JP2001111192A - Electronic component and manufacturing method thereof, electronic device and ultrasonic sensor component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated package which has package structure composed of laminated circuit boards, does not require the side surface wirings of the circuit boards and is low in cost, an electronic component using the laminated package and, further, an electronic apparatus and an ultrasonic sensor component using the electronic components. SOLUTION: Circuit boards 3a, 3b and 3c are electrically connected to an interlayer connection board 11 with side surface connection electrodes 10a, 10b...10n formed on the cut surfaces of spacers 6a, 6b...6n.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an electronic component in which a plurality of circuit boards are stacked, a manufacturing method thereof, and an electronic device and an ultrasonic sensor component using the same.

[0002]

2. Description of the Related Art For example, in an ultrasonic sensor, the density of an ultrasonic sensor array, which is a component, is increasing. Along with this, a technology for increasing the density of a circuit board on which electronic components mounted thereon are mounted has been developed.

[0003] The main techniques for increasing the density of a circuit board are thinning of a conductor pattern and reduction of a diameter of a via hole in a horizontal direction along a mounting surface of an electronic component of the circuit board. As the number of multi-pin ICs increases, the demand for thinner conductor patterns has become more demanding. In addition, via holes to which wiring on both front and back surfaces can be connected can be set to extremely small hole diameters and land widths. Is widely used because it is possible to secure a larger diameter, and the diameter is being reduced.

On the other hand, high-density mounting of a circuit board in the thickness direction is a multi-layer structure in which a plurality of circuit boards are combined in layers in the vertical direction. In addition, the multi-layered circuit board not only realizes higher density wiring, but also (a) lowers and uniformly sets the power supply impedance, lowers the noise level, and stabilizes the operation. Let it. (B) By providing a ground layer in the inner layer, crosstalk is reduced. (C) The propagation delay time is reduced by designing the wiring length as short as possible. And the like.

[0005] In order to increase the number of circuit boards, an electrical connection technique between the circuit boards in each layer is required. In many cases, the side surfaces of the circuit board are usually electrically connected to each other, and a technique common to the multilayer wiring of the semiconductor device is used. For example, in connection technology using the side surface of a circuit board, Japanese Patent Application Laid-Open No. 9-45858 discloses a technology relating to a stacked package in which thin-film wiring is formed on the side surface of a stacked LSI and the stacked LSIs are connected. .

[0006]

However, in the technique disclosed in Japanese Patent Application Laid-Open No. 9-45858, in which thin film wiring is formed on the side surface of an LSI, the side thin film wiring is formed for each package after stacking the LSI. There is a need. For this reason, the side wiring of each package cannot be formed collectively, and the side thin film wiring is individually formed for each package.

The process of forming the side surface thin film wiring individually for each package has a low throughput and a high production cost since it is not a batch formation.

The present invention has been made on the basis of these circumstances. In a laminated package structure in which circuit boards are laminated, a low-cost laminated package which does not require side wiring of the circuit board and which uses the laminated package. It is another object of the present invention to provide an electronic component, and an electronic device and an ultrasonic sensor component using the electronic component.

[0009]

According to the first aspect of the present invention, a circuit board on which a functional component is mounted is formed by laminating via a spacer in which conductive terminals are embedded. An electronic component, wherein the terminal of the spacer is
An electronic component having a surface in contact with wiring on the circuit board and a surface exposed on a side surface, wherein the surface exposed on the side surface is provided so as to be connectable to another electric component.

According to the second aspect of the present invention,
The electronic component is characterized in that the spacer is formed in a rectangular parallelepiped shape and has a plurality of side surface connection electrodes communicating with one side surface and the lower surface.

According to the third aspect of the present invention,
The side surface connection electrode formed on the one side surface of the spacer is a cut surface, and is an electronic component.

Further, according to the means of the present invention,
An electronic component is characterized in that a sealing material is filled between the circuit boards.

According to the invention of claim 5,
A step of forming wiring made of a conductive material on a plate made of an insulating material, and exposing the conductive material further to a cross section obtained by cutting them to form a side electrode and a spacer; An electronic component, comprising: bonding an electrically conductive material portion of the spacer to an electrode on a mounted circuit board; and bonding and laminating the circuit board to an insulating material portion of the spacer. It is a manufacturing method of.

Further, according to the means of the present invention,
An electronic device using the electronic component.

Further, according to the means of the present invention,
A plurality of circuit boards on which functional components are mounted and provided with I / O electrodes, and a spacer for laminating the circuit boards with side connection electrodes connected on the I / O electrodes;
I / Os arranged two-dimensionally corresponding to the side surface connection electrodes and electrically connected to the side surface connection electrodes, respectively.
In the ultrasonic sensor component including the ultrasonic transducer on which the O electrode is formed, the connection surface of the side surface connection electrode connected to the I / O electrode cuts the spacer of the laminated circuit board. An ultrasonic sensor component characterized in that it has a cross-section exposed by doing so.

[0016]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a side sectional view of an electronic component using a laminated circuit board according to an embodiment of the present invention. Electronic component 1
Are composed of three circuit boards 3a, 3a
b, 3c are formed in layers, and each of the circuit boards 3a, 3b, 3
c between the spacers 5 by the adhesive layers 4a and 4b of the adhesive.
a, 5b... 5n are bonded and fixed. On each of the circuit boards 3a, 3b, 3c, I / O electrodes 6a, 6b, 6c are formed by conductor patterns, respectively.
On the O-electrodes 6a, 6b, 6c, LSIs 7a, 7b...
8n and spacers 5a, 5b... 5n are mounted by soldering. Spacers 5a, 5b ...
5n is provided on both side ends of the circuit boards 3a, 3b, 3c over the entire end face, and the circuit boards 3a, 3b,
It is electrically connected to the I / O electrodes 6a, 6b, 6c on 3c by soldering. Also, spacers 5a, 5b
... 5n have the heights of all the LSIs 7a, 7b... 7n and chip components 8a, 8b mounted on the circuit boards 3a, 3b, 3c.
.. Are set higher than 8n.

The spacers 5a, 5b... 5n are formed on a rectangular parallelepiped insulator 9 as shown in a perspective view in FIG.
10n are provided regularly. This side connection electrode 1
.. 10n, each of the portions formed on the side surface has a rectangular shape, and is perpendicular to the width direction (the direction in which the side electrodes are arranged) and the height direction (the direction in which the side electrodes are arranged). Direction) and the aspect ratio (height / width ratio) is 1.
It is set to 0 or more. For example, if the width is 50μ
., 10n are formed at a pitch of 100 μm.

The spacers 5a, 5b... 5n are formed by injecting an epoxy resin into a mold (not shown) in which a plurality of grooves parallel to one main surface can be formed and solidifying them into a plate having a predetermined thickness. , And the grooves are filled with copper as a conductive material. The epoxy resin between the grooves insulates the terminals from each other, and by changing the interval between the grooves or the width of the grooves themselves, it becomes possible to cope with various wiring boards. The thickness direction is the spacers 5a and 5b.
.. 5n in the height direction. By adjusting this plate thickness, it becomes possible to cope with various applied products. The grooves can also be obtained by grinding the surface of a plate-shaped body made of an insulating material. The filling of the groove with copper can be obtained by filling the groove with copper by electrolytic plating, and then polishing and flattening the surface. Alternatively, a copper plate is attached to the surface of a plate made of an insulating material, and the steel plate is ground for each terminal width. Preferably, the groove obtained by the grinding is filled with an insulating material to form a spacer. Thus, the side connection electrodes 10a of the spacers 5a, 5b,.
Since 10b... 10n are formed by filling a mechanically formed groove with a conductive material, the cross-sectional area can be increased.
Since the width of the groove is restricted by the width of the wiring of the substrate to be laminated, it is necessary to extend in the thickness direction, but this can also be arbitrarily set, and the electrode area can be increased. Facilitates connection with electrical components. By making the cut surface oblique to the main surface of the plate as needed,
Larger electrodes can also be obtained.

FIG. 3 is a perspective view of a laminated circuit board in which three circuit boards are bonded in a layered manner by spacers. The circuit boards 3a, 3b, 3c are joined to each other via spacers 5a, 5b,... 5n mounted on the I / O electrodes 6a, 6b, 6c of the circuit boards 3a, 3b, 3c. Also, the side connection electrodes 10a, 10b... 10
n has a high aspect ratio, the exposed side surface connection electrode 1
The cross-sections of 0a, 10b... 10n are large enough to connect to respective electrodes (not shown) provided on the interlayer connection substrate 11.

Each L on the circuit boards 3a, 3b, 3c
7n and each chip component 8a, 8b... 8n
Are sealed with a sealing material 12 of an insulating material. Accordingly, the space between the circuit boards 3a, 3b, and 3c is also filled with the sealing material 12 made of an insulating material.

Since the interlayer connection board 11 also plays a role of inputting and outputting signals between the multilayer circuit board 2 and the outside, the interlayer connection board 11 has a diameter for connecting input and output with the outside. φ300 μm solder bumps 13a, 13b ... 13n
Are formed in an array at a pitch of 700 μm.

In order to improve heat dissipation and mechanical reinforcement,
The bottom surface of the multilayer circuit board 2 and the board 11 for interlayer connection are adhered by an adhesive layer 14 made of a silicone resin, an epoxy resin or a conductive paste.

Next, a method of manufacturing the electronic component 1 having these structures will be described with reference to FIGS.

As shown in FIG. 4A, I / O electrodes 6a, 6b, 6 are formed by conductor patterns formed on the surfaces of circuit boards 3a, 3b, 3c which are glass epoxy printed boards.
7c and chip components 8a,
8b... 8n are mounted. The circuit boards 3a, 3
b, 3c I / O electrodes 6a, 6b, 6c and LSI 7a,
The electrodes 7b... 7n are soldered by flip chip bonding.

The I / O of the circuit boards 3a, 3b, 3c
As shown in FIG. 4B, spacers 5a, 5b,... 5n are similarly mounted on predetermined positions on the electrodes 6a, 6b, 6c by flip chip bonding. Thereby, the side connection electrode 10 made of Cu on the spacers 5a, 5b,.
a, 10b... 10n and I on the circuit boards 3a, 3b, 3c
The / O electrodes 6a, 6b, 6c are electrically connected by soldering.

Next, an epoxy-based adhesive is applied to the upper surfaces of the spacers 5a, 5b,... 5n mounted on the circuit boards 3a, 3b, 3c. In this state, as shown in FIG. 4C, the LSIs 7a, 7b... 7n and the chip components 8a, 8b
.. 8n and the circuit boards 3a, 3b, 3c on which the spacers 5a, 5b,... 5n are mounted, respectively, and the adhesive layers 4a, 4b are formed with an epoxy-based adhesive and fixed.

When the circuit boards 3a, 3b, 3c are stacked and fixed by the spacers 5a, 5b,... 5n, the LSIs 7a, 7b,. May be sealed with a sealing material 12 made of a silicone resin or an ethoxy resin for the purpose of mechanical protection and improvement of moisture resistance. The sealing material 12 is formed on the adhesive layer 4 on the upper surface of the spacers 5a, 5b,.
The formation of a and 4b can also serve at the same time.

Next, as shown in FIG. 4D, a dicing saw is provided for each portion of the laminated circuit boards 3a, 3b, 3c (hereinafter, referred to as a laminated circuit board 2) on the spacers 5a, 5b,. (Not shown) to produce individual laminated circuit boards 2 having both ends cut. The cross sections of the side connection electrodes 10a, 10b,.
a, 3b and 3c can be used as input / output electrodes.

Next, as shown in FIG. 4 (e), the side face connection electrodes 10a, 10b... 10n on the multilayer circuit board 2 and the interlayer wiring electrodes on the interlayer connection board 11 are soldered to form the electronic component 1. Constitute. The side connection electrodes 10a, 10b
.. 10n and the interlayer wiring electrodes are joined by the formed solder bumps 14a, 14b. That is, the solder bumps 14a, 14b,..., 14n are formed in advance on the interlayer connection substrate 11 using a solder paste printing method or an electroplating method.

In the above case, as shown in FIG. 4C, each circuit board 3a, 5b,.
When the layers 3b and 3c are stacked and fixed together, the circuit boards 3a and 3c
LSIs 7a, 7b... 7n and chip components 8 on b, 3c
The mounting portions of a, 8b... 8n are sealed with a sealing material 12 of a silicone-based resin or an epoxy-based resin for the purpose of mechanical protection and improvement of moisture resistance, but there is no problem even if sealing is not particularly performed. In this case, as shown in FIG. 5, the laminated circuit boards 3a, 3b, 3c are separated from each other by spacers 5a, 5b,.
Need only be fixed with the adhesive layers 4a, 4b on the upper surface of the substrate, and the mechanical strength is maintained by the spacers 5a, 5b,.

In the above case, three circuit boards 3a,
Although the laminated circuit board 2 is configured by using the circuit boards 3b and 3c, the number of the circuit boards 3a, 3b and 3c is not limited to three and can be arbitrarily increased or decreased as needed.

By the method as described above, electrical connection between the laminated circuit boards 3a, 3b, 3c can be easily realized, and the laminated package type electronic component 1 can be provided at low cost. It becomes possible.

FIGS. 6A to 6C are schematic views showing an assembling sequence of an example in which the electronic component of the present invention is applied to an ultrasonic sensor array.

The ultrasonic sensor array 31 constituting the ultrasonic sensor (not shown) can be made of titanium-based piezoelectric vibrators using quartz or the like for the ultrasonic sensor elements (ultrasonic vibrators) 32a, 32b. Even in the case of an electrostrictive vibrator using a strong magnetic material such as barium oxide, the circuit scale becomes large because a drive / signal processing circuit is required for each sensor element. Therefore, the laminated circuit board 33 as described in the above embodiment is indispensable for higher density.

FIG. 6A is a schematic view showing a state in which a connection flexible board 34 is connected to one end of the laminated circuit board 33. The laminated circuit board 33 in which the connection flexible board 34 is connected to one end is An LSI (not shown) and a chip component (not shown) for a drive / measurement circuit of the ultrasonic transducer are mounted therein, and a portion corresponding to each ultrasonic transducer (not shown) is provided on the other end side. Side connection electrodes 35a, 35
35n are formed in a two-dimensional array.

On the other hand, as shown in FIG. 6B, bump electrodes 36a, 36b... 36n are provided at positions corresponding to side connection electrodes 35a, 35b... 35n on ultrasonic transducers 32a, 32b. Are formed in a two-dimensional array. The bump electrodes 36a, 36b... 36n and the side face connection electrodes 35a, 35b.
The pitch is 200 μm, corresponding to the intervals at which a, 32b... 32n are arranged in a two-dimensional array. The bump electrodes 36a, 36b... 36n are formed by printing a solder paste or a conductive paste or mounting a solder ball.

FIG. 6C shows that the laminated circuit board 33 and the ultrasonic vibrators 32a, 32b.
36b is a drawing showing a state in which the ultrasonic sensor array 31 is formed by being connected by 36n. The laminated circuit board 33 and the ultrasonic transducers 32a, 32b... 32n are aligned and temporarily joined by a mounting machine (not shown), and then passed through an inside of a reflow furnace (not shown) to be solder-joined and ultrasonically joined. The sensor array 31 is manufactured.

In the above-described case, the electronic component of the present invention is applied to an ultrasonic sensor array. However, the electronic component can be widely applied to other electronic devices.

According to the present invention, as described above, a plurality of multiple circuit boards are stacked via a spacer having a stripe-shaped side connection electrode having a high aspect ratio. At this time, the I / O electrodes on the circuit board and the side connection electrodes are electrically connected, and then the cross section of the side connection electrodes is exposed by cutting the spacers of the stacked circuit boards. . Thereafter, the circuit boards laminated by the interlayer connection board made of a flexible board are electrically connected with the exposed side surface connection electrode cross section as an I / O electrode. Further, since the side surface connection electrode on the spacer is manufactured separately from the circuit board, an electrode shape having a high aspect ratio can be easily obtained by mechanical grinding or the like.

Since the aspect ratio of the electrode cross section is high, the cross-sectional dimension of the side connection electrode is large enough to connect to the electrode on the interlayer connection substrate. Therefore, connection to the interlayer connection substrate is easy, and there is no need to form a special side wiring on the side surface of the circuit board.

Further, since the substrate for interlayer connection is formed separately from the circuit board, they are combined to perform collective formation by multi-paneling, and then cut and separated to be suitable for mass production. In addition, it is possible to provide a low-cost laminated package and an electronic component or an ultrasonic sensor component using the same, at low cost.

[0043]

According to the present invention, it is possible to obtain a laminated package type electronic component which does not require side wiring and can be produced at low cost.

Also, various electronic devices and ultrasonic sensor parts using the electronic parts can be obtained.

[Brief description of the drawings]

FIG. 1 is a side sectional view of an electronic component using a laminated circuit board according to an embodiment of the present invention.

FIG. 2 is a perspective view of a spacer.

FIG. 3 is a perspective view of a laminated circuit board in which circuit boards are bonded in a layered manner by spacers.

FIGS. 4A to 4E are diagrams illustrating a method for manufacturing an electronic component according to the present invention.

FIG. 5 is an explanatory view of a modification of the method for manufacturing an electronic component according to the present invention.

FIGS. 6A to 6C are schematic diagrams showing an assembling order of an example in which the electronic component of the present invention is applied to an ultrasonic sensor array.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Laminated circuit board, 3a, 3b, 3c ...
Circuit board, 5a, 5b ... 5n ... spacer, 6a, 6b ...
6n spacer, 10a, 10b 10n side connection electrode, 11 substrate for interlayer connection, 31 ultrasonic sensor array

Claims (7)

[Claims] An electronic component in which a circuit board on which a functional component is mounted is stacked via a spacer having a conductive terminal embedded therein, wherein the terminal of the spacer is An electronic component having a surface in contact with wiring on the circuit board and a surface exposed on a side surface, wherein the surface exposed on the side surface is provided so as to be connectable to another electric component. 2. The electronic component according to claim 1, wherein the spacer has a rectangular parallelepiped shape and a plurality of side surface connection electrodes communicating with one side surface and the lower surface. 3. The electronic component according to claim 1, wherein the side surface connection electrode formed on the one side surface of the spacer is a cut surface. 4. The electronic component according to claim 1, wherein a sealing material is filled between the circuit boards. 5. A step of forming wiring made of a conductive material on a plate made of an insulating material, cutting the wiring, exposing the conductive material to a cross section obtained, and forming side electrodes and a spacer. Bonding a conductive material portion of the spacer to an electrode on a circuit board on which a functional component is mounted, and further bonding and laminating the circuit board to an insulating material portion of the spacer. Characteristic electronic component manufacturing method. 6. An electronic apparatus using the electronic component according to claim 1. 7. A plurality of circuit boards on which functional components are mounted and provided with I / O electrodes, and a plurality of circuit boards provided with side connection electrodes connected on the I / O electrodes and which are stacked together. An ultrasonic wave comprising a spacer and an ultrasonic vibrator which is two-dimensionally arranged corresponding to the side surface connection electrode and has an I / O electrode electrically connected to the side surface connection electrode, respectively. In the sensor component, the connection surface of the side surface connection electrode connected to the I / O electrode has a cross section exposed by cutting the spacer of the laminated circuit board. Sensor parts.