JP2001244115A - Chip-type composite electronic component and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide a chip-type composite electronic component excellent in mass productivity. SOLUTION: The insulating member 11, an internal conductor 12 formed inside the insulating member 11, and one end 13a of the internal conductor 12 are electrically connected, and the insulating member 11 is provided.
A first external electrode 14 formed on a part of the surface of the insulating member 11 and the other end 13b of the internal conductor 12 on another surface of the insulating member 11; It comprises a resistor 15 formed after the provision of 11 and a second external electrode 16 electrically connected to the resistor 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type composite electronic component used for various electronic devices and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, an LR series circuit in which an inductor and a resistor are connected in series has been used for the purpose of suppressing unnecessary electromagnetic waves generated from an electronic device, particularly for suppressing waveform distortion. In realizing an LR series circuit on a circuit board, with the recent miniaturization of electronic devices, it is required to reduce the mounting area on the circuit board by forming the LR series circuit in a single component. . Accordingly, a component in which the elements of the inductor and the resistor are connected in series and integrated has been put to practical use.

Conventionally, as such a chip-type composite electronic component, one described in Japanese Patent Application Laid-Open No. 8-17637 is known.

FIG. 5 is a sectional view showing a conventional chip-type composite electronic component.

[0005] Here, as a conventional chip-type composite electronic component, a component in which the above-described elements of an inductor and a resistor are connected in series and integrated will be described.

In FIG. 5, reference numeral 1 denotes a square plate-shaped ceramic substrate, on which a prismatic magnetic layer 2 is formed. Three
Is an internal conductor formed of a thick film conductor, which is formed inside the magnetic layer 2, and this internal conductor 3 becomes an inductor portion. Reference numeral 4 denotes a shrinkage suppression layer, which is formed on the upper surface of the magnetic layer 2, and a resistor layer 5 is provided on the upper surface of the shrinkage suppression layer 4. Note that a part of the resistor layer 5 is electrically connected to the end of the internal conductor 3, and the other part is electrically connected to the connection electrode 6. Also, due to the difference in shrinkage between the magnetic layer 2 and the resistor layer 5 and the difference in shrinkage between the magnetic body 2 and the ceramic substrate 1, the amount of shrinkage differs between the upper and lower surfaces of the magnetic body 2 during firing. In addition, there is a possibility that structural defects such as warpage of parts and cracks in each contact portion may occur, and the shrinkage suppressing layer 4 is formed to suppress this.

Reference numeral 7 denotes an external electrode formed on both end surfaces of the magnetic layer 2 and electrically connected to the other end of the internal conductor 3 (the end not connected to the resistor layer 5) and the connection electrode 6, respectively. It is connected. A protective film 8 is formed so as to cover at least the resistor layer 5 for the purpose of preventing deterioration of the resistor layer 5 such as oxidation.

Hereinafter, a method of manufacturing the conventional chip-type composite electronic component configured as described above will be described.

First, a magnetic layer 2 in which an internal conductor 3 is formed is provided on the upper surface of a square plate-shaped ceramic substrate 1.

Next, a shrinkage suppression layer 4 is formed on the upper surface of the magnetic layer 2, and a resistor layer 5 and a connection electrode 6 are formed on the upper surface of the shrinkage suppression layer 4. At this time, a part of the resistor layer 5 is electrically connected to the end of the internal conductor 3, and the other part is electrically connected to the connection electrode 6.

Next, a protective film 8 is provided on the upper surface of the resistor layer 5 in order to prevent the resistor layer 5 from deteriorating.

Next, external electrodes 7 are formed on both end surfaces of the magnetic layer 2, and one is connected to the other end of the internal conductor 3, and the other is connected to the resistor layer 5 via the connection electrode 6.

Finally, the integrated laminate obtained as described above is fired to obtain a conventional chip-type composite electronic component.

In the conventional chip-type composite electronic component configured as described above, an inductor is formed by providing the internal conductor 3 in the magnetic layer 2, and the inductor and the resistor layer 5 are formed.
Are connected in series to form an LR series circuit, and are further connected to the outside by solder or the like via the external electrodes 7 to function as an LR series composite component.

[0015]

However, the conventional chip-type composite electronic component configured as described above has a large problem in mass productivity.

That is, since there is a possibility that a structural defect may occur due to a difference in the amount of shrinkage between the upper surface and the lower surface of the magnetic body 2 during baking as described above, it is necessary to provide the shrinkage suppressing layer 4. This is because its structure becomes very complicated and is not suitable for mass production.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a chip-type composite electronic component excellent in mass productivity and a method of manufacturing the same.

[0018]

In order to achieve the above object, a chip-type composite electronic component according to the present invention comprises an insulating member, an internal conductor formed inside the insulating member, and one end of the internal conductor. A first external electrode formed on a part of the surface of the insulating member, and electrically connected to another end of the internal conductor on another surface of the insulating member, And a resistor formed after the insulating member is provided, and a second external electrode electrically connected to the resistor. According to this configuration, mass production is achieved. It is possible to provide a chip-type composite electronic component having excellent performance.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to an insulating member, an internal conductor formed inside the insulating member, and electrically connected to one end of the internal conductor; A first external electrode formed on a part of the surface of the insulating member, and the insulating member is electrically connected to another end of the internal conductor on another surface of the insulating member. It is characterized by comprising a resistor formed after being provided, and a second external electrode electrically connected to the resistor. According to this configuration, the insulating member and the shrinkage ratio are reduced. Since different resistors are provided after the formation of the insulating member, no difference in the amount of shrinkage occurs, thereby eliminating the need for a shrinkage suppression layer, thereby simplifying the structure and making the chip-type composite electronic component excellent in mass productivity. Can be provided.

According to a second aspect of the present invention, there is provided an insulating member, an internal conductor formed inside the insulating member, and one end surface of the internal conductor electrically connected to one end of the internal conductor. The formed first external electrode and a resistor formed on the other end of the insulating member so as to be electrically connected to the other end of the internal conductor, and after the insulating member is provided. And a second external electrode electrically connected to the resistor. According to this configuration, the resistor having a contraction rate different from that of the insulating member forms the insulating member. Because it is provided later, there is no difference in the amount of shrinkage,
This eliminates the need for the shrinkage suppression layer, thereby simplifying the structure and providing a chip-type composite electronic component with excellent mass productivity. In addition, since the resistor is formed on the end surface of the insulating member, the chip This has the effect that the height of the composite electronic component can be reduced.

According to a third aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: laminating an insulating member and an internal conductor; firing the insulating member; and forming one end of the internal conductor on one end surface of the fired insulating member. Forming a resistor so as to be electrically connected; and forming a first external electrode on another end surface of the insulating member so as to be electrically connected to another end of the inner conductor. And a step of forming a second external electrode so as to be electrically connected to the resistor. According to this manufacturing method, after firing the insulating member, Since a resistor having a different shrinkage ratio from the insulating member is formed, a structural defect due to a difference in shrinkage amount after firing does not occur, thereby eliminating the need for a shrinkage suppression layer, thereby simplifying the structure. , A chip-type composite electronic component with excellent mass productivity Those having an effect of being able to provide.

Hereinafter, a chip type composite electronic component according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of a chip type composite electronic component according to an embodiment of the present invention.

In FIG. 1, reference numeral 11 denotes a magnetic material, which is a substantially rectangular parallelepiped insulating member made of ferrite ceramic, and has a spiral internal conductor 12 as an inductance element formed therein. In addition, as long as a predetermined inductance value is obtained, the internal conductor 12 may not be spiral but may be spiral, meandering, or linear. Further, the shape of the magnetic body (insulating member) 11 may be another shape such as a columnar shape depending on productivity, user's demand, and the like. 1
Reference numeral 3 denotes a lead electrode, which is formed at both ends of the internal conductor 12. One of the lead electrodes 13 (one end of the internal conductor 12) 13a is connected to the first external electrode 14 and the other (the other end of the internal conductor 12). One end 13 b is electrically connected to the resistor 15. Note that the first external electrode 14 and the resistor 15 are formed on opposite end faces of the magnetic body 11, respectively. Reference numeral 16 denotes a second external electrode provided on the end face of the magnetic body 11 on which the resistor 15 is formed so as to be electrically connected to the resistor 15 and to cover the resistor 15.

Therefore, the chip-type composite electronic component according to the embodiment of the present invention has an inductor portion (L) 17 made of the magnetic material 11 on which the internal conductor 12 is formed, and a resistor 15.
And a resistance portion (R) 18 composed of

A method of manufacturing a chip-type composite electronic component according to an embodiment of the present invention configured as described above will be described below with reference to the drawings.

FIGS. 2 to 4 are views showing a method of manufacturing a chip-type composite electronic component according to an embodiment of the present invention.

FIGS. 2 and 4 are exploded perspective views, and FIG. 3 is a sectional view.

First, a ceramic green sheet 22 in which vertical and horizontal dividing grooves 21 are formed is manufactured using a ferrite-based ceramic material containing at least Ni, Zn, and Cu.

The area surrounded by the dividing groove 21 is 1
One chip-type composite electronic component.

Next, the ceramic green sheet 22
Green sheet 24 with conductor 23 printed on it
And a ceramic green sheet 2 in which a via hole 25 is formed by drilling a hole in the ceramic green sheet 22.
6 are manufactured.

Next, as shown in FIG. 2, a predetermined number of ceramic green sheets 22, 24, 26 are laminated.

At this time, the conductors 23 are
5 so that one independent spiral internal conductor 12 is formed in the area divided by the dividing groove 21. Then, ceramic green sheets 22 and 24 are provided above and below the internal conductor 12 so that the internal conductor 12 is not exposed. The number of the ceramic green sheets 22, 24, 26 to be laminated may be appropriately selected so as to obtain predetermined characteristics. At this time, the lead electrodes 13 are formed at both ends of the independent spiral internal conductor 12. Each ceramic green sheet 2
The layers 2, 24 and 26 become the magnetic body (insulating member) 11 by being laminated.

Next, the ceramic green sheets 22, 24, and 26 are divided along the dividing grooves 21, and the inductor portion 17 made of the individual magnetic material 11 on which one independent internal conductor 12 is formed is manufactured. Then, the magnetic body 11 is fired.

The structure of the inductor section 17 is shown in FIGS.

Next, a first external electrode 14 is applied to one end surface of the magnetic body 11 by applying a conductive paste so as to be electrically connected to one of the extraction electrodes 13 (one end of the internal conductor 12) 13a. It is formed by drying and firing.

Next, the other one of the extraction electrodes 13 (the inner conductor 12)
Is coated with a ruthenium oxide-based resistance paste so as to be electrically connected to the other end 13b of the resistor 1b.
5 is formed, and a resistance portion 18 is provided.

Thus, the resistance paste is applied, dried,
By firing, a predetermined resistance value can be reliably obtained. Of course, a predetermined resistance value can be obtained even with a low resistance value.

Further, since the resistor portion 18 can be obtained only by applying the resistor paste and baking once, it can be easily formed, thereby facilitating manufacture and securing excellent mass productivity.

Finally, the magnetic body 1 on which the resistor 15 is formed
1 so that it is electrically connected to the resistor 15
The second external electrode 16 is formed by applying a conductive paste, drying and baking so as to cover the resistor 15 to obtain a chip-type composite electronic component according to one embodiment of the present invention. Note that the surfaces of the first external electrode 14 and the second external electrode 16 are plated. Further, the first external electrode 14 and the second external electrode 16 may be formed simultaneously.

Therefore, in the chip-type composite electronic component according to the above-described embodiment of the present invention, the inductor portion 17 is formed by providing the internal conductor 12 in the magnetic layer 11, and the inductor portion 17 and the resistor 15 are formed. The LR series circuit is formed by connecting in series with the resistor portion 18 made of LR series, and further connected to the outside by solder or the like by the first external electrode 14 and the second external electrode 16. Function as

As described above, in the chip-type composite electronic component according to one embodiment of the present invention, the resistor 15 is
Since it is provided after the firing of No. 1, the shrinkage suppressing layer is not required, thereby obtaining an effect that the structure is simplified and the mass productivity is excellent.

That is, after the magnetic material (insulating member) 11 is fired and shrinkage is completed, the resistor 15 having a different shrinkage ratio from the magnetic material 11 is formed. This eliminates the need for a shrinkage suppression layer, and furthermore, since the resistor 15 is covered with the second external electrode 16, the resistor 15 does not deteriorate, thereby eliminating the need for a protective film. As a result, the structure is simplified. Of course, the inductor section 17
Is manufactured by a lamination method widely used in the production of multilayer chip inductors and the like.
It is possible to manufacture a chip-type composite electronic component only by adding the step of forming No. 5, and it can be said that mass productivity is excellent also from this aspect.

Further, after all the inductor portions 17 are manufactured, the magnetic material 11 on which the inductor portions 17 are formed is divided into individual pieces or strips in order to apply and bake a resistance paste. If the end faces are arranged in the same direction, the resistance paste can be simultaneously applied to the end faces of the respective magnetic bodies 11, thereby simplifying the manufacturing process.
Excellent mass productivity is obtained.

On the other hand, when the resistor is formed on a portion other than the end face of the magnetic material as in the conventional chip-type composite electronic component, the resistor is formed by mask printing or the like for each individual chip-type composite electronic component. Therefore, it is disadvantageous for mass production in terms of forming a resistor.

Further, since the resistor 15 is formed on the end face of the magnetic body 11, an effect that the height of the chip-type composite electronic component can be reduced can be obtained.

Further, since the shrinkage suppressing layer is not required, the height and the size can be reduced.

Further, since the resistor 15 and the second external electrode 16 are directly connected, a connection electrode is not required, whereby a predetermined resistance value can be obtained accurately (even if the resistance value is low).

The above-described chip-type composite electronic component according to the embodiment of the present invention includes an inductor portion (L) 17.
And the resistor (R) 18 composed of the resistor 15 are integrated so as to be in series. However, the inductor (L) 17 is replaced by a capacitor.
For example, the insulating member 11 is made of a dielectric material. The same effect can be obtained for the CR series composite component used as an electrode.

[0050]

As described above, the chip-type composite electronic component according to the present invention is provided with an insulating member, an internal conductor formed inside the insulating member, and electrically connected to one end of the internal conductor; A first external electrode formed on a part of the surface of the insulating member, and the insulating member is electrically connected to another end of the internal conductor on another surface of the insulating member. It is characterized by comprising a resistor formed after being provided, and a second external electrode electrically connected to the resistor. According to this configuration, the insulating member and the shrinkage ratio are reduced. Since different resistors are provided after the formation of the insulating member, no difference in the amount of shrinkage occurs, thereby eliminating the need for a shrinkage suppression layer, thereby simplifying the structure and making the chip-type composite electronic component excellent in mass productivity. Can be provided.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a chip-type composite electronic component according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing a method of manufacturing the chip-type composite electronic component.

FIG. 3 is a sectional view showing the method of manufacturing the chip-type composite electronic component.

FIG. 4 is an exploded perspective view showing a method for manufacturing the chip-type composite electronic component.

FIG. 5 is a cross-sectional view of a conventional chip-type composite electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Insulating member (magnetic material) 12 Internal conductor 13a One end of internal conductor 13b Other end of internal conductor 14 First external electrode 15 Resistor 16 Second external electrode

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01F 41/04 H01F 15/00 Z H01G 4/40 H01G 4/40 307A F-term (Reference) 5E033 AA18 AA25 BC01 BG01 BH02 5E062 FF01 FG01 FG07 5E070 AA05 AB02 BA12 CB03 CB13 CB17 CC01 EA01 5E082 AA01 AB03 DD02 EE04 EE35 FG06 FG26 GG10 GG26 GG28 JJ03 JJ05 JJ21 JJ23 LL02 LL03

Claims (3)

[Claims] 1. An insulating member, an inner conductor formed inside the insulating member, and a first electrode electrically connected to one end of the inner conductor and formed on a part of a surface of the insulating member. An external electrode, a resistor formed on the other surface of the insulating member so as to be electrically connected to the other end of the internal conductor, and provided after the insulating member is provided; and And a second external electrode electrically connected to the chip-type composite electronic component. 2. An insulating member, an internal conductor formed inside the insulating member, and a first external part electrically connected to one end of the internal conductor and formed on one end surface of the insulating member. An electrode, a resistor formed after the insulating member is provided, so as to be electrically connected to another end of the internal conductor on another end surface of the insulating member, and the resistor; A chip-type composite electronic component comprising: a second external electrode that is electrically connected. 3. A step of laminating an insulating member and an internal conductor, a step of firing the insulating member, and one end face of the fired insulating member electrically connected to one end of the internal conductor. Forming a first external electrode on the other end surface of the insulating member so as to be electrically connected to the other end of the internal conductor; and Forming a second external electrode so as to be electrically connected to the chip-type composite electronic component.