JP2001280308A - Ring type actuator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ring actuator with small and simple construction suitable for the thrust of a circular work. SOLUTION: This ring actuator 6 comprises a first ring member 21, a second ring member 22 and a communication passage 14. The second ring member 22 is arranged in combination with the first ring member 21. A driving fluid is supplied/discharged into/from a closed space formed between both ring members 21, 22 via the communication passage 14. With the supply/discharge of the driving fluid, both ring members 21, 22 are relatively moved along ring axial directions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-cylinder type actuator, and more particularly, to a ring type actuator.

[0002]

2. Description of the Related Art Conventionally, an apparatus for polishing a circular work such as a semiconductor wafer has been known. This type of apparatus generally includes a polishing table and a wafer pressing unit. A polishing surface is formed on an upper portion of the polishing table.
The semiconductor wafer is pressed against the polishing surface by the pressing force of the pressing means. By rotating the polishing table in this state, the semiconductor wafer is polished.

Since the central portion of a semiconductor wafer is a portion where a circuit is formed, if the portion is scratched, the defective product generation rate increases, and the yield decreases.
Therefore, in order to prevent this, it is preferable that the central part of the semiconductor wafer is not touched as much as possible.

Therefore, in a conventional wafer pressing means 41 shown in FIG. 7, a plurality of air cylinders 42 are used.
The outer peripheral portion of the semiconductor wafer 43 is pressed at a plurality of places. In the prior art wafer pressing means 44 shown in FIG. 8, a jig 45 contacting only the outer peripheral portion of the semiconductor wafer 43 is attached to one large air cylinder 46, and the semiconductor wafer 43 is connected via the jig 45. Was pressed.

[0005]

However, in the case of the prior art shown in FIG. 7, in addition to the fact that the entire length of the wafer pressing means 41 becomes large, it is necessary to press each part of the outer peripheral portion of the semiconductor wafer 43 with a uniform force. It was difficult from a viewpoint. Further, a plurality of air cylinders 42 are required, and the configuration of the apparatus is complicated.

On the other hand, in the case of the prior art shown in FIG. 8, as a result of arranging the jig 45 and the air cylinder 46 in series, there is a problem that the entire length of the wafer pressing means 44 becomes extremely large. The present invention has been made in view of the above problems,
An object of the present invention is to provide a ring-type actuator which has a small and simple configuration and is suitable for pressing a circular work.

[0007]

In order to solve the above-mentioned problems, according to the first aspect of the present invention, a first ring-shaped member and a first ring-shaped member arranged in combination with the first ring-shaped member are provided. A two-ring-shaped member, and a communication path for supplying and discharging the driving fluid to and from a closed space defined between the two ring-shaped members, and by supplying and discharging the driving fluid through the communication path, The gist of the present invention is a ring-type actuator in which the ring-shaped members are configured to relatively move along the ring axis direction.

According to the second aspect of the present invention, a ring-shaped main body having a substantially U-shaped cross section having a groove-shaped space opened at one end face, and a ring disposed in a state housed in the groove-shaped space. Moving body, a communication passage for supplying and discharging a driving fluid to and from the closed space defined between the ring-shaped body and the ring-shaped moving body, and sliding between the ring-shaped body and the ring-shaped moving body. A ring-shaped seal member disposed at an interface, wherein the driving fluid is supplied and discharged through the communication passage, whereby the ring-shaped moving body is configured to move along a ring axis direction. The gist is a ring type actuator characterized by the following.

According to a third aspect of the present invention, in the second aspect, the ring-shaped sealing member is mounted on the inner end surface of the ring-shaped moving body located in the groove-shaped space so as to be integrally movable. The lip packing has two lip portions that open when the driving fluid is supplied, at an outer peripheral portion and an inner peripheral portion.

Hereinafter, the "action" of the present invention will be described. According to the first aspect of the present invention, since the member driven by the supply and discharge of the driving fluid has a ring shape, each portion of the outer peripheral portion of the circular work can be pressed with a uniform force along the ring axis direction. . Further, according to such a configuration, it is not necessary to use a cylindrical air cylinder or the like, and it is not necessary to arrange a jig in series with such an air cylinder. Further, since it is not necessary to use a plurality of air cylinders, a simple configuration is sufficient.

According to the second aspect of the present invention, since the moving body driven by the supply and discharge of the driving fluid has a ring shape, each portion of the outer peripheral portion of the circular work is pressed with a uniform force along the ring axis direction. can do. Further, according to such a configuration, it is not necessary to use a cylindrical air cylinder or the like, and it is not necessary to arrange a jig in series with such an air cylinder, so that the apparatus is downsized. Furthermore, since it is not necessary to use a plurality of air cylinders, a simple configuration is required. In addition, the sealing action of the ring-shaped sealing member prevents the drive fluid from leaking from the sliding interface between the ring-shaped main body and the ring-shaped moving body. For this reason,
The moving body can be operated efficiently.

According to the third aspect of the present invention, the use of the lip packing having the lip portions at the inner and outer peripheral portions eliminates the need to use two lip packings, thereby simplifying the structure of the actuator. . In addition, since such a lip packing is installed on the inner end face of the ring-shaped moving body so as to be able to move integrally, the configuration is suitable for miniaturizing the actuator.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A ring-type actuator for a semiconductor wafer polishing apparatus according to an embodiment of the present invention will be described in detail with reference to FIGS.

As schematically shown in FIG. 4, the semiconductor wafer polishing apparatus 1 of the present embodiment includes a polishing table 2 and a wafer pressing means 3. A polishing surface 4 is formed on the polishing table 2. The polishing table 2 is driven to rotate by rotation driving means (not shown). The wafer pressing means 3 includes the ring type actuator 6 and the actuator support 5 shown in FIG. The ring type actuator 6 is supported on the lower end surface of the actuator support 5.

As shown in FIG. 2, the ring-type actuator 6 of the present embodiment includes a ring-shaped main body 11 as a first ring-shaped member and a ring-shaped moving body 12 as a second ring-shaped member. I have.

As shown in FIGS. 2, 3 and the like, the ring-shaped main body 11 is an endless member having a substantially U-shaped cross section and having a diameter close to the diameter of the semiconductor wafer 7 as a circular work. I have. The ring-shaped body 11 has a groove-shaped space 13 having a rectangular cross section.
The groove-shaped space 13 is open at the lower end surface 11 b of the ring-shaped main body 11. This groove-shaped space 13
Are continuously formed in the same cross-sectional shape over the entire circumference of the ring-shaped main body 11. On the other hand, the ring-shaped moving body 12 is also a member having an endless and equal cross-sectional shape, and has a diameter close to the diameter of the semiconductor wafer 7. However, the groove-shaped space 13 is not particularly formed in the ring-shaped moving body 12.

The ring-shaped main body 11 and the ring-shaped moving body 12 of the present embodiment are formed of stainless steel. It is not limited to a steel material such as stainless steel, and may be formed of a non-ferrous metal material such as aluminum or an aluminum alloy. Further, it may be formed of a resin material or the like.

Such a ring-shaped moving body 12 is disposed in a state where the upper half thereof is housed in the groove-shaped space 13.
In other words, the ring-shaped moving body 12 is
It is arranged in the state combined with. At this time, a rectangular closed space is defined between the inner wall surface of the groove of the ring-shaped main body 11 and the upper end surface of the ring-shaped moving body 12. The lower half of the ring-shaped moving body 12 is exposed from the groove-shaped space 13.

As shown in FIGS. 1 to 3, a communication passage 14 extends through a portion of the ring-shaped main body 11 corresponding to the bottom of the groove-shaped space 13, that is, an upper end 11 a of the ring-shaped main body 11. I have. The communication path 14 is connected to a pipe hole 8 provided in the actuator support 5, and the pipe 8 is connected to a pressurized air supply source (not shown). For this reason,
Pressurized air, which is a driving fluid, is supplied to and discharged from the closed space via the piping hole 8 and the communication passage 14.

The upper end 11a of the ring-shaped main body 11 has a screw hole 15 for mounting the main body. The screw holes 15 are formed in large numbers and at equal intervals, and all extend along the ring axis direction (that is, the vertical direction in FIG. 3). The ring-shaped main body 11 is attached to the actuator support 5 by screwing a screw 16 into these screw holes 15.

As shown in FIGS. 2 and 3, the ring-type actuator 6 of the present embodiment is used as a ring-shaped seal member for sealing the sliding interface between the ring-shaped main body 11 and the ring-shaped moving body 12. , Lip packing 17. The lip packing 17 is a member having an endless and equal cross-sectional shape, and has a diameter close to the diameter of the semiconductor wafer 7.

A positioning ridge 19 is provided on the lower surface of the annular base 18 constituting the lip packing 17. In the present embodiment, the positioning ridge 19 is formed continuously over the entire circumference of the lip packing 17. On the other hand, a positioning groove 20 is provided at a position corresponding to the positioning ridge 19 on the inner end surface (upper end surface) of the ring-shaped moving body 12. The positioning ridges 19 are fitted into the respective positioning grooves 20, so that the lip packing 17 is fixed to the ring-shaped moving body 12 so as to be integrally movable therewith.

A thick portion 23 having a trapezoidal cross section is formed at the center of the upper surface side of the annular base 18 so as to be continuous over the entire circumference. On the upper surface side of the annular base portion 18, the thick portion 2
An outer lip portion 21 is formed on the outer peripheral side of 3, and an inner lip portion 22 is formed on the inner peripheral side of the thick portion 23. In other words, the lip packing 17 of the present embodiment has the lip portions 21 and 22 at two locations of its own outer peripheral portion and inner peripheral portion. These lip portions 21 and 22
Both are formed so as to be continuous over the entire circumference of the annular base portion 18.

The lip portions 21 and 22 are opened when the ring-shaped moving body 12 moves toward the opening of the groove-shaped space 13 (downward in FIG. 3). On the contrary, these lip portions 21 and 22
The ring-shaped moving body 12 closes when it moves toward the bottom of the groove-shaped space 13 (upward in FIG. 3).

The lip packing 17 of the present embodiment is used.
Is made of an elastic material such as rubber or the like, and the width thereof is designed to be equal to the width of the ring-shaped moving body 12. The annular base 18, the positioning projection 19, and the lips 21, 22 are integrally formed by molding.

The operation of the semiconductor wafer polishing apparatus 1 including the ring type actuator 6 configured as described above will be described. First, the semiconductor wafer 7 is placed on the polishing surface 4 of the polishing table 2, and the ring type actuator 6 is arranged on the semiconductor wafer 7. At this time, the lower end surface of the ring-shaped moving body 12 is entirely brought into contact with a portion of the semiconductor wafer 7 where a circuit is not formed, that is, an outer peripheral portion. Note that a material such as a cushion material is preferably interposed between and.

When pressurized air is supplied into the closed space through the pipe hole 8 and the communication passage 14 in this state, the ring-shaped moving body 1
2 moves downward in FIG.
Is pressed against the polishing surface 4. When the supply of the pressurized air to the closed space is stopped after the polishing is completed, and the air is discharged through the communication passage 14 and the pipe hole 8, the ring-shaped moving body 1
2 moves upward in FIG.

Therefore, according to the present embodiment, the following effects can be obtained. (1) In the ring-type actuator 6 of the present embodiment, a member driven by the supply and discharge of the pressurized air (that is, the moving body 1)
2) is ring-shaped. For this reason, when pressurized air is supplied into the closed space, the pressurized air uniformly acts on the entire upper end surface of the ring-shaped moving body 12. Therefore, each portion of the outer peripheral portion of the semiconductor wafer 7, which is a typical circular work, can be pressed with a uniform force along the ring axis direction, in other words, along the wafer thickness direction. On the other hand,
Since the ring-shaped actuator 6 has a structure in which the central portion is hollow, there is no contact with the central portion of the semiconductor wafer 7 (that is, the circuit forming portion). From the above, the actuator 6 is suitable for pressing a circular work.

Therefore, if the actuator 6 is used in the semiconductor wafer polishing apparatus 1, the polishing accuracy of the semiconductor wafer 7 can be reliably improved. (2) The members constituting the ring-type actuator 6 of the present embodiment are all ring-shaped, and the height is not so large. Therefore, the actuator 6 itself has a ring shape as a whole, and its height is not so large.

Therefore, if such a ring type actuator 6 is used in configuring the semiconductor wafer polishing apparatus 1, it is not necessary to use a cylindrical air cylinder or the like.
There is no need to arrange a jig in series with such an air cylinder. For this reason, the semiconductor wear polishing apparatus 1 can be reliably reduced in size, and space saving in the length direction can be achieved. Further, since there is no need to use a plurality of air cylinders, the semiconductor wafer polishing apparatus 1 can have a simple configuration.

(3) In this ring-type actuator 6, leakage of pressurized air from the sliding interface between the ring-shaped main body 11 and the ring-shaped moving body 12 is prevented by the sealing action of the ring-shaped lip packing 17. Therefore, the ring-shaped moving body 12 can be operated efficiently.

(4) In this embodiment, the ring-shaped moving body 1
A ring-shaped lip packing 17 installed integrally with the inner end face of the second lip is used as a ring-shaped seal member. Therefore, the interference can be set small. Therefore, the sliding resistance of the ring-shaped moving body 12 can be reduced, and the ring-shaped moving body 12 can be operated smoothly. In addition, the lip packing 17 is less likely to stick.

(5) In addition, the ring-shaped lip packing 17 has the lip portions 21 and 22 of the outer peripheral portion and the inner peripheral portion.
Each is provided with. Therefore, if you use this,
It is not necessary to use two lip packings each having only one lip portion, and the configuration of the actuator 6 is reliably simplified. In addition, since such a lip packing 17 is installed on the upper end surface of the ring-shaped moving body 12 so as to be integrally movable, the configuration is suitable for reducing the size of the actuator 6.

(6) In this ring-type actuator 6, the groove-shaped space 13 of the ring-shaped main body 11 is provided so as to be annular and continuous. Therefore, a uniform air pressure can be applied to the entire upper end surface of the ring-shaped moving body 12, and the semiconductor wafer 7 can be pressed by the ring-shaped moving body 12 with a uniform force. In addition, since the groove-shaped space 13 has the same cross-sectional shape, the ring-shaped main body 11 can be formed relatively easily by a conventionally known work. This contributes to the cost reduction of the actuator 6.

(7) The positioning ridge 19 of the ring-shaped lip packing 17 is fitted into a positioning groove 20 formed on the upper end surface of the ring-shaped moving body 12. As a result, the ring-shaped lip packing 17 is
2 and fixed. Therefore, since the lip packing 17 is stably attached, displacement and rattling are unlikely to occur, and a reliable sealing effect can be obtained for a long period of time. That is, suitable operability can be maintained for a long time.

The embodiment of the present invention may be modified as follows. The structure of the ring-shaped lip packing 17 is not limited to that of the embodiment, and may have a configuration in which the outer peripheral lip portion 21 is omitted or a configuration in which the inner peripheral lip portion 22 is omitted.

The ring-shaped seal member disposed at the sliding interface is not limited to the one having the lip portions 21 and 22 as in the embodiment. For example, FIG.
As another example shown in (a), a ring-shaped packing 31 without a lip may be used. With such a structure, although the sealing performance is inferior to the embodiment, the lip 2
A simple cross-sectional shape can be obtained because there is no 1, 22.

Only one ring-shaped seal member need not be provided on the upper end surface of the ring-shaped moving body 12, and one may be provided on each of the outer peripheral side and the inner peripheral side.

In this configuration, the ring-shaped sealing member may be provided. In this configuration, each ring-shaped sealing member 12 is fixed. The positioning ridge 19 and the positioning groove 20 are omitted, and the upper end surface of the ring-shaped moving body 12 is A ring-shaped seal member may be bonded. Further, the ring-shaped seal member does not necessarily have to be positioned and fixed.

The ring-shaped seal member does not necessarily have to be provided on the upper end surface of the ring-shaped moving body 12. In another example shown in FIG. 5B, the ring-shaped moving body 1
An outer peripheral ring-shaped packing 32 is mounted in an annular groove provided on the outer peripheral surface of No. 2. On the other hand, an inner peripheral side ring-shaped packing 33 is mounted in an annular groove provided on the inner peripheral surface of the ring-shaped moving body 12.

The ring-shaped actuator 6 according to the embodiment, which has a completely circular outer shape as a whole, may have an elliptical shape, for example. The communication passage 14 may not be provided at the upper end 11a of the ring-shaped main body 11 and may be provided on the inner peripheral surface side or the outer peripheral surface side. Further, the communication path portion 14 may be provided on the ring-shaped moving body 12 side.

If there is no particular problem in the sealing property between the ring-shaped main body 11 and the ring-shaped moving body 12, the ring-shaped sealing member may be omitted. The groove-shaped space 13 does not need to be provided continuously over the entire circumference of the ring-shaped main body 11, and in that case, the sealing member does not have to be ring-shaped.

Since the circular work is not limited to the semiconductor wafer 7 alone, any work may be used.
This may be used for purposes other than the wafer pressing means. Of course, the present invention may be used for pressing a non-circular work.

The ring-shaped moving body 12 has a groove-shaped space 13
It may be provided in a state where a part thereof is housed therein, or it may be provided in a state where the whole is housed.

The first ring-shaped member is not necessarily limited to a substantially U-shaped cross section, but may have another cross-sectional shape. In a ring-shaped actuator 6A of another example shown in FIG. 6, a first ring-shaped member 34 having a substantially L-shaped cross section is used. The first ring-shaped member 34 is provided with a second ring-shaped member 35 having a substantially L-shaped cross section in a combined state. Both members 34, 3
In the sliding interface of No. 5, annular grooves are formed, and packings 32 and 33 as ring-shaped sealing members are formed in the annular grooves.
Are attached. Therefore, both ring-shaped members 3
When pressurized air is supplied to the closed space defined between the first and fourth members 35 through the communication path 14, the second ring-shaped member 35
To move downward.

Next, in addition to the technical ideas described in the claims, the technical ideas grasped by the above-described embodiments will be listed below together with their effects. (1) In Claims 2 and 3, the groove-shaped spaces have the same cross-sectional shape and are provided continuously. Therefore, according to the invention described in the technical idea 1, the pressing force becomes even more uniform, and the working operation is relatively easy.

(2) In any one of the second to third aspects and the technical idea 1, the seal member is formed by a positioning structure formed on an inner end surface of the ring-shaped moving body.
Positioned and fixed to the ring-shaped moving body. Therefore, according to the invention described in the technical idea 2, since the sealing member is stably attached, a reliable sealing effect can be obtained for a long time.

(3) A wafer polishing apparatus comprising the ring-shaped actuator according to any one of claims 1 to 3 as a part of a wafer pressing means. (4) The first elongate member, the second elongate member disposed in combination with the first elongate member, and the closed space defined between the elongate members. A communication path for supplying and discharging the fluid, and by supplying and discharging the driving fluid through the communication path, the two elongated members relatively move along a direction orthogonal to the member longitudinal direction. A non-cylindrical actuator, characterized in that:

(5) An elongated main body having a groove-shaped space opened at one end face and having a substantially U-shaped cross section, and a long elongated body disposed so as to be partially accommodated in the groove-shaped space. Moving body, a communication path for supplying and discharging a driving fluid to and from a closed space defined between the long body and the long moving body, the long body and the long moving body And a long sealing member disposed at a sliding interface between the long moving member and the long moving body in a direction orthogonal to the longitudinal direction of the member by supplying and discharging the driving fluid through the communication passage. A non-cylindrical actuator configured to move along.

(6) The non-cylindrical actuator according to the technical concept 5, wherein both the elongated main body and the elongated moving body have curved portions. (7) The non-cylindrical actuator according to the technical concept 5, wherein the elongated main body and the elongated moving body are both curved in an arc shape.

(8) The hollow first member and the first member
A hollow second member arranged in combination with the member, and a communication path for supplying and discharging the driving fluid to and from a closed space defined between the two members, and via the communication path An actuator having a hollow structure, wherein the driving fluid is supplied and discharged so that both members relatively move along a predetermined direction.

[0052]

As described in detail above, according to the first and second aspects of the present invention, it is possible to provide a ring-type actuator having a small and simple structure and suitable for pressing a circular work. .

According to the third aspect of the present invention, a more compact and simple configuration can be achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a ring actuator according to an embodiment of the invention.

FIG. 2 is an exploded perspective view of the ring-type actuator of the embodiment.

FIG. 3A is an enlarged sectional view taken along line AA in FIG. 1;
(B) is an expanded sectional view in the BB line similarly.

FIG. 4 is a schematic diagram showing a use state of the ring-type actuator of the embodiment.

FIGS. 5A and 5B are enlarged cross-sectional views of main parts of another example of a ring actuator.

FIG. 6 is an enlarged sectional view of a main part of another example of a ring-shaped actuator.

FIG. 7 is a schematic perspective view showing an example using a plurality of air cylinders.

FIG. 8 is a schematic perspective view showing an example using a pressing jig and one large air cylinder.

[Explanation of symbols]

6, 6A: ring-type actuator, 11, 34: first
Ring-shaped body as a ring-shaped member, 12, 35 ... second
A ring-shaped moving body as a ring-shaped member, 13 a groove-shaped space, 14 a communication path, 17 a ring-shaped lip packing as a ring-shaped seal member, 21, 22 lip portion,
31 ... ring-shaped packing as a ring-shaped sealing member.

[Procedure amendment]

[Submission date] March 30, 2000 (2003.3.3)
0)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0039

[Correction method] Change

[Correction contents]

[0039] and positioning protrusions 19 and the positioning groove 20
May be omitted, and a ring-shaped seal member may be bonded to the upper end surface of the ring-shaped moving body 12. Further, the ring-shaped seal member does not necessarily have to be positioned and fixed.

Claims (3)

[Claims] 1. A driving fluid is supplied to a first ring-shaped member, a second ring-shaped member arranged in combination with the first ring-shaped member, and a closed space defined between the two ring-shaped members. And a communication path for supplying and discharging, and by supplying and discharging the driving fluid through the communication path, the two ring-shaped members are configured to relatively move along the ring axis direction. Ring type actuator. 2. A ring-shaped main body having a substantially U-shaped cross section having a groove-shaped space opened at one end surface, a ring-shaped moving body disposed in a state housed in the groove-shaped space, and the ring A communication path for supplying and discharging a driving fluid to and from a closed space defined between the ring-shaped body and the ring-shaped moving body, and a ring disposed at a sliding interface between the ring-shaped body and the ring-shaped moving body. A ring-shaped actuator, wherein the ring-shaped movable body is moved along the ring axis direction by supplying and discharging the driving fluid through the communication passage. . 3. The ring-shaped sealing member is a ring-shaped lip packing installed on the inner end surface of the ring-shaped moving body located in the groove-shaped space so as to be integrally movable. 3. The ring-type actuator according to claim 2, wherein lip portions that are opened when the driving fluid is supplied are provided at two positions, an outer peripheral portion and an inner peripheral portion.