JP2001129994A - Ink jet head, method of manufacturing the same, and ink jet recording apparatus - Google Patents

Abstract

(57) Abstract: In an ink jet head including an actuator section having a piezoelectric element and a vibration plate, the adhesion between the piezoelectric element and the vibration plate is strengthened. SOLUTION: The ink jet head includes a pressure chamber component A in which a plurality of pressure chambers 2 are formed, and an actuator section B. The actuator section B includes an individual electrode 3 and a piezoelectric element 10 located above each of the pressure chambers 2 and a diaphragm / common electrode 11. An adhesion layer 12 is formed between the piezoelectric element 10 and the diaphragm / common electrode 11. The piezoelectric element 10 is formed of, for example, lead zirconate titanate, and the diaphragm / common electrode 11 is formed of chromium, molybdenum, tantalum, or the like. The adhesion layer 12 is formed of, for example, titanium (Ti). The adhesion layer 12 brings the piezoelectric element 10 and the diaphragm / common electrode 11 into close contact with each other to increase the adhesion. The thickness of the adhesion layer 23 is 100 ° or more,
Desirably, it is set to 400 ° or more.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet head used in a recording apparatus such as a printer, a word processor, a facsimile, etc., for recording using a piezoelectric effect of a piezoelectric element, a method of manufacturing the same, and an ink jet type having the ink jet head. It relates to a recording device.

[0002]

2. Description of the Related Art Conventionally, this type of ink jet head has a pressure chamber component having a pressure chamber for containing an ink liquid,
An actuator for discharging ink droplets from the pressure chamber. The actuator section includes a piezoelectric element, an individual electrode and a common electrode for applying a voltage to the piezoelectric element to contract and expand, and a diaphragm that is displaced by a piezoelectric effect of the piezoelectric element. Thereby, the ink droplet is ejected from the nozzle hole of the pressure chamber.

In order to improve the quality and speed of printing and printing, it is necessary to satisfy the conflicting demands of a large number of nozzles and a small size of an ink jet head. μm
A thin film of a certain degree is required.

[0004]

Therefore, the present applicant has
For example, a method for manufacturing an inkjet head shown in FIG. 11 is proposed.

That is, as shown in FIG. 1A, a substrate 100 made of MgO is prepared, and an electrode material 10 made of Pt is sequentially formed on the substrate 100 as shown in FIG.
1, and a piezoelectric material 102 comprising lead zirconate titanate
Are formed and laminated. Next, as shown in FIG. 3C, the electrode material 101 and the piezoelectric material 102 are etched to form a plurality (four in the figure) of individual electrodes 103 and piezoelectric elements 104. Subsequently, as shown in FIG. 5D, an insulating resin 105 such as polyimide is buried in the film portion removed by the etching, and the whole is flattened. Then, as shown in FIG. (C
The actuator 110 before the substrate 100 is removed is formed by depositing and laminating the common electrode / vibration plate 106 of r). Thereafter, as shown in FIG. 6F, the pressure chamber component 130 having the same number of pressure chamber openings 120 as the individual electrodes 103 and the actuator 11 before removing the substrate 100 are formed.
0 and the common electrode / vibration plate 106 positions the individual electrodes 103 and the piezoelectric elements 104 above the respective pressure chamber openings 120. Pressure chamber 1 covering the top opening of
09 so as to define the pressure chamber component 130 and the substrate 10.
The actuator 110 before the removal of 0 is bonded with an adhesive. Then, as shown in FIG. 3G, the substrate 100 located at the uppermost position is removed by etching to complete the ink jet head.

However, the present invention is not limited to the above-described method of manufacturing an ink jet head or the proposed method. In the case where a piezoelectric material and a diaphragm material are formed one upon another, the piezoelectric material and the diaphragm material may be formed of a film. Peeling sometimes occurred.

The present invention has been made in view of this point, and an object of the present invention is to prevent the separation between the piezoelectric material film and the diaphragm material film during the production of the ink-jet head so that the two films are not separated. Method for manufacturing an ink jet head capable of increasing adhesion, ink jet head having a piezoelectric element and a vibration plate formed of a piezoelectric material film and a diaphragm material film having such high adhesion, and ink jet having the ink jet head An object of the present invention is to provide an expression recording device.

[0008]

In order to achieve the above object, according to the present invention, an adhesive layer for adhering a piezoelectric material film and a diaphragm material film is provided during the production of an ink jet head.

That is, an ink jet head according to the first aspect of the present invention includes a piezoelectric element, a vibrating plate displaced by a piezoelectric effect of the piezoelectric element, and a plurality of pressure chambers facing the vibrating plate and containing ink liquid. Wherein the piezoelectric element is formed above the vibration plate, and an adhesion layer that makes the vibration plate and the piezoelectric element adhere to each other is formed between the vibration plate and the piezoelectric element. It is characterized by being.

According to a second aspect of the present invention, in the ink jet head according to the first aspect, the piezoelectric element is divided into the same number as the plurality of pressure chambers.

According to a third aspect of the present invention, in the ink jet head according to the first or second aspect, the piezoelectric element is formed of lead zirconate titanate, and the diaphragm is formed of chromium, molybdenum or tantalum. It is characterized by.

According to a fourth aspect of the present invention, in the ink jet head according to the first or second aspect, the adhesion layer is formed of titanium.

According to a fifth aspect of the present invention, in the ink jet head according to the first or second aspect, the piezoelectric element is formed of lead zirconate titanate, the diaphragm is formed of chromium, and the adhesion layer is formed of titanium. It is characterized by being formed by.

[0014] The invention according to claim 6 is the first or fourth invention.
In the inkjet head according to the fifth aspect, the thickness of the adhesion layer is 100 ° or more.

The invention according to claim 7 is the invention according to claims 1 and 4.
In the inkjet head according to the fifth aspect, the thickness of the adhesion layer is 400 ° or more.

According to a eighth aspect of the present invention, there is provided a method of manufacturing an ink jet head for ejecting ink droplets by displacing a vibration plate by a piezoelectric effect of a piezoelectric element. Individual electrode material,
A step of forming a piezoelectric material, an adhesion layer material and a diaphragm material, and a step of bonding the formed substrate and a pressure chamber component for forming a pressure chamber, and after the bonding step, removing the substrate; At least processing the individual electrode material to form a plurality of individual electrodes.

According to a ninth aspect of the present invention, there is provided a method of manufacturing an ink jet head for ejecting ink droplets by displacing a diaphragm by a piezoelectric effect of a piezoelectric element. A step of forming an electrode material and a piezoelectric material; a step of processing the electrode material and the piezoelectric material to form a plurality of individual electrodes and a plurality of piezoelectric elements, respectively; Embedding an insulating resin in the recess, flattening an upper end surface, and forming an adhesion layer material for increasing the adhesion between the piezoelectric element and the vibration plate material on the flattened upper end surface,
Forming a film of the diaphragm material on the adhesive layer material.

According to the tenth aspect of the present invention, there is provided the ink jet recording apparatus according to the first, second, third, fourth, fifth, sixth or seventh aspect.
10. The ink jet head according to claim 8, or said claim 8 or 9.
An ink jet head manufactured by the method for manufacturing an ink jet head described above, and moving means for moving a recording medium in a direction substantially perpendicular to a width direction of the ink jet head.

As described above, in the ink-jet head according to the first and second aspects of the present invention, since the adhesion layer is provided between the vibration plate and the piezoelectric element, the adhesion layer is provided between the vibration plate and the piezoelectric element. Is effectively prevented from peeling off.

In particular, in the ink jet head according to the third aspect of the invention, when the piezoelectric element is formed of lead zirconate titanate and the diaphragm is formed of chromium, molybdenum or tantalum, the adhesion layer Is formed of titanium, it is possible to ensure a sufficiently high adhesion between these piezoelectric elements and the diaphragm.

Further, as in the ink jet head according to the sixth and seventh aspects of the present invention, the thickness of the adhesion layer is set to 100%.
If the angle is set to not less than Å, preferably not less than 400 剥離, it is possible to effectively prevent separation between the piezoelectric element and the vibration plate.

In the method of manufacturing an ink jet head according to the present invention, the diaphragm and the piezoelectric element are firmly adhered to each other by the adhesive layer, and then the electrode material is processed to form a plurality of individual electrodes. Is formed, it is possible to form these individual electrodes at the correct positions as expected.

In particular, in the method of manufacturing an ink jet head according to the present invention, a plurality of individual electrodes are formed by processing an individual electrode material after bonding a film-formed substrate and a pressure chamber component. Without adjusting the alignment of the substrate after the formation of the individual electrodes and the pressure chamber components after the formation of the pressure chamber openings with high precision as in the proposed example, a plurality of individual electrodes can be accurately positioned as expected above the pressure chambers. Position.

In addition, according to the tenth aspect of the present invention, there is provided an ink jet recording apparatus having an ink jet head capable of effectively preventing peeling between the vibration plate and the piezoelectric element as described above.

[0025]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 12 shows an overall schematic configuration of an ink jet recording apparatus having an ink jet head of the present invention. The ink jet recording apparatus 40 shown in FIG. 1 includes an ink jet head 41 of the present invention that performs recording by utilizing a piezoelectric effect of a piezoelectric element, and causes ink droplets discharged from the ink jet head 41 to land on a recording medium 42 such as paper. Thus, recording is performed on the recording medium 42. The ink jet head 41 is mounted on a carriage 44 provided on a carriage shaft 43 arranged in the main scanning direction X. In response to the carriage 44 reciprocating along the carriage shaft 43, the ink jet head 41 is moved in the main scanning direction X. Reciprocate. Further, the ink jet recording apparatus 40 includes a plurality of rollers (moving means) 45 for moving the recording medium 42 in the sub scanning direction Y substantially perpendicular to the width direction of the ink jet head 41 (that is, the main scanning direction X). Prepare.

FIG. 1 shows an overall configuration of the ink jet head 41 according to the embodiment of the present invention, and FIG. 2 shows a configuration of a main part thereof. In FIGS. 1 and 2, A is a pressure chamber component, and an opening 1 for a pressure chamber is formed. B is an actuator portion arranged so as to cover the upper end opening surface of the pressure chamber opening 1, and C is an ink liquid flow path component arranged so as to cover the lower end opening surface of the pressure chamber opening 1. . The pressure chamber opening 1 of the pressure chamber component A is partitioned by the actuator portion B and the ink liquid flow channel component C located above and below the pressure chamber opening 1 to form a pressure chamber 2. Actuator section B
, An individual electrode 3 located above the pressure chamber 2 is disposed. The pressure chambers 2 and the individual electrodes 3 are arranged in a zigzag as shown in FIG. The ink liquid flow path component C has pressure chambers 2 arranged in the ink liquid supply direction.
A common liquid chamber 5 commonly used between the pressure chamber 2 and a supply port 6 for communicating the common liquid chamber 5 with the pressure chamber 2 and an ink flow path 7 through which the ink liquid in the pressure chamber 2 flows out are formed. D is a nozzle plate, in which a nozzle hole 8 communicating with the ink flow path 7 is formed. In FIG. 1, E denotes an IC chip, which supplies a voltage to the large number of individual electrodes 3 via bonding wires BW.

Next, the configuration of the actuator section B will be described with reference to FIG. In the same drawing, the actuator section B is a sectional view in a direction perpendicular to the ink liquid supply direction shown in FIG. In the drawing, a pressure chamber component A having four pressure chambers 2 arranged in the orthogonal direction is illustrated for reference. The actuator section B has an individual electrode 3 located above each pressure chamber 2, a piezoelectric element 10 located immediately below the individual electrode 3, and a vibrating plate 11 which is displaced and vibrated by the piezoelectric effect of the piezoelectric element 10. . The diaphragm 11 is formed of a conductive material, and also serves as a common electrode common to the pressure chambers 2. Further, the actuator portion B is disposed between the vibration plate 11 and each of the piezoelectric elements 10, and has an adhesion layer 12 for strengthening the adhesion between the two, and a partition wall 2 a that separates the pressure chambers 2 from each other. Has a vertical wall 13 located at In the figure, reference numeral 14 denotes an adhesive for bonding the pressure chamber component A and the actuator B. Each of the vertical walls 13 can be used even when a part of the adhesive 14 protrudes outside the partition wall 2a at the time of bonding using the adhesive 14.
Does not adhere to the vibration plate 11 and the upper surface of the pressure chamber 2 and the vibration plate 11
It has a role to extend the distance to the lower surface of the.

Next, a method of manufacturing an ink jet head excluding the IC chip E of FIG. 1, that is, an ink jet head including the pressure chamber component A, the actuator section B, the ink flow path component C and the nozzle plate D shown in FIG. This will be described with reference to FIGS.

4A, an individual electrode material 21, a piezoelectric element material 22, an adhesive layer material 23, a diaphragm / common electrode material 24, and a vertical wall 13 shown in FIG. An intermediate layer material 25 is formed and laminated. The substrate 20 is, for example, an MgO single crystal substrate, but may be a silicon substrate, a sapphire substrate, or an SrTiO 3 substrate. The individual electrode material 21 is, for example, Pt (platinum), and the piezoelectric element material 22 is, for example, lead zirconate titanate (PZ).
T), the adhesion layer material 23 is, for example, Ti (titanium), the diaphragm / common electrode material 24 is, for example, Cr (chromium), Mo (molybdenum) or Ta (tantalum), and the intermediate layer material 25 is, for example, Ti. use.

The material of the adhesion layer 23 is not limited to titanium, but may be a material capable of increasing the adhesion between the two depending on the piezoelectric element material 22 and the diaphragm material 24 used.

The MgO substrate 20 is made of a small size, for example, a square plate of 18 mm in length and width, because it is difficult to increase the size of the MgO substrate 20 due to the manufacturing method, and the increase in size is expensive. FIG. 3A illustrates a process of forming a film on two MgO substrates 20. Further, for example, the individual electrode material 21 has a thickness of 0.1 to 0.5 μm,
2 has a thickness of 3 to 5 μm, and the adhesion layer material 23 has a thickness of 10 μm.
The thickness of the diaphragm / common electrode material 24 is 3 to 0 ° to 1000 °.
To 5 μm, and the intermediate layer material 25 is formed to a thickness of 5 to 10 μm.

On the other hand, in FIG.
To form The pressure chamber component A is provided on the MgO substrate 20.
It is formed using a silicon substrate 30 of a larger size, for example, a 4-inch wafer. Specifically, first,
The plurality of pressure chamber openings 1 are patterned on the silicon substrate 30. This patterning is shown in FIG.
As can be seen from the drawing, the partition wall 2b that divides each set into four sets of the pressure chamber openings 1 is about twice the width of the partition wall 2a that divides the pressure chamber openings 1 in each set. Is set to the thickness width. Thereafter, the patterned silicon substrate 30 is processed by chemical etching or dry etching to form four pressure chamber openings 1 in each group, thereby obtaining a pressure chamber part A.

Thereafter, the substrate 20 after the film formation is bonded to the pressure chamber component A using an adhesive. The formation of this adhesive is by electrodeposition. That is, first, as shown in FIG. 1C, the partition wall 2 of the pressure chamber is used as an adhesive surface on the pressure chamber component A side.
An adhesive 14 is attached to the upper surfaces of a and 2b by electrodeposition.
More specifically, although not shown, on the upper surfaces of the partition walls 2a and 2b, a thin Ni film having a thickness of several hundreds of mm, which is thin enough to transmit light, is formed as a base electrode film by a sputtering method. Then, a patterned adhesive resin material 14 is formed. At this time, as the electrodeposition liquid, a solution obtained by adding 0 to 50 parts by weight of pure water to an acrylic resin-based aqueous dispersion and stirring and mixing well is used. The reason why the thickness of the Ni thin film is set to be thin enough to transmit light is to easily visually recognize that the adhesive resin has completely adhered to the silicon substrate 30. According to the experiment, the electrodeposition conditions were that the liquid temperature was about 25 ° C.,
V and a conduction time of 60 seconds are preferable, and under these conditions, about 3 to
A 10 μm acrylic resin was electrodeposited on the Ni thin film on the silicon substrate 30.

Then, as shown in FIG. 5A, the laminated MgO substrate 20 and the pressure chamber component A are bonded using the electrodeposited adhesive 14. This bonding is performed using the intermediate layer material 25 formed on the substrate 20 as a substrate-side bonding surface. Since the MgO substrate 20 has a small size of 18 mm and the silicon substrate 30 forming the pressure chamber component A has a large size of 4 inches, as shown in FIG. The substrate 20 is attached to one pressure chamber component A. This attachment is performed in a state where the center of each MgO substrate 20 is positioned such that the center of each MgO substrate 20 is located at the center of the thick partition wall 2b of the pressure chamber component A, as shown in FIG. After this attachment, the pressure chamber part A is
The O-substrate 20 is pressed and brought into close contact with the O-substrate 20 to increase the liquid-tightness between them. Further, the temperature of the bonded MgO substrate 20 and the pressure chamber component A is gradually increased in a heating furnace, so that the adhesive 14 is completely cured. Subsequently, a plasma treatment is performed to remove the protruding fragments from the adhesive 14.

In FIG. 5A, the MgO substrate 20 after film formation and the pressure chamber member A are adhered.
The silicon substrate 30 at the stage where no silicon film is formed
It may be bonded to the gO substrate 20. In addition, the silicon substrate 3
As 0, a substrate of the same size as the MgO substrate 20 may be used, and one MgO substrate 20 may be bonded to this small-sized silicon substrate.

Thereafter, as shown in FIG. 5B, the intermediate layer 2 is formed by using the partition walls 2a and 2b of the pressure chamber part A as a mask.
5 is etched to form a vertical wall 13 continuous with each of the partition walls 2a, 2b. Next, as shown in FIG. 6A, each MgO substrate 20 is removed by etching.

Subsequently, as shown in FIG. 6B, the individual electrode material 21 located above the pressure chamber component A is etched using photolithography to form the individual electrode 3. Further, as shown in FIG. 7A, the piezoelectric material 22 is formed by using photolithography technology.
Is etched to form the piezoelectric element 10 immediately below each of the individual electrodes 3. These individual electrodes 3 and piezoelectric elements 10
Are formed above each of the pressure chambers 2, and are formed so that the center in the width direction of the individual electrode 3 and the piezoelectric element 10 coincides with the center of the corresponding pressure chamber 2 in the width direction with high precision. After individualizing the individual electrodes 3 and the piezoelectric elements 10 for each of the pressure chambers 2 as described above, as shown in FIG. 7B, the silicon substrate 30 is cut at the portions of the partition walls 2b having respective thicknesses. Four sets of a pressure chamber component A having four pressure chambers 2 and an actuator section B fixed to the upper surface thereof are completed.

The feature of the actuator section B is that each individual electrode 3 and piezoelectric element 10 protrude above a film (the contact layer 23 in this embodiment) located immediately below the individual electrode 3 and piezoelectric element 10. The recesses or openings (film portions removed by etching) between the elements 10 are left open as they are, and the inkjet head of FIG. 11 (g) manufactured by the manufacturing method proposed by the applicant described above. As described above, the insulating resin 105 and the like are buried in the openings, and are not flattened.

Subsequently, in FIG. 8A, a common liquid chamber 5, a supply port 6 and an ink flow path 7 are formed in the ink liquid flow path component C, and a nozzle hole 8 is formed in the nozzle plate D. After the nozzle holes 8 are formed, a water repellent is poured into the nozzle holes 8 to prevent the adhesive used for bonding the ink liquid flow path component C and the nozzle plate D in the next step from flowing into the nozzle holes 8 in advance. Take measures to suppress it. Next, as shown in FIG. 2B, the ink liquid flow path component C and the nozzle plate D are bonded together using an adhesive 30.

Thereafter, an adhesive (not shown) is transferred to the lower end surface of the pressure chamber component A or the upper end surface of the ink liquid flow path component C, as shown in FIG. The alignment with the liquid flow path component C is adjusted, and both are bonded with the adhesive. Thus, an ink jet head having the pressure chamber component A, the actuator section B, the ink liquid flow channel component C, and the nozzle plate D is completed as shown in FIG.

Therefore, in this embodiment, as shown in FIG. 4A, when the piezoelectric element material 21 and the diaphragm / common electrode material 24 are formed on the MgO substrate 20, the two materials are used. Since the film of the adhesion layer material 23 is interposed therebetween, the adhesion between the piezoelectric element material 21 and the diaphragm / common electrode material 24 is increased. As a result, subsequent bonding with the pressure chamber component A, formation of the vertical wall 13, division of the individual electrode 3,
In each of the steps such as the division into individual parts and the bonding with the ink liquid flow path component C, these steps can be performed with high accuracy.

Further, in the combination of the pressure chamber component A and the actuator portion B shown in FIG. 3 obtained by the above manufacturing method, the piezoelectric element material 21 and the diaphragm / common electrode material 24 are firmly adhered to each other by the adhesive layer 12. Therefore, above the pressure chambers 2, the individual electrodes 3 and the piezoelectric elements 10 are processed with high precision as expected, and the center of each individual electrode 3 and the piezoelectric element 10 in the width direction is set to the corresponding pressure chamber 2 Coincides with the center in the width direction with high precision. Therefore, when each piezoelectric element 10 receives a voltage from the corresponding individual electrode 3 to generate a piezoelectric effect, the portion of the diaphragm 11 located above the corresponding pressure chamber 2 has a center in the width direction of the pressure chamber 2. The ink droplets are ejected from the pressure chamber 2 to the recording paper as desired via the ink flow path 7 and the nozzle holes 8 while being symmetrically displaced and vibrated with reference to FIG. Therefore, an ink jet head capable of controlling the ejection amount of ink droplets with high accuracy can be obtained.

FIG. 10 shows the substrate 20 after the film formation shown in FIG.
4 shows the results of a test on the adhesion between the piezoelectric element material 21 and the diaphragm / common electrode material 24 when the thickness of the adhesion layer material 23 is variously changed. This test used a tape test. Here, the peeling method is
After cutting a 1mm square grid-like scratch into the thin film with a cutter,
When the adhesive tape is attached to the thin film and the adhesive tape is peeled off, it is a method of repeatedly examining whether the thin film remains on the substrate or whether the thin film adheres to the adhesive tape and peels off, and estimates the adhesion force based on the result. As a result, in the conventional device in which the adhesion layer material 23 is not formed as shown in FIG. 4A, all of the investigated numbers (320) were adhered to the adhesive tape and peeled off, but were formed of Ti. The thickness of the adhesion layer material is 10
At 0 °, 30 pieces were peeled off, and when the thickness was 200 °, 5 pieces were peeled off. When the thickness was 400 °, none was peeled off. Therefore, when the thickness of the Ti adhesion layer material 23 is 100 ° or more, it is effective for improving the adhesion, and is 4,000.
It can be seen that if the thickness is set to Å or more, film peeling between the piezoelectric element material 21 and the diaphragm / common electrode material 24 is eliminated.

Although the ink jet head of the present invention is characterized by having a structure having an adhesion layer, the present invention is not limited to the one manufactured by the manufacturing method of the present embodiment.
Needless to say, it may be manufactured by the manufacturing method proposed by the present applicant. In this case, an adhesion layer made of titanium or the like may be formed before the electrode / diaphragm 106 made of Cr as shown in FIG.

Further, in this embodiment, the following operation and effect can be obtained. That is, in the bonding step of the silicon substrate 30 and the five-layered MgO substrate 20 shown in FIG. 5A, the individual electrode material 21 and the piezoelectric element material 22 are in a film-formed state, and after this bonding step, In the subsequent step shown in FIG. 7A, the individual electrode material 21 and the piezoelectric element material 22 are etched for the first time, and the individual electrodes 3 and the piezoelectric elements 10 are individualized for each pressure chamber opening 1. Therefore, the center in the width direction of each individual electrode 3 and the piezoelectric element 10 can be accurately positioned at the center position in the width direction of each pressure chamber opening 1 of the pressure chamber component A. As a result, the diaphragm 24
The displacement and vibration of the ink droplets are performed as expected, and the discharge amount control of the ink droplets from the ink holes 8 can be accurately performed.

In the present embodiment, the small-sized (14) formed MgO substrates 20 are bonded to the large-sized silicon substrate 30, so that the individual electrodes 3 and the piezoelectric elements 10 In the dividing and individualizing step, the individual electrode material 21 and the piezoelectric material 22 on the plurality of MgO substrates 20 are formed.
Can be individually patterned at the same time, and mass productivity is improved.

In the ink jet head of this embodiment, as shown in FIG. 3, the piezoelectric elements 10 are individualized corresponding to the respective pressure chambers 2. However, the piezoelectric elements 10 are individualized by etching. The step of FIG. 6B may be omitted and the piezoelectric material film 22 may be used as it is as a common piezoelectric element. In this case, there is an advantage that the step of individualizing the piezoelectric element 10 can be reduced, and the withstand voltage characteristic does not deteriorate on the side wall of each piezoelectric element 10 due to the etching of the piezoelectric material film 22.

In the present embodiment, the diaphragm material 24
Is made of conductive Cr and serves as a common electrode and diaphragm. However, when the diaphragm material is not made of a conductive material such as Cr, a common electrode material is separately formed below the piezoelectric material 22. It may be a film. Further, a substrate 3 for forming the pressure chamber opening 1
Although 0 is made of silicon, it may be made of a glass wafer or photosensitive glass that can be anisotropically etched.

[0050]

As described above, according to the ink-jet head of the present invention, since the adhesion layer is provided between the vibration plate and the piezoelectric element, the adhesion layer is interposed between the vibration plate and the piezoelectric element. Can effectively prevent peeling.

In particular, when the piezoelectric element is formed of lead zirconate titanate and the diaphragm is formed of chromium, molybdenum or tantalum, if the adhesion layer is formed of titanium,
A sufficiently high adhesion between the piezoelectric element and the diaphragm can be ensured.

Further, if the thickness of the adhesive layer is set to 100 ° or more, preferably 400 ° or more, the separation between the piezoelectric element and the vibration plate can be effectively prevented.

In addition, according to the method of manufacturing an ink jet head of the present invention, the diaphragm and the piezoelectric element are firmly adhered to each other by the adhesion layer, and thereafter, the electrode material is processed to form a plurality of individual electrodes. It is possible to form these individual electrodes at the correct positions as expected.

In particular, if a plurality of individual electrodes are formed by processing the individual electrode material after bonding the substrate after the film formation and the pressure chamber components, it is possible to perform high-precision alignment adjustment.
There is an effect that a plurality of individual electrodes can be formed at the expected exact positions above the pressure chamber.

Further, as described above, it is possible to provide an ink jet recording apparatus having an ink jet head which can effectively prevent peeling between the diaphragm and the piezoelectric element.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating an overall configuration of an inkjet head according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing a main part of a pressure chamber part and an actuator part of the inkjet head.

FIG. 3 is a cross-sectional view illustrating a main part of a pressure chamber component and an actuator unit of the inkjet head.

FIG. 4 is a view showing a laminating step, a step of forming an opening for a pressure chamber, and a step of attaching an adhesive in the method of manufacturing the ink jet head.

FIG. 5 is a view showing a bonding step between a film-formed substrate and a pressure chamber component and a vertical wall forming step in the same manufacturing method.

FIG. 6 is a view showing a substrate removing step and an individual electrode individualizing step in the same manufacturing method.

FIG. 7 is a view showing a piezoelectric element individualizing step and a cutting step in the same manufacturing method.

FIG. 8 shows a process for producing each ink channel component and a nozzle plate, a process for bonding an ink channel component to a nozzle plate, a process for bonding an actuator section and a pressure chamber component, and a completed inkjet head in the same manufacturing method. FIG.

FIG. 9 is a cross-sectional view illustrating a method of manufacturing the ink-jet head according to the embodiment.
It is a figure which shows the mode of adhesion of the formed MgO substrate and the silicon substrate for pressure chamber formation.

FIG. 10 is a diagram showing the results of a test of the degree of adhesion force by changing the thickness of the adhesion layer.

FIG. 11 is a diagram showing steps of a method of manufacturing an ink jet head proposed by the present applicant.

FIG. 12 is a view showing an overall schematic configuration of an ink jet recording apparatus having an ink jet head of the present invention.

[Explanation of symbols]

 Reference Signs List A pressure chamber part B actuator part C ink flow path part D nozzle plate E IC chip 1 pressure chamber opening 2 pressure chamber 2a, 2b partition wall 3 individual electrode 5 common liquid chamber 6 supply port 7 ink flow path 8 nozzle hole 10 Piezoelectric element 11 Vibration plate / common electrode 12 Adhesion layer 13 Vertical wall 14 Adhesion layer 20 MgO substrate 21 Individual electrode material 22 Piezoelectric element material 23 Adhesion layer material 24 Vibration plate / common electrode material 25 Intermediate layer material 30 Silicon substrate 40 Ink jet recording Device 41 Inkjet head 42 Recording medium 45 Roller (moving means) 105 Insulating resin BW Bonding wire

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takanori Nakano 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. (reference) 2C057 AF93 AG15 AG39 AG44 AG52 AG55 AG85 AG93 AN01 AP02 AP14 AP22 AP25 AP32 AP33 AP52 AP58 AP60 AP75 AQ02 AQ10 BA03 BA14

Claims (10)

[Claims] 1. An ink jet head comprising: a piezoelectric element; a vibrating plate displaced by a piezoelectric effect of the piezoelectric element; and a plurality of pressure chambers facing the vibrating plate and containing an ink liquid. An ink jet head, wherein the piezoelectric element is formed above a plate, and an adhesion layer for adhering the vibration plate and the piezoelectric element is formed between the vibration plate and the piezoelectric element. 2. The ink jet head according to claim 1, wherein said piezoelectric element is divided into the same number as said plurality of pressure chambers. 3. The ink jet head according to claim 1, wherein the piezoelectric element is formed of lead zirconate titanate, and the vibration plate is formed of chromium, molybdenum, or tantalum. 4. The ink jet head according to claim 1, wherein the adhesion layer is formed of titanium. 5. The piezoelectric element according to claim 1, wherein the piezoelectric element is formed of lead zirconate titanate, the vibration plate is formed of chromium, and the adhesion layer is formed of titanium.
The inkjet head according to the above. 6. The ink jet head according to claim 1, wherein the thickness of the adhesion layer is 100 ° or more. 7. The ink jet head according to claim 1, wherein the thickness of the adhesion layer is 400 ° or more. 8. A method for manufacturing an ink jet head for ejecting ink droplets by displacing a vibration plate by a piezoelectric effect of a piezoelectric element, comprising: sequentially forming an individual electrode material, a piezoelectric material, an adhesion layer material, and a vibration on a substrate; A step of forming a plate material, a step of bonding the formed substrate and a pressure chamber component for forming a pressure chamber, and after the bonding step, removing the substrate and processing at least the individual electrode material. Forming a plurality of individual electrodes by using the method. 9. A method of manufacturing an ink jet head for ejecting ink droplets by displacing a vibration plate by a piezoelectric effect of a piezoelectric element, comprising: sequentially forming a film of an electrode material and a piezoelectric material on a substrate; Processing the electrode material and the piezoelectric material to form a plurality of individual electrodes and a plurality of piezoelectric elements, respectively; embedding an insulating resin in a recess between the plurality of individual electrodes and the piezoelectric element, and flattening the upper end surface Forming an adhesive layer material on the flattened upper end surface to increase the adhesive force between the piezoelectric element and the diaphragm material; and forming the diaphragm material on the adhesive layer material. Forming a film. 10. An inkjet head according to claim 1, 2, 3, 4, 5, 6, or 7, an inkjet head manufactured by the inkjet head manufacturing method according to claim 8 or 9, and the inkjet. An ink jet recording apparatus, comprising: moving means for moving a recording medium in a direction substantially perpendicular to a width direction of a head.