JP2001244698A - Circuit board and lead wiring method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To significantly reduce possibility of erroneous wiring, related to a circuit board where a lead is wired along a surface and the lead is fixed on the surface, as well as a lead wiring method for wiring the lead on the circuit board. SOLUTION: Lines 321, 322, and 323 are formed for guiding a wiring route on a circuit board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board on which leads are wired along a surface and the leads are fixed to the surface, and a lead wiring method for laying the leads on the circuit board. About.

[0002]

2. Description of the Related Art In various devices having built-in electronic circuits, lead wires may be fixed along the surface of a circuit board.

[0003] As an example, for example, a strobe light emitting portion in a compact camera is required to transmit considerably large power, and a lead wire having a thickness corresponding to the large power is wired. If it is wired in an uncontrolled place, there may be a problem of noise generation and a problem of competition with other parts. It is conceivable that wiring is performed on a predetermined route on a circuit board on which a control circuit for controlling light emission is mounted, and the circuit is directly fixed to the circuit board.

[0004]

In order to perform such a task, usually, a work instruction is written with an instruction to wire which lead wire at which position on which circuit board, Will lead wires on the circuit board according to the work instruction.

[0005] However, even if such a work instruction is given in the form of an illustration and is as easy to understand as possible, there is a possibility that a wiring error may occur. In particular, if there are a plurality of lead wires to be wired, the work becomes complicated. In addition, there is a problem that the possibility of a wiring error is significantly increased.

An object of the present invention is to provide a circuit board and a lead wiring method in which the possibility of such a wiring error is greatly reduced.

[0007]

A circuit board according to the present invention that achieves the above object is a circuit board on which leads are wired along a surface and the leads are fixed to the surface. It is characterized by having a guide display formed along a route to which the lead wire is fixed and showing a wiring route of the lead wire.

A circuit board according to the present invention is a circuit board in which a plurality of lead wires are wired along a surface and fixed to the surface, and each of the plurality of lead wires on the surface is fixed. And a guide display in a form in which each of the plurality of lead wires is formed along each of the plurality of paths and which can identify each other.

Here, in the circuit board of the present invention, it is preferable that the guide display is a guide display having a shape sandwiching the wiring route of the lead wire.

[0010] A lead wire wiring method according to the present invention for achieving the above object is a circuit board on which leads are wired along a surface and the leads are fixed to the surface. Is formed along the path where is fixed,
A circuit board having a guide display indicating a wiring route of a lead wire, and a lead wire wired along the guide display on the circuit board surface are prepared, and the lead wire is provided on the circuit board surface,
Wiring is performed along the guidance display, and the wired lead wires are fixed.

Further, according to the lead wire wiring method of the present invention, there is provided a circuit board on which leads are wired along a surface and the leads are fixed to the surface, and a path on the surface to which the leads are fixed. Prepare a circuit board having a guide display indicating the wiring route of the lead wire formed along and a lead wire wired along the guide display on the surface of the circuit board. The adhesive tape may be attached, and the lead wire may be wired on the surface of the circuit board along the guidance display.

Here, in the lead wire wiring method of the present invention, a mark for positioning the lead wire to be wired on the surface of the circuit board with a guide display indicating a wiring route of the lead wire formed on the surface of the circuit board. Prepare the lead wire marked with, and when wiring the lead wire to the circuit board surface,
It is preferable that the mark of the lead wire is aligned with a predetermined position of the guide display, and the lead wire is wired on the surface of the circuit board along the guide display.

According to the present invention, since the guidance of the wiring route is formed on the circuit board itself, wiring mistakes can be greatly suppressed and a highly efficient wiring operation can be performed.

[0014]

Embodiments of the present invention will be described below.

FIG. 1 is a front view of a camera having a built-in circuit board as one embodiment of the present invention and a lead wire wired based on a lead wiring method as one embodiment of the present invention. It is an external appearance perspective view seen from diagonally.

At the front center of the camera 10, a zoom lens barrel 11 having an optical zoom lens 11a is provided. An AF light-emitting window 12 having a built-in light-emitting element for autofocus (AF), and a light emitted from the AF light-emitting window 12 and reflected by a subject and received back are provided at an upper front portion of the camera 10. An AF light receiving window 13 having a built-in light receiving element is provided.

Further, in front of the camera 10, a finder window 14 and an AE light receiving window 15 for guiding light to a built-in AE sensor for exposure adjustment are also provided. In addition, a self-window 16 having a built-in light emitting element for emitting light during self-timer shooting and a self-timer slide switch 17 used for self-timer shooting are also provided.

A shutter button 18 is provided on the upper surface of the camera 10. As a shutter operated by the shutter button 18 of the camera 10, a program shutter whose aperture diameter increases with time during photographing is employed.

Further, a hop-up strobe light emitting section 19 is provided on the upper surface of the camera 10. By pushing down the head of the strobe light emitting unit 19, the strobe light emitting unit 19 is housed in the camera body and stops the operation of a not-shown strobe control circuit.

FIG. 2 is an external perspective view showing the camera shown in FIG.

On the back of the camera 10, there is provided a strobe switch 2 for hopping up a strobe light emitting portion 19 and for starting charging of a strobe main capacitor.
1, finder eyepiece window 22, and optical zoom lens 1
A zoom operation lever 23 for operating the camera 1a on the tele side (far side) or the wide side (close side) is provided.

FIG. 3 is a view showing a part of components of a strobe of the camera shown in FIGS.

FIG. 1 shows a part of a circuit board 30 on which a strobe light emitting section 19 also shown in FIGS. 1 and 2 and a strobe control circuit for controlling the strobe light emission are mounted.

A plurality of (here, three) lead wires 4 for sending power to the strobe light emitting unit 19 and sending a light emission trigger signal are provided on the strobe light emitting unit 19.
01, 402, and 403 are connected.

Further, on the circuit board 30, some circuit parts 311 and 312 for controlling the light emission of the strobe light are shown.
Along each wiring route of each of the lead wires 401, 402, and 403, a line 3 as a guide display of each wiring route is provided.
21, 322, 323 are shown.

The three lead wires 401, 402, and 403 are respectively connected to the lines 321, 322, and 322 on the circuit board 30.
Marks 401a and 402 for alignment with H.323
a, 403a, and in the present embodiment, the respective marks 401a, 402a, 403a are marked with the respective lines 321, 32.
The lead wires 401, 402, and 403 are wired so as to be superimposed on the lines 321, 322, and 323, respectively, so as to coincide with the head positions 321a, 322a, and 323a of the circuit boards 30 and 32. Fixed.

FIG. 4 is a flowchart showing an example of a lead wire wiring method for wiring lead wires on a circuit board.
FIG. 5 is a diagram showing a cross section of a wiring portion when wiring is performed by the method shown in FIG. 4. FIG. 5 shows three lead wires 401 and 4.
The portion of the lead wire 401 of 02 and 403 is shown.

First, in step (a1) of FIG.
The circuit board 30 shown in FIG. 3 and the lead wire (in the example shown in FIG. 3, the lead wire 40 connected to the strobe light emitting portion 19)
1, 402, 403) are prepared. As shown in FIG. 3, the prepared circuit board 30 has lines 321, 322, and 32 as guide displays indicating the wiring routes of the lead wires.
On the other hand, on the lead wires 401, 402, and 403 wired on the circuit board 30, marks 401a, 402a, and 403a for alignment with a line as a guide display on the circuit board 30 are printed. Is attached.

The marks 401a, 402a, 403a
As described with reference to FIG. 3, in the present embodiment,
Although the rule is set so as to coincide with the end of the line as the guide display, a mark for matching the mark of the lead wire may be provided on the circuit board in correspondence with the line as the guide display.

In step (a2) of FIG. 4, the mark 401a of each lead wire is placed on the lines 321, 322, and 323 of the circuit board 30 prepared as described above, as the guide display of the wiring route of the lead wire. , 402a, 403a to the ends 321a, 322 of the respective lines 321, 322, 323.
a, 323a.

Thereafter, in step (a3) of FIG. 4, the wired lead wires 401, 402, and 403 are fixed on the circuit board 30 with the adhesive 330 (see FIG. 5).

The wiring work of step (a2) and step (a3) in FIG.
02 and 403 may be performed one by one.

FIG. 6 is a flowchart showing another example of a lead wiring method for wiring leads on a circuit board.
Is a sectional view of a wiring portion when wiring is performed by the method shown in FIG.
(The part of one lead wire).

Step (b1) in FIG. 6 is the same as step (a1) in FIG. 4, and a detailed description thereof will be omitted.

In step (b2) of FIG. 6, the double-sided adhesive tape 331 (see FIG. 7) is attached to the prepared circuit board 30 on the lines 321, 322, and 323 as the guide display of the wiring route of the lead wire. Be worn. When the double-sided pressure-sensitive adhesive tape 331 is made of an opaque material, the line 3
It is preferable that the double-sided adhesive tape 331 is made of a transparent or translucent material, because 21, 32 and 323 become invisible. However, when the lines 321, 322, and 323 become invisible after the double-sided adhesive tape 331 is attached, the double-sided adhesive tape 331 can be used as a guide for the wiring path.
Is not necessarily made of a transparent or translucent material, but may be made of an opaque material.

In step (b3) of FIG. 6, leads are wired on the double-sided adhesive tape adhered on the circuit board in step (b2), and the leads are placed on the circuit board by the double-sided adhesive tape. Fixed.

Hereinafter, various aspects of the guide display along the wiring route on the circuit board will be described.

FIG. 8 is a diagram showing a second example of the guidance display on the circuit board (see FIG. 3 for the first example).

Here, each line 321, 322, 32
3 corresponding to numbers 321b,
322b and 323b are printed. For example, since the lines 321, 322, and 323 can be distinguished from each other in this manner, it is possible to easily associate the lines with the lead wires, and to further reduce wiring errors.

In identifying each of the lines 321, 322, and 323, a number or the like may be assigned as shown in FIG. 8, but instead of this, each line may be adjusted to match the color of each lead wire. The colors 321, 322, and 323 may be mutually changed.

FIG. 9 is a diagram showing a third example of the guidance display on the circuit board.

Here, lines 32 having different thicknesses are used.
1,322,323 are shown. The thickness of each line is associated with the thickness of each lead wire.

As described above, the lines may be distinguished from each other by changing the thickness of each line.

FIG. 10 is a diagram showing a fourth example of the guidance display on the circuit board. Here, a line corresponding to one lead wire is drawn by a double line.

FIG. 11 is a sectional view showing a wiring portion of a lead wire when the double line shown in FIG. 10 is formed on a circuit board.

Line 3 as a double line on circuit board 30
When 21 is formed, a slight depression extending along the wiring path is formed at the center of the double line of the double-sided adhesive tape 331 adhered thereon, thereby facilitating the wiring of the lead wire 401. At the same time, the bonding area between the lead wire 401 and the double-sided adhesive tape 331 is increased, and more stable bonding is possible.

FIG. 12 is a diagram showing a fifth example of the guide display on the circuit board.

FIG. 12 shows lines 321, 322, and 323 formed by dots as a guide display of the wiring route.

FIG. 13 is a view showing a sixth example of the guide display on the circuit board.

FIG. 13 shows lines 321, 322 and 323 as double lines formed by dots.

The guide display need not be a continuous line as shown in these examples, but may be formed by dots as shown in FIGS. 12 and 13, or may be formed in other forms. In other words, it is only necessary that the guidance display indicates the wiring route of the lead wire.

Further, the method of forming the guide display on the circuit board may be by the silk printing as described above, but is not limited thereto, and may be a form in which the guide display is formed on the circuit board. I just need.

[0053]

As described above, according to the present invention, the wiring of the lead wires on the circuit board is facilitated, the wiring error is greatly reduced, and the wiring workability is improved.

[Brief description of the drawings]

FIG. 1 shows a camera having a built-in circuit board as one embodiment of the present invention and a lead wire wired based on a lead wiring method as one embodiment of the present invention.
It is an external appearance perspective view seen from the front diagonal.

FIG. 2 is an external perspective view showing the camera of FIG.

FIG. 3 is a diagram showing a part of components of a strobe of the camera shown in FIGS. 1 and 2;

FIG. 4 is a flowchart illustrating an example of a lead wire wiring method for wiring lead wires on a circuit board.

FIG. 5 is a diagram showing a cross section of a wiring portion when wiring is performed by the method shown in FIG. 4;

FIG. 6 is a flowchart showing another example of a lead wire wiring method for wiring lead wires on a circuit board.

FIG. 7 is a sectional view of a wiring portion when wiring is performed by the method shown in FIG. 6;

FIG. 8 is a diagram showing a second example of the guidance display on the circuit board.

FIG. 9 is a diagram showing a third example of the guidance display on the circuit board.

FIG. 10 is a diagram showing a fourth example of the guidance display on the circuit board.

11 is a cross-sectional view showing a wiring portion of a lead wire when the double line shown in FIG. 10 is formed on a circuit board.

FIG. 12 is a diagram showing a fifth example of the guidance display on the circuit board.

FIG. 13 is a diagram showing a sixth example of the guidance display on the circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Camera 19 Strobe light emission part 21 Strobe switch 30 Circuit board 311, 312 Circuit parts 321, 322, 323 Line 321a, 322a, 323a Head position 330 Adhesive 331 Double-sided adhesive tape 401, 402, 403 Lead wire 401a, 402a, 403a Mark

Claims (6)

[Claims] 1. A circuit board on which a lead wire is wired along a surface and the lead wire is fixed to the surface, the circuit board being formed along a path on the surface where the lead wire is fixed.
A circuit board having a guide display indicating a wiring route of the lead wire. 2. A circuit board, on which a plurality of lead wires are wired along a surface and fixed to the surface, wherein:
A guide display is provided along each of the paths to which the plurality of leads are fixed, the guide indicating the respective wiring paths of the plurality of leads, and in a form capable of identifying each other. Circuit board. 3. The circuit board according to claim 1, wherein the guidance display is a guidance display having a shape sandwiching a wiring route of a lead wire. 4. A circuit board on which a lead wire is wired along a surface and the lead wire is fixed to the surface, the circuit board being formed along a path on the surface where the lead wire is fixed.
A circuit board having a guide display indicating a wiring route of the lead wire, and a lead wire wired along the guide display on the circuit board surface are prepared, and the lead wire is provided on the circuit board surface by the guide. A lead wiring method, comprising: wiring according to a display; and fixing the wired leads. 5. A circuit board on which a lead wire is wired along a surface and the lead wire is fixed to the surface, wherein the circuit board is formed along a path on the surface where the lead wire is fixed.
A circuit board having a guide sign indicating a wiring route of the lead wire, and a lead wire wired along the guide sign on the surface of the circuit board are provided, and the guide sign on the surface of the circuit board is double-sided adhesive tape on the guide sign. A lead wire is wired on the surface of the circuit board along the guide display. 6. A lead wire provided with a mark for alignment with a guide sign indicating a wiring route of the lead wire formed on the surface of the circuit board is prepared as a lead wire wired on the surface of the circuit board. When wiring the lead wire on the surface of the circuit board, align the mark of the lead wire with a predetermined position of the guide display, and wire the lead wire on the surface of the circuit board along the guide display. The lead wire wiring method according to claim 4 or 5, wherein