).
Number 32. ).

Partition wall baking step: The rear glass substrate 21 from which the coating film has been peeled is placed in a baking furnace profiled such that the peak temperature is slightly higher than the softening temperature of the partition wall material (about 550 ° C.). Add and heat. Thereby, the partition wall material of the partition wall 302 before sintering is sintered, and the partition wall 3 is formed.
0 is formed.

At the time of this baking, the sub-partition 304 is formed at the end 303a of each main partition 303 as described above, so that the bulges at the ends of the main partition as described below. It is prevented from occurring. Since the swelling of the end of the partition wall 30 is reduced, a gap is hardly generated between the partition wall 30 and the front panel plate 10.
At the time of driving the DP, it is possible to prevent erroneous discharge or abnormal discharge from occurring, and also to prevent the front panel plate 10 from vibrating.

(Effect of Preventing Protrusion by Sub-Partition) The effect of preventing elevation by the sub-partition will be described in detail. FIG. 4B is a diagram illustrating a stripe-shaped pre-fired partition wall 500 according to the conventional example, which has the same shape as the partition wall 130 of the PDP described in the above-described prior art. Generally, at the time of partition baking, the partition pattern before baking tends to shrink, so the partition 302 before baking shown in FIG.
Also, in each of the pre-fired partition walls 500 of FIG. 4B, tension is applied along the extension direction of the main partition walls (vertical direction in FIG. 4).

Here, the central portion 303b of the main partition portion 303
(Part of the main partition wall 303 excluding the end 303a)
In addition, in the central portion 500b of the pre-fired partition wall 500 (the portion excluding the end portion 500a in the pre-fired partition wall 500), as shown by a white arrow A, both extend in the main partition partition direction (vertical direction in FIG. 4). It is in a state of being pulled and pulled in opposite directions.

On the other hand, the end 30 of the main partition 303
3a and the end of the pre-fired partition 500, as shown by the white arrow B, facing the partition center (upward in FIG. 4).
But not in the opposite direction. Therefore, at the end portion 500a of the pre-fired partition wall 500, the partition wall material near the surface of the end portion 500a moves due to the pulling force (open arrow B) toward the partition center portion during the firing. In particular, it is considered that the partition wall material near the end moves toward the center, and the partition wall material concentrates in a narrow region at the end, thereby causing a swell.

On the other hand, the main partition wall 303 of the pre-fired partition 302
The same applies to the end 303a in that a force (open arrow B) pulling toward the center of the partition is applied at the time of baking, but the end 303a has a sub-partition 304 that is perpendicular to the main partition 303. Is extended, so that the end 303
The tensile force applied to “a” is also distributed to the sub-partition wall 304. Therefore, the partition wall material is difficult to move. Further, even if the partition material near the end of the end portion 303a moves toward the central portion 303b of the main partition portion 303, the sub-partition portion 30
4, it can be said that it is difficult to swell.

Further, as the sub-partition wall portion 304 tries to contract in the direction of its extension (the width direction of the main partition wall portion 303), tension is applied to the end portion 303a in this direction (open arrow C). . It is considered that the application of such tension to the end portion 303a also has the effect of reducing the height of the end portion 303a. Note that, as the width of the sub-partition wall portion 304 is larger, the tension applied to the end portion 303a at the time of firing increases, so that the height of the end portion 31a and the sub-partition wall portion 32 after firing is reduced. The width of the main partition 30
It can be said that it is preferable to set the width to be larger (1.5 times or more and 2 times or less) with respect to the width of 3.

Although depending on the conditions at the time of firing, the width of the sub-partition portion 304 is increased or the length of the sub-partition portion 304 is elongated as described above.
As shown in FIG. 5, the height of the end 31a and the height of the sub partition 32 are larger than the height of the central portion 31b of the main partition 31, as shown in FIG. Can also be lower.

As described above, when the height of the sub partition 32 is lower than the central portion 31b of the main partition 31, as shown in FIG. 6, the front panel plate 10 and the rear panel plate 20 are separated in the sealing step. When overlapped, a gap 34 is secured between the sub-partition wall 32 and the front panel 10. Therefore, in the evacuation process and the discharge gas sealing process after the sealing process, the space (groove 33) inside the sub-partition wall 32 and the space outside (the sub-partition wall 32 and the sealing material) are communicated by the gap 34. Since this state is achieved, there is an effect that the exhaust gas and the discharge gas sealing are smoothly performed without being hindered by the sub-partition wall portion 32.

However, as in the present embodiment, the sub partition 30
4 is extended in the X direction, and the entire end portions 303 a of the plurality of main partition portions 303 are connected by the sub partition portion 304, the width of the sub partition portion 304 is larger than the width of the main partition portion 303. Even if it is set small, sufficient tension is applied in the extension direction of the sub-partition portion 304 during firing, so that the height of the end portion 31a and the sub-partition portion 32 is substantially the same as the height of the central portion 31b of the main partition portion 31. can do.

In the above description, as shown in FIGS. 1 and 2, the adjacent main partition portions 31 are located at both ends in the direction in which the main partition portions 31 extend (Y direction). Have been described in which the end portions are all connected by the sub-partition portion 32. However, if the width at the end portion of the main partition portion 31 is wider than the width at the central portion, the swelling is caused by the same action. It is considered to have the effect of suppressing.

As a modified example of the partition wall 30, FIGS.
Examples shown in (d) are given. These partitions 3
No. 0 has a stripe-shaped main partition 31 in each of which the sub-partition 32 is formed at the end of each main partition 31 in common. Is different. 7 (a) and 7 (b), every other end of the main partition 31 is connected to every other.

In the embodiment shown in FIG.
Are formed line-symmetrically. That is, at both ends (upper and lower ends in FIG. 7) of the main partition 31, between the n-th main partition 31 and the (n + 1) -th (where n is an odd number) end of the main partition 31. Are formed and connected to each other, and between the end portions of the m-th main partition portion 31 and the (m + 1) -th (m is an even number) main partition portion 31, a sub-partition portion is formed. Not formed.

In the case of FIG. 7A, the odd-numbered grooves 33
Since the sub-partitions 32 are closed at both ends of the sub-partitions 3, the sub-partitions 3 are formed in order to smoothly perform the exhaust step and the discharge gas filling step after the sealing step as in the case of FIG.
It is desirable that the height of the second partition 2 be lower than the central portion 31b of the main partition wall portion 31. In the embodiment shown in FIG.
The sub-partition 32 is not line-symmetric but formed so as to form a one-stroke partition pattern as a whole. That is, at one end (lower side in the figure) of the main partition 31, the ends of the n-th main partition 31 and the (n + 1) -th (where n is an odd number) main partition 31 are connected to the sub partition. The other end (upper side in the drawing) of the main partition 31 is connected to the m-th main partition 31 and the (m + 1) -th (where m
(Even numbers) of the end portions of the main partition portion 31
Are linked by

In the case of the pattern shown in FIG. 7B, the sub-partitions 32 are present only at one of the ends of all the grooves 33.
Even if the height is equal to the height of the central portion 31b, the exhaust step and the discharge gas filling step after the sealing step can be performed smoothly. Next, in the form shown in FIGS. 7C and 7D,
The sub partition 32 is formed at both ends of each main partition 31, but the ends of the main partition 31 are not connected to each other.

In the form shown in FIG. 7C, sub-partitions 32 are formed at both ends of each main partition 31 so as to increase the width in both directions (in both the left and right directions in FIG. 7). Has a T-shape. In the form of FIG. 7D, sub-partitions 32 are formed at both ends of each main partition 31 so as to extend in one width direction (to the right in FIG. 7). It is shaped like a letter.

In the case of the patterns shown in FIGS. 7C and 7D, since both ends of the groove 33 are not closed by the sub-partition 32, the height of the sub-partition 32 is increased. Even if the height is equal to the height of the central portion 31b of the 31, the exhaust process and the discharge gas filling process after the sealing process can be performed smoothly. 7A to 7D, the height of the end 31a of the main partition 31 and the height of the sub-partition 32 are the same as those of FIG. It is preferable to set the width of the sub partition 32 to 1.5 to 2 times the width of the main partition 31 in order to make the width smaller. Is smaller than the width of the main partition part 303, the height of the end part 31a and the sub-partition part 32 is adjusted to the central part 31b of the main partition part 31.
It is considered that the height can be almost the same as the height of the object.

(Other Modifications) In this embodiment, the case where the main partition 31 extends linearly in parallel with the address electrode has been described. However, the main partition 31 is not necessarily linear. Is also good. For example, the present invention can be similarly carried out in the case of meandering and parallel to the address electrode, or in the case where the auxiliary partition is provided in the gap (groove 33) between the main partition portions 31, and the same effect can be obtained. To play.

Further, even when the main partition 31 extends in the direction perpendicular to the address electrodes, the present invention can be similarly implemented, and the same effects can be obtained. [Second Embodiment] The PDP of this embodiment is the same as the first embodiment in the overall configuration.

In the PDP of this embodiment, the shape of the partition wall is the same as that of the partition wall 130 of the PDP described in the related art, but the partition wall material is locally softened at the end of the partition wall after firing. By performing the heating treatment at a temperature higher than the point, the bulge at the end of the partition wall is reduced. The method of manufacturing the PDP is also generally the same as that described in the first embodiment, but differs in the partition wall forming step.

Hereinafter, the partition forming step will be described. In the partition forming step of the present embodiment, first, a first step (partition film coating forming step) and a second step (photosensitive coating film pattern) are performed in the same manner as described with reference to FIG. A stripe-shaped partition is formed by performing a (forming step), a third step (blast processing step), a fourth step (coating film peeling step), and a fifth step (partition baking step).

However, at the end of the fifth step, as in the case of the partition 130 shown in FIG. 11, there is a tendency for bulges to occur at the end of the partition, so that after the fifth step,
Further, as a sixth step, a laser beam is applied to the end of the partition wall to locally perform a heat treatment, and the processing is performed so as to reduce the swelling of the partition end portion. Hereinafter, the sixth step (local heating step) will be described in detail.

FIG. 8 is a view showing a state in which the end of the partition 230 on the rear glass substrate 21 after the fifth step is irradiated with laser light. Laser light irradiation device 4
As 10, for example, a YAG laser device with an output of 30 W may be used, or a carbon dioxide (CO 2) laser may be used. In FIG. 8, the laser irradiation is performed while moving the rear glass substrate 21 in the direction of the white arrow with respect to the laser beam irradiation device 410, so that the plurality of partition walls 230 are formed.
2 shows a state in which an edge heating process is sequentially performed.

FIG. 9 shows a state in which the end 230a of the partition wall 230 is irradiated with the laser beam 411. At the end of the fifth step, the address electrodes 22 and the back dielectric layer 23 are formed on the back glass substrate 21, and the stripe-shaped partition walls 230 are formed on the back dielectric layer 23. In FIG. 9, the end 230a of the partition 230
Is raised to 10% to 20% of the center 230b
About high.

By irradiating the laser beam 411 to both ends of the partition wall 230 using the laser light irradiation device 410, both ends of the partition wall 230 are heated to a temperature (about 550 ° C. or higher) above the softening point of the partition wall material. Above). Here, "locally heat the end" means that only the end 230a of the partition 230 is heated to the softening temperature or higher, and the center 230b (the end 230) of the partition 230 is heated.
a) is to heat so as to be kept below the softening temperature, and by this local heating,
Only the portion where the swelling occurs and its vicinity is softened.

As described above, when the protruding portion of the end portion 230a and its surroundings are once softened and then solidified again, the shape of the end portion 230a changes and the protuberance is reduced.
Such a shape change occurs because surface tension is applied to a portion where the partition material is softened, and the partition material in a raised portion is dispersed in a peripheral region as shown by a white arrow in FIG. Conceivable.

When the local heat treatment is performed on the end portion 230a in this manner, by adjusting the conditions,
The shape of the end 230a can be changed so that the height of the end 230a is equal to the height of the center 230b, and the height of the end 230a is lower than the height of the center 230b. It is also possible to change the shape of the end 230a.

In order to obtain such a swelling reduction effect, the entire end 230a does not need to be heated to a temperature higher than the softening temperature, and the deep portion of the end 230a is not heated to the softening temperature. May be heated above the softening temperature. As described above, in the present embodiment, by providing the step of locally heating the end of the partition wall after the step of baking the partition wall, it is possible to reduce the swelling of the end of the partition wall which occurs at the time of baking. Therefore, according to the PDP manufacturing method of the present embodiment, a PDP capable of displaying a high-quality image can be easily manufactured.

In the present embodiment, an example has been described in which the edge of the partition wall is locally heated by irradiating a laser beam from the surface side of the partition wall. In addition, it can be considered that the method can be implemented by a method of irradiating an electron beam, blowing high-temperature air, or bringing a member heated to a high temperature into contact with the end of the partition wall. Further, it is not always necessary to heat from the surface side of the partition wall, and for example, it is considered that heating can be performed by heating from the back side of the back glass substrate 21 or by a method.

Further, as in the first embodiment, the partition wall 230 does not necessarily have to be linear, and can be implemented in a case where the partition wall 230 extends in a direction perpendicular to the address electrodes. Play. (Modifications of First and Second Embodiments) In the first and second embodiments, the case where the partition wall pattern is formed by using the sand blast method in the partition wall forming step has been described as an example. A printing method of pattern-printing the partition wall paste by a screen printing method, and a photo-paste method of removing unnecessary portions by a photographic method after applying a photosensitive partition wall paste on the entire surface can be similarly performed. A similar effect is achieved.

In the first and second embodiments, the case where the partition wall is formed on the rear panel side has been described. However, the same can be applied to the case where the partition wall is formed on the front panel side. A similar effect is achieved. In the first and second embodiments, an AC surface discharge type PDP has been described as an example. However, the present invention can be similarly applied to a counter discharge type PDP or a DC type PDP, and the same effects can be obtained.

[0073]

As described above, the present invention provides a PDP
By forming the end portion of the main partition portion of the partition wall wider than the center portion (the portion excluding the end portion), that is, from each end portion of the plurality of main partition portions in the extending direction of the main partition portion. By forming the sub-partitions extending in the direction perpendicular to the direction, it is possible to prevent the ends from rising when firing the sub-partitions at the time of forming the partition.

In particular, when the ends of the adjacent main partitions are connected to each other by the sub-partition, a large tension is applied in the extension direction of the sub-partition, so that the effect of reducing the height of the end of the main partition is great. Further, in the present invention, when forming the partition of the PDP,
By heating the end of the partition wall after firing locally to a temperature higher than the softening point of the partition wall material, even if the end of the partition wall rises after firing, the rise can be reduced.

As a specific method for locally heating the end of the partition, a method of irradiating the end of the partition with a laser beam is excellent. As described above, according to the present invention, the swelling at the end of the partition wall of the PDP can be reduced, so that a gap is hardly generated between the partition wall and the opposing substrate. Therefore, it is possible to prevent erroneous discharge or abnormal discharge from occurring in the adjacent cells during driving, and to prevent the substrate from vibrating during driving.

[Brief description of the drawings]

FIG. 1 is a main part perspective view showing a configuration of an AC surface discharge type PDP according to Embodiment 1.

FIG. 2 is a top view showing a state in which a partition wall is formed on a back dielectric layer on a back panel plate in the PDP.

FIG. 3 is a diagram illustrating a partition forming step by a sandblast method.

FIG. 4 is a partially enlarged view of a partition before firing according to the embodiment and a conventional example.

FIG. 5 is a partially enlarged view of the PDP according to the first embodiment.

FIG. 6 is a cross-sectional view illustrating features of the PDP according to the first embodiment.

FIG. 7 is a view showing a modification of the partition wall of the embodiment.

FIG. 8 is a diagram showing a state where a laser beam is applied to an end of a partition in the second embodiment.

FIG. 9 is a diagram illustrating a state in which an end of a partition is irradiated with laser light.

FIG. 10 is a diagram showing an example of a general AC surface discharge type PDP.

FIG. 11 is a view showing a state in which an end portion is raised in the PDP. ,

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 front panel plate 11 front glass substrate 12 display electrode pair 13 transparent dielectric layer 14 protective layer 20 rear panel substrate 20 rear panel plate 21 rear glass substrate 22 address electrode 23 back dielectric layer 30 partition 31 main partition 31a main partition 31b Central part of main partition part 32 Sub-partition part 40 Phosphor layer 300 Partition film 302 Partition before firing 303 Main partition part 303a End part of main partition part 303b Central part of main partition part 304 Sub-partition part

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shinya Fujiwara 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. 72) Inventor Sadao Uemura 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. GF02 GF12 GF19 MA20 MA23

Claims (18)

[Claims] 1. A first substrate provided with a plurality of first electrodes in a stripe pattern and a second substrate provided with a plurality of second electrodes in a stripe pattern, wherein the first electrode and the second electrode intersect. A partition is formed on the facing surface of the first substrate, and the first
A plasma display panel comprising a gas medium sealed in a space sandwiched between a substrate and a second substrate and partitioned by a partition, wherein the partition includes a plurality of main partitions extending along the first electrode or the second electrode. A plasma display panel comprising: a plurality of main partition walls, wherein each end of each of the plurality of main partition walls is formed to be wider than a center of the main partition wall. 2. The plasma display panel according to claim 1, wherein an end of each of the main partition walls is formed in a T-shape or an L-shape. 3. A first substrate on which a plurality of first electrodes are provided in a stripe shape and a second substrate on which a plurality of second electrodes are provided in a stripe shape, wherein the first electrode and the second electrode intersect. A partition is formed on the facing surface of the first substrate, and the first
A plasma display panel comprising a gas medium sealed in a space sandwiched between a substrate and a second substrate and partitioned by a partition, wherein the partition includes a plurality of main partitions extending along the first electrode or the second electrode. A plasma display panel comprising: a sub-partition portion extending from each end of the plurality of main partition portions in a width direction of the main partition portion. 4. The sub-partition portion is an n-th and (n + 1) -th (where n is an odd or even number) among the plurality of main partition portions at least at one end in a direction in which the plurality of main partition portions extend. 4. The plasma display panel according to claim 3, wherein the end portions are connected. 5. The sub-partition portion is located at one end in a direction in which the plurality of main partition portions extend, and the n-th and (n + 1) -th parts counted from the first end among the plurality of main partition portions. (Where n is an odd number)
And at the other end in the direction in which the plurality of main partition walls extend, of the plurality of main partition walls, the (n + 1) -th and (n + 2) -th counters counted from the one located at the first end. 4. The plasma display panel according to claim 3, wherein the plasma display panels are connected to each other. 6. The plasma according to claim 3, wherein the sub-partition portion connects the plurality of main partition portions entirely at both ends in a direction in which the plurality of main partition portions extend. Display panel. 7. The plasma display panel according to claim 3, wherein the width of the sub partition is smaller than the width of the main partition. 8. The plasma display panel according to claim 3, wherein the height of the sub-partition is equal to or less than the height of the center of the main partition. 9. The plasma display panel according to claim 3, wherein the width of the sub partition is equal to or greater than the width of the main partition. 10. The plasma display panel according to claim 3, wherein the width of the sub partition is at least 1.5 times the width of the main partition. 11. A first substrate on which a plurality of first electrodes are provided in a stripe shape and a second substrate on which a plurality of second electrodes are provided in a stripe shape, wherein the first electrode and the second electrode intersect. A partition is formed on the facing surface of the first substrate, and the first
A plasma display panel in which a gas medium is sealed in a space sandwiched between a substrate and a second substrate and partitioned by a partition, wherein each partition is formed by molding a partition material into a partition shape and baking, A plasma display panel wherein an end portion thereof is locally heat-treated at a temperature higher than a softening point of a partition wall material. 12. The plasma display panel according to claim 11, wherein an end of each of the partition walls has been subjected to a heat treatment by irradiation with a laser beam. 13. The plasma display panel according to claim 11, wherein each of the partition walls has a height at an end portion thereof equal to or less than a height at a central portion. 14. A partition formation step of providing a plurality of partition walls on a surface of a first substrate on which a plurality of first electrodes are provided in a stripe pattern, and a second substrate on which a plurality of second electrodes are provided in a stripe pattern. Arranging the first substrate and the first electrode so as to face each other so that the first electrode and the second electrode intersect with each other. A forming step of forming a partition wall shape, a firing step of firing the formed partition wall material, and a heating step of locally heating the end of the fired partition wall molded body to a temperature equal to or higher than the softening point of the partition wall material. A method for manufacturing a plasma display panel, comprising: 15. In the heating step, a heat treatment is performed by irradiating a laser beam to an end portion of the fired partition wall molded body.
A manufacturing method of the plasma display panel according to the above. 16. The method according to claim 15, wherein in the heating step, a YAG laser or a carbon dioxide gas laser is used. 17. The heating step, wherein a shape of the end of the molded partition wall material after firing is shaped so as to be equal to or less than a height of a central part. A manufacturing method of the plasma display panel according to the above. 18. The manufacturing of a plasma display panel according to claim 14, wherein in the heating step, an end of the fired partition wall molded body is heat-treated from an upper surface side or a rear surface side of the first substrate. Method.