JP2001277565A - Wrapping device for thermal head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wrapping device for a thermal head, capable of preferably and efficiently executing a wrapping process for the surface for forming a protection film, a protection film, or the like, in a thermal head production step so as to produce a high quality thermal head with a good productivity. SOLUTION: This device comprises a pallet for holding at least one thermal head, a conveying means for conveying the thermal head held by the pallet successively to a predetermined processing position, and wrapping means for pressuring a running wrapping material against the thermal head conveyed to the processing position, wherein two sets of the wrapping means are disposed facing with each other so that the pallet is moved by the conveying means in the arrangement direction of heat generating elements of the thermal head in a state that the wrapping materials with different coarseness are pressured against the thermal head.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to various printers,
It belongs to the technical field of thermal head manufacturing for thermal recording used as recording means in plotters, fax machines, recorders, and the like. More specifically, in the thermal head manufacturing process, a protective layer of the thermal head, a layer on which the thermal head is formed, etc. The present invention relates to a small and easy-to-handle thermal head lapping apparatus suitable for use as a thermal head lapping apparatus for performing lapping processing (polishing processing).

[0002]

2. Description of the Related Art Thermal recording using a thermal recording material formed by forming a thermal recording layer using a film or the like as a support is used for recording an ultrasonic diagnostic image. Thermal recording has the advantages of requiring no wet development processing and being easy to handle. Therefore, in recent years, not only small-sized image recording apparatuses such as ultrasonic diagnostics but also CT diagnostics, MRI diagnostics, X
Even in applications requiring large and high-quality images, such as line diagnosis, use for image recording for medical diagnosis is increasing.

[0003] As is well known, in thermal recording, a heating element having a heating resistor or an electrode is moved in one direction (main scanning direction).
Using a thermal head on which a heating element (glaze) is arranged, and while the glaze is slightly pressed against the thermosensitive recording material, both are relatively moved in a sub-scanning direction orthogonal to the main scanning direction. According to the image data of a recording image supplied from an image data supply source such as MRI or CT, energy is supplied to each heating element of the glaze to generate heat, thereby heating the heat-sensitive recording layer of the heat-sensitive recording material. The image is recorded by coloring.

In the glaze of this thermal head, a protective film is formed on the surface of the glaze to protect the heating element for heating the thermosensitive recording material or further the electrodes and the like. Therefore, it is the protective film that comes into contact with the heat-sensitive recording material during the heat-sensitive recording, and the heating element heats the heat-sensitive recording material via the protective film, thereby performing the heat-sensitive recording. The material of the protective film is usually made of wear-resistant ceramics such as silicon nitride, but the surface of the protective film slides on the heat-sensitive recording material in a heated state at the time of heat-sensitive recording. Wear and deteriorate as they are layered.

[0005] If the wear progresses, density unevenness occurs in the recorded image or the strength of the protective film cannot be maintained, so that the function of protecting the heating element and the like is impaired.
Image recording cannot be performed (head shortage). In particular, in applications where high-quality and high-quality multi-tone images are required, such as the medical applications described above, a high-rigidity support such as a polyester film is used in order to achieve high quality and high image quality. Is used, and the recording temperature (applied energy) and the pressing force of the thermal head on the heat-sensitive recording material are set to be higher.
Therefore, compared to normal thermal recording, the force and heat applied to the protective film of the thermal head are large, and wear and corrosion (wear due to corrosion) are more likely to progress.

For this reason, a number of techniques have been proposed for preventing the wear of the protective film of the thermal head and improving the durability. One of the techniques is as follows.
It has been proposed to use a combination of a protective film containing carbon as a main component (hereinafter referred to as a carbon protective film). Since the carbon protective film has properties very close to diamond, it is extremely high in hardness and also chemically stable, so in terms of abrasion resistance and corrosion resistance against sliding contact with the heat-sensitive recording material, Demonstrates excellent properties. For example, Japanese Patent Application Laid-Open No. 7-132628 discloses that a lower silicon-based compound layer and an upper diamond-like carbon (DL)
By disposing a protective film having a two-layer structure with the C) layer, a thermal head capable of significantly reducing abrasion and destruction of the protective film and enabling high-quality recording for a long time is disclosed.

[0007]

In the manufacturing process of such a thermal head, the purpose is to improve surface properties, prevent image recording failure, improve adhesion of a protective film, prevent damage to a thermosensitive recording material, and the like. Lapping (polishing) of the protective film is performed. In particular, the carbon protective film described above easily reflects irregularities on the formation surface, and if the formation surface has irregularities,
Irregularities causing image recording failure are formed on the surface. Further, the carbon protective film is brittle because of its hardness, and if there is unevenness or foreign matter on the surface on which it is formed, peeling or cracking is likely to occur due to mechanical or physical stress. On the other hand, when the surface of the lower protective film is wrapped, the surface of the surface to be formed is smoothed, and then the carbon protective film is formed, the surface properties and adhesion of the carbon protective film are improved. The image quality, cracks and peeling due to unevenness on the surface can be suitably prevented (see, for example,
1-5323).

The present invention has been made in view of the above circumstances, and it is an object of the present invention to preferably and efficiently perform a lapping process on a surface on which a protective film is formed and a protective film in a manufacturing process of a thermal head. It is possible to improve the production efficiency of thermal heads and to produce high quality thermal heads with good lapping treatment and high quality image recording with good productivity. The present invention provides a wrapping device for a thermal head.

[0009]

In order to achieve the above object, a wrapping apparatus for a thermal head according to the present invention comprises:
A pallet for holding at least one thermal head, conveying means for moving the pallet to sequentially convey the thermal head held on the pallet to a predetermined processing position, and moving the wrapping material to the processing position. A wrapping device for pressing the thermal head conveyed to the thermal head wrapping device,
In a state where the two lapping means are arranged so as to face each other, and the wrapping means arranged oppositely presses the running lapping material against the thermal head,
A wrapping process of the thermal head is performed by moving the pallet in a direction in which the heating elements of the thermal head are arranged by the transporting means.

In the thermal head wrapping device according to the present invention, the pallet holds a plurality of thermal heads arranged in a direction orthogonal to the arrangement direction of the heat generating elements of the thermal head. A wrapping material having a width corresponding to the entire area of the heating element of the thermal head, wherein the transporting means intermittently transports the pallet in the direction in which the thermal heads are arranged, and removes the thermal head held by the pallet. ,
It is preferable that the wafers are sequentially conveyed to the processing position.

In the thermal head lapping apparatus according to the present invention, the two lapping means disposed so as to be opposed to each other are set such that lapping materials having different roughness are set. Features.

In the thermal head wrapping device according to the present invention, the pallet is a first component set on the transporting means, and the pallet is located on the first component, and the first component is And a third component having an angle adjusting means with respect to the first component.

Here, in the thermal head lapping apparatus according to the present invention, the third component having the angle adjusting means with respect to the first component is provided with the position adjusting means with respect to the first component. Or a second component having a position adjusting means with respect to the first component, which is disposed on the second component having
It is characterized in that it is arranged on a third component provided with means for adjusting the angle with respect to the first component.

In the thermal head lapping apparatus according to the present invention, the position adjusting means in the second component and the angle adjusting means in the third component use a micrometer for setting. Is preferred.

In the thermal head lapping device according to the present invention, the lapping means adjusts the position of the lapping material in at least two stages when pressing the lapping material against the thermal head to reduce the impact. There is a feature.

[0016]

Embodiments of the present invention will be described below in detail with reference to preferred embodiments shown in the accompanying drawings.

FIG. 1 is a schematic sectional view of a preferred example of a heating element of a thermal head manufactured by using a thermal head lapping apparatus (hereinafter simply referred to as a lapping apparatus) according to an embodiment of the present invention. . The thermal head 10 in the illustrated example performs thermal recording at a recording (pixel) density of about 300 dpi capable of recording an image up to a maximum B4 size, and performs thermal recording on the thermal recording material A (x
Has a known configuration in which a glaze is formed in which heating elements are arranged in one direction (a direction perpendicular to the paper surface in FIG. 1).

As shown in FIG. 1, the thermal head 10 (its glaze) is placed on a substrate 12 (the thermal head 10 in the illustrated example is pressed against the thermosensitive recording material A from above during recording. In the following, a glaze layer (heat storage layer) 14 formed thereon, a heat generating (resistor) body 16 formed thereon, an electrode 18 formed thereon, and a protective film further formed thereon Consists of The protective film of the thermal head 10 shown in FIG. 1 includes a lower protective film 20 formed to cover the heating element 16 and the electrode 18, and an intermediate protective film (hereinafter simply referred to as “lower protective film”) formed on the lower protective film 20. It has a three-layer configuration including an intermediate layer 22) and a carbon protective film 24 mainly formed of carbon and formed on the intermediate layer 22.

The lapping apparatus of the present invention can be suitably used for all lapping processes in a known thermal head manufacturing process, particularly for lapping a protective film and a surface on which a protective film is formed.

Therefore, the thermal head 10 shown in FIG.
Although having a feature in the layer configuration of the protective film, it has basically the same configuration as a known thermal head. In particular,
The substrate 12 is made of an electrically insulating material such as heat-resistant glass or ceramics such as alumina, silica or magnesia, the glaze layer 14 is made of a heat-resistant glass or heat-resistant resin such as a polyimide resin, and the heating element 16 is made of nichrome (Ni-). Cr),
A heating resistor such as tantalum or tantalum nitride is used, and a conductive material such as aluminum or copper is used for the electrode 18.
It can be suitably used.

The heating element (glaze) includes a thin-film heating element formed by using a so-called thin film forming technique such as vacuum deposition, CVD, and sputtering and a photo-etching method, and a so-called thin-film heating element formed by printing such as screen printing and firing. Although a thick film type heating element formed by using a thick film forming technique is known, any type of thermal head 10 may be used in the present invention.

The lower protective film 20 formed on the thermal head 10 may be any known material used as a protective film for the thermal head as long as the material has sufficient heat resistance, corrosion resistance and wear resistance. And silicon nitride (Si ₃ N ₄ ), silicon carbide (Si C), tantalum oxide (Ta ₂ O ₅ ), aluminum oxide (Al ₂ O ₃ ), sialon (Si Al ON), and silicon oxide (Si ₃ N ₄ ). Various ceramic materials such as SiO ₂ ) are preferably exemplified.

The illustrated thermal head 10 has a three-layer protective film having an intermediate layer 22 formed on such a lower protective film 20 and a carbon protective film 24 thereon. As described above, since the carbon protective film 24 is very stable chemically, the presence of the carbon protective film 24 on the lower protective film 20 allows the chemical protection of the lower protective film 20, the heating element 16, the electrode 18, and the like. Corrosion can be effectively prevented and the life of the thermal head can be prolonged.
The provision of the intermediate layer 22 improves the adhesion between the lower protective film 20 and the carbon protective film, shock absorption, and the like, and realizes a long-life thermal head having more excellent durability and long-term reliability.

Here, the intermediate layer 22 formed on the thermal head 10 includes a metal of Group 4A (Group 4 = titanium group), a metal of Group 5A (Group 5 = vanadium group) of the periodic table,
The upper carbon protective film and the lower layer mainly include at least one selected from the group consisting of metals of Group 6A (Group 6 = chromium group), Si (silicon) and Ge (germanium). This is preferable from the viewpoint of the adhesion to the lower protective film 20 and the durability of the carbon protective film 24. In particular,
From the viewpoint of the bonding property with the carbon protective film 24 and the like, Si and Mo are preferable, and particularly, Si is preferable.

In the illustrated thermal head 10,
On this intermediate layer 22, a carbon protective film 24 mainly composed of carbon is formed. In the present invention, a carbon protective film containing carbon as a main component is 50 atomic% (atm
%) A carbon film containing more than carbon, preferably a carbon film composed of carbon and unavoidable impurities. Preferred examples of additional components other than carbon for forming the carbon protective film include hydrogen, nitrogen, fluorine, Si and Ti. When the additional components are hydrogen, nitrogen and fluorine, their contents in the carbon protective film are preferably less than 50 atm%, and the additional components are Si.
And Ti, the content of these in the carbon protective film is preferably 20 atm% or less.

The lapping apparatus of the present invention performs a polishing process on a surface to be formed and a polishing process on a formed protective film prior to the formation (deposition) of each protective film in the process of manufacturing the thermal head as described above. It is.

For example, in the illustrated thermal head 10 (the same applies to a two-layer structure having no intermediate layer 22), the lower protective film 20 is polished prior to the formation of the intermediate layer 22 and the carbon protective film 24. Then, the surface roughness Ra is set to 0.
It is preferably from 005 μm to 0.5 μm. Thereby, in addition to the prevention of image recording failure due to the unevenness of the carbon protective film 24, the adhesion of the carbon protective film 24 and the intermediate layer 22 is improved, and the peeling and cracking of the carbon protective film 24 are prevented. A highly durable and reliable thermal head can be realized. Since the surface roughness of the intermediate layer 22 substantially follows the lower protective film 20, the surface of the lower protective film 20 may be appropriately treated.

In any of the two-layer and three-layer protective films, after the carbon protective film 24 is formed, the carbon protective film 24 is polished so that the surface roughness Ra is 2 nm. It is preferably set to と す る 100 nm. This makes it possible to realize a thermal head that has little sticking and can significantly reduce recording sound and image whiteout caused by sticking.

FIGS. 2 and 3 show a schematic configuration of a lapping apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of the wrapping device of the present invention, and FIG.
The arrow side view is each shown.

The illustrated lapping device 30 is a device for performing a glaze lapping process of a thermal head. As described above, the two lapping devices 30A and 30 are provided.
B are arranged so as to face each other and constitute one unit. These two lapping devices 30A and 30B are substantially the same, and include, for example, a wrapping tape feeding and winding mechanism and a surface of a thermal head that wraps the wrapping tape at a polishing position described later. What is necessary is just to have the means which presses on a part.

Also, two wrapping devices 30A, 30
LM (Linear Moto) so as to penetrate the polishing position of B
r) A guide 31 is arranged, and the first and second polishing positions (pressing rolls 32a, 3
2b) is set. The thermal head to be wrapped is conveyed to the polishing position and subjected to a lapping process, as described later.

That is, the thermal head 10 to be wrapped is held by a holding portion 33 called a pallet that moves on the LM guide 31 with high accuracy, and is attached to (set portion) → first polishing position (pressing roll). 32a) → the second polishing position (the position of the pressing roll 32b) → the removal portion, and during this time, undergoes a predetermined lapping process at the polishing position. Here, an example is shown in which the attachment portion (set portion) and the removal portion are located at the same position, but this is for operational reasons and is not essential.

The two wrapping devices 30A, 30
The difference of B is the difference in the set value of the lapping roughness. Here, as an example, in the lapping apparatus 30A, # 60
Although the rough polishing using the lapping tape of No. 00 is performed and the final polishing using the lapping tape of No. 20000 is performed in the lapping device 30B, the division and the like may be freely changed.

The two wrapping devices 30A and 30B are
As shown in FIG.
1, a winding section 42 (each of them has a torque motor), a reference roll 43, and a pressing roll 44 constituting a polishing position. In addition to this, variations such as providing a dancer roll for tension adjustment on the sending side, and moving the reference roll 43, and basically forming a type for both sending and winding are possible. .

The wrapping devices 30A, 30 shown in FIG.
In B, under control of the reference roll 43, the wrapping tape T sent from the sending section 41 is supplied to the polishing position of the pressing roll 44 at a predetermined speed to polish the surface of the thermal head 10 and to polish the surface of the thermal head 10 after polishing. Wrapping tape T
Is wound around the winding unit 42. As the wrapping tape T, for example, a tape having a width of 1 inch and a length of 300 m is used.

The LM guide 31 receives a rough lapping of the pallet 33 from the standby position at a predetermined speed pattern by a stepping motor with a high precision (first polishing position = position of the pressing roll 32a). ,
The sheet is transported to a position where the lapping is finished (second polishing position = the position of the pressing roll 32b), and when the lapping process is completed, the lapping process returns to the above-described standby position. Here, the standby position refers to a position where the thermal head 10 is attached to or detached from the pallet 33.

FIGS. 4 and 5 show the detailed structure of the pallet 33 described above. Here, the pallet 33 has a three-layer configuration as shown. The first component is
The lowermost layer, the transported subject 33a set directly on the LM guide 31, is hereinafter referred to as the base of the pallet 33. The second component is the base 33
a with respect to the base portion 33a.
A portion 33b (hereinafter, referred to as a pallet position adjusting unit for convenience of description) configured to allow position adjustment in a direction orthogonal to the moving direction of the pallet 33 along the M guide 31.

The third component is further mounted on the above-described position adjusting portion 33b, and is rotatable with respect to the position adjusting portion 33b, that is, the angle of the pallet 33 with respect to the transport direction is adjustable. (Hereinafter referred to as a pallet angle adjustment unit) 33c. The thermal head 10 to be wrapped is actually attached to the angle adjusting section 33c by the thermal head mounting jig 35.
Will be attached.

Accordingly, the thermal head 10 attached to the pallet 33 is attached to the angle adjusting section 33c, and is adjusted in the direction perpendicular to the moving direction by the position adjusting section 33b and in the moving direction by the angle adjusting section 33c. Thus, the angle can be adjusted. In addition, in the adjustment of the position and the angle, it is usually preferable to first perform the position adjustment and then perform the angle adjustment.

Here, the position adjusting portion 33b is formed by compressing the base portions 33a with compression springs arranged near both ends thereof.
The adjustment of the position between them (i.e., the adjustment of the position of the position adjusting portion 33b with respect to the base portion 33a) is performed by pressing the micro position provided in the middle of the base portion 33a. Position adjuster 3 with meter
3b is configured to be performed by the minute amount moving mechanism 34a.

The angle adjusting section 33c is held by a rotation center axis disposed at the center thereof so as to be rotatable about the axis with respect to the position adjusting section 33b.
Adjustment of the angle between the two (that is, the position adjustment unit 33b)
The adjustment of the angle of the angle adjustment unit 33c with respect to the angle adjustment unit 33c is performed by an angle adjustment unit 33c provided with two micrometers, which is provided near both ends of the position adjustment unit 33b, and a minute movement mechanism 34b.

Here, an example in which the pallet 33 has a three-layer structure is described, but the present invention is not limited to this, and the second component and the third component are integrated. Thus, the position and the angle may be adjusted together (simultaneously) between the integrated portion and the base portion. Also, when a three-layer configuration is adopted, the angle adjustment unit 33c
May be directly rotated with respect to the base portion 33a.

First and second polishing positions (= pressing roll 32
At positions (a, 32b), pressing means 36 for pressing the wrapping tape T is arranged on the surface of the thermal head 10 on the pallet 33 conveyed and positioned. The pressing means 36 includes two guide rollers 36a and 36b which guide the wrapping tape T and are disposed in a triangular shape with their apexes facing downward, and a pressing roll 44 which is disposed between them and constitutes a polishing position. It is composed of

The pressing means 36 has elevation control means (not shown), and is normally moved upward. When the pallet 33 holding the thermal head 10 is transported to a predetermined position, the elevation control means is moved. Pressing roll 3 by
2a (or 32b) is moved downward, and the lapping tape T is pressed against the thermal head 10 at the polishing position. When the pressing roll 32a (or 32b) moves downward, it is preferable that the pressing roller 32a moves at a high speed at first, and then decelerates at a later stage so as to softly contact the thermal head 10.

In this case, an air syringe is used as the lifting / lowering means of the pressing means 36. However, the lifting / lowering means is not particularly limited, and mechanical means using a spring or a cam or electric means using various motors. , Furthermore, means utilizing magnetism or a combination thereof,
Various known means are available.

The running speed of the tape T is not particularly limited, and may be appropriately determined according to the type of material to be polished, the amount of polishing, and the like. For example, when polishing the lower protective film 20, the intermediate layer 22, the carbon protective film 24, and the like, 0.1 m /
It is preferably about 50 m / sec to 50 m / sec. The pressing force of the wrapping tape T on the thermal head 10 is not particularly limited, and may be appropriately determined according to the type of the material to be polished, the amount of polishing, and the like.

In the wrapping apparatus according to the present embodiment, which is configured as described above, the pallet 33 provided with the above-described means for precisely positioning (determining the posture) of the thermal head 10 is used. Before starting the process, the attitude of the thermal head 10 can be set precisely. The pallet 33 on which the thermal head 10 is precisely set as described above is positioned at the polishing position along the LM guide 31.

At the polishing position, rough lapping is performed by the lapping device 30A at the first polishing position, and fine lapping is performed by the lapping device 30B at the second polishing position. On this occasion,
With respect to the pressing of the wrapping tape T to the thermal head 10, consideration is given so as not to give an impact as described above.

In the lapping apparatus according to the present embodiment, the thermal head 10 is positioned at the polishing position.
Can be precisely set by a simple operation. For example, as shown in FIG. 6, the cross-sectional shape of the glaze convex portion of the thermal head 10 formed by the lapping process is indicated by a curve S. From the usual symmetric shape,
It is easy to freely and precisely set the shape including the asymmetric cross-sectional shape as shown by the curves P and Q.

The above embodiment is merely an example of the present invention, and it goes without saying that the present invention is not limited to this. As described above, in the thermal head manufacturing process, the lapping apparatus of the present invention performs polishing of the surface to be formed prior to formation (deposition) of each protective film or polishing of the protective film after formation. In this case, it can be suitably used.

[0051]

As described above in detail, according to the present invention, it is possible to preferably and efficiently perform a lapping process on a surface on which a protective film is formed and a protective film in a manufacturing process of a thermal head. In addition, it is possible to realize a thermal head wrapping device that enables high-quality thermal heads to be manufactured with good productivity.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view of a preferred example of a heating element of a thermal head manufactured using a lapping device according to an embodiment of the present invention.

FIG. 2 is a plan view showing a schematic configuration of a wrapping device according to one embodiment of the present invention.

FIG. 3 is a side view taken along the line AA in FIG. 2;

FIG. 4 is a top view showing a detailed configuration of a pallet 33 used in the lapping device according to the embodiment.

FIG. 5 is a side view corresponding to FIG.

FIG. 6 is a sectional view showing a glaze shape of the thermal head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Thermal head 12 Substrate 14 Glaze layer 16 Heat generation (resistance) body 18 Electrode 20 Lower protective film 22 Intermediate layer 24 Carbon protective film 30, 30A, 30B Lapping device 31 LM guide 32a, 32b Press roll 33 Pallet (holding part) 33a Base Part 33b Position adjusting part 33c Angle adjusting part 34a Position adjusting part minute moving mechanism 34b Angle adjusting part minute moving mechanism 35 Thermal head mounting jig 36 Pressing means 36a, 36b Guide roller 41 Sending-out part 42 Winding 43 Reference roll 44 Pressing roll

Claims (8)

[Claims] 1. A pallet for holding at least one thermal head, transport means for moving the pallet and sequentially transporting the thermal head held on the pallet to a predetermined processing position, and a wrapping material for traveling A wrapping device for pressing the thermal head conveyed to the processing position, and a wrapping device for the thermal head, wherein the two wrapping devices are arranged so as to face each other, While the wrapping means is pressing the running wrapping material against the thermal head,
A lapping apparatus for a thermal head, wherein the transport means moves the pallet in a direction in which the heating elements of the thermal head are arranged, thereby performing a lapping process on the thermal head. 2. The pallet according to claim 1, wherein said pallet holds a plurality of thermal heads arranged in a direction orthogonal to an arrangement direction of the heating elements of the thermal head, and said lapping means corresponds to the entire area of the heating elements of the thermal head. It is to use a wrapping material having a width, wherein the conveying means,
2. The thermal head wrapping device according to claim 1, wherein the pallets are intermittently conveyed in the direction in which the thermal heads are arranged, and the thermal heads held on the pallets are sequentially conveyed to the processing position. 3. The lapping apparatus for a thermal head according to claim 1, wherein the two lapping means arranged so as to face each other are set with different lapping materials having different roughnesses. 4. The pallet according to claim 1, wherein said pallet is provided with a first component set on said transport means, and a second component provided on said first component and having a position adjusting means for adjusting a position with respect to said first component. The thermal head lapping apparatus according to any one of claims 1 to 3, further comprising a third component member having an angle adjusting means with respect to the first component member. 5. A third component provided with means for adjusting an angle with respect to said first component is disposed on a second component provided with means for adjusting a position with respect to said first component. The wrapping device for a thermal head according to any one of claims 1 to 4, wherein: 6. A second component having position adjusting means with respect to the first component is disposed on a third component having angle adjusting means with respect to the first component. The wrapping device for a thermal head according to any one of claims 1 to 4, wherein: 7. The thermal head lapping device according to claim 5, wherein the position adjusting means in the second component and the angle adjusting means in the third component use a micrometer for setting. apparatus. 8. The wrapping means, when pressing the wrapping material against the thermal head, positions the wrapping material by at least two positions.
The impact is reduced by adjusting in stages.
8. The wrapping device for a thermal head according to any one of items 7 to 7.