JP2001268883A - Coil wiring connector, linear motor, stage device, exposure apparatus, and semiconductor device manufacturing method - Google Patents

Abstract

(57) [Problem] To use a flat armature coil for a linear motor and wire the flat armature coils to each other using the conductor wire used in the flat armature coil as it is, wiring becomes complicated, And increase in size. The present invention provides a flat armature coil wiring connector capable of reliably performing coil wiring even in a small space having a small size. A flat armature coil wiring connector for electrically connecting a plurality of arranged coils, comprising: an insulating plate; and a terminal portion for connecting terminals of the coil, the connector being fixed on the insulating plate. And a plurality of thin plate-shaped members having a conductor plate, and the member provides a laminated flat armature coil wiring connector.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coil wiring connector such as a flat armature coil wiring connector such as a linear motor, a linear motor having a coil connected to the coil wiring connector, and a drive of the linear motor. The present invention relates to a stage apparatus used as a means, an exposure apparatus using the stage apparatus, and a method for manufacturing a semiconductor device using the exposure apparatus.

[0002]

2. Description of the Related Art Conventionally, a motor has been used as a mover drive source of a precision positioning device, and the motor is composed of a magnet unit and an armature coil unit.
A linear movement mechanism is used in a moving stage device, which is one of the precision positioning devices, and a type in which a rotary drive by a rotary motor is converted into a linear motion, and a type in which a linear drive is directly driven by a linear motor are known. . In particular, since the linear motor can directly obtain linear motion, the structure of the stage device is simplified, and the number of parts is reduced. Further, since there is no need for a mechanism for converting motion, there are many advantages such as loss of driving force due to the mechanism. Therefore, recently, a linear motor has been frequently used as a drive source of a linear motion mechanism.

In order to improve the efficiency of the linear motor, a flat and armature coil having a flat and complicated shape is conceivable in order to improve the space factor of the armature coil. FIG. 2 is a side view showing an example of such a flat armature coil (FIG.
(A)) and a plan view (FIG. 2 (b)). This coil has a shape in which a single conductive wire whose outer periphery is insulated and coated is wound in a tortoiseshell shape. The bent portion of the coil is formed to have a certain diameter in order to prevent the insulation coating from breaking.

[0004]

When a flat armature coil is used as a motor, a plurality of flat armature coils are regularly arranged as shown in FIG. 3, and each flat armature coil is set in accordance with an excitation method. Wiring must be performed, and the wiring must be reliably insulated. In this case, if the flat armature coils are wired using the conductor wires used in the flat armature coils as they are, there is a problem that the wiring becomes complicated and the dimensions increase.

In order to reduce the volume of the wiring, it is conceivable to reduce the size of the conductor in the wiring portion. However, this leads to an increase in the resistance value in the wiring portion, and the resulting power drop due to the voltage drop. And heat generation. Therefore, it is desired that the conductor used for the wiring has the same or lower resistance value as the conductor used in the coil. That is, this means that the thickness of the wiring must be equal to or greater than the thickness of the conductor of the flat armature coil. Furthermore, when using a flat armature coil, since the flat coil itself is mostly used in a narrow limited space, the thickness of the wiring must not exceed the size of the flat armature coil, or It is required to be thinner or a compact shape.

That is, there is a problem in that the wiring of the flat armature coil must be performed in a very narrow space without fail in insulation and without increasing the resistance value.

In view of the above, the present invention provides a connector for coil wiring such as a connector for wiring flat armature coils, which enables reliable wiring of flat armature coils in a narrow space, and is connected to the connector for coil wiring. It is an object to provide a linear motor having a coil, a stage device using the linear motor as driving means, an exposure device using the stage device, and a method for manufacturing a semiconductor device using the exposure device. .

[0008]

That is, in order to solve the above-mentioned problems, a coil wiring connector according to a first aspect of the present invention is a connector for electrically connecting a plurality of arranged coils, wherein an insulating plate and an insulating plate are provided. And a conductor plate having a terminal portion for connecting the terminal of the coil and a conductor plate fixed on the insulating plate, and the members are laminated.

According to a second aspect of the present invention, in the coil wiring connector according to the first aspect, the terminal portions do not overlap in the stacking direction of the members.

According to a third aspect of the present invention, in the coil wiring connector according to the second aspect, the length of the conductor plate is substantially an integral multiple of the width of the terminal portion.

[0011] A coil wiring connector according to a fourth aspect of the present invention is a connector for electrically connecting a plurality of arranged coils, comprising: an insulating sheet; a conductor pattern formed on the insulating sheet; A resin film that insulates a portion other than the coil connection portion of the conductor pattern, wherein the insulating sheet is folded such that the coil connection portions are arranged in the same direction.

According to a fifth aspect of the present invention, in the coil wiring connector according to the fourth aspect, the coil connection portions do not overlap in a direction in which the coil connection portions are arranged.

A linear motor according to a sixth aspect of the present invention has a plurality of coils connected to the coil wiring connector according to any one of the first to fifth aspects.

The linear motor according to a seventh aspect of the present invention is the linear motor according to the sixth aspect, wherein a resistance value of the conductor plate or the conductor pattern of the coil wiring connector is:
The resistance value is equal to or less than the resistance value of the coil connected to the conductor plate or the conductor pattern.

In an N-phase linear motor according to an eighth aspect of the present invention, the plurality of members are connected to the coil wiring connector according to any one of the first to third aspects, wherein the number of stacked members is N + 1. Of the coil.

According to a ninth aspect of the present invention, in the N-phase linear motor according to the eighth aspect, the resistance value of the conductor plate or the conductor pattern of the coil wiring connector is equal to the conductor plate or the conductor pattern. It is equal to or less than the resistance of the connected coil.

According to a tenth aspect of the present invention, there is provided a stage device, wherein the linear motor according to the sixth or seventh aspect or the N-phase linear motor according to the eighth or ninth aspect comprises a stage unit. This is used as a driving means for.

An exposure apparatus according to an eleventh aspect of the present invention comprises:
The stage apparatus according to the tenth aspect is used.

A semiconductor device manufacturing method according to a twelfth aspect of the present invention includes a step of transferring a circuit pattern of a reticle onto a wafer coated with a photosensitive agent using the exposure apparatus according to the eleventh aspect. is there.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below, but the present invention is not limited to these embodiments.

FIG. 1 shows a first embodiment of the present invention.
This will be described with reference to FIG.

FIG. 1 is an external view showing a state in which a plurality of flat armature coils are connected to a flat armature coil wiring connector which is the coil wiring connector of the first embodiment.
FIG. 2 is an external view of the flat armature coil. FIG. 2A is a side view, and FIG. 2B is a plan view. The shape of the flat armature coil 10 of FIG. 1 is the same as that of the flat armature coil 10 shown in FIG. The flat armature coil 10 has a tortoiseshell shape, and the left half 2 and the right half 3 form a step having a thickness of one conductor 1. Utilizing this step, the next flat armature coil 10 is attached to the right half of the flat armature coil 10.
By overlapping and arranging the left halves of the flat armature coils, even a plurality of flat armature coils 10 can be arranged compactly without lengthening.

On the other hand, the thickness of the flat armature coil row does not become thicker than the bent portion 4 even when the flat armature coils 10 are stacked. Therefore, it is desirable that the thickness of the flat armature coil wiring connector 20 be the same as or smaller than the bent portion 4.

Among the terminals of the flat armature coil 10, the terminals 1a, 1b, 1c, 1d, 1e, and 1f are terminals for making an electrical connection to the outside, and are connected to conductors (not shown). Terminals other than the terminals 1a, 1b, 1c, 1d, 1e, and 1f are connected to the flat armature coil wiring connector.

FIG. 5 is an external view showing the structure of the coil wiring connector according to the first embodiment. FIG. 5A is a plan view, and FIG. 5B is a cross-sectional view taken along line AA ′ of FIG. 5A. FIG. 6 is a plan view showing the configuration of each layer of the coil wiring connector according to the first embodiment.
The flat armature coil wiring connector 20 includes a conductor plate 21 and an insulating plate 22. Copper foil is used for the conductor plate 21 and is shaped by etching.
Is an epoxy resin plate. The conductor plate 21 is fixed to the insulating plate 22 with an epoxy resin adhesive to form a thin plate-shaped member. Similarly to the insulating plate 22, the conductive plates are also fixed to the insulating plates 23, 24, and 25 by an adhesive to form a thin plate-shaped member, but the fixing position of the conductive plate differs for each insulating plate.

An insulating plate 23 is fixed on the conductive plate 21 of the insulating plate 22 with an adhesive, and an insulating plate 24 is fixed on the conductive plate of the insulating plate 23 with an adhesive. The insulating plate 25 is fixed on the conductor plate of the insulating plate 25 with an adhesive, and the insulating plate 26 is fixed on the conductor plate of the insulating plate 25 with an adhesive, thereby forming the flat armature coil wiring connector 20 of FIG. . The thin plate member is
If it is a layer, the structure of the coil wiring connector of the first embodiment has four layers.

FIG. 4 is a diagram schematically showing a state of wiring when a three-phase motor is formed by using a plurality of coils. In FIG. 4, rectangles U, V, W, U ', V',
W 'represents one coil each. The upper left and lower right circles in each coil U, V, W, U ', V', W 'are the terminals of the coil. Focusing on the leftmost coil U, the upper left terminal of the leftmost coil U is connected to the outside by a conductor, and the lower right terminal of the leftmost coil U is the fourth coil U 'from the left. Is connected to the lower right terminal by a conducting wire.

When the connection structure is realized by the connector 20, the conductor plate 21 is preferably arranged as shown in FIG. Here, all the conductor plates 21 have the same shape, and terminal portions 21 a protruding from the insulating plate 22 and connecting flat armature coils are formed at both ends. Here, the terminal portions 21a of the respective layers are arranged as shown in FIG. 5 so as not to overlap when they are stacked. Thereby, when the conductor is connected to the terminal portion, the conductor does not overlap with the conductor connected to the other terminal portion in the laminating direction of the insulating plate, so that the arrangement as shown in FIG. preferable. FIG. 7 is a schematic diagram showing a case where the wiring connection of FIG. 4 is connected by a plate-like member such as a conductor plate. With such a connection, the connection of the wiring in FIG. 4 can be performed using the conductor plate. 1 and 4, the terminal 1 not connected to the flat armature coil wiring connector of FIG.
a, 1b, 1c, 1d, 1e, and 1f correspond to the terminals W2, V2, U2, W1, V1, and U1, respectively, of FIG.

Here, as can be seen from FIGS. 5 and 7, when a three-phase motor is formed using a plurality of coils, one coil is connected to the coil three ahead in the coil row direction. Then, two wires emerge from one coil, and two wires of another coil not connected to the coil are installed so as to straddle the coil.
As described above, in one coil, the total of the number of wirings (2) connected to the coil and the number of wirings (2) straddling the coil is four, which is the first embodiment. It can be seen that the coil wiring connector of the embodiment requires four layers of conductor plates. For example, in a four-phase motor, for one coil, the number of wires connected to that coil (two)
Then, the total number of wirings (three) that straddles the coil becomes five, and if the number of motor phases increases by one, the number of wirings straddling the coil increases by one. That is, when an N-phase motor is formed using a plurality of coils, N + 1 is required as the number of stacked conductor plates, and conversely, an N-phase motor can be realized without any more layers. Therefore, in the N-phase motor using the coil wiring connector according to the first embodiment, it is preferable that the number of stacked pairs of the conductor plate and the insulating plate is N + 1.

When the width of the terminal portion 21a is WD, the arrangement of the terminal portions 21a in each layer is shifted by an integral multiple of WD.
Therefore, the length of the conductor plate 21 is also substantially an integral multiple of WD. The width WD of the terminal portion 21a is determined in consideration of the thickness of the conductive wire 1 in order to make the resistance value equal to or less than that of the conductive wire 1 of the coil to be connected. Specifically, when the metal of the conductor plate and the metal of the conductor are of the same type, the cross-sectional area of the conductor and the cross-sectional area of the terminal are preferably substantially the same so that the resistance value is the same.

As described above, the coil wiring connector of the first embodiment has a laminated structure, but has a thickness equal to or less than that of the flat armature coil by using a thin plate-shaped member. be able to. This has the effect that the dimensions of the device can be reduced and the wiring of the flat armature coil can be performed reliably even in a narrow space. Further, since the resistance in the wiring portion does not increase, there is an effect that the generated force does not drop or heat is generated due to the voltage effect.

The connection between the terminal portion of the conductor plate of the flat armature coil wiring connector and the terminal of the coil is performed by soldering,
Various connection methods can be used, such as press-fitting and crimping using a conductive plate.

Although the flat armature coil wiring connector has a four-layer structure in the first embodiment, the number of layers may be other than four.

The insulating plate may be bakelite or the like. The conductor plate may be made of aluminum, silver, or the like.

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 8 is a plan view for explaining a flat armature coil wiring connector which is a coil wiring connector according to a second embodiment of the present invention. The flat armature coil wiring connector 30 is formed by forming a metal pattern 31 serving as a conductor portion, which is a conductor pattern, on a flexible resin flexible sheet 32 that is freely bendable and has high insulation properties, which is an insulation sheet. In the flat armature coil wiring connector 30, the surface of the pattern 31 other than the terminal portion 31a serving as a connection portion with the coil is covered with an insulating film (resin film having insulating properties). FIG. 8A shows a flexible sheet 32 having the pattern 31 formed on the surface. FIG. 8B shows a state where the flexible sheet 32 is bent once around the center. By this bending, the necessary terminal portions 31a are aligned in the same direction. FIG. 8C shows a state where the light beam is bent once more by the line 33. This makes the flat armature coil wiring connector 30 more compact. The resin flexible sheet 32 uses a polyimide sheet, and uses copper as a material of the metal pattern. The conductor pattern 31 of the flat armature coil wiring connector 30 is designed so that the terminal portions 31a do not overlap when bent. In FIG. 8A, the shape of the metal pattern is oblique linear except for the terminal portion 31a. However, in order to increase the width of the metal pattern, it is preferable to use a crank shape.

The connection with the flat armature coil is the same as in the first embodiment, and a description thereof will be omitted.

As described above, in the coil wiring connector of the second embodiment, the thickness can be made equal to or less than that of the flat armature coil. This has the effect that the dimensions of the device can be reduced and the wiring of the flat armature coil can be performed reliably even in a narrow space. In addition, since the resistance in the wiring portion does not increase, there is an effect that the generated force does not decrease due to a voltage drop and heat is not generated.

The material of the metal pattern may be aluminum, silver or the like.

Next, a third embodiment of the present invention will be described with reference to FIG.

In the third embodiment, a plurality of flat armatures connected to the coil wiring connector of the first embodiment or the second embodiment are mounted on a stage device 700 used for manufacturing a semiconductor. A linear motor having a coil,
Alternatively, an N-phase linear motor having a plurality of flat armature coils connected to the coil wiring connector of the first embodiment is used. In the linear motor or the N-phase linear motor, since a large number of coils are arranged at high density in the axial direction without leaving a space between each other, the space factor of the coils in the mover (armature) 120 is reduced. High, with high propulsion as a whole. The linear motor and the N-phase linear motor can be applied to either a moving coil type or a moving magnet type.

In the third embodiment, the linear motor 10
0 is used for driving the X stage (movable stage) 700X of the stage device 700.

Here, the stator 110 has a permanent magnet.

The configuration of the two linear motors 720 used for driving the Y stage 700Y is the same as that of the linear motor 1
00 and the detailed description is omitted.

The use of the stage device 700 in which the linear motors 100 and 720 are used as driving means is not limited, but in this embodiment, a pattern (not shown) formed on a wafer (substrate) 9 on a mask (not shown) is used. Is used as a means for moving the wafer 9 in an exposure apparatus for transferring the wafer 9.

That is, the stage device 700 is a two-axis XY stage device of X-axis and Y-axis,
X stage 700X driven in X direction (direction indicated by arrow X in FIG. 2), Y stage 700Y driven in Y direction (direction indicated by arrow Y), and sample stage (movable body) 7
04 is a main component.

Here, the sample stage 704 is mounted on the Y stage 7
The wafer (substrate) 9 is mounted on the sample stage 704 via a wafer holder (not shown).

Above the wafer 9, an irradiator (not shown) is disposed, and the wafer 9 is irradiated by exposure light irradiated from the irradiator via a mask (both not shown).
The circuit pattern on the mask is transferred to a resist (not shown) previously applied thereon.

X stage 7 in stage device 700
The amounts of movement of the 00X and Y stages 700Y are respectively set on the moving mirrors 705X and 705Y fixed to the X-direction end and the Y-direction end of the sample table 704, and to the base 702 so as to face the mirrors. Fixed laser interferometer 706X,
706Y. A main controller (not shown) controls the movement of the sample table 704 to a desired position on the base 702 based on the measurement result.

The X stage 70 of the stage device 700
Both the 0X and Y stages 700Y are linear motors 100 and 1 using a mover 120 on which a number of coils are arranged.
00, 720, and 720 respectively.
It is driven in the X and Y directions above.

Here, the two linear motors 100, 10
The 0 stators 110, 110 are both fixed on a base 702 at a mounting portion, and the movers 120, 120 are fixed to the X stage 700X via fixing plates 707, 707, respectively.

The stators 721, 721 of the linear motors 720, 720 are both fixed to the X stage 700X, and the movers 722, 722 (only one is shown) are fixed to the Y stage 700Y.

The stage device 700 is provided with an air guide 740 and a static pressure gas bearing (not shown).
The air blowing port 741 and the air suction port 742 constitute a stage of a static pressure air bearing type.

In the third embodiment, a linear motor having a plurality of flat armature coils connected to the coil wiring connector of the first embodiment or the second embodiment, Alternatively, since an N-phase linear motor having a plurality of flat armature coils connected to the coil wiring connector according to the first embodiment is used, the resistance in the wiring portion does not increase, so that no heat is generated. Accordingly, since the laser interferometer used for measuring the position of the stage is not affected by the thermal fluctuation due to the heat generated at the wiring portion, there is an effect that the position of the laser interferometer can be detected with high accuracy. .

Next, a fourth embodiment of the present invention will be described with reference to FIG.

The fourth embodiment is a linear motor having a plurality of flat armature coils connected to the coil wiring connector of the first embodiment or the second embodiment, or the first embodiment. In this embodiment, an N-phase linear motor having a plurality of flat armature coils connected to the coil wiring connector according to the first embodiment is used as a driving means of a reticle (mask) stage 850 (FIG. 10) of exposure apparatus 800.

The exposure apparatus 800 is a so-called step-and-scan exposure type scanning exposure apparatus.

The exposure apparatus 800 includes an illumination system 810,
A stage movable section for holding a reticle (photomask) R, a projection optical system PL, and a stage device 900 for driving a wafer (substrate) 9 in a two-dimensional direction of X-Y in a XY plane; Is provided with a main control device 820 for controlling the

The illumination system 810 irradiates the exposure light emitted from the light source unit to the rectangular (or arc-shaped) illumination area IAR on the reticle R with uniform illuminance.

In the reticle stage 850, the stage movable part is moved along the guide rail at a predetermined scanning speed on the reticle base, and the reticle R is placed on the upper surface of the stage movable part. For example, it is fixed by vacuum suction. An exposure light passage hole is formed below the reticle R of the stage movable section.

The moving position of the stage movable section is detected by the reflecting mirror 815 and the reticle laser interferometer 816, and the stage control system 819 issues an instruction from the main controller 820 based on the detected moving position of the stage movable section. The stage movable part is driven in accordance with.

The projection optical system PL is a reduction optical system.
As shown in FIG. 10, it is arranged below reticle stage 850, and the direction of its optical axis AX (coincident with the optical axis of the illumination optical system) is the Z-axis direction. Here, a refraction optical system including a plurality of lens elements arranged at predetermined intervals along the optical axis AX direction so as to have a telecentric optical arrangement is used. Therefore, when the illumination area IAR of the reticle R is illuminated by the illumination system 810, a reduced image (partially inverted image) of the circuit pattern in the illumination area IAR of the reticle R is exposed to light conjugate to the illumination area IAR on the wafer 9. It is formed in the region IA.

The stage apparatus 900 drives the table 918 in a two-dimensional direction in the XY plane by using a plane motor 970 using a coil as an armature as a driving means.

That is, the stage device 900 has a base 921 and several μm above the upper surface of the base 921.
Table 918 lifted through a degree of clearance
And a plane motor 970 for moving the table 918
With Here, the wafer (substrate) 9 is fixed to the upper surface of the table 918 during the exposure processing, for example, by vacuum suction.

A movable mirror 927 is fixed to the table 918, and a laser beam is emitted from the wafer interferometer 931 to detect the position of the table 918 in the XY plane. .

The information on the movement position obtained at this time is sent to main controller 820 via stage control system 819. Then, the stage control system 819 responds to an instruction from the main controller 820 based on this information, and
Activate 70 to move table 918 to a desired position in the XY plane.

The table 918 is supported on the upper surface of a mover (not shown) constituting the flat motor 970 at three different points by a support mechanism (not shown), and is moved in the X and Y directions by the flat motor 970. Not only can it be driven, but also it can be tilted with respect to the XY plane or driven in the Z-axis direction (upward). Note that the planar motor 970 has a known configuration, and other descriptions of the planar motor 970 are omitted.

In the figure, reference numeral 921 denotes a base portion,
A fluid for preventing a temperature rise due to heat generated from the inside thereof is supplied by a supply pipe 892, a discharge pipe 893, and a temperature control device 879.
It is circulated by the action of.

In exposure apparatus 800 including reticle stage 850 having such a configuration, exposure processing is generally performed in the following procedure.

First, the reticle R and the wafer 9 are loaded, and then reticle alignment, baseline measurement, alignment measurement and the like are executed.

After the completion of the alignment measurement, an exposure operation of a step-and-scan method is performed.

In the exposure operation, the reticle interferometer 8
16, reticle R position information, wafer interferometer 931
Main controller 820 based on position information of wafer 9 by
Issues a command to the stage control system 819, and the reticle R and the wafer 9 move synchronously by the linear motor and the planar motor 970 of the reticle stage 850, so that desired scanning exposure is performed.

When the transfer of the reticle pattern to one shot area is completed, the table 9
18 is stepped by one shot area, and scanning exposure is performed on the next shot area. This stepping and scanning exposure are sequentially repeated, and the required number of shot patterns are transferred onto the wafer 9.

Here, in the reticle stage 850, a three-phase current is appropriately supplied to each coil constituting the mover of the linear motor, and the amount of movement is controlled.

As described above, in the exposure apparatus of the fourth embodiment, the linear device having a plurality of flat armature coils connected to the coil wiring connector of the first embodiment or the second embodiment. Since a motor or an N-phase linear motor having a plurality of flat armature coils connected to the coil wiring connector of the first embodiment is used as a driving unit of the reticle (mask) stage 850 of the exposure apparatus 800. Since the laser interferometer used for measuring the position of the stage is not affected by the thermal fluctuation due to the heat generated at the wiring portion, the position of the laser interferometer can be detected with high accuracy. Further, since the coil wiring connector according to the present invention is compact, the space occupied by the stage can be reduced.

In the exposure apparatus of the fourth embodiment, a linear motor having a plurality of flat armature coils connected to the coil wiring connector of the first or second embodiment, Alternatively, an N-phase linear motor having a plurality of flat armature coils connected to the coil wiring connector according to the first embodiment is used as a driving unit of the reticle (mask) stage 850 of the exposure apparatus 800. The linear motor or the N-phase linear motor may be used as a driving unit of the stage device 900 for driving a wafer.

Incidentally, the exposure apparatus of the fourth embodiment is as follows.
The present invention can be applied to a step-and-repeat type exposure apparatus in which a pattern of a mask is exposed while the mask and the substrate are stationary and the substrate is sequentially moved stepwise.

Further, as the exposure apparatus of the fourth embodiment,
The present invention can also be applied to a proximity exposure apparatus that exposes a mask pattern by bringing a mask and a substrate into close contact without using a projection optical system.

The application of the exposure apparatus is not limited to the exposure apparatus for manufacturing semiconductors. For example, the present invention can be widely applied to a liquid crystal exposure apparatus for exposing a liquid crystal display element pattern to a square glass plate and an exposure apparatus for manufacturing a thin film magnetic head.

The light source of the exposure apparatus of the fourth embodiment includes g-line (436 nm), i-line (365 nm),
rF excimer laser (248 nm), ArF excimer laser (193 nm), not only the F ₂ laser (157 nm), it is possible to use a charged particle beam such as X-ray or electron beam. For example, when using an electron beam,
Thermionic emission type lanthanum hexaborite (LaB ₆ ) or tantalum (Ta) can be used. Further, when an electron beam is used, a structure using a mask may be used, or a pattern may be formed on a substrate by direct drawing using an electron beam without using a mask.

The magnification of the projection optical system may be not only a reduction system but also an equal magnification system or an enlargement system.

When far ultraviolet rays such as an excimer laser are used as the projection optical system, a material that transmits far ultraviolet rays such as quartz or fluorite may be used as a glass material. Also, F ₂
When using a laser or X-ray, use a catadioptric or refractive optical system (use a reticle of a reflective type).
When an electron beam is used, an electron optical system including an electron lens and a deflector may be used as the optical system. It goes without saying that the optical path through which the electron beam passes is in a vacuum state.

In an exposure apparatus using vacuum ultraviolet light (VUV light) having a wavelength of about 200 nm or less, a catadioptric optical system may be used as the projection optical system. As a catadioptric optical system, for example, Japanese Patent Application Laid-Open No.
No. 4 and corresponding US Pat. No. 5,668,6.
No. 72, and Japanese Patent Application Laid-Open No. 10-20195 and U.S. Pat. No. 5,835,275 and the like, which discloses a catadioptric optical system having a beam splitter and a concave mirror as a reflective optical element. Can be used. Also, Japanese Patent Application Laid-Open No. 8-334695 and US Patent No. 5,689,377 corresponding thereto, and
No. 0-3039 and corresponding US patent application Ser. No. 873,605 (filing date: June 12, 1997), etc., have a catadioptric system having a concave mirror or the like without using a beam splitter as a reflective optical element. Mold optics can be used. The present invention is also applicable to an exposure apparatus having such a projection optical system.

In addition, US Pat. No. 5,031,976
Nos. 5,488,229 and 5,717,518 disclose a plurality of refractive optical elements and two mirrors (a primary mirror which is a concave mirror and a reflecting element or a plane opposite to the plane of incidence of a plane-parallel plate). A sub-mirror, which is a back-side mirror having a reflection surface formed on the side, is disposed on the same axis, and an intermediate image of a reticle pattern formed by the plurality of refractive optical elements is formed on the wafer by the main mirror and the sub-mirror. A catadioptric optical system for re-imaging the image may be used. In this catadioptric optical system, a primary mirror and a secondary mirror are arranged following a plurality of refractive optical elements, and illumination light reaches a wafer through a part of the primary mirror.

Further, the catadioptric projection optical system has, for example, a circular image field, is telecentric on both the object side and the image side, and has a projection magnification of 1/4 or 1 / It is also possible to use a five-fold reduction system. In the case of a scanning type exposure apparatus having this catadioptric projection optical system, the irradiation area of the illumination light has its optical axis substantially centered within the field of view of the projection optical system, and is substantially orthogonal to the scanning direction of the reticle or wafer. It may be of a type defined in a rectangular slit shape extending along the direction of movement. According to such a scanning exposure apparatus, for example, a wavelength of 157 nm
100n also be used for F ₂ laser beam as illumination light for exposure
It is possible to transfer a fine pattern of about the mL / S pattern onto a wafer with high accuracy. The present invention is also applicable to an exposure apparatus having such a projection optical system.

When a linear motor is used for the wafer stage or reticle stage, either an air levitation type using an air bearing or a magnetic levitation type using Lorentz force or reactance force may be used. Also, the stage may be of a type that moves along a guide or a guideless type that does not have a guide.

When a plane motor is used as the stage driving device, one of the magnet unit and the armature unit is connected to the stage, and the other of the magnet unit and the armature unit is provided on the moving surface side of the stage. Just do it. still,
As a planar motor, for example, Japanese Patent Application Laid-Open No. 11-27925
Can be used.

The reaction force generated by the movement of the wafer stage may be mechanically released to the floor (ground) by using a frame member as described in, for example, JP-A-8-166475. . The present invention is also applicable to a wafer stage having such a reaction force processing mechanism.

The reaction force generated by the movement of the reticle stage may be mechanically released to the floor (ground) using a frame member as described in, for example, JP-A-8-330224. . The present invention is also applicable to a reticle stage having such a reaction force processing mechanism.

Further, the exposure apparatus according to the embodiment of the present invention includes each of the constituent elements (elevated elements) recited in the claims of the present invention.
various subsystems, including specified mechanical accuracy,
It is manufactured by assembling to maintain electrical and optical accuracy. Before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electric systems to ensure these various accuracy Are adjusted to achieve electrical accuracy. The process of assembling the exposure apparatus from various subsystems includes mechanical connections, wiring connections of electric circuits, and piping connections of pneumatic circuits among the various subsystems. It goes without saying that there is an assembling process for each subsystem before the assembling process from these various subsystems to the exposure apparatus. After the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustments including electrical adjustment, operation confirmation, and the like are performed, and various precisions of the entire exposure apparatus are secured. It is desirable that the manufacture of the exposure apparatus be performed in a clean room in which the temperature, cleanliness, and the like are controlled.

As shown in FIG. 11, the semiconductor device is designed in step 301 for designing the function and performance of the device.
Step 302 of manufacturing a mask (reticle) based on this design step, Step 303 of manufacturing a wafer from a silicon material, Wafer processing step 304 of exposing a reticle pattern to a wafer by the exposure apparatus of the above-described embodiment, Device assembling step (Including dicing process, bonding process, package process) 30
5. It is manufactured through an inspection step 306 and the like.

Hereinafter, the device manufacturing method will be described in more detail. FIG. 11 shows devices (ICs and LSIs).
Of the semiconductor chip, the liquid crystal panel, the CCD, the thin-film magnetic head, the micromachine, etc.). As shown in FIG. 11, first, in step 301 (design step), device function / performance design (for example, circuit design of a semiconductor device, etc.)
And design a pattern to realize the function. Subsequently, step 302 (mask manufacturing step)
In (1), a mask (reticle) on which a designed circuit pattern is formed is manufactured. On the other hand, in step 303 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.

Next, in step 304 (wafer processing step), using the mask (reticle) prepared in steps 301 to 303 and the wafer, an actual circuit or the like is formed on the wafer by lithography or the like, as described later. Form. Next, in step 305 (device assembly step), device assembly is performed using the wafer processed in step 304. This step 3
05 includes steps such as a dicing step, a bonding step, and a packaging step (chip encapsulation) as necessary.

Finally, step 306 (inspection step)
In the step (3), inspections such as an operation confirmation test and a durability test of the device manufactured in step 305 are performed. After these steps, the device is completed and the device is shipped.

FIG. 12 shows a detailed flow example of step 304 in the case of a semiconductor device. In FIG. 12, step 311 (oxidation step)
In, the surface of the wafer is oxidized. Step 31
In step 2 (CVD step), an insulating film is formed on the wafer surface. In step 313 (electrode forming step), electrodes are formed on the wafer by vapor deposition. In step 314 (ion implantation step), ions are implanted into the wafer. Each of the above steps 311 to 314 constitutes a pre-processing step in each stage of wafer processing, and is selected and executed according to a necessary process in each stage.

In each stage of the wafer process, when the above-mentioned pre-processing step is completed, the post-processing step is executed as follows. In this post-processing step, first, in step 3
In 15 (resist forming step), a photosensitive agent is applied to the wafer. Subsequently, in step 316 (exposure step), the circuit pattern of the mask (reticle) is transferred onto the wafer using the above-described exposure apparatus 800. Next, the wafer exposed in step 317 (development step) is developed, and in step 318 (etching step), the surface of the exposed member other than the portion where the resist remains is removed by etching. Then, in step 319 (resist removing step), unnecessary resist after etching is removed.

By repeatedly performing these pre-processing and post-processing, multiple circuit patterns are formed on the wafer.

[0097]

As described above, according to the present invention, since the connector for the flat armature coil is compact and the terminal portions do not overlap, the wiring of the coil can be reliably performed even in a narrow space. There is an effect that can be.

Further, since the resistance in the wiring portion does not increase, there is an effect that the generation force does not drop or heat is generated due to the voltage effect.

Further, several coils connected to the flat armature coil wiring connector are formed as one unit,
By connecting the necessary units, there is an effect that maintenance such as change of the stroke of the linear motor or replacement of the unit when the motor fails can be facilitated.

Further, since the laser interferometer used for measuring the position of the stage is not affected by the thermal fluctuation due to the heat generated in the wiring portion, the position of the laser interferometer can be detected with high accuracy. is there.

Further, there is an effect that the space occupied by the stage in the exposure apparatus may be small.

[Brief description of the drawings]

FIG. 1 is an external view showing a state in which a plurality of flat armature coils are connected to a coil wiring connector according to a first embodiment.

FIG. 2 is an external view of a flat armature coil. FIG. 2 (a)
Is a side view, and FIG. 2B is a plan view.

FIG. 3 is a plan view showing an arrangement of a plurality of flat armature coils.

FIG. 4 is a diagram schematically showing a state of wiring when a three-phase motor is to be formed by using a plurality of coils.

FIG. 5 is an external view showing the structure of the coil wiring connector according to the first embodiment of the present invention. FIG. 5A is a plan view, and FIG. 5B is a cross-sectional view taken along line AA ′ of FIG. 5A.

FIG. 6 is a plan view showing a configuration of each layer of the coil wiring connector according to the first embodiment of the present invention.

FIG. 7 is a schematic diagram in a case where the wiring connection of FIG. 4 is connected by a plate-like member such as a conductor plate.

FIG. 8 is a plan view for explaining a flat armature coil wiring connector according to a second embodiment of the present invention.

FIG. 9 is a perspective view showing a stage device 700 to which the linear motor 100 is applied.

FIG. 10 is a diagram showing an overall configuration of an exposure apparatus 800 in which a linear motor is used for reticle stage 850.

FIG. 11 is a diagram showing a semiconductor device manufacturing process using the exposure apparatus according to the present invention.

FIG. 12 is a diagram showing a more specific manufacturing process of a semiconductor device using the exposure apparatus according to the present invention.

[Explanation of symbols]

1 ... Conductor 1a, 1b, 1c, 1d, 1e, 1f, W, U, V,
W ', U', V ', U1, V1, W1, U2, V2, W
2 ... terminal 4 ... bent part 10 ... coil 20, 30 ... connector for flat armature coil wiring 21 ... conductor plate 21 a, 31 a ... terminal part 22, 23, 24, 25 , 26 ... insulating plate 31 ... conductor pattern 32 ... insulating sheet 100 ... linear motor 110 ... stator 120 ... mover 700 ... stage device 800 ... exposure device 850 ... Reticle stage

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5F031 CA02 HA53 JA06 JA14 JA29 JA32 KA06 KA11 LA03 LA04 LA08 MA27 5F046 BA05 CC01 CC02 CC03 CC18 5H641 BB06 BB14 BB18 GG03 GG05 GG11 GG12 GG15 HH02

Claims (12)

[Claims] 1. A connector for electrically connecting a plurality of arranged coils, comprising: an insulating plate; and a conductor plate provided with a terminal portion for connecting terminals of the coil and fixed on the insulating plate. A coil wiring connector, comprising: a plurality of members configured as described above, wherein the members are stacked. 2. The coil wiring connector according to claim 1, wherein the terminal portions do not overlap in the stacking direction of the members. 3. The coil wiring connector according to claim 2, wherein the length of the conductor plate is substantially an integral multiple of the width of the terminal portion. 4. A connector for electrically connecting a plurality of arranged coils, comprising: an insulating sheet; a conductor pattern formed on the insulating sheet; and a resin for insulatingly covering portions other than the coil connection portion of the conductor pattern. And a film, wherein the insulating sheet is folded such that the coil connection portions are arranged in the same direction. 5. The coil wiring connector according to claim 4, wherein the coil connection portions do not overlap in a direction in which the coil connection portions are arranged. 6. A linear motor comprising a plurality of coils connected to the coil wiring connector according to claim 1. Description: 7. A resistance value of the conductor plate or the conductor pattern of the coil wiring connector is equal to or less than a resistance value of a coil connected to the conductor plate or the conductor pattern. The linear motor according to claim 6, wherein 8. An N-phase linear motor having a plurality of coils connected to the coil wiring connector according to claim 1, wherein the number of layers of the members is N + 1. 9. A resistance value of the conductor plate or the conductor pattern of the coil wiring connector is equal to or less than a resistance value of a coil connected to the conductor plate or the conductor pattern. The N-phase linear motor according to claim 8, wherein 10. A stage device, wherein the linear motor according to claim 6 or 7 or the N-phase linear motor according to claim 8 or 9 is used as a driving unit of a stage unit. 11. An exposure apparatus using the stage device according to claim 10. 12. A method for manufacturing a semiconductor device, comprising a step of transferring a circuit pattern of a reticle onto a wafer coated with a photosensitive agent using the exposure apparatus according to claim 11.