JP2001110576A - Organic el element and manufacturing process for it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture organic EL elements having different thickness and different material of wiring of an electrode and wiring for another electrode, maintaining the prescribed light emitting area. SOLUTION: The anode 3 and lead out part 3b are formed on the substrate 2. The anode 3 corresponds to the shape of the light emitting part 10. The lead out part 3b is drawn up from the anode 3 to the edge of substrate 2. The organic layer 5 is laminated on the anode 3 using metal mask 4A. The cathode 6 and the cathode wiring 6b are formed on the organic layer 5 using a metal mask 4B. The anode wiring 7 is formed using a metal mask 4C on the lead out part 3b of the anode 3, which is separated for prescribed gap from the light emitting part 10 of a part of the organic layer 5. The organic layer 5 is inserted between the anode 3 and the cathode 6. The cathode 6 the cathode wiring 6b, and the anode wiring 7 are formed to have different film thickness using the different or equal material by suiting usage of metal mask 4B and metal mask 4C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescence device (hereinafter abbreviated as an organic EL device) in which a thin film of an organic compound material is laminated between a pair of electrodes at least one of which is a transparent electrode, and a method of manufacturing the same. About.

[0002]

2. Description of the Related Art An organic EL device has a structure in which a thin film containing a fluorescent organic compound is sandwiched between an anode and a cathode forming a pair of electrodes, and holes (holes) and electrons are injected into the thin film. An exciton is generated by recombination, and display is performed using light emission (fluorescence / phosphorescence) when the exciton is deactivated.

FIGS. 20 and 21 show Japanese Patent Application Laid-Open No. 5-30799.
7 shows the structure of a conventional organic EL device disclosed in Japanese Patent Application Laid-Open No. 7-107.

[0004] The organic EL element 51 shown in FIGS.
A transparent anode 53, a metal film 54 having a lower work function than the transparent anode 53, and an organic hole transport layer 5
5, a light emitting layer 56 made of an organic compound and a metal cathode 57 are sequentially stacked. The metal film 54 is made of an alloy in which Al is doped with a small amount of Li having a low work function.
3 and a part between the hole transport layer 55. This prevents holes from being injected from the anode wiring of the transparent anode 53, thereby reducing the wiring resistance.

[0005]

However, in the above-described organic EL device 51 shown in FIGS. 20 and 21, a step of forming a metal film 54 having a work function lower than that of the transparent anode 53 on the line of the transparent electrode 53. Increase. In order to prevent holes from being injected from the wiring of the transparent anode 53, the transparent anode 5
A metal film 54 made of an alloy in which Al is doped with a small amount of Li having a low work function can be used as an anode wiring between the hole transport layer 3 and the hole transport layer. In the vicinity of the interface with the transport layer 55, the work function is close to that of Al, and holes may be injected. Moreover, when co-evaporating Al and Li by binary evaporation, there is a problem that the rate control is difficult. In addition, there is a possibility that the portion of the metal film 54 becomes a shadow, causing luminance unevenness.

As another structure of the above-mentioned conventional organic EL device, FIGS. 22 and 23 show a structure of an organic EL device disclosed in Japanese Patent Application Laid-Open No. 8-315981.

The organic EL device 61 shown in FIGS. 22 and 23
Has a configuration in which simple matrix driving is performed by an XY matrix electrode having a stripe shape, and a partition having an electrically insulating overbank portion is used to pattern the cathode electrode in a stripe shape.

[0008] To further explain, on the substrate 62, ITO
A first display electrode line 63 is provided. The first display electrode lines 63 are arranged in a plurality of stripes parallel to each other. On the substrate 62 and the first display electrode lines 63, a plurality of electrically insulating partitions 64 projecting from the substrate 62 so as to be orthogonal to the first display electrode lines 63 are formed. The partition 64 is formed so that at least a part of the first display electrode line 63 is exposed.

On the upper part of the partition 64, an overhang portion 65 protruding in a direction parallel to the substrate 62 is formed along the extending direction of the partition 64. At least one layer of the organic EL medium thin film 66 is formed on each of the exposed portions of the first display electrode lines 63. On the thin film 66 of the organic EL medium, a second display electrode line 67 is formed along the extension direction. The portion of the organic EL medium sandwiched between the first and second display electrode lines 63 and 67 corresponds to a light emitting portion.

The organic EL device 61 shown in FIGS. 22 and 23
In the case of forming the wiring (anode wiring) of the first display electrode line 63 made of a transparent electrode, a wiring having a low resistivity, such as Al, is formed on the first display electrode line 63 by a photolithography method. Can be considered to be covered with an insulating film by a photolithography method. However, there is a problem that the number of manufacturing steps is increased by the amount of the anode wiring step for forming the wiring of the first display electrode line 63. In addition, since a wiring is formed on the first display electrode line 63 and is covered with the insulating film, there is a problem that the light emitting area is reduced accordingly.

As described above, in the conventional organic EL element, a metal such as Al is used as the anode wiring in order to prevent luminance unevenness in each pixel due to the use of ITO having a higher resistivity than the metal material. In addition to increasing the number of steps for fabricating the element, the light-emitting portion is not only shaded and the light-emitting area is reduced,
An element in which the thickness and the material of the anode wiring and the cathode are different from each other cannot be easily manufactured.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has been made in consideration of the above-described problems. In order to prevent a reduction in electrode wiring resistance, a film formed of an electrode wiring of one electrode and an electrode wiring of the other electrode is formed. It is an object of the present invention to provide an organic EL device capable of easily manufacturing devices having different thicknesses and materials while securing a predetermined light emitting area, and a method for manufacturing the same.

[0013]

To achieve the above object, according to the first aspect of the present invention, an organic layer including a light emitting layer is provided between a pair of electrodes, at least one of which is a transparent electrode,
In the organic EL element in which the portion of the organic layer sandwiched between the pair of electrodes constitutes a light emitting portion, the electrode wiring of one electrode and the electrode wiring of the other electrode located at a place other than the light emitting portion are: It is characterized by comprising metal films of different materials or metal films of the same material but of different thicknesses.

According to a second aspect of the present invention, an organic layer including a light emitting layer is provided between a pair of electrodes at least one of which is a transparent electrode, and a portion of the organic layer sandwiched between the pair of electrodes constitutes a light emitting portion. In the organic EL element to be formed, a first electrode formed in a predetermined pattern shape on an insulating substrate corresponding to the light emitting unit and a part of the first electrode apart from a position corresponding to the light emitting unit are exposed. An insulating layer formed on the first electrode such that the first electrode is exposed at least at a position corresponding to the light emitting unit and is divided in a predetermined region; and an insulating layer formed in the region defined by the insulating layer. An organic layer formed on the first electrode corresponding to at least a region of the light emitting unit, and a second electrode formed on the organic layer, the second electrode being located other than the light emitting unit. One electrode wiring and the second electrode The use of the electrode wire, characterized by comprising the different thicknesses of the metal film is a metal film or the same materials of different materials.

According to a third aspect of the present invention, in the organic EL device of the second aspect, the insulating layer is formed in a shape of the light emitting portion and formed on the first electrode and the electrode wiring. And an insulating rib formed on the insulating film so that the pair of electrodes and the second electrode are electrically insulated from each other.

According to a fourth aspect of the present invention, in the organic EL device of the third aspect, the first electrode and the second electrode are formed in a stripe shape crossing each other.

According to a fifth aspect of the present invention, an organic layer including a light emitting layer is provided between a pair of electrodes at least one of which is a transparent electrode, and a portion of the organic layer sandwiched between the pair of electrodes is a light emitting portion. In the method for manufacturing an organic EL element, the electrode wiring of one electrode and the electrode wiring of the other electrode located in places other than the light emitting portion are formed of a metal film of a different material or a metal film of the same material having a different thickness. The method is characterized by including a step of forming a film.

According to a sixth aspect of the present invention, an organic layer including a light emitting layer is provided between a pair of electrodes at least one of which is a transparent electrode, and a portion of the organic layer sandwiched between the pair of electrodes constitutes a light emitting portion. Forming a first electrode and an electrode wiring on an insulating substrate corresponding to the light emitting unit; and forming the first electrode separated from a position corresponding to the light emitting unit. Forming an insulating layer on the first electrode and the electrode wiring such that a portion is exposed and the first electrode is exposed at least at a position corresponding to the light emitting unit and is divided into predetermined regions; Forming an organic layer on at least the first electrode corresponding to a region of the light emitting portion in a region defined by the insulating layer using a mask, and forming a first organic layer on the organic layer using a metal mask. Forming two electrodes; Characterized in that it comprises a step of further forming an electrode wiring on the exposed portion of the electrode wiring of the first electrode using a metal mask.

According to a seventh aspect of the present invention, an organic layer including a light emitting layer is provided between a pair of electrodes at least one of which is a transparent electrode, and a portion of the organic layer sandwiched between the pair of electrodes constitutes a light emitting portion. Forming a first electrode and an electrode wiring on an insulating substrate corresponding to the light emitting unit; and forming the first electrode and the electrode in the shape of the light emitting unit. Forming an insulating film on the wiring, and forming insulating ribs on the insulating layer in a pattern shape in which the pair of electrodes and the electrodes formed on the organic layer are electrically insulated. Forming an organic layer on the first electrode corresponding to at least a region of the light emitting portion in a region defined by the insulating layer and the insulating rib using a metal mask; Using the organic layer from the top Forming a electrode and the electrode wiring, characterized in that it comprises a step of forming a further wiring electrode on the exposed portion of the electrode wiring of the first electrode using a metal mask.

[0020]

1 (a) to 1 (e) are views showing a first embodiment of an organic EL device according to the present invention, which is a partially enlarged plan view showing a manufacturing process thereof, and FIGS. ) To (c)
FIG. 4 is a cross-sectional view showing a manufacturing process of the organic EL element. In each drawing, only the substrate on which the element is formed is shown, and the configuration of the sealing member sealed on the substrate is omitted.

Hereinafter, the structure of the organic EL device according to the first embodiment will be described along the procedure of the manufacturing process with reference to FIGS.

As shown in FIGS. 1 and 2, the organic EL element 1A (1) has a 3 × 2 display pattern on the substrate 2 and is made of a transparent and insulating substrate 2 such as glass. Is based. First, FIGS. 1A and 2A
As shown in (1), an anode 3 as a first electrode and a lead-out section (electrode wiring) 3b are formed in a predetermined pattern shape on a substrate 2 by using a technique such as a sputtering method, a molecular beam evaporation method, and a photolithography method. I do.

As shown in FIG. 1A, the anode 3 is composed of three rectangular parts. At the lower end of each anode 3, an L-shaped lead-out portion (electrode wiring) 3b extended to the left end of the substrate 2 is integrally formed. The anode 3 and the lead portion 3b are made of a transparent material having a surface work function of 4.0 eV or more, such as ITO (composite oxide of indium oxide and tin).

Next, as shown in FIGS. 1B and 2B, an organic layer 5 is formed on the anode 3 using a metal mask 4A. As shown by hatching in FIG. 1B, the metal mask 4A has a light emitting area of the light emitting unit 10 (corresponding to a portion of the organic layer 5 sandwiched between the anode 3 and the cathode 6 formed in a later step). ) Is used that has an opening in a region that sufficiently covers the above.

Then, the portion other than the portion corresponding to the light emitting portion 10 on the anode 3 is covered with a metal mask 4A, and the organic layer 5 is formed in a rectangular shape slightly larger than the anode 3. This organic layer 5
It is formed into a single layer of only a light emitting layer that emits light of a predetermined color (for example, green, red, or the like) or a multilayer including a light emitting layer that emits light of a predetermined color.

Next, as shown in FIGS. 1C and 2C, a cathode 6 as a second electrode and a cathode wiring (electrode wiring) are formed on the organic layer 5 laminated on the anode 3. ) 6b is formed using the metal mask 4B. As shown in FIG. 1 (c), the cathode 6 has a rectangular shape orthogonal to the anode 3.
Consists of two parts. At the left end of each cathode 6, an L-shaped cathode wiring 6b extending to the upper end of the substrate 2 is integrally formed. The cathode 6 and the cathode wiring 6b are formed of the organic layer 5
Are formed so as not to intersect with the anode 3 and the lead-out portion 3b except for the light-emitting portion 10 with the. As shown in FIG. 1C and FIG. 2C, the metal mask 4B has a region covering the light-emitting area of the light-emitting portion 10 and a region between the metal mask 4B and the upper end of the substrate 2 communicating with this region. Cathode 6 and cathode wiring 6b
The one having an opening at the formation position is used.

Then, as shown in FIG.
A cathode 6 is formed on the organic layer 5 so as to face the cathode, and a cathode wiring 6b is formed so as to be drawn out to the upper end of the substrate 2 continuously to the cathode 6.

Next, as shown in FIGS. 1D and 2D, a metal mask 4C is placed on the lead-out portion 3b of the anode 3 with a predetermined gap H1 from the anode 3 (light-emitting portion 10). The anode wiring 7 is formed by using this. As shown in FIG. 1D and FIG. 2D, the metal mask 4C having an opening at the position of the lead-out portion 3b of the anode 3 with a predetermined gap H1 from the anode 3a is used. . And FIG.
As shown in (d), six rectangular portions of the organic layer 5 sandwiched between the anode 3 and the cathode 6 function as the light emitting unit 10.

The above-mentioned cathode 6, cathode wiring 6b and anode wiring 7
Are materials having a lower resistivity than the material of the anode 3 (materials having a small work function), simple metals such as Li, Na, Mg, Ca and the like, and compounds thereof, or Al: Li, M
Various alloys such as g: In and Mg: Ag can be used.

The cathode 6, the cathode wiring 6b and the anode wiring 7 can be made of the same material or different materials by using a metal mask. Further, it is possible to form the cathode 6, the cathode wiring 6b and the anode wiring 7 with different thicknesses.

It is preferable that the cathode 6 be made of an alloy such as Al: Li having a small work function so that electrons can be easily injected into the organic layer 5. Therefore, after forming the cathode 6, the cathode wiring 6b and the anode wiring 7 may be formed at the same time.

Although not shown, the cathode 6 and the cathode wiring 6 are not shown.
After the formation of b and the anode wiring 7, a sealing member (a substrate such as glass, a metal cap, etc.) is sealed on the upper surface of the substrate 2 in an inert gas from which moisture has been sufficiently removed, and sealing is performed. Complete the fabrication process for 1A.

FIG. 3 is a sectional view showing a second embodiment of the organic EL device according to the present invention. The organic EL device according to the second embodiment is manufactured by the same steps as those in the first embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

The organic EL device 1B (1) of the second embodiment
Is a modification of the organic EL element 1A of the first embodiment. That is, in the organic EL element 1B of the second embodiment, the lead-out portion (electrode wiring) 3b of the anode 3 is drawn out toward the lower end of the substrate 2 to an intermediate position, and is formed shorter than in the first embodiment. ing. As shown in FIG. 3, the length of the lead-out portion 3b may be equal to or greater than the gap H1 and may have a portion where the anode wiring 7 partially overlaps.

Next, FIGS. 4 to 11 show the organic E according to the present invention.
13 shows a third embodiment of the L element. 4 (a) is a partially enlarged plan view of the organic EL element, FIG. 4 (b) is a partially enlarged plan view showing a state where the cathode and anode wirings are peeled off in FIG. 4 (a), and FIG. 6 is a sectional view taken along line BB of FIG. 4 (a), and FIG. 7 is a sectional view taken along line CC of FIG. 4 (a).
8 is a sectional view taken along line DD of FIG. 4A, FIG. 9 is a sectional view taken along line EE of FIG. 4A, and FIGS. Sectional drawing which shows a manufacturing process, FIG.
FIG. 11C is a cross-sectional view showing a manufacturing step of the organic EL element following FIG. 10. In each drawing, only the substrate on which the element is formed is shown, and the configuration of the sealing member sealed on the substrate is omitted.

Hereinafter, the structure of the organic EL device according to the third embodiment will be described along the procedure of the manufacturing process with reference to FIGS.

As shown in FIG. 4, the organic EL element 1C (1) of the third embodiment has two vertically long rectangular fixed display patterns arranged side by side with respect to the substrate 2. The substrate 2 is made of a transparent and insulating substrate 2 such as glass. First, as shown in FIGS. 10A and 10B, an anode 3 as a first electrode is formed on a substrate 2 by a method such as a sputtering method or a molecular beam evaporation method, and then is formed by a photolithography method. Is formed in a pattern shape.

As shown in FIG. 4B and the cross-sectional views of FIGS. 5 to 9, the anode 3 is composed of two stripe-shaped patterns formed in parallel on the left and right sides of the substrate 2. The space is connected at the upper end. The anode 3 is made of, for example, IT
It is composed of a transparent material having a surface work function of 4.0 eV or more, such as O (composite oxide of indium oxide and tin).

Next, as shown in FIG.
An insulating film (insulating layer) 11 is formed thereon. Insulating film 11
Is formed on the anode 3 so as to cover portions other than the anode wiring 7 and the light emitting portion 10 formed in a later step. The insulating film 11
For example, in addition to the negative photosensitive polyimide, it can be composed of an insulating material that can be deposited as a thin film, such as SiN or SiO ₂ . In this example, the insulating film 11 is formed using negative photosensitive polyimide.

When the insulating film 11 is formed, a predetermined coating thickness (for example, 1) is formed on the anode 3 by spin coating.
A negative photosensitive polyimide film is formed so as to have a thickness of 5 μm), and a predetermined pre-bake treatment is performed. Then, the light emitting unit 10 and the anode wiring 7 are formed on the anode 3 by using an exposure mask manufactured so as to cover portions other than the light emitting unit 10 and the anode wiring 7 on the anode 3.
Exposure processing is performed on the insulating pattern portion other than the portion to be formed.
After completion of the development, a predetermined imide treatment is performed. Thus, the insulating film 11 having a predetermined pattern is formed on the anode 3. As shown in FIG. 4B and the cross-sectional views of FIGS. 5 to 9, the insulating film 11 is stacked on the anode 3 so as to cover portions other than the right edge portion of the anode 3 and a portion corresponding to the light emitting unit 10. It is formed.

Next, as shown in FIG. 10D, an insulating rib (insulating layer) 12 is formed on the insulating film 11. The insulating rib 12 is formed on the insulating film 11 with a predetermined height so as to form a light emitting area of the light emitting unit 10. Like the insulating film 11, the insulating rib 12 is made of, for example, a negative photosensitive polyimide, or a thin-film insulating material Si
It can be made of N, SiO ₂ or the like. In this embodiment, the insulating ribs 12 are formed using negative photosensitive polyimide.

When the insulating ribs 12 are formed, a negative photosensitive polyimide film is formed on the insulating film 11 by a spin coating method so as to have a predetermined coating thickness (for example, 20 μm), and a predetermined prebaking is performed. Perform processing. Thereafter, the negative photosensitive polyimide film is processed with an appropriate exposure using an exposure mask manufactured so as to form a light emitting area of the light emitting section 10. After the exposure, development and rinsing are performed under predetermined conditions. As a result, the insulating ribs 12 having a predetermined pattern are formed on the insulating film 11.

Next, as shown in FIG. 11A, a metal mask 13 is placed on the anode 3 partitioned by the insulating ribs 12.
A is used to form an organic layer 5, and a cathode 6 (including an electrode wiring) is formed on the organic layer 5 as shown in FIG. As the metal mask 13A, a metal mask having an opening in a region defined by the insulating ribs 12 (corresponding to a light emitting area of the light emitting portion 10 of the organic layer 5 sandwiched between the anode 3 and the cathode 6) is used. Then, a portion other than the portion corresponding to the light emitting unit 10 is covered with the metal mask 13A, and the organic layer 5 is formed on the anode 3 in a region defined by the insulating rib 12,
The cathode 6 is formed on the organic layer 5.

The organic layer 5 is formed as a single layer of only a light emitting layer that emits light of a predetermined color (for example, green or red) or a multilayer including a light emitting layer that emits light of a predetermined color.

Next, as shown in FIGS. 4A and 11C, the right edge portion of the anode 3 exposed by using the metal mask 13B so as to cover the anode 3 partitioned by the insulating ribs 12 is formed. An anode wiring 7 is formed thereon. As the metal mask 13B, a mask having an opening in a portion other than a region defined by the insulating ribs 12 (corresponding to a light emitting area of the light emitting portion 10 of the organic layer 5 sandwiched between the anode 3 and the cathode 6) is used. .
Then, as shown in FIG. 4B and the cross-sectional views of FIGS. 5 to 9, a vertically long rectangular portion of the organic layer 5 sandwiched between the anode 3 and the cathode 6 becomes the light emitting unit 10. The formation of the cathode 6 and the anode wiring 7 is performed by normal forward evaporation, and there is no particular need for oblique evaporation.

In the above configuration, electrical insulation between the anode 3 and the cathode 6 is achieved via the insulating film 11 and the insulating rib 12. Electrical insulation between the adjacent cathodes 6 is achieved by the insulating ribs 12. Further, the cathode 6 from the organic layer 5 is uniquely defined by self-alignment.

As the material of the cathode 6 (including the electrode wiring) and the anode wiring 7, a material having a lower resistivity (a material having a lower work function) than the material of the anode 3, for example, Li, Na,
Simple metals such as Mg and Ca and their compounds, or A
Various alloys such as l: Li, Mg: In, and Mg: Ag can be used.

The cathode 6 (including the electrode wiring) and the anode wiring 7 can be made of different materials as well as the same material by using different metal masks. Further, a cathode 6 (including an electrode wiring) and an anode wiring 7
Can be formed with different thicknesses.

As described in the first embodiment, the cathode 6 is preferably made of an alloy such as Al: Li having a small work function so that electrons can be easily injected into the organic layer 5. The electrode wiring 6 and the anode wiring 7 need only have at least conductivity.

Therefore, after forming the cathode 6 on the organic layer 5 using the metal mask 13A, the electrode wiring and the anode wiring 7 of the cathode 6 may be formed simultaneously without using the metal mask 13B. .

Although not shown, after forming the cathode 6 and the anode wiring 7, a sealing member (a substrate of glass or the like, a metal cap, etc.) is sealed on the upper surface of the substrate 2 in an inert gas from which moisture has been sufficiently removed. To complete the manufacturing process of the organic EL element 1C.

Next, FIGS. 12 to 19 show an organic EL device according to a fourth embodiment of the present invention. 12 is a partially enlarged plan view of the organic EL element, FIGS. 13A to 13D are cross-sectional views taken along lines FF, GG, HH, and II in FIG. 12, and FIG. FIG. 15 is a partially enlarged plan view of a state in which an insulating film is formed from the state of FIG. 14, and FIG. 16 is a partially enlarged plan view of a state in which an insulating rib is formed from the state of FIG. FIG. 17 is a partially enlarged plan view showing a state where an organic layer is formed from the state shown in FIG. 16, and FIGS. 18 (a) to 18 (c).
Is a cross-sectional view showing a manufacturing process of the organic EL device, and FIG.
FIG. 19C is a cross-sectional view showing a step of manufacturing the organic EL element following FIG. In each drawing, only the substrate on which the element is formed is shown, and the configuration of the sealing member sealed on the substrate is omitted.

Hereinafter, the structure of the organic EL device according to the fourth embodiment will be described with reference to FIGS.

As shown in FIG. 12, the organic EL element 1D (1) of the fourth embodiment has a rectangular display pattern arranged in a matrix with respect to the substrate 2 and is made of a transparent material such as glass. The substrate 2 has properties and insulating properties. First, as shown in FIG. 18A, an anode 3 as a first electrode is formed on a substrate 2 by a method such as a sputtering method or a molecular beam evaporation method, and then formed into a predetermined pattern shape by a photolithography method. Form.

As shown in FIGS. 13 (a) to 13 (d) and FIG. 14, the anode 3 is composed of four stripe-shaped patterns formed in parallel with a predetermined interval in the vertical direction of the substrate 2. The anode 3 is made of a transparent material having a surface work function of 4.0 eV or more, such as ITO (composite oxide of indium oxide and tin).

Next, as shown in FIG.
An insulating film (insulating layer) 11 is formed thereon. Insulating film 11
Is formed on the anode 3 so as to form a light emitting area of the light emitting section 10. The insulating film 11 is made of, for example, a negative photosensitive polyimide or an insulating material that can be deposited as a thin film.
It can be made of iN, SiO ₂ or the like. In this example, the insulating film 11 is formed using negative photosensitive polyimide.

When the insulating film 11 is formed, a predetermined coating thickness (for example, 1) is formed on the anode 3 by spin coating.
A negative photosensitive polyimide film is formed so as to have a thickness of 5 μm), and a predetermined pre-bake treatment is performed. Then, the light emitting unit 10 and the anode wiring 7 are formed on the anode 3 by using an exposure mask manufactured so as to cover portions other than the light emitting unit 10 and the anode wiring 7 on the anode 3.
Exposure processing is performed on the insulating pattern portion other than the portion to be formed.
After completion of the development, a predetermined imide treatment is performed. Thus, the insulating film 11 having a predetermined pattern is formed on the anode 3.

The insulating film 11 in this example is formed as shown in FIG.
15 (d) and FIG. 15, the anodes 3 are laminated on the anodes 3 so as to cover the upper and lower edges of the anodes 3, and are arranged in a stripe shape at predetermined intervals perpendicular to the anodes 3. A laminate is formed from above the anode 3. Thereby, the anode 3 is partitioned so as to form a light emitting area of the light emitting unit 10.

Next, as shown in FIG. 18C, an insulating rib (insulating layer) 12 is formed on the insulating film 11. The insulating ribs 12 are formed on the insulating film 11 except for the region where the organic layer 5 is laminated.
Are formed at a predetermined height on the substrate. Insulating rib 12
In the same manner as the insulating film 11, for example, in addition to a negative photosensitive polyimide, SiN or Si which is an insulating material that can be deposited in a thin film.
It can be composed of O ₂ or the like. In this embodiment, the insulating ribs 12 are formed using negative photosensitive polyimide.

When the insulating ribs 12 are formed, a negative photosensitive polyimide film is formed on the insulating film 11 by a spin coating method so as to have a predetermined coating thickness (for example, 20 μm), and a predetermined prebaking is performed. Perform processing. Thereafter, the negative photosensitive polyimide film is processed with an appropriate exposure using an exposure mask manufactured so as to form a light emitting area of the light emitting section 10. After the exposure, development and rinsing are performed under predetermined conditions. As a result, the insulating ribs 12 having a predetermined pattern are formed on the insulating film 11.

The insulating ribs 12 in the present example correspond to FIG.
As shown in FIGS. 16A to 16D and FIG. 16, the upper, lower, left, and right parts are pulled out to the end of the substrate 2 except for the region where the organic layer 5 is laminated, and are formed in a ladder shape on the insulating film 11. .

Next, as shown in FIG. 17 and FIG. 19A, the organic layer 5 is formed on the anode 3 partitioned by the insulating film 11 and the insulating rib 12 using the metal mask 14A. A metal mask having an opening in a region defined by the insulating ribs 12 is used as the metal mask 14A.

Then, the portion other than the region defined by the insulating ribs 12 is covered with a metal mask 14A, and the organic layer 5 is formed on the anode 3 in the region defined by the insulating ribs 12. In the example of FIG. 17, an organic layer that emits red light, an organic layer that emits green light from the left of the region partitioned by the insulating ribs 12,
Organic layers that emit blue light are sequentially stacked, and one pixel is constituted by these red, green, and blue light-emitting portions. This enables full-color matrix display. If the organic layer is formed of an organic layer that emits light of the same single color, a monochrome display is obtained. The organic layer 5 is formed as a single layer of only a light emitting layer emitting light of a predetermined color or a multilayer including a light emitting layer emitting light of a predetermined color.

Next, as shown in FIG. 19B, a cathode 6 (including an electrode wiring) is formed on the organic layer 5 using the metal mask 14A. Subsequently, as shown in FIG. 19C, the anode wiring 7 is formed on the right edge portion of the exposed anode 3 using the metal mask 14B so as to cover the anode 3 partitioned by the insulating ribs 12. As the metal mask 14B, a metal mask having an opening in a portion other than a region defined by the insulating ribs 12 (corresponding to a light emitting area of the light emitting portion 10 of the organic layer 5 sandwiched between the anode 3 and the cathode 6) is used. .
Then, a rectangular portion of the organic layer 5 sandwiched between the anode 3 and the cathode 6 becomes the light emitting unit 10. The above-mentioned cathode 6 and anode wiring 7
Is formed by ordinary normal vapor deposition, and it is not particularly necessary to perform vapor deposition from an oblique direction.

In the above configuration, electrical insulation between the anode 3 and the cathode 6 is achieved through the insulating film 11 and the insulating ribs 12. Electrical insulation between the adjacent cathodes 6 is achieved by the insulating ribs 12. Further, the cathode 6 from the organic layer 5 is uniquely defined by self-alignment.

As the material of the cathode 6 (including the electrode wiring) and the anode wiring 7, a material having a lower resistivity (a material having a lower work function) than the material of the anode 3, for example, Li, Na,
Simple metals such as Mg and Ca and their compounds, or A
Various alloys such as l: Li, Mg: In, and Mg: Ag can be used.

The cathode 6 (including the electrode wiring) and the anode wiring 7 can be made of different materials as well as the same material by using a different metal mask. Further, a cathode 6 (including an electrode wiring) and an anode wiring 7
Can be formed with different thicknesses.

As in the first and second embodiments, it is preferable to use an alloy such as Al: Li having a small work function so that electrons can be easily injected into the organic layer 5 as in the first and second embodiments. The use wiring and the anode wiring 7 only need to have at least conductivity.

Therefore, after forming the cathode 6 on the organic layer 5 using the metal mask 13A, the electrode wiring and the anode wiring 7 of the cathode 6 may be simultaneously formed without using the metal mask 13B. .

Although not shown, after forming the cathode 6 and the anode wiring 7, a sealing member (a substrate such as glass, a metal cap, etc.) is sealed on the upper surface of the substrate 2 in an inert gas from which moisture has been sufficiently removed. To complete the manufacturing process of the organic EL element 1D.

In the third and fourth embodiments described above,
The photosensitive polyimide film for forming the insulating film 11 has a coating thickness of 15 μm, and the photosensitive polyimide film for forming the insulating ribs 12 has a coating thickness of 20 μm. After exposure, development and rinsing are performed under predetermined conditions. Is performed, the insulating rib 12
Is 33 μm, and the thickness of the insulating film is 3 μm. After that, a heat treatment (imidization) for 30 minutes at a hold at a peak of 400 ° C. in a nitrogen atmosphere is performed.
Finally, the total thickness of the insulating ribs is 16 μm, and the thickness of the insulating film is 1.5 μm.

The total thickness of the insulating film 11 and the insulating ribs 12 is preferably more than 10 μm and not more than 50 μm.
In each embodiment, the pattern of the organic layer 5 is
In particular, it is not necessary to have a stripe shape, and the shape of the light emitting unit 10 is not limited to a rectangular shape.

As described above, according to the organic EL device of the present embodiment, the anode wiring 7 of the anode 3 and the electrode wiring (cathode wiring 6b) of the cathode 6 are partially separated by using a mask in accordance with the pattern shape. By vapor deposition, different materials or the same material can be formed with different thicknesses. In addition, a desired light emitting area can be sufficiently secured and the device can be easily manufactured without hindering light emission by wiring as in the related art.

Further, the anode wiring 7 can be formed of a metal material such as Al having a lower resistivity than the anode 3 at a position separated from the light emitting portion 10 and at least a part thereof has a two-layer structure. The reliability of the wiring can be improved.

By the way, the anode 3 and the cathode 6 in each of the above embodiments may be reversed. In this case, since light emission is observed from the anode 3 side, the substrate 2 does not need to have translucency, and the sealing member on the cathode 6 side is formed of a translucent member. That is, the pair of electrodes (the anode 3 and the cathode 6) only needs to be formed of a conductive material (transparent electrode) having at least transparency on the electrode side from which light is emitted.

[0076]

As is apparent from the above description, according to the present invention, a desired light emitting area is secured by performing partial vapor deposition using a mask according to the pattern shape.
The electrode wiring on the organic layer and the electrode wiring on the substrate side can be easily made of different materials or the same material with different film thicknesses.

The electrode wiring on the organic layer can be formed of a metal material having a lower resistivity than the electrode on the substrate side at a position separated from the light emitting portion, and at least a part thereof has a two-layer structure. Therefore, the reliability of the wiring can be improved.

[Brief description of the drawings]

1 (a) to 1 (e) are views showing a first embodiment of an organic EL device according to the present invention, and are partially enlarged plan views showing manufacturing steps thereof.

FIGS. 2A to 2D are cross-sectional views illustrating manufacturing steps of the organic EL device according to the first embodiment.

FIG. 3 is a sectional view showing a second embodiment of the organic EL device according to the present invention.

FIG. 4 (a) is a partially enlarged plan view showing a third embodiment of the organic EL device according to the present invention. FIG. 4 (b) is a partially enlarged plan view showing a state where a cathode is removed in FIG. 4 (a).

FIG. 5 is a sectional view taken along line AA of FIG.

FIG. 6 is a sectional view taken along line BB of FIG.

FIG. 7 is a sectional view taken along line CC of FIG.

FIG. 8 is a sectional view taken along line DD of FIG.

FIG. 9 is a sectional view taken along line EE of FIG.

FIGS. 10A to 10D are cross-sectional views illustrating manufacturing steps of an organic EL device according to a third embodiment.

FIGS. 11A to 11C are cross-sectional views illustrating a manufacturing process of the organic EL element following FIG.

FIG. 12 is a partially enlarged plan view showing a fourth embodiment of the organic EL device according to the present invention.

13 (a) to 13 (d) are FF, GG, and H in FIG.
-H, II sectional view

FIG. 14 is a partially enlarged plan view of a substrate on which an anode is formed in the fourth embodiment.

15 is a partially enlarged plan view showing a state where an insulating film is formed from the state shown in FIG. 14;

FIG. 16 is a partially enlarged plan view showing a state where insulating ribs are formed from the state shown in FIG. 15;

FIG. 17 is a partially enlarged plan view showing a state where an organic layer is formed from the state shown in FIG. 16;

FIGS. 18A to 18C are cross-sectional views illustrating manufacturing steps of an organic EL device according to a fourth embodiment.

FIGS. 19A to 19C are cross-sectional views illustrating a manufacturing process of the organic EL element following FIG.

FIG. 20 is a perspective view showing the structure of a conventional organic EL device disclosed in Japanese Patent Application Laid-Open No. Hei 5-307997.

FIG. 21 is a partial sectional view of FIG. 20;

FIG. 22 is a perspective view showing the structure of a conventional organic EL device disclosed in Japanese Patent Application Laid-Open No. 8-315981.

FIG. 23 is a partial sectional view of FIG. 22;

[Explanation of symbols]

1 (1A to 1D): organic EL element, 2: substrate, 3: anode, 3b: lead-out portion (wiring for electrode), 4A to 4C: metal mask, 5: organic layer, 6: cathode, 6b: cathode wiring, 7 ... Anode wiring, 10 ... Light emitting section, 11 ... Insulating film (insulating layer), 12
... insulating ribs (insulating layers), 13A to 13C ... metal masks,
14A to 14C: Metal mask.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05B 33/22 H05B 33/22 Z

Claims (7)

[Claims] An organic EL device in which an organic layer including a light emitting layer is provided between a pair of electrodes at least one of which is a transparent electrode, and a portion of the organic layer sandwiched between the pair of electrodes forms a light emitting portion. The electrode wiring of one electrode and the electrode wiring of the other electrode located in places other than the light emitting portion are made of metal films of different materials or metal films of the same material and different film thicknesses. Organic EL element. 2. An organic EL device in which an organic layer including a light emitting layer is provided between a pair of electrodes at least one of which is a transparent electrode, and a portion of the organic layer sandwiched between the pair of electrodes constitutes a light emitting section. A first electrode formed in a predetermined pattern on an insulating substrate corresponding to the light emitting unit; and a part of the first electrode apart from a position corresponding to the light emitting unit is exposed, and at least the light emitting unit is exposed. An insulating layer formed on the first electrode so that the first electrode is exposed at a position corresponding to the first electrode and is divided into a predetermined region; and at least the light emitting unit in a region defined by the insulating layer. An organic layer formed on the first electrode corresponding to a region; and a second electrode formed on the organic layer, for an electrode of the first electrode located at a place other than the light emitting section. Wiring and wiring for electrode of the second electrode An organic EL element characterized in that it consists of different thicknesses of the metal film is a metal film or the same materials of different materials. 3. The electrical connection between the insulating layer and the insulating film formed on the first electrode and the electrode wiring in the shape of the light emitting portion and between the pair of electrodes and the second electrode. 3. The organic EL device according to claim 2, comprising insulating ribs formed on the insulating film so as to be electrically insulated. 4. The organic EL device according to claim 3, wherein the first electrode and the second electrode are formed in stripes crossing each other. 5. An organic EL element in which an organic layer including a light emitting layer is provided between a pair of electrodes at least one of which is a transparent electrode, and a portion of the organic layer sandwiched between the pair of electrodes constitutes a light emitting section. Forming the electrode wiring of one electrode and the electrode wiring of the other electrode located in places other than the light-emitting portion by metal films of different materials or metal films of the same material but different thicknesses. A method for producing an organic EL device, comprising: 6. An organic EL device according to claim 1, wherein an organic layer including a light emitting layer is provided between a pair of electrodes at least one of which is a transparent electrode, and a portion of the organic layer sandwiched between the pair of electrodes constitutes a light emitting section. In the manufacturing method, a step of forming a first electrode and an electrode wiring on an insulating substrate corresponding to the light emitting unit; and exposing a part of the first electrode away from a position corresponding to the light emitting unit; Forming an insulating layer on the first electrode and the electrode wiring so that the first electrode is exposed at least at a position corresponding to the light emitting unit and is divided into predetermined regions; and Forming an organic layer on at least the first electrode corresponding to a region of the light emitting unit in a region defined by an insulating layer; and forming a second electrode from above the organic layer using a metal mask. Process and metal mask The method for manufacturing an organic EL device which comprises a step of forming a further wiring electrode on the exposed portion of the electrode wiring of the first electrode have. 7. An organic EL device according to claim 1, wherein an organic layer including a light emitting layer is provided between a pair of electrodes at least one of which is a transparent electrode, and a portion of the organic layer sandwiched between the pair of electrodes constitutes a light emitting section. In the manufacturing method, a step of forming a first electrode and an electrode wiring on an insulating substrate corresponding to the light emitting unit; and forming the first electrode and the electrode wiring in a shape of the light emitting unit. A step of forming an insulating film; a step of forming insulating ribs on the insulating layer in a pattern shape in which the pair of electrodes and the electrodes formed on the organic layer are electrically insulated; Forming an organic layer on at least the first electrode corresponding to at least a region of the light emitting portion in a region defined by the insulating layer and the insulating rib using a mask; and forming the organic layer using a metal mask. Second electrode and electrode from above Process and method of manufacturing an organic EL element which comprises a step of further forming an electrode wiring on the exposed portion of the electrode wiring of the first electrode using a metal mask to form the wiring.