JP2001251028A - Power supply wiring method and power supply wiring device for electronic equipment - Google Patents

Abstract

(57) [Problem] To provide a power supply pattern for supplying power to a printed circuit board having a large current capacity, the thickness and width of the power supply pattern become large, so that the size of the printed circuit board becomes large. SOLUTION: In a power supply wiring structure of an electronic device for supplying power via a power supply pattern 2 to a printed circuit board 1 having a large current capacity, a plus side conductive plate formed of a conductive material and soldered to the printed circuit board 1 Since the power supply pattern 2 is formed by the third and negative side conductive plates 4 and the insulator 5 sandwiched between the conductive plates 3 and 4, the printed circuit board 1 has a large current capacity without increasing the size. 1 can be supplied with power.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power supply wiring method and a power supply wiring device for an electronic device in which power supply wiring is stabilized.

[0002]

2. Description of the Related Art Conventionally, power supply wiring devices for electronic equipment include:
For example, the one shown in FIG. 5 is known.

That is, a plus side c and a minus side d of a power supply pattern b are arranged side by side on a printed circuit board a on which electronic components and the like are mounted.
, And the printed circuit board a is fixed to a housing (not shown) of the electronic device by a mounting screw f via a conductive boss e.

[0004]

However, in the conventional power supply wiring device, since a power supply pattern b on the plus side c and the minus side d is formed on the surface of the printed circuit board a, a large amount of current is supplied. It is necessary to increase the thickness and width of the positive side c and the negative side d of the power supply pattern b in accordance with the flowing current, and as a result, the printed circuit board a becomes large, which is an obstacle to miniaturization of electronic equipment. Becoming
There were problems such as the inability to stably supply a large current.

[0005] The present invention is to solve such a conventional problem,
It is an object of the present invention to provide a power supply wiring method and a power supply wiring device for an electronic device which can supply a large current stably without increasing the size of a printed circuit board and have high reliability.

[0006]

A power supply wiring method for an electronic device according to the present invention is a power supply wiring method for an electronic device for supplying power to a printed circuit board having a large current capacity through a power supply pattern, and is made of a conductive material. A power supply pattern was formed on the printed circuit board by sandwiching an insulator between a plus-side conductive plate and a minus-side conductive plate and soldering the plus-side conductive plate and the minus-side conductive plate to the printed circuit board. Things.

According to the above-mentioned method, a part of the plus side conductive plate is inserted into the plus side conductive plate mounting hole opened in the printed circuit board, and a part of the minus side conductive plate is inserted into the minus side conductive plate mounting hole. Since the power supply pattern is assembled by soldering, the assembling work can be performed easily and in a short time.

Further, since the assembled power supply pattern allows a large current to flow through the positive side conductive plate and the negative side conductive plate, power can be stably supplied even to a printed circuit board having a large current capacity. By forming a three-dimensional power supply pattern on a printed circuit board, power can be supplied to a printed circuit board having a large current capacity without increasing the size of the printed circuit board.

A power supply wiring device for an electronic device according to the present invention is a power supply wiring structure for an electronic device for supplying power via a power supply pattern to a printed circuit board having a large current capacity, the power supply wiring device being formed of a conductive material, and A power supply pattern is formed by a plus-side conductive plate and a minus-side conductive plate soldered to the substrate and an insulator sandwiched between these conductive plates.

According to the above configuration, a large current can be supplied to the positive conductive plate and the negative conductive plate of the power supply pattern, so that power can be supplied stably even on a printed circuit board having a large current capacity, and the printed circuit can be printed. By forming the power supply pattern three-dimensionally on the board, power can be supplied to the printed board having a large current capacity without increasing the size of the printed board.

A power supply wiring method for an electronic device according to the present invention is a power supply wiring method for an electronic device in which power is supplied to a printed circuit board having a large current capacity via a power supply pattern, wherein a plurality of plate mounting members made of a conductive material are provided. A plus-side conductive plate made of a conductive material, which is soldered to the plus-side conductive plate mounting hole and the minus-side conductive plate mounting hole of the printed circuit board and soldered to the plus-side conductive plate mounting hole; And a power supply pattern is formed by mounting a negative side conductive plate on a plate mounting member soldered to the negative side conductive plate mounting hole.

According to the above method, after the plate mounting member is soldered to the printed circuit board in advance, the plus side conductive plate and the minus side conductive plate can be mounted to each plate mounting member. Therefore, the plate mounting member is soldered to the printed circuit board. When soldering, the heat of the solder does not escape to each conductive plate side, which completes the soldering in a short time, thus improving workability and reliably soldering the plate mounting member to the printed circuit board. The performance is also improved.

Further, since a large current can be passed through the conductive plate on the positive side and the conductive plate on the negative side of the power supply pattern, power can be supplied stably even on a printed circuit board having a large current capacity. By forming the power supply pattern three-dimensionally, power can be supplied to a printed circuit board having a large current capacity without increasing the size of the printed circuit board.

A power supply wiring device for an electronic device according to the present invention is a power supply wiring device for an electronic device for supplying power via a power supply pattern to a printed circuit board having a large current capacity. A plurality of plate mounting members soldered to the side conductive plate mounting hole and the negative side conductive plate mounting hole, respectively, and a positive side made of a conductive material mounted to the plate mounting member soldered to the positive side conductive plate mounting hole. A power supply pattern is formed by a conductive plate and a minus conductive plate made of a conductive material attached to a plate attaching member soldered to the minus conductive plate attaching hole.

According to the above configuration, a large current can be supplied to the positive conductive plate and the negative conductive plate of the power supply pattern, so that power can be supplied stably even on a printed circuit board having a large current capacity, and the printed circuit can be printed. By forming the power supply pattern three-dimensionally on the board, power can be supplied to the printed board having a large current capacity without increasing the size of the printed board.

[0016]

FIG. 1 shows a first embodiment of the present invention.
This will be described in detail with reference to FIG.

A plurality of electronic components (not shown) for realizing the functions of the electronic device are mounted on a printed circuit board 1 housed in a housing of the electronic device (not shown). Power is supplied via the pattern 2.

The power supply pattern 2 comprises a strip-shaped positive conductive plate 3 made of a conductive material and a negative conductive plate 4 of the same material and the same shape, between the positive conductive plate 3 and the negative conductive plate 4. , An insulator 5 formed in the shape of a prism is interposed, and the insulator 5 is sandwiched between the conductive plates 3 and 4.

The positive conductive plate 3 and the negative conductive plate 4 are provided with a plurality of heat insulating holes 3a and 4a at intervals in the longitudinal direction.

The heat insulating holes 3a, 4a are formed by elongated holes in the longitudinal direction of the conductive plates 3, 4, and below the heat insulating holes 3a, 4a, the conductive plates 3, 4a are formed.
Legs 3b and 4b for soldering the printed circuit board 4 to the printed circuit board 1 are projected.

In the power supply pattern installation portion of the printed circuit board 1, a positive side conductive plate mounting hole 1a consisting of a long hole is provided.
And the negative side conductive plate mounting hole 1b is connected to the leg 3b,
4b, the legs 3b of the positive-side conductive plate 3 are provided in the positive-side conductive plate mounting holes 1a.
And the negative side conductive plate mounting hole 1b
, The leg 4b of the negative side conductive plate 4 is inserted,
By soldering the legs 3b and 4b to the printed circuit board 1, respectively,
Is fixed.

The corners of the printed circuit board 1 are fixed to the inner bottom of the housing by mounting screws 7 via bosses 6 made of a conductor.

Next, the operation of the above-described power supply wiring structure will be described. When power is supplied to the printed circuit board 1 having a large current capacity, a power supply wiring structure capable of supplying a large current to the power supply pattern 2 is required.

Therefore, in the first embodiment of the present invention, the power supply pattern 2 is formed by sandwiching the insulator 5 between the plus side conductive plate 3 and the minus side conductive plate 4, and the leg of each of the conductive plates 3 and 4 is formed. The portions 3b and 4b are inserted into the plus side conductive plate mounting hole 1a and the minus side conductive plate mounting hole 1b of the printed circuit board 1, respectively, and soldered to the printed circuit board 1 from the back side of the printed circuit board 1.

At this time, the heat of the solder is applied to the legs 3b, 4b, but the heat insulating holes 3a, 4 near the legs 3b, 4b.
a is open and the heat applied to the legs 3b and 4b
Since the escape from the heat insulating holes 3a and 4a to the entire conductive plates 3 and 4 is prevented, the conductive plates 3 having a large heat capacity are prevented.
4, the soldering is completed in a short time, the workability is good, and the legs 3b, 4b can be securely soldered to the printed circuit board 1, so that the reliability is improved.

The printed circuit board 1 assembled as described above is used by being fixed to the inner bottom surface of the housing or the like with mounting screws 7 via the bosses 6. 4, a large current can flow through the printed circuit board 1 having a large current capacity.
Power can be supplied stably, and by forming the power supply pattern 2 three-dimensionally on the printed circuit board 1, it is possible to cope with the printed circuit board 1 having a large current capacity without increasing the size of the printed circuit board 1. become.

FIGS. 3 and 4 show a power supply wiring device according to a second embodiment of the present invention, which will be described below.

The same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In the second embodiment, the plus side conductive plate 3 and the minus side conductive plate 4 are parallel to each other,
In addition, plate mounting members 8 and 9 which are arranged in a plane at regular intervals and are formed in a substantially U-shape in the longitudinal direction of the conductive plates 3 and 4 are provided.

When assembling the power supply pattern 2, first, the leg portions 8a, 9a of the plate mounting members 8, 9 are inserted into the plus side conductive plate mounting hole 1c and the minus side conductive plate mounting hole 1d opened in the printed circuit board 1, respectively. Is inserted from above, and the ends of the legs 8 a and 9 a are soldered to the printed circuit board 1 from the back side of the printed circuit board 1.

At this time, since the plus-side conductive plate 3 and the minus-side conductive plate 4 are not yet mounted on each of the plate mounting members 8 and 9, the heat of the solder does not escape to the respective conductive plates 3 and 4. Thereby, the soldering is completed in a short time, the workability is good, and the legs 8a, 9
Since a can be reliably soldered to the printed circuit board 1, the reliability is also improved.

After the plate mounting members 8 and 9 are soldered to the printed circuit board 1 as described above, the plus side conductive plate 3 is attached to the plate attaching member 8 soldered to the plus side conductive plate mounting hole 1c, and the minus side conductive plate 3 is attached. The minus conductive plate 4 is placed on a plate mounting member 9 soldered to the conductive plate mounting hole 1d, and the conductive plates 3, 4 are fixed to the plate mounting members 8, 9 by a fixing tool 10 such as a screw. Although the printed circuit board 1 is used by fixing it to the inner bottom surface of the housing or the like with the mounting screws 7 via the bosses 6, even in the case of the printed circuit board 1 having a large current capacity, the power Can be supplied and the power supply pattern 2 is formed three-dimensionally on the printed circuit board 1 so that the current capacity can be increased without increasing the size of the printed circuit board 1. It is possible to accommodate a large printed circuit board 1.

[0033]

According to the present invention, as described in detail above, an insulator is sandwiched between a positive conductive plate and a negative conductive plate made of a conductive material, and the positive conductive plate and the negative conductive plate are connected to each other. Since the power supply pattern was formed on the printed circuit board by soldering to the printed circuit board, a part of the plus side conductive plate was inserted into the plus side conductive plate mounting hole opened in the printed circuit board, Since the power supply pattern can be assembled by soldering a part of the negative side conductive plate to the plate mounting hole, the assembling operation can be performed easily and in a short time.

Further, the assembled power supply pattern allows a large current to flow through the positive side conductive plate and the negative side conductive plate, so that power can be supplied stably even on a printed circuit board having a large current capacity. By forming a three-dimensional power supply pattern on a printed circuit board, power can be supplied to a printed circuit board having a large current capacity without increasing the size of the printed circuit board.

Further, a plurality of plate mounting members made of a conductive material are soldered to the plus side conductive plate mounting holes and the minus side conductive plate mounting holes of the printed circuit board, and are soldered to the plus side conductive plate mounting holes. Since the plus side conductive plate made of a conductive material was attached to the plate attaching member, and the minus side conductive plate was attached to the plate attaching member soldered to the minus side conductive plate attaching hole, the power supply pattern was formed. After soldering the plate mounting member to the printed circuit board, the plus side conductive plate and the minus side conductive plate can be mounted on each plate mounting member. It does not escape to the conductive plate side, To short time soldering is completed I, on good workability, because it can soldered reliably plate mounting member to the printed circuit board, reliability is improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a power supply wiring structure of an electronic device according to a first embodiment of the present invention.

FIG. 2A is a partially enlarged perspective view of an assembled state showing a power supply wiring structure of the electronic apparatus according to the first embodiment of the present invention, and FIG. 2B is an enlarged view of a dashed line in FIG. Front view

FIG. 3 is an exploded perspective view showing a power supply wiring structure of an electronic device according to a second embodiment of the present invention.

FIG. 4 is an assembled perspective view showing a power supply wiring structure of an electronic device according to a second embodiment of the present invention;

FIG. 5 is a perspective view showing a power supply wiring structure of a conventional electronic device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 1a, 1c Positive side conductive plate mounting hole 1b, 1d Minus side conductive plate mounting hole 2 Power supply pattern 3 Positive side conductive plate 3a Heat insulation hole 3b Leg 4 Minus side conductive plate 4a Heat insulation hole 4b Leg 5 Insulator 6 Boss 7 Mounting screw 8, 9 Plate mounting member 8a, 9a Leg 10 Fixing tool

Claims (4)

[Claims] 1. A power supply wiring method for an electronic device for supplying power to a printed circuit board having a large current capacity via a power supply pattern, wherein an insulator is provided between a positive side conductive plate and a negative side conductive plate made of a conductive material. A power supply wiring method for an electronic device, wherein a power supply pattern is formed on the printed circuit board by sandwiching and soldering the plus side conductive plate and the minus side conductive plate to the printed circuit board. 2. A power supply wiring device for an electronic device for supplying power to a printed circuit board having a large current capacity through a power supply pattern, wherein the plus side conductive plate is formed of a conductive material and soldered to the printed circuit board. A power supply wiring device for electronic equipment, wherein a power supply pattern is formed by a negative conductive plate and an insulator sandwiched between the conductive plates. 3. A power supply wiring method for an electronic device for supplying power to a printed circuit board having a large current capacity via a power supply pattern, wherein a plurality of plate mounting members made of a conductive material are connected to a positive conductive plate of the printed circuit board. A positive conductive plate made of a conductive material is mounted on the plate mounting member soldered to the mounting hole and the negative conductive plate mounting hole and soldered to the positive conductive plate mounting hole, and a negative conductive plate is mounted. A power supply wiring method for an electronic device, wherein a power supply pattern is formed by attaching a negative side conductive plate to a plate attachment member soldered to a hole. 4. A power supply wiring device of an electronic device for supplying power to a printed circuit board having a large current capacity via a power supply pattern, wherein the printed circuit board is formed of a conductive material, and a plus side conductive plate mounting hole and a minus side of the printed circuit board are provided. A plurality of plate mounting members each soldered to the side conductive plate mounting hole; a positive side conductive plate made of a conductive material mounted on the plate mounting member soldered to the positive side conductive plate mounting hole; A power supply wiring device for an electronic device, wherein a power supply pattern is formed by a negative side conductive plate made of a conductive material mounted on a plate mounting member soldered to a conductive plate mounting hole.