JP2001110922A - Package for electronic components - Google Patents
Package for electronic componentsInfo
- Publication number
- JP2001110922A JP2001110922A JP28947399A JP28947399A JP2001110922A JP 2001110922 A JP2001110922 A JP 2001110922A JP 28947399 A JP28947399 A JP 28947399A JP 28947399 A JP28947399 A JP 28947399A JP 2001110922 A JP2001110922 A JP 2001110922A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- ceramic base
- metal lid
- gold
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
(57)【要約】
【課題】 パッケージと金属蓋とを接合させる場合に、
金属の飛沫が飛散しないようなパッケージと蓋とを得
る。
【解決手段】 中央部を凹陥せしめ、周囲を高くしたセ
ラミックパッケージの前記周囲上部のフランジ部にタン
グステンを用いてメタライズ面を形成し、それにニッケ
ルメッキをし、さらに金あるいは錫メッキを施すと共
に、密封用金属蓋に錫メッキあるいは金メッキを施し、
パッケージと金属蓋とを接合させる場合に接合面が金／
錫の共晶を形成するようにする。
(57) [Summary] [Problem] To join a package and a metal lid,
Obtain a package and a lid that do not splash metal splashes. SOLUTION: A metallized surface is formed by using tungsten on a flange portion of the upper part of the periphery of a ceramic package whose central part is depressed and the periphery is raised, and nickel plating is further performed thereon, followed by gold or tin plating and sealing. Tin or gold plating on the metal lid for
When joining the package and the metal lid, the joining surface is gold /
A tin eutectic is formed.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電子部品用パッケー
ジに関し、特にセラミックベースと金属蓋とを接合する
際に、接合に金と錫との共晶（合金）を利用した電子部
品用パッケージに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for an electronic component, and more particularly to a package for an electronic component using a eutectic (alloy) of gold and tin for joining a ceramic base and a metal cover.
【０００２】[0002]
【従来の技術】従来より環境の影響、例えば酸化、湿度
等の影響を受けてその特性が変化、劣化等を起こし易い
電子部品は、容器に収容して気密封止するか、あるいは
樹脂等で電子部品の周囲を覆って影響を防止するのが一
般的である。特に、周波数偏移が10-6程度の精度を要求
される圧電振動子の場合には、不活性ガス等を充たした
パッケージに収容し、気密封止してその精度を保持する
のが一般的である。図２（ａ）、（ｂ）、（ｃ）はそれ
ぞれ従来の圧電振動子の構造を示す斜視図、Ｑ−Ｑにお
ける断面図及び接合部周辺断面の拡大図である。圧電基
板１１の両主面に電極１２ａ、１２ｂを配置すると共
に、該電極１２ａ、１２ｂからそれぞれリード電極１３
ａ、１３ｂを圧電基板１１の端部に向けて延在して、圧
電振動素子Ｙを形成する。この圧電振動素子Ｙをセラミ
ックベース１４の内底面に成形した段差部１５に載置
し、リード電極１３ａ、１３ｂと段差部１５に焼成され
た電極端子とを導電性接着剤１６を用いて導通固定し、
該ベース１４に金属蓋を気密封止して圧電振動子を構成
する。2. Description of the Related Art Conventionally, electronic components whose characteristics are liable to change or deteriorate under the influence of the environment, for example, oxidation, humidity, etc., are housed in a container and airtightly sealed, or made of resin or the like. It is common to cover the periphery of the electronic component to prevent the effects. In particular, in the case of a piezoelectric vibrator that requires an accuracy of about 10 −6 in frequency shift, it is generally housed in a package filled with an inert gas or the like and hermetically sealed to maintain the accuracy. It is. 2 (a), 2 (b) and 2 (c) are a perspective view showing the structure of a conventional piezoelectric vibrator, a cross-sectional view taken along QQ, and an enlarged view of a cross-section around a joint. Electrodes 12a and 12b are arranged on both main surfaces of the piezoelectric substrate 11, and lead electrodes 13a and 12b are respectively provided from the electrodes 12a and 12b.
a and 13b are extended toward the end of the piezoelectric substrate 11 to form the piezoelectric vibrating element Y. The piezoelectric vibrating element Y is placed on a step 15 formed on the inner bottom surface of the ceramic base 14, and the lead electrodes 13 a and 13 b and the electrode terminals fired on the step 15 are conductively fixed using a conductive adhesive 16. And
A metal lid is hermetically sealed to the base 14 to form a piezoelectric vibrator.
【０００３】ベース１４の周辺上部の構造は図２（ｃ）
に拡大して示すように、セラミック14にタングステン
（Ｗ）をメタライズしたメタライズ層17aと、ニッケル
（Ni）メッキ層17bと、シールリング17cと、ニッケルメ
ッキ層17dと、金（Au）メッキ層17eとの５層が積層され
た構造となっている。このニッケルメッキ層17dに金属
板（鉄−ニッケル−コバルト合金）18aにニッケルメッ
キ18bを施した金属蓋１８を載置し、圧力を加えながら
金属蓋１８の周辺を抵抗溶接してベース１４を気密封止
する。通常、気密封止の工程は空気を窒素ガスで置換し
た雰囲気の中で行われる。FIG. 2C shows the structure of the upper part of the periphery of the base 14.
As shown in the enlarged view, a metallized layer 17a obtained by metallizing tungsten (W) on ceramic 14, a nickel (Ni) plated layer 17b, a seal ring 17c, a nickel plated layer 17d, and a gold (Au) plated layer 17e Are laminated. A metal cover 18 having a metal plate (iron-nickel-cobalt alloy) 18a on which nickel plating 18b is applied is placed on the nickel plating layer 17d, and the base 14 is subjected to resistance welding around the metal cover 18 while applying pressure. Seal tightly. Usually, the hermetic sealing process is performed in an atmosphere in which air is replaced with nitrogen gas.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、従来の
抵抗封止形パッケージにおいては、抵抗封止の際に金属
蓋１８のメッキ層あるいはパッケージ周辺上部のメッキ
層が急激に溶けて、小さな飛沫となって周辺に飛び散
り、この飛沫が圧電振動素子の電極上に付着すると、圧
電振動子の共振時のクリスタル・インピーダンス（Ｃ
Ｉ）が励振レベルによって大きく変動するという問題が
あった。本発明は上記問題を解決するためになされたも
のであって、セラミックベースに金属蓋を封止する際に
金属粉末の飛散を抑圧した封止方法を提供することを目
的とする。However, in the conventional resistance sealing type package, when the resistance sealing is performed, the plating layer of the metal cover 18 or the plating layer on the periphery of the package is rapidly melted and small droplets are formed. When the droplets adhere to the electrodes of the piezoelectric vibrating element, the crystal impedance at resonance of the piezoelectric vibrator (C
There is a problem that I) greatly varies depending on the excitation level. The present invention has been made to solve the above problem, and has as its object to provide a sealing method in which scattering of metal powder is suppressed when a metal lid is sealed in a ceramic base.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に本発明に係る電子部品用パッケージの請求項１記載の
発明は、セラミックベースと、該セラミックベースの周
縁と密着して該セラミックベースを封止する金属蓋とを
備えた電子部品用パッケージであって、前記セラミック
ベースと前記金属蓋との接合部分に少なくとも金層及び
錫層を含む多層構造を有し、前記金層と錫層との境界が
金と錫との共晶であることを特徴とする電子部品用パッ
ケージである。請求項２記載の発明は、前記多層構造は
セラミックベース表面から順にタングステン層とニッケ
ル層とを備えたものであることを特徴とする請求項１記
載の電子部品用パッケージである。請求項３記載の発明
は、セラミックベースと、該セラミックベースの周縁と
密着して該セラミックベースを封止する金属蓋とから成
る電子部品用パッケージの封止方法であって、前記セラ
ミックベースの周縁に金層を最上層とする積層構造を形
成する手順と、前記金属蓋に錫層を最上層とする積層構
造を形成する手順と、金層と錫層が対面するように前記
セラミックベースと前記金属蓋とを密着し、高温下で両
者間に圧力を印加する手順とからなる電子部品用パッケ
ージの封止方法である。請求項４記載の発明は、セラミ
ックベースと、該セラミックベースの周縁と密着して該
セラミックベースを封止する金属蓋とから成る電子部品
用パッケージの封止方法であって、前記セラミックベー
スの周縁に錫層を最上層とする積層構造を形成する手順
と、前記金属蓋に金層を最上層とする積層構造を形成す
る手順と、錫層と金層とが対面するように前記セラミッ
クベースと前記金属蓋とを密着し、高温下で両者に圧力
を印加する手順とからなる電子部品用パッケージの封止
方法である。According to a first aspect of the present invention, there is provided a package for an electronic component according to the present invention, wherein the ceramic base is in close contact with a peripheral edge of the ceramic base. An electronic component package having a metal lid to be sealed, having a multilayer structure including at least a gold layer and a tin layer at a joint between the ceramic base and the metal lid, wherein the gold layer and the tin layer Is a eutectic of gold and tin. The invention according to claim 2 is the electronic component package according to claim 1, wherein the multilayer structure includes a tungsten layer and a nickel layer in order from the surface of the ceramic base. The invention according to claim 3 is a method for sealing an electronic component package comprising a ceramic base and a metal lid for sealing the ceramic base in close contact with the periphery of the ceramic base, wherein the peripheral edge of the ceramic base is provided. A procedure of forming a laminated structure with a gold layer as the uppermost layer, a procedure of forming a laminated structure with a tin layer as the uppermost layer on the metal lid, and the ceramic base and the tin so that the gold layer and the tin layer face each other. This is a method for sealing an electronic component package, which comprises the steps of: adhering a metal cover and applying pressure between the two at a high temperature. The invention according to claim 4 is a method of sealing a package for an electronic component, comprising a ceramic base and a metal lid that is in close contact with the peripheral edge of the ceramic base to seal the ceramic base, wherein the peripheral edge of the ceramic base is A procedure of forming a laminated structure having a tin layer as the uppermost layer, a procedure of forming a laminated structure having a gold layer as the uppermost layer on the metal lid, and the ceramic base so that the tin layer and the gold layer face each other. A method of sealing the electronic component package, the method comprising: bringing the metal lid into close contact with the metal lid and applying pressure to both at a high temperature.
【０００６】[0006]
【発明の実施の形態】以下本発明を図面に示した実施の
形態に基づいて詳細に説明する。図１（ａ）、（ｂ）は
それぞれ本発明に係るパッケージを用いた圧電振動子の
構造を示す斜視図と、Ｑ−Ｑにおける断面図である。圧
電基板１の両主面に電極２ａ、２ｂを配置すると共に、
該電極２ａ、２ｂからそれぞれリード電極３ａ、３ｂを
圧電基板１の端部に向けて延在して、圧電振動素子Ｙを
形成する。この圧電振動素子Ｙをセラミックパッケージ
４の内底面に成形した段差部５に載置し、リード電極３
ａ、３ｂと、段差部５に焼成された電極端子とを導電性
接着剤６を用いて導通固定する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail based on an embodiment shown in the drawings. 1A and 1B are a perspective view showing a structure of a piezoelectric vibrator using a package according to the present invention and a cross-sectional view taken along line QQ. While the electrodes 2a and 2b are arranged on both main surfaces of the piezoelectric substrate 1,
The lead electrodes 3a, 3b extend from the electrodes 2a, 2b toward the ends of the piezoelectric substrate 1, respectively, to form a piezoelectric vibrating element Y. The piezoelectric vibrating element Y is placed on a step 5 formed on the inner bottom surface of the ceramic package 4 and the lead electrode 3
a, 3b and the electrode terminals fired on the step portion 5 are conductively fixed by using a conductive adhesive 6.
【０００７】ベース４の周辺上部の構造は図１（ｂ）に
示すように、セラミックにタングステンＷをメタライズ
したメタライズ層７ａと、ニッケルNiメッキ層７ｂと、
金Auメッキ層７ｃとの三層構造からなっている。この金
メッキ層７ｃに、金属８ａに錫メッキ８ｂを施した金属
蓋８を載置し、高温、例えば２８０℃の接合温度で、数
十秒間、圧力を加えながら金属蓋８とベース４とを気密
封止して圧電振動子を構成する。As shown in FIG. 1B, the structure of the upper part of the periphery of the base 4 is a metallized layer 7a obtained by metallizing tungsten W on a ceramic, a nickel Ni plated layer 7b,
It has a three-layer structure with a gold Au plating layer 7c. A metal lid 8 formed by applying tin plating 8b to a metal 8a is placed on the gold plating layer 7c, and the metal lid 8 and the base 4 are evacuated while applying pressure at a high temperature, for example, 280 ° C. for several tens of seconds. A piezoelectric vibrator is formed by tightly sealing.
【０００８】本発明の特徴は、セラミックベースの周囲
最上部に形成した金メッキ層７ｃと、金属蓋８にメッキ
した錫メッキ８ｂとの組み合わせにある。封止する際に
熱と圧力とで金Auと錫Snとが共晶（Au/Sn合金）を形成
して、セラミックベース４と金属蓋８とを接合する。こ
の接合を利用してパッケージの気密封止を行うことにあ
る。上記の例ではセラミックベース側を金メッキ層、金
属蓋側を錫メッキ層としたが、セラミックベース側を
錫、金属蓋側を金としてもよい。The feature of the present invention resides in the combination of the gold plating layer 7c formed on the uppermost part of the periphery of the ceramic base and the tin plating 8b plated on the metal lid 8. At the time of sealing, gold Au and tin Sn form a eutectic (Au / Sn alloy) by heat and pressure, and the ceramic base 4 and the metal lid 8 are joined. An object of the present invention is to perform hermetic sealing of a package using this bonding. In the above example, the ceramic base side is a gold plating layer and the metal lid side is a tin plating layer. However, the ceramic base side may be tin and the metal lid side may be gold.
【０００９】理化学辞典によるとＡｕ／Ｓｎ合金の共晶
点はＳｎ２０wt％（共晶温度２８０℃）とＳｎ９０wt％
（共晶温度２１７℃）とある。しかし、単に金メッキ層
と錫メッキ層を高温下で接合させて合金（共晶）とする
場合、上記の数値に制御するのは極めて難しい。そこ
で、保持温度を２５０℃から３００℃の範囲で圧力を一
定１０（ｇ／mm2）とし、接合時間を１０秒として金メ
ッキ面と錫メッキ面の接合実験をした結果、２８０℃±
１０℃で十分な接合強度が得られることが判明した。な
お、圧力は１０（ｇ／mm2）以上、望ましくは１０〜５
０（ｇ／mm2）とすればよく、接合時間は１０秒〜３０
秒が適している。また、保持温度を下げる場合には接合
時間を長くすればよい。According to the dictionary of physics and chemistry, the eutectic point of the Au / Sn alloy is Sn 20 wt% (eutectic temperature 280 ° C.) and Sn 90 wt%.
(Eutectic temperature 217 ° C.). However, when the gold plating layer and the tin plating layer are simply joined at a high temperature to form an alloy (eutectic), it is extremely difficult to control the above numerical values. Then, the holding temperature was set in the range of 250 ° C. to 300 ° C., the pressure was fixed at 10 (g / mm 2 ), and the bonding time was set to 10 seconds.
It was found that sufficient bonding strength was obtained at 10 ° C. The pressure is 10 (g / mm 2 ) or more, preferably 10 to 5
0 (g / mm 2 ), and the bonding time is 10 seconds to 30 seconds.
Seconds are suitable. When the holding temperature is lowered, the bonding time may be extended.
【００１０】[0010]
【発明の効果】本発明は、以上説明したように構成した
ので、セラミックパッケージと金属蓋とを容易に接合で
きると共に、その強度、気密度も十分なものが得られ
る。さらに、金と錫との共晶を利用したので、従来の抵
抗溶接等のように金属の飛沫が圧電振動素子に付着し、
その電気特性を損なうことがないという優れた効果を表
す。According to the present invention, as described above, the ceramic package and the metal lid can be easily joined, and the strength and airtightness can be sufficiently obtained. Furthermore, since the eutectic of gold and tin was used, metal droplets adhered to the piezoelectric vibrating element as in conventional resistance welding, etc.
It shows an excellent effect of not impairing its electrical characteristics.
【図１】（ａ）、（ｂ）は本発明に係るパッケージを用
いた圧電振動子の構造を示す斜視図とその断面図であ
る。FIGS. 1A and 1B are a perspective view and a sectional view showing a structure of a piezoelectric vibrator using a package according to the present invention.
【図２】（ａ）、（ｂ）は従来パッケージを用いた圧電
振動子の斜視図とその断面図、（ｃ）はパッケージ周辺
上部断面の拡大図ある。FIGS. 2A and 2B are a perspective view and a sectional view of a piezoelectric vibrator using a conventional package, and FIG. 2C is an enlarged view of an upper section around the package.
１・・圧電基板 ２ａ、２ｂ・・電極 ３ａ、３ｂ・・リード電極 ４・・セラミックベース ５・・段差部 ６・・導電性接着剤 ７・・セラミックベースのフランジ ７ａ・・タングステン層 ７ｂ・・ニッケルメッキ層 ７ｃ・・金メッキ層あるいは錫メッキ層 ８・・金属蓋 ８ａ・・金属板 Ｙ・・圧電振動素子 ８ｂ・・錫メッキ層あるいは金メッキ層 1, piezoelectric substrate 2a, 2b, electrode 3a, 3b, lead electrode 4, ceramic base 5, step 6, conductive adhesive 7, ceramic base flange 7a, tungsten layer 7b Nickel plated layer 7c Gold plated layer or tin plated layer 8 Metal lid 8a Metal plate Y Piezoelectric vibrating element 8b Tin plated layer or gold plated layer
Claims (4)
スの周縁と密着して該セラミックベースを封止する金属
蓋とを備えた電子部品用パッケージであって、 前記セラミックベースと前記金属蓋との接合部分に少な
くとも金層及び錫層を含む多層構造を有し、前記金層と
錫層との境界が金と錫との共晶であることを特徴とする
電子部品用パッケージ。1. A package for an electronic component, comprising: a ceramic base; and a metal lid that is in close contact with a peripheral edge of the ceramic base and seals the ceramic base, wherein a joining portion between the ceramic base and the metal lid is provided. A multilayer structure including at least a gold layer and a tin layer, wherein the boundary between the gold layer and the tin layer is a eutectic of gold and tin.
ら順にタングステン層とニッケル層とを備えたものであ
ることを特徴とする請求項１記載の電子部品用パッケー
ジ。2. The electronic component package according to claim 1, wherein said multilayer structure includes a tungsten layer and a nickel layer in order from a ceramic base surface.
スの周縁と密着して該セラミックベースを封止する金属
蓋とから成る電子部品用パッケージの封止方法であっ
て、前記セラミックベースの周縁に金層を最上層とする
積層構造を形成する手順と、前記金属蓋に錫層を最上層
とする積層構造を形成する手順と、金層と錫層が対面す
るように前記セラミックベースと前記金属蓋とを密着
し、高温下で両者間に圧力を印加する手順とからなる電
子部品用パッケージの封止方法。3. A method for sealing an electronic component package comprising a ceramic base and a metal lid for sealing the ceramic base in close contact with the periphery of the ceramic base, wherein a gold layer is provided on the periphery of the ceramic base. A procedure for forming a laminated structure having a top layer as a top layer, a procedure for forming a laminated structure having a tin layer as a top layer on the metal lid, and the ceramic base and the metal lid so that a gold layer and a tin layer face each other. And applying a pressure between the two at a high temperature.
スの周縁と密着して該セラミックベースを封止する金属
蓋とから成る電子部品用パッケージの封止方法であっ
て、前記セラミックベースの周縁に錫層を最上層とする
積層構造を形成する手順と、前記金属蓋に金層を最上層
とする積層構造を形成する手順と、錫層と金層とが対面
するように前記セラミックベースと前記金属蓋とを密着
し、高温下で両者に圧力を印加する手順とからなる電子
部品用パッケージの封止方法。4. A method for sealing an electronic component package comprising a ceramic base and a metal lid for sealing the ceramic base in close contact with the periphery of the ceramic base, wherein a tin layer is provided on the periphery of the ceramic base. Forming a laminated structure with a top layer as a top layer, forming a laminated structure with a gold layer as a top layer on the metal lid, and forming the ceramic base and the metal lid such that a tin layer and a gold layer face each other. And a step of applying pressure to both at a high temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28947399A JP2001110922A (en) | 1999-10-12 | 1999-10-12 | Package for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28947399A JP2001110922A (en) | 1999-10-12 | 1999-10-12 | Package for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001110922A true JP2001110922A (en) | 2001-04-20 |
Family
ID=17743739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28947399A Withdrawn JP2001110922A (en) | 1999-10-12 | 1999-10-12 | Package for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001110922A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100542484B1 (en) * | 2001-12-28 | 2006-01-16 | 주식회사 에그 바이오택 | Method for producing eggs containing E. coli, Salmonella enteritidis, Salmonella typhimurium, Helicobacter pylori, Rotavirus special immune protein and egg yolk, egg yolk powder or water-soluble complex special immune protein powder Ice cream and yogurt |
| JP2006135264A (en) * | 2004-11-09 | 2006-05-25 | Murata Mfg Co Ltd | Method for manufacturing electronic component, and electronic component using the method |
| CN103107141A (en) * | 2013-02-16 | 2013-05-15 | 马国荣 | Parcel-gilt cover plate structure |
| CN104070294A (en) * | 2013-03-28 | 2014-10-01 | Tdk株式会社 | Junction structure for an electronic device and electronic device |
| CN105989863A (en) * | 2015-03-20 | 2016-10-05 | Tdk株式会社 | Magnetic head device |
-
1999
- 1999-10-12 JP JP28947399A patent/JP2001110922A/en not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100542484B1 (en) * | 2001-12-28 | 2006-01-16 | 주식회사 에그 바이오택 | Method for producing eggs containing E. coli, Salmonella enteritidis, Salmonella typhimurium, Helicobacter pylori, Rotavirus special immune protein and egg yolk, egg yolk powder or water-soluble complex special immune protein powder Ice cream and yogurt |
| JP2006135264A (en) * | 2004-11-09 | 2006-05-25 | Murata Mfg Co Ltd | Method for manufacturing electronic component, and electronic component using the method |
| CN103107141A (en) * | 2013-02-16 | 2013-05-15 | 马国荣 | Parcel-gilt cover plate structure |
| CN104070294A (en) * | 2013-03-28 | 2014-10-01 | Tdk株式会社 | Junction structure for an electronic device and electronic device |
| JP2014192521A (en) * | 2013-03-28 | 2014-10-06 | Tdk Corp | Junction structure for electronic device and electronic device |
| CN104070294B (en) * | 2013-03-28 | 2017-04-12 | Tdk株式会社 | Junction structure for an electronic device and electronic device |
| US10205250B2 (en) | 2013-03-28 | 2019-02-12 | Tdk Corporation | Junction structure for an electronic device and electronic device |
| CN105989863A (en) * | 2015-03-20 | 2016-10-05 | Tdk株式会社 | Magnetic head device |
| CN105989863B (en) * | 2015-03-20 | 2019-01-11 | Tdk株式会社 | Magnetic head assembly |
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