JP2001264724A - Production control method, display device and plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a design burden and process burden generated in the case of attaching identifying marks by reducing the number of identifying marks in the production line of a sheet substrate before separating a panel substrate in a production control method of electronic device production in which the panel substrate is separated from the sheet substrate provided with a single or multiple panel substrate parts in a prescribed area, to simplify reader equipment in the production line, and to realize shortening of the reading time and simplification of a reading operation. SOLUTION: A sheet ID identifying mark is firstly attached on a sheet substrate (F1, B1), and after passing through processes (F2-F7, B2-B7), a panel ID identifying mark is attached on a panel substrate. Furthermore, a panel substrate before separation is controlled by identifying the panel substrate by a sheet ID read by a sheet ID identifying mark and the positional information of the panel substrate on a sheet substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a production management method for electronic device production for separating a panel substrate from a sheet substrate provided with a single or plural panel substrate portions in a predetermined area.

[0002]

2. Description of the Related Art A production system in which one or a plurality of panel substrates are separated from a sheet substrate having a predetermined area in a predetermined area during the production process is advantageous in terms of production efficiency. Have been. Conventionally, there are a printed circuit board and a panel-type display device as electronic devices that can adopt this production system. Here, a panel type display device includes a plasma display panel (PD).
P: Plasma Display Panel and liquid crystal display (LCD: Liqui
d Crystal Display) panel. In the production of these electronic devices, the area of the relatively small panel substrate used as a product on a relatively large sheet substrate is determined, and the wiring electrode layer, insulating layer, etc. Efficient production by forming patterns. The panel substrate section is cut and separated at a certain stage until commercialization, and each constitutes an individual product. On the other hand, portions other than the panel substrate portion on the sheet substrate are finally discarded. However, this waste section is effectively used at various stages of the production process. For example, if there is a discarded portion, the product portion can be processed by supporting the entire sheet substrate without touching the product portion by supporting the discarded portion. Further, the discarding unit may be used as a transport jig. On a panel substrate portion which is a product on a sheet substrate, precise processing is performed at a high density according to the type of an electronic device, and in most cases, in a laminated manner. On the other hand, this is not the case in the discarded portion, and only the alignment marker and the number of the sheet substrate are formed.

Conventionally, when managing each product in the production management of an electronic device, a panel I corresponding to each panel substrate is used.
There has been a production management method in which D is set, and information about processing conditions, inspection items, and the like generated in each production process is accumulated with the panel ID as an axis. At that time, an identification mark of some form in which an ID such as a barcode is recorded is provided on the substrate. As an example of such a conventional technique, Japanese Patent Application Laid-Open No. H11-119204 discloses a technique of attaching a barcode as an ID identification mark to a discarded portion on a sheet substrate and each panel substrate. Also, JP-A-11-11
No. 9204 discloses a technique for determining the attachment position of an identification mark such that the identification mark attached to the substrate passes through the reading range of a reading device installed at a fixed position on the transport path even if the size of the substrate is different. It has been disclosed. This technique has been used to some extent to simplify the reading device equipment in the production line.

[0004]

However, even the technique disclosed in Japanese Patent Application Laid-Open No. H11-119204 has the following problem. That is, even before the panel substrate is separated, the identification mark on which the sheet ID is recorded must be attached to the sheet substrate, and the identification mark on which the panel ID has been recorded must be attached to each panel substrate. Therefore, there is a problem that the number of identification marks on the sheet substrate increases, which increases the area occupied by the identification marks, and makes it difficult to attach the identification marks. Also, since it is extremely difficult to attach an identification mark at a predetermined position in design before forming an alignment marker,
There has been a problem that the process of forming the alignment marker and the process preceding it cannot be managed based on the ID. Further, even before the panel substrates are separated, in order to identify all the panel substrates on the sheet substrate, it is necessary to read the identification marks as many times as the number of the panel substrates on the sheet substrate. Therefore, there is a problem that it takes time to read the identification mark. Even if the number of reading devices is increased to shorten the reading time and a plurality of identification marks can be read simultaneously,
This is against the simplification of the reading device equipment in the production line.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems in the prior art, and is directed to a production management method for production of electronic devices for separating a panel substrate from a sheet substrate provided with one or more panel substrate portions in a predetermined area. In the above, the number of identification marks in the production line of the sheet substrate before the separation of the panel substrate is reduced, thereby reducing the design burden and the process burden caused in attaching the identification mark, and simplifying the reading device equipment in the production line,
Another object is to shorten the reading time and simplify the reading operation. It is another object of the present invention to manage all processes from supplying a sheet substrate to a production line to shipping a product with a consistent ID.

[0006]

According to a first aspect of the present invention, there is provided a production management method for electronic device production for separating a panel substrate from a sheet substrate having a single panel substrate portion in a predetermined area. Management of sheet substrates
The sheet substrate is identified by reading the sheet ID from the sheet ID identification mark attached to the portion of the sheet substrate other than the panel substrate portion, and the management of the panel substrate before separating the panel substrate is performed by reading from the sheet ID identification mark. The panel substrate is identified by the obtained sheet ID, and management of the panel substrate after the panel substrate is separated is performed by identifying the panel substrate by reading the panel ID from the panel ID identification mark attached to the panel substrate. It is a production management method.

Therefore, according to the production management method of the first invention of the present application, the management of the panel substrate before the separation of the panel substrate is as follows.
Since the panel substrate is identified by the sheet ID read from the sheet ID identification mark, the sheet ID identification mark is only attached to a portion of the sheet substrate other than the panel substrate portion, that is, a discarded portion.
There is an advantage that it is not necessary to attach an identification mark to the panel substrate. As a result, it is possible to reduce the design load and the process load generated when attaching the identification mark, and to simplify the reading device equipment in the production line, shorten the reading time, and simplify the reading operation. is there. As a result, there is an advantage that the cost of the reading device equipment is reduced and the adjustment and maintenance thereof are simplified. Further, since the discarded portion has much more room than the panel substrate portion as a product, it is possible to attach a sheet ID identification mark before forming the alignment marker. Therefore, according to the production management method of the first invention of the present application, the step of forming an alignment marker and the preceding step can be managed based on the ID, and the product is shipped after the sheet substrate is put into the production line. There is an advantage that it is possible to manage all the processes up to the process with a consistent ID.

[0008] The panel substrate includes a printed wiring board used for all electronic and electrical equipment, a film carrier used for a semiconductor device, a lead carrier, and a P.C.
A glass substrate used on the front and back of a DP or LCD panel corresponds to this.

A second invention of the present application is directed to a production management method of electronic device production for separating a panel substrate from a sheet substrate having a plurality of panel substrate portions in a predetermined area.
The management of the sheet substrate is performed by using the sheet I attached to the sheet substrate.
The identification of the sheet substrate is performed by reading the sheet ID from the D identification mark, and the management of the panel substrate before separation of the panel substrate is performed by the sheet ID read from the sheet ID identification mark and the position information of the panel substrate on the sheet substrate. The production management method is characterized in that a panel substrate is identified by using the method.

Therefore, according to the production management method of the second invention of the present application, the management of the panel substrate before separating the panel substrate is as follows.
Since the panel substrate is identified by the sheet ID read from the sheet ID identification mark and the position information of the panel substrate on the sheet substrate, the identification is performed only by attaching the sheet ID identification mark to the sheet substrate. There is an advantage that it is not necessary to attach an ID identification mark to the panel substrate. This reduces the design burden and process burden that occur when attaching identification marks,
There is an advantage that the reading device equipment in the production line can be simplified, the reading time can be reduced, and the reading operation can be simplified. As a result, there is an advantage that the cost of the reading device equipment is reduced and the adjustment and maintenance thereof are simplified. This position information is information for specifying one panel substrate from among a plurality of panel substrates on the sheet substrate. For example, if a plurality of panel substrates are arranged in a matrix on a sheet substrate, the content of the position information may be a fixed reference such as the transport direction and the matrix number of each panel substrate. When the management of the panel substrate is necessary after the separation of the panel substrate, the management of the panel substrate after the separation of the panel substrate is performed by identifying the panel substrate by reading the panel ID from the panel ID identification mark attached to the panel substrate. . In that case, it is preferable to attach the panel ID identification mark before separating the panel substrate. This is because the positional integrity of each panel substrate is lost after separation, and it becomes more difficult to reliably attach a panel ID identification mark to the panel substrate corresponding to the panel ID as compared to before the separation.

The third invention of the present application is directed to a production management method for producing a display device, wherein the panel substrate is separated from a sheet substrate having a single panel substrate portion in a predetermined area.
The management of the sheet substrate is performed based on the sheet ID identification mark attached to a portion of the sheet substrate other than the panel substrate portion.
The management of the panel substrate before the separation of the panel substrate is performed by identifying the panel substrate by the sheet ID read from the sheet ID identification mark, and the management of the panel substrate before the separation of the panel substrate is performed. The management is a production management method characterized by identifying a panel substrate by reading a panel ID from a panel ID identification mark attached to the panel substrate.

Therefore, according to the production management method of the third invention of the present application, the management of the panel substrate before separation of the panel substrate is as follows.
Since the panel substrate is identified by the sheet ID read from the sheet ID identification mark, the sheet ID identification mark is only attached to a portion of the sheet substrate other than the panel substrate portion, that is, a discarded portion.
There is an advantage that it is not necessary to attach an identification mark to the panel substrate. As a result, it is possible to reduce the design load and the process load generated when attaching the identification mark, and to simplify the reading device equipment in the production line, shorten the reading time, and simplify the reading operation. is there. As a result, there is an advantage that the cost of the reading device equipment is reduced and the adjustment and maintenance thereof are simplified. Further, since the discarded portion has much more room than the panel substrate portion as a product, it is possible to attach a sheet ID identification mark before forming the alignment marker. Therefore, according to the production management method of the third invention of the present application, the process of forming the alignment marker and the process before the alignment marker can be managed based on the ID, and the product is shipped after the sheet substrate is put into the production line. There is an advantage that it is possible to manage all the processes up to the process with a consistent ID. The panel substrate corresponds to a glass substrate used in front and back of a PDP or LCD panel.

According to a fourth aspect of the present invention, there is provided a production management method for producing a display device for separating a panel substrate from a sheet substrate having a plurality of panel substrate portions in a predetermined area.
The management of the sheet substrate is performed by using the sheet I attached to the sheet substrate.
The identification of the sheet substrate is performed by reading the sheet ID from the D identification mark, and the management of the panel substrate before separation of the panel substrate is performed by the sheet ID read from the sheet ID identification mark and the position information of the panel substrate on the sheet substrate. The panel substrate is identified by the method described above, and the management of the panel substrate after the panel substrate is separated is performed by identifying the panel substrate by reading the panel ID from the panel ID identification mark attached to the panel substrate. It is a management method.

Therefore, according to the production management method of the fourth invention of the present application, the management of the panel substrate before separation of the panel substrate is as follows.
Since the panel substrate is identified by the sheet ID read from the sheet ID identification mark and the position information of the panel substrate on the sheet substrate, the identification is performed only by attaching the sheet ID identification mark to the sheet substrate. There is an advantage that it is not necessary to attach an ID identification mark to the panel substrate. This reduces the design burden and process burden that occur when attaching identification marks,
There is an advantage that the reading device equipment in the production line can be simplified, the reading time can be reduced, and the reading operation can be simplified. As a result, there is an advantage that the cost of the reading device equipment is reduced and the adjustment and maintenance thereof are simplified.

According to a fifth aspect of the present invention, a front panel substrate is separated from a sheet substrate provided with a single front panel substrate portion in a predetermined area, and a rear panel substrate is provided from a sheet substrate provided with a single rear panel substrate portion in a predetermined region. In a production management method for display device production in which a front panel substrate and a rear panel are bonded together to form a display panel, the management of the sheet substrate is performed by identifying a sheet ID attached to a portion of the sheet substrate other than the panel substrate portion. The sheet ID is read from the mark to identify the sheet substrate, and the management of the panel substrate before separation of the front panel substrate is performed by identifying the panel substrate by the sheet ID read from the sheet ID identification mark. Management of the panel substrate after separation is performed by reading the panel ID from the panel ID identification mark attached to the panel substrate. In this manner, the panel substrate is identified, and the management of the panel substrate before separation of the rear panel substrate is performed by identifying the panel substrate by the sheet ID read from the sheet ID identification mark, and the management of the panel substrate after the separation of the rear panel substrate. The management is performed by the panel I attached to the panel board.
The panel substrate is identified by reading the panel ID from the D identification mark, and the display panel is managed based on the panel ID identification mark attached to the front panel substrate or the panel ID identification mark attached to the rear panel substrate.
A production management method characterized by identifying a display panel by reading D.

Therefore, according to the production management method of the fifth invention of the present application, there are the same advantages as the third invention of the present application. In the production management method according to the fifth aspect of the present invention, the display panel is managed by reading a panel ID from a panel ID identification mark attached to a front panel substrate or a panel ID identification mark attached to a rear panel substrate. The display panel is identified efficiently.

According to a sixth aspect of the present invention, a front panel substrate is separated from a sheet substrate provided with a plurality of front panel substrate portions in a predetermined region, and the rear panel substrate is separated from a sheet substrate provided with a plurality of rear panel substrate portions in a predetermined region. In the production management method of display device production in which the front panel substrate and the rear panel are bonded together to form a display panel, the management of the sheet substrate is performed by reading the sheet ID from the sheet ID identification mark attached to the sheet substrate. The front panel board is managed by identifying the front panel board based on the sheet ID read from the sheet ID identification mark and the position information of the front panel board on the sheet board. The management of the front panel board after the separation of the front panel board is performed by the control attached to the front panel board. The front panel substrate is identified by reading the panel ID from the file ID identification mark, and the back panel substrate before separation of the rear panel substrate is managed by the sheet ID read from the sheet ID identification mark and the back panel on the sheet substrate. The rear panel substrate is identified by the position information of the substrate, and the rear panel substrate is separated from the rear panel substrate, and the rear panel substrate is managed by reading the panel ID from the panel ID identification mark attached to the rear panel substrate. The display panel is managed by identifying the display panel by reading the panel ID from the panel ID identification mark attached to the front panel substrate or the panel ID identification mark attached to the rear panel substrate. This is a characteristic production management method.

According to the production management method of the sixth aspect of the present invention, there are the same advantages as the fourth aspect of the present invention. The production management method according to the sixth aspect of the present invention provides a method for managing a display panel.
The display panel is efficiently identified by reading the panel ID from the panel ID identification mark attached to the front panel substrate or the panel ID identification mark attached to the rear panel substrate.

According to a seventh aspect of the present invention, in the production management method according to any one of the first to sixth aspects of the present invention, the management of the panel substrate before separation of the panel substrate is as follows. A panel substrate is identified based on the sheet ID read from the sheet ID identification mark and the position information of the panel substrate on the sheet substrate, and the panel ID is set and performed.

Therefore, according to the production management method of the seventh invention of the present application, since the panel ID is set and the panel substrate is managed before the panel substrate is separated, the production of the panel substrate is managed with a consistent panel ID. There is an advantage that can be.

According to an eighth invention of the present application, in the production management method according to any one of the first invention to the sixth invention of the present application, the sheet ID identification is performed on an unprocessed sheet substrate. After attaching the mark, a cleaning step and a processing step are performed.

Therefore, according to the production management method of the eighth invention of the present application, the cleaning step and the processing step are performed after the sheet ID identification mark is attached to the unprocessed sheet substrate. There is an advantage that all the production processes performed on the electronic device (including the display device), including the cleaning process performed first and the subsequent processing process, can be consistently managed by the ID.

The ninth invention of the present application relates to a production management method according to any one of the first invention to the sixth invention of the present application, wherein
After attaching the sheet ID identification mark to the unprocessed sheet substrate, a cleaning step and an electrode forming step are performed.

Therefore, according to the production management method of the ninth invention of the present application, the cleaning process and the electrode forming process are performed after the sheet ID identification mark is attached to the unprocessed sheet substrate, so that the unprocessed substrate is There is an advantage that all the production processes performed on the display device, including the cleaning process performed first and the subsequent electrode forming process, can be consistently managed by the ID. The front panel substrate is a substrate arranged on the side on which the display surface is formed. This electrode forming step for a front panel substrate of a PDP refers to a transparent electrode forming step, and the electrode forming step for a rear panel substrate of a PDP refers to a data electrode forming step. In addition, TFT-L
This electrode forming step for a front panel substrate of a CD refers to a transparent electrode forming step, and the electrode forming step for a rear panel substrate of a TFT-LCD refers to a gate electrode forming step or a transparent electrode forming step. In a color LCD, a colored layer (color filter layer) having a predetermined pattern is formed before a transparent electrode is formed on a front panel substrate. According to the ninth invention of the present application, a sheet ID identification mark is attached to an unprocessed sheet substrate before these steps, including not only a step of applying a pattern to a substrate and other processing steps but also a cleaning step. Things.

According to a tenth invention of the present application, in the production management method according to any one of the first invention to the sixth invention of the present application, the panel ID identification mark is attached to the panel substrate portion. Then, a step of cutting the panel substrate is performed.

Therefore, according to the production management method of the tenth aspect of the present invention, a panel ID identification mark is attached to the panel substrate portion, and then a panel substrate cutting step is performed.
That is, a panel ID identification mark is attached to the panel substrate immediately before panel separation. This is best for maximizing the management by the sheet ID identification mark and the position information before separating the panel substrate, and avoiding the complexity and uncertainty of attaching the panel ID identification mark to the separated panel substrate. At the timing of attachment.

According to an eleventh invention of the present application, in the production management method according to any one of the first invention to the sixth invention of the present application, a sheet ID identification mark is provided on a panel substrate on a sheet substrate. It is characterized in that it is attached to parts other than the part.

Since the portion other than the panel substrate portion on the sheet substrate, that is, the discarded portion has much more room than the panel substrate portion as a product, it is possible to attach a sheet ID identification mark before forming the alignment marker. is there. Therefore, according to the production management method of the eleventh invention of the present application, the step of forming the alignment marker and the preceding step can be managed based on the ID, and the product is shipped after the sheet substrate is put into the production line. There is an advantage that it is possible to manage all the processes up to the process with a consistent ID.

A twelfth invention of the present application is the production control method according to any one of the first invention to the sixth invention of the present application, wherein the alignment marker on the sheet substrate is a sheet ID identification mark. It is characterized in that a sheet ID identification mark is attached to an area that does not interfere with reading.

Here, the alignment marker is sheet I
The area that does not interfere with the reading of the D identification mark is an area that is far from the alignment marker so that a reading device such as a barcode reader or a CCD does not cause a reading error of the sheet ID identification mark due to the shadow of the alignment marker. If the alignment marker overlaps the sheet ID identification mark in the reading direction, the sheet I
This is because the signal represented by the D identification mark may not be accurately read, and even if the signal does not overlap, the signal may not be accurately read because the alignment marker is too close to the sheet ID identification mark. Therefore, according to the production management method of the tenth aspect of the present invention, the sheet ID identification mark is attached to an area where the alignment marker on the sheet substrate does not interfere with the reading of the sheet ID identification mark. Can be performed well.

According to a thirteenth invention of the present application, in the production management method according to any one of the first invention to the sixth invention of the present application, the wiring and the alignment marker on the panel substrate are arranged on the panel. The panel ID identification mark is attached to an area that does not interfere with the reading of the ID identification mark.

On the panel substrate, there are not only alignment markers but also wirings that affect reading. However, according to the production management method of the thirteenth invention of the present application, the panel ID identification mark is attached to an area where the wiring and the alignment marker on the panel substrate do not interfere with the reading of the panel ID identification mark. Reading can be performed well. Here, in the case of a display device, the wiring and the alignment marker on the panel substrate are formed not only on the same substrate as the panel substrate provided with the panel ID identification mark but also on the opposing substrate. Including.

According to a fourteenth aspect of the present invention, there is provided the production management method according to any one of the first to sixth aspects of the present invention, wherein the sheet ID identification mark and the panel ID identification mark are provided. The process is performed by attaching to a non-processed surface of a substrate.

Here, the non-processed surface refers to a surface which has not been subjected to any processing such as attachment of other components to the substrate or removal or deformation of a part of the substrate. In an electronic device, processing for attaching a wiring electrode layer or an insulating layer, processing for forming a hole in a substrate, or the like may be performed. If an identification mark is attached to a processing surface on which such processing is performed, there is a possibility that such processing may be adversely affected, and the identification mark itself may become unreadable due to such processing. However, according to the production management method of the fourteenth invention of the present application, the sheet ID identification mark and the panel ID identification mark are provided on the non-processed surface of the substrate, so that the processing on the substrate is not adversely affected, and There is an advantage that information recording reliability is not impaired.

According to a fifteenth invention of the present application, in the production management method according to any one of the first invention to the sixth invention of the present application, the sheet ID identification mark is formed by a metal deposition film. It is characterized by performing.

As a method of forming an identification mark, there is a laser direct writing method in which laser processing is performed on a substrate, but in the laser direct writing method, a mark is formed by grinding the substrate, so that the contrast is extremely intense. No. On the other hand, when the metal deposition film is formed by patterning, the contrast is improved. Therefore, according to the production management method of the fifteenth invention of the present application, since the sheet ID identification mark is formed by a metal deposition film, the sheet I
There is an advantage that the contrast of the D identification mark is improved, and the D identification mark can be read by an inexpensive reading device having relatively low reading ability.

According to a sixteenth aspect of the present invention, in the production management method according to any one of the first to sixth aspects of the present invention, the panel ID identification mark is replaced with a heat-resistant label. It is characterized by doing.

It is necessary to set the heat-resistant temperature of the heat-resistant label to be equal to or higher than the maximum temperature in a heating step performed after the panel ID identification mark is attached. For example, in the production of a PDP, when sealing the front panel substrate and the rear panel substrate, heating is performed at 400 ° C. to 500 ° C. to fuse the frit seal glass to the substrate. As the heat-resistant label, a ceramic label is preferably used. Ceramic labels having a maximum use temperature of about 500 ° C. to 1400 ° C. are commercially available. Thus, according to the production management method, since the panel ID identification mark is a heat-resistant label, there is an advantage that the function of the panel ID identification mark can be well read without loss of the function of the panel ID mark even after the heating step.

According to a seventeenth aspect of the present invention, in the production management method according to any one of the first to sixth aspects of the present invention, an FPC is provided on an electrode terminal at an end of a display panel. In managing the display device production including an FPC connection step of arranging and pressing the end portion and the FPC with a pressure bonding head of a pressure bonding device, a panel ID identification mark provided in a convex shape with respect to the surface of the panel substrate is employed. The panel ID identification mark is provided outside a range where the pressure bonding head comes into contact with the display panel during the pressure bonding operation. Note that FPC stands for Flexible Printed cir
Abbreviation for cuit (flexible printed circuit).

If a panel ID identification mark is provided in a range where the pressure bonding head comes into contact with the display panel during the pressure bonding operation, the pressure bonding head may be tilted due to the thickness of the identification mark, and the FPC may not be sufficiently pressed. For example, since a ceramic label has a thickness of about 20 μm, if a panel ID identification mark is provided in a range where the pressure bonding head contacts the display panel during the pressure bonding operation, the FPC may not be sufficiently pressed. However, according to the production management method of the seventeenth aspect of the present invention, since the panel ID identification mark is attached outside the range where the pressure bonding head comes into contact with the display panel during the pressure bonding operation, the panel ID identification mark acts on the inclination of the pressure bonding head. In this case, there is an advantage that the pressure-bonding failure of the FPC caused by the thickness of the panel ID identification mark can be prevented.

The position where the panel ID identification mark is attached may be specifically set as follows. That is, in the front panel substrate constituting the display device, it is preferable that the corners be the positions where the panel ID identification marks are provided. If it is attached to the display unit, it is on the front side, so there is a disadvantage that it affects the image, but if it is a corner, there is no such disadvantage. In addition, setting the attachment position near the center of the side of the panel substrate even in the frame portion around the display unit has a disadvantage that the arrangement of the electrode terminals for connecting the FPC is inconvenient. Therefore, in the front panel substrate, it is best to set the corner portion to the position where the panel ID identification mark is provided. Therefore, an eighteenth invention of the present application provides a front panel substrate and a rear panel that are overlapped and bonded at least in a display portion, and that one of the two substrates has an end protruding from an end surface position of the other substrate. A display device in which an FPC is crimp-connected, wherein the panel ID identification mark is provided at a corner of a front panel substrate.

The corners of the rear panel substrate may be provided with panel ID identification marks. However, in the rear panel substrate constituting the plasma display panel (PDP), since the white dielectric layer covers the display portion, if the position where the panel ID identification mark is provided is set in the range where the white dielectric layer is attached, There is an advantage that a stable contrast can be obtained with the white dielectric layer serving as a background of the panel ID identification mark without affecting the image.
Therefore, the nineteenth invention of the present application is directed to a front panel substrate and a rear panel that are overlapped and bonded at least in a display portion, and that one of the two substrates has an end protruding from an end surface position of the other substrate. In a plasma display panel to which an FPC is crimp-connected, the panel ID identification mark is provided in an area where a white dielectric layer on a rear panel substrate is attached. However, as a panel ID identification mark, a white background and black printing (barcode, etc.) formed on the white background
In the case of using a label having a base serving as a printing background, such as a label consisting of, a good contrast can be ensured even if the label is provided outside the range in which the white dielectric layer is adhered. On the other hand, when using a deposition type identification mark that does not have a base serving as a background for printing, if it is attached outside the range in which the white dielectric layer is applied, the brightness of the background is uncertain, resulting in good contrast. Is hard to secure. Also in this case, if the panel ID identification mark is provided in the area where the white dielectric layer is attached, good contrast can be ensured.

[0043]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A production management method according to an embodiment of the present invention will be described below with reference to the drawings. The following is one example of the present invention and does not limit the present invention.

Embodiment 1 This embodiment is an example in which the present invention is applied to a conventional PDP production line. This production line is one in which a plurality of manufacturing facilities are arranged according to the processing order, and is controlled by a system control unit (not shown). The system control method may be a centralized type that controls the entire production line. in this case,
The production control system has a single central control unit that can communicate with each of the manufacturing apparatuses, and the system control unit refers to this central control unit. In addition, the system control system may be configured so that each manufacturing facility can communicate with an adjacent manufacturing facility, and may be a self-contained decentralized type that independently determines and controls. In this case, the production control system has a control unit for each manufacturing facility, and a system control unit refers to a control unit for each manufacturing facility or a control unit and a central control unit for each manufacturing facility.

FIG. 1 is a plan view of a sheet substrate 11 having a sheet ID identification mark in an unprocessed state. The sheet substrate 11 is a transparent glass substrate for a PDP. The sheet substrate 11 has four front panel substrates 12, 13, 14, 15
The sections are laid out in two rows and two columns. The area of each front panel substrate 12, 13, 14, 15 is defined by a cutting line 16 shown in FIG. 1, and the outside of the cutting line 16 constitutes a waste unit 17. The actual marking of the cutting line 16 on the sheet substrate 11 is performed by forming a cutting marker using the same material as the electrode using the same material as that of the electrode using a patterning step of forming an electrode.

The system controller holds the position information of the front panel substrates 12, 13, 14, 15 on the sheet substrate 11 in a memory. The system control unit holds matrix information based on the transport direction of the sheet substrate 11 as position information. The matrix information includes the front panel substrate 12 in the first row and the first column, the front panel substrate 13 in the first row and the second column, and the front panel substrate 13 in the first row and the second column, as shown in FIG.
The front panel board 14 is arranged in the first row and the front panel board 15 is arranged in the second row and second column. By setting the transfer direction, it is easy for a worker involved in the production line to specify the panel substrate. Also, the system control unit
Sheet substrate 11 and front panel substrates 12, 13, 14,
An ID is set for 15 and stored in the memory.
The sheet ID includes, for example, a production line number—the front and rear flags—the date of input to the production line, and the panel ID includes the sheet ID to which the self belongs + n (n =
01, 02, 03,...).

Next, a description will be given along a PDP manufacturing flow. FIG. 2 is a schematic diagram of a main part in each step of the A1-A2 cross section in FIG. FIG. 3 shows a PDP manufacturing flow chart.

[Attachment of Sheet ID Identification Mark (F1)] First, as shown in FIGS. 1 and 2A, a sheet ID identification mark 18 is attached on the discarded portion 17 of the unprocessed sheet substrate 11. The sheet ID identification mark 18 records the sheet ID set by the system control unit for the sheet substrate 11 and held in the memory. The manufacturing facility 31 (see FIG. 4) is automatically numbered (numbering) from the system control unit.
The obtained number (sheet ID) is obtained. Thereafter, the manufacturing equipment 31 etches the metal film deposited by sputtering into a predetermined barcode pattern to form a metal deposited film barcode. This is the sheet ID identification mark 1
It becomes 8. After attaching the sheet ID identification mark 18, it is preferable to confirm reading by a reading device (bar code reader) 21. As shown in FIG. 2, the sheet ID identification mark 18 is provided on the non-processed surface opposite to the processed surface on which the transparent electrodes 22 and the like are stacked.

[Cleaning Step (F2)] Next, a cleaning step (F2) is performed on the sheet substrate 11 provided with the sheet ID identification mark 18. Here, the production management method according to the present invention will be described by taking the cleaning step (F2) as an example. FIG. 4 shows a schematic diagram of a production line for performing the cleaning step (F2). The cleaning step (F2) includes cleaning (F21) and pre-baking (F2).
2) and washing (F23).

[Cleaning (F21)] First, the system control unit controls the front panel substrates 12, 13 for cleaning (F21).
The condition values (speed 1, rotation speed 1, liquid temperature 1) of 14 and 15 are called based on the panel ID, and the set values (speed 1, rotation speed 1, liquid temperature 1) of the manufacturing equipment 32 are referred to. here,
Since the condition value and the set value matched, the system control unit
Receiving and processing (washing) sheet substrate 11 in manufacturing facility 32
Control to do. In response to this, the manufacturing equipment 32 processes (cleans) the sheet substrate 11 with the set values (speed 1, rotation speed 1, liquid temperature 1). The system control unit stores the processing condition and the processing time in the memory in association with the panel ID.

[Pre-baking (F22)] Next, the system control unit controls the front panel substrates 12, 13 for the pre-baking (F22).
The condition values (condition 1) of 14 and 15 are called based on the panel ID, and the set values (condition 2) of the manufacturing equipment 33 are referred to. Here, since the processing conditions and the set conditions do not match, the system control unit outputs a warning to the manufacturing equipment 33 and performs control so as to seek the operator's judgment. In response to this, the operator may remove the sheet substrate 11, but this is not necessary here, and it is assumed that the operator has changed the set value to the condition 1. In response to this, the system control unit controls the manufacturing facility 33 to receive and process (pre-fire) the sheet substrate 11.
In response, the manufacturing equipment 33 processes (pre-fires) the sheet substrate 11 with the set value (condition 1). The system control unit stores the processing condition and the processing time in the memory in association with the panel ID.

Similarly, cleaning (F23) is performed on the sheet substrate 11, and production control and production management operations are performed.

In the manufacturing facility 34, the front panel substrate 12
Is defective. In that case, the system control unit stores the defect information in the memory in association with the panel ID of the front panel substrate 12. As a result, the system control unit can control the front panel substrate 12 in which the defect has occurred so as not to perform unnecessary processing thereafter.

[Transparent electrode forming step (F3)] Next, the transparent electrode forming step (F3) is performed on the sheet substrate 11 having undergone the cleaning step (F2). Here, a transparent electrode forming step (F3)
The production management method according to the present invention will be described with reference to an example. FIG. 5 is a schematic view of a production line for performing the transparent electrode forming step (F3). The data electrode forming step (F3) includes printing (F31), exposure (F32), and development (F33).

[Printing (F31)] First, the system control unit sends the front panel substrates 13, 14 to the printing (F31).
15 condition values (pressure 1, speed 1, angle 1) are assigned to panel ID
, And refer to the set values (pressure 1, speed 1, angle 1) of the manufacturing equipment 41. Here, since the condition value and the set value match, the system control unit returns to the manufacturing equipment 4
1 receives the sheet substrate 11 and the front panel substrates 13 and 1
It controls so that processing (printing) is performed on 4 and 15. In response to this, the manufacturing equipment 41 sets the set values (pressure 1, speed 1, angle 1).
Then, the front panel substrates 13, 14, and 15 are processed (printed). The system control unit stores the processing condition and the processing time in the memory in association with the panel ID.

[Exposure (F32)] Next, the system control unit controls the front panel substrates 12, 13 for the exposure (F32).
The condition values (exposure amount 1, exposure time 1) of 14 and 15 are called based on the panel ID, and the set values (exposure amount 2, exposure time 1) of the manufacturing equipment 42 are referred to. Here, since the processing conditions do not match the setting conditions, the system control unit
It is assumed that the set value is changed to the exposure amount 1, and the manufacturing equipment 42 is controlled to receive the sheet substrate 11 and process (expose) the front panel substrates 13, 14, and 15. In response to this, the manufacturing equipment 42 processes (exposes) the front panel substrates 13, 14, and 15 with the set values (exposure amount 1, exposure time 1). The system control unit stores the processing condition and the processing time in the memory in association with the panel ID.

Similarly, development (F33) is performed on the sheet substrate 11, and production control and production management operations are performed.

As described above, the transparent electrodes 22 are formed on the front panel substrates 13, 14, 15 as shown in FIG. This transparent electrode 22 is made of ITO (Indium Tin O
xide), and a surface discharge electrode composed of a pair of a scan electrode and a sustain electrode is formed.

[Bus Electrode Forming Step (F4)] Next, a bus electrode forming step (F4) is performed on the front panel substrates 12, 13, and 14 on which the transparent electrodes 22 are formed. A bus electrode 23 is formed on the transparent electrode 22 as shown in FIG. The bus electrode 23 is a metal electrode having a narrow width with respect to the transparent electrode 22, and has a low resistance.
To reduce the resistance value of the surface discharge electrode.

[Transparent Dielectric Layer Forming Step (F5)] Next, the front panel substrates 12, 13, 1
4 is subjected to a transparent dielectric layer forming step (F5). FIG.
As shown in (d), a transparent dielectric layer 24 is formed.

[Black Mask Layer Forming Step (F6)] Next, the front panel substrate 12, on which the transparent dielectric layer 24 has been formed,
Black mask layer forming step (F6) for 13 and 14
Is applied. As shown in FIG. 2E, the black mask layer 25 is formed.
Is formed on the transparent dielectric layer 24. This black mask layer 25 is a lattice-shaped or stripe-shaped black partition,
This has the effect of preventing discharge and light emission leakage to adjacent cells and improving display contrast.

[MgO Deposition Step (F7)] Next, the front panel substrates 12, 13 on which the black mask layer 25 is formed,
14 is subjected to an MgO vapor deposition step (F7). FIG.
As shown in (f), the MgO (magnesium oxide) layer 26
Are formed on the black mask layer 25. This MgO
The layer 26 is a protective layer which has excellent secondary electron emission performance and lowers the voltage required for discharge.

Also in the above steps (F4 to F7), the system control unit performs management using the panel ID.

As described above, according to the present embodiment, the panel ID identification mark is provided on the front panel substrates 12, 13, 14,
15, the system control unit controls the front panel substrates 12, 13, 13 on the sheet substrate 11.
The position information of the front panel substrate 12,
Since the panel IDs are set for 13, 14, and 15, all information related to production can be stored in association with the panel IDs and can be called. That is, the production of the front panel substrate can be managed with a consistent panel ID.

FIG. 6 shows a plan view (a) of the sheet substrate 11 when the panel ID identification mark is provided and a plan view (b) of the front panel substrate when separated. As shown in FIG. 6A, the alignment marker 53 on the sheet substrate 11 is the sheet ID.
A sheet ID identification mark 18 is provided in an area where the identification mark 18 does not interfere with reading.

[Addition of Panel ID Identification Mark (F8)] Next, as shown in FIGS. 2 (g) and 6 (a), panel ID identification marks 5 are provided on the corners of front panel substrates 13, 14, 15.
1 is attached. The system control unit includes a front panel substrate 13, 14,
Control is performed so that panel ID identification marks (ceramic labels) 51 on which the 15 panel IDs are printed are attached (attached). A two-dimensional bar code format ceramic label is used. After attaching the panel ID identification mark 51, it is preferable to confirm reading by the reading device (CCD) 27. The reading device (CCD) 27 may be incorporated in an automatic ceramic labeling device. In this case, the automatic ceramic labeling device automatically verifies the printed ceramic label and then automatically applies the ceramic label. As a result, the panel ID identification mark 51 is displayed on the display unit 5.
2 attached outside. Further, in a region where the wiring electrodes (not shown) and the alignment marker 53 on the sheet substrate 11 do not interfere with the reading of the panel ID identification mark 51,
A panel ID identification mark 51 is provided. further,
As shown in FIG. 2 (g), a panel ID identification mark 51 is provided on the non-processed surface opposite to the processed surface on which the transparent electrode 22 and the like are stacked.

[Cutting Step (F9)] Next, a cutting step is performed. The system control unit supplies cutting equipment (not shown) to the front panel substrates 13 and 1 except for the front panel 12 in which a defect has occurred.
4 and 15 are cut off. In response, the cutting equipment scribes along the cutting line 16 with a cutter or laser to form a scribe groove. Thereafter, an impact load is applied from the opposite side of the scribe groove to break the glass substrate. As a result, as shown in FIG.
3, 14, 15 are separated. The remaining disposal unit 17 and front panel substrate 12 are disposed of.

On the other hand, the rear glass substrate which has been subjected to various processes is separated from the rear glass substrate through substantially the same steps as described below. FIG. 7 is a plan view of a sheet substrate 61 in which a sheet ID identification mark is provided in an unprocessed state. The sheet substrate 61 is a transparent glass substrate for a PDP. The sheet substrate 61 includes four back panel substrates 62, 63, 64, and 65.
The sections are laid out in two rows and two columns. The area of each rear panel substrate 62, 63, 64, 65 is defined by a cutting line 66 shown in FIG. 7, and the outside of the cutting line 66 constitutes a waste part 67.

The system controller holds the position information of the rear panel substrates 62, 63, 64, 65 on the sheet substrate 61 in the memory. The system control unit holds matrix information based on the transport direction of the sheet substrate 61 as position information. The matrix information includes, as shown in FIG. 7, the rear panel substrate 62 in the first row and first column, the rear panel substrate 63 in the first row and second column,
The rear panel substrate 64 is arranged in the first row and the rear panel substrate 65 is arranged in the second row and second column. Further, the system control unit includes the sheet substrate 61 and the back panel substrate 6.
IDs are set for 2, 63, 64, and 65 and are stored in the memory.

FIG. 8 is a schematic diagram of a main part in each step of the section taken along line C1-C2 in FIG. Further, reference is made to the PDP manufacturing flowchart of FIG.

[Attachment of Sheet ID Identification Mark (B1)] First, as shown in FIGS. 7 and 8A, a sheet ID identification mark 68 is attached on the discarded portion 67 of the unprocessed sheet substrate 61. The sheet ID identification mark 68 records a sheet ID set by the system control unit for the sheet substrate 61 and held in the memory. The metal film deposited by sputtering is etched into a predetermined bar code pattern to form a metal deposited film bar code, which is used as a sheet ID identification mark 68. Sheet ID identification mark 6
After attaching 8, a reading device (bar code reader)
It is preferable to confirm the reading by using the reference numeral 21. As shown in FIG. 8, the sheet ID identification mark 68 is provided on the non-processed surface opposite to the processed surface on which the data electrodes 71 and the like are stacked.

[Cleaning Step (B2)] Next, the cleaning step (B2) is performed on the sheet substrate 61 provided with the sheet ID identification mark 68. In the cleaning step (B2), three steps of cleaning, pre-baking, and cleaning are performed.

[Data Electrode Forming Step (B3)] Next, the data electrode forming step (B3) is performed on the sheet substrate 61 having undergone the cleaning step (B2). As shown in FIG. 8B, data electrodes 71 are formed on rear panel substrates 62, 63, 64 and 65. In the data electrode forming step (B3), two steps of printing and development are performed.

[White Dielectric Layer Forming Step (B4)] Next, the back panel substrates 62, 63 on which the data electrodes 71 are formed,
A white dielectric layer forming step (B4) is performed on the layers 64 and 65. As shown in FIG. 8C, a white dielectric layer 72 is formed on the data electrode 71. The white dielectric layer 72 reflects visible light from the phosphor toward the front surface to improve luminance.

[White Partition Forming Step (B5)] Next, the rear panel substrates 62, 63, 6 on which the white dielectric layer 72 is formed
4 and 65 are subjected to a white partition wall forming step (B5). FIG.
As shown in (d), a white partition 73 is formed. White partition 7
3 is formed in a stripe shape so as to partition display cells in parallel with the data electrodes. The white partition 73 is formed of a white dielectric layer 72.
Also works as a reflective layer.

[Phosphor Layer Forming Step (B6)] Next, the back panel substrates 62, 63, 64, 6 on which the white partition walls 73 are formed.
5 is subjected to a phosphor layer forming step (B6). FIG.
As shown in (e), the phosphor layer 74 is applied to the bottom and the inner wall of the groove formed by the white dielectric layer 72 and the white partition wall 73. The phosphor layer 74 receives discharge and emits light in three primary colors of red, green and blue.

[Frit seal glass forming step (B
7)] Next, the back panel substrate 6 on which the phosphor layer 74 is formed
The frit seal glass forming step (B7) is performed on 2, 63, 64, and 65. As shown in FIG. 8F, a frit seal glass 75 is formed around the display section.

Also in the above steps (B1 to B7), the system control unit performs management using the panel ID. According to the present embodiment, the panel ID identification mark is attached to the rear panel substrate 6.
Despite not being attached to 2, 63, 64, 65,
The system controller holds the position information of the rear panel substrates 62, 63, 64, 65 on the sheet substrate 61, and assigns panel IDs to the rear panel substrates 62, 63, 64, 65.
Is set, all information relating to production can be stored in connection with the panel ID, and can be called. That is, the production of the rear panel substrate can be managed with a consistent panel ID.

FIG. 9 shows a plan view (a) of the sheet substrate 61 when the panel ID identification mark is provided and a plan view (b) of the rear panel substrate when separated. As shown in FIG. 9A, the alignment marker 83 on the sheet substrate 61 is the sheet ID.
A sheet ID identification mark 68 is provided in an area where the identification mark 68 does not interfere with reading.

[Addition of Panel ID Identification Mark (B8)] Next, as shown in FIGS. 8 (g) and 9 (a), the coverage of the white dielectric layers on the rear panel substrates 62, 63, 64, 65 Is provided with a panel ID identification mark 81. The system control unit controls to attach (attach) a panel ID identification mark (ceramic label) 81 on which the panel ID of each of the rear panel substrates 62, 63, 64, and 65 is printed to a ceramic label automatic attaching device (not shown). A one-dimensional barcode format is used as the ceramic label. After attaching the panel ID identification mark 81, it is preferable to confirm reading by a reading device (bar code reader) 76. This reading device (bar code reader)
Reference numeral 76 may be incorporated in an automatic ceramic labeling apparatus. In this case, the automatic ceramic labeling device automatically verifies the printed ceramic label and then automatically applies the ceramic label. The panel ID identification mark 81 is provided in the display section 82 to which the white dielectric layer is always attached. However, the panel ID identification mark 81 is provided outside the range 84 of the display unit 82 where the end face of the suction head contacts in a later step. The panel ID is in the range 84 where the end face of the suction head contacts.
This is because, if the identification mark 81 is provided, the attraction force may decrease. The panel ID identification mark 81 is provided in a region where the wiring electrodes (not shown) and the alignment marker 83 on the sheet substrate 61 do not interfere with the reading of the panel ID identification mark 81. Further, as shown in FIG. 8 (g), the panel ID identification mark 81 is
Etc. are attached to the non-working surface opposite to the working surface on which they are stacked.

[Cutting Step (B9)] Next, a cutting step is performed. The system control unit controls the cutting equipment (not shown) to cut the rear panel substrates 62, 63, 64, and 65. In response, the cutting equipment scribes with a cutter or laser along the cutting line 66 to form a scribe groove. Thereafter, an impact load is applied from the opposite side of the scribe groove to break the glass substrate. As a result, the rear panel substrates 62, 63, 64, and 65 are separated as shown in FIG. The remaining disposal section 67 is disposed of.

[Assembling / Sealing Step (P1)] The front panel substrate 13 on which the panel ID identification marks 51 and 81 are respectively attached by the above steps (F1 to F9, B1 to B9).
The case of assembling and sealing with the rear panel substrate 62 will be described. FIG. 10 is a plan view showing a state where the front panel substrate 13 and the rear panel substrate 62 are assembled. 11 to FIG.
2 shows a sectional view taken along line D1-D2 in FIG. The system control unit calls the respective specification information based on the panel IDs of the front panel substrate 13 and the rear panel substrate 62, and
3 and the rear panel substrate 62 are determined to be of the same type. Next, the system control unit controls the assembling facilities (not shown) to assemble the front panel substrate 13 and the rear panel substrate 62. In response, the assembling facility performs assembling. FIG.
The front panel substrate 13 and the rear panel substrate 62 are overlapped so that the display units 52 and 82 overlap as shown in FIG. 0, and the display panel 90 is assembled. At this time, FIG.
As shown in (1), the end of the front panel substrate 13 on which the electrode terminals 85 are formed protrudes from the end surface position of the rear panel substrate 62. The back panel substrate 6 on which the electrode terminals 86 are formed
2 protrudes from the end face position of the front panel substrate 13. Next, the display panel 90 is heated at 430 ° C. for a predetermined time. Thereby, the frit seal glass is fused to the front panel substrate 13 and the rear panel substrate 62, thereby sealing the display panel. The system control unit associates the panel ID of the front panel substrate 13 with the panel ID of the rear panel substrate 62 and stores them in the memory.

[Exhaust / Baking / Gas Injection Sealing Step (P2)] Next, the exhaust pipe 8 provided on the back panel substrate
7, the inside of the display panel 90 is evacuated. The evacuation is performed by activating the inside while baking at 380 ° C.
Next, a discharge gas is sealed from the exhaust pipe 87 and the display panel 90 is closed.
Is completed. [Aging (P3), Panel Inspection (P4)] Next, the display panel 90 is aged (aging), and then a panel inspection is performed.

Steps after panel assembly (P2 to P4)
And in the subsequent module process, the display panel 9
0 is controlled by the panel I attached to the front panel substrate 13.
The display panel 90 is identified by reading the panel ID from the D identification mark 18 or the panel ID identification mark 68 attached to the rear panel substrate 62. Since the system control unit associates the panel ID of the front panel substrate 13 with the panel ID of the rear panel substrate 62 and holds them in the memory, the system controller reads the panel ID from the panel ID identification mark 18 attached to the front panel substrate 13. In this case, the processing history of the rear panel substrate 62 can be called.

[FPC Connection Step] Next, the FPC connection step will be described. FIG. 11 is a sectional view taken along line D1-D2 in FIG. As shown in FIG. 11, the FPC 91 is arranged on the electrode terminal 85, and the end of the display panel is narrowed by the heated pressure bonding heads 92 and 93, and the FPC 91 is thermocompressed to the electrode terminal. At this time, the pressure bonding heads 92 and 93 come into contact with the back panel substrate 62 and the non-processed surface of the front panel substrate 13. FIG. 12 shows a plan view of a display panel 90 in which FPCs 91 are connected to four sides. In FIG. 12, reference numeral 94 denotes a range where the pressure bonding heads 92 and 93 contact the display panel 90 when the FPC 91 is pressure bonded to the electrode terminals 85 formed on the front panel substrate 13. Reference numeral 95 denotes a range where the pressure bonding heads 92 and 93 contact the display panel 90 when the FPC 91 is pressure-bonded to the electrode terminals 86 formed on the rear panel substrate 62. As described above, the panel ID identification marks 51 and 81 are ceramic labels and have a thickness of about 20 μm.
Inconvenience occurs in connection 91 (a panel ID identification mark provided in a convex shape with respect to the surface of the panel substrate is employed). However, in the present embodiment, as shown in FIG. 12, such inconvenience does not occur because the panel ID identification marks 51 and 81 are provided outside the range where the pressure bonding heads 92 and 93 come into contact.

Next, another embodiment of the present invention will be described.

Embodiment 2 This embodiment is an example in which the present invention is applied to a conventional liquid crystal display device production line. A liquid crystal display panel also has a structure in which two glass substrates are bonded together like a PDP, and a production method of separating the panel substrate from a sheet substrate having one or more panel substrate portions in a predetermined area has been widely adopted. I have. In the case of a liquid crystal display panel, a production procedure for separating the panel substrate is often performed after bonding a sheet substrate having a front panel substrate portion and a sheet substrate having a rear panel substrate portion, and also in a PDP. Such a procedure may be adopted. In this case, after bonding (after assembling) and before separating the panel substrate, a panel ID identification mark is attached to one of the front panel substrate and the rear panel substrate, and production management is performed in the same manner as in the first embodiment. According to the present embodiment, although the panel ID identification mark is not attached to the panel substrate, the system control unit holds the position information of the panel substrate on the sheet substrate and sets the panel ID for the panel substrate. Therefore, all information related to production can be stored in association with the panel ID, and can be called up. That is, the production of the panel substrate can be managed with a consistent panel ID. In addition, since the panel ID identification mark may be provided on one of the front panel substrate and the rear panel substrate, a design burden and a process burden generated when the panel ID identification mark is provided can be further reduced.

In the case of a liquid crystal display panel used for a transmission type liquid crystal display or a projection type liquid crystal display, it is preferable that a panel ID identification mark is attached to a corner outside the display section on the rear panel substrate as well as the front substrate. This is to avoid the inconvenience of blocking the light from the light source from the back and creating a shadow in the image. If the reflection layer is formed on the display section of the rear panel substrate in the reflection type liquid crystal display, a panel ID identification mark may be provided on the display section.

Embodiment 3 This embodiment is an example in which the present invention is applied to a conventional production line for printed wiring boards. FIG. 13 shows the printed wiring board 1.
00 shows a plan view.

The printed wiring board 100 is a wiring board on which a wiring pattern is laid on a ceramic or glass epoxy substrate as a base material. This printed wiring board 100
Is a multi-piece sheet substrate composed of four panel substrates 101a, 101b, 101c and 101d, which are cut and separated along cutting lines 102 in a later step. At that time, no discarded portion is generated. Lands 103a, 103b, 103c, 1031d on the upper surface of each panel substrate
, A large number of electrode pads 104 of a wiring pattern are formed, and portions other than the electrode pads 104 are insulated and coated with a solder resist or the like.

When performing integrated management of the printed wiring board 100 by ID for each panel board, first, a sheet ID identification mark 105 is provided on an unprocessed base material. In the subsequent steps, the panel substrates 101a, 101b, 101c, and 101d are identified based on the sheet ID read from the sheet ID identification mark 105 and the position information as in the first embodiment. Further, the panel substrates 101a, 101b, 101
A panel ID is set for each of c and 101d, and information associated with these panel IDs is stored. For example,
It is assumed that a defect such as disconnection has occurred in the wiring on the panel substrate 101a in the wiring pattern forming step. In this case, the system control unit calls the panel ID of the panel board 101a based on the sheet ID of the printed wiring board 100 read from the sheet ID identification mark 105, and
The defect information is stored in the memory in association with the panel ID 1a. Thereafter, when the printed wiring board 100 is transported and received by a mounting device (not shown) for mounting the conductive balls on the electrode pads 104, the system control unit reads the sheet ID of the printed wiring board 100 read from the sheet ID identification mark 105. Originally, the panel ID, defect information, and position information belonging to the sheet ID are called, and it is determined that it is not necessary to mount a conductive ball on the panel substrate 101a positioned at the head in the transport direction. Next, the system control unit controls the mounting apparatus to mount the conductive balls on the panel substrates 101b, 101c, and 101d except for the panel substrate 101a. Then, after the semiconductor device is bonded to the panel substrates 101b, 101c, and 101d and sealed with a resin, the panel devices 101b, 101c, and 101d are bonded.
A panel ID identification mark is provided on the surface of each sealing resin of d. Thereafter, the substrate is cut along the cutting line 102 to separate the panel substrates 101b, 101c, and 101d to obtain individual semiconductor packages. Subsequent panel substrates (semiconductor package) 101b, 101c, 10
1d is identified by a panel ID identification mark.

In this embodiment, as shown in FIG. 13, a sheet ID identification mark 105 is formed on a panel substrate 101a.
However, in a printed wiring board having a discarded portion, it is more advantageous to attach it to the discarded portion. In any case, the sheet ID identification mark 105 is formed on a non-processed surface on which a layer such as a wiring pattern or a solder resist is not laminated on the base material so that the sheet ID identification mark 105 can be read in each step.
Is attached. According to the present embodiment, although the panel ID identification mark is not attached to the panel substrate, the system control unit holds the position information of the panel substrate on the sheet substrate and sets the panel ID for the panel substrate. Therefore, all information related to production can be stored in association with the panel ID, and can be called up. In other words, the production of panel substrates
D can be managed.

In the above-described first to third embodiments, the production management method of electronic device production (multi-cavity) for separating the panel substrate from the sheet substrate having a plurality of panel substrate portions in a predetermined area has been described. According to the above description, a production management method of electronic device production (single-panning) in which the panel substrate is separated from a sheet substrate having a single panel substrate portion in a predetermined area can be implemented. However, position information is not required for single-paneling. This is because, in single-paneling, if a sheet substrate is specified, a panel substrate can be specified without positional information. In other words, the management of the sheet substrate is performed by identifying the sheet substrate by reading the sheet ID from the sheet ID identification mark attached to the portion of the sheet substrate other than the panel substrate portion. The panel substrate is identified by the sheet ID read from the sheet ID identification mark, and the panel substrate after the panel substrate is separated is managed by the panel ID identification mark attached to the panel substrate.
By reading D, the panel substrate is identified.

[0094]

As described above, according to the present invention, the management of the panel substrate before the panel substrate separation is performed by identifying the panel substrate based on the sheet ID read from the sheet ID identification mark and the position information of the panel substrate on the sheet substrate. The number of identification marks in the production line for sheet substrates before separating the panel substrate, thereby reducing the design burden and process burden that occur when attaching the identification marks, and a reading device in the production line. There is an effect that the equipment can be simplified, the reading time can be shortened, and the reading operation can be simplified. In addition, in the present invention, since the panel ID is set from the beginning and management linked to the panel ID is performed, all processes from inputting the sheet substrate to the production line to shipping the product are performed with a consistent ID. There is an effect that can be managed.

[Brief description of the drawings]

FIG. 1 is a plan view of a sheet substrate 11 provided with a sheet ID identification mark in an unprocessed state according to Embodiment 1 of the present invention.

FIG. 2 is a schematic diagram of a main part in each step of an A1-A2 cross section in FIG.

FIG. 3 is a PDP manufacturing flow chart in Embodiment 1 of the present invention.

FIG. 4 shows a cleaning step (F) in the first embodiment of the present invention.
Schematic diagram of the production line that implements 2)

FIG. 5 is a schematic diagram of a production line for performing a transparent electrode forming step (F3) according to the first embodiment of the present invention.

FIG. 6A is a plan view of the sheet substrate 11 when the panel ID identification mark is provided and FIG. 6B is a plan view of the front panel substrate when the panel substrate is separated according to the first embodiment of the present invention.

FIG. 7 is a plan view of a sheet substrate 61 provided with a sheet ID identification mark in an unprocessed state according to the first embodiment of the present invention.

8 is a schematic diagram of a main part in each step of a C1-C2 cross section in FIG. 7;

FIG. 9A is a plan view of the sheet substrate 61 when the panel ID identification mark is provided according to the first embodiment of the present invention, and FIG.

FIG. 10 is a plan view of a state where the front panel substrate 13 and the rear panel substrate 62 according to the first embodiment of the present invention are assembled.

11 is a sectional view taken along line D1-D2 in FIG.

FIG. 12 is a plan view of a display panel 90 in which an FPC 91 according to Embodiment 1 of the present invention is connected to four sides.

FIG. 13 is a plan view of a printed wiring board 100 according to Embodiment 3 of the present invention.

[Explanation of symbols]

11, 61: sheet substrate 12, 13, 14, 15, 62, 63, 64, 65: back panel substrate 16, 66: cutting line 17, 67: discarded part 18, 68: sheet ID identification mark 21, 27, 76 ... Reading device 51, 81 ... Panel ID identification mark 52,82 ... Display unit 53,83 ... Alignment marker 84 ... Range where end face of suction head comes in contact 85,86 ... Electrode terminal 87 ... Exhaust pipe 90 ... Display panel 91 ... FPC 92, 93 ... Crimping head 94,95 ... Range where the crimping head contacts

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01J 11/02 H01J 11/02 B 5G435 H05K 3/00 H05K 3/00 PF term (Reference) 2H088 FA25 FA28 HA05 HA06 MA20 2H092 GA50 NA30 PA06 5B049 BB07 CC21 CC23 DD02 EE08 EE23 FF02 5C012 AA09 BB07 5C040 GA09 JA38 MA23 MA26 5G435 AA17 KK05

Claims (19)

[Claims] 1. A production management method for electronic device production, comprising separating a panel substrate from a sheet substrate provided with a single panel substrate portion in a predetermined area, wherein the management of the sheet substrate is performed in a portion of the sheet substrate excluding the panel substrate portion. The sheet substrate is identified by reading the sheet ID from the obtained sheet ID identification mark, and the management of the panel substrate before separation of the panel substrate is performed by identifying the panel substrate by the sheet ID read from the sheet ID identification mark. The production management method is characterized in that the management of the panel substrate after separating the panel substrate is performed by identifying the panel substrate by reading the panel ID from a panel ID identification mark attached to the panel substrate. 2. In a production management method of electronic device production for separating a panel substrate from a sheet substrate having a plurality of panel substrate portions in a predetermined area, the management of the sheet substrate is performed based on a sheet ID identification mark attached to the sheet substrate. Identify and perform the sheet substrate by reading the sheet ID,
The management of the panel substrate before the panel substrate separation is performed by the sheet I described above.
A production management method characterized by identifying a panel substrate based on a sheet ID read from a D identification mark and position information of the panel substrate on the sheet substrate. 3. A production management method for production of a display device for separating a panel substrate from a sheet substrate provided with a single panel substrate portion in a predetermined area, wherein the management of the sheet substrate is performed in a portion of the sheet substrate excluding the panel substrate portion. The sheet substrate is identified by reading the sheet ID from the obtained sheet ID identification mark, and the management of the panel substrate before separation of the panel substrate is performed by identifying the panel substrate by the sheet ID read from the sheet ID identification mark. The production management method is characterized in that the management of the panel substrate after separating the panel substrate is performed by identifying the panel substrate by reading the panel ID from a panel ID identification mark attached to the panel substrate. 4. In a production management method for production of a display device for separating a panel substrate from a sheet substrate provided with a plurality of panel substrate portions in a predetermined area, the management of the sheet substrate is performed based on a sheet ID identification mark attached to the sheet substrate. Identify and perform the sheet substrate by reading the sheet ID,
The management of the panel substrate before the panel substrate separation is performed by the sheet I described above.
The panel substrate is identified based on the sheet ID read from the D identification mark and the position information of the panel substrate on the sheet substrate, and the panel substrate is separated.
A production management method characterized by identifying a panel substrate by reading a panel ID from a panel ID identification mark attached to the panel substrate. 5. A front panel substrate, wherein a front panel substrate is separated from a sheet substrate having a single front panel substrate portion in a predetermined region, and a rear panel substrate is separated from a sheet substrate having a single rear panel substrate portion in a predetermined region. In the production management method of display device production in which the display panel is formed by bonding the display panel and the rear panel, the management of the sheet substrate is performed by reading a sheet ID from a sheet ID identification mark attached to a portion of the sheet substrate other than the panel substrate portion. The management of the panel substrate before separation of the front panel substrate is performed by identifying the panel substrate by the sheet ID read from the sheet ID identification mark, and the management of the panel substrate after separation of the front panel substrate. Reads the panel ID from the panel ID identification mark attached to the panel substrate, The management of the panel substrate before separation of the rear panel substrate is performed by identifying the panel substrate by the sheet ID read from the sheet ID identification mark, and the management of the panel substrate after separation of the rear panel substrate is performed by the panel substrate Panel ID identification mark attached to the panel I
D is read to identify the panel substrate, and the display panel is managed by reading the panel ID from the panel ID identification mark attached to the front panel substrate or the panel ID identification mark attached to the rear panel substrate. A production management method characterized by identifying a panel. 6. A front panel substrate, comprising: separating a front panel substrate from a sheet substrate having a plurality of front panel substrate portions in a predetermined region; separating a rear panel substrate from a sheet substrate having a plurality of rear panel substrate portions in a predetermined region; In the production management method of display device production in which a display panel is formed by laminating a sheet substrate and a rear panel, the management of the sheet substrate is performed by reading the sheet ID from the sheet ID identification mark attached to the sheet substrate to identify the sheet substrate. The management of the front panel substrate before separation of the front panel substrate is performed according to the sheet I.
The front panel substrate is identified based on the sheet ID read from the D identification mark and the position information of the front panel substrate on the sheet substrate, and the management of the front panel substrate after the separation of the front panel substrate is performed on the front panel substrate. Panel I
The front panel substrate is identified by reading the panel ID from the D identification mark, and the back panel substrate before separation of the rear panel substrate is managed by the sheet ID read from the sheet ID identification mark and the rear panel substrate on the sheet substrate. The rear panel board is identified by the position information of the rear panel board.
The rear panel substrate is identified by reading the panel ID from the panel ID identification mark attached to the rear panel substrate, and the display panel is managed by the panel ID identification mark attached to the front panel substrate or attached to the rear panel substrate. A production management method, wherein a display panel is identified by reading a panel ID from a panel ID identification mark that has been set. 7. The management of the panel substrate before the separation of the panel substrate is performed by identifying the panel substrate based on the sheet ID read from the sheet ID identification mark and the position information of the panel substrate on the sheet substrate. The production management method according to claim 1, wherein the production management method is set. 8. The production method according to claim 1, wherein a cleaning step and a processing step are performed after attaching the sheet ID identification mark to the unprocessed sheet substrate. Management method. 9. The display device according to claim 1, wherein, in managing the production of the display device, a cleaning step and an electrode forming step are performed after attaching the sheet ID identification mark to the unprocessed sheet substrate. The production management method according to any one of the above. 10. The panel according to claim 1, wherein the panel ID identification mark is attached to the panel substrate portion, and then a panel substrate cutting step is performed. Production control method. 11. The production management method according to claim 1, wherein the sheet ID identification mark is attached to a portion of the sheet substrate other than the panel substrate portion. 12. The method according to claim 1, wherein a sheet ID identification mark is attached to an area where the alignment marker on the sheet substrate does not interfere with reading of the sheet ID identification mark. Production management method described in. 13. The method according to claim 1, wherein the panel ID identification mark is attached to a region where the wiring and the alignment marker on the panel substrate do not interfere with the reading of the panel ID identification mark. The production management method according to any one of the above. 14. The production management according to claim 1, wherein the sheet ID identification mark and the panel ID identification mark are attached to a non-processed surface of a substrate. Method. 15. The production management method according to claim 1, wherein the sheet ID identification mark is formed by forming a metal deposition film. 16. The apparatus according to claim 1, wherein said panel ID identification mark is a heat-resistant label.
The production management method according to any one of the above. 17. An FP is provided on the electrode terminal at the end of the display panel.
A panel ID identification mark provided in a convex shape with respect to the surface of a panel substrate in managing display device production having an FPC connection step of arranging C and pressing the end portion and the FPC with a pressure bonding head of a pressure bonding device. Adopt
7. The production management method according to claim 1, wherein the panel ID identification mark is provided outside a range in which the crimping head contacts the display panel during the crimping operation. 8. 18. A front panel substrate and a rear panel are overlapped and bonded at least at a display portion, and an FPC is crimp-connected to an end of one of the two substrates which protrudes from an end surface position of the other substrate. The display device, wherein the panel ID identification mark is provided at a corner of a front panel substrate. 19. A front panel substrate and a rear panel are overlapped and bonded at least at a display portion, and an FPC is crimp-connected to an end protruding from an end surface position of one of the two substrates. In the plasma display panel according to the present invention, the panel ID identification mark is provided in an area where the white dielectric layer of the rear panel substrate is attached.