JP2001266724A - Alloy-type thermal fuse - Google Patents
Alloy-type thermal fuseInfo
- Publication number
- JP2001266724A JP2001266724A JP2000081924A JP2000081924A JP2001266724A JP 2001266724 A JP2001266724 A JP 2001266724A JP 2000081924 A JP2000081924 A JP 2000081924A JP 2000081924 A JP2000081924 A JP 2000081924A JP 2001266724 A JP2001266724 A JP 2001266724A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- weight
- fuse
- fuse element
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 31
- 239000000956 alloy Substances 0.000 claims abstract description 31
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 238000002844 melting Methods 0.000 claims abstract description 15
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 17
- 230000008018 melting Effects 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 229910052718 tin Inorganic materials 0.000 abstract description 4
- 229910052797 bismuth Inorganic materials 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000004321 preservation Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 15
- 239000007788 liquid Substances 0.000 description 10
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 8
- 239000010408 film Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229910052745 lead Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 235000021355 Stearic acid Nutrition 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 229910002058 ternary alloy Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VDQLTWSIHIWIFQ-UHFFFAOYSA-N 5-chloro-2-(3,4-dimethoxyphenyl)-2-propan-2-ylpentanenitrile Chemical compound COC1=CC=C(C(CCCCl)(C#N)C(C)C)C=C1OC VDQLTWSIHIWIFQ-UHFFFAOYSA-N 0.000 description 1
- 229910016334 Bi—In Inorganic materials 0.000 description 1
- 229910000925 Cd alloy Inorganic materials 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910018978 Sn—In—Bi Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- CBPYOHALYYGNOE-UHFFFAOYSA-M potassium;3,5-dinitrobenzoate Chemical compound [K+].[O-]C(=O)C1=CC([N+]([O-])=O)=CC([N+]([O-])=O)=C1 CBPYOHALYYGNOE-UHFFFAOYSA-M 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H2037/768—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material characterised by the composition of the fusible material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
Landscapes
- Fuses (AREA)
Abstract
Description
【０００１】本発明は、作動温度が９５℃〜１０５℃の
合金型温度ヒュ−ズに関するものである。The present invention relates to an alloy type temperature fuse having an operating temperature of 95 ° C. to 105 ° C.
【０００２】合金型温度ヒュ−ズにおいては、フラック
スを塗布した低融点可溶合金片をヒュ−ズエレメントと
しており、保護すべき電気機器に取り付けて使用され
る。[0002] In an alloy type temperature fuse, a low melting point fusible alloy piece coated with a flux is used as a fuse element, and is used by being attached to an electric device to be protected.
【０００３】この場合、電気機器がその異常時に発熱す
ると、その発生熱により低融点可溶合金片が液相化さ
れ、その溶融金属がフラックスとの共存下、表面張力に
より球状化され、球状化の進行により分断されて機器へ
の通電が遮断される。[0003] In this case, when the electric equipment generates heat at the time of its abnormality, the heat generated thereby causes the low melting point fusible alloy piece to be in a liquid phase, and the molten metal is formed into a spherical shape by surface tension in the presence of a flux, thereby forming a spherical shape. And the power supply to the device is cut off.
【０００４】上記低融点可溶合金に要求される要件の一
つは、固相線と液相線との間の固液共存域が狭いことで
ある。すなわち、通常、合金においては、固相線と液相
線との間に固液共存域が存在し、この領域においては、
液相中に固相粒体が分散した状態にあり、液相様の性質
も備えているために、上記の球状化分断が発生する可能
性があり、従って、液相線温度（この温度をＴとする）
以前に固液共存域に属する温度範囲（ΔＴとする）で、
低融点可溶合金片が球状化分断される可能性がある。而
して、かかる低融点可溶合金片を用いた温度ヒュ−ズに
おいては、ヒュ−ズエレメント温度が（Ｔ−ΔＴ）〜Ｔ
となる温度範囲で動作するものとして取り扱わなければ
ならず、従って、ΔＴが小であるほど、すなわち、固液
共存域が狭いほど、温度ヒュ−ズの作動温度範囲のバラ
ツキを小として、温度ヒュ−ズを所定の設定温度で作動
させることができる。従って、温度ヒュ−ズのヒュ−ズ
エレメントとして使用される合金には、まず固液共存域
が狭いことが要求される。[0004] One of the requirements required for the low melting point fusible alloy is that the solid-liquid coexistence region between the solidus line and the liquidus line is narrow. That is, usually, in an alloy, a solid-liquid coexistence region exists between the solidus line and the liquidus line, and in this region,
Since the solid particles are dispersed in the liquid phase and have a liquid-like property, the above-mentioned spheroidization may occur. T)
Previously, in the temperature range belonging to the solid-liquid coexistence region (referred to as ΔT),
There is a possibility that the low-melting-point fusible alloy piece is spheroidized and divided. Thus, in the temperature fuse using the low melting point fusible alloy piece, the fuse element temperature is (T-ΔT) to T
Therefore, the smaller the ΔT, that is, the narrower the solid-liquid coexistence area, the smaller the variation in the operating temperature range of the temperature fuse, and the smaller the temperature fuse. Can be operated at a predetermined set temperature. Therefore, the alloy used as the fuse element of the temperature fuse must first have a narrow solid-liquid coexistence region.
【０００５】更に、近来、電子電気機器の小型化に伴
い、温度ヒュ−ズにおいても小型化が要求され、かかる
小型化に対処するために、例えば、３００μｍφという
細線加工性が要求される。Further, recently, with the miniaturization of electronic and electrical equipment, miniaturization of the temperature fuse is required, and in order to cope with such miniaturization, fine wire workability of, for example, 300 μmφ is required.
【０００６】[0006]
【発明が解決しようとする課題】近来、携帯電子機器の
普及に伴い、作動温度が９５℃〜１０５℃の合金型温度
ヒュ−ズの需用が多く、この合金型温度ヒュ−ズのヒュ
−ズエレメントとしては、固液共存域が１００℃前後
で、その領域の巾が温度ヒュ−ズの作動上許容できる範
囲、通常４℃以内にあることが要求され、かかる合金と
しては、９６℃共晶のＢｉ−Ｐｂ−Ｓｎ合金（Ｂｉ５２
重量％，Ｐｂ３２重量％，Ｓｎ１６重量％）や１０３℃
共晶のＢｉ−Ｓｎ−Ｃｄ合金（Ｂｉ５４重量％，Ｓｎ１
６重量％，Ｃｄ２０重量％）が用いられている。しかし
ながら、これらの合金においては、生態に有害なＰｂや
Ｃｄを含有しており、環境保全の面から改良が求められ
ている。In recent years, with the spread of portable electronic devices, there has been a great demand for an alloy-type temperature fuse having an operating temperature of 95 ° C. to 105 ° C. It is required that the solid-liquid coexistence region is around 100 ° C and the width of the region is within the allowable range for the operation of the temperature fuse, usually within 4 ° C. Bi-Pb-Sn alloy (Bi52
Wt%, Pb 32 wt%, Sn 16 wt%) or 103 ° C
Eutectic Bi-Sn-Cd alloy (54% by weight of Bi, Sn1
6% by weight, Cd 20% by weight). However, these alloys contain ecologically harmful Pb and Cd, and improvement is required from the viewpoint of environmental protection.
【０００７】従来、上記ＰｂやＣｄ等の有害金属を含有
しない合金型温度ヒュ−ズのヒュ−ズエレメントとし
て、Ｓｎ−Ｉｎ−Ｂｉの三元合金が知られているが、延
性が合金強度に比べて著しく大きいために、従来の合金
型温度ヒュ−ズに用いられている線径５００μｍφ以上
のヒュ−ズエレメントの加工は可能であっても、前記３
００μｍφといった細線化は難しい。Hitherto, a ternary alloy of Sn-In-Bi has been known as a fuse element of an alloy type temperature fuse which does not contain harmful metals such as Pb and Cd. Because of the remarkably large size, even though it is possible to process a fuse element having a wire diameter of 500 μmφ or more, which is used in a conventional alloy-type temperature fuse, the above-mentioned method can be used.
It is difficult to reduce the thickness to 00 μmφ.
【０００８】かかる現況下、本発明者において、Ｉｎ−
Ｓｎ−Ｂｉの三元合金をヒュ−ズエレメント組成とし、
作動温度が９５℃〜１０５℃の範囲で、ヒュ−ズエレメ
ント径をほぼ３００μｍφ程度に極細化し得、自己発熱
をよく抑えて正確に作動させ得る合金型温度ヒュ−ズを
開発すべく鋭意検討したところ、Ｓｎ４０〜４６重量
％、Ｂｉ７〜１２重量％、残部Ｉｎの合金組成によっ
て、その目的を達成できることを知った。Under these circumstances, the present inventor has proposed that In-
A fuse element composition of a ternary alloy of Sn-Bi,
In the operating temperature range of 95 ° C. to 105 ° C., the fuse element diameter can be extremely thinned to about 300 μm φ, and self-heating has been well suppressed. However, it has been found that the object can be achieved by the alloy composition of 40 to 46% by weight of Sn, 7 to 12% by weight of Bi, and the balance of In.
【０００９】本発明の目的は、かかる成果を基礎とし
て、作動温度が９５℃〜１０５℃の範囲で、環境保全の
要請を充足し、ヒュ−ズエレメント径をほぼ３００μｍ
φ程度に極細化し得、自己発熱をよく抑えて正確に作動
させ得る合金型温度ヒュ−ズを提供することにある。The object of the present invention is to provide a fuse element having an operating temperature in the range of 95 ° C. to 105 ° C. and a fuse element diameter of approximately 300 μm, based on the above results, in the range of 95 ° C. to 105 ° C.
It is an object of the present invention to provide an alloy-type temperature fuse which can be made extremely thin to about φ and can be operated accurately while suppressing self-heating.
【００１０】[0010]
【課題を解決するための手段】本発明の請求項１に係る
合金型温度ヒュ−ズは、低融点可溶合金をヒュ−ズエレ
メントとする温度ヒュ−ズにおいて、低融点可溶合金の
合金組成が、Ｓｎ４０〜４６重量％、Ｂｉ７〜１２重量
％、残部Ｉｎであることを特徴とする構成である。本発
明の請求項２に係る合金型温度ヒュ−ズは、低融点可溶
合金をヒュ−ズエレメントとする温度ヒュ−ズにおい
て、低融点可溶合金の合金組成が、Ｓｎ４０〜４６重量
％、Ｂｉ７〜１２重量％、残部Ｉｎの１００重量部にＡ
ｇが０．５〜３．５重量部添加された組成であることを
特徴とする構成であり、Ａｇの添加により、比抵抗を低
減できると共に動作温度を殆ど変えずに固液共存領域の
巾を狭めて作動温度のバラツキをより一層に抑制でき
る。According to a first aspect of the present invention, there is provided an alloy type temperature fuse having a low melting point fusible alloy as a fuse element. The composition is such that the composition is 40 to 46% by weight of Sn, 7 to 12% by weight of Bi, and the balance In. An alloy-type temperature fuse according to claim 2 of the present invention is a temperature fuse using a low-melting-point fusible alloy as a fuse element, wherein the alloy composition of the low-melting-point fusible alloy is 40 to 46% by weight of Sn, Bi is 7 to 12% by weight, and the balance is 100% by weight of In.
g is 0.5 to 3.5 parts by weight, wherein the addition of Ag can reduce the specific resistance and the width of the solid-liquid coexistence region without substantially changing the operating temperature. And the variation in operating temperature can be further suppressed.
【００１１】[0011]
【発明の実施の形態】本発明に係る合金型温度ヒュ−ズ
において、ヒュ−ズエレメントには、外径２００μｍφ
〜５００μｍφ、好ましくは２５０μｍφ〜３５０μｍ
φの円形線、または当該円形線と同一断面積の扁平線を
使用できる。BEST MODE FOR CARRYING OUT THE INVENTION In the alloy type temperature fuse according to the present invention, the fuse element has an outer diameter of 200 μmφ.
~ 500μmφ, preferably 250μmφ ~ 350μm
A circular line of φ or a flat line having the same cross-sectional area as the circular line can be used.
【００１２】このヒュ−ズエレメントの合金は、Ｓｎ４
０〜４６重量％、Ｂｉ７〜１２重量％、残部Ｉｎ、好ま
しくは、Ｓｎ４３〜４５重量％、Ｂｉ７〜９重量％、残
部Ｉｎあり、基準組成は、Ｓｎ４４．５重量％，Ｂｉ
７．４重量％，Ｉｎ４８．１重量％であり，その液相線
温度は１０２℃，固液共存域巾は４℃である。The alloy of the fuse element is Sn4
0 to 46% by weight, Bi 7 to 12% by weight, balance In, preferably Sn 43 to 45% by weight, Bi 7 to 9% by weight, balance In, and reference compositions are Sn 44.5% by weight, Bi
It is 7.4% by weight and In is 48.1% by weight. Its liquidus temperature is 102 ° C., and its solid-liquid coexistence area width is 4 ° C.
【００１３】前記Ｉｎ及びＳｎにより細線の線引きに必
要な充分な延性が与えられ、Ｂｉにより融点が１００℃
付近にされて、９８℃〜１０２℃の固液共存域に設定さ
れる。Ｂｉが７重量％未満では、強度が不足して３５０
μｍφという細線の線引きが困難となり、１２重量％を
越えると、脆弱となり、同細線の線引きが困難となる。
温度ヒュ−ズのヒュ−ズエレメントと機器との間には、
その間の熱抵抗のために約２℃の温度差が生じるから、
この基準組成を使用した温度ヒュ−ズの作動温度は１０
０℃〜１０４℃である。前記ヒュ−ズエレメントの抵抗
率は、ほぼ２０μΩ・ｃｍである。The above In and Sn provide sufficient ductility necessary for drawing a fine wire, and Bi has a melting point of 100 ° C.
The temperature is set at around 98 ° C. to 102 ° C. in the solid-liquid coexistence region. If Bi is less than 7% by weight, strength is insufficient and 350
It becomes difficult to draw a fine wire having a diameter of μmφ, and if it exceeds 12% by weight, the wire becomes brittle and it becomes difficult to draw the fine wire.
Between the fuse element of the temperature fuse and the device,
Because there is a temperature difference of about 2 ° C due to the thermal resistance during that,
The operating temperature of the temperature fuse using this reference composition is 10
0 ° C to 104 ° C. The fuse element has a resistivity of about 20 μΩ · cm.
【００１４】上記合金組成１００重量部にＡｇを０．５
〜３．５重量部添加することにより、抵抗率を前記より
も低くすることができ、例えば、３．５重量部添加する
ことにより、１０％程度低くできる。Ag is added to 100 parts by weight of the above alloy composition.
By adding 3.5 parts by weight, the resistivity can be made lower than the above. For example, by adding 3.5 parts by weight, the resistivity can be lowered by about 10%.
【００１５】本発明に係る温度ヒュ−ズのヒュ−ズエレ
メントは、合金母材の線引きにより製造され、断面丸形
のまま、または、さらに扁平に圧縮加工して使用でき
る。The fuse element of the temperature fuse according to the present invention is manufactured by drawing an alloy base material, and can be used as it is in a round cross section or in a flattened form.
【００１６】図１は、本発明に係るテ−プタイプの合金
型温度ヒュ−ズを示し、厚み１００〜３００μｍのプラ
スチックベ−スフィルム４１に厚み１００〜２００μｍ
の帯状リ−ド導体１，１を接着剤または融着により固着
し、帯状リ−ド導体間に線径２５０μｍφ〜５００μｍ
φのヒュ−ズエレメント２を接続し、このヒュ−ズエレ
メント２にフラツクス３を塗布し、このフラツクス塗布
ヒュ−ズエレメントを厚み１００〜３００μｍのプラス
チックカバ−フィルム４１の接着剤または融着による固
着で封止してある。FIG. 1 shows a tape-type alloy-type temperature fuse according to the present invention, wherein a plastic base film 41 having a thickness of 100 to 300 μm is formed on a plastic base film 41 having a thickness of 100 to 200 μm.
The band-shaped lead conductors 1, 1 are fixed by an adhesive or fusion bonding, and the wire diameter between the band-shaped lead conductors is 250 μmφ to 500 μm.
A fuse element 2 having a diameter φ is connected, a flux 3 is applied to the fuse element 2, and the flux-coated fuse element is fixed to a plastic cover film 41 having a thickness of 100 to 300 μm by an adhesive or fusion. Sealed with.
【００１７】本発明に係る合金型温度ヒュ−ズは、筒型
ケ−スタイプ、ケ−ス型ラジアルタイプ、基板タイプ、
樹脂モ−ルドラジアルタイプの形式で実施することもで
きる。図２は筒型ケ−スタイプを示し、一対のリ−ド線
１，１間に低融点可溶合金片２を接続し、該低融点可溶
合金片２上にフラックス３を塗布し、このフラックス塗
布低融点可溶合金片上に耐熱性・良熱伝導性の絶縁筒
４、例えば、セラミックス筒を挿通し、該絶縁筒４の各
端と各リ−ド線１との間を常温硬化の接着剤、例えば、
エポキシ樹脂で封止してある。The alloy type temperature fuse according to the present invention includes a cylindrical case type, a case radial type, a substrate type,
It can also be carried out in the form of a resin mold radial type. FIG. 2 shows a cylindrical case type, in which a low melting point fusible alloy piece 2 is connected between a pair of lead wires 1 and 1, and a flux 3 is applied on the low melting point fusible alloy piece 2. A heat-resistant and good-heat-conductive insulating tube 4, for example, a ceramic tube is inserted through the flux-coated low-melting-point fusible alloy piece, and the space between each end of the insulating tube 4 and each lead wire 1 is hardened at room temperature. Adhesive, for example
Sealed with epoxy resin.
【００１８】図３はケ−ス型ラジアルタイプを示し、並
行リ−ド導体１，１の先端部間にヒュ−ズエレメント２
を溶接により接合し、ヒュ−ズエレメント２にフラック
ス３を塗布し、このフラックス塗布ヒュ−ズエレメント
を一端開口の絶縁ケ−ス４、例えばセラミックスケ−ス
で包囲し、この絶縁ケ−ス４の開口をエポキシ樹脂等の
封止材５で封止してある。FIG. 3 shows a case-type radial type, in which a fuse element 2 is provided between the leading ends of parallel lead conductors 1 and 1.
Are welded, a flux 3 is applied to the fuse element 2, and the flux-coated fuse element is surrounded by an insulating case 4 having an opening at one end, for example, a ceramic case. Are sealed with a sealing material 5 such as an epoxy resin.
【００１９】図４は基板タイプを示し、絶縁基板４、例
えばセラミックス基板上に一対の膜電極１，１を導電ペ
−スト（例えば銀ペ−スト）の印刷焼付けにより形成
し、各電極１にリ−ド導体１１を溶接等により接続し、
電極１，１間にヒュ−ズエレメント２を溶接により接合
し、ヒュ−ズエレメント２にフラックス３を塗布し、こ
のフラックス塗布ヒュ−ズエレメントを封止材４例えば
エポキシ樹脂で封止してある。FIG. 4 shows a substrate type, in which a pair of film electrodes 1, 1 are formed on an insulating substrate 4, for example, a ceramic substrate, by printing and printing a conductive paste (for example, silver paste). The lead conductor 11 is connected by welding or the like,
A fuse element 2 is joined between the electrodes 1 and 1 by welding, a flux 3 is applied to the fuse element 2, and the flux-coated fuse element is sealed with a sealing material 4, for example, an epoxy resin. .
【００２０】図５は樹脂モ−ルドラジアルタイプを示
し、並行リ−ド導体１，１の先端部間にヒュ−ズエレメ
ント２を溶接により接合し、ヒュ−ズエレメント２にフ
ラックス３を塗布し、このフラックス塗布ヒュ−ズエレ
メントを樹脂液ディッピングにより樹脂モ−ルド５して
ある。FIG. 5 shows a resin mold radial type, in which a fuse element 2 is welded between the ends of the parallel lead conductors 1 and 1 and a flux 3 is applied to the fuse element 2. The flux-coated fuse element is resin-molded 5 by dipping the resin liquid.
【００２１】また、通電式発熱体付きヒュ−ズ、例え
ば、基板タイプの合金型温度ヒュ−ズの絶縁基板に抵抗
体（膜抵抗）を付設し、機器の異常時、抵抗体を通電発
熱させ、その発生熱で低融点可溶合金片を溶断させる抵
抗付きの基板型ヒュ−ズの形式で実施することもでき
る。Further, a resistor (film resistance) is provided on an insulating substrate of a current-carrying type heating element, for example, an insulating substrate of a board-type alloy type temperature fuse. Alternatively, the present invention can also be implemented in the form of a substrate-type fuse with a resistor for fusing the low-melting-point fusible alloy piece with the generated heat.
【００２２】上記のフラックスには、通常、融点がヒュ
−ズエレメントの融点よりも低いものが使用され、例え
ば、ロジン９０〜６０重量部、ステアリン酸１０〜４０
重量部、活性剤０〜３重量部を使用できる。この場合、
ロジンには、天然ロジン、変性ロジン（例えば、水添ロ
ジン、不均化ロジン、重合ロジン）またはこれらの精製
ロジンを使用でき、活性剤には、ジエチルアミンの塩酸
塩や臭化水素酸塩等を使用できる。As the above flux, a flux whose melting point is lower than that of the fuse element is usually used. For example, 90 to 60 parts by weight of rosin, 10 to 40 parts of stearic acid.
Parts by weight, 0 to 3 parts by weight of activator can be used. in this case,
As the rosin, natural rosin, modified rosin (for example, hydrogenated rosin, disproportionated rosin, polymerized rosin) or these purified rosins can be used. As the activator, diethylamine hydrochloride, hydrobromide, or the like can be used. Can be used.
【００２３】[0023]
【実施例】〔実施例１〕Ｉｎ４８．１重量％，Ｓｎ４
４．５重量％，Ｉｎ７．４重量％の合金組成の母材を線
引きして直径３００μｍφの線に加工した。１ダイスに
ついての引落率を６．５％とし、線引き速度を４５ｍ／
ｍｉｎとしたが、断線は皆無であった。この線の抵抗率
を測定したところ、２３μΩ・ｃｍであった。この線を
長さ４ｍｍに切断してヒュ−ズエレメントとし、テ-プ
タイプの温度ヒュ−ズを作成した。フラックスには、ロ
ジン８０重量部，ステアリン酸２０重量部，ジエチルア
ミン臭化水素酸塩１重量部の組成物を使用し、プラスチ
ックベ−スフィルム及びプラスチックカバ−フィルムに
は厚み２００μｍのホリエチレンテレフタレ−トフィル
ムを使用した。Example 1 Example 48.1% by weight of In, Sn4
A base material having an alloy composition of 4.5% by weight and In 7.4% by weight was drawn and processed into a wire having a diameter of 300 μmφ. The drop rate per die was 6.5%, and the drawing speed was 45 m /
min, but there was no disconnection. When the resistivity of this wire was measured, it was 23 μΩ · cm. This wire was cut into a length of 4 mm to form a fuse element, and a tape type temperature fuse was prepared. A composition comprising 80 parts by weight of rosin, 20 parts by weight of stearic acid, and 1 part by weight of diethylamine hydrobromide is used for the flux, and 200 μm thick polyethylene terephthalate is used for the plastic base film and the plastic cover film. -Film was used.
【００２４】この実施例品５０箇を、０．１アンペアの
電流を通電しつつ、昇温速度１℃／分のオイルバスに浸
漬し、溶断による通電遮断時のオイル温度を測定したと
ころ、１０２℃±１℃の範囲内であった。また、上記し
た合金組成の範囲内であれば、動作温度を１００℃を中
心として±５℃の範囲内に納めることができた。Fifty samples of this example were immersed in an oil bath at a rate of temperature increase of 1 ° C./min while applying a current of 0.1 amperes. The temperature was within the range of ± 1 ° C. Further, within the above-mentioned range of the alloy composition, the operating temperature could be kept within a range of ± 5 ° C around 100 ° C.
【００２５】なお、Ｂｉを６重量％以下及び１３重量％
以上にして直径３００μｍφの線引きを試みたが、延性
が大きすぎたり、乏しかったりして、至難であった。In addition, Bi is not more than 6% by weight and 13% by weight.
An attempt was made to draw a wire having a diameter of 300 μmφ as described above, but it was difficult because the ductility was too large or poor.
【００２６】〔実施例２〕Ｉｎ４６．５重量％，Ｓｎ４
３．０重量％，Ｂｉ７．１重量％，Ａｇ３．４重量％の
合金組成の母材を線引きして直径３００μｍφの線に加
工した。１ダイスについての引落率を６．５％とし、線
引き速度を４５ｍ／ｍｉｎとしたが、断線は皆無であっ
た。この線の抵抗率を測定したところ、２０μΩ・ｃｍ
であった。この線を長さ４ｍｍに切断してヒュ−ズエレ
メントとし、実施例１と同様のテ−プタイプの温度ヒュ
−ズを作成した。Example 2 46.5% by weight of In, Sn4
A base material having an alloy composition of 3.0% by weight, Bi 7.1% by weight, and Ag 3.4% by weight was drawn and processed into a wire having a diameter of 300 μmφ. The drop rate for one die was 6.5%, and the drawing speed was 45 m / min, but there was no disconnection. When the resistivity of this wire was measured, it was 20 μΩ · cm
Met. This wire was cut into a length of 4 mm to form a fuse element, and a tape type temperature fuse similar to that of Example 1 was prepared.
【００２７】この実施例品５０箇を、０．１アンペアの
電流を通電しつつ、昇温速度１℃／分のオイルバスに浸
漬し、溶断による通電遮断時のオイル温度を測定したと
ころ、１０１℃±１℃の範囲内であった。また、上記し
た合金組成の範囲内であれば、動作温度を１００℃を中
心として±４℃の範囲内に納めることができた。Fifty samples of this example were immersed in an oil bath at a temperature increasing rate of 1 ° C./min while applying a current of 0.1 amperes. The temperature was within the range of ± 1 ° C. Further, within the above-mentioned range of the alloy composition, the operating temperature could be kept within a range of ± 4 ° C around 100 ° C.
【００２８】[0028]
【発明の効果】本発明によれば、生態に影響のないＳｎ
−Ｂｉ−Ｉｎ系の低融点可溶合金母材の能率のよい線引
きで３００μｍφクラスの極細線ヒュ−ズエレメントを
製造し、このヒュ−ズエレメントを用いて動作温度が９
５℃〜１０５℃で、かつ自己発熱による作動誤差を充分
に防止できる合金型温度ヒュ−ズを得ることができる。According to the present invention, Sn which does not affect the ecology can be obtained.
An ultrafine fuse element of 300 μmφ class is manufactured by efficient drawing of a Bi-In based low melting point fusible alloy base material, and an operating temperature of 9 mm is produced by using this fuse element.
It is possible to obtain an alloy-type temperature fuse at 5 ° C. to 105 ° C. and capable of sufficiently preventing an operation error due to self-heating.
【図１】本発明に係る合金型温度ヒュ−ズの一例を示す
図面である。FIG. 1 is a drawing showing an example of an alloy type temperature fuse according to the present invention.
【図２】本発明に係る合金型温度ヒュ−ズの上記とは別
の例を示す図面である。FIG. 2 is a drawing showing another example of the alloy type temperature fuse according to the present invention.
【図３】本発明に係る合金型温度ヒュ−ズの上記とは別
の例を示す図面である。FIG. 3 is a drawing showing another example of the alloy type temperature fuse according to the present invention.
【図４】本発明に係る合金型温度ヒュ−ズの上記とは別
の例を示す図面である。FIG. 4 is a drawing showing another example of the alloy type temperature fuse according to the present invention.
【図５】本発明に係る合金型温度ヒュ−ズの上記とは別
の例を示す図面である。FIG. 5 is a drawing showing another example of the alloy type temperature fuse according to the present invention.
２ ヒュ−ズエレメント 2 fuse element
Claims (2)
る温度ヒュ−ズにおいて、低融点可溶合金の合金組成
が、Ｓｎ４０〜４６重量％、Ｂｉ７〜１２重量％、残部
Ｉｎであることを特徴とする合金型温度ヒュ−ズ。1. A temperature fuse using a low melting point fusible alloy as a fuse element, wherein the alloy composition of the low melting point fusible alloy is 40 to 46% by weight of Sn, 7 to 12% by weight of Bi, and the balance In. An alloy type temperature fuse characterized by the following.
る温度ヒュ−ズにおいて、低融点可溶合金の合金組成
が、Ｓｎ４０〜４６重量％、Ｂｉ７〜１２重量％、残部
Ｉｎの１００重量部にＡｇが０．５〜３．５重量部添加
された組成であることを特徴とする合金型温度ヒュ−
ズ。2. A temperature fuse using a low melting point fusible alloy as a fuse element, wherein the alloy composition of the low melting point fusible alloy is 40 to 46% by weight of Sn, 7 to 12% by weight of Bi, and the balance of In is 100% by weight. Wherein the composition has 0.5 to 3.5 parts by weight of Ag added thereto.
Z.
Priority Applications (1)
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|---|---|---|---|
| JP2000081924A JP3841257B2 (en) | 2000-03-23 | 2000-03-23 | Alloy type temperature fuse |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000081924A JP3841257B2 (en) | 2000-03-23 | 2000-03-23 | Alloy type temperature fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001266724A true JP2001266724A (en) | 2001-09-28 |
| JP3841257B2 JP3841257B2 (en) | 2006-11-01 |
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ID=18598792
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000081924A Expired - Fee Related JP3841257B2 (en) | 2000-03-23 | 2000-03-23 | Alloy type temperature fuse |
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| EP1383149A3 (en) * | 2002-07-16 | 2004-01-28 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and wire member for a thermal fuse element |
| EP1424712A1 (en) * | 2002-11-26 | 2004-06-02 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and material for a thermal fuse element |
| EP1424711A1 (en) * | 2002-11-26 | 2004-06-02 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and material for a thermal fuse element |
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| US7064648B2 (en) | 2003-03-04 | 2006-06-20 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and material for a thermal fuse element |
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| US6774761B2 (en) | 2002-03-06 | 2004-08-10 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element thereof |
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| CN100349242C (en) * | 2002-11-26 | 2007-11-14 | 内桥艾斯泰克股份有限公司 | Alloy type thermal fuse and material for thermal fuse element |
| CN100349241C (en) * | 2002-11-26 | 2007-11-14 | 内桥艾斯泰克股份有限公司 | Alloy type thermal fuse and material for thermal fuse element |
| US7142088B2 (en) | 2002-11-26 | 2006-11-28 | Uchibashi Estec Co., Ltd. | Alloy type thermal fuse and material for a thermal fuse element |
| EP1424713A1 (en) * | 2002-11-26 | 2004-06-02 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and material for a thermal fuse element |
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| CN100376704C (en) * | 2003-05-29 | 2008-03-26 | 松下电器产业株式会社 | Components for thermal fuses, thermal fuses, and batteries using thermal fuses |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| LAPS | Cancellation because of no payment of annual fees |